XQV600E-6BGG432N - Xilinx, Inc. - Datasheet.Directory

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DS098-1 (v1.1) July 29, 2004 www.xilinx.com Module 1 of 4

Advance Product Specification 1-800-255-7778 1

Features

• Certified to MIL-PRF-38535 (Qualified Manufacturer

Listing)

• Guaranteed over the full military temperature range

(–55°C to +125°C)

• Ceramic and Plastic Packages

• Fast, High-Density 1.8V FPGA Family

- Densities from 600K to 2M system gates

- 130 MHz internal performance (four LUT levels)

- Designed for low-power operation

- PCI compliant 3.3V, 32-bit, 33 MHz

• Highly Flexible SelectIO™+ Technology

- Supports 20 high-performance interface standards

- Up to 804 singled-ended I/Os or 344 differential I/O

pairs for an aggregate bandwidth of > 100 Gb/s

• Differential Signalling Support

- LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL

- Differential I/O signals can be input, output, or I/O

- Compatible with standard differential devices

- LVPECL and LVDS clock inputs for 300+ MHz

clocks

• Proprietary High-Performance SelectLink Technology

- Double Data Rate (DDR) to Virtex™-E link

- Web-based HDL generation methodology

• Sophisticated SelectRAM+™ Memory Hierarchy

- 600 Kb of internal configurable distributed RAM

- Up to 640 Kb of synchronous internal block RAM

- Dual port block RAM capability

- Memory bandwidth up to 1.66 Tb/s (equivalent

bandwidth of over 100 RAMBUS channels)

- Designed for high-performance Interfaces to

External Memories

- 200 MHz ZBT* SRAMs

- 200 Mb/s DDR SDRAMs

- Supported by free Synthesizable reference design

• High-Performance Built-In Clock Management Circuitry

- Eight fully digital Delay-Locked Loops (DLLs)

- Digitally-Synthesized 50% duty cycle for Double

Data Rate (DDR) Applications

- Clock Multiply and Divide

- Zero-delay conversion of high-speed LVPECL/LVDS

clocks to any I/O standard

• Flexible Architecture Balances Speed and Density

- Dedicated carry logic for high-speed arithmetic

- Dedicated multiplier support

- Cascade chain for wide-input function

- Abundant registers/latches with clock enable, and

dual synchronous/asynchronous set and reset

- Internal 3-state bussing

- IEEE 1149.1 boundary-scan logic

- Die-temperature sensor diode

• Supported by Xilinx Foundation™ and Alliance Series™

Development Systems

- Further compile time reduction of 50%

- Internet Team Design (ITD) tool ideal for

million-plus gate density designs

- Wide selection of PC and workstation platforms

• SRAM-Based In-System Configuration

- Unlimited reprogrammability

• Advanced Packaging Options

-1.0mm BGA

- 1.27 mm BGA

•0.18µm 6-Layer Metal Process

• 100% Factory Tested

* ZBT is a trademark of Integrated Device Technology, Inc.

QPro Virtex-E 1.8V QML

High-Reliability FPGAs

DS098-1 (v1.1) July 29, 2004 00Advance Product Specification

Table 1: Virtex-E Field-Programmable Gate Array Family Members

Device

System

Gates

Logic

Gates

CLB

Array

Logic

Cells

Differential

I/O Pairs

User

I/O

Block

RAM Bits

Distributed

RAM Bits

XQV600E 985,882 186,624 48 x 72 15,552 247 316 294,912 221,184

XQV1000E 1,569,178 331,776 64 x 96 27,648 281 404 393,216 393,216

XQV2000E 2,541,952 518,400 80 x 120 43,200 344 804 655,360 614,400

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

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Virtex-E Compared to Virtex Devices

The Virtex-E family offers up to 43,200 logic cells in devices

up to 30% faster than the Virtex family.

I/O performance is increased to 622 Mb/s using Source

Synchronous data transmission architectures and synchro-

nous system performance up to 240 MHz using sin-

gled-ended SelectIO technology. Additional I/O standards

are supported, notably LVPECL, LVDS, and BLVDS, which

use two pins per signal. Almost all signal pins can be used

for these new standards.

Virtex-E devices have up to 640 Kb of faster (250 MHz)

block SelectRAM, but the individual RAMs are the same

size and structure as in the Virtex family. They also have

eight DLLs instead of the four in Virtex devices. Each indi-

vidual DLL is slightly improved with easier clock mirroring

and 4x frequency multiplication.

VCCINT

, the supply voltage for the internal logic and mem-

ory, is 1.8V, instead of 2.5V for Virtex devices. Advanced

processing and 0.18 µm design rules have resulted in

smaller dice, faster speed, and lower power consumption.

I/O pins are 3V tolerant, and can be 5V tolerant with an

external 100Ω resistor. PCI 5V is not supported. With the

addition of appropriate external resistors, any pin can toler-

ate any voltage desired.

Banking rules are different. With Virtex devices, all input

buffers are powered by VCCINT

. With Virtex-E devices, the

LVTTL, LVCMOS2, and PCI input buffers are powered by

the I/O supply voltage VCCO.

The Virtex-E family is not bitstream-compatible with the Vir-

tex family, but Virtex designs can be compiled into equiva-

lent Virtex-E devices.

The same device in the same package for the Virtex-E and

Virtex families are pin-compatible with some minor excep-

tions. See the data sheet pinout section for details.

General Description

The Virtex-E FPGA family delivers high-performance,

high-capacity programmable logic solutions. Dramatic

increases in silicon efficiency result from optimizing the new

architecture for place-and-route efficiency and exploiting an

aggressive 6-layer metal 0.18 µm CMOS process. These

advances make Virtex-E FPGAs powerful and flexible alter-

natives to mask-programmed gate arrays. The QPro Vir-

tex-E family includes the three members in Ta b l e 1 .

Building on experience gained from Virtex FPGAs, the

Virtex-E family is an evolutionary step forward in program-

mable logic design. Combining a wide variety of program-

mable system features, a rich hierarchy of fast, flexible

interconnect resources, and advanced process technology,

the Virtex-E family delivers a high-speed and high-capacity

programmable logic solution that enhances design flexibility

while reducing time-to-market.

Virtex-E Architecture

Virtex-E devices feature a flexible, regular architecture that

comprises an array of configurable logic blocks (CLBs) sur-

rounded by programmable input/output blocks (IOBs), all

interconnected by a rich hierarchy of fast, versatile routing

resources. The abundance of routing resources permits the

Virtex-E family to accommodate even the largest and most

complex designs.

Virtex-E FPGAs are SRAM-based, and are customized by

loading configuration data into internal memory cells. Con-

figuration data can be read from an external SPROM (mas-

ter serial mode), or can be written into the FPGA

(SelectMAP™, slave serial, and JTAG modes).

The standard Xilinx Foundation Series and Alliance Series

Development systems deliver complete design support for

Virtex-E, covering every aspect from behavioral and sche-

matic entry, through simulation, automatic design transla-

tion and implementation, to the creation and downloading of

a configuration bit stream.

Higher Performance

Virtex-E devices provide better performance than previous

generations of FPGAs. Designs can achieve synchronous

system clock rates up to 240 MHz including I/O or 622 Mb/s

using Source Synchronous data transmission architech-

tures. Virtex-E I/Os comply fully with 3.3V PCI specifica-

tions, and interfaces can be implemented that operate at

33 MHz or 66 MHz.

While performance is design-dependent, many designs

operate internally at speeds in excess of 133 MHz and can

achieve over 311 MHz.

QPro Virtex-E 1.8V QML High-Reliability FPGAs

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Advance Product Specification 1-800-255-7778 3

Virtex-E Device/Package Combinations and Maximum I/O

Virtex-E Ordering Information

Table 2: Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)

XQV600E XQV1000E XQV2000E

BG432 316 - -

BG560 - 404 404

CG560 - 404 -

FG1156 - - 804

XQV600E -6 BG 432 M

Example:

Temperature Range/Grade

Number of Pins

Package Type

Device Type

Speed Grade(1)

Device Ordering Options

Device Type Package Grade Temperature

XQV600E BG432 432-ball Plastic BGA Package MMilitary Ceramic TC = –55°C to +125°C

XQV1000E BG560 560-ball Plastic BGA Package NMilitary Plastic TJ = –55°C to +125°C

XQV2000E FG1156 1156-ball Plastic Fine Pitch BGA Package

CG560 560-column Ceramic Column Grid Package

Notes:

1. -6 only supported speed grade.

Valid Ordering Combinations

M Grade N Grade

XQV1000E-6CG560M XQV600E-6BG432N

XQV1000E-6BG560N

XQV2000E-6BG560N

XQV2000E-6FG1156N

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Revision History

The following table shows the revision history for this document.

Date Version Revision

05/19/03 1.0 Initial Xilinx release.

07/29/04 1.1 • Device/Package Availability and Ordering Information tables on page 3: Removed

references to devices in CB228 and HQ240 packages (not offered).

• Device Ordering Options table on page 3: Removed Footnote (2) referring to Class Q

order codes (not offered).

•Tabl e 1 : Corrected number of available User I/Os to conform to numbers in Ta bl e 2 .

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Advance Product Specification 1-800-255-7778 1

Architectural Description

Virtex-E Array

The Virtex™-E user-programmable gate array, shown in

Figure 1, comprises two major configurable elements: con-

figurable logic blocks (CLBs) and input/output blocks (IOBs).

• CLBs provide the functional elements for constructing

logic

• IOBs provide the interface between the package pins

and the CLBs

CLBs interconnect through a general routing matrix (GRM).

The GRM comprises an array of routing switches located at

the intersections of horizontal and vertical routing channels.

Each CLB nests into a VersaBlock that also provides local

routing resources to connect the CLB to the GRM.

The VersaRing™ I/O interface provides additional routing

resources around the periphery of the device. This routing

improves I/O routability and facilitates pin locking.

The Virtex-E architecture also includes the following circuits

that connect to the GRM.

• Dedicated block memories of 4096 bits each

• Clock DLLs for clock-distribution delay compensation

and clock domain control

• 3-State buffers (BUFTs) associated with each CLB that

drive dedicated segmentable horizontal routing

resources

Values stored in static memory cells control the configurable

logic elements and interconnect resources. These values

load into the memory cells on power-up, and can reload if

necessary to change the function of the device.

Input/Output Block

The Virtex-E IOB, Figure 2, features SelectIO™+ inputs and

outputs that support a wide variety of I/O signalling stan-

dards, see Ta bl e 1 .

The three IOB storage elements function either as edge-

triggered D-type flip-flops or as level-sensitive latches. Each

IOB has a clock signal (CLK) shared by the three flip-flops

and independent clock enable signals for each flip-flop.

In addition to the CLK and CE control signals, the three flip-

flops share a Set/Reset (SR). For each flip-flop, this signal

can be independently configured as a synchronous Set, a

synchronous Reset, an asynchronous Preset, or an asyn-

chronous Clear.

The output buffer and all of the IOB control signals have

independent polarity controls.

All pads are protected against damage from electrostatic

discharge (ESD) and from over-voltage transients. After

configuration, clamping diodes are connected to VCCO with

the exception of LVCMOS18, LVCMOS25, GTL, GTL+,

LVDS, and LVPECL.

QPro Virtex-E 1.8V QML High-

Reliability FPGAs

DS098-2 (v1.1) July 29, 2004 00Advance Product Specification

Figure 1: Virtex-E Architecture Overview

DLLDLL

IOBs

VersaRing

ds022_01_121099

CLBs

BRAMs

CLBs

BRAMs

CLBs

DLLDLL

Figure 2: Virtex-E Input/Output Block (IOB)

OBUFT

IBUF

Vref

ds022_02_091300

CLK

ICE

OCE

TCE

PAD

Programmable

Delay

Weak

Keeper

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Optional pull-up, pull-down and weak-keeper circuits are

attached to each pad. Prior to configuration all outputs not

involved in configuration are forced into their high-imped-

ance state. The pull-down resistors and the weak-keeper

circuits are inactive, but I/Os can optionally be pulled up.

The activation of pull-up resistors prior to configuration is

controlled on a global basis by the configuration mode pins.

If the pull-up resistors are not activated, all the pins are in a

high-impedance state. Consequently, external pull-up or

pull-down resistors must be provided on pins required to be

at a well-defined logic level prior to configuration.

All Virtex-E IOBs support IEEE 1149.1-compatible bound-

ary scan testing.

Input Path

The Virtex-E IOB input path routes the input signal directly

to internal logic and/ or through an optional input flip-flop.

An optional delay element at the D-input of this flip-flop elim-

inates pad-to-pad hold time. The delay is matched to the

internal clock-distribution delay of the FPGA, and when

used, assures that the pad-to-pad hold time is zero.

Each input buffer can be configured to conform to any of the

low-voltage signalling standards supported. In some of

these standards the input buffer utilizes a user-supplied

threshold voltage, VREF

. The need to supply VREF imposes

constraints on which standards can be used in close prox-

imity to each other. See "I/O Banking" on page 2.

There are optional pull-up and pull-down resistors at each

user I/O input for use after configuration. Their value is in

the range 50-100 kΩ.

Output Path

The output path includes a 3-state output buffer that drives

the output signal onto the pad. The output signal can be

routed to the buffer directly from the internal logic or through

an optional IOB output flip-flop.

The 3-state control of the output can also be routed directly

from the internal logic or through a flip-flip that provides syn-

chronous enable and disable.

Each output driver can be individually programmed for a

wide range of low-voltage signalling standards. Each output

buffer can source up to 24 mA and sink up to 48 mA. Drive

strength and slew rate controls minimize bus transients.

In most signalling standards, the output High voltage

depends on an externally supplied VCCO voltage. The need

to supply VCCO imposes constraints on which standards

can be used in close proximity to each other. See "I/O Bank-

ing" on page 2.

An optional weak-keeper circuit is connected to each out-

put. When selected, the circuit monitors the voltage on the

pad and weakly drives the pin High or Low to match the

input signal. If the pin is connected to a multiple-source sig-

nal, the weak keeper holds the signal in its last state if all

drivers are disabled. Maintaining a valid logic level in this

way eliminates bus chatter.

Since the weak-keeper circuit uses the IOB input buffer to

monitor the input level, an appropriate VREF voltage must be

provided if the signalling standard requires one. The provi-

sion of this voltage must comply with the I/O banking rules.

I/O Banking

Some of the I/O standards described above require VCCO

and/or VREF voltages. These voltages are externally sup-

plied and connected to device pins that serve groups of

IOBs, called banks. Consequently, restrictions exist about

which I/O standards can be combined within a given bank.

Eight I/O banks result from separating each edge of the

FPGA into two banks, as shown in Figure 3. Each bank has

multiple VCCO pins, all of which must be connected to the

same voltage. This voltage is determined by the output

standards in use.

Tabl e 1: Supported I/O Standards

I/O

Standard

Output

VCCO

Input

VCCO

Input

VREF

Board

Termination

Voltage (VTT)

LVTTL 3.3 3.3 N/A N/A

LVCMOS2 2.5 2.5 N/A N/A

LVCMOS18 1.8 1.8 N/A N/A

SSTL3 I & II 3.3 N/A 1.50 1.50

SSTL2 I & II 2.5 N/A 1.25 1.25

GTL N/A N/A 0.80 1.20

GTL+ N/A N/A 1.0 1.50

HSTL I 1.5 N/A 0.75 0.75

HSTL III & IV 1.5 N/A 0.90 1.50

CTT 3.3 N/A 1.50 1.50

AGP-2X 3.3 N/A 1.32 N/A

PCI33_3 3.3 3.3 N/A N/A

PCI66_3 3.3 3.3 N/A N/A

BLVDS & LVDS 2.5 N/A N/A N/A

LVPECL 3.3 N/A N/A N/A

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Within a bank, output standards can be mixed only if they

use the same VCCO. Compatible standards are shown in

Ta bl e 2 . GTL and GTL+ appear under all voltages because

their open-drain outputs do not depend on VCCO.

Some input standards require a user-supplied threshold

voltage, VREF

. In this case, certain user-I/O pins are auto-

matically configured as inputs for the VREF voltage. Approx-

imately one in six of the I/O pins in the bank assume this

role.

The VREF pins within a bank are interconnected internally

and consequently only one VREF voltage can be used within

each bank. All VREF pins in the bank, however, must be con-

nected to the external voltage source for correct operation.

Within a bank, inputs that require VREF can be mixed with

those that do not. However, only one VREF voltage can be

used within a bank.

In Virtex-E, input buffers with LVTTL, LVCMOS2,

LVCMOS18, PCI33_3, PCI66_3 standards are supplied by

VCCO rather than VCCINT

. For these standards, only input

and output buffers that have the same VCCO can be mixed

together.

The VCCO and VREF pins for each bank appear in the device

pin-out tables and diagrams. The diagrams also show the

bank affiliation of each I/O.

Within a given package, the number of VREF and VCCO pins

can vary depending on the size of device. In larger devices,

more I/O pins convert to VREF pins. Since these are always

a super set of the VREF pins used for smaller devices, it is

possible to design a PCB that permits migration to a larger

device if necessary. All the VREF pins for the largest device

anticipated must be connected to the VREF voltage, and not

used for I/O.

In smaller devices, some VCCO pins used in larger devices

do not connect within the package. These unconnected pins

can be left unconnected externally, or can be connected to

the VCCO voltage to permit migration to a larger device if

necessary.

Configurable Logic Blocks

The basic building block of the Virtex-E CLB is the logic cell

(LC). An LC includes a 4-input function generator, carry

logic, and a storage element. The output from the function

generator in each LC drives both the CLB output and the D

input of the flip-flop. Each Virtex-E CLB contains four LCs,

organized in two similar slices, as shown in Figure 4.

Figure 5 shows a more detailed view of a single slice.

In addition to the four basic LCs, the Virtex-E CLB contains

logic that combines function generators to provide functions

of five or six inputs. Consequently, when estimating the

number of system gates provided by a given device, each

CLB counts as 4.5 LCs.

Look-Up Tables

Virtex-E function generators are implemented as 4-input

look-up tables (LUTs). In addition to operating as a function

generator, each LUT can provide a 16 x 1-bit synchronous

RAM. Furthermore, the two LUTs within a slice can be com-

bined to create a 16 x 2-bit or 32 x 1-bit synchronous RAM,

or a 16 x 1-bit dual-port synchronous RAM.

The Virtex-E LUT can also provide a 16-bit shift register that

is ideal for capturing high-speed or burst-mode data. This

mode can also be used to store data in applications such as

Digital Signal Processing.

Figure 3: Virtex-E I/O Banks

Tabl e 2: Compatible Output Standards

VCCO Compatible Standards

3.3V PCI, LVTTL, SSTL3 I, SSTL3 II, CTT, AGP, GTL,

GTL+, LVPECL

2.5V SSTL2 I, SSTL2 II, LVCMOS2, GTL, GTL+,

BLVDS, LVDS

1.8V LVCMOS18, GTL, GTL+

1.5V HSTL I, HSTL III, HSTL IV, GTL, GTL+

ds022_03_121799

Bank 0

GCLK3 GCLK2

GCLK1 GCLK0

Bank 1

Bank 5 Bank 4

VirtexE

Device

Bank 7Bank 6

Bank 2Bank 3

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Storage Elements

The storage elements in the Virtex-E slice can be config-

ured either as edge-triggered D-type flip-flops or as level-

sensitive latches. The D inputs can be driven either by the

function generators within the slice or directly from slice

inputs, bypassing the function generators.

In addition to Clock and Clock Enable signals, each Slice

has synchronous set and reset signals (SR and BY). SR

Figure 4: 2-Slice Virtex-E CLB

Carry &

Control

Carry &

Control

Carry &

Control

Carry &

Control

LUT

CINCIN

COUT COUT

YBYB

Slice 1 Slice 0

LUT

LUT D

ds022_04_121799

Figure 5: Detailed View of Virtex-E Slice

F5IN

CLK

CIN

F5 F5

ds022_05_092000

COUT

CK WSO

WSH

BY DG

BX DI

LUT

INIT

REV

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forces a storage element into the initialization state speci-

fied for it in the configuration. BY forces it into the opposite

state. Alternatively, these signals can be configured to oper-

ate asynchronously. All of the control signals are indepen-

dently invertible, and are shared by the two flip-flops within

the slice.

Additional Logic

The F5 multiplexer in each slice combines the function gen-

erator outputs. This combination provides either a function

generator that can implement any 5-input function, a 4:1

multiplexer, or selected functions of up to nine inputs.

Similarly, the F6 multiplexer combines the outputs of all four

function generators in the CLB by selecting one of the F5-

multiplexer outputs. This permits the implementation of any

6-input function, an 8:1 multiplexer, or selected functions of

up to 19 inputs.

Each CLB has four direct feedthrough paths, two per slice.

These paths provide extra data input lines or additional local

routing that does not consume logic resources.

Arithmetic Logic

Dedicated carry logic provides fast arithmetic carry capabil-

ity for high-speed arithmetic functions. The Virtex-E CLB

supports two separate carry chains, one per Slice. The

height of the carry chains is two bits per CLB.

The arithmetic logic includes an XOR gate that allows a 2-

bit full adder to be implemented within a slice. In addition, a

dedicated AND gate improves the efficiency of multiplier

implementation. The dedicated carry path can also be used

to cascade function generators for implementing wide logic

functions.

BUFTs

Each Virtex-E CLB contains two 3-state drivers (BUFTs)

that can drive on-chip busses. See "Dedicated Routing" on

page 6. Each Virtex-E BUFT has an independent 3-state

control pin and an independent input pin.

Block SelectRAM

Virtex-E FPGAs incorporate large block SelectRAM memo-

ries. These complement the Distributed SelectRAM memo-

ries that provide shallow RAM structures implemented in

CLBs.

Block SelectRAM memory blocks are organized in columns,

starting at the left (column 0) and right outside edges and

inserted every 12 CLB columns (see notes for smaller

devices). Each memory block is four CLBs high, and each

memory column extends the full height of the chip, immedi-

ately adjacent (to the right, except for column 0) of the CLB

column locations indicated in Ta b l e 3 .

Tabl e 4 shows the amount of block SelectRAM memory that

is available in each Virtex-E device.

As illustrated in Figure 6, each block SelectRAM cell is a

fully synchronous dual-ported (True Dual Port) 4096-bit

RAM with independent control signals for each port. The

data widths of the two ports can be configured indepen-

dently, providing built-in bus-width conversion.

Tabl e 5 shows the depth and width aspect ratios for the

block SelectRAM. The Virtex-E block SelectRAM also

includes dedicated routing to provide an efficient interface

with both CLBs and other block SelectRAMs. Refer to

XAPP130 for block SelectRAM timing waveforms.

Tabl e 3: CLB/Block RAM Column Locations

Device

Column Number

0 12 24 36 48 60 72 84 96 108 120

V600E √√√ √√√

V1000E √√√ √√√

V2000E √√√√ √√√√

Tabl e 4: Virtex-E Block SelectRAM Amounts

Virtex-E Device # of Blocks Block SelectRAM Bits

XQV600E 72 294,912

XQV1000E 96 393,216

XQV2000E 160 655,360

Figure 6: Dual-Port Block SelectRAM

Tabl e 5: Block SelectRAM Port Aspect Ratios

Width Depth ADDR Bus Data Bus

1 4096 ADDR<11:0> DATA<0>

2 2048 ADDR<10:0> DATA<1:0>

WEB

ENB

RSTB

CLKB

ADDRB[#:0]

DIB[#:0]

WEA

ENA

RSTA

CLKA

ADDRA[#:0]

DIA[#:0]

DOA[#:0]

DOB[#:0]

RAMB4_S#_S#

ds022_06_121699

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Programmable Routing Matrix

It is the longest delay path that limits the speed of any worst-

case design. Consequently, the Virtex-E routing architec-

ture and its place-and-route software were defined in a joint

optimization process. This joint optimization minimizes

long-path delays, and consequently, yields the best system

performance.

The joint optimization also reduces design compilation

times because the architecture is software-friendly. Design

cycles are correspondingly reduced due to shorter design

iteration times.

Local Routing

The VersaBlock provides local routing resources (see

Figure 7), providing three types of connections:

• Interconnections among the LUTs, flip-flops, and GRM

• Internal CLB feedback paths that provide high-speed

connections to LUTs within the same CLB, chaining

them together with minimal routing delay

• Direct paths that provide high-speed connections

between horizontally adjacent CLBs, eliminating the

delay of the GRM.

General Purpose Routing

Most Virtex-E signals are routed on the general purpose

routing, and consequently, the majority of interconnect

resources are associated with this level of the routing hier-

archy. General-purpose routing resources are located in

horizontal and vertical routing channels associated with the

CLB rows and columns and are as follows:

• Adjacent to each CLB is a General Routing Matrix

(GRM). The GRM is the switch matrix through which

horizontal and vertical routing resources connect, and

is also the means by which the CLB gains access to

the general purpose routing.

• 24 single-length lines route GRM signals to adjacent

GRMs in each of the four directions.

• 72 buffered Hex lines route GRM signals to another

GRMs six-blocks away in each one of the four

directions. Organized in a staggered pattern, Hex lines

are driven only at their endpoints. Hex-line signals can

be accessed either at the endpoints or at the midpoint

(three blocks from the source). One third of the Hex

lines are bidirectional, while the remaining ones are

uni-directional.

• 12 Longlines are buffered, bidirectional wires that

distribute signals across the device quickly and

efficiently. Vertical Longlines span the full height of the

device, and horizontal ones span the full width of the

device.

I/O Routing

Virtex-E devices have additional routing resources around

their periphery that form an interface between the CLB array

and the IOBs. This additional routing, called the

VersaRing, facilitates pin-swapping and pin-locking, such

that logic redesigns can adapt to existing PCB layouts.

Time-to-market is reduced, since PCBs and other system

components can be manufactured while the logic design is

still in progress.

Dedicated Routing

Some classes of signal require dedicated routing resources to

maximize performance. In the Virtex-E architecture, dedi-

cated routing resources are provided for two classes of signal.

• Horizontal routing resources are provided for on-chip 3-

state busses. Four partitionable bus lines are provided

per CLB row, permitting multiple busses within a row,

as shown in Figure 8.

• Two dedicated nets per CLB propagate carry signals

vertically to the adjacent CLB.Global Clock Distribution

Network

• DLL Location

4 1024 ADDR<9:0> DATA<3:0>

8 512 ADDR<8:0> DATA<7:0>

16 256 ADDR<7:0> DATA<15:0>

Figure 7: Virtex-E Local Routing

Tabl e 5: Block SelectRAM Port Aspect Ratios

Width Depth ADDR Bus Data Bus

XCVE_ds_007

CLB

GRM

Adjacent

GRM

To Adjacent

GRM

Direct

Connection

To Adjacent

CLB

To Adjacent

GRM

To Adjacent

GRM

Direct Connection

To Adjacent

CLB

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Clock Routing

Clock Routing resources distribute clocks and other signals

with very high fanout throughout the device. Virtex-E

devices include two tiers of clock routing resources referred

to as global and local clock routing resources.

• The global routing resources are four dedicated global

nets with dedicated input pins that are designed to

distribute high-fanout clock signals with minimal skew.

Each global clock net can drive all CLB, IOB, and block

RAM clock pins. The global nets can be driven only by

global buffers. There are four global buffers, one for

each global net.

• The local clock routing resources consist of 24

backbone lines, 12 across the top of the chip and 12

across bottom. From these lines, up to 12 unique

signals per column can be distributed via the 12

longlines in the column. These local resources are

more flexible than the global resources since they are

not restricted to routing only to clock pins.

Global Clock Distribution

Virtex-E provides high-speed, low-skew clock distribution

through the global routing resources described above. A

typical clock distribution net is shown in Figure 9.

Four global buffers are provided, two at the top center of the

device and two at the bottom center. These drive the four

global nets that in turn drive any clock pin.

Four dedicated clock pads are provided, one adjacent to

each of the global buffers. The input to the global buffer is

selected either from these pads or from signals in the gen-

eral purpose routing.

Digital Delay-Locked Loops

There are eight DLLs (Delay-Locked Loops) per device,

with four located at the top and four at the bottom,

Figure 10. The DLLs can be used to eliminate skew

between the clock input pad and the internal clock input pins

throughout the device. Each DLL can drive two global clock

networks.The DLL monitors the input clock and the distrib-

uted clock, and automatically adjusts a clock delay element.

Additional delay is introduced such that clock edges arrive

at internal flip-flops synchronized with clock edges arriving

at the input.

In addition to eliminating clock-distribution delay, the DLL

provides advanced control of multiple clock domains. The

DLL provides four quadrature phases of the source clock,

and can double the clock or divide the clock by 1.5, 2, 2.5, 3,

4, 5, 8, or 16.

The DLL also operates as a clock mirror. By driving the out-

put from a DLL off-chip and then back on again, the DLL can

be used to de-skew a board level clock among multiple

devices.

To guarantee that the system clock is operating correctly

prior to the FPGA starting up after configuration, the DLL

can delay the completion of the configuration process until

after it has achieved lock. For more information about DLL

functionality, see the Design Consideration section of the

data sheet.

Figure 8: BUFT Connections to Dedicated Horizontal Bus LInes

CLB CLB CLB CLB

buft_c.eps

Tri-State

Lines

Figure 9: Global Clock Distribution Network

Global Clock Spine

Global Clock Column

GCLKPAD2

GCLKBUF2

GCLKPAD3

GCLKBUF3

GCLKBUF1

GCLKPAD1

GCLKBUF0

GCLKPAD0

Global Clock Rows

XCVE_009

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Boundary Scan

Virtex-E devices support all the mandatory boundary-scan

instructions specified in the IEEE standard 1149.1. A Test

Access Port (TAP) and registers are provided that imple-

ment the EXTEST, INTEST, SAMPLE/PRELOAD, BYPASS,

IDCODE, USERCODE, and HIGHZ instructions. The TAP

also supports two internal scan chains and configura-

tion/readback of the device.

The JTAG input pins (TDI, TMS, TCK) do not have a VCCO

requirement and operate with either 2.5V or 3.3V input sig-

nalling levels. The output pin (TDO) is sourced from the

VCCO in bank 2, and for proper operation of LVTTL 3.3V lev-

els, the bank should be supplied with 3.3V.

Boundary-scan operation is independent of individual IOB

configurations, and unaffected by package type. All IOBs,

including un-bonded ones, are treated as independent 3-

state bidirectional pins in a single scan chain. Retention of

the bidirectional test capability after configuration facilitates

the testing of external interconnections.

Tabl e 6 lists the boundary-scan instructions supported in

Virtex-E FPGAs. Internal signals can be captured during

EXTEST by connecting them to un-bonded or unused IOBs.

They can also be connected to the unused outputs of IOBs

defined as unidirectional input pins.

Before the device is configured, all instructions except

USER1 and USER2 are available. After configuration, all

instructions are available. During configuration, it is recom-

mended that those operations using the boundary-scan

performed.

In addition to the test instructions outlined above, the

boundary-scan circuitry can be used to configure the

FPGA, and also to read back the configuration data.

Figure 11 is a diagram of the Virtex-E Series boundary scan

logic. It includes three bits of Data Register per IOB, the

IEEE 1149.1 Test Access Port controller, and the Instruction

Figure 10: DLL Locations

XCVE_0010

DLLDLL

Primary DLLs

Secondary DLLs

DLLDLL

Figure 11: Virtex-E Family Boundary Scan Logic

D Q

IOB

BYPASS

IOB IOB

TDO

TDI

IOB IOB IOB

D Q

IOB

D Q

0DQ

IOB.T

DATA IN

IOB.I

IOB.Q

IOB.T

IOB.I

SHIFT/

CAPTURE

CLOCK DATA

DATAOUT UPDATE EXTEST

X9016

INSTRUCTION REGISTER

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Instruction Set

The Virtex-E Series boundary scan instruction set also

includes instructions to configure the device and read back

configuration data (CFG_IN, CFG_OUT, and JSTART). The

complete instruction set is coded as shown in Ta bl e 6 ..

Data Registers

The primary data register is the boundary scan register. For

each IOB pin in the FPGA, bonded or not, it includes three

bits for In, Out, and 3-State Control. Non-IOB pins have

appropriate partial bit population if input-only or output-only.

Each EXTEST CAPTURED-OR state captures all In, Out,

and 3-state pins.

The other standard data register is the single flip-flop

BYPASS register. It synchronizes data being passed

through the FPGA to the next downstream boundary scan

device.

The FPGA supports up to two additional internal scan

chains that can be specified using the BSCAN macro. The

macro provides two user pins (SEL1 and SEL2) which are

decodes of the USER1 and USER2 instructions respec-

tively. For these instructions, two corresponding pins (T

DO1 and TDO2) allow user scan data to be shifted out of

TDO.

Likewise, there are individual clock pins (DRCK1 and

DRCK2) for each user register. There is a common input pin

(TDI) and shared output pins that represent the state of the

TAP controller (RESET, SHIFT, and UPDATE).

Bit Sequence

The order within each IOB is: In, Out, 3-State. The input-

only pins contribute only the In bit to the boundary scan I/O

data register, while the output-only pins contributes all three

bits.

From a cavity-up view of the chip (as shown in EPIC), start-

ing in the upper right chip corner, the boundary scan data-

BSDL (Boundary Scan Description Language) files for Vir-

tex-E Series devices are available on the Xilinx web site in

the File Download area.

Identification Registers

The IDCODE register is supported. By using the IDCODE,

the device connected to the JTAG port can be determined.

Tabl e 6: Boundary Scan Instructions

Boundary-Scan

Command

Binary

Code(4:0) Description

EXTEST 00000 Enables boundary-scan

EXTEST operation

SAMPLE/

PRELOAD

00001 Enables boundary-scan

SAMPLE/PRELOAD

operation

USER1 00010 Access user-defined

USER2 00011 Access user-defined

CFG_OUT 00100 Access the

configuration bus for

read operations.

CFG_IN 00101 Access the

configuration bus for

write operations.

INTEST 00111 Enables boundary-scan

INTEST operation

USERCODE 01000 Enables shifting out

USER code

IDCODE 01001 Enables shifting out of

ID Code

HIGHZ 01010 3-states output pins

while enabling the

Bypass Register

JSTART 01100 Clock the start-up

sequence when

StartupClk is TCK

BYPASS 11111 Enables BYPASS

RESERVED All other

codes

Xilinx reserved

instructions Figure 12: Boundary Scan Bit Sequence

Bit 0 ( TDO end)

Bit 1

Bit 2

Right half of top-edge IOBs (Right to Left)

GCLK2

GCLK3

Left half of top-edge IOBs (Right to Left)

Left-edge IOBs (Top to Bottom)

Left half of bottom-edge IOBs (Left to Right)

GCLK1

GCLK0

Right half of bottom-edge IOBs (Left to Right)

DONE

PROG

Right-edge IOBs (Bottom to Top)

CCLK

(TDI end)

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The IDCODE register has the following binary format:

vvvv:ffff:fffa:aaaa:aaaa:cccc:cccc:ccc1

where

v = the die version number

f = the family code (05 for Virtex-E family)

a = the number of CLB rows (ranges from 48 for

XQV600E to 80 for XQV2000E)

c = the company code (49h for Xilinx)

The USERCODE register is supported. By using the USER-

CODE, a user-programmable identification code can be

loaded and shifted out for examination. The identification

code (see Ta b le 7 ) is embedded in the bitstream during bit-

stream generation and is valid only after configuration.

Note:

Attempting to load an incorrect bitstream causes

configuration to fail and can damage the device.

Including Boundary Scan in a Design

Since the boundary scan pins are dedicated, no special ele-

ment needs to be added to the design unless an internal

data register (USER1 or USER2) is desired.

If an internal data register is used, insert the boundary scan

symbol and connect the necessary pins as appropriate.

Development System

Virtex-E FPGAs are supported by the Xilinx Foundation and

Alliance Series CAE tools. The basic methodology for Vir-

tex-E design consists of three interrelated steps: design

entry, implementation, and verification. Industry-standard

tools are used for design entry and simulation (for example,

Synopsys FPGA Express), while Xilinx provides proprietary

architecture-specific tools for implementation.

The Xilinx development system is integrated under the Xil-

inx Design Manager (XDM™) software, providing designers

with a common user interface regardless of their choice of

entry and verification tools. The XDM software simplifies the

selection of implementation options with pull-down menus

and on-line help.

Application programs ranging from schematic capture to

Placement and Routing (PAR) can be accessed through the

XDM software. The program command sequence is gener-

ated prior to execution, and stored for documentation.

Several advanced software features facilitate Virtex-E design.

RPMs, for example, are schematic-based macros with relative

location constraints to guide their placement. They help

ensure optimal implementation of common functions.

For HDL design entry, the Xilinx FPGA Foundation develop-

ment system provides interfaces to the following synthesis

design environments.

• Synopsys (FPGA Compiler, FPGA Express)

• Exemplar (Spectrum)

• Synplicity (Synplify)

For schematic design entry, the Xilinx FPGA Foundation

and Alliance development system provides interfaces to the

following schematic-capture design environments.

• Mentor Graphics V8 (Design Architect, QuickSim II)

• Viewlogic Systems (Viewdraw)

Third-party vendors support many other environments.

A standard interface-file specification, Electronic Design

Interchange Format (EDIF), simplifies file transfers into and

out of the development system.

Virtex-E FPGAs are supported by a unified library of stan-

dard functions. This library contains over 400 primitives and

macros, ranging from 2-input AND gates to 16-bit accumu-

lators, and includes arithmetic functions, comparators,

counters, data registers, decoders, encoders, I/O functions,

latches, Boolean functions, multiplexers, shift registers, and

barrel shifters.

The "soft macro" portion of the library contains detailed

descriptions of common logic functions, but does not con-

tain any partitioning or placement information. The perfor-

mance of these macros depends, therefore, on the

partitioning and placement obtained during implementation.

RPMs, on the other hand, do contain predetermined parti-

tioning and placement information that permits optimal

implementation of these functions. Users can create their

own library of soft macros or RPMs based on the macros

and primitives in the standard library.

The design environment supports hierarchical design entry,

with high-level schematics that comprise major functional

blocks, while lower-level schematics define the logic in

these blocks. These hierarchical design elements are auto-

matically combined by the implementation tools. Different

design entry tools can be combined within a hierarchical

design, thus allowing the most convenient entry method to

be used for each portion of the design.

