TC35661SBG/DBG-503 TC35661SBG/DBG-503 (R) Bluetooth IC ROM Profile Series Rev. 1.0 (R) The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. (c)2016 TOSHIBA Corporation 1 2016-12-20 TC35661SBG/DBG-503 Data sheet composition This data sheet consists of two parts describing the firmware and the hardware. The chapter of the firmware describes the functions of the firmware built in the ROM of the IC. The chapter of the hardware describes the functions of the hardware. Some functions are not supported by the firmware depending on ROM versions. Please refer to the chapter of the firmware for details. 2 2016-12-20 TC35661SBG/DBG-503 Firmware data sheet TC35661-503 (R) Bluetooth IC ROM Profile Series SPP+GATT Rev 1.01 3 2016-12-20 TC35661SBG/DBG-503 Contents Firmware data sheet ..........................................................................................................................................................................................3 1. General Description...............................................................................................................................................................................5 1.1. Product Concept ...........................................................................................................................................................................5 1.2. Features.........................................................................................................................................................................................5 1.3. Bluetooth(R) Support Feature List ...................................................................................................................................................6 2. Pin Function ...........................................................................................................................................................................................8 2.1 Pin Functions .....................................................................................................................................................................................8 2.2 System Configuration Example......................................................................................................................................................11 4 2016-12-20 TC35661SBG/DBG-503 1. General Description 1.1. Product Concept (R) TC35661 is the 1-chip CMOS IC for Bluetooth communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-503 is TC35661 with ROM version 503. It supports both SPP (Serial (R) Port Profile) and GATT (Bluetooth Low Energy). 1.2. Features SPP (Serial Port Profile) and GATT (Generic Attribute Profile) UART as Host CPU Interface Baud rate from 2400 bps to 3.25 Mbps (Default 115200 bps) 4-wire EEPROM control I2C interface API for General Purpose I/O (GPIO) control API for Wake-up Interface 19 ports (with pull-up and pull-down resistors) Wake-up input Wake-up status output Host wake-up output API for Low power mode Sleep function Wake up by UART command Wake up by GPIO0 input Selectable source of the sleep clock 32.768 kHz (External input or Clock divided from 26 MHz) Synchronization signal output For LED blinking function API Service Database GATT SPP RFCOMM SDP ATT SMP GAP GAP L2CAP HCI LE Link Layer BR/EDR Baseband Physical Layer BR function LE function Figure 1-1 Diagram of Bluetooth(R) Stack in TC35661-503 5 2016-12-20 TC35661SBG/DBG-503 1.3. Bluetooth(R) Support Feature List Table 1-1 Support Feature List Items (R) Bluetooth Core Description Status Version 4.2 Power Class 2 Basic Rate (BR) Supported (R) Bluetooth low energy (LE) Supported High Speed (HS) Not Supported Bluetooth Sniff Supported (BR/EDR) Park/Hold Not Supported BR- 3slot packet Supported BR- 5slot packet Supported EDR Not Supported Extended Inquiry Response Supported Interlaced Inquiry/Page Scan Supported Read RSSI Supported Secure Simple Pairing Supported Power Control Supported Enhanced Power Control Supported AFH Supported SCO/eSCO Not Supported CQDDR Not Supported Sniff subrating Supported SPP Supported (Initiator and Acceptor) SPP UUID Assignment Supported Multi Profile / Multi point connection Not supported (R) 6 2016-12-20 TC35661SBG/DBG-503 Items (R) Bluetooth (LE) Description Status Central Not Supported Peripheral Supported ConnectionUpdate Supported Random Address Supported WhiteList Supported LE Legacy Pairing Supported LE Secure Connection (V4.2) Not Supported GATT-Client Supported GATT-Server Supported Broadcaster (Advertising) Supported Observer (Scan) Not Supported MAX MTU size 160 bytes Read RSSI Supported Multi point connection Not Supported Scatternet (V4.1) Not Supported LE Encryption Supported Connection parameters Request Not Supported Procedure (V4.1) Extended Reject Indication (V4.1) Not Supported Slave-initiated Feature Exchange (V4.1) Not Supported LE Ping(V4.1) Not Supported LE Data Packet Length