© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 3 1Publication Order Number:
MR2520L/D
MR2520L
Overvoltage
Transient Suppressor
Designed for applications requiring a low voltage rectifier with
reverse avalanche characteristics for use as reverse power transient
suppressors. Developed to suppress transients in the automotive
system, these devices operate in the forward mode as standard
rectifiers or reverse mode as power avalanche rectifier and will protect
electronic equipment from overvoltage conditions.
Features
•High Power Capability
•Economical
•Increased Capacity by Parallel Operation
•Pb−Free Packages are Available*
Mechanical Characteristics:
•Case: Epoxy, Molded
•Weight: 2.5 Grams (Approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Maximum Lead Temperature for Soldering Purposes:
350°C 3/8″ from Case for 10 Seconds at 5 lbs. Tension
•Polarity: Indicated by Diode Symbol or Cathode Band
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating Symbol Value Unit
DC Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
23 V
Repetitive Peak Reverse Surge Current
(Time Constant = 10 ms, Duty Cycle ≤ 1%,
TC = 25°C)
IRSM 58 A
Peak Reverse Power (Time Constant = 10 ms,
Duty Cycle ≤ 1%, TC = 25°C) PRSM 2500 W
Average Rectified Forward Current , (Single
Phase, Resistive Load, 60 Hz, TC = 125°C)
(See Figure 4)
IO6.0 A
Non−Repetitive Peak Surge Current, Surge
Supplied at Rated Load Conditions Halfwave,
Single Phase
IFSM 400 A
Operating and Storage Junction Temperature
Range TJ, Tstg −65 to
+175 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
MICRODE AXIAL
CASE 194
STYLE 1
OVERVOLTAGE
TRANSIENT SUPPRESSOR
24 − 32 VOLTS
MR2520LAYYWW G
G
A = Assembly Location
YY = Year
WW = Work Week
G= Pb−Free Package
http://onsemi.com
(Note: Microdot may be in either location)
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
MARKING DIAGRAM
MR2520L
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Lead Length Symbol Max Unit
Thermal Resistance, Junction−to−Lead,
Both Leads to Heat Sink with Equal Length 6.25 mm
10 mm
15 mm
RqJL 7.5
10
15
°C/W
Thermal Resistance Junction−to−Case −RqJC 1.0 °C/W
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
Instantaneous Forward Voltage (Note 1) (IF = 100 A, TC = 25°C) VF− 1.25 V
Instantaneous Forward Voltage (Note 1) (IF = 6.0 A, TC = 25°C) VF− 0.90 V
Reverse Current (VR = 20 Vdc, TC = 25°C) IR− 10 nAdc
Reverse Current (VR = 20 Vdc, TC = 25°C) IR− 300 nAdc
Breakdown Voltage (Note 1) (IR = 100 mAdc, TC = 25°C) V(BR) 24 32 V
Breakdown Voltage (Note 1) (IR = 90 A, TC = 150°C, PW = 80 ms) V(BR) − 40 V
Dynamic Resistance (IR = 100 mA, TJ = 25°C, f = 1.0 kHz) RZ− 5.0 W
Dynamic Resistance (IR = 40 mA, TJ = 25°C) RZ− 0.15 W
Breakdown Voltage Temperature Coefficient V(BR)TC − 0.09* %/°C
Forward Voltage Temperature Coefficient @ IF = 10 mA VFTC − −2* mV/°C
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
*Typical
ORDERING INFORMATION
Device Package Shipping†
MR2520L Microde Axial 1000 / Box
MR2520LG Microde Axial
(Pb−Free)
MR2520LRL Microde Axial 800 / Tape & Reel