Design Implementation

The place-and-route tools (PAR) automatically provide the

implementation flow described in this section. The parti-

tioner takes the EDIF net list for the design and maps the

logic into the architectural resources of the FPGA (CLBs

and IOBs, for example). The placer then determines the

best locations for these blocks based on their interconnec-

tions and the desired performance. Finally, the router inter-

connects the blocks.

Tabl e 7: IDCODEs Assigned to Virtex-E FPGAs

FPGA IDCODE

XCV600E v0A30093h

XCV1000E v0A40093h

XCV2000E v0A50093h

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The PAR algorithms support fully automatic implementation

of most designs. For demanding applications, however, the

user can exercise various degrees of control over the pro-

cess. User partitioning, placement, and routing information

is optionally specified during the design-entry process. The

implementation of highly structured designs can benefit

greatly from basic floor planning.

The implementation software incorporates Timing Wizard®

timing-driven placement and routing. Designers specify tim-

ing requirements along entire paths during design entry.

The timing path analysis routines in PAR then recognize

these user-specified requirements and accommodate them.

Timing requirements are entered on a schematic in a form

directly relating to the system requirements, such as the tar-

geted clock frequency, or the maximum allowable delay

between two registers. In this way, the overall performance

of the system along entire signal paths is automatically tai-

lored to user-generated specifications. Specific timing infor-

mation for individual nets is unnecessary.

Design Verification

In addition to conventional software simulation, FPGA users

can use in-circuit debugging techniques. Because Xilinx

devices are infinitely reprogrammable, designs can be veri-

fied in real time without the need for extensive sets of soft-

ware simulation vectors.

The development system supports both software simulation

and in-circuit debugging techniques. For simulation, the

system extracts the post-layout timing information from the

design database, and back-annotates this information into

the net list for use by the simulator. Alternatively, the user

can verify timing-critical portions of the design using the

TRCE® static timing analyzer.

For in-circuit debugging, an optional download and read-

back cable is available. This cable connects the FPGA in the

target system to a PC or workstation. After downloading the

design into the FPGA, the designer can single-step the

logic, readback the contents of the flip-flops, and so observe

the internal logic state. Simple modifications can be down-

loaded into the system in a matter of minutes.

Configuration

Virtex-E devices are configured by loading configuration

data into the internal configuration memory. Note that

attempting to load an incorrect bitstream causes configura-

tion to fail and can damage the device.

Some of the pins used for configuration are dedicated pins,

while others can be re-used as general purpose inputs and

outputs once configuration is complete.

The following are dedicated pins:

• Mode pins (M2, M1, M0)

• Configuration clock pin (CCLK)

•PROGRAM

• DONE pin

• Boundary-scan pins (TDI, TDO, TMS, TCK)

Depending on the configuration mode chosen, CCLK can

be an output generated by the FPGA, or can be generated

externally and provided to the FPGA as an input. The

PROGRAM pin must be pulled High prior to reconfiguration.

Note that some configuration pins can act as outputs. For

correct operation, these pins require a VCCO of 3.3 V or

2.5 V. At 3.3 V the pins operate as LVTTL, and at 2.5 V they

operate as LVCMOS. All affected pins fall in banks 2 or 3.

The configuration pins needed for SelectMap (CS, Write)

are located in bank 1.

Configuration Modes

Virtex-E supports the following four configuration modes.

• Slave-serial mode

• Master-serial mode

• SelectMAP mode

• Boundary-scan mode (JTAG)

The Configuration mode pins (M2, M1, M0) select among

these configuration modes with the option in each case of

having the IOB pins either pulled up or left floating prior to

configuration. The selection codes are listed in Ta b l e 8 .

Tabl e 8: Configuration Codes

Configuration Mode M2 M1 M0 CCLK Direction Data Width Serial Dout Configuration Pull-ups

Master-serial mode 0 0 0 Out 1 Yes No

Boundary-scan mode 1 0 1 N/A 1 No No

SelectMAP mode 1 1 0 In 8 No No

Slave-serial mode 1 1 1 In 1 Yes No

Master-serial mode 1 0 0 Out 1 Yes Yes

Boundary-scan mode 0 0 1 N/A 1 No Yes

SelectMAP mode 0 1 0 In 8 No Yes

Slave-serial mode 0 1 1 In 1 Yes Yes

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Configuration through the boundary-scan port is always

available, independent of the mode selection. Selecting the

boundary-scan mode simply turns off the other modes. The

three mode pins have internal pull-up resistors, and default

to a logic High if left unconnected. However, it is recom-

mended to drive the configuration mode pins externally.

Ta bl e 9 lists the total number of bits required to configure

each device.

Slave-Serial Mode

In slave-serial mode, the FPGA receives configuration data

in bit-serial form from a serial PROM or other source of

serial configuration data. The serial bitstream must be set

up at the DIN input pin a short time before each rising edge

of an externally generated CCLK.

For more detailed information on serial PROMs, see the

PROM data sheet at http://www.xilinx.com/bvdocs/publi-

cations/ds082.pdf.

Multiple FPGAs can be daisy-chained for configuration from

a single source. After a particular FPGA has been config-

ured, the data for the next device is routed to the DOUT pin.

The data on the DOUT pin changes on the rising edge of

CCLK.

The change of DOUT on the rising edge of CCLK differs

from previous families, but does not cause a problem for

mixed configuration chains. This change was made to

improve serial configuration rates for Virtex and Virtex-E

only chains.

Figure 13 shows a full master/slave system. A Virtex-E

device in slave-serial mode should be connected as shown

in the right-most device.

Slave-serial mode is selected by applying <111> or <011>

to the mode pins (M2, M1, M0). A weak pull-up on the mode

pins makes slave serial the default mode if the pins are left

unconnected. However, it is recommended to drive the con-

figuration mode pins externally. Figure 14 shows slave-

serial mode programming switching characteristics.

Ta b le 1 0 provides more detail about the characteristics

shown in Figure 14. Configuration must be delayed until the

INIT pins of all daisy-chained FPGAs are High.

Tabl e 9: Virtex-E Bitstream Lengths

Device # of Configuration Bits

XQV600E 3,961,632

XQV1000E 6,587,520

XQV2000E 10,159,648

Tabl e 1 0 : Master/Slave Serial Mode Programming Switching

Description

Figure

References Symbol

Values

Unitsmin max

CCLK

DIN setup/hold, slave mode 1/2 TDCC / TCCD 5.0 / 0.0 - ns

DIN setup/hold, master mode 1/2 TDSCK / TCKDS 5.0 / 0.0 - ns

DOUT 3T

CCO 12.0 ns

High time 4T

CCH 5.0 - ns

Low time 5T

CCL 5.0 - ns

Maximum Frequency -F

CC -66MHz

Frequency Tolerance, master mode with respect to nominal - - –30 +45 %

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Master-Serial Mode

In master-serial mode, the CCLK output of the FPGA drives

a Xilinx Serial PROM that feeds bit-serial data to the DIN

input. The FPGA accepts this data on each rising CCLK

edge. After the FPGA has been loaded, the data for the next

device in a daisy-chain is presented on the DOUT pin after

the rising CCLK edge.

The interface is identical to slave-serial except that an inter-

nal oscillator is used to generate the configuration clock

(CCLK). A wide range of frequencies can be selected for

CCLK, which always starts at a slow default frequency. Con-

figuration bits then switch CCLK to a higher frequency for

the remainder of the configuration. Switching to a lower fre-

quency is prohibited.

The CCLK frequency is set using the ConfigRate option in

the bitstream generation software. The maximum CCLK fre-

quency that can be selected is 60 MHz. When selecting a

CCLK frequency, ensure that the serial PROM and any

daisy-chained FPGAs are fast enough to support the clock

rate.

On power-up, the CCLK frequency is approximately

2.5 MHz. This frequency is used until the ConfigRate bits

have been loaded when the frequency changes to the

selected ConfigRate. Unless a different frequency is speci-

fied in the design, the default ConfigRate is 4 MHz.

In a full master/slave system (Figure 13), the left-most

device operates in master-serial mode. The remaining

devices operate in slave-serial mode. The SPROM RESET

pin is driven by INIT, and the CE input is driven by DONE.

There is the potential for contention on the DONE pin,

depending on the start-up sequence options chosen.

Figure 13: Master/Slave Serial Mode Circuit Diagram

VIRTEX-E

MASTER

SERIAL

VIRTEX-E,

XC4000XL,

SLAVE

XC1701L

PROGRAM

M0 M1

DOUT

CCLK CLK

3.3V

DATA

CE CEO

RESET/OE DONE

DIN

INIT INIT

DONE

PROGRAM PROGRAM

CCLK

DIN DOUT

M0 M1

(Low Reset Option Used)

330 Ω

XCVE_ds_013_050103

N/C

Note 1: If none of the Virtex FPGAs have been selected to drive DONE, an external pull-up resistor

of 330 Ω should be added to the common DONE line. (For Spartan-XL devices, add a 4.7K Ω

pull-up resistor.) This pull-up is not needed if the DriveDONE attribute is set. If used,

DriveDONE should be selected only for the last device in the configuration chain.

Optional Pull-up

Resistor on Done1

Figure 14: Slave-Serial Mode Programming Switching Characteristics

CCH

CCO

CCL

CCD

DCC

DIN

CCLK

DOUT

(Output)

X5379_a

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The sequence of operations necessary to configure a

Virtex-E FPGA serially appears in Figure 15.

Figure 16 shows the timing of master-serial configuration. Master-serial mode is selected by a <000> or <100> on the mode

pins (M2, M1, M0). Ta b l e 1 0 shows the timing information for Figure 16.

At power-up, VCC must rise from 1.0 V to VCC Min in less

than 50 ms, otherwise delay configuration by pulling PRO-

GRAM Low until VCC is valid.

SelectMAP Mode

The SelectMAP mode is the fastest configuration option.

Byte-wide data is written into the FPGA with a BUSY flag

controlling the flow of data.

An external data source provides a byte stream, CCLK, a

Chip Select (CS) signal and a Write signal (WRITE). If

BUSY is asserted (High) by the FPGA, the data must be

held until BUSY goes Low.

Data can also be read using the SelectMAP mode. If

WRITE is not asserted, configuration data is read out of the

FPGA as part of a readback operation.

After configuration, the pins of the SelectMAP port can be

used as additional user I/O. Alternatively, the port can be

retained to permit high-speed 8-bit readback.

Retention of the SelectMAP port is selectable on a design-

by-design basis when the bitstream is generated. If reten-

tion is selected, PROHIBIT constraints are required to pre-

vent the SelectMAP-port pins from being used as user I/O.

Multiple Virtex-E FPGAs can be configured using the

SelectMAP mode, and be made to start-up simultaneously.

To configure multiple devices in this way, wire the individual

CCLK, Data, WRITE, and BUSY pins of all the devices in

parallel. The individual devices are loaded separately by

asserting the CS pin of each device in turn and writing the

appropriate data. See Ta bl e 1 1 for SelectMAP Write Timing

Characteristics.

Write

Write operations send packets of configuration data into the

FPGA. The sequence of operations for a multi-cycle write

operation is shown below. Note that a configuration packet

can be split into many such sequences. The packet does

Figure 15: Serial Configuration Flowchart

Apply Power

Set PROGRAM = High

Release INIT If used to delay

configuration

Load a Configuration Bit

High

Low

FPGA makes a final

clearing pass and releases

INIT when finished.

FPGA starts to clear

configuration memory.

ds009_15_111799

Configuration Completed

End of

Bitstream?

Yes

Once per bitstream,

FPGA checks data using CRC

and pulls INIT Low on error.

If no CRC errors found,

FPGA enters start-up phase

causing DONE to go High.

INIT?

Figure 16: Master-Serial Mode Programming Switching Characteristics

Serial Data In

CCLK

(Output)

Serial DOUT

(Output)

1TDSCK

TCKDS

DS022_44_071201

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not have to complete within one assertion of CS, illustrated

in Figure 17.

1. Assert WRITE and CS Low. Note that when CS is

asserted on successive CCLKs, WRITE must remain

either asserted or de-asserted. Otherwise, an abort is

initiated, as described below.

2. Drive data onto D[7:0]. Note that to avoid contention,

the data source should not be enabled while CS is Low

and WRITE is High. Similarly, while WRITE is High, no

more that one CS should be asserted.

3. At the rising edge of CCLK: If BUSY is Low, the data is

accepted on this clock. If BUSY is High (from a previous

write), the data is not accepted. Acceptance instead

occurs on the first clock after BUSY goes Low, and the

data must be held until this has happened.

4. Repeat steps 2 and 3 until all the data has been sent.

5. De-assert CS and WRITE.

Tabl e 1 1 : SelectMAP Write Timing Characteristics

Description Symbol Units

CCLK

D0-7 Setup/Hold 1/2 TSMDCC/TSMCCD 5.0 / 1.7 ns, min

CS Setup/Hold 3/4 TSMCSCC/TSMCCCS 7.0 / 1.7 ns, min

WRITE Setup/Hold 5/6 TSMCCW/TSMWCC 7.0 / 1.7 ns, min

BUSY Propagation Delay 7 TSMCKBY 12.0 ns, max

Maximum Frequency FCC 66 MHz, max

Maximum Frequency with no handshake FCCNH 50 MHz, max

Figure 17: Write Operations

DS022_45_071702

CCLK

No Write Write No Write Write

DATA[0:7]

WRITE

BUSY

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A flowchart for the write operation is shown in Figure 18.

Note that if CCLK is slower than fCCNH, the FPGA never

asserts BUSY, In this case, the above handshake is unnec-

essary, and data can simply be entered into the FPGA every

CCLK cycle.

Abort

During a given assertion of CS, the user cannot switch from

a write to a read, or vice-versa. This action causes the cur-

rent packet command to be aborted. The device remains

BUSY until the aborted operation has completed. Following

an abort, data is assumed to be unaligned to word bound-

aries, and the FPGA requires a new synchronization word

prior to accepting any new packets.

To initiate an abort during a write operation, de-assert

WRITE. At the rising edge of CCLK, an abort is initiated, as

shown in Figure 19.

Figure 18: SelectMAP Flowchart for Write Operations

Apply Power

Release INIT If used to delay

configuration

On first FPGA

PROGRAM

from Low

to High

Set WRITE = Low

Enter Data Source

Set CS = Low

On first FPGA

Set CS = High

Apply Configuration Byte

INIT?

High

Low

Yes

Busy?

Low

High

Disable Data Source

Set WRITE = High

When all DONE pins

are released, DONE goes High

and start-up sequences complete.

If no errors,

later FPGAs enter start-up phase

releasing DONE.

If no errors,

first FPGAs enter start-up phase

releasing DONE.

Once per bitstream,

FPGA checks data using CRC

and pulls INIT Low on error.

FPGA makes a final

clearing pass and releases

INIT when finished.

FPGA starts to clear

configuration memory.

For any other FPGAs

ds003_17_090602

Repeat Sequence A

Configuration Completed

Sequence A

End of Data?

Yes

Figure 19: SelectMAP Write Abort Waveforms

CCLK

WRITE

Abort

DATA[0:7]

BUSY

DS022_46_071702

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Boundary-Scan Mode

In the boundary-scan mode, configuration is done through

the IEEE 1149.1 Test Access Port. Note that the PROGRAM

pin must be pulled High prior to reconfiguration. A Low on

the PROGRAM pin resets the TAP controller and no JTAG

operations can be performed.

Configuration through the TAP uses the CFG_IN instruc-

tion. This instruction allows data input on TDI to be con-

verted into data packets for the internal configuration bus.

The following steps are required to configure the FPGA

through the boundary-scan port (when using TCK as a

start-up clock).

1. Load the CFG_IN instruction into the boundary-scan

instruction register (IR).

2. Enter the Shift-DR (SDR) state.

3. Shift a configuration bitstream into TDI.

4. Return to Run-Test-Idle (RTI).

5. Load the JSTART instruction into IR.

6. Enter the SDR state.

7. Clock TCK through the startup sequence.

8. Return to RTI.

Configuration and readback via the TAP is always available.

The boundary-scan mode is selected by a <101> or <001>

on the mode pins (M2, M1, M0). For details on TAP charac-

teristics, refer to XAPP139.

Configuration Sequence

The configuration of Virtex-E devices is a three-phase pro-

cess. First, the configuration memory is cleared. Next, con-

figuration data is loaded into the memory, and finally, the

logic is activated by a start-up process.

Configuration is automatically initiated on power-up unless

it is delayed by the user, as described below. The configura-

tion process can also be initiated by asserting PROGRAM.

The end of the memory-clearing phase is signalled by INIT

going High, and the completion of the entire process is sig-

nalled by DONE going High.

The power-up timing of configuration signals is shown in

Figure 20.

The corresponding timing characteristics are listed in Ta bl e 1 2 .

Figure 20: Power-Up Timing Configuration Signals

VALI

PROGRAM

Vcc

CCLK OUTPUT or INPUT

M0, M1, M2

(Required)

TPL

TICCK

ds022_020_071201

TPOR

INIT

Tabl e 1 2 : Power-up Timing Characteristics

Description

Figure

Reference Symbol

Value

Unitsmin max

Power-on Reset120 TPOR -2.0ms

Program Latency 20 TPL - 100.0 µs

CCLK (output) Delay 20 TICCK 0.5 4.0 µs

Program Pulse Width - TPROGRAM 300 - ns

Notes:

1. TPOR delay is the initialization time required after VCCINT and VCCO in Bank 2 reach the recommended operating

voltage.

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Delaying Configuration

INIT can be held Low using an open-drain driver. An open-

drain is required since INIT is a bidirectional open-drain pin

that is held Low by the FPGA while the configuration mem-

ory is being cleared. Extending the time that the pin is Low

causes the configuration sequencer to wait. Thus, configu-

ration is delayed by preventing entry into the phase where

data is loaded.

Start-Up Sequence

The default Start-up sequence is that one CCLK cycle after

DONE goes High, the global 3-state signal (GTS) is

released. This permits device outputs to turn on as neces-

sary.

One CCLK cycle later, the Global Set/Reset (GSR) and Glo-

bal Write Enable (GWE) signals are released. This permits

the internal storage elements to begin changing state in

response to the logic and the user clock.

The relative timing of these events can be changed. In addi-

tion, the GTS, GSR, and GWE events can be made depen-

dent on the DONE pins of multiple devices all going High,

forcing the devices to start synchronously. The sequence

can also be paused at any stage until lock has been

achieved on any or all DLLs.

Readback

The configuration data stored in the Virtex-E configuration

memory can be readback for verification. Along with the

configuration data it is possible to readback the contents all

flip-flops/latches, LUT RAMs, and block RAMs. This capa-

bility is used for real-time debugging. For more detailed

information, see application note XAPP138 "Virtex FPGA

Series Configuration and Readback".

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Advance Product Specification 1-800-255-7778 19

Design Considerations

This section contains more detailed design information on

the following features.

• Delay-Locked Loop . . . see page 19

• BlockRAM . . . see page 23

• SelectIO . . . see page 30

Using DLLs

The Virtex-E FPGA series provides up to eight fully digital

dedicated on-chip Delay-Locked Loop (DLL) circuits which

provide zero propagation delay, low clock skew between

output clock signals distributed throughout the device, and

advanced clock domain control. These dedicated DLLs can

be used to implement several circuits which improve and

simplify system level design.

Introduction

As FPGAs grow in size, quality on-chip clock distribution

becomes increasingly important. Clock skew and clock

delay impact device performance and the task of managing

clock skew and clock delay with conventional clock trees

becomes more difficult in large devices. The Virtex-E series

of devices resolve this potential problem by providing up to

eight fully digital dedicated on-chip DLL circuits, which pro-

vide zero propagation delay and low clock skew between

output clock signals distributed throughout the device.

Each DLL can drive up to two global clock routing networks

within the device. The global clock distribution network min-

imizes clock skews due to loading differences. By monitor-

ing a sample of the DLL output clock, the DLL can

compensate for the delay on the routing network, effectively

eliminating the delay from the external input port to the indi-

vidual clock loads within the device.

In addition to providing zero delay with respect to a user

source clock, the DLL can provide multiple phases of the

source clock. The DLL can also act as a clock doubler or it

can divide the user source clock by up to 16.

Clock multiplication gives the designer a number of design

alternatives. For instance, a 50 MHz source clock doubled

by the DLL can drive an FPGA design operating at 100

MHz. This technique can simplify board design because the

clock path on the board no longer distributes such a high-

speed signal. A multiplied clock also provides designers the

option of time-domain-multiplexing, using one circuit twice

per clock cycle, consuming less area than two copies of the

same circuit. Two DLLs in can be connected in series to

increase the effective clock multiplication factor to four.

The DLL can also act as a clock mirror. By driving the DLL

output off-chip and then back in again, the DLL can be used

to de-skew a board level clock between multiple devices.

In order to guarantee the system clock establishes prior to

the device "waking up," the DLL can delay the completion of

the device configuration process until after the DLL

achieves lock.

By taking advantage of the DLL to remove on-chip clock

delay, the designer can greatly simplify and improve system

level design involving high-fanout, high-performance clocks.

Library DLL Symbols

Figure 21 shows the simplified Xilinx library DLL macro

symbol, BUFGDLL. This macro delivers a quick and effi-

cient way to provide a system clock with zero propagation

delay throughout the device. Figure 22 and Figure 23 show

the two library DLL primitives. These symbols provide

access to the complete set of DLL features when imple-

menting more complex applications.

Figure 21: Simplified DLL Macro Symbol BUFGDLL

Figure 22: Standard DLL Symbol CLKDLL

Figure 23: High Frequency DLL Symbol CLKDLLHF

0ns

ds022_25_121099

CLK0

CLK90

CLK180

CLK270

CLK2X

CLKDV

LOCKED

CLKIN

CLKFB

RST

ds022_26_121099

CLKDLL

CLK0

CLK180

CLKDV

LOCKED

CLKIN

CLKFB

RST

ds022_027_121099

CLKDLLHF

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BUFGDLL Pin Descriptions

Use the BUFGDLL macro as the simplest way to provide

zero propagation delay for a high-fanout on-chip clock from

an external input. This macro uses the IBUFG, CLKDLL and

BUFG primitives to implement the most basic DLL applica-

tion as shown in Figure 24.

This symbol does not provide access to the advanced clock

domain controls or to the clock multiplication or clock divi-

sion features of the DLL. This symbol also does not provide

access to the RST, or LOCKED pins of the DLL. For access

to these features, a designer must use the library DLL prim-

itives described in the following sections.

Source Clock Input — I

The I pin provides the user source clock, the clock signal on

which the DLL operates, to the BUFGDLL. For the BUF-

GDLL macro the source clock frequency must fall in the low

frequency range as specified in the data sheet. The BUF-

GDLL requires an external signal source clock. Therefore,

only an external input port can source the signal that drives

the BUFGDLL I pin.

Clock Output — O

The clock output pin O represents a delay-compensated

version of the source clock (I) signal. This signal, sourced by

a global clock buffer BUFG symbol, takes advantage of the

dedicated global clock routing resources of the device.

The output clock has a 50-50 duty cycle unless you deacti-

vate the duty cycle correction property.

CLKDLL Primitive Pin Descriptions

The library CLKDLL primitives provide access to the com-

plete set of DLL features needed when implementing more

complex applications with the DLL.

Source Clock Input — CLKIN

The CLKIN pin provides the user source clock (the clock

signal on which the DLL operates) to the DLL. The CLKIN

frequency must fall in the ranges specified in the data sheet.

A global clock buffer (BUFG) driven from another CLKDLL,

one of the global clock input buffers (IBUFG), or an

IO_LVDS_DLL pin on the same edge of the device (top or

bottom) must source this clock signal. There are four

IO_LVDS_DLL input pins that can be used as inputs to the

DLLs. This makes a total of eight usable input pins for DLLs

in the Virtex-E family.

Feedback Clock Input — CLKFB

The DLL requires a reference or feedback signal to provide

the delay-compensated output. Connect only the CLK0 or

CLK2X DLL outputs to the feedback clock input (CLKFB)

pin to provide the necessary feedback to the DLL. The feed-

back clock input can also be provided through one of the fol-

lowing pins.

IBUFG - Global Clock Input Pad

IO_LVDS_DLL - the pin adjacent to IBUF

If an IBUFG sources the CLKFB pin, the following special

rules apply.

1. An external input port must source the signal that drives

the IBUFG I pin.

2. The CLK2X output must feedback to the device if both

the CLK0 and CLK2X outputs are driving off chip

devices.

3. That signal must directly drive only OBUFs and nothing

else.

These rules enable the software determine which DLL clock

output sources the CLKFB pin.

Reset Input — RST

When the reset pin RST activates the LOCKED signal deac-

tivates within four source clock cycles. The RST pin, active

High, must either connect to a dynamic signal or tied to

ground. As the DLL delay taps reset to zero, glitches can

occur on the DLL clock output pins. Activation of the RST

pin can also severely affect the duty cycle of the clock out-

put pins. Furthermore, the DLL output clocks no longer de-

skew with respect to one another. For these reasons, rarely

use the reset pin unless re-configuring the device or chang-

ing the input frequency.

2x Clock Output — CLK2X

The output pin CLK2X provides a frequency-doubled clock

with an automatic 50/50 duty-cycle correction. Until the

CLKDLL has achieved lock, the CLK2X output appears as a

1x version of the input clock with a 25/75 duty cycle. This

behavior allows the DLL to lock on the correct edge with

respect to source clock. This pin is not available on the

CLKDLLHF primitive.

Clock Divide Output — CLKDV

The clock divide output pin CLKDV provides a lower fre-

quency version of the source clock. The CLKDV_DIVIDE

property controls CLKDV such that the source clock is

divided by N where N is either 1.5, 2, 2.5, 3, 4, 5, 8, or 16.

This feature provides automatic duty cycle correction such

that the CLKDV output pin always has a 50/50 duty cycle,

with the exception of noninteger divides in HF mode, where

the duty cycle is 1/3 for N=1.5 and 2/5 for N=2.5.

Figure 24: BUFGDLL Schematic

CLK0

CLK90

CLK180

CLK270

CLK2X

CLKDV

LOCKED

CLKIN

CLKFB

RST

ds022_28_121099

CLKDLL BUFG

IBUFG

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1x Clock Outputs — CLK[0|90|180|270]

The 1x clock output pin CLK0 represents a delay-compen-

sated version of the source clock (CLKIN) signal. The

CLKDLL primitive provides three phase-shifted versions of

the CLK0 signal while CLKDLLHF provides only the 180

phase-shifted version. The relationship between phase shift

and the corresponding period shift appears in Ta b l e 1 3 .

The timing diagrams in Figure 25 illustrate the DLL clock

output characteristics.

The DLL provides duty cycle correction on all 1x clock out-

puts such that all 1x clock outputs by default have a 50/50

duty cycle. The DUTY_CYCLE_CORRECTION property

(TRUE by default), controls this feature. In order to deacti-

vate the DLL duty cycle correction, attach the

DUTY_CYCLE_CORRECTION=FALSE property to the

DLL symbol. When duty cycle correction deactivates, the

output clock has the same duty cycle as the source clock.

The DLL clock outputs can drive an OBUF, a BUFG, or they

can route directly to destination clock pins. The DLL clock

outputs can only drive the BUFGs that reside on the same

edge (top or bottom).

Locked Output — LOCKED

To achieve lock, the DLL might need to sample several thou-

sand clock cycles. After the DLL achieves lock, the

LOCKED signal activates. The DLL timing parameter sec-

tion of the data sheet provides estimates for locking times.

To guarantee that the system clock is established prior to

the device "waking up," the DLL can delay the completion of

the device configuration process until after the DLL locks.

The STARTUP_WAIT property activates this feature.

Until the LOCKED signal activates, the DLL output clocks

are not valid and can exhibit glitches, spikes, or other spuri-

ous movement. In particular the CLK2X output appears as a

1x clock with a 25/75 duty cycle.

DLL Properties

Properties provide access to some of the Virtex-E series

DLL features, (for example, clock division and duty cycle

correction).

Duty Cycle Correction Property

The 1x clock outputs, CLK0, CLK90, CLK180, and CLK270,

use the duty-cycle corrected default, exhibiting a 50/50 duty

cycle. The DUTY_CYCLE_CORRECTION property (by

default TRUE) controls this feature. To deactivate the DLL

duty-cycle correction for the 1x clock outputs, attach the

DUTY_CYCLE_CORRECTION=FALSE property to the

DLL symbol.

Clock Divide Property

The CLKDV_DIVIDE property specifies how the signal on

the CLKDV pin is frequency divided with respect to the

CLK0 pin. The values allowed for this property are 1.5, 2,

2.5, 3, 4, 5, 8, or 16; the default value is 2.

Startup Delay Property

This property, STARTUP_WAIT, takes on a value of TRUE

or FALSE (the default value). When TRUE the device con-

figuration DONE signal waits until the DLL locks before

going to High.

Virtex-E DLL Location Constraints

As shown in Figure 26, there are four additional DLLs in the

Virtex-E devices, for a total of eight per Virtex-E device.

These DLLs are located in silicon, at the top and bottom of

the two innermost block SelectRAM columns. The location

constraint LOC, attached to the DLL symbol with the identi-

fier DLL0S, DLL0P, DLL1S, DLL1P, DLL2S, DLL2P, DLL3S,

or DLL3P, controls the DLL location.

The LOC property uses the following form:

LOC = DLL0P

Tabl e 1 3 : Relationship of Phase-Shifted Output Clock

to Period Shift

Phase (degrees) Period Shift (percent)

00%

90 25%

180 50%

270 75%

Figure 25: DLL Output Characteristics

ds022_29_121099

CLKIN

CLK2X

CLK0

CLK90

CLK180

CLK270

CLKDV

CLKDV_DIVIDE=2

DUTY_CYCLE_CORRECTION=FALSE

CLK0

CLK90

CLK180

CLK270

DUTY_CYCLE_CORRECTION=TRUE

0 90 180 270 0 90 180 270

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Design Factors

Use the following design considerations to avoid pitfalls and

improve success designing with Xilinx devices.

Input Clock

The output clock signal of a DLL, essentially a delayed ver-

sion of the input clock signal, reflects any instability on the

input clock in the output waveform. For this reason the qual-

ity of the DLL input clock relates directly to the quality of the

output clock waveforms generated by the DLL. The DLL

input clock requirements are specified in the data sheet.

In most systems a crystal oscillator generates the system

clock. The DLL can be used with any commercially available

quartz crystal oscillator. For example, most crystal oscilla-

tors produce an output waveform with a frequency tolerance

of 100 PPM, meaning 0.01 percent change in the clock

period. The DLL operates reliably on an input waveform with

a frequency drift of up to 1 ns — orders of magnitude in

excess of that needed to support any crystal oscillator in the

industry. However, the cycle-to-cycle jitter must be kept to

less than 300 ps in the low frequencies and 150 ps for the

high frequencies.

Input Clock Changes

Changing the period of the input clock beyond the maximum

drift amount requires a manual reset of the CLKDLL. Failure

to reset the DLL produces an unreliable lock signal and out-

put clock.

It is possible to stop the input clock with little impact to the

DLL. Stopping the clock should be limited to less than

100 µs to keep device cooling to a minimum. The clock

should be stopped during a Low phase, and when restored

the full High period should be seen. During this time,

LOCKED stays High and remains High when the clock is

restored.

When the clock is stopped, one to four more clocks are still

observed as the delay line is flushed. When the clock is

restarted, the output clocks are not observed for one to four

clocks as the delay line is filled. The most common case is

two or three clocks.

In a similar manner, a phase shift of the input clock is also

possible. The phase shift propagates to the output one to

four clocks after the original shift, with no disruption to the

CLKDLL control.

Output Clocks

As mentioned earlier in the DLL pin descriptions, some

restrictions apply regarding the connectivity of the output

pins. The DLL clock outputs can drive an OBUF, a global

clock buffer BUFG, or they can route directly to destination

clock pins. The only BUFGs that the DLL clock outputs can

drive are the two on the same edge of the device (top or bot-

tom). In addition, the CLK2X output of the secondary DLL

can connect directly to the CLKIN of the primary DLL in the

same quadrant.

Do not use the DLL output clock signals until after activation

of the LOCKED signal. Prior to the activation of the

LOCKED signal, the DLL output clocks are not valid and

can exhibit glitches, spikes, or other spurious movement.

Useful Application Examples

The Virtex-E DLL can be used in a variety of creative and

useful applications. The following examples show some of

the more common applications. The Verilog and VHDL

example files are available at:

ftp://ftp.xilinx.com/pub/applications/xapp/xapp132.zip

Standard Usage

The circuit shown in Figure 27 resembles the BUFGDLL

macro implemented to provide access to the RST and

LOCKED pins of the CLKDLL.

Board Level De-skew of Multiple Non-Virtex-E

Devices

The circuit shown in Figure 28 can be used to de-skew a

system clock between a Virtex-E chip and other non-Virtex-

E chips on the same board. This application is commonly

used when the Virtex-E device is used in conjunction with

other standard products such as SRAM or DRAM devices.

While designing the board level route, ensure that the return

net delay to the source equals the delay to the other chips

involved.

Figure 26: Virtex Series DLLs

x132_14_100799

DLL-3P

DLL-1P

DLL-3S

DLL-1S

DLL-2S

DLL-0S

DLL-2P

DLL-0P

Bottom Right

Half Edge

Figure 27: Standard DLL Implementation

CLK0

CLK90

CLK180

CLK270

CLK2X

CLKDV

LOCKED

CLKIN

CLKFB

RST

ds022_028_121099

CLKDLL

BUFG

IBUFG

IBUF OBUF

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Board-level de-skew is not required for low-fanout clock net-

works. It is recommended for systems that have fanout lim-

itations on the clock network, or if the clock distribution chip

cannot handle the load.

Do not use the DLL output clock signals until after activation

of the LOCKED signal. Prior to the activation of the

LOCKED signal, the DLL output clocks are not valid and

can exhibit glitches, spikes, or other spurious movement.

The dll_mirror_1 files in the xapp132.zip file show the

VHDL and Verilog implementation of this circuit.

De-Skew of Clock and Its 2x Multiple

The circuit shown in Figure 29 implements a 2x clock multi-

plier and also uses the CLK0 clock output with a zero ns

skew between registers on the same chip. Alternatively, a

clock divider circuit can be implemented using similar con-

nections.

Because any single DLL can access only two BUFGs at

most, any additional output clock signals must be routed

from the DLL in this example on the high speed backbone

routing.

The dll_2x files in the xapp132.zip file show the VHDL and

Verilog implementation of this circuit.

Virtex-E 4x Clock

Two DLLs located in the same half-edge (top-left, top-right,

bottom-right, bottom-left) can be connected together, with-

out using a BUFG between the CLKDLLs, to generate a 4x

clock as shown in Figure 30. Virtex-E devices, like the Virtex

devices, have four clock networks that are available for inter-

nal de-skewing of the clock. Each of the eight DLLs have

access to two of the four clock networks. Although all the

DLLs can be used for internal de-skewing, the presence of

two GCLKBUFs on the top and two on the bottom indicate

that only two of the four DLLs on the top (and two of the four

DLLs on the bottom) can be used for this purpose.

The dll_4xe files in the xapp132.zip file show the DLL imple-

mentation in Verilog for Virtex-E devices. These files can be

found at:

ftp://ftp.xilinx.com/pub/applications/xapp/xapp132.zip

Using Block SelectRAM+ Features

The Virtex FPGA Series provides dedicated blocks of on-

chip, true dual-read/write port synchronous RAM, with 4096

memory cells. Each port of the block SelectRAM+ memory

can be independently configured as a read/write port, a

read port, a write port, and can be configured to a specific

data width. The block SelectRAM+ memory offers new

capabilities allowing the FPGA designer to simplify designs.

Figure 28: DLL De-skew of Board Level Clock

Figure 29: DLL De-skew of Clock and 2x Multiple

ds022_029_121099

CLK0

CLK90

CLK180

CLK270

CLK2X

CLKDV

LOCKED

CLKIN

CLKFB

RST

CLKDLL OBUFIBUFG

CLK0

CLK90

CLK180

CLK270

CLK2X

CLKDV

LOCKED

CLKIN

CLKFB

RST

CLKDLL BUFG

IBUFG

Non-Virtex-E Chip

Other Non_Virtex-E Chips

Virtex-E Device

CLK0

CLK90

CLK180

CLK270

CLK2X

CLKDV

LOCKED

CLKIN

CLKFB

RST

ds022_030_121099

CLKDLL

BUFG

IBUFG

IBUF OBUF

BUFG

Figure 30: DLL Generation of 4x Clock in Virtex-E

Devices

ds022_031_041901

RST

CLKFB

CLKIN

CLKDLL-S

LOCKED

CLKDV

INV

BUFG

OBUF

IBUFG

CLK2X

CLK0

CLK90

CLK180

CLK270

RST

CLKFB

CLKIN

CLKDLL-P

LOCKED

CLKDV

CLK2X

CLK0

CLK90

CLK180

CLK270

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Operating Modes

VIrtex-E block SelectRAM+ memory supports two operating

modes:

• Read Through

• Write Back

Read Through (one clock edge)

The read address is registered on the read port clock edge

and data appears on the output after the RAM access time.

Some memories might place the latch/register at the out-

puts, depending on whether a faster clock-to-out versus set-

up time is desired. This is generally considered to be an

inferior solution, since it changes the read operation to an

asynchronous function with the possibility of missing an

address/control line transition during the generation of the

read pulse clock.

Write Back (one clock edge)

The write address is registered on the write port clock edge

and the data input is written to the memory and mirrored on

the output.

Block SelectRAM+ Characteristics

• All inputs are registered with the port clock and have a

set-up to clock timing specification.

• All outputs have a read through or write back function

depending on the state of the port WE pin. The outputs

relative to the port clock are available after the clock-to-

out timing specification.

• The block SelectRAMs are true SRAM memories and

do not have a combinatorial path from the address to

the output. The LUT SelectRAM+ cells in the CLBs are

still available with this function.

• The ports are completely independent from each other

(i.e., clocking, control, address, read/write function, and

data width) without arbitration.

• A write operation requires only one clock edge.

• A read operation requires only one clock edge.

The output ports are latched with a self timed circuit to guar-

antee a glitch free read. The state of the output port does

not change until the port executes another read or write

operation.

Library Primitives

Figure 31 and Figure 32 show the two generic library block

SelectRAM+ primitives. Ta bl e 1 4 describes all of the avail-

able primitives for synthesis and simulation.