Extension (V4.2) Not Supported LL Privacy(V4.2) Not Supported Extended Scanner Filter Policies (V4.2) Not Supported Low Duty cycle Directed Advertising (V4.1) Not Supported LE L2CAP Connection Oriented Channel Not Supported (V4.1) 32-bit UUID support in LE (V4.1) (R) Bluetooth Dual BR Page/Inquiry scan and LE Advertising mode simultaneously Not Supported Supported SPP+GATT connection establishment Not Supported simultaneously Interface UART Baudrate 115200 bps (default). Selected by command. UART Protocol UART Transport Layer (Core4.2 Transport Layer Part A) USB Not Supported PCM Not Supported WIFI Co-Ex Not Supported 7 2016-12-20 TC35661SBG/DBG-503 2. Pin Function 2.1 Pin Functions Table 2-1 shows an attribute and the state of input or output at operation for each pin, and the function description. Table 2-1 Pin Functions Pin name Pin No. Attribute Condition Functional description VDD category Default configuration Direction Type General purpose I/O port GPIO0 C7 DVDDA IN (Neither pull-up nor General purpose I/O pin 0 (Wake-Up Input) IN/OUT pull-down resistor) After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as Wake-Up Schmitt trigger input pin. 1, 2, and 4 mA If not used for this function, this pin needs to be pulled down by 100 k. GPIO1 A4 DVDDA OUT General Purpose I/O pin 1 (Wake-up Status IN/OUT Output) Pull-up/Pull-down After the boot-up, this pin is assigned to the Schmitt trigger Wake-up Status output pin automatically. 1, 2, and 4 mA L output: Active mode H output: Sleep mode If not used for this function, this pin needs to be kept open. GPIO2 H8 DVDDB IN (Pull-up) General Purpose I/O pin 2 (LED Blinking Output) IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as LED Schmitt trigger Blinking output pin. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO3 G8 DVDDB IN (Pull-up) General Purpose I/O pin 3 (LED Blinking Output) IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as LED Schmitt trigger Blinking output pin. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO4 G7 DVDDB IN (Pull-up) General Purpose I/O pin 4 (Request Wake-Up IN/OUT output for Host CPU) Pull-up/Pull-down After the pin configuration done by the UART Schmitt trigger command, this pin is able to operate as Request 1, 2, and 4 mA Wake-up output port for Host CPU. If not used for this function, this pin needs to be kept open. 8 2016-12-20 TC35661SBG/DBG-503 Pin name Pin No. Attribute Condition Functional description VDD category Default configuration Direction Type GPIO5 G6 DVDDB IN (Pull-up) General Purpose I/O pin 5 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO6 E7 DVDDA OUT General Purpose I/O pin 6 (UART-TX port) IN/OUT After the boot-up, this pin is assigned to the Pull-up/Pull-down UART-TX output pin automatically. Schmitt trigger 1, 2, and 4 mA GPIO7 F8 DVDDA IN (Neither pull-up nor General Purpose I/O pin 7 (UART-RX port) IN/OUT pull-down resistor) After the boot-up, this pin is assigned to the Pull-up/Pull-down UART-RX input pin automatically. Schmitt trigger 1, 2, and 4 mA GPIO8 F7 DVDDA OUT General Purpose I/O pin 8 (UART-RTSX port) IN/OUT After the boot-up, this pin is assigned to the UART Pull-up/Pull-down -RTSX (Request to send) output pin automatically. Schmitt trigger 1, 2, and 4 mA GPIO9 D7 DVDDA IN (Neither pull-up nor General Purpose I/O pin 9 (UART-CTSX port) IN/OUT pull-down resistor) After the boot-up this pin is assigned to the UART Pull-up/Pull-down -CTSX (Clear to send) input pin automatically. Schmitt trigger 1, 2, and 4 mA GPIO10 B2 DVDDA IN (Pull-up) General Purpose I/O pin 10 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO11 A2 DVDDA IN (Pull-up) General Purpose I/O pin 11 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO12 C6 DVDDA IN (Pull-up) General Purpose I/O pin 12 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. 9 2016-12-20 TC35661SBG/DBG-503 Pin name Pin No. Attribute Condition Functional description VDD category Default configuration Direction Type GPIO13 D8 DVDDA IN (Pull-up) General Purpose I/O pin 13 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO14 B6 DVDDA General Purpose I/O pin 14 (I2C SCL port) IN (Pull-up) IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin changes to SCL signal pin for Schmitt trigger the serial memory interface. I2C can be selected 1, 2, and 4 mA for the serial memory interface. If not used for this function, this pin needs to be kept open. GPIO15 B5 DVDDA General Purpose I/O pin 15 (I2C SDA port) IN (Pull-up) IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin changes to SDA signal pin for Schmitt trigger the serial memory interface. I C can be selected 1, 2, and 4 mA for the serial memory interface. 