MR2520LRLG Microde Axial
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MR2520L
http://onsemi.com
3
100°C
Figure 1. Forward Voltage Figure 2. Normalized Reverse Current
VF, INSTANTANEOUS FORWARD VOLTAGE (mV) TJ, JUNCTION TEMPERATURE (°C)
I
1100900800700500
1.0
10
100
1000
I
175125100755025
Figure 3. Typical Capacitance Figure 4. Maximum Current Ratings
VR, REVERSE VOLTAGE (V) TL, LEAD TEMPERATURE (°C)
C, CAPACITANCE (pF)
2520151050
1000
1500
2000
2500
3000
3500
4000
I
18014012010080604020
0
5
10
15
20
25
Figure 5. Thermal Response Figure 6. Steady State Thermal Resistance
t, TIME (S) LEAD LENGTH (mm)
r(t), TRANSIENT THERMAL
R
2520151050
0
5
10
15
20
25
30
F, INSTANTANEOUS FORWARD CURRENT (A)
, REVERSE CURRENT (NORMALIZED)
R
, A VERAGE FORW ARD CURRENT (A)
F(avg)
160
RESISTANCE (NORMALIZED)
35
40
, THERMAL RESISTANCE
JUNCTION TO LEAD ( C/W)°
JLq
TJ = 150°C
25°C
VR = 20 V
L = 6.25 mm
10 mm
15 mm
Both leads to heatsink with equal length
IF(peak)/IF(avg) = p
L = 6.25 mm, both leads to heatsink (equal length)
Maximum
Maximum
Typical
Typical
Both leads to heatsink (equal length)
Single to heatsink
1000600 100
101
102
103
104
150
10−3 10−2 10−1 100101102
10−2
10−1
100
MR2520L
http://onsemi.com
4
Figure 7. Maximum Peak Reverse Current Figure 8. Maximum Peak Reverse Power
t, TIME CONSTANT (mS) t, TIME CONSTANT (mS)
I
1000100101
10
100
P
100
0
100101
100
1000
10000
Figure 9. Maximum Reverse Energy Figure 10. Reverse Power Derating
t, TIME CONSTANT (mS) TL, LEAD TEMPERATURE (°C)
W
1000100101
1
10
100
1000
15
0
100755025
200
400
800
1200
1600
2400
Figure 11. Typical Clamping Factor
IRSM, REPETITIVE PEAK REVERSE SURGE CURRENT (A)
V
12070603010
1.00
1.10
1.20
RSM, PEAK REVERSE CURRENT (A
)
, PEAK REVERSE POWER (W)
RSM
PEAK REVERSE POWER (W)
125
50
, PEAK REVERSE ENERGY (J)
RSM
2000
20 40 90 110
80 100
1.02
1.04
1.06
1.08
1.18
1.12
1.14
1.16
TJ = 25°CTJ = 25°C
TJ = 25°C
Time Constant = 100 mS
Time Constant = 10 mS
/V
Z(Irsm) Z(100 mA)
PW = 80 mS, TL = 25°C
600
1000
1400
1800
2600
2200
2800
Figure 12. Maximum Load Dump Frequency
TIME CONSTANT (ms)
f, FREQUENCY (HERTZ)
100
0
110 100
1−5 mm (Both leads to heat sink)
10−3
10−2
10−1
100
1−20 mm (Both leads to heat sink)
MR2520L
http://onsemi.com
5
Figure 13. Load Dump Test Circuit
Figure 14. Load Dump Pulse Current
t, TIME (S)
0.50.30.20.10
0
20
40
60
80
100
(%)
0.4
dl/dt < 1 A/ms
2 W
dl/dt Limitation
100 mH
MR2532L
50 mF0 − 150 V
t (50%) t (10%)
t (37%)
t (37%) = Time Constant
t (50%) = 0.7 t (37%)
t (10%) = 2.3 t (37%)
MR2520L
http://onsemi.com
6
PACKAGE DIMENSIONS
CASE 194−04
ISSUE H
MICRODE AXIAL
NOTES:
1. CATHODE SYMBOL ON PACKAGE.
2. 194−01 OBSOLETE, 194−04 NEW STANDARD.
STYLE 1:
PIN 1. CATHODE
2. ANODE
A
K
B
K
2
1
D
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.43 8.69 0.332 0.342
B5.94 6.25 0.234 0.246
D1.27 1.35 0.050 0.053
K25.15 25.65 0.990 1.010
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, af filiates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
MR2520L/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