Figure 31: Dual-Port Block SelectRAM+ Memory

Figure 32: Single-Port Block SelectRAM+ Memory

Table 14: Available Library Primitives

Primitive Port A Width Port B Width

RAMB4_S1

RAMB4_S1_S1

RAMB4_S1_S2

RAMB4_S1_S4

RAMB4_S1_S8

RAMB4_S1_S16

N/A

RAMB4_S2

RAMB4_S2_S2

RAMB4_S2_S4

RAMB4_S2_S8

RAMB4_S2_S16

N/A

RAMB4_S4

RAMB4_S4_S4

RAMB4_S4_S8

RAMB4_S4_S16

N/A

RAMB4_S8

RAMB4_S8_S8

RAMB4_S8_S16

N/A

RAMB4_S16

RAMB4_S16_S16 16 N/A

WEB

ENB

RSTB

CLKB

ADDRB[#:0]

DIB[#:0]

WEA

ENA

RSTA

CLKA

ADDRA[#:0]

DIA[#:0]

DOA[#:0]

DOB[#:0]

RAMB4_S#_S#

ds022_032_121399

ds022_033_121399

DO[#:0]

RST

CLK

ADDR[#:0]

DI[#:0]

RAMB4_S#

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Port Signals

Each block SelectRAM+ port operates independently of the

others while accessing the same set of 4096 memory cells.

Ta bl e 1 5 describes the depth and width aspect ratios for the

block SelectRAM+ memory.

Clock—CLK[A|B]

Each port is fully synchronous with independent clock pins.

All port input pins have setup time referenced to the port

CLK pin. The data output bus has a clock-to-out time refer-

enced to the CLK pin.

Enable—EN[A|B]

The enable pin affects the read, write and reset functionality

of the port. Ports with an inactive enable pin keep the output

pins in the previous state and do not write data to the mem-

ory cells.

Write Enable—WE[A|B]

Activating the write enable pin allows the port to write to the

memory cells. When active, the contents of the data input

bus are written to the RAM at the address pointed to by the

address bus, and the new data also reflects on the data out

bus. When inactive, a read operation occurs and the con-

tents of the memory cells referenced by the address bus

reflect on the data out bus.

Reset—RST[A|B]

The reset pin forces the data output bus latches to zero syn-

chronously. This does not affect the memory cells of the

RAM and does not disturb a write operation on the other

port.

Address Bus—ADDR[A|B]<#:0>

The address bus selects the memory cells for read or write.

The width of the port determines the required width of this

bus as shown in Ta b l e 1 5 .

Data In Bus—DI[A|B]<#:0>

The data in bus provides the new data value to be written

into the RAM. This bus and the port have the same width, as

shown in Tab l e 1 5 .

Data Output Bus—DO[A|B]<#:0>

The data out bus reflects the contents of the memory cells

referenced by the address bus at the last active clock edge.

During a write operation, the data out bus reflects the data

in bus. The width of this bus equals the width of the port.

The allowed widths appear in Ta bl e 1 5 .

Inverting Control Pins

The four control pins (CLK, EN, WE and RST) for each port

have independent inversion control as a configuration

option.

Address Mapping

Each port accesses the same set of 4096 memory cells

using an addressing scheme dependent on the width of the

port.

The physical RAM location addressed for a particular width

are described in the following formula (of interest only when

the two ports use different aspect ratios).

Start = ((ADDRport +1) * Widthport) –1

End = ADDRport * Widthport

Ta b le 1 6 shows low order address mapping for each port

width.

Creating Larger RAM Structures

The block SelectRAM+ columns have specialized routing to

allow cascading blocks together with minimal routing delays.

This achieves wider or deeper RAM structures with a smaller

timing penalty than when using normal routing channels.

Location Constraints

Block SelectRAM+ instances can have LOC properties

attached to them to constrain the placement. The block

SelectRAM+ placement locations are separate from the

CLB location naming convention, allowing the LOC proper-

ties to transfer easily from array to array.

The LOC properties use the following form.

LOC = RAMB4_R#C#

RAMB4_R0C0 is the upper left RAMB4 location on the

device.

Tabl e 1 5 : Block SelectRAM+ Port Aspect Ratios

Width Depth ADDR Bus Data Bus

1 4096 ADDR<11:0> DATA<0>

2 2048 ADDR<10:0> DATA<1:0>

4 1024 ADDR<9:0> DATA<3:0>

8 512 ADDR<8:0> DATA<7:0>

16 256 ADDR<7:0> DATA<15:0>

Table 16: Port Address Mapping

Port

Width

Port

Addresses

1 4095... 1

2 2047... 07 06 05 04 03 02 01 00

4 1023... 03 02 01 00

8 511... 01 00

16 255... 00

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Conflict Resolution

The block SelectRAM+ memory is a true dual-read/write

port RAM that allows simultaneous access of the same

memory cell from both ports. When one port writes to a

given memory cell, the other port must not address that

memory cell (for a write or a read) within the clock-to-clock

setup window. The following lists specifics of port and mem-

ory cell write conflict resolution.

• If both ports write to the same memory cell

simultaneously, violating the clock-to-clock setup

requirement, consider the data stored as invalid.

• If one port attempts a read of the same memory cell

the other simultaneously writes, violating the clock-to-

clock setup requirement, the following occurs.

- The write succeeds

- The data out on the writing port accurately reflects

the data written.

- The data out on the reading port is invalid.

Conflicts do not cause any physical damage.

Single Port Timing

Figure 33 shows a timing diagram for a single port of a block

SelectRAM+ memory. The block SelectRAM+ AC switching

characteristics are specified in the data sheet. The block

SelectRAM+ memory is initially disabled.

At the first rising edge of the CLK pin, the ADDR, DI, EN,

WE, and RST pins are sampled. The EN pin is High and the

WE pin is Low indicating a read operation. The DO bus con-

tains the contents of the memory location, 0x00, as indi-

cated by the ADDR bus.

At the second rising edge of the CLK pin, the ADDR, DI, EN,

WR, and RST pins are sampled again. The EN and WE pins

are High indicating a write operation. The DO bus mirrors the

DI bus. The DI bus is written to the memory location 0x0F.

At the third rising edge of the CLK pin, the ADDR, DI, EN,

WR, and RST pins are sampled again. The EN pin is High

and the WE pin is Low indicating a read operation. The DO

bus contains the contents of the memory location 0x7E as

indicated by the ADDR bus.

At the fourth rising edge of the CLK pin, the ADDR, DI, EN,

WR, and RST pins are sampled again. The EN pin is Low

indicating that the block SelectRAM+ memory is now dis-

abled. The DO bus retains the last value.

Dual Port Timing

Figure 34 shows a timing diagram for a true dual-port

read/write block SelectRAM+ memory. The clock on port A

has a longer period than the clock on Port B. The timing

parameter TBCCS, (clock-to-clock set-up) is shown on this

diagram. The parameter, TBCCS is violated once in the dia-

gram. All other timing parameters are identical to the single

port version shown in Figure 33.

TBCCS is only of importance when the address of both ports

are the same and at least one port is performing a write

operation. When the clock-to-clock set-up parameter is vio-

lated for a WRITE-WRITE condition, the contents of the

memory at that location are invalid. When the clock-to-clock

set-up parameter is violated for a WRITE-READ condition,

the contents of the memory are correct, but the read port

has invalid data.

At the first rising edge of the CLKA, memory location 0x00 is

to be written with the value 0xAAAA and is mirrored on the

DOA bus. The last operation of Port B was a read to the

same memory location 0x00. The DOB bus of Port B does

not change with the new value on Port A, and retains the

last read value. A short time later, Port B executes another

read to memory location 0x00, and the DOB bus now

reflects the new memory value written by Port A.

At the second rising edge of CLKA, memory location 0x7E

is written with the value 0x9999 and is mirrored on the DOA

bus. Port B then executes a read operation to the same

memory location without violating the TBCCS parameter and

the DOB reflects the new memory values written by Port A.

At the third rising edge of CLKA, the TBCCS parameter is

violated with two writes to memory location 0x0F. The DOA

and DOB busses reflect the contents of the DIA and DIB

busses, but the stored value at 0x0F is invalid.

At the fourth rising edge of CLKA, a read operation is per-

formed at memory location 0x0F and invalid data is present

on the DOA bus. Port B also executes a read operation to

memory location 0x0F and also reads invalid data.

At the fifth rising edge of CLKA a read operation is per-

formed that does not violate the TBCCS parameter to the

previous write of 0x7E by Port B. THe DOA bus reflects the

recently written value by Port B.

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Initialization

The block SelectRAM+ memory can initialize during the

device configuration sequence. The 16 initialization properties

of 64 hex values each (a total of 4096 bits) set the initialization

of each RAM. These properties appear in Ta b l e 1 7 . Any initial-

ization properties not explicitly set configure as zeros. Partial

initialization strings pad with zeros. Initialization strings

greater than 64 hex values generate an error. The RAMs can

be simulated with the initialization values using generics in

VHDL simulators and parameters in Verilog simulators.

Figure 33: Timing Diagram for Single Port Block SelectRAM+ Memory

ds022_0343_121399

CLK

TBPWH

TBACK

ADDR 00

DDDD

MEM (00) CCCC MEM (7E)

CCCC

7E 8F

BBBB 2222

DIN

DOUT

RST

DISABLED READ WRITE READ DISABLED

TBDCK

TBECK

TBWCK

TBCKO

TBPWL

Figure 34: Timing Diagram for a True Dual-port Read/Write Block SelectRAM+ Memory

ds022_035_121399

CLK_A

PORT APORT B

ADDR_A 00 7E 0F

00 00 7E 7E 1A0F 0F

0F 7E

AAAA 9999 AAAA 0000 1111

2222AAAA 9999 AAAA UNKNOWN

EN_A

WE_A

DI_A

DO_A

1111 1111 1111 2222 FFFFBBBB 1111

AAAAMEM (00) 9999 2222 FFFFBBBB UNKNOWN

CLK_B

ADDR_B

EN_B

WE_B

DI_B

DO_B

BCCS

VIOLATION

BCCS

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Initialization in VHDL and Synopsys

The block SelectRAM+ structures can be initialized in VHDL

for both simulation and synthesis for inclusion in the EDIF

output file. The simulation of the VHDL code uses a generic

to pass the initialization. Synopsys FPGA compiler does not

presently support generics. The initialization values instead

attach as attributes to the RAM by a built-in Synopsys

dc_script. The translate_off statement stops synthesis

translation of the generic statements. The following code

illustrates a module that employs these techniques.

Initialization in Verilog and Synopsys

The block SelectRAM+ structures can be initialized in Verilog

for both simulation and synthesis for inclusion in the EDIF

output file. The simulation of the Verilog code uses a def-

param to pass the initialization. The Synopsys FPGA com-

piler does not presently support defparam. The initialization

values instead attach as attributes to the RAM by a built-in

Synopsys dc_script. The translate_off statement stops syn-

thesis translation of the defparam statements. The following

code illustrates a module that employs these techniques.

Design Examples

Creating a 32-bit Single-Port RAM

The true dual-read/write port functionality of the block

SelectRAM+ memory allows a single port, 128 deep by 32-

bit wide RAM to be created using a single block

SelectRAM+ cell as shown in Figure 35.

Interleaving the memory space, setting the LSB of the

address bus of Port A to 1 (VCC), and the LSB of the

address bus of Port B to 0 (GND), allows a 32-bit wide sin-

gle port RAM to be created.

Creating Two Single-Port RAMs

The true dual-read/write port functionality of the block

SelectRAM+ memory allows a single RAM to be split into

two single port memories of 2K bits each as shown in

Figure 36.

In this example, a 512K x 4 RAM (Port A) and a 128 x 16

RAM (Port B) are created out of a single block SelectRAM+.

The address space for the RAM is split by fixing the MSB of

Port A to 1 (VCC) for the upper 2K bits and the MSB of Port

B to 0 (GND) for the lower 2K bits.

Block Memory Generation

The CoreGen program generates memory structures using

the block SelectRAM+ features. This program outputs

VHDL or Verilog simulation code templates and an EDIF file

for inclusion in a design.

Tabl e 1 7 : RAM Initialization Properties

Property Memory Cells

INIT_00 255 to 0

INIT_01 511 to 256

INIT_02 767 to 512

INIT_03 1023 to 768

INIT_04 1279 to 1024

INIT_05 1535 to 1280

INIT_06 1791 to 2047

INIT_07 2047 to 1792

INIT_08 2303 to 2048

INIT_09 2559 to 2304

INIT_0a 2815 to 2560

INIT_0b 3071 to 2816

INIT_0c 3327 to 3072

INIT_0d 3583 to 3328

INIT_0e 3839 to 3584

INIT_0f 4095 to 3840

Figure 35: Single Port 128 x 32 RAM

Figure 36: 512 x 4 RAM and 128 x 16 RAM

WEB

ENB

RSTB

CLKB

ADDRB[7:0]

DIB[15:0]

WEA

ENA

RSTA

CLKA

ADDRA[7:0]

DIA[15:0]

ADDR[6:0], V

CLK

RST

CLK

RST

DI[31:16]

ADDR[6:0], GND

DI[15:0]

DOA[15:0] DO[31:16]

DO[15:0]

DOB[15:0]

RAMB4_S16_S16

ds022_036_121399

WEB

ENB

RSTB

CLKB

ADDRB[7:0]

DIB[15:0]

WEA

ENA

RSTA

CLKA

ADDRA[9:0]

DIA[3:0]

VCC, ADDR1[8:0]

DI1[3:0]

WE1

EN1

RST1

CLK1

WE2

EN2

RST2

CLK2

GND, ADDR2[6:0]

DI2[15:0]

DOA[3:0] DO1[3:0]

DO2[15:0]

DOB[15:0]

RAMB4_S4_S16

ds022_037_121399

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VHDL Initialization Example

library IEEE;

use IEEE.std_logic_1164.all;

entity MYMEM is

port (CLK, WE:in std_logic;

ADDR: in std_logic_vector(8 downto 0);

DIN: in std_logic_vector(7 downto 0);

DOUT: out std_logic_vector(7 downto 0));

end MYMEM;

architecture BEHAVE of MYMEM is

signal logic0, logic1: std_logic;

component RAMB4_S8

--synopsys translate_off

generic( INIT_00,INIT_01, INIT_02, INIT_03, INIT_04, INIT_05, INIT_06, INIT_07,

INIT_08, INIT_09, INIT_0a, INIT_0b, INIT_0c, INIT_0d, INIT_0e, INIT_0f : BIT_VECTOR(255

downto 0)

:= X"0000000000000000000000000000000000000000000000000000000000000000");

--synopsys translate_on

port (WE, EN, RST, CLK: in STD_LOGIC;

ADDR: in STD_LOGIC_VECTOR(8 downto 0);

DI: in STD_LOGIC_VECTOR(7 downto 0);

DO: out STD_LOGIC_VECTOR(7 downto 0));

end component;

--synopsys dc_script_begin

--set_attribute ram0 INIT_00

"0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF" -type string

--set_attribute ram0 INIT_01

"FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210" -type string

--synopsys dc_script_end

begin

logic0 <=’0’;

logic1 <=’1’;

ram0: RAMB4_S8

--synopsys translate_off

generic map (

INIT_00 => X"0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF",

INIT_01 => X"FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210")

--synopsys translate_on

port map (WE=>WE, EN=>logic1, RST=>logic0, CLK=>CLK,ADDR=>ADDR, DI=>DIN, DO=>DOUT);

end BEHAVE;

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Verilog Initialization Example

module MYMEM (CLK, WE, ADDR, DIN, DOUT);

input CLK, WE;

input [8:0] ADDR;

input [7:0] DIN;

output [7:0] DOUT;

wire logic0, logic1;

//synopsys dc_script_begin

//set_attribute ram0 INIT_00

"0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF" -type string

//set_attribute ram0 INIT_01

"FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210" -type string

//synopsys dc_script_end

assign logic0 = 1’b0;

assign logic1 = 1’b1;

RAMB4_S8 ram0 (.WE(WE), .EN(logic1), .RST(logic0), .CLK(CLK), .ADDR(ADDR), .DI(DIN),

.DO(DOUT));

//synopsys translate_off

defparam ram0.INIT_00 =

256h’0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF0123456789ABCDEF;

defparam ram0.INIT_01 =

256h’FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210FEDCBA9876543210;

//synopsys translate_on

endmodule

Using SelectIO

The Virtex-E FPGA series includes a highly configurable,

high-performance I/O resource, called SelectIO to provide

support for a wide variety of I/O standards. The SelectIO

resource is a robust set of features including programmable

control of output drive strength, slew rate, and input delay

and hold time. Taking advantage of the flexibility and Selec-

tIO features and the design considerations described in this

document can improve and simplify system level design.

Introduction

As FPGAs continue to grow in size and capacity, the larger

and more complex systems designed for them demand an

increased variety of I/O standards. Furthermore, as system

clock speeds continue to increase, the need for high perfor-

mance I/O becomes more important.

While chip-to-chip delays have an increasingly substantial

impact on overall system speed, the task of achieving the

desired system performance becomes more difficult with

the proliferation of low-voltage I/O standards. SelectIO, the

revolutionary input/output resources of Virtex-E devices,

resolve this potential problem by providing a highly config-

urable, high-performance alternative to the I/O resources of

more conventional programmable devices. Virtex-E SelectIO

features combine the flexibility and time-to-market advan-

tages of programmable logic with the high performance pre-

viously available only with ASICs and custom ICs.

Each SelectIO block can support up to 20 I/O standards.

Supporting such a variety of I/O standards allows the sup-

port of a wide variety of applications, from general purpose

standard applications to high-speed low-voltage memory

busses.

SelectIO blocks also provide selectable output drive

strengths and programmable slew rates for the LVTTL out-

put buffers, as well as an optional, programmable weak pull-

up, weak pull-down, or weak "keeper" circuit ideal for use in

external bussing applications.

Each Input/Output Block (IOB) includes three registers, one

each for the input, output, and 3-state signals within the

IOB. These registers are optionally configurable as either a

D-type flip-flop or as a level sensitive latch.

The input buffer has an optional delay element used to guar-

antee a zero hold time requirement for input signals regis-

tered within the IOB.

The Virtex-E SelectIO features also provide dedicated

resources for input reference voltage (VREF) and output

source voltage (VCCO), along with a convenient banking

system that simplifies board design.

By taking advantage of the built-in features and wide variety

of I/O standards supported by the SelectIO features, sys-

tem-level design and board design can be greatly simplified

and improved.

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Fundamentals

Modern bus applications, pioneered by the largest and most

influential companies in the digital electronics industry, are

commonly introduced with a new I/O standard tailored spe-

cifically to the needs of that application. The bus I/O stan-

dards provide specifications to other vendors who create

products designed to interface with these applications.

Each standard often has its own specifications for current,

voltage, I/O buffering, and termination techniques.

The ability to provide the flexibility and time-to-market

advantages of programmable logic is increasingly depen-

dent on the capability of the programmable logic device to

support an ever increasing variety of I/O standards

The SelectIO resources feature highly configurable input

and output buffers which provide support for a wide variety

of I/O standards. As shown in Ta bl e 1 8 , each buffer type can

support a variety of voltage requirements.

Overview of Supported I/O Standards

This section provides a brief overview of the I/O standards

supported by all Virtex-E devices.

While most I/O standards specify a range of allowed volt-

ages, this document records typical voltage values only.

Detailed information on each specification can be found on

the Electronic Industry Alliance Jedec website at:

http://www.jedec.org

LVTTL — Low-Voltage TTL

The Low-Voltage TTL, or LVTTL standard is a general pur-

pose EIA/JESDSA standard for 3.3V applications that uses

an LVTTL input buffer and a Push-Pull output buffer. This

standard requires a 3.3V output source voltage (VCCO), but

does not require the use of a reference voltage (VREF) or a

termination voltage (VTT).

LVCMOS2 — Low-Voltage CMOS for 2.5V

The Low-Voltage CMOS for 2.5V or lower, or LVCMOS2

standard is an extension of the LVCMOS standard (JESD 8-

5) used for general purpose 2.5V applications. This stan-

dard requires a 2.5V output source voltage (VCCO), but

does not require the use of a reference voltage (VREF) or a

board termination voltage (VTT).

LVCMO S 1 8 — 1.8V Low Voltage CMOS

This standard is an extension of the LVCMOS standard. It is

used in general purpose 1.8V applications. The use of a ref-

erence voltage (VREF) or a board termination voltage (VTT)

is not required.

PCI — Peripheral Component Interface

The Peripheral Component Interface, or PCI standard spec-

ifies support for both 33 MHz and 66 MHz PCI bus applica-

tions. It uses a LVTTL input buffer and a Push-Pull output

buffer. This standard does not require the use of a reference

voltage (VREF) or a board termination voltage (VTT), how-

ever, it does require a 3.3V output source voltage (VCCO).

GTL — Gunning Transceiver Logic Terminated

The Gunning Transceiver Logic, or GTL standard is a high-

speed bus standard (JESD 8.3) invented by Xerox. Xilinx

has implemented the terminated variation for this standard.

This standard requires a differential amplifier input buffer

and a Open Drain output buffer.

GTL+ — Gunning Transceiver Logic Plus

The Gunning Transceiver Logic Plus, or GTL+ standard is a

high-speed bus standard (JESD 8.3) first used by the Pen-

tium Pro processor.

HSTL — High-Speed Transceiver Logic

The High-Speed Transceiver Logic, or HSTL standard is a

general purpose high-speed, 1.5V bus standard sponsored

by IBM (EIA/JESD 8-6). This standard has four variations or

classes. SelectIO devices support Class I, III, and IV. This

Tabl e 1 8 : Virtex-E Supported I/O Standards

I/O Standard

Output

VCCO

Input

VCCO

Input

VREF

Board

Termination

Voltage

(VTT)

LVTTL 3.3 3.3 N/A N/A

LVCMOS2 2.5 2.5 N/A N/A

LVCMOS18 1.8 1.8 N/A N/A

SSTL3 I & II 3.3 N/A 1.50 1.50

SSTL2 I & II 2.5 N/A 1.25 1.25

GTL N/A N/A 0.80 1.20

GTL+ N/A N/A 1.0 1.50

HSTL I 1.5 N/A 0.75 0.75

HSTL III & IV 1.5 N/A 0.90 1.50

CTT 3.3 N/A 1.50 1.50

AGP-2X 3.3 N/A 1.32 N/A

PCI33_3 3.3 3.3 N/A N/A

PCI66_3 3.3 3.3 N/A N/A

BLVDS & LVDS 2.5 N/A N/A N/A

LVPECL 3.3 N/A N/A N/A

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32 1-800-255-7778 Advance Product Specification

standard requires a Differential Amplifier input buffer and a

Push-Pull output buffer.

SSTL3 — Stub Series Terminated Logic for 3.3V

The Stub Series Terminated Logic for 3.3V, or SSTL3 stan-

dard is a general purpose 3.3V memory bus standard also

sponsored by Hitachi and IBM (JESD 8-8). This standard

has two classes, I and II. SelectIO devices support both

classes for the SSTL3 standard. This standard requires a

Differential Amplifier input buffer and an Push-Pull output

buffer.

SSTL2 — Stub Series Terminated Logic for 2.5V

The Stub Series Terminated Logic for 2.5V, or SSTL2 stan-

dard is a general purpose 2.5V memory bus standard spon-

sored by Hitachi and IBM (JESD 8-9). This standard has

two classes, I and II. SelectIO devices support both classes

for the SSTL2 standard. This standard requires a Differen-

tial Amplifier input buffer and an Push-Pull output buffer.

CTT — Center Tap Terminated

The Center Tap Terminated, or CTT standard is a 3.3V

memory bus standard sponsored by Fujitsu (JESD 8-4).

This standard requires a Differential Amplifier input buffer

and a Push-Pull output buffer.

AGP-2X — Advanced Graphics Port

The Intel AGP standard is a 3.3V Advanced Graphics Port-

2X bus standard used with the Pentium II processor for

graphics applications. This standard requires a Push-Pull

output buffer and a Differential Amplifier input buffer.

LVDS — Low Voltage Differential Signal

LVDS is a differential I/O standard. It requires that one data

bit is carried through two signal lines. As with all differential

signaling standards, LVDS has an inherent noise immunity

over single-ended I/O standards. The voltage swing

between two signal lines is approximately 350 mV. The use

of a reference voltage (VREF) or a board termination voltage

(VTT) is not required. LVDS requires the use of two pins per

input or output. LVDS requires external resistor termination.

BLVDS — Bus LVDS

This standard allows for bidirectional LVDS communication

between two or more devices. The external resistor termi-

nation is different than the one for standard LVDS.

LVPECL — Low Voltage Positive Emitter Coupled

Logic

LVPECL is another differential I/O standard. It requires two

signal lines for transmitting one data bit. This standard

specifies two pins per input or output. The voltage swing

between these two signal lines is approximately 850 mV.

The use of a reference voltage (VREF) or a board termina-

tion voltage (VTT) is not required. The LVPECL standard

requires external resistor termination.

Library Symbols

The Xilinx library includes an extensive list of symbols

designed to provide support for the variety of SelectIO fea-

tures. Most of these symbols represent variations of the five

generic SelectIO symbols.

• IBUF (input buffer)

• IBUFG (global clock input buffer)

• OBUF (output buffer)

• OBUFT (3-state output buffer)

• IOBUF (input/output buffer)

IBUF

Signals used as inputs to the Virtex-E device must source

an input buffer (IBUF) via an external input port. The generic

Virtex-E IBUF symbol appears in Figure 37. The extension

to the base name defines which I/O standard the IBUF

uses. The assumed standard is LVTTL when the generic

IBUF has no specified extension.

The following list details the variations of the IBUF symbol:

•IBUF

•IBUF_LVCMOS2

•IBUF_PCI33_3

•IBUF_PCI66_3

•IBUF_GTL

•IBUF_GTLP

• IBUF_HSTL_I

• IBUF_HSTL_III

• IBUF_HSTL_IV

• IBUF_SSTL3_I

• IBUF_SSTL3_II

• IBUF_SSTL2_I

• IBUF_SSTL2_II

•IBUF_CTT

•IBUF_AGP

•IBUF_LVCMOS18

•IBUF_LVDS

• IBUF_LVPECL

When the IBUF symbol supports an I/O standard that

requires a VREF

, the IBUF automatically configures as a dif-

ferential amplifier input buffer. The VREF voltage must be

supplied on the VREF pins. In the case of LVDS, LVPECL,

and BLVDS, VREF is not required.

Figure 37: Input Buffer (IBUF) Symbols

IBUF

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The voltage reference signal is "banked" within the Virtex-E

device on a half-edge basis such that for all packages there

are eight independent VREF banks internally. See Figure 38

for a representation of the Virtex-E I/O banks. Within each

bank approximately one of every six I/O pins is automati-

cally configured as a VREF input. After placing a differential

amplifier input signal within a given VREF bank, the same

external source must drive all I/O pins configured as a VREF

input.

IBUF placement restrictions require that any differential

amplifier input signals within a bank be of the same stan-

dard. How to specify a specific location for the IBUF via the

LOC property is described below. Ta bl e 1 9 summarizes the

Virtex-E input standards compatibility requirements.

An optional delay element is associated with each IBUF.

When the IBUF drives a flip-flop within the IOB, the delay

element by default activates to ensure a zero hold-time

requirement. The NODELAY=TRUE property overrides this

default.

When the IBUF does not drive a flip-flop within the IOB, the

delay element de-activates by default to provide higher per-

formance. To delay the input signal, activate the delay ele-

ment with the DELAY=TRUE property.

IBUFG

Signals used as high fanout clock inputs to the Virtex-E

device should drive a global clock input buffer (IBUFG) via

an external input port in order to take advantage of one of

the four dedicated global clock distribution networks. The

output of the IBUFG symbol can drive only a CLKDLL,

CLKDLLHF, or BUFG symbol. The generic Virtex-E IBUFG

symbol appears in Figure 39.

The extension to the base name determines which I/O stan-

dard is used by the IBUFG. With no extension specified for

the generic IBUFG symbol, the assumed standard is

LVTTL.

The following list details variations of the IBUFG symbol.

•IBUFG

• IBUFG_LVCMOS2

• IBUFG_PCI33_3

• IBUFG_PCI66_3

•IBUFG_GTL

•IBUFG_GTLP

• IBUFG_HSTL_I

• IBUFG_HSTL_III

• IBUFG_HSTL_IV

• IBUFG_SSTL3_I

• IBUFG_SSTL3_II

• IBUFG_SSTL2_I

• IBUFG_SSTL2_II

• IBUFG_CTT

•IBUFG_AGP

• IBUFG_LVCMOS18

•IBUFG_LVDS

• IBUFG_LVPECL

When the IBUFG symbol supports an I/O standard that

requires a differential amplifier input, the IBUFG automati-

cally configures as a differential amplifier input buffer. The

low-voltage I/O standards with a differential amplifier input

require an external reference voltage input VREF

The voltage reference signal is "banked" within the Virtex-E

device on a half-edge basis such that for all packages there

are eight independent VREF banks internally. See Figure 38

for a representation of the Virtex-E I/O banks. Within each

bank approximately one of every six I/O pins is automati-

cally configured as a VREF input. After placing a differential

amplifier input signal within a given VREF bank, the same

external source must drive all I/O pins configured as a VREF

input.

IBUFG placement restrictions require any differential ampli-

fier input signals within a bank be of the same standard. The

LOC property can specify a location for the IBUFG.

Tabl e 1 9 : Xilinx Input Standards Compatibility

Requirements

Rule 1 Standards with the same input VCCO, output VCCO,

and VREF can be placed within the same bank.

Figure 38: Virtex-E I/O Banks

ds022_42_012100

Bank 0

GCLK3 GCLK2

GCLK1 GCLK0

Bank 1

Bank 5 Bank 4

Virtex-E

Device

Bank 7Bank 6

Bank 2Bank 3

Figure 39: Virtex-E Global Clock Input Buffer (IBUFG)

Symbol

IBUFG

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As an added convenience, the BUFGP can be used to

instantiate a high fanout clock input. The BUFGP symbol

represents a combination of the LVTTL IBUFG and BUFG

symbols, such that the output of the BUFGP can connect

directly to the clock pins throughout the design.

Unlike previous architectures, the Virtex-E BUFGP symbol

can only be placed in a global clock pad location. The LOC

property can specify a location for the BUFGP.

OBUF

An OBUF must drive outputs through an external output

port. The generic output buffer (OBUF) symbol appears in

Figure 40.

The extension to the base name defines which I/O standard

the OBUF uses. With no extension specified for the generic

OBUF symbol, the assumed standard is slew rate limited

LVTTL with 12 mA drive strength.

The LVTTL OBUF additionally can support one of two slew

rate modes to minimize bus transients. By default, the slew

rate for each output buffer is reduced to minimize power bus

transients when switching non-critical signals.

LVTTL output buffers have selectable drive strengths.

The format for LVTTL OBUF symbol names is as follows:

OBUF_<slew_rate>_<drive_strength>

where <slew_rate> is either F (Fast) or S (Slow), and

<drive_strength> is specified in milliamps (2, 4, 6, 8, 12, 16,

or 24).

The following list details variations of the OBUF symbol.

•OBUF

•OBUF_S_2

•OBUF_S_4

•OBUF_S_6

•OBUF_S_8

•OBUF_S_12

•OBUF_S_16

•OBUF_S_24

•OBUF_F_2

•OBUF_F_4

•OBUF_F_6

•OBUF_F_8

• OBUF_F_12

• OBUF_F_16

• OBUF_F_24

•OBUF_LVCMOS2

• OBUF_PCI33_3

• OBUF_PCI66_3

•OBUF_GTL

•OBUF_GTLP

• OBUF_HSTL_I

• OBUF_HSTL_III

• OBUF_HSTL_IV

• OBUF_SSTL3_I

• OBUF_SSTL3_II

• OBUF_SSTL2_I

• OBUF_SSTL2_II

•OBUF_CTT

•OBUF_AGP

•OBUF_LVCMOS18

•OBUF_LVDS

• OBUF_LVPECL

The Virtex-E series supports eight banks for the HQ pack-

ages. The CB packages support one VCCO banks.

OBUF placement restrictions require that within a given

VCCO bank each OBUF share the same output source drive

voltage. Input buffers of any type and output buffers that do

not require VCCO can be placed within any VCCO bank.

Ta b le 2 0 summarizes the Virtex-E output compatibility

requirements. The LOC property can specify a location for

the OBUF.

OBUFT

The generic 3-state output buffer OBUFT (see Figure 41)

typically implements 3-state outputs or bidirectional I/O.

The extension to the base name defines which I/O standard

OBUFT uses. With no extension specified for the generic

OBUFT symbol, the assumed standard is slew rate limited

LVTTL with 12 mA drive strength.

The LVTTL OBUFT additionally can support one of two slew

rate modes to minimize bus transients. By default, the slew

rate for each output buffer is reduced to minimize power bus

transients when switching non-critical signals.

Figure 40: Virtex-E Output Buffer (OBUF) Symbol

OBUF

x133_04_111699

Table 20: Output Standards Compatibility

Requirements

Rule 1 Only outputs with standards that share compatible

VCCO can be used within the same bank.

Rule 2 There are no placement restrictions for outputs

with standards that do not require a VCCO.

VCCO Compatible Standards

3.3 LVTTL, SSTL3_I, SSTL3_II, CTT, AGP, GTL,

GTL+, PCI33_3, PCI66_3

2.5 SSTL2_I, SSTL2_II, LVCMOS2, GTL, GTL+

1.5 HSTL_I, HSTL_III, HSTL_IV, GTL, GTL+

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LVTTL 3-state output buffers have selectable drive

strengths.

The format for LVTTL OBUFT symbol names is as follows:

OBUFT_<slew_rate>_<drive_strength>

where <slew_rate> is either F (Fast) or S (Slow), and

<drive_strength> is specified in mA (2, 4, 6, 8, 12, 16, 24).

The following list details variations of the OBUFT symbol.

• OBUFT

• OBUFT_S_2

• OBUFT_S_4

• OBUFT_S_6

• OBUFT_S_8

• OBUFT_S_12

• OBUFT_S_16

• OBUFT_S_24

• OBUFT_F_2

• OBUFT_F_4

• OBUFT_F_6

• OBUFT_F_8

• OBUFT_F_12

• OBUFT_F_16

• OBUFT_F_24

• OBUFT_LVCMOS2

• OBUFT_PCI33_3

• OBUFT_PCI66_3

• OBUFT_GTL

• OBUFT_GTLP

• OBUFT_HSTL_I

• OBUFT_HSTL_III

• OBUFT_HSTL_IV

• OBUFT_SSTL3_I

• OBUFT_SSTL3_II

• OBUFT_SSTL2_I

• OBUFT_SSTL2_II

• OBUFT_CTT

• OBUFT_AGP

• OBUFT_LVCMOS18

• OBUFT_LVDS

• OBUFT_LVPECL

The Virtex-E series supports eight banks for the HQ pack-

age. The CB package supports one VCCO bank.

The SelectIO OBUFT placement restrictions require that

within a given VCCO bank each OBUFT share the same out-

put source drive voltage. Input buffers of any type and out-

put buffers that do not require VCCO can be placed within

the same VCCO bank.

The LOC property can specify a location for the OBUFT.

3-state output buffers and bidirectional buffers can have

either a weak pull-up resistor, a weak pull-down resistor, or

a weak "keeper" circuit. Control this feature by adding the

appropriate symbol to the output net of the OBUFT (PUL-

LUP, PULLDOWN, or KEEPER).

The weak "keeper" circuit requires the input buffer within the

IOB to sample the I/O signal. So, OBUFTs programmed for

an I/O standard that requires a VREF have automatic place-

ment of a VREF in the bank with an OBUFT configured with

a weak "keeper" circuit. This restriction does not affect most

circuit design as applications using an OBUFT configured

with a weak "keeper" typically implement a bidirectional I/O.

In this case the IBUF (and the corresponding VREF) are

explicitly placed.

The LOC property can specify a location for the OBUFT.

IOBUF

Use the IOBUF symbol for bidirectional signals that require

both an input buffer and a 3-state output buffer with an

active high 3-state pin. The generic input/output buffer

IOBUF appears in Figure 42.

The extension to the base name defines which I/O standard

the IOBUF uses. With no extension specified for the generic

IOBUF symbol, the assumed standard is LVTTL input buffer

and slew rate limited LVTTL with 12 mA drive strength for

the output buffer.

The LVTTL IOBUF additionally can support one of two slew

rate modes to minimize bus transients. By default, the slew

rate for each output buffer is reduced to minimize power bus

transients when switching non-critical signals.

LVTTL bidirectional buffers have selectable output drive

strengths.

The format for LVTTL IOBUF symbol names is as follows:

IOBUF_<slew_rate>_<drive_strength>

where <slew_rate> is either F (Fast) or S (Slow), and

<drive_strength> is specified in mA (2, 4, 6, 8, 12, 16, 24).

Figure 41: 3-State Output Buffer Symbol (OBUFT)

OBUFT

x133_05_111699

Figure 42: Input/Output Buffer Symbol (IOBUF)

IOBUF

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The following list details variations of the IOBUF symbol.

•IOBUF

• IOBUF_S_2

• IOBUF_S_4

• IOBUF_S_6

• IOBUF_S_8

• IOBUF_S_12

• IOBUF_S_16

• IOBUF_S_24

•IOBUF_F_2

•IOBUF_F_4

•IOBUF_F_6

•IOBUF_F_8

•IOBUF_F_12

•IOBUF_F_16

•IOBUF_F_24

• IOBUF_LVCMOS2

• IOBUF_PCI33_3

• IOBUF_PCI66_3

•IOBUF_GTL

•IOBUF_GTLP

• IOBUF_HSTL_I

• IOBUF_HSTL_III

• IOBUF_HSTL_IV

• IOBUF_SSTL3_I

• IOBUF_SSTL3_II

• IOBUF_SSTL2_I

• IOBUF_SSTL2_II

•IOBUF_CTT

• IOBUF_AGP

• IOBUF_LVCMOS18

•IOBUF_LVDS

• IOBUF_LVPECL

When the IOBUF symbol used supports an I/O standard

that requires a differential amplifier input, the IOBUF auto-

matically configures with a differential amplifier input buffer.