2 If not used for this function, this pin needs to be kept open. GPIO16 A5 DVDDA IN (Pull-up) General Purpose I/O pin 16 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO17 A3 DVDDA IN (Pull-up) General Purpose I/O pin 17 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. GPIO18 B4 DVDDA IN (Pull-up) General Purpose I/O pin 18 IN/OUT After the pin configuration done by the UART Pull-up/Pull-down command, this pin is able to operate as a Schmitt trigger general-purpose input and output port. 1, 2, and 4 mA If not used for this function, this pin needs to be kept open. 10 2016-12-20 TC35661SBG/DBG-503 2.2 System Configuration Example This Figure 2-1 shows an example of system configuration. TC35661-503 GPIO6/UART-TX Filter 26 MHz OSC H2 D1 D2 GPIO7/UART-RX RFIO GPIO8/UART-RTSX GPIO9/UART-CTSX XOIN GPIO0 XOOUT GPIO1 D5 C8 CLKREQ E8 32.768 kHz CLKREQ GPIO2 SLEEPCLK GPIO3 GPIO5 D6 B1 JTAG I/F C5 C4 C3 B7 B8 A8 F8 F7 UART I/F D7 C7 A4 Wake-up input Status output RESETX GPIO4 B3 E7 TRSTX GPIO14/SCL TCK GPIO15/SDA TMS GPIO16 TDI GPIO17 TDO GPIO18 TRTCK GPIO10 GPIO11 USBDP GPIO12 USBDM DVDD33USB GPIO13 H8 G8 G7 G6 B6 B5 A5 LEDout0 LEDout1 Request Wake-up I2C for EEPROM connection (Option) A3 B4 B2 A2 C6 D8 GND Figure 2-1 TC35661-503 System Configuration Example 11 2016-12-20 TC35661SBG/DBG-503 Hardware data sheet TC35661SBG/DBG HW2 (R) Bluetooth IC ROM Profile Series Rev 1.11 12 2016-12-20 TC35661SBG/DBG-503 Contents Hardware data sheet ...................................................................................................................................................................................... 12 1. General Description............................................................................................................................................................................ 15 1.1. Product Concept ........................................................................................................................................................................ 15 1.2. Features...................................................................................................................................................................................... 15 1.3. Ordering Information .................................................................................................................................................................. 16 2. Pin Function ........................................................................................................................................................................................ 17 2.1. Pin Assignment .......................................................................................................................................................................... 17 2.2. Pin Functions.............................................................................................................................................................................. 18 2.2.1. 3. Power Supply Pins ............................................................................................................................................................ 21 System Configuration......................................................................................................................................................................... 23 3.1. 4. Block Diagram ............................................................................................................................................................................ 23 Hardware Interface............................................................................................................................................................................. 24 4.1. Reset Interface (Power Supply Sequence) .............................................................................................................................. 24 4.1.1. 4.1.2. 4.2. Features ............................................................................................................................................................................. 24 Connection Example ......................................................................................................................................................... 24 UART Interface........................................................................................................................................................................... 25 4.2.1. Features ............................................................................................................................................................................. 25 4.2.2. Connection Example ......................................................................................................................................................... 25 4.2.3. Frame Format .................................................................................................................................................................... 26 4.2.4. Flow Control Function........................................................................................................................................................ 