The low-voltage I/O standards with a differential amplifier

input require an external reference voltage input VREF

The voltage reference signal is "banked" within the Virtex-E

device on a half-edge basis such that for all packages there

are eight independent VREF banks internally. See Figure 38,

page 33 for a representation of the Virtex-E I/O banks.

Within each bank approximately one of every six I/O pins is

automatically configured as a VREF input. After placing a dif-

ferential amplifier input signal within a given VREF bank, the

same external source must drive all I/O pins configured as a

VREF input.

IOBUF placement restrictions require any differential ampli-

fier input signals within a bank be of the same standard.

The Virtex-E series supports eight banks for the HQ pack-

age. The CB package supports one VCCO bank.

Additional restrictions on the Virtex-E SelectIO IOBUF

placement require that within a given VCCO bank each

IOBUF must share the same output source drive voltage.

Input buffers of any type and output buffers that do not

require VCCO can be placed within the same VCCO bank.

The LOC property can specify a location for the IOBUF.

An optional delay element is associated with the input path

in each IOBUF. When the IOBUF drives an input flip-flop

within the IOB, the delay element activates by default to

ensure a zero hold-time requirement. Override this default

with the NODELAY=TRUE property.

In the case when the IOBUF does not drive an input flip-flop

within the IOB, the delay element de-activates by default to

provide higher performance. To delay the input signal, acti-

vate the delay element with the DELAY=TRUE property.

3-state output buffers and bidirectional buffers can have

either a weak pull-up resistor, a weak pull-down resistor, or

a weak "keeper" circuit. Control this feature by adding the

appropriate symbol to the output net of the IOBUF (PUL-

LUP, PULLDOWN, or KEEPER).

SelectIO Properties

Access to some of the SelectIO features (for example, loca-

tion constraints, input delay, output drive strength, and slew

rate) is available through properties associated with these

features.

Input Delay Properties

An optional delay element is associated with each IBUF.

When the IBUF drives a flip-flop within the IOB, the delay

element activates by default to ensure a zero hold-time

requirement. Use the NODELAY=TRUE property to over-

ride this default.

In the case when the IBUF does not drive a flip-flop within

the IOB, the delay element by default de-activates to pro-

vide higher performance. To delay the input signal, activate

the delay element with the DELAY=TRUE property.

IOB Flip-Flop/Latch Property

The Virtex-E series I/O Block (IOB) includes an optional

path, and an optional register on the 3-state control pin. The

design implementation software automatically takes advan-

tage of these registers when the following option for the Map

program is specified.

map –pr b <filename>

Alternatively, the IOB = TRUE property can be placed on a

Location Constraints

Specify the location of each SelectIO symbol with the loca-

tion constraint LOC attached to the SelectIO symbol. The

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external port identifier indicates the value of the location

constrain. The format of the port identifier depends on the

package chosen for the specific design.

The LOC properties use the following form:

LOC=A42

LOC=P37

Output Slew Rate Property

As mentioned above, a variety of symbol names provide the

option of choosing the desired slew rate for the output buff-

ers. In the case of the LVTTL output buffers (OBUF, OBUFT,

and IOBUF), slew rate control can be alternatively pro-

gramed with the SLEW= property. By default, the slew rate

for each output buffer is reduced to minimize power bus

transients when switching non-critical signals. The SLEW=

property has one of the two following values.

SLEW=SLOW

SLEW=FAST

Output Drive Strength Property

The desired output drive strength can be additionally speci-

fied by choosing the appropriate library symbol. The Xilinx

library also provides an alternative method for specifying

this feature. For the LVTTL output buffers (OBUF, OBUFT,

and IOBUF, the desired drive strength can be specified with

the DRIVE= property. This property could have one of the

following seven values.

DRIVE=2

DRIVE=4

DRIVE=6

DRIVE=8

DRIVE=12 (Default)

DRIVE=16

DRIVE=24

Design Considerations

Reference Voltage (VREF) Pins

Low-voltage I/O standards with a differential amplifier input

buffer require an input reference voltage (VREF). Provide the

VREF as an external signal to the device.

The voltage reference signal is "banked" within the device on

a half-edge basis such that for all packages there are eight

independent VREF banks internally. See Figure 38 for a rep-

resentation of the Virtex-E I/O banks. Within each bank

approximately one of every six I/O pins is automatically con-

figured as a VREF input. After placing a differential amplifier

input signal within a given VREF bank, the same external

source must drive all I/O pins configured as a VREF input.

Within each VREF bank, any input buffers that require a

VREF signal must be of the same type. Output buffers of any

type and input buffers can be placed without requiring a ref-

erence voltage within the same VREF bank.

Output Drive Source Voltage (VCCO) Pins

Many of the low voltage I/O standards supported by Selec-

tIO devices require a different output drive source voltage

(VCCO). As a result each device can often have to support

multiple output drive source voltages.

The Virtex-E series supports eight banks for the HQ and PQ

packages. The CS package supports four VCCO banks.

Output buffers within a given VCCO bank must share the

same output drive source voltage. Input buffers for LVTTL,

LVCMOS2, LVCMOS18, PCI33_3, and PCI 66_3 use the

VCCO voltage for Input VCCO voltage.

Transmission Line Effects

The delay of an electrical signal along a wire is dominated

by the rise and fall times when the signal travels a short dis-

tance. Transmission line delays vary with inductance and

capacitance, but a well-designed board can experience

delays of approximately 180 ps per inch.

Transmission line effects, or reflections, typically start at

1.5" for fast (1.5 ns) rise and fall times. Poor (or non-exis-

tent) termination or changes in the transmission line imped-

ance cause these reflections and can cause additional

delay in longer traces. As system speeds continue to

increase, the effect of I/O delays can become a limiting fac-

tor and therefore transmission line termination becomes

increasingly more important.

Termination Techniques

A variety of termination techniques reduce the impact of

transmission line effects.

The following are output termination techniques:

•None

•Series

• Parallel (Shunt)

• Series and Parallel (Series-Shunt)

Input termination techniques include the following.

•None

• Parallel (Shunt)

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These termination techniques can be applied in any combi-

nation. A generic example of each combination of termina-

tion methods appears in Figure 43.

Simultaneous Switching Guidelines

Ground bounce can occur with high-speed digital ICs when

multiple outputs change states simultaneously, causing

undesired transient behavior on an output, or in the internal

logic. This problem is also referred to as the Simultaneous

Switching Output (SSO) problem.

Ground bounce is primarily due to current changes in the

combined inductance of ground pins, bond wires, and

ground metallization. The IC internal ground level deviates

from the external system ground level for a short duration (a

few nanoseconds) after multiple outputs change state

simultaneously.

Ground bounce affects stable Low outputs and all inputs

because they interpret the incoming signal by comparing it

to the internal ground. If the ground bounce amplitude

exceeds the actual instantaneous noise margin, then a non-

changing input can be interpreted as a short pulse with a

polarity opposite to the ground bounce.

Ta b l e 2 1 provides guidelines for the maximum number of

simultaneously switching outputs allowed per output

power/ground pair to avoid the effects of ground bounce. See

Ta b l e 2 2 for the number of effective output power/ground pairs

for each Virtex-E device and package combination.

Figure 43: Overview of Standard Input and Output

Termination Methods

Tabl e 2 1 : Guidelines for Max Number of

Simultaneously Switching Outputs per Power/Ground

Pair

Standard Outputs

LVTTL Slow Slew Rate, 2 mA drive 68

LVTTL Slow Slew Rate, 4 mA drive 41

LVTTL Slow Slew Rate, 6 mA drive 29

LVTTL Slow Slew Rate, 8 mA drive 22

x133_07_111699

Unterminated Double Parallel Terminated

Series-Parallel Terminated Output

Driving a Parallel Terminated Input

VTT

VREF

Series Terminated Output Driving

a Parallel Terminated Input

VTT

VREF

Unterminated Output Driving

a Parallel Terminated Input

VTT

VREF

VTT

VREF

Series Terminated Output

VREF

Z=50

LVTTL Slow Slew Rate, 12 mA drive 17

LVTTL Slow Slew Rate, 16 mA drive 14

LVTTL Slow Slew Rate, 24 mA drive 9

LVTTL Fast Slew Rate, 2 mA drive 40

LVTTL Fast Slew Rate, 4 mA drive 24

LVTTL Fast Slew Rate, 6 mA drive 17

LVTTL Fast Slew Rate, 8 mA drive 13

LVTTL Fast Slew Rate, 12 mA drive 10

LVTTL Fast Slew Rate, 16 mA drive 8

LVTTL Fast Slew Rate, 24 mA drive 5

LVC M OS 2 10

PCI 8

GTL 4

GTL+ 4

HSTL Class I 18

HSTL Class III 9

HSTL Class IV 5

SSTL2 Class I 15

SSTL2 Class II 10

SSTL3 Class I 11

SSTL3 Class II 7

CTT 14

AGP 9

Notes:

1. This analysis assumes a 35 pF load for each output.

Table 22: Virtex-E Equivalent Power/Ground Pairs

Pkg/Part XQV600E XQV1000E XQV2000E

CB228 27 - -

BG432 40 - -

BG560 - 56 60

CG560 - 56 -

FG1156 - - 120

Table 21: Guidelines for Max Number of

Simultaneously Switching Outputs per Power/Ground

Pair (Continued)

Standard Outputs

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Advance Product Specification 1-800-255-7778 39

Application Examples

Creating a design with the SelectIO features requires the

instantiation of the desired library symbol within the design

code. At the board level, designers need to know the termi-

nation techniques required for each I/O standard.

This section describes some common application examples

illustrating the termination techniques recommended by

each of the standards supported by the SelectIO features.

Termination Examples

Circuit examples involving typical termination techniques for

each of the SelectIO standards follow. For a full range of

accepted values for the DC voltage specifications for each

standard, refer to the table associated with each figure.

The resistors used in each termination technique example

and the transmission lines depicted represent board level

components and are not meant to represent components

on the device.

GTL

A sample circuit illustrating a valid termination technique for

GTL is shown in Figure 44.

Ta bl e 2 3 lists DC voltage specifications.

GTL+

A sample circuit illustrating a valid termination technique for

GTL+ appears in Figure 45. DC voltage specifications

appear in Ta bl e 2 4 .

Figure 44: Terminated GTL

Tabl e 2 3 : GTL Voltage Specifications

Parameter Min Typ Max

VCCO -N/A-

VREF = N × VTT(1) 0.74 0.8 0.86

VTT 1.14 1.2 1.26

VIH = VREF + 0.05 0.79 0.85 -

VIL = VREF – 0.05 - 0.75 0.81

VOH ---

VOL -0.20.4

IOH at VOH (mA) ---

IOLat VOL(mA) at 0.4V 32 - -

IOLat VOL(mA) at 0.2V - - 40

Notes:

1. N must be greater than or equal to 0.653 and less than or

equal to 0.68.

VREF = 0.8V

VTT = 1.2V

50Ω

VCCO = N/A

Z = 50

GTL

x133_08_111699

VTT = 1.2V

Figure 45: Terminated GTL+

Table 24: GTL+ Voltage Specifications

Parameter Min Typ Max

VCCO -- -

VREF = N × VTT(1) 0.88 1.0 1.12

VTT 1.35 1.5 1.65

VIH = VREF + 0.1 0.98 1.1 -

VIL = VREF – 0.1 - 0.9 1.02

VOH -- -

VOL 0.3 0.45 0.6

IOH at VOH (mA) - - -

IOLat VOL (mA) at 0.6V 36 - -

IOLat VOL (mA) at 0.3V - - 48

Notes:

1. N must be greater than or equal to 0.653 and less than or

equal to 0.68.

VREF = 1.0V

VTT = 1.5V

50Ω

VCCO = N/A Z = 50

GTL+

x133_09_012400

50Ω

VTT = 1.5V

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40 1-800-255-7778 Advance Product Specification

HSTL

A sample circuit illustrating a valid termination technique for

HSTL_I appears in Figure 46. A sample circuit illustrating a

valid termination technique for HSTL_III appears in

Figure 47.

A sample circuit illustrating a valid termination technique for

HSTL_IV appears in Figure 48.

Tabl e 2 5 : HSTL Class I Voltage Specification

Parameter Min Typ Max

VCCO 1.40 1.50 1.60

VREF 0.68 0.75 0.90

VTT -V

CCO × 0.5 -

VIH VREF + 0.1 - -

VIL --V

REF – 0.1

VOH VCCO – 0.4 - -

VOL 0.4

IOH at VOH (mA) −8- -

IOLat VOL (mA) 8 - -

Figure 46: Terminated HSTL Class I

Tabl e 2 6 : HSTL Class III Voltage Specification

Parameter Min Typ Max

VCCO 1.40 1.50 1.60

VREF (1) -0.90-

VTT -V

CCO -

VIH VREF + 0.1 - -

VIL --V

REF – 0.1

VOH VCCO – 0.4 - -

VOL --0.4

IOH at VOH (mA) −8--

IOLat VOL (mA) 24 - -

Notes:

1. Per EIA/JESD8-6, "The value of VREF is to be selected by the

user to provide optimum noise margin in the use conditions

specified by the user."

REF

= 0.75V

50Ω

CCO

= 1.5V

Z = 50

HSTL Class I

x133_10_111699

Figure 47: Terminated HSTL Class III

Table 27: HSTL Class IV Voltage Specification

Parameter Min Typ Max

VCCO 1.40 1.50 1.60

VREF -0.90-

VTT -V

CCO -

VIH VREF + 0.1 - -

VIL --V

REF – 0.1

VOH VCCO – 0.4 - -

VOL --0.4

IOH at VOH (mA) −8- -

IOLat VOL (mA) 48 - -

Notes:

1. Per EIA/JESD8-6, "The value of VREF is to be selected by the

user to provide optimum noise margin in the use conditions

specified by the user.

Figure 48: Terminated HSTL Class IV

VREF = 0.9V

VTT= 1.5V

50Ω

VCCO = 1.5V

Z = 50

HSTL Class III

x133_11_111699

50Ω

Z = 50

HSTL Class IV

x133_12_111699

50Ω

VREF = 0.9V

VTT= 1.5VVTT= 1.5V

VCCO = 1.5V

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Advance Product Specification 1-800-255-7778 41

SSTL3_I

A sample circuit illustrating a valid termination technique for

SSTL3_I appears in Figure 49. DC voltage specifications

appear in Ta bl e 2 8 .

SSTL3_II

A sample circuit illustrating a valid termination technique for

SSTL3_II appears in Figure 50. DC voltage specifications

appear in Ta bl e 2 9 .

SSTL2_I

A sample circuit illustrating a valid termination technique for

SSTL2_I appears in Figure 51. DC voltage specifications

appear in Ta bl e 3 0 .

Figure 49: Terminated SSTL3 Class I

Tabl e 2 8 : SSTL3_I Voltage Specifications

Parameter Min Typ Max

VCCO 3.0 3.3 3.6

VREF = 0.45 × VCCO 1.3 1.5 1.7

VTT = VREF 1.3 1.5 1.7

VIH = VREF + 0.2 1.5 1.7 3.9(1)

VIL = VREF – 0.2 −0.3(2) 1.3 1.5

VOH = VREF + 0.6 1.9 - -

VOL = VREF – 0.6 - - 1.1

IOH at VOH (mA) −8- -

IOLat VOL (mA) 8 - -

Notes:

1. VIH maximum is VCCO + 0.3

2. VIL minimum does not conform to the formula

Figure 50: Terminated SSTL3 Class II

50Ω

Z = 50

SSTL3 Class I

x133_13_111699

25Ω

VREF = 1.5V

VTT= 1.5V

VCCO = 3.3V

50Ω

Z = 50

SSTL3 Class II

x133_14_111699

25Ω50Ω

REF

= 1.5V

= 1.5VV

= 1.5V

CCO

= 3.3V

Table 29: SSTL3_II Voltage Specifications

Parameter Min Typ Max

VCCO 3.0 3.3 3.6

VREF = 0.45 × VCCO 1.3 1.5 1.7

VTT = VREF 1.3 1.5 1.7

VIH = VREF + 0.2 1.5 1.7 3.9(1)

VIL= VREF – 0.2 −0.3(2) 1.3 1.5

VOH = VREF + 0.8 2.1 - -

VOL= VREF – 0.8 - - 0.9

IOH at VOH (mA) −16 - -

IOLat VOL (mA) 16 - -

Notes:

1. VIH maximum is VCCO + 0.3

2. VIL minimum does not conform to the formula

Figure 51: Terminated SSTL2 Class I

Table 30: SSTL2_I Voltage Specifications

Parameter Min Typ Max

VCCO 2.3 2.5 2.7

VREF = 0.5 × VCCO 1.15 1.25 1.35

VTT = VREF + N(1) 1.11 1.25 1.39

VIH = VREF + 0.18 1.33 1.43 3.0(2)

VIL = VREF – 0.18 −0.3(3) 1.07 1.17

VOH = VREF + 0.61 1.76 - -

VOL= VREF – 0.61 - - 0.74

50Ω

Z = 50

SSTL2 Class I

xap133_15_011000

25Ω

VREF = 1.25V

VTT= 1.25V

VCCO = 2.5V

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SSTL2_II

A sample circuit illustrating a valid termination technique for

SSTL2_II appears in Figure 52. DC voltage specifications

appear in Ta bl e 3 1 .

CTT

A sample circuit illustrating a valid termination technique for

CTT appear in Figure 53. DC voltage specifications appear

in Ta b l e 3 2 .

PCI33_3 & PCI66_3

PCI33_3 or PCI66_3 require no termination. DC voltage

specifications appear in Ta b l e 3 3 .

IOH at VOH (mA) −7.6 - -

IOLat VOL (mA) 7.6 - -

Notes:

1. N must be greater than or equal to −0.04 and less than or

equal to 0.04.

2. VIH maximum is VCCO + 0.3.

3. VIL minimum does not conform to the formula.

Figure 52: Terminated SSTL2 Class II

Tabl e 3 1 : SSTL2_II Voltage Specifications

Parameter Min Typ Max

VCCO 2.3 2.5 2.7

VREF = 0.5 × VCCO 1.15 1.25 1.35

VTT = VREF + N(1) 1.11 1.25 1.39

VIH = VREF + 0.18 1.33 1.43 3.0(2)

VIL = VREF – 0.18 −0.3(3) 1.07 1.17

VOH = VREF + 0.8 1.95 - -

VOL = VREF – 0.8 - - 0.55

IOH at VOH (mA) −15.2 - -

IOLat VOL (mA) 15.2 - -

Notes:

1. N must be greater than or equal to -0.04 and less than or

equal to 0.04.

2. VIH maximum is VCCO + 0.3.

3. VIL minimum does not conform to the formula.

Tabl e 3 0 : SSTL2_I Voltage Specifications

Parameter Min Typ Max

50Ω

Z = 50

SSTL2 Class II

x133_16_111699

25Ω

50Ω

VREF = 1.25V

VTT= 1.25VVTT= 1.25V

VCCO = 2.5V

Figure 53: Terminated CTT

Table 32: CTT Voltage Specifications

Parameter Min Typ Max

VCCO 2.05(1) 3.3 3.6

VREF 1.35 1.5 1.65

VTT 1.35 1.5 1.65

VIH = VREF + 0.2 1.55 1.7 -

VIL = VREF – 0.2 - 1.3 1.45

VOH = VREF + 0.4 1.75 1.9 -

VOL= VREF – 0.4 - 1.1 1.25

IOH at VOH (mA) −8--

IOLat VOL (mA) 8 - -

Notes:

1. Timing delays are calculated based on VCCO min of 3.0V.

Table 33: PCI33_3 and PCI66_3 Voltage Specifications

Parameter Min Typ Max

VCCO 3.0 3.3 3.6

VREF -- -

VTT -- -

VIH = 0.5 × VCCO 1.5 1.65 VCCO +0.5

VIL = 0.3 × VCCO −0.5 0.99 1.08

VOH = 0.9 × VCCO 2.7 - -

VOL= 0.1 × VCCO - - 0.36

IOH at VOH (mA) Note 1 - -

IOLat VOL (mA) Note 1 - -

Notes:

1. Tested according to the relevant specification.

VREF= 1.5V

VTT = 1.5V

50Ω

VCCO = 3.3V

Z = 50

CTT

x133_17_111699

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Advance Product Specification 1-800-255-7778 43

LVTTL

LVTTL requires no termination. DC voltage specifications

appears in Ta bl e 3 4 .

LVCMO S 2

LVCMOS2 requires no termination. DC voltage specifica-

tions appear in Ta b l e 3 5 .

LVCMO S 1 8

LVCMOS18 does not require termination. Ta bl e 3 6 lists DC

voltage specifications.

AGP-2X

The specification for the AGP-2X standard does not docu-

ment a recommended termination technique. DC voltage

specifications appear in Ta b l e 3 7 .

Tabl e 3 4 : LVTTL Voltage Specifications

Parameter Min Typ Max

VCCO 3.0 3.3 3.6

VREF -- -

VTT -- -

VIH 2.0 - 3.6

VIL −0.5 - 0.8

VOH 2.4 - -

VOL --0.4

IOH at VOH (mA) −24 - -

IOLat VOL (mA) 24 - -

Notes:

1. Note: VOLand VOH for lower drive currents sample tested.

Tabl e 3 5 : LVCMOS2 Voltage Specifications

Parameter Min Typ Max

VCCO 2.3 2.5 2.7

VREF -- -

VTT -- -

VIH 1.7 - 3.6

VIL −0.5 - 0.7

VOH 1.9 - -

VOL --0.4

IOH at VOH (mA) −12 - -

IOLat VOL (mA) 12 - -

Table 36: LVCMOS18 Voltage Specifications

Parameter Min Typ Max

VCCO 1.70 1.80 1.90

VREF ---

VTT ---

VIH 0.65 x VCCO -1.95

VIL – 0.5 - 0.2 x VCCO

VOH VCCO – 0.4 - -

VOL --0.4

IOH at VOH (mA) –8 - -

IOLat VOL (mA) 8 - -

Table 37: AGP-2X Voltage Specifications

Parameter Min Typ Max

VCCO 3.0 3.3 3.6

VREF = N × VCCO(1) 1.17 1.32 1.48

VTT -- -

VIH = VREF + 0.2 1.37 1.52 -

VIL = VREF – 0.2 - 1.12 1.28

VOH = 0.9 × VCCO 2.7 3.0 -

VOL = 0.1 × VCCO - 0.33 0.36

IOH at VOH (mA) Note 2 - -

IOLat VOL (mA) Note 2 - -

Notes:

1. N must be greater than or equal to 0.39 and less than or

equal to 0.41.

2. Tested according to the relevant specification.

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44 1-800-255-7778 Advance Product Specification
LVDS
Depending on whether the device is transmitting an LVDS
signal or receiving an LVDS signal, there are two different
circuits used for LVDS termination. A sample circuit illustrat-
ing a valid termination technique for transmitting LVDS sig-
nals appears in Figure 54. A sample circuit illustrating a
valid termination for receiving LVDS signals appears in
Figure 55. Ta bl e 3 8  lists DC voltage specifications. Further
information on the specific termination resistor packs shown
can be found on Ta bl e 4 0 . 
 
LVPECL
Depending on whether the device is transmitting or receiv-
ing an LVPECL signal, two different circuits are used for
LVPECL termination. A sample circuit illustrating a valid ter-
mination technique for transmitting LVPECL signals
appears in Figure 56. A sample circuit illustrating a valid ter-
mination for receiving LVPECL signals appears in
Figure 57. Ta b l e 3 9  lists DC voltage specifications. Further
information on the specific termination resistor packs shown
can be found on Ta bl e 4 0 . 
 
 
Figure 54:   Transmitting LVDS Signal Circuit
Figure 55:   Receiving LVDS Signal Circuit
Tabl e   3 8 :   LVDS Voltage Specifications
Parameter Min Typ Max
VCCO 2.375 2.5 2.625
VICM(2) 0.2 1.25 2.2
VOCM(1) 1.125 1.25 1.375
VIDIFF (1) 0.1 0.35 -
VODIFF (1) 0.25 0.35 0.45
VOH(1) 1.25 - -
VOL(1) - - 1.25
Notes: 
1. Measured with a 100Ω resistor across Q and Q.
2. Measured with a differential input voltage = ± 350 mV.
x133_19_122799
QZ0 = 50Ω
Z0 = 50Ω
Q
Virtex-E
FPGA
to LVDS Receiver
to LVDS Receiver
RDIV
140
RS
165
RS
165
2.5V
VCCO = 2.5V
LVDS
Output
DATA
Transmit
1/4 of Bourns 
Part Number
CAT16-LV4F12
x133_29_122799
QZ0 = 50ΩLVDS_IN
LVDS_IN
Z0 = 50Ω
RT
100Ω
Q
DATA
Receive
from
LVDS
Driver
VIRTEX-E
FPGA
+
–
Table  39:  LVPECL Voltage Specifications
Parameter Min Typ Max
VCCO 3.0 3.3 3.6
VREF -- -
VTT -- -
VIH 1.49 - 2.72
VIL 0.86 - 2.125
VOH 1.8 - -
VOL - - 1.57
Notes: 
1. For more detailed information, see LVPECL DC 
Specifications (Module 2).
Figure 56:   Transmitting LVPECL Signal Circuit
Figure 57:   Receiving LVPECL Signal Circuit
x133_20_122799
QZ0 = 50ΩLVPECL_OUT
LVPECL_OUT
Z0 = 50Ω
Q
Virtex-E
FPGA
to LVPECL Receiver
to LVPECL Receiver
RDIV
187
R
S
100
R
S
100
3.3V
DATA
Transmit
1/4 of Bourns 
Part Number
CAT16-PC4F12
x133_21_122799
QZ0 = 50Ω
LVPECL_IN
LVPECL_IN
Z0 = 50Ω
RT
100Ω
Q
DATA
Receive
from
LVPECL
Driver
VIRTEX-E
FPGA
+
–

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Advance Product Specification 1-800-255-7778 45

Termination Resistor Packs

Resistor packs are available with the values and the config-

uration required for LVDS and LVPECL termination from

Bourns, Inc., as listed in Table. For pricing and availability,

please contact Bourns directly at http://www.bourns.com.

LVDS Design Guide

The SelectIO library elements have been expanded for Vir-

tex-E devices to include new LVDS variants. At this time all

of the cells might not be included in the Synthesis libraries.

The 2.1i-Service Pack 2 update for Alliance and Foundation

software includes these cells in the VHDL and Verilog librar-

ies. It is necessary to combine these cells to create the P-

side (positive) and N-side (negative) as described in the

input, output, 3-state and bidirectional sections.

Creating LVDS Global Clock Input Buffers

Global clock input buffers can be combined with adjacent

IOBs to form LVDS clock input buffers. P-side is the GCLK-

PAD location; N-side is the adjacent IO_LVDS_DLL site.

HDL Instantiation

Only one global clock input buffer is required to be instanti-

ated in the design and placed on the correct GCLKPAD

location. The N-side of the buffer is reserved and no other

IOB is allowed to be placed on this location.

In the physical device, a configuration option is enabled that

routes the pad wire to the differential input buffer located in

the GCLKIOB. The output of this buffer then drives the out-

put of the GCLKIOB cell. In EPIC it appears that the second

buffer is unused. Any attempt to use this location for another

purpose leads to a DRC error in the software.

VHDL Instantiation

gclk0_p : IBUFG_LVDS port map

(I=>clk_external, O=>clk_internal);

Verilog Instantiation

IBUFG_LVDS gclk0_p (.I(clk_external),

.O(clk_internal));

Location constraints

All LVDS buffers must be explicitly placed on a device. For

the global clock input buffers this can be done with the fol-

lowing constraint in the .ucf or .ncf file.

NET clk_external LOC = GCLKPAD3;

GCLKPAD3 can also be replaced with the package pin

name such as D17 for the BG432 package.

Optional N-side

Some designers might prefer to also instantiate the N-side

buffer for the global clock buffer. This allows the top-level net

list to include net connections for both PCB layout and sys-

tem-level integration. In this case, only the output P-side

IBUFG connection has a net connected to it. Since the N-

side IBUFG does not have a connection in the EDIF net list,

it is trimmed from the design in MAP.

Tabl e 4 0 : Bourns LVDS/LVPECL Resistor Packs

Part Number I/O Standard

Term.

for:

Pairs/

Pack Pins

CAT16−LV 2 F 6 LV D S D r i v er 2 8

CAT16−LV4F12 LVDS Driver 4 16

CAT16−PC2F6 LVPECL Driver 2 8

CAT16−PC4F12 LVPECL Driver 4 16

CAT16−PT2F2 LVDS/LVPECL Receiver 2 8

CAT16−PT4F4 LVDS/LVPECL Receiver 4 16

Figure 58: LVDS elements

IBUF_LVDS

OBUF_LVDS IOBUF_LVDS

OBUFT_LVDS

IBUFG_LVDS

x133_22_122299

Table 41: Global Clock Input Buffer Pair Locations

Pkg

GCLK 3 GCLK 2 GCLK 1 GCLK 0

PNPN P N P N

CB228 - - 199 198 - - 87 88

BG432 D17 C17 A16 B16 AK16 AL17 AL16 AH15

BG560 A17 C18 D17 E17 AJ17 AM18 AL17 AM17

CG560 A17 C18 D17 E17 AJ17 AM18 AL17 AM17

FG1156 E17 C17 D17 J18 Al19 AL17 AH18 AM18

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VHDL Instantiation

gclk0_p : IBUFG_LVDS port map

(I=>clk_p_external, O=>clk_internal);

gclk0_n : IBUFG_LVDS port map

(I=>clk_n_external, O=>clk_internal);

Verilog Instantiation

IBUFG_LVDS gclk0_p (.I(clk_p_external),

.O(clk_internal));

IBUFG_LVDS gclk0_n (.I(clk_n_external),

.O(clk_internal));

Location Constraints

All LVDS buffers must be explicitly placed on a device. For

the global clock input buffers this can be done with the fol-

lowing constraint in the .ucf or .ncf file.

NET clk_p_external LOC = GCLKPAD3;

NET clk_n_external LOC = C17;

GCLKPAD3 can also be replaced with the package pin

name, such as D17 for the BG432 package.

Creating LVDS Input Buffers

An LVDS input buffer can be placed in a wide number of IOB

locations. The exact location is dependent on the package

that is used. The Virtex-E package information lists the pos-

sible locations as IO_L#P for the P-side and IO_L#N for the

N-side where # is the pair number.

HDL Instantiation

Only one input buffer is required to be instantiated in the

design and placed on the correct IO_L#P location. The N-

side of the buffer is reserved and no other IOB is allowed to

be placed on this location. In the physical device, a configu-

ration option is enabled that routes the pad wire from the

IO_L#N IOB to the differential input buffer located in the

IO_L#P IOB. The output of this buffer then drives the output

of the IO_L#P cell or the input register in the IO_L#P IOB. In

EPIC it appears that the second buffer is unused. Any

attempt to use this location for another purpose leads to a

DRC error in the software.

VHDL Instantiation

data0_p : IBUF_LVDS port map (I=>data(0),

O=>data_int(0));

Verilog Instantiation

IBUF_LVDS data0_p (.I(data[0]),

.O(data_int[0]));

Location Constraints

All LVDS buffers must be explicitly placed on a device. For

the input buffers this can be done with the following con-

straint in the .ucf or .ncf file.

NET data<0> LOC = D28; # IO_L0P

Optional N-side

Some designers might prefer to also instantiate the N-side

buffer for the input buffer. This allows the top-level net list to

include net connections for both PCB layout and system-

level integration. In this case, only the output P-side IBUF

connection has a net connected to it. Since the N-side IBUF

does not have a connection in the EDIF net list, it is trimmed

from the design in MAP.

VHDL Instantiation

data0_p : IBUF_LVDS port map

(I=>data_p(0), O=>data_int(0));

data0_n : IBUF_LVDS port map

(I=>data_n(0), O=>open);

Verilog Instantiation

IBUF_LVDS data0_p (.I(data_p[0]),

.O(data_int[0]));

IBUF_LVDS data0_n (.I(data_n[0]), .O());

Location Constraints

All LVDS buffers must be explicitly placed on a device. For

the global clock input buffers this can be done with the fol-

lowing constraint in the .ucf or .ncf file.

NET data_p<0> LOC = D28; # IO_L0P

NET data_n<0> LOC = B29; # IO_L0N

Adding an Input Register

All LVDS buffers can have an input register in the IOB. The

input register is in the P-side IOB only. All the normal IOB

FDPE, FDR, FDRE, FDS, FDSE, LD, LDE, LDC, LDCE,

LDP, LDPE). The register elements can be inferred or

explicitly instantiated in the HDL code.

The register elements can be packed in the IOB using the

IOB property to TRUE on the register or by using the "map

-pr [i|o|b]" where "i" is inputs only, "o" is outputs only and "b"

is both inputs and outputs.

To improve design coding times VHDL and Verilog synthesis

macro libraries available to explicitly create these structures.

The input library macros are listed in Ta b l e 4 2 . The I and IB

inputs to the macros are the external net connections.

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Creating LVDS Output Buffers

LVDS output buffers can be placed in a wide number of IOB

locations. The exact locations are dependent on the pack-

age used. The Virtex-E package information lists the possi-

ble locations as IO_L#P for the P-side and IO_L#N for the

N-side, where # is the pair number.

HDL Instantiation

Both output buffers are required to be instantiated in the

design and placed on the correct IO_L#P and IO_L#N loca-

tions. The IOB must have the same net source the following

pins, clock (C), set/reset (SR), output (O), output clock

enable (OCE). In addition, the output (O) pins must be

inverted with respect to each other, and if output registers

are used, the INIT states must be opposite values (one

HIGH and one LOW). Failure to follow these rules leads to

DRC errors in software.

VHDL Instantiation

data0_p : OBUF_LVDS port map

(I=>data_int(0), O=>data_p(0));

data0_inv: INV port map

(I=>data_int(0), O=>data_n_int(0));

data0_n : OBUF_LVDS port map

(I=>data_n_int(0), O=>data_n(0));

Verilog Instantiation

OBUF_LVDS data0_p (.I(data_int[0]),

.O(data_p[0]));

INV data0_inv (.I(data_int[0],

.O(data_n_int[0]);

OBUF_LVDS data0_n (.I(data_n_int[0]),

.O(data_n[0]));

Location Constraints

All LVDS buffers must be explicitly placed on a device. For

the output buffers this can be done with the following con-

straint in the .ucf or .ncf file.

NET data_p<0> LOC = D28; # IO_L0P

NET data_n<0> LOC = B29; # IO_L0N

Synchronous vs. Asynchronous Outputs

If the outputs are synchronous (registered in the IOB) then

any IO_L#P|N pair can be used. If the outputs are asynchro-

nous (no output register), then they must use one of the

pairs that are part of the same IOB group at the end of a

ROW or COLUMN in the device.

The LVDS pairs that can be used as asynchronous outputs

are listed in the Virtex-E pinout tables. Some pairs are

marked as asynchronous-capable for all devices in that

package, and others are marked as available only for that

device in the package. If the device size might change at

some point in the product lifetime, then only the common

pairs for all packages should be used.

Adding an Output Register

All LVDS buffers can have an output register in the IOB. The

output registers must be in both the P-side and N-side IOBs.

All the normal IOB register options are available (FD, FDE,

FDC, FDCE, FDP, FDPE, FDR, FDRE, FDS, FDSE, LD,

LDE, LDC, LDCE, LDP, LDPE). The register elements can

be inferred or explicitly instantiated in the HDL code.

Special care must be taken to insure that the D pins of the

registers are inverted and that the INIT states of the regis-

ters are opposite. The clock pin (C), clock enable (CE) and

set/reset (CLR/PRE or S/R) pins must connect to the same

source. Failure to do this leads to a DRC error in the soft-

ware.

The register elements can be packed in the IOB using the

IOB property to TRUE on the register or by using the "map

-pr [i|o|b]" where "i" is inputs only, "o" is outputs only and "b"

is both inputs and outputs.

To improve design coding times VHDL and Verilog synthe-

sis macro libraries have been developed to explicitly create

these structures. The output library macros are listed in

Ta b le 4 3 . The O and OB inputs to the macros are the exter-

nal net connections.

Tabl e 4 2 : Input Library Macros

Name Inputs Outputs

IBUFDS_FD_LVDS I, IB, C Q

IBUFDS_FDE_LVDS I, IB, CE, C Q

IBUFDS_FDC_LVDS I, IB, C, CLR Q

IBUFDS_FDCE_LVDS I, IB, CE, C, CLR Q

IBUFDS_FDP_LVDS I, IB, C, PRE Q

IBUFDS_FDPE_LVDS I, IB, CE, C, PRE Q

IBUFDS_FDR_LVDS I, IB, C, R Q

IBUFDS_FDRE_LVDS I, IB, CE, C, R Q

IBUFDS_FDS_LVDS I, IB, C, S Q

IBUFDS_FDSE_LVDS I, IB, CE, C, S Q

IBUFDS_LD_LVDS I, IB, G Q

IBUFDS_LDE_LVDS I, IB, GE, G Q

IBUFDS_LDC_LVDS I, IB, G, CLR Q

IBUFDS_LDCE_LVDS I, IB, GE, G, CLR Q

IBUFDS_LDP_LVDS I, IB, G, PRE Q

IBUFDS_LDPE_LVDS I, IB, GE, G, PRE Q

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Creating LVDS Output 3-State Buffers

LVDS output 3-state buffers can be placed in a wide number

of IOB locations. The exact locations are dependent on the

package used. The Virtex-E package information lists the

possible locations as IO_L#P for the P-side and IO_L#N for

the N-side, where # is the pair number.

HDL Instantiation

Both output 3-state buffers are required to be instantiated in

the design and placed on the correct IO_L#P and IO_L#N

locations. The IOB must have the same net source the fol-

lowing pins, clock (C), set/reset (SR), 3-state (T), 3-state

clock enable (TCE), output (O), output clock enable (OCE).

In addition, the output (O) pins must be inverted with

respect to each other, and if output registers are used, the

INIT states must be opposite values (one High and one

Low). If 3-state registers are used, they must be initialized to

the same state. Failure to follow these rules leads to DRC

errors in the software.

VHDL Instantiation

data0_p: OBUFT_LVDS port map

(I=>data_int(0), T=>data_tri,

O=>data_p(0));

data0_inv: INV port map

(I=>data_int(0), O=>data_n_int(0));

data0_n: OBUFT_LVDS port map

(I=>data_n_int(0), T=>data_tri,

O=>data_n(0));

Verilog Instantiation

OBUFT_LVDS data0_p (.I(data_int[0]),

.T(data_tri), .O(data_p[0]));

INV data0_inv (.I(data_int[0],

.O(data_n_int[0]);

OBUFT_LVDS data0_n (.I(data_n_int[0]),

.T(data_tri), .O(data_n[0]));

Location Constraints

All LVDS buffers must be explicitly placed on a device. For

the output buffers this can be done with the following con-

straint in the .ucf or .ncf file.

NET data_p<0> LOC = D28; # IO_L0P

NET data_n<0> LOC = B29; # IO_L0N

Synchronous vs. Asynchronous 3-State Outputs

If the outputs are synchronous (registered in the IOB), then

any IO_L#P|N pair can be used. If the outputs are asynchro-

nous (no output register), then they must use one of the

pairs that are part of the same IOB group at the end of a

ROW or COLUMN in the device. This applies for either the

3-state pin or the data out pin.

LVDS pairs that can be used as asynchronous outputs are

listed in the Virtex-E pinout tables. Some pairs are marked

as "asynchronous capable" for all devices in that package,

and others are marked as available only for that device in

the package. If the device size might be changed at some

point in the product lifetime, then only the common pairs for

all packages should be used.

Adding Output and 3-State Registers

All LVDS buffers can have an output register in the IOB. The

output registers must be in both the P-side and N-side IOBs.

All the normal IOB register options are available (FD, FDE,

FDC, FDCE, FDP, FDPE, FDR, FDRE, FDS, FDSE, LD,

LDE, LDC, LDCE, LDP, LDPE). The register elements can

be inferred or explicitly instantiated in the HDL code.

Special care must be taken to insure that the D pins of the

registers are inverted and that the INIT states of the regis-

ters are opposite. The 3-state (T), 3-state clock enable

(CE), clock pin (C), output clock enable (CE) and set/reset

(CLR/PRE or S/R) pins must connect to the same source.

Failure to do this leads to a DRC error in the software.

Tabl e 4 3 : Output Library Macros

Name Inputs Outputs

OBUFDS_FD_LVDS D, C O, OB

OBUFDS_FDE_LVDS DD, CE, C O, OB

OBUFDS_FDC_LVDS D, C, CLR O, OB

OBUFDS_FDCE_LVDS D, CE, C, CLR O, OB

OBUFDS_FDP_LVDS D, C, PRE O, OB

OBUFDS_FDPE_LVDS D, CE, C, PRE O, OB

OBUFDS_FDR_LVDS D, C, R O, OB

OBUFDS_FDRE_LVDS D, CE, C, R O, OB

OBUFDS_FDS_LVDS D, C, S O, OB

OBUFDS_FDSE_LVDS D, CE, C, S O, OB

OBUFDS_LD_LVDS D, G O, OB

OBUFDS_LDE_LVDS D, GE, G O, OB

OBUFDS_LDC_LVDS D, G, CLR O, OB

OBUFDS_LDCE_LVDS D, GE, G, CLR O, OB

OBUFDS_LDP_LVDS D, G, PRE O, OB

OBUFDS_LDPE_LVDS D, GE, G, PRE O, OB

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The register elements can be packed in the IOB using the

IOB property to TRUE on the register or by using the "map

-pr [i|o|b]" where "i" is inputs only, "o" is outputs only and "b"

is both inputs and outputs.

To improve design coding times VHDL and Verilog synthe-

sis macro libraries have been developed to explicitly create

these structures. The input library macros are listed below.

The 3-state is configured to be 3-stated at GSR and when

the PRE,CLR,S or R is asserted and shares its clock enable

with the output register. If this is not desirable then the

library can be updated by the user for the desired function-

ality. The O and OB inputs to the macros are the external

net connections.

Creating a LVDS Bidirectional Buffer

LVDS bidirectional buffers can be placed in a wide number

of IOB locations. The exact locations are dependent on the

package used. The Virtex-E package information lists the

possible locations as IO_L#P for the P-side and IO_L#N for

the N-side, where # is the pair number.

HDL Instantiation

Both bidirectional buffers are required to be instantiated in

the design and placed on the correct IO_L#P and IO_L#N

locations. The IOB must have the same net source the fol-

lowing pins, clock (C), set/reset (SR), 3-state (T), 3-state

clock enable (TCE), output (O), output clock enable (OCE).

In addition, the output (O) pins must be inverted with

respect to each other, and if output registers are used, the

INIT states must be opposite values (one HIGH and one

LOW). If 3-state registers are used, they must be initialized

to the same state. Failure to follow these rules leads to DRC

errors in the software.

VHDL Instantiation

data0_p: IOBUF_LVDS port map

(I=>data_out(0), T=>data_tri,

IO=>data_p(0), O=>data_int(0));

data0_inv: INV port map

(I=>data_out(0), O=>data_n_out(0));

data0_n : IOBUF_LVDS port map

(I=>data_n_out(0), T=>data_tri,

IO=>data_n(0), O=>open);

Verilog Instantiation

IOBUF_LVDS data0_p(.I(data_out[0]),

.T(data_tri), .IO(data_p[0]),

.O(data_int[0]);

INV data0_inv (.I(data_out[0],

.O(data_n_out[0]);

IOBUF_LVDS

data0_n(.I(data_n_out[0]),.T(data_tri),.

IO(data_n[0]).O());

Location Constraints

All LVDS buffers must be explicitly placed on a device. For

the output buffers this can be done with the following con-

straint in the .ucf or .ncf file.

NET data_p<0> LOC = D28; # IO_L0P

NET data_n<0> LOC = B29; # IO_L0N

Synchronous vs. Asynchronous Bidirectional

Buffers

If the output side of the bidirectional buffers are synchro-

nous (registered in the IOB), then any IO_L#P|N pair can be

used. If the output side of the bidirectional buffers are asyn-

chronous (no output register), then they must use one of the

pairs that is a part of the asynchronous LVDS IOB group.

This applies for either the 3-state pin or the data out pin.

The LVDS pairs that can be used as asynchronous bidirec-

tional buffers are listed in the Virtex-E pinout tables. Some

pairs are marked as asynchronous capable for all devices in

that package, and others are marked as available only for

that device in the package. If the device size might change

at some point in the product’s lifetime, then only the com-

mon pairs for all packages should be used.

Adding Output and 3-State Registers

All LVDS buffers can have an output and input registers in

the IOB. The output registers must be in both the P-side and

N-side IOBs, the input register is only in the P-side. All the

normal IOB register options are available (FD, FDE, FDC,

FDCE, FDP, FDPE, FDR, FDRE, FDS, FDSE, LD, LDE,

LDC, LDCE, LDP, LDPE). The register elements can be

inferred or explicitly instantiated in the HDL code. Special

care must be taken to insure that the D pins of the registers

are inverted and that the INIT states of the registers are

opposite. The 3-state (T), 3-state clock enable (CE), clock

pin (C), output clock enable (CE), and set/reset (CLR/PRE

or S/R) pins must connect to the same source. Failure to do

this leads to a DRC error in the software.

The register elements can be packed in the IOB using the

IOB property to TRUE on the register or by using the "map

-pr [i|o|b]" where "i" is inputs only, "o" is outputs only and "b"

is both inputs and outputs. To improve design coding times

VHDL and Verilog synthesis macro libraries have been

developed to explicitly create these structures. The bidirec-

tional I/O library macros are listed in Ta bl e 4 4 . The 3-state is

configured to be 3-stated at GSR and when the PRE,CLR,S

or R is asserted and shares its clock enable with the output

and input register. If this is not desirable then the library can

be updated be the user for the desired functionality. The I/O

and IOB inputs to the macros are the external net connec-

tions.

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Revision History
The following table shows the revision history for this document.  
Tabl e   4 4 :   Bidirectional I/O Library Macros
Name Inputs Bidirectional Outputs
IOBUFDS_FD_LVDS D, T, C IO, IOB Q
IOBUFDS_FDE_LVDS D, T, CE, C IO, IOB Q
IOBUFDS_FDC_LVDS D, T, C, CLR IO, IOB Q
IOBUFDS_FDCE_LVDS D, T, CE, C, CLR IO, IOB Q
IOBUFDS_FDP_LVDS D, T, C, PRE IO, IOB Q
IOBUFDS_FDPE_LVDS D, T, CE, C, PRE IO, IOB Q
IOBUFDS_FDR_LVDS D, T, C, R IO, IOB Q
IOBUFDS_FDRE_LVDS D, T, CE, C, R IO, IOB Q
IOBUFDS_FDS_LVDS D, T, C, S IO, IOB Q
IOBUFDS_FDSE_LVDS D, T, CE, C, S IO, IOB Q
IOBUFDS_LD_LVDS D, T, G IO, IOB Q
IOBUFDS_LDE_LVDS D, T, GE, G IO, IOB Q
IOBUFDS_LDC_LVDS D, T, G, CLR IO, IOB Q
IOBUFDS_LDCE_LVDS D, T, GE, G, CLR IO, IOB Q
IOBUFDS_LDP_LVDS D, T, G, PRE IO, IOB Q
IOBUFDS_LDPE_LVDS D, T, GE, G, PRE IO, IOB Q
Date Version Revision
05/19/03 1.0 Initial Xilinx release.
07/29/04 1.1 • Section Input/Output Block, page 1: Last paragraph, excepted certain I/O standards 
from automatic addition of clamping diodes at the inputs.
• Section Input Path, page 2: Last paragraph, qualified the presence of optional pull-
up/pull-down resistors on all inputs to "all user I/O inputs."
• Section Block SelectRAM, page 5: Last paragraph, added reference to XAPP130.
• Section Configuration, page 11: Added updated information regarding the optional 
special use of certain pins.
• Section Configuration Modes: On page 12 (two places), added recommendation to 
actively drive configuration mode pins rather than leave tem floating.
•Figure 18, page 16: Updated flowchart.
• Section Boundary-Scan Mode, page 17: Added information about required control of 
PROGRAM pin, and added a reference to XAPP139.
• Section Duty Cycle Correction Property, page 21: Removed the statement that 
when duty-cycle correction deactivates, the output clock has the same duty cycle as 
the source clock.
•Table 36, page 43: Correct VIH Min from 0.7 x VCCO to 0.65 x VCCO.

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

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QPro Virtex-E Electrical Characteristics

Based on preliminary characterization. Further changes are not expected.

All guaranteed specifications are representative of worst-case supply voltage and junction temperature conditions. Some

specifications also include best-case timing predictions. Best-case timing specifications are for design guidance and are not

guaranteed.

DC Characteristics

Absolute Maximum Ratings

Recommended Operating Conditions

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Symbol Description(1) Units

VCCINT Internal Supply voltage relative to GND –0.5 to 2.0 V

VCCO Supply voltage relative to GND –0.5 to 4.0 V

VREF Input Reference Voltage –0.5 to 4.0 V

VIN(3) Input voltage relative to GND –0.5 to VCCO + 0.5 V

VTS Voltage applied to 3-state output –0.5 to 4.0 V

VCC Longest Supply Voltage Rise Time from 0 V - 1.71 V 50 ms

TSTG Storage temperature (ambient) –65 to +150 °C

TJJunction temperature(2) Plastic packages +125 °C

Ceramic packages +150 °C

Notes:

1. Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions

is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time can affect device reliability.

2. For soldering guidelines and thermal considerations, see the Device Packaging infomation on the Xilinx website.

3. Inputs configured as PCI are fully PCI compliant. This statement takes precedence over any specification that would imply that the

device is not PCI compliant.

Symbol Description Min Max Units

VCCINT Internal Supply voltage relative to GND, TJ = –55°C to +125°C Military 1.71 1.89 V

VCCO Supply voltage relative to GND, TJ = –55°C to +125°C Military 1.2 3.6 V

TIN Input signal transition time - 250 ns

TCOperating Temperature Range XQV600E –55 +125 °C

XQV1000E –55 +125 °C

XQV2000E –40 +125 °C

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DC Characteristics Over Recommended Operating Conditions

Power-On Power Supply Requirements

Xilinx FPGAs require a certain amount of supply current during power-on to insure proper device operation. The actual

current consumed depends on the power-on ramp rate of the power supply. This is the time required to reach the nominal

power supply voltage of the device1 from 0 V. The fastest ramp rate is 0V to nominal voltage in 2 ms, and the slowest allowed

ramp rate is 0V to nominal voltage in 50 ms. For more details on power supply requirements, see XAPP158.

Symbol Description Device Min Max Units

VDRINT Data Retention VCCINT Voltage

(below which configuration data might be lost) All 1.5 - V

VDRIO Data Retention VCCO Voltage

(below which configuration data might be lost) All 1.2 - V

ICCINTQ Quiescent VCCINT supply current(1) XQV600E - 400 mA

XQV1000E - 500 mA

XQV2000E - 1100 mA

ICCOQ Quiescent VCCO supply current(1) All - 2 mA

ILInput or output leakage current All –10 +10 µA

CIN Input capacitance (sample tested) All - 8 pF

IRPU Pad pull-up (when selected) @ Vin = 0V, VCCO = 3.3V (sample tested) All Note 2 0.25 mA

IRPD Pad pull-down (when selected) @ Vin = 3.6V (sample tested) - Note 2 0.25 mA

Notes:

1. With no output current loads, no active input pull-up resistors, all I/O pins 3-stated and floating.

2. Internal pull-up and pull-down resistors guarantee valid logic levels at unconnected input pins. These pull-up and pull-down resistors

do not guarantee valid logic levels when input pins are connected to other circuits.

Description2Temperature Min3Units

Minimum required current supply TJ = 0°C to +125 °C1A

TJ = –40°C to 0°C2A

TJ = –55°C to –40°C2.5A

Notes:

1. Ramp rate used for this specification is from 0-1.8V DC. Peak current occurs on or near the internal power-on reset threshold and

lasts for less than 3 ms.

2. Devices are guaranteed to initialize properly with the minimum current available from the power supply as noted above.

3. Larger currents might result if ramp rates are forced to be faster.

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DC Input and Output Levels

Values for VIL and VIH are recommended input voltages. Values for IOL and IOH are guaranteed over the recommended

operating conditions at the VOL and VOH test points. Only selected standards are tested. These are chosen to ensure that

all standards meet their specifications. The selected standards are tested at minimum VCCO with the respective VOL and

VOH voltage levels shown. Other standards are sample tested.

Input/Output

Standard

VIL VIH VOL VOH IOL IOH

V, Min V, Max V, Min V, Max V, Max V, Min mA mA

LVTTL (1) – 0.5 0.8 2.0 3.6 0.4 2.4 24 – 24

LVCMOS2 – 0.5 0.7 1.7 2.7 0.4 1.9 12 – 12

LVCMOS18 – 0.5 35% VCCO 65% VCCO 1.95 0.4 VCCO – 0.4 8 – 8

PCI, 3.3V – 0.5 30% VCCO 50% VCCO VCCO + 0.5 10% VCCO 90% VCCO Note 2 Note 2

GTL – 0.5 VREF – 0.05 VREF + 0.05 3.6 0.4 n/a 40 n/a

GTL+ – 0.5 VREF – 0.1 VREF + 0.1 3.6 0.6 n/a 36 n/a

HSTL I – 0.5 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCO – 0.4 8 –8

HSTL III – 0.5 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCO – 0.4 24 –8

HSTL IV – 0.5 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCO – 0.4 48 –8

SSTL3 I – 0.5 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.6 VREF + 0.6 8 –8

SSTL3 II – 0.5 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.8 VREF + 0.8 16 –16

SSTL2 I – 0.5 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.61 VREF + 0.61 7.6 –7.6

SSTL2 II – 0.5 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.80 VREF + 0.80 15.2 –15.2

CTT – 0.5 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.4 VREF + 0.4 8 –8

AGP – 0.5 VREF – 0.2 VREF + 0.2 3.6 10% VCCO 90% VCCO Note 2 Note 2

Notes:

1. VOL and VOH for lower drive currents are sample tested.

2. Tested according to the relevant specifications.

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LVDS DC Specifications

LVPECL DC Specifications

These values are valid at the output of the source termination pack shown under LVPECL (Module 2), with a 100Ω

differential load only. The VOH levels are 200 mV below standard LVPECL levels and are compatible with devices tolerant of

lower common-mode ranges. The following table summarizes the DC output specifications of LVPECL.

Symbol DC Parameter Conditions Min Typ Max Units

VCCO Supply Voltage 2.375 2.5 2.625 V

VOH Output High Voltage for Q and Q RT = 100Ω across Q and Q signals 1.25 1.425 1.6 V

VOL Output Low Voltage for Q and Q RT = 100Ω across Q and Q signals 0.9 1.075 1.25 V

VODIFF

Differential Output Voltage (Q – Q),

Q = High (Q – Q), Q = High RT = 100Ω across Q and Q signals 250 350 450 mV

VOCM Output Common-Mode Voltage RT = 100Ω across Q and Q signals 1.125 1.25 1.375 V

VIDIFF

Differential Input Voltage (Q – Q),

Q = High (Q – Q), Q = High Common-mode input voltage = 1.25V 100 350 NA mV

VICM Input Common-Mode Voltage Differential input voltage = ±350 mV 0.2 1.25 2.2 V

Notes:

1. Refer to the Design Consideration section for termination schematics.

DC Parameter Min Max Min Max Min Max Units

VCCO 3.0 3.3 3.6 V

VOH 1.8 2.11 1.92 2.28 2.13 2.41 V

VOL 0.96 1.27 1.06 1.43 1.30 1.57 V

VIH 1.49 2.72 1.49 2.72 1.49 2.72 V

VIL 0.86 2.125 0.86 2.125 0.86 2.125 V

Differential Input Voltage 0.3 - 0.3 - 0.3 - V

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Virtex-E Switching Characteristics

Testing of switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%

functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are

representative values. For more specific, more precise, and worst-case guaranteed data, use the values reported by the

static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation net list. All timing

parameters assume worst-case operating conditions (supply voltage and junction temperature). Values apply to all Virtex-E

devices unless otherwise noted.

IOB Input Switching Characteristics

Input delays associated with the pad are specified below for LVTTL levels. For other standards, adjust the delays with the

values shown in IOB Input Switching Characteristics Standard Adjustments, page 6.

Symbol Description(2) Device

Best Case(3) Worst Case Units

Min Max Min Max

Propagation Delays

TIOPI Pad to I output, no delay All 0.43 - - 0.8 ns

TIOPID Pad to I output, with delay XQV600E 0.51 - - 1.0 ns

XQV1000E 0.55 - - 1.1 ns

XQV2000E 0.55 - - 1.1 ns

TIOPLI

Pad to output IQ via transparent

latch, no delay All 0.8 --

1.6 ns

TIOPLID Pad to output IQ via transparent

latch, with delay

XQV600E 1.55 - - 3.7 ns

XQV1000E 1.55 - - 3.7 ns

XQV2000E 1.59 - - 3.8 ns

Sequential Delays, Clock CLK

TCH Minimum Pulse Width, High

All

0.56 1.4 ns

TCL Minimum Pulse Width, Low 0.56 1.4 ns

TIOCKIQ Clock CLK to output IQ 0.18 - - 0.7 ns

Setup and Hold Times with respect to Clock at IOB Input Register

TIOPICK/

TIOICKP

Pad, no delay All 0.69 / 0 - 1.5 / 0 - ns

TIOPICKD/

TIOICKPD

Pad, with delay XQV600E 1.49 / 0 - 3.5 / 0 - ns

XQV1000E 1.49 / 0 - 3.5 / 0 - ns

XQV2000E 1.53 / 0 - 3.6 / 0 - ns

TIOICECK/

TIOCKICE

ICE input All 0.28 / 0.01 - 0.7 / 0.01 - ns

TIOSRCKI SR input (IFF, synchronous) All 0.38 - 1.0 - ns

Set/Reset Delays

TIOSRIQ SR input to IQ (asynchronous) All 0.54 - - 1.4 ns

TGSRQ GSR to output IQ All 3.88 - - 9.7 ns

Notes:

1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed "best-case", but

if a "0" is listed, there is no positive hold time.

2. Input timing i for LVTTL is measured at 1.4V. For other I/O standards, see Ta b l e 2 .

3. Best Case numbers are Advance specification numbers. See DC Characteristics, page 1 for a description.

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6 1-800-255-7778 Advance Product Specification

IOB Input Switching Characteristics Standard Adjustments

Symbol Description Standard(1) Min(2) Max Units

Data Input Delay Adjustments

TILVTTL Standard-specific data input delay

adjustments

LVTTL 0.0 0.0 ns

TILVCMOS2 LVCMOS2 –0.02 0.0 ns

TILVCMOS18 LVCMOS18 0.12 +0.20 ns

TILVDS LVDS 0.00 +0.15 ns

TILVPECL LVPECL 0.00 +0.15 ns

TIPCI33_3 PCI, 33 MHz, 3.3V –0.05 +0.08 ns

TIPCI66_3 PCI, 66 MHz, 3.3V –0.05 –0.11 ns

TIGTL GTL +0.10 +0.14 ns

TIGTLPLUS GTL+ +0.06 +0.14 ns

TIHSTL HSTL +0.02 +0.04 ns

TISSTL2 SSTL2 –0.04 +0.04 ns

TISSTL3 SSTL3 –0.02 +0.04 ns

TICTT CTT +0.01 +0.10 ns

TIAGP AGP –0.03 +0.04 ns

Notes:

1. Input timing i for LVTTL is measured at 1.4V. For other I/O standards, see Ta b l e 2 .

2. Best Case Numbers are Advance product specification numbers. See DC Characteristics, page 1 for a description.

Figure 1: Virtex-E Input/Output Block (IOB)

OBUFT

IBUF

Vref

ds022_02_091300

CLK

ICE

OCE

TCE

PAD

Programmable

Delay

Weak

Keeper

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IOB Output Switching Characteristics, Figure 1

Output delays terminating at a pad are specified for LVTTL with 12 mA drive and fast slew rate. For other standards, adjust

the delays with the values shown in IOB Output Switching Characteristics Standard Adjustments, page 8.

Symbol

Description (2)

Best Case Worst Case(1)

UnitsMin (3) Max Min Max

Propagation Delays

TIOOP O input to Pad 1.04 - - 2.9 ns

TIOOLP O input to Pad via transparent latch 1.24 - - 3.4 ns

3-State Delays

TIOTHZ T input to Pad high-impedance(2) 0.73 - - 1.9 ns

TIOTON T input to valid data on Pad 1.13 - - 3.1 ns

TIOTLPHZ T input to Pad high-impedance via transparent latch (2) 0.86 - - 2.2 ns

TIOTLPON T input to valid data on Pad via transparent latch 1.26 - - 3.4 ns

TGTS GTS to Pad high impedance(2) 1.94 - - 4.9 ns

Sequential Delays, Clock CLK

TCH Minimum Pulse Width, High 0.56 1.4 ns

TCL Minimum Pulse Width, Low 0.56 1.4 ns

TIOCKP Clock CLK to Pad 0.97 - - 2.9 ns

TIOCKHZ Clock CLK to Pad high-impedance (synchronous)(2) 0.77 - - 2.2 ns

TIOCKON Clock CLK to valid data on Pad (synchronous) 1.17 - - 3.4 ns

Setup and Hold Times before/after Clock CLK

TIOOCK /

TIOCKO

O input 0.43 / 0 - 1.1 / 0 - ns

TIOOCECK /

TIOCKOCE

OCE input 0.28 / 0 - 0.7 / 0 - ns

TIOSRCKO /

TIOCKOSR

SR input (OFF) 0.40 / 0 - 1.0 / 0 - ns

TIOTCK /

TIOCKT

3-State Setup Times, T input 0.26 / 0 - 0.7 / 0 - ns

TIOTCECK /

TIOCKTCE

3-State Setup Times, TCE input 0.30 / 0 - 0.8 / 0 - ns

TIOSRCKT /

TIOCKTSR

3-State Setup Times, SR input (TFF)0.38 / 0 - 1.0 / 0 - ns

Set/Reset Delays

TIOSRP SR input to Pad (asynchronous) 1.30 - - 3.5 ns

TIOSRHZ SR input to Pad high-impedance (asynchronous)(2) 1.08 - - 2.7 ns

TIOSRON SR input to valid data on Pad (asynchronous) 1.48 - - 3.9 ns

TIOGSRQ GSR to Pad 3.88 - - 9.7 ns

Notes:

1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed "best-case", but

if a "0" is listed, there is no positive hold time.

2. 3-state turn-off delays should not be adjusted.

3. Best Case Numbers are Advance product specification numbers. See DC Characteristics, page 1 for a description.

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IOB Output Switching Characteristics Standard Adjustments

Output delays terminating at a pad are specified for LVTTL with 12 mA drive and fast slew rate. For other standards, adjust

the delays by the values shown.

Symbol Description Standard Min(1) Max Units

Output Delay Adjustments

TOLVTTL_S2 Standard-specific adjustments for output delays terminating at

pads (based on standard capacitive load, Csl)

LVTTL, Slow, 2 mA 4.2 +14.7 ns

TOLVTTL_S4 4 mA 2.5 +7.5 ns

TOLVTTL_S6 6 mA 1.8 +4.8 ns

TOLVTTL_S8 8 mA 1.2 +3.0 ns

TOLVTTL_S12 12 mA 1.0 +1.9 ns

TOLVTTL_S16 16 mA 0.9 +1.7 ns

TOLVTTL_S24 24 mA 0.8 +1.3 ns

TOLVTTL_F2 LVTTL, Fast, 2 mA 1.9 +13.1 ns

TOLVTTL_F4 4 mA 0.7 +5.3 ns

TOLVTTL_F6 6 mA 0.20 +3.1 ns

TOLVTTL_F8 8 mA 0.10 +1.0 ns

TOLVTTL_F12 12 mA 0.0 0.0 ns

TOLVTTL_F16 16 mA –0.10 –0.05 ns

TOLVTTL_F24 24 mA –0.10 –0.20 ns

TOLVCMOS_2 LVCMOS2 0.10 +0.09 ns

TOLVCMOS_18 LVCMOS18 0.10 +0.7 ns

TOLVDS LVDS –0.39 –1.2 ns

TOLVPECL LVPECL –0.20 –0.41 ns

TOPCI33_3 PCI, 33 MHz, 3.3V 0.50 +2.3 ns

TOPCI66_3 PCI, 66 MHz, 3.3V 0.10 –0.41 ns

TOGTL GTL 0.6 +0.49 ns

TOGTLP GTL+ 0.7 +0.8 ns

TOHSTL_I HSTL I 0.10 –0.51 ns

TOHSTL_III HSTL III –0.10 –0.91 ns

TOHSTL_IV HSTL IV –0.20 –1.01 ns

TOSSTL2_I SSTL2 I –0.10 –0.51 ns

TOSSTL2_II SSTL2 II –0.20 –0.91 ns

TOSSTL3_I SSTL3 I –0.20 –0.51 ns

TOSSTL3_II SSTL3 II –0.30 –1.01 ns

TOCTT CTT 0.0 –0.61 ns

TOAGP AGP –0.1 –0.91 ns

Notes:

1. The numbers for Min are Best Case Advance product specification numbers. See DC Characteristics, page 1 for a description.

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Advance Product Specification 1-800-255-7778 9

Calculation of Tioop as a Function of Capacitance

Tioop is the propagation delay from the O Input of the IOB to

the pad. The values for Tioop are based on the standard

capacitive load (Csl) for each I/O standard as listed in

Ta bl e 1 .

For other capacitive loads, use the formulas below to calcu-

late the corresponding Tioop:

Tioop = Tioop + Topadjust + (Cload – Csl) * fl

where:

Topadjust is reported above in the Output Delay

Adjustment section.

Cload is the capacitive load for the design.

Tabl e 1: Constants for Use in Calculation of Tioop

Standard Csl (pF) fl (ns/pF)

LVTTL Fast Slew Rate, 2 mA drive 35 0.41

LVTTL Fast Slew Rate, 4 mA drive 35 0.20

LVTTL Fast Slew Rate, 6 mA drive 35 0.13

LVTTL Fast Slew Rate, 8 mA drive 35 0.079

LVTTL Fast Slew Rate, 12 mA drive 35 0.044

LVTTL Fast Slew Rate, 16 mA drive 35 0.043

LVTTL Fast Slew Rate, 24 mA drive 35 0.033

LVTTL Slow Slew Rate, 2 mA drive 35 0.41

LVTTL Slow Slew Rate, 4 mA drive 35 0.20

LVTTL Slow Slew Rate, 6 mA drive 35 0.10

LVTTL Slow Slew Rate, 8 mA drive 35 0.086

LVTTL Slow Slew Rate, 12 mA drive 35 0.058

LVTTL Slow Slew Rate, 16 mA drive 35 0.050

LVTTL Slow Slew Rate, 24 mA drive 35 0.048

LVCMOS2 35 0.041

LVCMOS18 35 0.050

PCI 33 MHZ 3.3V 10 0.050

PCI 66 MHz 3.3V 10 0.033

GTL 0 0.014

GTL+ 0 0.017

HSTL Class I 20 0.022

HSTL Class III 20 0.016

HSTL Class IV 20 0.014

SSTL2 Class I 30 0.028

SSTL2 Class II 30 0.016

SSTL3 Class I 30 0.029

SSTL3 Class II 30 0.016

CTT 20 0.035

AGP 10 0.037

Notes:

1. I/O parameter measurements are made with the capacitance

values shown above. See the Application Examples

(Module 2) for appropriate terminations.

2. I/O standard measurements are reflected in the IBIS model

information except where the IBIS format precludes it.

Tabl e 2: Delay Measurement Methodology

Standard VL(1) VH(1)

Meas.

Point

VREF

(Typ)(2)

LVT T L 0 3 1. 4 -

LVCMOS2 0 2.5 1.125 -

PCI33_3 Per PCI Spec -

PCI66_3 Per PCI Spec -

GTL VREF – 0.2 VREF + 0.2 VREF 0.80

GTL+ VREF – 0.2 VREF + 0.2 VREF 1.0

HSTL Class I VREF – 0.5 VREF + 0.5 VREF 0.75

HSTL Class III VREF – 0.5 VREF + 0.5 VREF 0.90

HSTL Class IV VREF – 0.5 VREF + 0.5 VREF 0.90

SSTL3 I & II VREF – 1.0 VREF + 1.0 VREF 1.5

SSTL2 I & II VREF – 0.75 VREF + 0.75 VREF 1.25

CTT VREF – 0.2 VREF + 0.2 VREF 1.5

AGP VREF –

(0.2xVCCO)

VREF +

(0.2xVCCO)

VREF Per

AGP

Spec

LVD S 1.2 – 0.125 1.2 + 0.125 1.2

LVPECL 1.6 – 0.3 1.6 + 0.3 1.6

Notes:

1. Input waveform switches between VLand VH.

2. Measurements are made at VREF (Typ), Maximum, and

Minimum. Worst-case values are reported.

I/O parameter measurements are made with the capacitance

values shown in Table 14. See the Application Examples

(Module 2) for appropriate terminations.

I/O standard measurements are reflected in the IBIS model

information except where the IBIS format precludes it.

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10 1-800-255-7778 Advance Product Specification

Clock Distribution Switching Characteristics

I/O Standard Global Clock Input Adjustments

Symbol Description Min(1) Max Units

GCLK IOB and Buffer

TGPIO Global Clock PAD to output. 0.38 0.7 ns

TGIO Global Clock Buffer I input to O output 0.11 0.50 ns

Notes:

1. The numbers for Min are Best Case Advance product specification numbers. See DC Characteristics, page 1 for a description.

Symbol(1) Description Standard Min(2) Max Units

Data Input Delay Adjustments

TGPLVTTL Standard-specific global clock input delay

adjustments

LVTTL 0.0 0.0 ns

TGPLVCMOS2 LVCMOS2 –0.02 0.0 ns

TGPLVCMOS18 LVCMOS18 0.12 0.20 ns

TGLVDS LVDS 0.23 0.38 ns

TGLVPECL LVPECL 0.23 0.38 ns

TGPPCI33_3 PCI, 33 MHz, 3.3V –0.05 0.08 ns

TGPPCI66_3 PCI, 66 MHz, 3.3V –0.05 –0.11 ns

TGPGTL GTL 0.20 0.37 ns

TGPGTLP GTL+ 0.20 0.37 ns

TGPHSTL HSTL 0.18 0.27 ns

TGPSSTL2 SSTL2 0.21 0.27 ns

TGPSSTL3 SSTL3 0.18 0.27 ns

TGPCTT CTT 0.22 0.33 ns

TGPAGP AGP 0.21 0.27 ns

Notes:

1. Input timing for GPLVTTL is measured at 1.4V. For other I/O standards, see Ta bl e 2 .

2. The numbers for Min are Best Case Advance product specification numbers. See DC Characteristics, page 1 for a description.

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Advance Product Specification 1-800-255-7778 11

CLB Switching Characteristics

Delays originating at F/G inputs vary slightly according to the input used, see Figure 2. The values listed below are

worst-case. Precise values are provided by the timing analyzer.

Symbol Description

Best Case(1) Worst Case (2)

UnitsMin Max Min Max

Combinatorial Delays

TILO 4-input function: F/G inputs to X/Y outputs 0.19 - -0.47 ns

TIF5 5-input function: F/G inputs to F5 output 0.36 - -0.9 ns

TIF5X 5-input function: F/G inputs to X output 0.35 - -0.9 ns

TIF6Y 6-input function: F/G inputs to Y output via F6 MUX 0.35 --1.0 ns

TF5INY 6-input function: F5IN input to Y output 0.04 --0.22 ns

TIFNCTL

Incremental delay routing through transparent latch to

XQ/YQ outputs 0.27 --0.8 ns

TBYYB BY input to YB output 0.19 --0.51 ns

Sequential Delays

TCKO FF Clock CLK to XQ/YQ outputs 0.34 --1.0 ns

TCKLO Latch Clock CLK to XQ/YQ outputs 0.40 --1.0 ns

Setup and Hold Times before/after Clock CLK

TICK / TCKI 4-input function: F/G Inputs 0.39 / 0 - 1.1 / 0 - ns

TIF5CK /

TCKIF5

5-input function: F/G inputs 0.55 / 0 - 1.5 / 0 - ns

TF5INCK /

TCKF5IN

6-input function: F5IN input 0.27 / 0 - 0.8 / 0 - ns

TIF6CK /

TCKIF6

6-input function: F/G inputs via F6 MUX 0.58 / 0 - 1.6 / 0 - ns

TDICK /

TCKDI

BX/BY inputs 0.25 / 0 - 0.8 / 0 - ns

TCECK /

TCKCE

CE input 0.28 / 0 - 0.7 / 0 - ns

TRCK /

TCKR

SR/BY inputs (synchronous) 0.24 / 0 - 0.6 / 0 - ns

Clock CLK

TCH Minimum Pulse Width, High 1.4 - 1.4 - ns

TCL Minimum Pulse Width, Low 1.4 - 1.4 - ns

Set/Reset

TRPW Minimum Pulse Width, SR/BY inputs 0.94 - 2.4 - ns

TRQ Delay from SR/BY inputs to XQ/YQ outputs (asynchronous) 0.39 - - 1.0 ns

FTOG Toggle Frequency (MHz) (for export control) - - - 357.2 MHz

Notes:

1. Best Case Numbers are Advance product specification numbers. See DC Characteristics, page 1 for a description.

2. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed "best-case", but

if a "0" is listed, there is no positive hold time.

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12 1-800-255-7778 Advance Product Specification

Figure 2: Detailed View of Virtex-E Slice

F5IN

CLK

CIN

F5 F5

ds022_05_092000

COUT

CK WSO

WSH

BY DG

BX DI

LUT

INIT

REV

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Advance Product Specification 1-800-255-7778 13

CLB Arithmetic Switching Characteristics

Setup times not listed explicitly can be approximated by decreasing the combinatorial delays by the setup time adjustment

listed. Precise values are provided by the timing analyzer.

Symbol

Description

Best Case(1) Worst Case(2)

UnitsMin Max Min Max

Combinatorial Delays

TOPX F operand inputs to X via XOR 0.32 - - 0.8 ns

TOPXB F operand input to XB output 0.35 - - 0.9 ns

TOPY F operand input to Y via XOR 0.59 - - 1.5 ns

TOPYB F operand input to YB output 0.48 - - 1.3 ns

TOPCYF F operand input to COUT output 0.37 - - 1.0 ns

TOPGY G operand inputs to Y via XOR 0.34 - - 0.9 ns

TOPGYB G operand input to YB output 0.47 - - 1.3 ns

TOPCYG G operand input to COUT output 0.36 - - 1.0 ns

TBXCY BX initialization input to COUT 0.19 - - 0.57 ns

TCINX CIN input to X output via XOR 0.27 - - 0.7 ns

TCINXB CIN input to XB 0.02 - - 0.08 ns

TCINY CIN input to Y via XOR 0.26 - - 0.7 ns

TCINYB CIN input to YB 0.16 - - 0.43 ns

TBYP CIN input to COUT output 0.05 - - 0.15 ns

Multiplier Operation

TFANDXB F1/2 operand inputs to XB output via AND 0.10 - - 0.39 ns

TFANDYB F1/2 operand inputs to YB output via AND 0.28 - - 0.8 ns

TFANDCY F1/2 operand inputs to COUT output via AND 0.17 - - 0.51 ns

TGANDYB G1/2 operand inputs to YB output via AND 0.20 - - 0.7 ns

TGANDCY G1/2 operand inputs to COUT output via AND 0.09 - - 0.34 ns

Setup and Hold Times before/after Clock CLK

TCCKX/TCKCX CIN input to FFX 0.47 / 0 - 1.3 / 0 - ns

TCCKY/TCKCY CIN input to FFY 0.49 / 0 - 1.3 / 0 - ns

Notes:

1. Best Case Numbers are Advance product specification numbers. See DC Characteristics, page 1 for a description.

2. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed "best-case", but

if a "0" is listed, there is no positive hold time.