26 4.2.5. UART Baud Rate Setting .................................................................................................................................................. 27 4.2.6. Error Detection Function.................................................................................................................................................... 27 4.3. Audio CODEC Digital Interface ................................................................................................................................................. 28 4.3.1. Features ............................................................................................................................................................................. 28 4.3.2. Connection Examples ....................................................................................................................................................... 28 4.3.3. Frame Format .................................................................................................................................................................... 30 4.3.4. Programmable Polarity Changing..................................................................................................................................... 33 4.3.5. 4.4. Bit Clock Frequency in Master Mode................................................................................................................................ 35 Serial Memory Interface............................................................................................................................................................. 37 4.4.1. Features ............................................................................................................................................................................. 37 4.4.2. Connection Example ......................................................................................................................................................... 37 4.4.3. Selection of External Pull-up Resistor Value for I2C Bus Interface .................................................................................. 40 4.4.4. Frame Format .................................................................................................................................................................... 41 4.5. Wi-Fi Co-existence Interface ..................................................................................................................................................... 44 4.5.1. Features ............................................................................................................................................................................. 44 4.5.2. Connection Example ......................................................................................................................................................... 44 4.6. Reference Clock Interface ......................................................................................................................................................... 45 4.6.1. Features ............................................................................................................................................................................. 45 4.6.2. Connection Example ......................................................................................................................................................... 45 4.6.3. Fine Tuning Function for Cristal Oscillator ........................................................................................................................ 45 4.7. JTAG Interface ........................................................................................................................................................................... 46 4.7.1. Features ............................................................................................................................................................................. 46 4.7.2. Connection Example ......................................................................................................................................................... 46 5. Electrical Characteristics .................................................................................................................................................................... 47 5.1. Absolute Maximum Ratings ...................................................................................................................................................... 47 5.2. Operation Condition ................................................................................................................................................................... 