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14 1-800-255-7778 Advance Product Specification

CLB Distributed RAM Switching Characteristics

Symbol Description

Best Case Worst Case(1)

UnitsMin(2) Max Min Max

Sequential Delays

TSHCKO16 Clock CLK to X/Y outputs (WE active) 16 x 1 mode 0.67 - - 1.7 ns

TSHCKO32 Clock CLK to X/Y outputs (WE active) 32 x 1 mode 0.84 - - 2.1 ns

Shift-Register Mode

TREG Clock CLK to X/Y outputs 1.25 - - 3.2 ns

Setup and Hold Times before/after Clock CLK

TAS/TAH F/G address inputs 0.19 / 0 - 0.47 / 0 - ns

TDS/TDH BX/BY data inputs (DIN) 0.24 / 0 - 0.6 / 0 - ns

TWS/TWH CE input (WE) 0.29 / 0 - 0.8 / 0 - ns

Shift-Register Mode

TSHDICK BX/BY data inputs (DIN) 0.24 / 0 - 0.6 / 0 - ns

TSHCECK CE input (WS) 0.29 / 0 - 0.8 / 0 - ns

Clock CLK

TWPH Minimum Pulse Width, High 0.96 - 2.4 - ns

TWPL Minimum Pulse Width, Low 0.96 - 2.4 - ns

TWC Minimum clock period to meet address write cycle time 1.92 - 4.8 - ns

Shift-Register Mode

TSRPH Minimum Pulse Width, High 1.0 - 2.4 - ns

TSRPL Minimum Pulse Width, Low 1.0 - 2.4 - ns

Notes:

1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed "best-case", but

if a "0" is listed, there is no positive hold time.

2. The numbers for Min are Advance product specification numbers. See DC Characteristics, page 1 for a description.

Figure 3: Dual-Port Block SelectRAM

WEB

ENB

RSTB

CLKB

ADDRB[#:0]

DIB[#:0]

WEA

ENA

RSTA

CLKA

ADDRA[#:0]

DIA[#:0]

DOA[#:0]

DOB[#:0]

RAMB4_S#_S#

ds022_06_121699

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Advance Product Specification 1-800-255-7778 15

Block RAM Switching Characteristics

TBUF Switching Characteristics

JTAG Test Access Port Switching Characteristics

Symbol Description

Best Case Worst Case(1)

UnitsMin(2) Max Min Max

Sequential Delays

TBCKO Clock CLK to DOUT output 0.63 - - 3.5 ns

Setup and Hold Times before Clock CLK

TBACK/TBCKA ADDR inputs 0.42 / 0 - 1.1 / 0 - ns

TBDCK/TBCKD DIN inputs 0.42 / 0 - 1.1 / 0 - ns

TBECK/TBCKE EN input 0.97 / 0 - 2.5 / 0 - ns

TBRCK/TBCKR RST input 0.9 / 0 - 2.3 / 0 - ns

TBWCK/TBCKW WEN input 0.86 / 0 - 2.2 / 0 - ns

Clock CLK

TBPWH Minimum Pulse Width, High 0.6 - 1.5 - ns

TBPWL Minimum Pulse Width, Low 0.6 - 1.5 - ns

TBCCS CLKA -> CLKB setup time for different ports 1.2 - 3.0 - ns

Notes:

1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed "best-case", but

if a "0" is listed, there is no positive hold time.

2. The numbers for Min are Advance product specification numbers. See DC Characteristics, page 1 for a description.

Symbol Description

Best Case Worst Case

UnitsMin(1) Max Min Max

Combinatorial Delays

TIO IN input to OUT output 0.0 - - 0 .0 ns

TOFF TRI input to OUT output high-impedance 0.05 - - 0.11 ns

TON TRI input to valid data on OUT output 0.05 - - 0.11 ns

Notes:

1. The numbers for Min are Advance product specification numbers. See DC Characteristics, page 1 for a description.

Symbol Description Min Max Units

TTAPTK TMS and TDI Setup times before TCK 4.0 - ns

TTCKTAP TMS and TDI Hold times after TCK 2.0 - ns

TTCKTDO Output delay from clock TCK to output TDO - 11.0 ns

FTCK Maximum TCK clock frequency - 33 MHz

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16 1-800-255-7778 Advance Product Specification
Virtex-E Pin-to-Pin Output Parameter Guidelines
Testing of switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%
functionally tested. Listed below are representative values for typical pin locations and normal clock loading. Values are
expressed in nanoseconds unless otherwise noted.
Global Clock Input to Output Delay for LVTTL, 12 mA, Fast Slew Rate, with DLL
Global Clock Input to Output Delay for LVTTL, 12 mA, Fast Slew Rate, without DLL
Symbol  Description(1) Device
Best Case Worst Case
UnitsMin(4) Max Min Max
TICKOFDLL LVTTL Global Clock Input to Output Delay using 
Output Flip-flop, 12 mA, Fast Slew Rate, with 
DLL. For data output with different standards, 
adjust the delays with the values shown in IOB 
Output Switching Characteristics Standard 
Adjustments, page 8.
XQV600E 1.0 - - 3.1 ns
XQV1000E 1.0 - - 3.1 ns
XQV2000E 1.0 - - 3.1 ns
Notes: 
1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and 
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2. Output timing is measured at 50% VCC threshold with 35 pF external capacitive load. For other I/O standards and different loads, see 
Ta bl e 1  and Ta b le 2 .
3. DLL output jitter is already included in the timing calculation.
4. The numbers for Min are Advance product specification numbers. See DC Characteristics, page 1 for a description.
Symbol Description1Device
Best Case Worst Case
UnitsMin(4) Max Min Max
TICKOF LVTTL Global Clock Input to Output Delay using 
Output Flip-flop, 12 mA, Fast Slew Rate, without 
DLL. For data output with different standards, 
adjust the delays with the values shown in IOB 
Output Switching Characteristics Standard 
Adjustments, page 8.
XQV600E 1.6 - - 4.9 ns
XQV1000E 1.7 - - 5.0 ns
XQV2000E 1.8 - - 5.2 ns
Notes: 
1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and 
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2. Output timing is measured at 50% VCC threshold with 35 pF external capacitive load. For other I/O standards and different loads, see 
Ta bl e 1  and Ta b le 2 .
3. The numbers for Min are Advance product specification numbers. See DC Characteristics, page 1 for a description.

QPro Virtex-E 1.8V QML High-Reliability FPGAs
R
DS098-3 (v1.1) July 29, 2004 www.xilinx.com Module 3 of 4
Advance Product Specification 1-800-255-7778 17
Virtex-E Pin-to-Pin Input Parameter Guidelines
Testing of switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%
functionally tested. Listed below are representative values for typical pin locations and normal clock loading. Values are
expressed in nanoseconds unless otherwise noted.
Global Clock Set-Up and Hold for LVTTL Standard, with DLL
Global Clock Set-Up and Hold for LVTTL Standard, without DLL
Symbol Description(1) Device
Best Case Worst Case
UnitsMin(4) Max Min Max
TPSDLL/TPHDLL No Delay. Global Clock and IFF, with 
DLL.
Input Setup and Hold Time Relative to 
Global Clock Input Signal for LVTTL 
Standard. For data input with different 
standards, adjust the setup time delay 
by the values shown in IOB Input 
Switching Characteristics Standard 
Adjustments, page 6.
XQV600E 1.5 / –0.4 - - 1.7 / –0.4 ns
XQV1000E 1.5 / –0.4 - - 1.7 / –0.4 ns
XQV2000E 1.5 / –0.4 - - 1.7 / –0.4 ns
Notes: 
1. IFF = Input Flip-Flop or Latch.
2. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured 
relative to the Global Clock input signal with the slowest route and heaviest load.
3. DLL output jitter is already included in the timing calculation.
4. The numbers for Min are Advance product specification numbers. See DC Characteristics, page 1 for a description.
Symbol Description(1) Device
Best Case Worst Case
UnitsMin(4) Max Min Max
TPSFD/TPHFD Full Delay
Global Clock and IFF, without DLL
Input Setup and Hold Time Relative to 
Global Clock Input Signal for LVTTL 
Standard. For data input with different 
standards, adjust the setup time delay 
by the values shown in IOB Input 
Switching Characteristics Standard 
Adjustments, page 6.
XQV600E 2.1 / 0 - - 2.1 / 0 ns
XQV1000E 2.3 / 0 - - 2.3 / 0 ns
 XQV2000E 2.5 / 0 - - 2.5 / 0 ns
Notes: 
1. IFF = Input Flip-Flop or Latch.
2. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured 
relative to the Global Clock input signal with the slowest route and heaviest load.
3. DLL output jitter is already included in the timing calculation.
4. The numbers for Min are Advance product specification numbers. See DC Characteristics, page 1 for a description.

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18 1-800-255-7778 Advance Product Specification

DLL Timing Parameters

Switching parameters testing is modeled after testing methods specified by MIL-M-38510/605; all devices are 100 percent

functionally tested. Because of the difficulty in directly measuring many internal timing parameters, those parameters are

derived from benchmark timing patterns. The following guidelines reflect worst-case values across the recommended

operating conditions.

Description Symbol FCLKIN Min Max Units

Input Clock Frequency (CLKDLLHF) FCLKINHF 60 275 MHz

Input Clock Frequency (CLKDLL) FCLKINLF 25 135 MHz

Input Clock Low/High Pulse Width TDLLPW ≥ 25 MHz 5.0 - ns

≥50 MHz 3.0 - ns

≥100 MHz 2.4 - ns

≥150 MHz 2.0 - ns

≥200 MHz 1.8 - ns

≥250 MHz 1.5 - ns

≥300 MHz NA - ns

Notes:

1. All specifications correspond to Military Operating Temperatures (-55°C to +125°C).

Figure 4: DLL Timing Waveforms

TCLKIN TCLKIN + T

IPTOL

Period Tolerance: the allowed input clock period change in nanoseconds.

Output Jitter: the difference between an ideal

reference clock edge and the actual design.

ds022_24_091200

Ideal Period

Actual Period

+ Jitter

+/- Jitter

+ Maximum

Phase Difference

Phase Offset and Maximum Phase Difference

+ Phase Offset

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Advance Product Specification 1-800-255-7778 19

DLL Clock Tolerance, Jitter, and Phase Information

All DLL output jitter and phase specifications determined through statistical measurement at the package pins using a clock

mirror configuration and matched drivers.

Revision History

The following table shows the revision history for this document.

Symbol Description FCLKIN

CLKDLLHF CLKDLL

UnitsMin Max Min Max

TIPTOL Input Clock Period Tolerance - 1.0 - 1.0 ns

TIJITCC Input Clock Jitter Tolerance (Cycle to Cycle) - ± 150 - ± 300 ps

TLOCK Time Required for DLL to Acquire Lock > 60 MHz - 20 - 20 µs

50 - 60 MHz - - - 25 µs

40 - 50 MHz - - - 50 µs

30 - 40 MHz - - - 90 µs

25 - 30 MHz - - - 120 µs

TOJITCC Output Jitter (cycle-to-cycle) for any DLL Clock Output(1) -± 60 - ± 60 ps

TPHIO Phase Offset between CLKIN and CLKO(2) -± 100 - ± 100 ps

TPHOO Phase Offset between Clock Outputs on the DLL(3) -± 140 - ± 140 ps

TPHIOM Maximum Phase Difference between CLKIN and CLKO(4) -± 160 - ± 160 ps

TPHOOM Maximum Phase Difference between Clock Outputs on the DLL(5) -± 200 - ± 200 ps

Notes:

1. Output Jitter is cycle-to-cycle jitter measured on the DLL output clock, excluding input clock jitter.

2. Phase Offset between CLKIN and CLKO is the worst-case fixed time difference between rising edges of CLKIN and CLKO,

excluding Output Jitter and input clock jitter.

3. Phase Offset between Clock Outputs on the DLL is the worst-case fixed time difference between rising edges of any two DLL

outputs, excluding Output Jitter and input clock jitter.

4. Maximum Phase Difference between CLKIN an CLKO is the sum of Output Jitter and Phase Offset between CLKIN and CLKO,

or the greatest difference between CLKIN and CLKO rising edges due to DLL alone (excluding input clock jitter).

5. Maximum Phase DIfference between Clock Outputs on the DLL is the sum of Output JItter and Phase Offset between any DLL

clock outputs, or the greatest difference between any two DLL output rising edges sue to DLL alone (excluding input clock jitter).

6. All specifications correspond to Military Operating Temperatures (-55°C to +125°C).

Date Version Revision

05/19/03 1.0 Initial Xilinx release.

07/29/04 1.1 • Table Absolute Maximum Ratings, page 1:

- Revised VIN from "–0.5 to 4.0" to "–0.5 to VCCO + 0.5".

- Removed Footnote (2) regarding power-up sequencing. Former Footnote (3) is

now Footnote (2).

- Added new Footnote (3) regarding PCI standard compliance.

•Table DC Characteristics Over Recommended Operating Conditions, page 2:

Revised ICCINTQ for XQV2000E device from 500 mA to 1100 mA.

• Section Power-On Power Supply Requirements, page 2: Added reference to

XAPP158 regarding power supply requirements.

•Table IOB Input Switching Characteristics, page 5, and IOB Output Switching

Characteristics, Figure 1, page 7: Added TCH and TCL pulse width parameters for

clock CLK.

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20 1-800-255-7778 Advance Product Specification

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

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Advance Product Specification 1-800-255-7778 1

Virtex-E Pin Definitions

QPro Virtex-E 1.8V QML

High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 00Advance Product Specification

Pin Name Dedicated Pin Direction Description

GCK0, GCK1,

GCK2, GCK3

Yes Input Clock input pins that connect to Global Clock Buffers.

M0, M1, M2 Yes Input Mode pins are used to specify the configuration mode.

CCLK Yes Input or

Output

The configuration Clock I/O pin: it is an input for SelectMAP and

slave-serial modes, and output in master-serial mode. After

configuration, it is input only, logic level = Don’t Care.

PROGRAM Yes Input Initiates a configuration sequence when asserted Low.

DONE Yes Bidirectional Indicates that configuration loading is complete, and that the start-up

sequence is in progress. The output can be open drain.

INIT No Bidirectional

(Open-drain)

When Low, indicates that the configuration memory is being cleared.

The pin becomes a user I/O after configuration.

BUSY/DOUT No Output In SelectMAP mode, BUSY controls the rate at which configuration

data is loaded. The pin becomes a user I/O after configuration unless

the SelectMAP port is retained.

In bit-serial modes, DOUT provides preamble and configuration data

to downstream devices in a daisy-chain. The pin becomes a user I/O

after configuration.

D0/DIN, D1,

D2, D3, D4, D5,

D6, D7

No Input or

Output

In SelectMAP mode, D0-D7 are configuration data pins. These pins

become user I/Os after configuration unless the SelectMAP port is

retained.

In bit-serial modes, DIN is the single data input. This pin becomes a

user I/O after configuration.

WRITE No Input In SelectMAP mode, the active-low Write Enable signal. The pin

becomes a user I/O after configuration unless the SelectMAP port is

retained.

CS No Input In SelectMAP mode, the active-low Chip Select signal. The pin

becomes a user I/O after configuration unless the SelectMAP port is

retained.

TDI, TDO,

TMS, TCK

Yes Mixed Boundary-scan Test-Access-Port pins, as defined in IEEE1149.1.

DXN, DXP Yes N/A Temperature-sensing diode pins. (Anode: DXP, cathode: DXN)

VCCINT Yes Input Power-supply pins for the internal core logic.

VCCO Yes Input Power-supply pins for the output drivers (subject to banking rules)

VREF No Input Input threshold voltage pins. Become user I/Os when an external

threshold voltage is not needed (subject to banking rules).

GND Yes Input Ground

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Low Voltage Differential Signals

The Virtex-E family incorporates low-voltage signalling

(LVDS and LVPECL). Two pins are utilized for these signals

to be connected to a Virtex-E device. These are known as

differential pin pairs. Each differential pin pair has a Positive

(P) and a Negative (N) pin. These pairs are labeled in the

following manner.

IO_L#[P/N]

where

L = LVDS or LVPECL pin

# = Pin Pair Number

P = Positive

N = Negative

I/O pins for differential signals can either be synchronous or

asynchronous, input or output. The pin pairs can be used for

synchronous input and output signals as well as asynchro-

nous input signals. However, only some of the low-voltage

pairs can be used for asynchronous output signals.

DIfferential signals require the pins of a pair to switch almost

simultaneously. If the signals driving the pins are from IOB

flip-flops, they are synchronous. If the signals driving the

pins are from internal logic, they are asynchronous. Tabl e 1

defines the names and function of the different types of

low-voltage pin pairs in the Virtex-E family.

Virtex-E Package Pinouts

The QPro Virtex-E family of FPGAs is available in three

popular packages, including plastic ball grid, fine-pitch plas-

tic ball grid, and hermetic ceramic column grid arrays. Fam-

ily members have footprint compatibility across devices

provided in the same package. The pinout tables in this sec-

tion indicate function, pin, and bank information for each

package/device combination. Following each pinout table is

an additional table summarizing information specific to dif-

ferential pin pairs for all devices provided in that package.

Tabl e 1: LVDS Pin Pai rs

Pin Name Description

IO_L#[P/N]

Example: IO_L22N

Represents a general IO or a

synchronous input/output

differential signal. When used

as a differential signal, N

means Negative I/O and P

means Positive I/O.

IO_L#[P/N]_Y

Example: IO_L22N_Y

Represents a general IO or a

synchronous input/output

differential signal, or a

part-dependent asynchronous

output differential signal.

IO_L#[P/N]_YY

Example: O_L22N_YY

Represents a general IO or a

synchronous input/output

differential signal, or an

asynchronous output

differential signal.

IO_LVDS_DLL_L#[P/N]

Example:

IO_LVDS_DLL_L16N

Represents a general IO or a

synchronous input/output

differential signal, a differential

clock input signal, or a DLL

input. When used as a

differential clock input, this pin

is paired with the adjacent

GCK pin. The GCK pin is

always the positive input in the

differential clock input

configuration.

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BG432 Ball Grid Array Packages

XQV600E devices are available in the BG432 Ball Grid

Array package and supports output banking. See Tab l e 2 for

pinout information. Immediately following Ta bl e 2 , see

Ta bl e 3 for Differential Pair information.

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

0GCK3D17

0IOA22

0IOA26

0IOB20

0IOC23

0IOC28

0 IO_L0N_Y B29

0IO_L0P_YD27

0 IO_L1N_YY B28

0 IO_L1P_YY C27

0 IO_VREF_L2N_YY D26

0 IO_L2P_YY A28

0 IO_L3N_Y B27

0IO_L3P_YC26

0 IO_L4N_YY D25

0 IO_L4P_YY A27

0 IO_VREF_L5N_YY D24

0 IO_L5P_YY C25

0 IO_L6N_Y B25

0IO_L6P_YD23

0 IO_VREF_L7N_Y C24

0 IO_L7P_Y B24

0 IO_VREF_L8N_YY D22

0 IO_L8P_YY A24

0 IO_L9N_YY C22

0 IO_L9P_YY B22

0 IO_L10N_YY C21

0 IO_L10P_YY D20

0 IO_L11N_YY B21

0 IO_L11P_YY C20

0 IO_L12N_YY A20

0 IO_L12P_YY D19

0 IO_VREF_L13N_YY B19

0 IO_L13P_YY A19

0 IO_L14N_Y B18

0 IO_L14P_Y D18

0 IO_VREF_L15N_Y C18

0 IO_L15P_Y B17

0 IO_LVDS_DLL_L16N C17

1GCK2A16

1IOA12

1IOB9

1IOB11

1IOC16

1IOD9

1 IO_LVDS_DLL_L16P B16

1 IO_L17N_Y A15

1 IO_VREF_L17P_Y B15

1 IO_L18N_Y C15

1 IO_L18P_Y D15

1 IO_L19N_YY B14

1 IO_VREF_L19P_YY A13

1 IO_L20N_YY B13

1 IO_L20P_YY D14

1 IO_L21N_YY C13

1 IO_L21P_YY B12

1 IO_L22N_YY D13

1 IO_L22P_YY C12

1 IO_L23N_YY D12

1 IO_L23P_YY C11

1 IO_L24N_YY B10

1 IO_VREF_L24P_YY C10

1 IO_L25N_Y C9

1 IO_VREF_L25P_Y D10

1 IO_L26N_Y A8

1 IO_L26P_Y B8

1 IO_L27N_YY C8

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

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1 IO_VREF_L27P_YY B7

1 IO_L28N_YY D8

1 IO_L28P_YY A6

1 IO_L29N_Y B6

1 IO_L29P_Y D7

1 IO_L30N_YY A5

1 IO_VREF_L30P_YY C6

1 IO_L31N_YY B5

1 IO_L31P_YY D6

1 IO_L32N_Y A4

1 IO_L32P_Y C5

1 IO_WRITE_L33N_YY B4

1 IO_CS_L33P_YY D5

2IOH4

2IOJ3

2IOL3

2IOM1

2IOR2

2 IO_DOUT_BUSY_L34P_YY D3

2 IO_DIN_D0_L34N_YY C2

2 IO_L35P D2

2 IO_L35N E4

2 IO_L36P_Y D1

2 IO_L36N_Y E3

2 IO_VREF_L37P_Y E2

2 IO_L37N_Y F4

2 IO_L38P E1

2 IO_L38N F3

2 IO_L39P_Y F2

2 IO_L39N_Y G4

2 IO_VREF_L40P_YY G3

2 IO_L40N_YY G2

2 IO_L41P_Y H3

2 IO_L41N_Y H2

2 IO_VREF_L42P_Y H1

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

2 IO_L42N_Y J4

2 IO_VREF_L43P_YY J2

2 IO_D1_L43N_YY K4

2 IO_D2_L44P_YY K2

2 IO_L44N_YY K1

2 IO_L45P_Y L2

2 IO_L45N_Y M4

2 IO_L46P_Y M3

2 IO_L46N_Y M2

2 IO_L47P_Y N4

2 IO_L47N_Y N3

2 IO_VREF_L48P_YY N1

2 IO_D3_L48N_YY P4

2 IO_L49P_Y P3

2 IO_L49N_Y P2

2 IO_VREF_L50P_Y R3

2 IO_L50N_Y R4

2 IO_L51P_YY R1

2 IO_L51N_YY T3

3 IO AA2

3IOAC2

3 IO AE2

3IOU3

3IOW1

3 IO_L52P_Y U4

3 IO_VREF_L52N_Y U22

3 IO_L53P_Y U1

3 IO_L53N_Y V3

3 IO_D4_L54P_YY V4

3 IO_VREF_L54N_YY V2

3 IO_L55P_Y W3

3 IO_L55N_Y W4

3 IO_L56P_Y Y1

3 IO_L56N_Y Y3

3 IO_L57P_Y Y4

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

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3 IO_L57N_Y Y2

3 IO_L58P_YY AA3

3 IO_D5_L58N_YY AB1

3 IO_D6_L59P_YY AB3

3 IO_VREF_L59N_YY AB4

3 IO_L60P_Y AD1

3 IO_VREF_L60N_Y AC3

3 IO_L61P_Y AC4

3 IO_L61N_Y AD2

3 IO_L62P_YY AD3

3 IO_VREF_L62N_YY AD4

3 IO_L63P_Y AF2

3 IO_L63N_Y AE3

3 IO_L64P AE4

3 IO_L64N AG1

3 IO_L65P_Y AG2

3 IO_VREF_L65N_Y AF3

3 IO_L66P_Y AF4

3 IO_L66N_Y AH1

3 IO_L67P AH2

3 IO_L67N AG3

3 IO_D7_L68P_YY AG4

3 IO_INIT_L68N_YY AJ2

3IOT2

4 GCK0 AL16

4IOAH10

4 IO AJ11

4IOAK7

4 IO AL12

4 IO AL15

4 IO_L69P_YY AJ4

4 IO_L69N_YY AK3

4 IO_L70P_Y AH5

4 IO_L70N_Y AK4

4 IO_L71P_YY AJ5

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

4 IO_L71N_YY AH6

4 IO_VREF_L72P_YY AL4

4 IO_L72N_YY AK5

4 IO_L73P_Y AJ6

4 IO_L73N_Y AH7

4 IO_L74P_YY AL5

4 IO_L74N_YY AK6

4 IO_VREF_L75P_YY AJ7

4 IO_L75N_YY AL6

4 IO_L76P_Y AH9

4 IO_L76N_Y AJ8

4 IO_VREF_L77P_Y AK81

4 IO_L77N_Y AJ9

4 IO_VREF_L78P_YY AL8

4 IO_L78N_YY AK9

4 IO_L79P_YY AK10

4 IO_L79N_YY AL10

4 IO_L80P_YY AH12

4 IO_L80N_YY AK11

4 IO_L81P_YY AJ12

4 IO_L81N_YY AK12

4 IO_L82P_YY AH13

4 IO_L82N_YY AJ13

4 IO_VREF_L83P_YY AL13

4 IO_L83N_YY AK14

4 IO_L84P_Y AH14

4 IO_L84N_Y AJ14

4 IO_VREF_L85P_Y AK152

4 IO_L85N_Y AJ15

4 IO_LVDS_DLL_L86P AH15

5 GCK1 AK16

5IOAH20

5IOAJ19

5IOAJ23

5IOAJ24

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

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5 IO_LVDS_DLL_L86N AL17

5 IO_L87P_Y AK17

5 IO_VREF_L87N_Y AJ172

5 IO_L88P_Y AH17

5 IO_L88N_Y AK18

5 IO_L89P_YY AL19

5 IO_VREF_L89N_YY AJ18

5 IO_L90P_YY AH18

5 IO_L90N_YY AL20

5 IO_L91P_YY AK20

5 IO_L91N_YY AH19

5 IO_L92P_YY AJ20

5 IO_L92N_YY AK21

5 IO_L93P_YY AJ21

5 IO_L93N_YY AL22

5 IO_L94P_YY AJ22

5 IO_VREF_L94N_YY AK23

5 IO_L95P_Y AH22

5 IO_VREF_L95N_Y AL241

5 IO_L96P_Y AK24

5 IO_L96N_Y AH23

5 IO_L97P_YY AK25

5 IO_VREF_L97N_YY AJ25

5 IO_L98P_YY AL26

5 IO_L98N_YY AK26

5 IO_L99P_Y AH25

5 IO_L99N_Y AL27

5 IO_L100P_YY AJ26

5 IO_VREF_L100N_YY AK27

5 IO_L101P_YY AH26

5 IO_L101N_YY AL28

5 IO_L102P_Y AJ27

5 IO_L102N_Y AK28

6 IO AA30

6IOAC30

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

6IOAD29

6IOU31

6IOW28

6 IO_L103N_YY AJ30

6 IO_L103P_YY AH30

6 IO_L104N AG28

6 IO_L104P AH31

6 IO_L105N_Y AG29

6 IO_L105P_Y AG30

6 IO_VREF_L106N_Y AF28

6 IO_L106P_Y AG31

6 IO_L107N AF29

6 IO_L107P AF30

6 IO_L108N_Y AE28

6 IO_L108P_Y AF31

6 IO_VREF_L109N_YY AE30

6 IO_L109P_YY AD28

6 IO_L110N_Y AD30

6 IO_L110P_Y AD31

6 IO_VREF_L111N_Y AC281

6 IO_L111P_Y AC29

6 IO_VREF_L112N_YY AB28

6 IO_L112P_YY AB29

6 IO_L113N_YY AB31

6 IO_L113P_YY AA29

6 IO_L114N_Y Y28

6 IO_L114P_Y Y29

6 IO_L115N_Y Y30

6 IO_L115P_Y Y31

6 IO_L116N_Y W29

6 IO_L116P_Y W30

6 IO_VREF_L117N_YY V28

6 IO_L117P_YY V29

6 IO_L118N_Y V30

6 IO_L118P_Y U29

6 IO_VREF_L119N_Y U28

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

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6 IO_L119P_Y U30

6IOT30

7IOC30

7IOH29

7IOH31

7IOL29

7IOM31

7IOR28

7 IO_L120N_YY T31

7 IO_L120P_YY R29

7 IO_L121N_Y R30

7 IO_VREF_L121P_Y R31

7 IO_L122N_Y P29

7 IO_L122P_Y P28

7 IO_L123N_YY P30

7 IO_VREF_L123P_YY N30

7 IO_L124N_Y N28

7 IO_L124P_Y N31

7 IO_L125N_Y M29

7 IO_L125P_Y M28

7 IO_L126N_Y M30

7 IO_L126P_Y L30

7 IO_L127N_YY K31

7 IO_L127P_YY K30

7 IO_L128N_YY K28

7 IO_VREF_L128P_YY J30

7 IO_L129N_Y J29

7 IO_VREF_L129P_Y J281

7 IO_L130N_Y H30

7 IO_L130P_Y G30

7 IO_L131N_YY H28

7 IO_VREF_L131P_YY F31

7 IO_L132N_Y G29

7 IO_L132P_Y G28

7 IO_L133N E31

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

7 IO_L133P E30

7 IO_L134N_Y F29

7 IO_VREF_L134P_Y F28

7 IO_L135N_Y D31

7 IO_L135P_Y D30

7 IO_L136N E29

7 IO_L136P E28

2CCLKD4

3DONEAH4

NA DXN AH27

NA DXP AK29

NA M0 AH28

NA M1 AH29

NA M2 AJ28

NA PROGRAM AH3

NA TCK D28

NA TDI B3

2TDOC4

NA TMS D29

NA VCCINT A10

NA VCCINT A17

NA VCCINT B23

NA VCCINT B26

NA VCCINT C7

NA VCCINT C14

NA VCCINT C19

NA VCCINT F1

NA VCCINT F30

NA VCCINT K3

NA VCCINT K29

NA VCCINT N2

NA VCCINT N29

NA VCCINT T1

NA VCCINT T29

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

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NA VCCINT W2

NA VCCINT W31

NA VCCINT AB2

NA VCCINT AB30

NA VCCINT AE29

NA VCCINT AF1

NA VCCINT AH8

NA VCCINT AH24

NA VCCINT AJ10

NA VCCINT AJ16

NA VCCINT AK22

NA VCCINT AK13

NA VCCINT AK19

0 VCCO A21

0 VCCO C29

0 VCCO D21

1 VCCO A1

1 VCCO A11

1 VCCO D11

2 VCCO C3

2 VCCO L4

2 VCCO L1

3 VCCO AA1

3 VCCO AA4

3 VCCO AJ3

4 VCCO AH11

4 VCCO AL1

4 VCCO AL11

5 VCCO AH21

5 VCCO AL21

5 VCCO AJ29

6 VCCO AA28

6 VCCO AA31

6 VCCO AL31

7 VCCO A31

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

7VCCOL28

7VCCOL31

NA GND A2

NA GND A3

NA GND A7

NA GND A9

NA GND A14

NA GND A18

NA GND A23

NA GND A25

NA GND A29

NA GND A30

NA GND B1

NA GND B2

NA GND B30

NA GND B31

NA GND C1

NA GND C31

NA GND D16

NA GND G1

NA GND G31

NA GND J1

NA GND J31

NA GND P1

NA GND P31

NA GND T4

NA GND T28

NA GND V1

NA GND V31

NA GND AC1

NA GND AC31

NA GND AE1

NA GND AE31

NA GND AH16

NA GND AJ1

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

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Advance Product Specification 1-800-255-7778 9

BG432 Differential Pin Pairs

Virtex-E devices have differential pin pairs that can also Vir-

tex-E devices have differential pin pairs that can also pro-

vide other functions when not used as a differential pair. A √

in the AO column indicates that the pin pair can be used as

an asynchronous output. The Other Functions column indi-

cates alternative function(s) not available when the pair is

used as a differential pair or differential clock.

NA GND AJ31

NA GND AK1

NA GND AK2

NA GND AK30

NA GND AK31

NA GND AL2

NA GND AL3

NA GND AL7

NA GND AL9

NA GND AL14

NA GND AL18

NA GND AL23

NA GND AL25

NA GND AL29

NA GND AL30

Tabl e 3: BG432 Differential Pin Pair Summary

XQV600E

Pair Bank P

AO Other

Functions

Global Differential Clock

0 4 AL16 AH15 NA IO_DLL_L86P

1 5 AK16 AL17 NA IO_DLL_L86N

2 1 A16 B16 NA IO_DLL_L16P

3 0 D17 C17 NA IO_DLL_L16N

IO LVDS

Total Outputs: 137, Asynchronous Output Pairs: 63

00D27B29√-

10C27B28√-

20A28D26√VREF

Tabl e 2: BG432 — XQV600E

Bank Pin Description Pin #

3 0 C26 B27 NA -

40A27D25√-

50C25D24√VREF

60D23B25√-

70B24C24√VREF

80A24D22√VREF

90B22C22√-

10 0 D20 C21 √-

11 0 C20 B21 √-

12 0 D19 A20 √-

13 0 A19 B19 √VREF

14 0 D18 B18 √-

15 0 B17 C18 √VREF

16 1 B16 C17 NA IO_LVDS_DLL

17 1 B15 A15 √VREF

18 1 D15 C15 √-

19 1 A13 B14 √VREF

20 1 D14 B13 √-

21 1 B12 C13 √-

22 1 C12 D13 √-

23 1 C11 D12 √-

24 1 C10 B10 √VREF

25 1 D10 C9 √VREF

26 1 B8 A8 √-

27 1 B7 C8 √VREF

28 1 A6 D8 √-

29 1 D7 B6 NA -

30 1 C6 A5 √VREF

31 1 D6 B5 √-

32 1 C5 A4 √-

33 1 D5 B4 √CS, WRITE

34 2 D3 C2 √DIN, D0, BUSY

Tabl e 3: BG432 Differential Pin Pair Summary

XQV600E

Pair Bank P

AO Other

Functions

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35 2 D2 E4 √-

36 2 D1 E3 NA -

37 2 E2 F4 √VREF

38 2 E1 F3 √-

39 2 F2 G4 √-

40 2 G3 G2 √VREF

41 2 H3 H2 NA -

42 2 H1 J4 √VREF

43 2 J2 K4 √D1

44 2 K2 K1 √D2

45 2 L2 M4 4 -

46 2 M3 M2 √-

47 2 N4 N3 √-

48 2 N1 P4 √D3

49 2 P3 P2 NA -

50 2 R3 R4 √VREF

51 2 R1 T3 √-

52 3 U4 U2 √VREF

53 3 U1 V3 NA -

54 3 V4 V2 √VREF

55 3 W3 W4 √-

56 3 Y1 Y3 √-

57 3 Y4 Y2 NA -

58 3 AA3 AB1 √D5

59 3 AB3 AB4 √VREF

60 3 AD1 AC3 √VREF

61 3 AC4 AD2 NA -

62 3 AD3 AD4 √VREF

63 3 AF2 AE3 √-

64 3 AE4 AG1 √-

65 3 AG2 AF3 √VREF

66 3 AF4 AH1 NA -

Tabl e 3: BG432 Differential Pin Pair Summary

XQV600E

Pair Bank P

AO Other

Functions

67 3 AH2 AG3 √-

68 3 AG4 AJ2 √INIT

69 4 AJ4 AK3 √-

70 4 AH5 AK4 √-

71 4 AJ5 AH6 √-

72 4 AL4 AK5 √VREF

73 4 AJ6 AH7 NA -

74 4 AL5 AK6 √-

75 4 AJ7 AL6 √VREF

76 4 AH9 AJ8 √-

77 4 AK8 AJ9 √VREF

78 4 AL8 AK9 √VREF

79 4 AK10 AL10 √-

80 4 AH12 AK11 √-

81 4 AJ12 AK12 √-

82 4 AH13 AJ13 √-

83 4 AL13 AK14 √VREF

84 4 AH14 AJ14 √-

85 4 AK15 AJ15 √VREF

86 5 AH15 AL17 NA IO_LVDS_DLL

87 5 AK17 AJ17 √VREF

88 5 AH17 AK18 √-

89 5 AL19 AJ18 √VREF

90 5 AH18 AL20 √-

91 5 AK20 AH19 √-

92 5 AJ20 AK21 √-

93 5 AJ21 AL22 √-

94 5 AJ22 AK23 √VREF

95 5 AH22 AL24 √VREF

96 5 AK24 AH23 √-

97 5 AK25 AJ25 √VREF

98 5 AL26 AK26 √-

Tabl e 3: BG432 Differential Pin Pair Summary

XQV600E

Pair Bank P

AO Other

Functions

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Advance Product Specification 1-800-255-7778 11

99 5 AH25 AL27 NA -

100 5 AJ26 AK27 √VREF

101 5 AH26 AL28 √-

102 5 AJ27 AK28 √-

103 6 AH30 AJ30 √-

104 6 AH31 AG28 √-

105 6 AG30 AG29 NA -

106 6 AG31 AF28 √VREF

107 6 AF30 AF29 √-

108 6 AF31 AE28 √-

109 6 AD28 AE30 √VREF

110 6 AD31 AD30 NA -

111 6 AC29 AC28 √VREF

112 6 AB29 AB28 √VREF

113 6 AA29 AB31 √-

114 6 Y29 Y28 NA -

115 6 Y31 Y30 √-

116 6 W30 W29 √-

117 6 V29 V28 √VREF

118 6 U29 V30 NA -

119 6 U30 U28 √VREF

120 7 R29 T31 √-

121 7 R31 R30 √VREF

122 7 P28 P29 NA -

123 7 N30 P30 √VREF

124 7 N31 N28 √-

125 7 M28 M29 √-

126 7 L30 M30 NA -

127 7 K30 K31 √-

128 7 J30 K28 √VREF

129 7 J28 J29 √VREF

130 7 G30 H30 NA -

Tabl e 3: BG432 Differential Pin Pair Summary

XQV600E

Pair Bank P

AO Other

Functions

131 7 F31 H28 √VREF

132 7 G28 G29 √-

133 7 E30 E31 √-

134 7 F28 F29 √VREF

135 7 D30 D31 NA -

136 7 E28 E29 √-

Tabl e 3: BG432 Differential Pin Pair Summary

XQV600E

Pair Bank P

AO Other

Functions

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BG560 Plastic Ball Grid and CG560 Ceramic

Column Grid Array Packages

XQV1000E is the only Virtex-E device available in the

CG560 Hermetic Ceramic Column Grid Array package.

XQV1000E and XQV2000E devices are both available in

BG560 Ball Grid Array packages and have footprint compat-

ibility. Pins labeled I0_VREF can be used as either in all

parts unless device-dependent as indicated in the foot-

notes. If the pin is not used as VREF

, it can be used as gen-

eral I/O. Immediately following Table 4, see Ta b l e 5 for

Differential Pair information.

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

0GCK3A17

0IOA27

0IOB25

0IOC28

0IOC30

0IOD30

0 IO_L0N E28

0 IO_VREF_L0P D29

0IO_L1N_YYD28

0 IO_L1P_YY A31

0 IO_VREF_L2N_YY E27

0 IO_L2P_YY C29

0 IO_L3N_Y B30

0 IO_L3P_Y D27

0 IO_L4N_YY E26

0 IO_L4P_YY B29

0 IO_VREF_L5N_YY D26

0 IO_L5P_YY C27

0 IO_L6N_Y E25

0 IO_VREF_L6P_Y A28 1

0 IO_L7N_Y D25

0 IO_L7P_Y C26

0 IO_VREF_L8N_Y E24

0IO_L8P_YB26

0 IO_L9N_Y C25

0 IO_L9P_Y D24

0 IO_VREF_L10N_YY E23

0 IO_L10P_YY A25

0 IO_L11N_YY D23

0 IO_L11P_YY B24

0 IO_L12N_Y E22

0 IO_L12P_Y C23

0 IO_L13N_YY A23

0 IO_L13P_YY D22

0 IO_VREF_L14N_YY E21

0 IO_L14P_YY B22

0 IO_L15N_Y D21

0 IO_L15P_Y C21

0 IO_L16N_YY B21

0 IO_L16P_YY E20

0 IO_VREF_L17N_YY D20

0 IO_L17P_YY C20

0 IO_L18N_Y B20

0 IO_L18P_Y E19

0 IO_L19N_Y D19

0 IO_L19P_Y C19

0 IO_VREF_L20N_Y A19

0 IO_L20P_Y D18

0 IO_LVDS_DLL_L21N C18

0 IO_VREF E18 1

1GCK2D17

1IOA3

1IOD9

1IOE8

1IOE11

1 IO_LVDS_DLL_L21P E17

1 IO_VREF_L22N_Y C17 1

1 IO_L22P_Y B17

1 IO_L23N_Y B16

1 IO_VREF_L23P_Y D16

1 IO_L24N_Y E16

1 IO_L24P_Y C16

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

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Advance Product Specification 1-800-255-7778 13

1 IO_L25N_Y A15

1 IO_L25P_Y C15

1 IO_L26N_YY D15

1 IO_VREF_L26P_YY E15

1 IO_L27N_YY C14

1 IO_L27P_YY D14

1 IO_L28N_Y A13

1 IO_L28P_Y E14

1 IO_L29N_YY C13

1 IO_VREF_L29P_YY D13

1 IO_L30N_YY C12

1 IO_L30P_YY E13

1 IO_L31N_Y A11

1 IO_L31P_Y D12

1 IO_L32N_YY B11

1 IO_L32P_YY C11

1 IO_L33N_YY B10

1 IO_VREF_L33P_YY D11

1 IO_L34N_Y C10

1 IO_L34P_Y A9

1 IO_L35N_Y C9

1 IO_VREF_L35P_Y D10

1 IO_L36N_Y A8

1 IO_L36P_Y B8

1 IO_L37N_Y E10

1 IO_VREF_L37P_Y C8 1

1 IO_L38N_YY B7

1 IO_VREF_L38P_YY A6

1 IO_L39N_YY C7

1 IO_L39P_YY D8

1 IO_L40N_Y A5

1 IO_L40P_Y B5

1 IO_L41N_YY C6

1 IO_VREF_L41P_YY D7

1 IO_L42N_YY A4

1 IO_L42P_YY B4

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

1 IO_L43N_Y C5

1 IO_VREF_L43P_Y E7

1 IO_WRITE_L44N_YY D6

1 IO_CS_L44P_YY A2

2IOD3

2IOF3

2IOG1

2IO J2

2 IO_DOUT_BUSY_L45P_YY D4

2 IO_DIN_D0_L45N_YY E4

2 IO_L46P_Y F5

2 IO_VREF_L46N_Y B3

2 IO_L47P_Y F4

2 IO_L47N_Y C1

2 IO_VREF_L48P_Y G5

2 IO_L48N_Y E3

2 IO_L49P_Y D2

2 IO_L49N_Y G4

2 IO_L50P_Y H5

2 IO_L50N_Y E2

2 IO_VREF_L51P_YY H4

2 IO_L51N_YY G3

2 IO_L52P_Y J5

2 IO_VREF_L52N_Y F1 1

2 IO_L53P_Y J4

2 IO_L53N_Y H3

2 IO_VREF_L54P_Y K5

2 IO_L54N_Y H2

2 IO_L55P_Y J3

2 IO_L55N_Y K4

2 IO_VREF_L56P_YY L5

2 IO_D1_L56N_YY K3

2 IO_D2_L57P_YY L4

2 IO_L57N_YY K2

2 IO_L58P_Y M5

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

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2 IO_L58N_Y L3

2 IO_L59P_Y L1

2 IO_L59N_Y M4

2 IO_VREF_L60P_Y N5

2 IO_L60N_Y M2

2 IO_L61P_Y N4

2 IO_L61N_Y N3

2 IO_L62P_Y N2

2 IO_L62N_Y P5

2 IO_VREF_L63P_YY P4

2 IO_D3_L63N_YY P3

2 IO_L64P_Y P2

2 IO_L64N_Y R5

2 IO_L65P_Y R4

2 IO_L65N_Y R3

2 IO_VREF_L66P_Y R1

2 IO_L66N_Y T4

2 IO_L67P_Y T5

2 IO_VREF_L67N_Y T3 1

2 IO_L68P_YY T2

2 IO_L68N_YY U3

3 IO AE3

3IOAF3

3IOAH3

3 IO AK3

3 IO_VREF_L69P_Y U1 1

3 IO_L69N_Y U2

3 IO_L70P_Y V2

3 IO_VREF_L70N_Y V4

3 IO_L71P_Y V5

3 IO_L71N_Y V3

3 IO_L72P_Y W1

3 IO_L72N_Y W3

3 IO_D4_L73P_YY W4

3 IO_VREF_L73N_YY W5

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

3 IO_L74P_Y Y3

3 IO_L74N_Y Y4

3 IO_L75P_Y AA1

3 IO_L75N_Y Y5

3 IO_L76P_Y AA3

3 IO_VREF_L76N_Y AA4

3 IO_L77P_Y AB3

3 IO_L77N_Y AA5

3 IO_L78P_Y AC1

3 IO_L78N_Y AB4

3 IO_L79P_YY AC3

3 IO_D5_L79N_YY AB5

3 IO_D6_L80P_YY AC4

3 IO_VREF_L80N_YY AD3

3 IO_L81P_Y AE1

3 IO_L81N_Y AC5

3 IO_L82P_Y AD4

3 IO_VREF_L82N_Y AF1

3 IO_L83P_Y AF2

3 IO_L83N_Y AD5

3 IO_L84P_Y AG2

3 IO_VREF_L84N_Y AE4 1

3 IO_L85P_YY AH1

3 IO_VREF_L85N_YY AE5

3 IO_L86P_Y AF4

3 IO_L86N_Y AJ1

3 IO_L87P_Y AJ2

3 IO_L87N_Y AF5

3 IO_L88P_Y AG4

3 IO_VREF_L88N_Y AK2

3 IO_L89P_Y AJ3

3 IO_L89N_Y AG5

3 IO_L90P_Y AL1

3 IO_VREF_L90N_Y AH4

3 IO_D7_L91P_YY AJ4

3 IO_INIT_L91N_YY AH5

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

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Advance Product Specification 1-800-255-7778 15

3IOU4

4GCK0AL17

4IOAJ8

4IOAJ11

4 IO AK6

4 IO AK9

4 IO_L92P_YY AL4

4 IO_L92N_YY AJ6

4 IO_L93P_Y AK5

4 IO_VREF_L93N_Y AN3

4 IO_L94P_YY AL5

4 IO_L94N_YY AJ7

4 IO_VREF_L95P_YY AM4

4 IO_L95N_YY AM5

4 IO_L96P_Y AK7

4 IO_L96N_Y AL6

4 IO_L97P_YY AM6

4 IO_L97N_YY AN6

4 IO_VREF_L98P_YY AL7

4 IO_L98N_YY AJ9

4 IO_L99P_Y AN7

4 IO_VREF_L99N_Y AL8 1

4 IO_L100P_Y AM8

4 IO_L100N_Y AJ10

4 IO_VREF_L101P_Y AL9

4 IO_L101N_Y AM9

4 IO_L102P_Y AK10

4 IO_L102N_Y AN9

4 IO_VREF_L103P_YY AL10

4 IO_L103N_YY AM10

4 IO_L104P_YY AL11

4 IO_L104N_YY AJ12

4 IO_L105P_Y AN11

4 IO_L105N_Y AK12

4 IO_L106P_YY AL12

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

4 IO_L106N_YY AM12

4 IO_VREF_L107P_YY AK13

4 IO_L107N_YY AL13

4 IO_L108P_Y AM13

4 IO_L108N_Y AN13

4 IO_L109P_YY AJ14

4 IO_L109N_YY AK14

4 IO_VREF_L110P_YY AM14

4 IO_L110N_YY AN15

4 IO_L111P_Y AJ15

4 IO_L111N_Y AK15

4 IO_L112P_Y AL15

4 IO_L112N_Y AM16

4 IO_VREF_L113P_Y AL16

4 IO_L113N_Y AJ16

4 IO_L114P_Y AK16

4 IO_VREF_L114N_Y AN17 1

4 IO_LVDS_DLL_L115P AM17

5 GCK1 AJ17

5IOAL25

5IOAL28

5IOAL30

5IOAN28

5 IO_LVDS_DLL_L115N AM18

5 IO_VREF AL18 1

5 IO_L116P_Y AK18

5 IO_VREF_L116N_Y AJ18

5 IO_L117P_Y AN19

5 IO_L117N_Y AL19

5 IO_L118P_Y AK19

5 IO_L118N_Y AM20

5 IO_L119P_YY AJ19

5 IO_VREF_L119N_YY AL20

5 IO_L120P_YY AN21

5 IO_L120N_YY AL21

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

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16 1-800-255-7778 Advance Product Specification

5 IO_L121P_Y AJ20

5 IO_L121N_Y AM22

5 IO_L122P_YY AK21

5 IO_VREF_L122N_YY AN23

5 IO_L123P_YY AJ21

5 IO_L123N_YY AM23

5 IO_L124P_Y AK22

5 IO_L124N_Y AM24

5 IO_L125P_YY AL23

5 IO_L125N_YY AJ22

5 IO_L126P_YY AK23

5 IO_VREF_L126N_YY AL24

5 IO_L127P_Y AN26

5 IO_L127N_Y AJ23

5 IO_L128P_Y AK24

5 IO_VREF_L128N_Y AM26

5 IO_L129P_Y AM27

5 IO_L129N_Y AJ24

5 IO_L130P_Y AL26

5 IO_VREF_L130N_Y AK25 1

5 IO_L131P_YY AN29

5 IO_VREF_L131N_YY AJ25

5 IO_L132P_YY AK26

5 IO_L132N_YY AM29

5 IO_L133P_Y AM30

5 IO_L133N_Y AJ26

5 IO_L134P_YY AK27

5 IO_VREF_L134N_YY AL29

5 IO_L135P_YY AN31

5 IO_L135N_YY AJ27

5 IO_L136P_Y AM31

5 IO_VREF_L136N_Y AK28

6IOAE33

6IOAF31

6IOAJ32

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

6IOAL33

6 IO_L137N_YY AH29

6 IO_L137P_YY AJ30

6 IO_L138N_Y AK31

6 IO_VREF_L138P_Y AH30

6 IO_L139N_Y AG29

6 IO_L139P_Y AJ31

6 IO_VREF_L140N_Y AK32

6 IO_L140P_Y AG30

6 IO_L141N_Y AH31

6 IO_L141P_Y AF29

6 IO_L142N_Y AH32

6 IO_L142P_Y AF30

6 IO_VREF_L143N_YY AE29

6 IO_L143P_YY AH33

6 IO_L144N_Y AG33

6 IO_VREF_L144P_Y AE30 1

6 IO_L145N_Y AD29

6 IO_L145P_Y AF32

6 IO_VREF_L146N_Y AE31

6 IO_L146P_Y AD30

6 IO_L147N_Y AE32

6 IO_L147P_Y AC29

6 IO_VREF_L148N_YY AD31

6 IO_L148P_YY AC30

6 IO_L149N_YY AB29

6 IO_L149P_YY AC31

6 IO_L150N_Y AC33

6 IO_L150P_Y AB30

6 IO_L151N_Y AB31

6 IO_L151P_Y AA29

6 IO_VREF_L152N_Y AA30

6 IO_L152P_Y AA31

6 IO_L153N_Y AA32

6 IO_L153P_Y Y29

6 IO_L154N_Y AA33

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 17

6 IO_L154P_Y Y30

6 IO_VREF_L155N_YY Y32

6 IO_L155P_YY W29

6 IO_L156N_Y W30

6 IO_L156P_Y W31

6 IO_L157N_Y W33

6 IO_L157P_Y V30

6 IO_VREF_L158N_Y V29

6 IO_L158P_Y V31

6 IO_L159N_Y V32

6 IO_VREF_L159P_Y U33 1

6IOU29

7IOE30

7IOF29

7IOF33

7IOG30

7IOK30

7 IO_L160N_YY U31

7 IO_L160P_YY U32

7 IO_VREF_L161N_Y T32 1

7 IO_L161P_Y T30

7 IO_L162N_Y T29

7 IO_VREF_L162P_Y T31

7 IO_L163N_Y R33

7 IO_L163P_Y R31

7 IO_L164N_Y R30

7 IO_L164P_Y R29

7 IO_L165N_YY P32

7 IO_VREF_L165P_YY P31

7 IO_L166N_Y P30

7 IO_L166P_Y P29

7 IO_L167N_Y M32

7 IO_L167P_Y N31

7 IO_L168N_Y N30

7 IO_VREF_L168P_Y L33

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

7 IO_L169N_Y M31

7 IO_L169P_Y L32

7 IO_L170N_Y M30

7 IO_L170P_Y L31

7 IO_L171N_YY M29

7 IO_L171P_YY J33

7 IO_L172N_YY L30

7 IO_VREF_L172P_YY K31

7 IO_L173N_Y L29

7 IO_L173P_Y H33

7 IO_L174N_Y J31

7 IO_VREF_L174P_Y H32

7 IO_L175N_Y K29

7 IO_L175P_Y H31

7 IO_L176N_Y J30

7 IO_VREF_L176P_Y G32 1

7 IO_L177N_YY J29

7 IO_VREF_L177P_YY G31

7 IO_L178N_Y E33

7 IO_L178P_Y E32

7 IO_L179N_Y H29

7 IO_L179P_Y F31

7 IO_L180N_Y D32

7 IO_VREF_L180P_Y E31

7 IO_L181N_Y G29

7 IO_L181P_Y C33

7 IO_L182N_Y F30

7 IO_VREF_L182P_Y D31

2CCLKC4

3DONEAJ5

NA DXN AK29

NA DXP AJ28

NA M0 AJ29

NA M1 AK30

NA M2 AN32

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

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18 1-800-255-7778 Advance Product Specification

NA PROGRAM AM1

NA TCK E29

NA TDI D5

2TDOE6

NA TMS B33

NA NC C31

NA NC AC2

NA NC AK4

NA NC AL3

NA VCCINT A21

NA VCCINT B12

NA VCCINT B14

NA VCCINT B18

NA VCCINT B28

NA VCCINT C22

NA VCCINT C24

NA VCCINT E9

NA VCCINT E12

NA VCCINT F2

NA VCCINT H30

NA VCCINT J1

NA VCCINT K32

NA VCCINT M3

NA VCCINT N1

NA VCCINT N29

NA VCCINT N33

NA VCCINT U5

NA VCCINT U30

NA VCCINT Y2

NA VCCINT Y31

NA VCCINT AB2

NA VCCINT AB32

NA VCCINT AD2

NA VCCINT AD32

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

NA VCCINT AG3

NA VCCINT AG31

NA VCCINT AJ13

NA VCCINT AK8

NA VCCINT AK11

NA VCCINT AK17

NA VCCINT AK20

NA VCCINT AL14

NA VCCINT AL22

NA VCCINT AL27

NA VCCINT AN25

0VCCOA22

0VCCOA26

0VCCOA30

0VCCOB19

0VCCOB32

1VCCOA10

1VCCOA16

1VCCOB13

1VCCOC3

1VCCOE5

2VCCOB2

2VCCOD1

2VCCOH1

2VCCOM1

2VCCOR2

3VCCOV1

3 VCCO AA2

3VCCOAD1

3 VCCO AK1

3VCCOAL2

4VCCOAN4

4VCCOAN8

4 VCCO AN12

4VCCOAM2

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

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DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 19

4 VCCO AM15

5 VCCO AL31

5 VCCO AM21

5 VCCO AN18

5 VCCO AN24

5 VCCO AN30

6 VCCO W32

6 VCCO AB33

6 VCCO AF33

6 VCCO AK33

6 VCCO AM32

7 VCCO C32

7 VCCO D33

7 VCCO K33

7 VCCO N32

7 VCCO T33

NA GND A1

NA GND A7

NA GND A12

NA GND A14

NA GND A18

NA GND A20

NA GND A24

NA GND A29

NA GND A32

NA GND A33

NA GND B1

NA GND B6

NA GND B9

NA GND B15

NA GND B23

NA GND B27

NA GND B31

NA GND C2

NA GND E1

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

NA GND F32

NA GND G2

NA GND G33

NA GND J32

NA GND K1

NA GND L2

NA GND M33

NA GND P1

NA GND P33

NA GND R32

NA GND T1

NA GND V33

NA GND W2

NA GND Y1

NA GND Y33

NA GND AB1

NA GND AC32

NA GND AD33

NA GND AE2

NA GND AG1

NA GND AG32

NA GND AH2

NA GND AJ33

NA GND AL32

NA GND AM3

NA GND AM7

NA GND AM11

NA GND AM19

NA GND AM25

NA GND AM28

NA GND AM33

NA GND AN1

NA GND AN2

NA GND AN5

NA GND AN10

NA GND AN14

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

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20 1-800-255-7778 Advance Product Specification

BG560 and CG560 Differential Pin Pairs

Virtex-E devices have differential pin pairs that can also pro-

vide other functions when not used as a differential pair. A √

in the AO column indicates that the pin pair can be used as

an asynchronous output for all devices provided in this

package. Pairs with a note number in the AO column are

device dependent. They can have asynchronous outputs if

the pin pair are in the same CLB row and column in the

device. Numbers in this column refer to footnotes that indi-

cate which devices have pin pairs than can be asynchro-

nous outputs. The Other Functions column indicates

alternative function(s) not available when the pair is used as

a differential pair or differential clock.

NA GND AN16

NA GND AN20

NA GND AN22

NA GND AN27

NA GND AN33

Notes:

1. VREF or I/O option only in the XQV2000E; otherwise, I/O

option only.

Tabl e 5: BG560/CG560 Differential Pin Pair Summary

XQV1000E, XQV2000E

Pair Bank

Pin AO

Other

Functions

Global Differential Clock

0 4 AL17 AM17 NA IO_DLL_L15P

1 5 AJ17 AM18 NA IO_DLL_L15N

2 1 D17 E17 NA IO_DLL_L21P

3 0 A17 C18 NA IO_DLL_L21N

IO LVDS

Total Outputs: 183, Asynchronous Outputs: 87

0 0 D29 E28 NA VREF

10A31D28√-

20C29E27√VREF

30D27B302 -

40B29E26√-

50C27D26√VREF

6 0 A28 E25 NA VREF

Tabl e 4: BG560/CG560 — XQV1000E, XQV2000E

Bank Pin Description Pin# See Note

70C26D25√-

80B26E24√VREF

90D24C252 -

10 0 A25 E23 √VREF

11 0 B24 D23 √-

12 0 C23 E22 NA -

13 0 D22 A23 √-

14 0 B22 E21 √VREF

15 0 C21 D21 2 -

16 0 E20 B21 √-

17 0 C20 D20 √VREF

18 0 E19 B20 NA -

19 0 C19 D19 √-

20 0 D18 A19 √VREF

21 1 E17 C18 NA IO_LVDS_DLL

22 1 B17 C17 2 VREF

23 1 D16 B16 √VREF

24 1 C16 E16 √-

25 1 C15 A15 NA -

26 1 E15 D15 √VREF

27 1 D14 C14 √-

28 1 E14 A13 2 -

29 1 D13 C13 √VREF

30 1 E13 C12 √-

31 1 D12 A11 NA -

32 1 C11 B11 √-

33 1 D11 B10 √VREF

34 1 A9 C10 √-

35 1 D10 C9 √VREF

36 1 B8 A8 √-

37 1 C8 E10 √VREF

Tabl e 5: BG560/CG560 Differential Pin Pair Summary

XQV1000E, XQV2000E

Pair Bank

Pin AO

Other

Functions

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Advance Product Specification 1-800-255-7778 21

38 1 A6 B7 √VREF

39 1 D8 C7 √-

40 1 B5 A5 1 -

41 1 D7 C6 √VREF

42 1 B4 A4 √-

43 1 E7 C5 √VREF

44 1 A2 D6 √CS

45 2 D4 E4 √DIN, D0

46 2 F5 B3 2 VREF

47 2 F4 C1 1 -

48 2 G5 E3 √VREF

49 2 D2 G4 2 -

50 2 H5 E2 √-

51 2 H4 G3 √VREF

52 2 J5 F1 2 VREF

53 2 J4 H3 1 -

54 2 K5 H2 √VREF

55 2 J3 K4 2 -

56 2 L5 K3 √D1

57 2 L4 K2 √D2

58 2 M5 L3 2 -

59 2 L1 M4 1 -

60 2 N5 M2 √VREF

61 2 N4 N3 2 -

62 2 N2 P5 √-

63 2 P4 P3 √D3

64 2 P2 R5 2 -

65 2 R4 R3 1 -

66 2 R1 T4 √VREF

67 2 T5 T3 2 VREF

68 2 T2 U3 √-

Tabl e 5: BG560/CG560 Differential Pin Pair Summary

XQV1000E, XQV2000E

Pair Bank

Pin AO

Other

Functions

69 3 U1 U2 2 VREF

70 3 V2 V4 √VREF

71 3 V5 V3 1 -

72 3 W1 W3 2 -

73 3 W4 W5 √VREF

74 3 Y3 Y4 √-

75 3 AA1 Y5 2 -

76 3 AA3 AA4 √VREF

77 3 AB3 AA5 1 -

783AC1AB42 -

793AC3AB5√D5

803AC4AD3√VREF

81 3 AE1 AC5 1 -

82 3 AD4 AF1 √VREF

83 3 AF2 AD5 1 -

84 3 AG2 AE4 1 VREF

85 3 AH1 AE5 √VREF

86 3 AF4 AJ1 √-

87 3 AJ2 AF5 1 -

88 3 AG4 AK2 √VREF

89 3 AJ3 AG5 1 -

90 3 AL1 AH4 1 VREF

91 3 AJ4 AH5 √INIT

92 4 AL4 AJ6 √-

93 4 AK5 AN3 NA VREF

94 4 AL5 AJ7 √-

95 4 AM4 AM5 √VREF

96 4 AK7 AL6 2 -

97 4 AM6 AN6 √-

98 4 AL7 AJ9 √VREF

99 4 AN7 AL8 NA VREF

Tabl e 5: BG560/CG560 Differential Pin Pair Summary

XQV1000E, XQV2000E

Pair Bank

Pin AO

Other

Functions

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22 1-800-255-7778 Advance Product Specification

100 4 AM8 AJ10 √-

101 4 AL9 AM9 √VREF

102 4 AK10 AN9 2 -

103 4 AL10 AM10 √VREF

104 4 AL11 AJ12 √-

105 4 AN11 AK12 NA -

106 4 AL12 AM12 √-

107 4 AK13 AL13 √VREF

108 4 AM13 AN13 2 -

109 4 AJ14 AK14 √-

110 4 AM14 AN15 √VREF

111 4 AJ15 AK15 NA -

112 4 AL15 AM16 √-

113 4 AL16 AJ16 √VREF

114 4 AK16 AN17 2 VREF

115 5 AM17 AM18 NA IO_LVDS_DLL

116 5 AK18 AJ18 √VREF

117 5 AN19 AL19 √-

118 5 AK19 AM20 NA -

119 5 AJ19 AL20 √VREF

120 5 AN21 AL21 √-

121 5 AJ20 AM22 2 -

122 5 AK21 AN23 √VREF

123 5 AJ21 AM23 √-

124 5 AK22 AM24 NA -

125 5 AL23 AJ22 √-

126 5 AK23 AL24 √VREF

127 5 AN26 AJ23 1 -

128 5 AK24 AM26 √VREF

129 5 AM27 AJ24 √-

130 5 AL26 AK25 √VREF

Tabl e 5: BG560/CG560 Differential Pin Pair Summary

XQV1000E, XQV2000E

Pair Bank

Pin AO

Other

Functions

131 5 AN29 AJ25 √VREF

132 5 AK26 AM29 √-

133 5 AM30 AJ26 1 -

134 5 AK27 AL29 √VREF

135 5 AN31 AJ27 √-

136 5 AM31 AK28 √VREF

137 6 AJ30 AH29 √-

138 6 AH30 AK31 2 VREF

139 6 AJ31 AG29 1 -

140 6 AG30 AK32 √VREF

141 6 AF29 AH31 2 -

142 6 AF30 AH32 √-

143 6 AH33 AE29 √VREF

144 6 AE30 AG33 2 VREF

145 6 AF32 AD29 1 -

146 6 AD30 AE31 √VREF

1476AC29AE322 -

148 6 AC30 AD31 √VREF

1496AC31AB29√-

150 6 AB30 AC33 2 -

151 6 AA29 AB31 1 -

152 6 AA31 AA30 √VREF

153 6 Y29 AA32 2 -

154 6 Y30 AA33 √-

155 6 W29 Y32 √VREF

156 6 W31 W30 2 -

157 6 V30 W33 1 -

158 6 V31 V29 √VREF

159 6 U33 V32 2 VREF

160 7 U32 U31 √-

161 7 T30 T32 2 VREF

Tabl e 5: BG560/CG560 Differential Pin Pair Summary

XQV1000E, XQV2000E

Pair Bank

Pin AO

Other

Functions

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Advance Product Specification 1-800-255-7778 23

162 7 T31 T29 √VREF

163 7 R31 R33 1 -

164 7 R29 R30 2 -

165 7 P31 P32 √VREF

166 7 P29 P30 √-

167 7 N31 M32 2 -

168 7 L33 N30 √VREF

169 7 L32 M31 1 -

170 7 L31 M30 2 -

171 7 J33 M29 √-

172 7 K31 L30 √VREF

173 7 H33 L29 1 -

174 7 H32 J31 √VREF

175 7 H31 K29 1 -

176 7 G32 J30 1 VREF

177 7 G31 J29 √VREF

178 7 E32 E33 √-

179 7 F31 H29 1 -

180 7 E31 D32 √VREF

181 7 C33 G29 1 -

182 7 D31 F30 1 VREF

Notes:

1. AO in the XQV1000E.

2. AO in the XQV2000E.

Tabl e 5: BG560/CG560 Differential Pin Pair Summary

XQV1000E, XQV2000E

Pair Bank

Pin AO

Other

Functions

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24 1-800-255-7778 Advance Product Specification

FG1156 Fine-Pitch Ball Grid Array Package

XQV2000E devices only are available in the FG1156

fine-pitch Ball Grid Array package. See Tabl e 6 for pinout

information. Immediately following Ta bl e 6 , see Ta b l e 7 for

Differential Pair information.

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

0GCK3E17

0IO B4

0IO B9

0IOB10

0IO D9

0IOD16

0IO E7

0IOE11

0IOE13

0IOE16

0IOF17

0IOJ12

0IOJ13

0IOJ14

0IOK11

0 IO_L0N_Y F7

0IO_L0P_Y H9

0 IO_L1N_Y C5

0IO_L1P_YJ10

0 IO_VREF_L2N_Y E6

0IO_L2P_Y D6

0 IO_L3N_Y A4

0IO_L3P_Y G8

0 IO_L4N_YY C6

0 IO_L4P_YY J11

0 IO_VREF_L5N_YY G9

0 IO_L5P_YY F8

0 IO_L6N_YY A5

0 IO_L6P_YY H10

0 IO_L7N_Y D7

0IO_L7P_Y B5

0 IO_L8N_Y K12

0IO_L8P_Y E8

0 IO_L9N B6

0IO_L9P F9

0 IO_L10N_YY G10

0 IO_L10P_YY C7

0 IO_VREF_L11N_YY D8

0 IO_L11P_YY B7

0 IO_L12N H11

0 IO_L12P C85

0 IO_L13N_Y E9

0 IO_L13P_Y B8

0 IO_VREF_L14N_Y K13

0 IO_L14P_Y G11

0 IO_L15N A8

0 IO_L15P F10

0 IO_L16N_YY C9

0 IO_L16P_YY H12

0 IO_VREF_L17N_YY D10

0 IO_L17P_YY A9

0 IO_L18N_Y F11

0 IO_L18P_Y A10

0 IO_L19N_Y K14

0 IO_L19P_Y C10

0 IO_VREF_L20N_YY H13

0 IO_L20P_YY G12

0 IO_L21N_YY A11

0 IO_L21P_YY B11

0 IO_L22N_Y E12

0 IO_L22P_Y D11

0 IO_L23N_Y G13

0 IO_L23P_Y C12

0 IO_L24N_Y K15

0 IO_L24P_Y A12

0 IO_L25N_Y B12

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

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Advance Product Specification 1-800-255-7778 25

0 IO_L25P_Y H14

0 IO_L26N_YY D12

0 IO_L26P_YY F13

0 IO_VREF_L27N_YY A13

0 IO_L27P_YY B13

0 IO_L28N_YY J15

0 IO_L28P_YY G14

0 IO_L29N_Y C13

0 IO_L29P_Y F14

0 IO_L30N_Y H15

0 IO_L30P_Y D13

0 IO_L31N A14

0 IO_L31P K16

0 IO_L32N_YY E14

0 IO_L32P_YY B14

0 IO_VREF_L33N_YY G15

0 IO_L33P_YY D14

0 IO_L34N J16

0 IO_L34P D15

0 IO_L35N_Y F15

0 IO_L35P_Y B15

0 IO_L36N_Y A15

0 IO_L36P_Y E15

0 IO_L37N G16

0 IO_L37P A16

0 IO_L38N_YY F16

0 IO_L38P_YY J17

0 IO_VREF_L39N_YY C16

0 IO_L39P_YY B16

0 IO_L40N_Y H17

0 IO_L40P_Y A17

0 IO_VREF_L41N_Y G17

0 IO_L41P_Y B17

0 IO_LVDS_DLL_L42N C17

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

1GCK2D17

1IOA18

1IOB18

1IOB24

1IOB25

1IOE22

1IOE23

1IOD18

1IOD19

1IOD25

1IOD26

1IOD28

1IOD29

1IOG23

1IOJ23

1 IO_LVDS_DLL_L42P J18

1 IO_L43N_Y G18

1 IO_VREF_L43P_Y C18

1 IO_L44N_Y H18

1 IO_L44P_Y F18

1 IO_L45N_YY B19

1 IO_VREF_L45P_YY A19

1 IO_L46N_YY K19

1 IO_L46P_YY C19

1 IO_L47N F19

1 IO_L47P E19

1 IO_L48N_Y G19

1 IO_L48P_Y J19

1 IO_L49N_Y A20

1 IO_L49P_Y G20

1 IO_L50N B20

1 IO_L50P F20

1 IO_L51N_YY D20

1 IO_VREF_L51P_YY E20

1 IO_L52N_YY H20

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

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26 1-800-255-7778 Advance Product Specification

1 IO_L52P_YY A21

1 IO_L53N E21

1 IO_L53P J20

1 IO_L54N_Y D21

1 IO_L54P_Y K20

1 IO_L55N_Y B21

1 IO_L55P_Y H21

1 IO_L56N_YY G21

1 IO_L56P_YY F21

1 IO_L57N_YY A22

1 IO_VREF_L57P_YY B22

1 IO_L58N_YY J21

1 IO_L58P_YY C22

1 IO_L59N_Y D22

1 IO_L59P_Y G22

1 IO_L60N_Y K21

1 IO_L60P_Y A23

1 IO_L61N_Y F22

1 IO_L61P_Y B23

1 IO_L62N_Y C23

1 IO_L62P_Y H22

1 IO_L63N_YY D23

1 IO_L63P_YY K22

1 IO_L64N_YY A24

1 IO_VREF_L64P_YY J22

1 IO_L65N_Y H23

1 IO_L65P_Y D24

1 IO_L66N_Y A25

1 IO_L66P_Y E24

1 IO_L67N_YY A26

1 IO_VREF_L67P_YY C25

1 IO_L68N_YY F24

1 IO_L68P_YY B26

1 IO_L69N K23

1 IO_L69P F25

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

1 IO_L70N_Y C26

1 IO_VREF_L70P_Y H24

1 IO_L71N_Y G24

1 IO_L71P_Y A27

1 IO_L72N B27

1 IO_L72P G25

1 IO_L73N_YY E26

1 IO_VREF_L73P_YY C27

1 IO_L74N_YY J24

1 IO_L74P_YY B28

1 IO_L75N K24

1 IO_L75P H25

1 IO_L76N_Y D27

1 IO_L76P_Y F26

1 IO_L77N_Y G26

1 IO_L77P_Y C28

1 IO_L78N_YY E27

1 IO_L78P_YY J25

1 IO_L79N_YY A30

1 IO_VREF_L79P_YY H26

1 IO_L80N_YY G27

1 IO_L80P_YY B29

1 IO_L81N_Y F27

1 IO_L81P_Y C29

1 IO_L82N_Y E28

1 IO_VREF_L82P_Y F28

1 IO_L83N_Y L25

1 IO_L83P_Y B30

1 IO_L84N B31

1 IO_L84P E29

1 IO_WRITE_L85N_YY A31

1 IO_CS_L85P_YY D30

2IOF31

2IOJ32

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

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DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 27