48 5.3. DC Characteristics ..................................................................................................................................................................... 49 5.3.1. Current consumption ......................................................................................................................................................... 49 13 2016-12-20 TC35661SBG/DBG-503 5.4. Internal Regulator Characteristics ............................................................................................................................................. 51 5.5. RF Characteristics...................................................................................................................................................................... 52 5.5.1. Basic Rate .......................................................................................................................................................................... 52 5.5.2. Enhanced Data Rate ......................................................................................................................................................... 54 5.5.3. Bluetooth(R) Low Energy ..................................................................................................................................................... 56 5.6. AC Characteristics ..................................................................................................................................................................... 58 5.6.1. UART Interface .................................................................................................................................................................. 58 5.6.2. I2C Interface........................................................................................................................................................................ 59 6. System Configuration Example ......................................................................................................................................................... 61 6.1. 6.2. 7. System Configuration Example................................................................................................................................................. 61 Application Circuit Example ....................................................................................................................................................... 61 Package .............................................................................................................................................................................................. 62 7.1. TC35661SBG Package Outline................................................................................................................................................ 62 7.2. TC35661DBG Package Outline................................................................................................................................................ 63 RESTRICTIONS ON PRODUCT USE......................................................................................................................................................... 64 14 2016-12-20 TC35661SBG/DBG-503 1. General Description 1.1. Product Concept (R) TC35661 is a 1-chip CMOS IC for Bluetooth communication. Each supported function depends on ROM version. Please see the firmware data sheet. 1.2. Features Each supported function depends on ROM version. Please see the firmware data sheet. (R) Compliant with Bluetooth specification (R) Built-in Bluetooth baseband digital core (R) Built-in Bluetooth RF analog core Built-in PLL for multi-clock input Built-in ARM7TDMI-STM core (R) On-chip Program Mask-ROM for Bluetooth communication (R) On-chip Work memory (RAM) for Bluetooth Baseband procedure Supports patch program loader function Supports a CODEC for audio communication CVSD (Continuous Variable Slope Delta Modulation) CODEC PCM (Pulse Code Modulation) CODEC Connectable Serial Flash ROM/ EEPROM at external serial memory interface Serial Flash ROM interface (SPI) EEPROM interface (I2C/SPI) Host Interface (set for the product test.) UART interface: Baud rate from 2400 bps to 4.33 Mbps Voice/Audio CODEC Digital Interface (1-ch) 2 Supports I S (The Inter-IC Sound Bus) interface Left-justified interface Supports PCM (Pulse Code Modulation) digital interface General Purpose I/O (GPIO) with pull-up and pull-down resistors (MAX: 19 ports) Wake-up Interface Wake-up input function and remote wake-up output function Wi-Fi co-existence interface (2-wire, 3-wire and 4-wire) Test Interface JTAG Interface (ICE Interface) Supports OSC (Crystal oscillator: 26 MHz) Supports an external clock input Built-in oscillation circuit for an external crystal oscillator Supports a sleep clock Built-in divider for the reference operation clock Supports an external clock input Built-in sleep function Power Supply: Single 1.8 or 3.3 V Package TC35661SBG: P-TFBGA64-0505-0.50 [64 balls, 5x5 mm, 0.5 mm pitch, and 1.2 mm height] TC35661DBG: P-LFBGA64-0707-0.80-001 [64 balls, 7x7 mm, 0.8 mm pitch, and 1.4 mm height] 15 2016-12-20 TC35661SBG/DBG-503 1.3. Ordering Information The product whose ending of the product number (the added code) is different has different specifications. Ending of Product Number (Added Code) Operating Temperature Weight (Typ.) (ELA -20 to 85C 0.052 g (ELC -20 to 85C 0.049 g Others -40 to 85C 0.049 g 16 2016-12-20 TC35661SBG/DBG-503 2. Pin Function 2.1. Pin Assignment A8 B8 C8 D8 E8 F8 G8 H8 DVDD33USB USBDM CLKREQ GPIO13 SLEEPCLK GPIO7 GPIO3 GPIO2 A7 B7 C7 D7 E7 F7 G7 H7 CVDD USBDP GPIO0 GPIO6 GPIO8 GPIO4 DVDDB A6 B6 C6 D6 E6 F6 G6 H6 DVDDA GPIO14 GPIO12 TCK CDVSS CDVSS GPIO5 CVDD A5 B5 C5 D5 E5 F5 G5 H5 GPIO16 GPIO15 TDI RESETX CDVSS CDVSS LVDD33A LVDD33D A4 B4 C4 D4 E4 F4 G4 H4 GPIO1 GPIO18 TDO LVSS33 TRTESTB TRTESTD LVSS33 A3 B3 C3 D3 E3 F3 G3 H3 GPIO17 TRSTX TRTCK TMODE1 TRTESTA AVSS12ADC TRTESTC AVSSSG A2 B2 C2 D2 E2 F2 G2 H2 GPIO11 GPIO10 VPGM XOOUT AVSS12X AVSS12SYN A1 B1 C1 D1 E1 F1 DVDDA TMS TMODE0 XOIN AVDD12X GPIO9 AVDD12SYN LDOOUT12A AVDD33PA RFIO G1 H1 AVDD12SG AVSSSG Figure 2-1 Pin Assignment (Top view) 17 2016-12-20 TC35661SBG/DBG-503 2.2. Pin Functions Table 2-1 shows an attribute of each pin, input or output state at operation, and function of each pin. Each supported function depends on ROM version. Please see the firmware data sheet. The power supply pins are shown in Table 2-2. Table 2-1 Pin Functions Pin name Pin No. Attribute Condition VDD category Direction Type During BT communication During a reset After a reset release Functional description Reset interface RESETX D5 DVDDA IN Schmitt trigger IN IN IN Hardware reset input pin Low level indicates the reset. Clock interface XOIN D1 AVDD12X IN OSC IN IN IN Reference clock input pin Crystal oscillator or TCXO input pin. The clock frequency is 26 MHz. The clock frequency uncertainty should be +/- 20 ppm or less. A feedback resistor is built in between XOIN pin and XOOUT pin. A resistor and a capacitor suitable for the used crystal oscillator should be externally connected. The clock is used as the internal reference clock. XOOUT D2 AVDD12X OUT OSC OUT OUT OUT Reference clock feedback output pin Crystal oscillator output pin. A feedback resistor is built in between XOIN pin and XOOUT pin. A resistor and a capacitor suitable for the used crystal oscillator should be externally connected. The clock is used as the internal reference clock. If using TCXO for a reference clock, this pin needs to be kept open. CLKREQ C8 DVDDA OUT 2 mA OUT OUT OUT Reference clock (26 MHz) request pin Reference clock request signal. By using this signal to control ON/OFF of an external clock, lower power consumption of the hardware system is achieved. A high level indicates a request for the clock supply. If SLEEPCLK is not used and only X'tal is used, or during a reset, this pin always outputs High. When the clock supply is not necessary, this pin outputs Low. When not using this pin, this pin needs to be kept open. SLEEPCLK E8 DVDDA IN Schmitt trigger IN IN IN Sleep clock input pin This pin is a clock input for low power consumption operation. The clock frequency should be 32.768 kHz. Frequency uncertainty of the sleep clock should be less than or equal to +/-250 ppm. When not using this pin, this pin needs to be pulled down by 100 k. 18 2016-12-20 TC35661SBG/DBG-503 Pin name Pin No. Attribute Condition VDD category Direction Type During BT communication During a reset After a reset release Functional description RF interface RFIO H2 AVDD12SG IN/OUT Analog IN/OUT GND GND RF I/O pin Chapter 6 shows the external connection example of the circuit which matches this pin to 50 . Refer to the connection example, confirm operations in customer's environment, and adjust the components constant. The pattern before and behind the matching circuit should wire with the 50 transmission line as much as possible, and should not interfere with the power supply line. Don't connect DC voltage directly to this pin. General purpose I/O port GPIO0 C7 DVDDA IN/OUT Pull-up/ Pull-down Schmitt trigger 1, 2, and 4 mA IN/OUT No-pull-up No-pull-up General purpose I/O pin 0 During a reset GPIO0 is set as an input whose built-in pull-up resistor is disabled. After the reset release, the data direction and the built-in pull-up resistor are set by using the internal software. When not using this pin, this pin needs to be pulled down by 100 k. Each supported function depends on ROM version. Please see the firmware data sheet. GPIO1 A4 GPIO2 H8 GPIO3 G8 IN/OUT Pull-up Pull-up GPIO4 G7 GPIO5 G6 DVDDA/DVDDB IN/OUT Pull-up/ Pull-down Schmitt trigger 1, 2, and 4 mA GPIO6 E7 GPIO7 F8 GPIO8 F7 GPIO9 D7 General Purpose I/O pin 1 to 18 During a reset the GPIO pin is set as an input whose built-in pull-up resistor is enabled. After the reset release, the data direction and the built-in pull-up resistor are set by using