2IOK27

2IOK31

2 IO L28

2 IO L30

2IOM32

2ION26

2ION28

2IOP25

2IOU26

2IOU30

2IOU32

2IOU34

2 IO_D2 M30

2 IO_DOUT_BUSY_L86P_YY D32

2 IO_DIN_D0_L86N_YY J27

2 IO_L87P_Y E31

2 IO_L87N_Y F30

2 IO_L88P_Y G29

2 IO_L88N_Y F32

2 IO_VREF_L89P_Y E32

2 IO_L89N_Y G30

2 IO_L90P M25

2 IO_L90N G31

2 IO_L91P_Y L26

2 IO_L91N_Y D33

2 IO_VREF_L92P_Y D34

2 IO_L92N_Y H29

2 IO_L93P_YY J28

2 IO_L93N_YY E33

2 IO_L94P_YY H28

2 IO_L94N_YY H30

2 IO_L95P_Y H32

2 IO_L95N_Y K28

2 IO_L96P_Y L27

2 IO_L96N_Y F33

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

2 IO_L97P_Y M26

2 IO_L97N_Y E34

2 IO_VREF_L98P_YY H31

2 IO_L98N_YY G32

2 IO_L99P_YY N25

2 IO_L99N_YY J31

2 IO_L100P_YY J30

2 IO_L100N_YY G33

2 IO_VREF_L101P_Y H34

2 IO_L101N_Y J29

2 IO_L102P M27

2 IO_L102N H33

2 IO_L103P_Y K29

2 IO_L103N_Y J34

2 IO_VREF_L104P_YY L29

2 IO_L104N_YY J33

2 IO_L105P_YY M28

2 IO_L105N_YY K34

2 IO_L106P_Y N27

2 IO_L106N_Y L34

2 IO_VREF_L107P_YY K33

2 IO_D1_L107N_YY P26

2 IO_L108P_Y R25

2 IO_L108N_Y M34

2 IO_L109P_Y L31

2 IO_L109N_Y L33

2 IO_L110P_Y P27

2 IO_L110N_Y M33

2 IO_L111P M31

2 IO_L111N R26

2 IO_L112P_Y N30

2 IO_L112N_Y P28

2 IO_VREF_L113P_Y N29

2 IO_L113N_Y N33

2 IO_L114P_YY T25

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

28 1-800-255-7778 Advance Product Specification

2 IO_L114N_YY N34

2 IO_L115P_YY P34

2 IO_L115N_YY R27

2 IO_L116P_Y P29

2 IO_L116N_Y P31

2 IO_L117P_Y P33

2 IO_L117N_Y T26

2 IO_L118P_Y R34

2 IO_L118N_Y R28

2 IO_VREF_L119P_YY N31

2 IO_D3_L119N_YY N32

2 IO_L120P_YY P30

2 IO_L120N_YY R33

2 IO_L121P_YY R29

2 IO_L121N_YY T34

2 IO_L122P_Y R30

2 IO_L122N_Y T30

2 IO_L123P T28

2 IO_L123N R31

2 IO_L124P_Y T29

2 IO_L124N_Y U27

2 IO_VREF_L125P_YY T31

2 IO_L125N_YY T33

2 IO_L126P_YY U28

2 IO_L126N_YY T32

2 IO_VREF_L127P_Y U29

2 IO_L127N_Y U33

2 IO_L128P_YY V33

2 IO_L128N_YY U31

3IOV27

3IOV31

3IOV32

3IOW33

3 IO AB25

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

3 IO AB26

3 IO AB31

3IOAC31

3IOAF34

3IOAG31

3IOAG33

3IOAG34

3IOAH29

3 IO AJ30

3 IO_L129P_Y V26

3 IO_VREF_L129N_Y V30

3 IO_L130P_YY W34

3 IO_L130N_YY V28

3 IO_L131P_YY W32

3 IO_VREF_L131N_YY W30

3 IO_L132P_Y V29

3 IO_L132N_Y Y34

3 IO_L133P W29

3 IO_L133N Y33

3 IO_L134P_Y W26

3 IO_L134N_Y W28

3 IO_L135P_YY Y31

3 IO_L135N_YY Y30

3 IO_L136P_YY AA34

3 IO_L136N_YY W31

3 IO_D4_L137P_YY AA33

3 IO_VREF_L137N_YY Y29

3 IO_L138P_Y W25

3 IO_L138N_Y AB34

3 IO_L139P_Y Y28

3 IO_L139N_Y AB33

3 IO_L140P_Y AA30

3 IO_L140N_Y Y26

3 IO_L141P_YY Y27

3 IO_L141N_YY AA31

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 29

3 IO_L142P_YY AA27

3 IO_L142N_YY AA29

3 IO_L143P_Y AB32

3 IO_VREF_L143N_Y AB29

3 IO_L144P_Y AA28

3 IO_L144N_Y AC34

3 IO_L145P Y25

3 IO_L145N AD34

3 IO_L146P_Y AB30

3 IO_L146N_Y AC33

3 IO_L147P_Y AA26

3 IO_L147N_Y AC32

3 IO_L148P_Y AD33

3 IO_L148N_Y AB28

3 IO_L149P_YY AE34

3 IO_D5_L149N_YY AB27

3 IO_D6_L150P_YY AE33

3 IO_VREF_L150N_YY AC30

3 IO_L151P_Y AA25

3 IO_L151N_Y AE32

3 IO_L152P_YY AE31

3 IO_L152N_YY AD29

3 IO_L153P_YY AD31

3 IO_VREF_L153N_YY AF33

3 IO_L154P_Y AC28

3 IO_L154N_Y AF31

3 IO_L155P_Y AC27

3 IO_L155N_Y AF32

3 IO_L156P_Y AE29

3 IO_VREF_L156N_Y AD28

3 IO_L157P_YY AD30

3 IO_L157N_YY AG32

3 IO_L158P_YY AC26

3 IO_L158N_YY AH33

3 IO_L159P_YY AD26

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

3 IO_VREF_L159N_YY AF30

3 IO_L160P_Y AC25

3 IO_L160N_Y AH32

3 IO_L161P_Y AE28

3 IO_L161N_Y AL34

3 IO_L162P_Y AG30

3 IO_L162N_Y AD27

3 IO_L163P_YY AF29

3 IO_L163N_YY AK34

3 IO_L164P_YY AD25

3 IO_L164N_YY AE27

3 IO_L165P_Y AJ33

3 IO_VREF_L165N_Y AH31

3 IO_L166P_Y AE26

3 IO_L166N_Y AL33

3 IO_L167P AF28

3 IO_L167N AL32

3 IO_L168P_Y AJ31

3 IO_VREF_L168N_Y AF27

3 IO_L169P_Y AG29

3 IO_L169N_Y AJ32

3 IO_L170P_Y AK33

3 IO_L170N_Y AH30

3 IO_D7_L171P_YY AK32

3 IO_INIT_L171N_YY AK31

3IOV34

4 GCK0 AH18

4 IO AE21

4IOAG18

4IOAG23

4IOAH24

4IOAH25

4 IO AJ28

4 IO AK18

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

30 1-800-255-7778 Advance Product Specification

4 IO AK19

4IOAL25

4IOAL27

4IOAL30

4IOAN18

4IOAN22

4IOAN24

4 IO_L172P_YY AP31

4 IO_L172N_YY AK29

4 IO_L173P_Y AP30

4 IO_L173N_Y AN31

4 IO_L174P_Y AH27

4 IO_L174N_Y AN30

4 IO_VREF_L175P_Y AM30

4 IO_L175N_Y AK28

4 IO_L176P_Y AG26

4 IO_L176N_Y AN29

4 IO_L177P_YY AF25

4 IO_L177N_YY AM29

4 IO_VREF_L178P_YY AL29

4 IO_L178N_YY AL28

4 IO_L179P_YY AE24

4 IO_L179N_YY AN28

4 IO_L180P_Y AJ27

4 IO_L180N_Y AH26

4 IO_L181P_Y AG25

4 IO_L181N_Y AK27

4 IO_L182P AM28

4 IO_L182N AF24

4 IO_L183P_YY AJ26

4 IO_L183N_YY AP27

4 IO_VREF_L184P_YY AK26

4 IO_L184N_YY AN27

4 IO_L185P AE23

4 IO_L185N AM27

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

4 IO_L186P_Y AL26

4 IO_L186N_Y AP26

4 IO_VREF_L187P_Y AN26

4 IO_L187N_Y AJ25

4 IO_L188P AG24

4 IO_L188N AP25

4 IO_L189P_YY AF23

4 IO_L189N_YY AM26

4 IO_VREF_L190P_YY AJ24

4 IO_L190N_YY AN25

4 IO_L191P_Y AE22

4 IO_L191N_Y AM25

4 IO_L192P_Y AK24

4 IO_L192N_Y AH23

4 IO_VREF_L193P_YY AF22

4 IO_L193N_YY AP24

4 IO_L194P_YY AL24

4 IO_L194N_YY AK23

4 IO_L195P_Y AG22

4 IO_L195N_Y AN23

4 IO_L196P_Y AP23

4 IO_L196N_Y AM23

4 IO_L197P_Y AH22

4 IO_L197N_Y AP22

4 IO_L198P_Y AL23

4 IO_L198N_Y AF21

4 IO_L199P_YY AL22

4 IO_L199N_YY AJ22

4 IO_VREF_L200P_YY AK22

4 IO_L200N_YY AM22

4 IO_L201P_YY AG21

4 IO_L201N_YY AJ21

4 IO_L202P_Y AP21

4 IO_L202N_Y AE20

4 IO_L203P_Y AH21

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 31

4 IO_L203N_Y AL21

4 IO_L204P AN21

4 IO_L204N AF20

4 IO_L205P_YY AK21

4 IO_L205N_YY AP20

4 IO_VREF_L206P_YY AE19

4 IO_L206N_YY AN20

4 IO_L207P_Y AG20

4 IO_L207N_Y AL20

4 IO_L208P_Y AH20

4 IO_L208N_Y AK20

4 IO_L209P_Y AN19

4 IO_L209N_Y AJ20

4 IO_L210P AF19

4 IO_L210N AP19

4 IO_L211P_YY AM19

4 IO_L211N_YY AH19

4 IO_VREF_L212P_YY AJ19

4 IO_L212N_YY AP18

4 IO_L213P_Y AF18

4 IO_L213N_Y AP17

4 IO_VREF_L214P_Y AJ18

4 IO_L214N_Y AL18

4 IO_LVDS_DLL_L215P AM18

5GCK1AL19

5IOAF17

5IOAG12

5IOAH12

5 IO AJ10

5 IO AJ11

5 IO AK7

5 IO AK13

5IOAL13

5IOAM4

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

5IOAN9

5IOAN10

5IOAN16

5IOAN17

5 IO_LVDS_DLL_L215N AL17

5 IO_L216P_Y AH17

5 IO_VREF_L216N_Y AM17

5 IO_L217P_Y AJ17

5 IO_L217N_Y AG17

5 IO_L218P_YY AP16

5 IO_VREF_L218N_YY AL16

5 IO_L219P_YY AJ16

5 IO_L219N_YY AM16

5 IO_L220P AK16

5 IO_L220N AP15

5 IO_L221P_Y AL15

5 IO_L221N_Y AH16

5 IO_L222P_Y AN15

5 IO_L222N_Y AF16

5 IO_L223P_Y AP14

5 IO_L223N_Y AE16

5 IO_L224P_YY AK15

5 IO_VREF_L224N_YY AJ15

5 IO_L225P_YY AH15

5 IO_L225N_YY AN14

5 IO_L226P AK14

5 IO_L226N AG15

5 IO_L227P_Y AM13

5 IO_L227N_Y AF15

5 IO_L228P_Y AG14

5 IO_L228N_Y AP13

5 IO_L229P_YY AE14

5 IO_L229N_YY AE15

5 IO_L230P_YY AN13

5 IO_VREF_L230N_YY AG13

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

32 1-800-255-7778 Advance Product Specification

5 IO_L231P_YY AH14

5 IO_L231N_YY AP12

5 IO_L232P_Y AJ14

5 IO_L232N_Y AL14

5 IO_L233P_Y AF13

5 IO_L233N_Y AN12

5 IO_L234P_Y AF14

5 IO_L234N_Y AP11

5 IO_L235P_Y AN11

5 IO_L235N_Y AH13

5 IO_L236P_YY AM12

5 IO_L236N_YY AL12

5 IO_L237P_YY AJ13

5 IO_VREF_L237N_YY AP10

5 IO_L238P_Y AK12

5 IO_L238N_Y AM10

5 IO_L239P_Y AP9

5 IO_L239N_Y AK11

5 IO_L240P_YY AL11

5 IO_VREF_L240N_YY AL10

5 IO_L241P_YY AE13

5 IO_L241N_YY AM9

5 IO_L242P AF12

5 IO_L242N AP8

5 IO_L243P_Y AL9

5 IO_VREF_L243N_Y AH11

5 IO_L244P_Y AF11

5 IO_L244N_Y AN8

5 IO_L245P_Y AM8

5 IO_L245N_Y AG11

5 IO_L246P_YY AL8

5 IO_VREF_L246N_YY AK9

5 IO_L247P_YY AH10

5 IO_L247N_YY AN7

5 IO_L248P AE12

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

5 IO_L248N AJ9

5 IO_L249P_Y AM7

5 IO_L249N_Y AL7

5 IO_L250P_Y AG10

5 IO_L250N_Y AN6

5 IO_L251P_YY AK8

5 IO_L251N_YY AH9

5 IO_L252P_YY AP5

5 IO_VREF_L252N_YY AJ8

5 IO_L253P_YY AE11

5 IO_L253N_YY AN5

5 IO_L254P_Y AF10

5 IO_L254N_Y AM6

5 IO_L255P_Y AL6

5 IO_VREF_L255N_Y AG9

5 IO_L256P_Y AH8

5 IO_L256N_Y AP4

5 IO_L257P_Y AN4

5 IO_L257N_Y AJ7

5 IO_L258P_YY AM5

5 IO_L258N_YY AK6

6IO T1

6IO V2

6IO V3

6IO V5

6IO V8

6 IO AA10

6 IO AB5

6 IO AB7

6 IO AB9

6IOAD7

6IOAD8

6 IO AE2

6 IO AE4

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 33

6IOAJ4

6IOAH5

6 IO_L259N_YY AH6

6 IO_L259P_YY AF8

6 IO_L260N_Y AE9

6 IO_L260P_Y AK3

6 IO_L261N_Y AD10

6 IO_L261P_Y AL2

6 IO_VREF_L262N_Y AL1

6 IO_L262P_Y AH4

6 IO_L263N AG6

6 IO_L263P AK1

6 IO_L264N_Y AF7

6 IO_L264P_Y AK2

6 IO_VREF_L265N_Y AJ3

6 IO_L265P_Y AG5

6 IO_L266N_YY AD9

6 IO_L266P_YY AJ2

6 IO_L267N_YY AC10

6 IO_L267P_YY AH2

6 IO_L268N_Y AH3

6 IO_L268P_Y AF5

6 IO_L269N_Y AE8

6 IO_L269P_Y AG3

6 IO_L270N_Y AE7

6 IO_L270P_Y AG2

6 IO_VREF_L271N_YY AF6

6 IO_L271P_YY AG1

6 IO_L272N_YY AC9

6 IO_L272P_YY AG4

6 IO_L273N_YY AE6

6 IO_L273P_YY AF3

6 IO_VREF_L274N_Y AF1

6 IO_L274P_Y AF4

6 IO_L275N AB10

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

6 IO_L275P AF2

6 IO_L276N_Y AC8

6 IO_L276P_Y AE1

6 IO_VREF_L277N_YY AD5

6 IO_L277P_YY AE3

6 IO_L278N_YY AC7

6 IO_L278P_YY AD1

6 IO_L279N_Y AD6

6 IO_L279P_Y AD2

6 IO_VREF_L280N_YY AB8

6 IO_L280P_YY AC1

6 IO_L281N_YY AC5

6 IO_L281P_YY AC2

6 IO_L282N_Y AA9

6 IO_L282P_Y AC3

6 IO_L283N_Y AC4

6 IO_L283P_Y AD4

6 IO_L284N_Y AA8

6 IO_L284P_Y AB6

6 IO_L285N AB1

6 IO_L285P Y10

6 IO_L286N_Y AB2

6 IO_L286P_Y AA7

6 IO_VREF_L287N_Y AA4

6 IO_L287P_Y AA1

6 IO_L288N_YY Y9

6 IO_L288P_YY AB4

6 IO_L289N_YY AA2

6 IO_L289P_YY Y8

6 IO_L290N_Y AA6

6 IO_L290P_Y AA5

6 IO_L291N_Y AB3

6 IO_L291P_Y Y7

6 IO_L292N_Y Y1

6 IO_L292P_Y W10

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

34 1-800-255-7778 Advance Product Specification

6 IO_VREF_L293N_YY Y5

6 IO_L293P_YY Y2

6 IO_L294N_YY W9

6 IO_L294P_YY W2

6 IO_L295N_YY W7

6 IO_L295P_YY Y4

6 IO_L296N_Y W1

6 IO_L296P_Y Y6

6 IO_L297N_Y W6

6 IO_L297P_Y W3

6 IO_L298N_Y V9

6 IO_L298P_Y W4

6 IO_VREF_L299N_YY W5

6 IO_L299P_YY V1

6 IO_L300N_YY V7

6 IO_L300P_YY U2

6 IO_VREF_L301N_Y V6

6 IO_L301P_Y U1

7IO F5

7IO G6

7IO H1

7IO H7

7IO K2

7IO K4

7IO L6

7IO M5

7IOM10

7IO N5

7ION10

7IO R7

7IO T2

7IO T7

7IO U8

7IOV4

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

7 IO_L302N_YY U9

7 IO_L302P_YY U4

7 IO_L303N_Y U7

7 IO_VREF_L303P_Y U5

7 IO_L304N_YY U3

7 IO_L304P_YY U6

7 IO_L305N_YY T3

7 IO_VREF_L305P_YY T6

7 IO_L306N_Y T9

7 IO_L306P_Y T4

7 IO_L307N_Y T5

7 IO_L307P_Y R1

7 IO_L308N_Y R6

7 IO_L308P_Y T10

7 IO_L309N_YY R2

7 IO_L309P_YY R5

7 IO_L310N_YY P1

7 IO_VREF_L310P_YY P5

7 IO_L311N_Y R8

7 IO_L311P_Y P2

7 IO_L312N_Y R9

7 IO_L312P_Y N1

7 IO_L313N_Y P4

7 IO_L313P_Y R10

7 IO_L314N_YY P8

7 IO_L314P_YY N2

7 IO_L315N_YY P6

7 IO_L315P_YY P7

7 IO_L316N_Y M1

7 IO_VREF_L316P_Y N4

7 IO_L317N_Y N6

7 IO_L317P_Y N3

7 IO_L318N P9

7 IO_L318P M2

7 IO_L319N_Y N7

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 35

7 IO_L319P_Y M3

7 IO_L320N_Y P10

7 IO_L320P_Y M4

7 IO_L321N_Y L1

7 IO_L321P_Y N8

7 IO_L322N_YY L2

7 IO_L322P_YY N9

7 IO_L323N_YY M7

7 IO_VREF_L323P_YY K1

7 IO_L324N_Y M8

7 IO_L324P_Y L4

7 IO_L325N_YY J1

7 IO_L325P_YY L5

7 IO_L326N_YY J2

7 IO_VREF_L326P_YY K3

7 IO_L327N_Y L7

7 IO_L327P_Y J3

7 IO_L328N_Y M9

7 IO_L328P_Y H24

7 IO_L329N_Y J4

7 IO_VREF_L329P_Y K6

7 IO_L330N_YY L8

7 IO_L330P_YY G2

7 IO_L331N_YY H3

7 IO_L331P_YY K7

7 IO_L332N_YY G3

7 IO_VREF_L332P_YY J5

7 IO_L333N_Y L9

7 IO_L333P_Y H5

7 IO_L334N_Y J6

7 IO_L334P_Y H4

7 IO_L335N_Y G4

7 IO_L335P_Y K8

7 IO_L336N_YY J7

7 IO_L336P_YY F2

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

7 IO_L337N_YY F3

7 IO_L337P_YY L10

7 IO_L338N_Y E1

7 IO_VREF_L338P_Y_Y H6

7 IO_L339N_Y G5

7 IO_L339P_Y E2

7 IO_L340N K9

7 IO_L340P D1

7 IO_L341N_Y E3

7 IO_VREF_L341P_Y J8

7 IO_L342N_Y E4

7 IO_L342P_Y D2

7 IO_L343N_Y F4

7 IO_L343P_Y D3

2CCLKC31

3DONEAM31

NA DXN AJ5

NA DXP AL5

NA M0 AK4

NA M1 AG7

NA M2 AL3

NA PROGRAM AG28

NA TCK D5

NA TDI C30

2TDOK26

NA TMS C4

NA VCCINT K10

NA VCCINT K17

NA VCCINT K18

NA VCCINT K25

NA VCCINT L11

NA VCCINT L24

NA VCCINT M12

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

36 1-800-255-7778 Advance Product Specification

NA VCCINT M23

NA VCCINT N13

NA VCCINT N14

NA VCCINT N15

NA VCCINT N16

NA VCCINT N19

NA VCCINT N20

NA VCCINT N21

NA VCCINT N22

NA VCCINT P13

NA VCCINT P22

NA VCCINT R13

NA VCCINT R22

NA VCCINT T13

NA VCCINT T22

NA VCCINT U10

NA VCCINT U25

NA VCCINT V10

NA VCCINT V25

NA VCCINT W13

NA VCCINT W22

NA VCCINT Y13

NA VCCINT Y22

NA VCCINT AA13

NA VCCINT AA22

NA VCCINT AB13

NA VCCINT AB14

NA VCCINT AB15

NA VCCINT AB16

NA VCCINT AB19

NA VCCINT AB20

NA VCCINT AB21

NA VCCINT AB22

NA VCCINT AC12

NA VCCINT AC23

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

NA VCCINT AD24

NA VCCINT AD11

NA VCCINT AE10

NA VCCINT AE17

NA VCCINT AE18

NA VCCINT AE25

NA VCCO_0 M17

NA VCCO_0 L17

NA VCCO_0 L16

NA VCCO_0 E10

NA VCCO_0 C14

NA VCCO_0 A6

NA VCCO_0 M13

NA VCCO_0 M14

NA VCCO_0 M15

NA VCCO_0 M16

NA VCCO_0 L12

NA VCCO_0 L13

NA VCCO_0 L14

NA VCCO_0 L15

NA VCCO_1 M18

NA VCCO_1 L18

NA VCCO_1 L23

NA VCCO_1 E25

NA VCCO_1 C21

NA VCCO_1 A29

NA VCCO_1 M19

NA VCCO_1 M20

NA VCCO_1 M21

NA VCCO_1 M22

NA VCCO_1 L19

NA VCCO_1 L20

NA VCCO_1 L21

NA VCCO_1 L22

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 37

NA VCCO_2 U24

NA VCCO_2 U23

NA VCCO_2 N24

NA VCCO_2 M24

NA VCCO_2 K30

NA VCCO_2 F34

NA VCCO_2 T23

NA VCCO_2 T24

NA VCCO_2 R23

NA VCCO_2 R24

NA VCCO_2 P23

NA VCCO_2 P24

NA VCCO_2 P32

NA VCCO_2 N23

NA VCCO_3 V23

NA VCCO_3 V24

NA VCCO_3 Y23

NA VCCO_3 Y24

NA VCCO_3 W23

NA VCCO_3 W24

NA VCCO_3 AJ34

NA VCCO_3 AE30

NA VCCO_3 AC24

NA VCCO_3 AB23

NA VCCO_3 AB24

NA VCCO_3 AA23

NA VCCO_3 AA24

NA VCCO_3 AA32

NA VCCO_4 AD18

NA VCCO_4 AC18

NA VCCO_4 AC19

NA VCCO_4 AC20

NA VCCO_4 AC21

NA VCCO_4 AC22

NA VCCO_4 AP29

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

NA VCCO_4 AM21

NA VCCO_4 AK25

NA VCCO_4 AD19

NA VCCO_4 AD20

NA VCCO_4 AD21

NA VCCO_4 AD22

NA VCCO_4 AD23

NA VCCO_5 AC17

NA VCCO_5 AD17

NA VCCO_5 AC13

NA VCCO_5 AC14

NA VCCO_5 AC15

NA VCCO_5 AC16

NA VCCO_5 AP6

NA VCCO_5 AM14

NA VCCO_5 AK10

NA VCCO_5 AD12

NA VCCO_5 AD13

NA VCCO_5 AD14

NA VCCO_5 AD15

NA VCCO_5 AD16

NA VCCO_6 V11

NA VCCO_6 V12

NA VCCO_6 Y11

NA VCCO_6 Y12

NA VCCO_6 W11

NA VCCO_6 W12

NA VCCO_6 AJ1

NA VCCO_6 AE5

NA VCCO_6 AC11

NA VCCO_6 AB11

NA VCCO_6 AB12

NA VCCO_6 AA3

NA VCCO_6 AA11

NA VCCO_6 AA12

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

38 1-800-255-7778 Advance Product Specification

NA VCCO_7 U11

NA VCCO_7 U12

NA VCCO_7 N12

NA VCCO_7 M11

NA VCCO_7 K5

NA VCCO_7 F1

NA VCCO_7 T11

NA VCCO_7 T12

NA VCCO_7 R11

NA VCCO_7 R12

NA VCCO_7 P3

NA VCCO_7 P11

NA VCCO_7 P12

NA VCCO_7 N11

NA GND K32

NA GND R4

NA GND AN1

NA GND AM11

NA GND AK5

NA GND AH28

NA GND AD32

NA GND AA20

NA GND Y20

NA GND W19

NA GND V19

NA GND U20

NA GND T20

NA GND R19

NA GND P19

NA GND H8

NA GND F12

NA GND C2

NA GND B1

NA GND A7

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

NA GND AP1

NA GND AN2

NA GND AM15

NA GND AK17

NA GND AH34

NA GND AC6

NA GND AA21

NA GND Y21

NA GND W20

NA GND V20

NA GND U21

NA GND T21

NA GND R20

NA GND P20

NA GND H16

NA GND F23

NA GND C3

NA GND B2

NA GND A28

NA GND AP34

NA GND AM3

NA GND AL31

NA GND AH7

NA GND AD3

NA GND AA19

NA GND Y19

NA GND W18

NA GND V18

NA GND U19

NA GND T19

NA GND R18

NA GND P18

NA GND J26

NA GND F6

NA GND C1

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 39

NA GND C34

NA GND A3

NA GND AP2

NA GND AN3

NA GND AM20

NA GND AK30

NA GND AG8

NA GND AC29

NA GND Y3

NA GND Y32

NA GND W21

NA GND V21

NA GND T8

NA GND T27

NA GND R21

NA GND P21

NA GND H19

NA GND F29

NA GND C11

NA GND B3

NA GND A32

NA GND AP3

NA GND AN32

NA GND AM24

NA GND AJ6

NA GND AG16

NA GND AA14

NA GND Y14

NA GND W8

NA GND W27

NA GND U14

NA GND T14

NA GND R3

NA GND R32

NA GND M6

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

NA GND H27

NA GND E5

NA GND C15

NA GND B32

NA GND A33

NA GND AP7

NA GND AN33

NA GND AM32

NA GND AJ12

NA GND AG19

NA GND AA15

NA GND Y15

NA GND W14

NA GND V14

NA GND U15

NA GND T15

NA GND R14

NA GND P14

NA GND M29

NA GND G1

NA GND E18

NA GND C20

NA GND B33

NA GND A34

NA GND AP28

NA GND AN34

NA GND AM33

NA GND AJ23

NA GND AG27

NA GND AA16

NA GND Y16

NA GND W15

NA GND V15

NA GND U16

NA GND T16

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

40 1-800-255-7778 Advance Product Specification

FG1156 Differential Pin Pairs

Virtex-E devices have differential pin pairs that can also pro-

vide other functions when not used as a differential pair. The

AO column in Ta b le 7 indicates which pin pairs may be used

as an asynchronous output with a “√.” The “Other Func-

tions” column indicates alternative function(s) that are not

available when the pair is used as a differential pair or differ-

ential clock.

NA GND R15

NA GND P15

NA GND L3

NA GND G7

NA GND E30

NA GND C24

NA GND B34

NA GND AP32

NA GND AM1

NA GND AM34

NA GND AJ29

NA GND AF9

NA GND AA17

NA GND Y17

NA GND W16

NA GND V16

NA GND U17

NA GND T17

NA GND R16

NA GND P16

NA GND L32

NA GND G28

NA GND D4

NA GND C32

NA GND A1

NA GND AP33

NA GND AM2

NA GND AL4

NA GND AH1

NA GND AF26

NA GND AA18

NA GND Y18

NA GND W17

NA GND V17

NA GND U18

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

NA GND T18

NA GND R17

NA GND P17

NA GND J9

NA GND G34

NA GND D31

NA GND C33

NA GND A2

NA GND AB17

NA GND AB18

NA GND N17

NA GND N18

NA GND U13

NA GND V13

NA GND U22

NA GND V22

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

GCLK LVDS

3 0 E17 C17 NA IO_DLL_L 42N

2 1 D17 J18 NA IO_DLL_L 42P

1 5 AL19 AL17 NA IO_DLL_L 215N

0 4 AH18 AM18 NA IO_DLL_L 215P

IO LVDS

Total Pairs: 344, Asynchronous Output Pairs: 134

00H9F7 NA -

1 0 J10 C5 √-

Tabl e 6: FG1156 — XQV2000E

Bank Pin Description Pin #

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 41

20D6E6 √VREF

30G8A4 NA -

4 0 J11 C6 √-

50F8G9 √VREF

60H10A5 √-

7 0 B5 D7 NA -

8 0 E8 K12 NA -

90F9B6 NA -

10 0 C7 G10 √-

11 0 B7 D8 √VREF

12 0 C8 H11 NA -

13 0 B8 E9 √-

14 0 G11 K13 √VREF

15 0 F10 A8 NA -

160H12C9 √-

17 0 A9 D10 √VREF

18 0 A10 F11 NA -

190C10K14 NA -

20 0 G12 H13 √VREF

21 0 B11 A11 √-

220D11E12 NA -

230C12G13 √-

24 0 A12 K15 √-

250H14B12 NA -

26 0 F13 D12 √-

27 0 B13 A13 √VREF

28 0 G14 J15 √-

29 0 F14 C13 NA -

300D13H15 NA -

31 0 K16 A14 NA -

32 0 B14 E14 √-

330D14G15 √VREF

340D15J16 NA -

35 0 B15 F15 √-

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

36 0 E15 A15 √-

37 0 A16 G16 NA -

38 0 J17 F16 √-

39 0 B16 C16 √VREF

40 0 A17 H17 NA -

41 0 B17 G17 NA VREF

42 1 J18 C17 None IO_LVDS_DLL

431C18G18 NA VREF

44 1 F18 H18 NA -

45 1 A19 B19 √VREF

461C19K19 √-

47 1 E19 F19 √-

48 1 J19 G19 √-

49 1 G20 A20 √-

50 1 F20 B20 NA -

51 1 E20 D20 √VREF

52 1 A21 H20 √-

53 1 J20 E21 NA -

54 1 K20 D21 NA -

551H21B21 NA -

56 1 F21 G21 √-

57 1 B22 A22 √VREF

581C22J21 √-

59 1 G22 D22 NA -

60 1 A23 K21 √-

61 1 B23 F22 √-

621H22C23 NA -

63 1 K22 D23 √-

64 1 J22 A24 √VREF

651D24H23 NA -

66 1 E24 A25 NA -

671C25A26 √VREF

68 1 B26 F24 √-

69 1 F25 K23 NA -

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

42 1-800-255-7778 Advance Product Specification

701H24C26 √VREF

71 1 A27 G24 √-

72 1 G25 B27 NA -

731C27E26 √VREF

74 1 B28 J24 √-

751H25K24 NA -

76 1 F26 D27 NA -

771C28G26 NA -

78 1 J25 E27 √-

791H26A30 √VREF

80 1 B29 G27 √-

811C29F27 NA -

82 1 F28 E28 √VREF

83 1 B30 L25 √-

84 1 E29 B31 NA -

851D30A31 √CS

862D32J27 √DIN, D0

87 2 E31 F30 √-

88 2 G29 F32 √-

89 2 E32 G30 NA VREF

90 2 M25 G31 NA -

91 2 L26 D33 NA -

922D34H29 √VREF

93 2 J28 E33 √-

942H28H30 √-

952H32K28 NA -

96 2 L27 F33 √-

97 2 M26 E34 √-

982H31G32 √VREF

992N25J31 √-

100 2 J30 G33 √-

101 2 H34 J29 NA VREF

102 2 M27 H33 NA -

103 2 K29 J34 NA -

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

104 2 L29 J33 √VREF

105 2 M28 K34 √-

106 2 N27 L34 NA -

107 2 K33 P26 √D1

108 2 R25 M34 √-

109 2 L31 L33 √-

110 2 P27 M33 NA -

111 2 M31 R26 NA -

112 2 N30 P28 NA -

113 2 N29 N33 √VREF

114 2 T25 N34 √-

115 2 P34 R27 √-

116 2 P29 P31 NA -

117 2 P33 T26 √-

118 2 R34 R28 √-

119 2 N31 N32 √D3

120 2 P30 R33 √-

121 2 R29 T34 √-

122 2 R30 T30 NA -

123 2 T28 R31 NA -

124 2 T29 U27 NA -

125 2 T31 T33 √VREF

126 2 U28 T32 √-

127 2 U29 U33 NA VREF

128 2 V33 U31 √-

129 3 V26 V30 NA VREF

130 3 W34 V28 √-

131 3 W32 W30 √VREF

132 3 V29 Y34 NA -

133 3 W29 Y33 NA -

134 3 W26 W28 NA -

135 3 Y31 Y30 √-

136 3 AA34 W31 √-

137 3 AA33 Y29 √VREF

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 43

138 3 W25 AB34 √-

139 3 Y28 AB33 √-

140 3 AA30 Y26 NA -

141 3 Y27 AA31 √-

142 3 AA27 AA29 √-

143 3 AB32 AB29 √VREF

144 3 AA28 AC34 NA -

145 3 Y25 AD34 NA -

146 3 AB30 AC33 NA -

147 3 AA26 AC32 √-

148 3 AD33 AB28 √-

149 3 AE34 AB27 √D5

150 3 AE33 AC30 √VREF

151 3 AA25 AE32 NA -

152 3 AE31 AD29 √-

153 3 AD31 AF33 √VREF

154 3 AC28 AF31 NA -

155 3 AC27 AF32 NA -

156 3 AE29 AD28 NA VREF

157 3 AD30 AG32 √-

158 3 AC26 AH33 √-

159 3 AD26 AF30 √VREF

160 3 AC25 AH32 √-

161 3 AE28 AL34 √-

162 3 AG30 AD27 NA -

1633AF29AK34 √-

164 3 AD25 AE27 √-

165 3 AJ33 AH31 √VREF

166 3 AE26 AL33 NA -

167 3 AF28 AL32 NA -

168 3 AJ31 AF27 NA VREF

169 3 AG29 AJ32 √-

170 3 AK33 AH30 √-

171 3 AK32 AK31 √INIT

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

172 4 AP31 AK29 √-

173 4 AP30 AN31 NA -

174 4 AH27 AN30 √-

175 4 AM30 AK28 √VREF

176 4 AG26 AN29 NA -

1774AF25AM29 √-

178 4 AL29 AL28 √VREF

179 4 AE24 AN28 √-

180 4 AJ27 AH26 NA -

181 4 AG25 AK27 NA -

182 4 AM28 AF24 NA -

183 4 AJ26 AP27 √-

184 4 AK26 AN27 √VREF

185 4 AE23 AM27 NA -

186 4 AL26 AP26 √-

187 4 AN26 AJ25 √VREF

188 4 AG24 AP25 NA -

1894AF23AM26 √-

190 4 AJ24 AN25 √VREF

191 4 AE22 AM25 NA -

192 4 AK24 AH23 NA -

1934AF22AP24 √VREF

194 4 AL24 AK23 √-

195 4 AG22 AN23 NA -

196 4 AP23 AM23 √-

197 4 AH22 AP22 √-

198 4 AL23 AF21 NA -

199 4 AL22 AJ22 √-

200 4 AK22 AM22 √VREF

201 4 AG21 AJ21 √-

202 4 AP21 AE20 NA -

203 4 AH21 AL21 NA -

204 4 AN21 AF20 NA -

205 4 AK21 AP20 √-

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

44 1-800-255-7778 Advance Product Specification

206 4 AE19 AN20 √VREF

207 4 AG20 AL20 NA -

208 4 AH20 AK20 √-

209 4 AN19 AJ20 √-

2104AF19AP19 NA -

211 4 AM19 AH19 √-

212 4 AJ19 AP18 √VREF

2134AF18AP17 NA -

214 4 AJ18 AL18 NA VREF

215 5 AM18 AL17 None IO_LVDS_DLL

216 5 AH17 AM17 NA VREF

217 5 AJ17 AG17 NA -

218 5 AP16 AL16 √VREF

219 5 AJ16 AM16 √-

220 5 AK16 AP15 NA -

221 5 AL15 AH16 √-

222 5 AN15 AF16 √-

223 5 AP14 AE16 NA -

224 5 AK15 AJ15 √VREF

225 5 AH15 AN14 √-

226 5 AK14 AG15 NA -

227 5 AM13 AF15 NA -

228 5 AG14 AP13 NA -

229 5 AE14 AE15 √-

230 5 AN13 AG13 √VREF

231 5 AH14 AP12 √-

232 5 AJ14 AL14 NA -

2335AF13AN12 √-

2345AF14AP11 √-

235 5 AN11 AH13 NA -

236 5 AM12 AL12 √-

237 5 AJ13 AP10 √VREF

238 5 AK12 AM10 NA -

239 5 AP9 AK11 NA -

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

240 5 AL11 AL10 √VREF

241 5 AE13 AM9 √-

2425AF12AP8 NA -

243 5 AL9 AH11 √VREF

2445AF11AN8 √-

245 5 AM8 AG11 NA -

246 5 AL8 AK9 √VREF

247 5 AH10 AN7 √-

248 5 AE12 AJ9 NA -

249 5 AM7 AL7 NA -

250 5 AG10 AN6 NA -

251 5 AK8 AH9 √-

252 5 AP5 AJ8 √VREF

253 5 AE11 AN5 √-

2545AF10AM6 NA -

255 5 AL6 AG9 √VREF

256 5 AH8 AP4 √-

257 5 AN4 AJ7 NA -

258 5 AM5 AK6 √-

259 6 AF8 AH6 √-

260 6 AK3 AE9 √-

261 6 AL2 AD10 √-

262 6 AH4 AL1 NA VREF

263 6 AK1 AG6 NA -

264 6 AK2 AF7 NA -

265 6 AG5 AJ3 √VREF

266 6 AJ2 AD9 √-

267 6 AH2 AC10 √-

268 6 AF5 AH3 NA -

269 6 AG3 AE8 √-

270 6 AG2 AE7 √-

271 6 AG1 AF6 √VREF

272 6 AG4 AC9 √-

273 6 AF3 AE6 √-

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

QPro Virtex-E 1.8V QML High-Reliability FPGAs

DS096-4 (v1.1) July 29, 2004 www.xilinx.com Module 4 of 4

Advance Product Specification 1-800-255-7778 45

274 6 AF4 AF1 NA VREF

275 6 AF2 AB10 NA -

276 6 AE1 AC8 NA -

277 6 AE3 AD5 √VREF

278 6 AD1 AC7 √-

279 6 AD2 AD6 NA -

280 6 AC1 AB8 √VREF

281 6 AC2 AC5 √-

282 6 AC3 AA9 √-

283 6 AD4 AC4 √-

284 6 AB6 AA8 NA -

285 6 Y10 AB1 NA -

286 6 AA7 AB2 NA -

287 6 AA1 AA4 √VREF

288 6 AB4 Y9 √-

289 6 Y8 AA2 √-

290 6 AA5 AA6 NA -

291 6 Y7 AB3 √-

292 6 W10 Y1 √-

293 6 Y2 Y5 √VREF

294 6 W2 W9 √-

295 6 Y4 W7 √-

296 6 Y6 W1 NA -

297 6 W3 W6 NA -

298 6 W4 V9 NA -

299 6 V1 W5 √VREF

300 6 U2 V7 √-

301 6 U1 V6 NA VREF

302 7 U4 U9 √-

303 7 U5 U7 NA VREF

304 7 U6 U3 √-

305 7 T6 T3 √VREF

306 7 T4 T9 NA -

307 7 R1 T5 NA -

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

308 7 T10 R6 NA -

309 7 R5 R2 √-

310 7 P5 P1 √VREF

311 7 P2 R8 √-

312 7 N1 R9 √-

3137 R10P4 NA -

314 7 N2 P8 √-

315 7 P7 P6 √-

316 7 N4 M1 √VREF

317 7 N3 N6 NA -

318 7 M2 P9 NA -

319 7 M3 N7 NA -

320 7 M4 P10 √-

321 7 N8 L1 √-

322 7 N9 L2 √-

323 7 K1 M7 √VREF

324 7 L4 M8 NA -

325 7 L5 J1 √-

326 7 K3 J2 √VREF

327 7 J3 L7 NA -

328 7 H2 M9 NA -

329 7 K6 J4 NA VREF

330 7 G2 L8 √-

331 7 K7 H3 √-

332 7 J5 G3 √VREF

333 7 H5 L9 √-

334 7 H4 J6 √-

335 7 K8 G4 NA -

336 7 F2 J7 √-

337 7 L10 F3 √-

338 7 H6 E1 √VREF

339 7 E2 G5 NA -

340 7 D1 K9 NA -

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

QPro Virtex-E 1.8V QML High-Reliability FPGAs R

Module 4 of 4 www.xilinx.com DS096-4 (v1.1) July 29, 2004

46 1-800-255-7778 Advance Product Specification

Revision History

The following table shows the revision history for this document.

341 7 J8 E3 NA VREF

342 7 D2 E4 √-

343 7 D3 F4 √-

Tabl e 7: FG1156 Differential Pin Pair Summary:

XQV2000E

Pair Bank

Pin AO

Other

Functions

Date Version Revision

05/19/03 1.0 Initial Xilinx release.

07/29/04 1.1 • Removed CB228 and HQ240 package pinout information (not offered).

• Added “VREF” to pin description of pin B15 in package BG432 (XQV600E).