the internal software. When not using this pin, this pin needs to be kept open. Pin function of each GPIO pin is assigned to UART interface, the codec digital interface, the serial memory interface, and so on by the firmware mounted on ROM or the commands from the external host mounted on that firmware. Please see the firmware data sheet. GPIO10 B2 GPIO11 A2 GPIO12 C6 GPIO13 D8 GPIO14 B6 GPIO15 B5 GPIO16 A5 GPIO17 A3 GPIO18 B4 19 2016-12-20 TC35661SBG/DBG-503 Pin name Pin No. Attribute Condition VDD category Direction Type During BT communication During a reset After a reset release Functional description IC test interface DVDDA IN Schmitt trigger IN IN IN Test mode setting pins These pins are used to test a product in Toshiba. TMODE0 and TMODE1 pins need to be connected to GND. LVDD33A IN/OUT Analog IN IN IN Analog test pins These pins are used for analog inputs or outputs at the test of a product. These pins are used to test a product in Toshiba. TRTESTA, TRTESTB, TRTESTC and TRTESTD pins have to be connected to GND. B7 DVDD33USB IN/OUT Differential IN/OUT Hi-Z Hi-Z Test pin This pin has to be connected to GND. B8 DVDD33USB IN/OUT Differential IN/OUT Hi-Z Hi-Z Test pin This pin has to be connected to GND. TMODE0 C1 TMODE1 D3 TRTESTA E3 TRTESTB E4 TRTESTC G3 TRTESTD F4 USBDP USBDM JTAG interface TRSTX B3 DVDDA IN Schmitt trigger Pull-down Pull-down Pull-down JTAG reset input pin This pin is a reset input for test or debugging. During a reset the TRSTX is set as an input whose built-in pull-down resistor is enabled. Low level indicates JTAG reset. High level indicates JTAG operation. This pin needs to be kept open (not connected) or to be pulled down if not used for JTAG. TCK D6 DVDDA IN Schmitt trigger Pull-up Pull-up Pull-up JTAG clock input pin This pin is a clock input for test or debugging. This pin needs to be kept open (unconnected) or to be pulled up if not used for JTAG. TMS B1 DVDDA IN Schmitt trigger Pull-up Pull-up Pull-up JTAG mode selection input pin This pin is a serial signal input of the mode selection for test or debugging. This pin needs to be kept open (unconnected) or to be pulled up if not used for JTAG. TDI C5 DVDDA IN Schmitt trigger Pull-up Pull-up Pull-up JTAG data input pin This pin is a serial data input for test or debugging. This pin is for a chip boundary test and firmware development. This pin needs to be kept open (unconnected) or to be pulled up if not used for JTAG. TDO C4 DVDDA TristateOUT 4 mA Hi-Z Hi-Z Hi-Z JTAG data output pin This pin is a serial data output for test or debugging. This pin needs to be kept open (unconnected) if not used for JTAG. TRTCK C3 DVDDA OUT 4 mA OUT OUT OUT ICE return clock output pin Wait control signal to JTAG clock when using ICE. This pin is used for firmware development using ICE. This pin needs to be kept open (unconnected) if not used for JTAG. 20 2016-12-20 TC35661SBG/DBG-503 2.2.1. Power Supply Pins Table 2-2 shows an attribute of each pin and the supply voltage for each pin at operation. Table 2-2 Power supply pins Pin name Pin No. Attribute Condition Type VDD/GND Normal Exceptional Functional description VDD/ GND VPGM C2 Digital VDD/GND GND 3.3 V Test pin for IC manufacturing VPGM shall be connected to GND directly. DVDDA A1 A6 Digital VDD 3.3 V -- Power supply pin for GPIOm pins (m = 0, 1, and 6 to 18) 3.3 V needs to be supplied to all DVDDA pins because two DVDDA pins, A1 and A6 are connected internally in the IC. DVDDB H7 Digital VDD 3.3 V -- Power supply pin for GPIOn pins (n = 2 to 5) 3.3 V needs to be supplied to DVDDB pin. DVDD33USB A8 Digital VDD/GND GND -- Test pin (for power supply) This pin needs to be connected to GND in normal operation. CVDD A7 H6 Digital VDD 1.2 V -- Power supply pin for the IC core LDO output voltage (1.2 V) is supplied to the digital circuit in the IC. A capacitor of at least 0.8 F or more in the operating temperature range needs to be connected to this pin as the load of LDO. All CVDD pins, A7 and H6 are connected internally in the IC. CDVSS E5 E6 F5 F6 Digital GND GND -- GND pin for the digital core logic and I/O interface All CDVSS pins need to be connected to GND. AVDD12X E1 Analog VDD 1.2 V -- Power supply pin for the crystal oscillator interface LDO output voltage (1.2 V) is supplied to the digital circuit in the IC. A capacitor of 0.8 F or more needs to be connected in the operating temperature range as the load of the LDO. AVDD12SYN F1 Analog VDD 1.2 V -- Power supply pin for RFPLL This pin needs to be connected to LDOOUT12A. AVDD12SG G1 Analog VDD 1.2 V -- Power supply pin for LNA/ Receiver MIX (RxMIX)/ ADC/ DAC/ Low pass filter (LPF)/ PAcontrol/ BasebandPLL This pin needs to be connected to LDOOUT12A. AVDD33PA G2 Analog VDD 3.3 V -- Power supply pin for PA 3.3 V needs to be supplied to AVDD33PA pin. AVSS12X E2 Analog GND GND -- GND pin for the crystal oscillator interface AVSS12X pin needs to be connected to GND. AVSS12SYN F2 Analog GND GND -- GND pin for RFPLL AVSS12SYN pin needs to be connected to GND. AVSS12ADC F3 Analog GND GND -- GND pin for ADC/ DAC/ LPF/ BasebandPLL AVSS12ADC pin needs to be connected to GND. AVSSSG H1 H3 Analog GND GND -- GND pin for LNA/ RxMIX/ PAcontrol/ PA All AVSSSG pins need to be connected to GND. LVDD33D H5 LDO IN VDD 3.3 V -- Power supply pin for LDO-type regulator for the digital core 3.3 V needs to be supplied to LVDD33D pin. LVDD33A G5 LDO IN VDD 3.3 V -- Power supply pin for LDO-type regulator for the analog core 3.3 V needs to be supplied to LVDD33A pin. LVSS33 D4 G4 LDO GND GND GND -- GND pin for LDO-type regulators for the analog core and the digital core All LVSS33 pins need to be connected to GND. 21 2016-12-20 TC35661SBG/DBG-503 Pin name LDOOUT12A Pin No. H4 Attribute Condition Type VDD/GND Normal Exceptional LDO OUT OUT OUT -- Functional description Voltage output pin of LDO-type regulator for the analog core LDOOUT12A pin needs to be connected to both AVDD12SYN pin and AVDD12SG pin. A capacitor of 0.8 F or more needs to be connected in the operating temperature range as the load of the LDO. 22 2016-12-20 TC35661SBG/DBG-503 3. System Configuration 3.1. Block Diagram Figure 3-1 shows a block diagram of TC35661 and a connection example to peripheral devices. TC35661 should have a single power supply of 3.3 V or 1.8 V, and the IC has LDO regulators that have to have external capacitors. The reference operation clock of 26 MHz should be input. TC35661 supports the sleep clock function for low power operation. External clock input and the divided clock of the internal system clock are selectable. 32.768-kHz external clock should be used to save more power. To connect a serial memory, use SPI or I2C interface. Host CPU interface can be UART one. Some of the functional blocks, circuits, and constants in the block diagram may be omitted or simplified for explanatory purpose. Host CPU Codec IC Serial Memory Wi-Fi IC Optional 1.8 or 3.3 V LDO Bluetooth RF core with LE TM ARM7TDMI-S ARM7TDMI-S Modem RF PLL TCXO/ X'tal Baseband PLL PCMIF/ I2S UART Power Management Controller Patch Program Loader Selectable Sleep Clock Optional SPI/ I2C Mask ROM Wi-Fi Coex. SRAM Bluetooth Baseband core with LE Sleep clock TC35661 Figure 3-1 TC35661 block diagram and a connection example to peripheral devices 23 2016-12-20 TC35661SBG/DBG-503 4. Hardware Interface 4.1. Reset Interface (Power Supply Sequence) 4.1.1. Features Reset interface has the following features. 3.3 V or 1.8 V operation Level sensitive asynchronous reset (Low level: reset) When the power is turned on, set the reset signal in the reset state (RESETX = Low). After the power supply and the clock are stable, release the reset. Crystal oscillator stable time is about 2 ms, so set the reset release time after enough evaluation. When the power is turned off, set the reset signal in the reset state (RESETX = Low). If the power is turned off while the reset signal is High, this IC may be destroyed due of overcurrent flow to VDD pins. 4.1.2. Connection Example The reset interface can be connected to Reset IC or the device which has the level sensitive asynchronous reset function. Figure 4-1 shows a Reset IC connection example. Figure 4-2 and Figure 4-3 show the reset sequences of .Power-on and Power-off, respectively. TC35661 Reset Reset key Reset IC Power supply Reference clock GND Power supply Figure 4-1 Rest IC connection example Power supply Reset Unstable Reference clock Power off Stable Power on Power on Waiting until OSC is stablele Operation Figure 4-2 Power-on reset sequence Power supply Reset Stable Reference clock Power on HW reset Operation OSC is stable. Power off Figure 4-3 Power-off reset sequence 24 2016-12-20 TC35661SBG/DBG-503 4.2. UART Interface About enabling or disabling this function, it depends on ROM version. Please see the firmware data sheet. 4.2.1. Features TC35661 UART interface has the following features. Operation voltage: 3.3 V or 1.8 V Full-duplex 4-wire start/stop synchronization data transfer: RX, TX, RTSX, and CTSX Data format (No parity bits): LSB first * Start bit (1-bit) * Data bit (8-bit) * Stop bit (1-bit) Programmable baud rate: 2400 bps to 4.33 Mbps (Default 115200 bps) Error detection: Inter-character timeout, Overrun error, and Framing error TC35661 UART interface is used to transfer commands, status, and data with the Host CPU, and the pin is multiplexed with GPIO pin. After release of the reset, TC35661 firmware sets UART interface function to the related GPIO pins in Boot procedure. Operation voltage is 1.8 V or 3.6 V. The power voltage cannot be selected only for the UART interface because the power supply is shared by other hardware interfaces. 4.2.2. Connection Example The UART interface can connect with the Host CPU which has UART function. Figure 4-4 shows UART connection example with an external Host CPU. Figure 4-5 shows a sequence diagram from reset state to setting of UART pins. TC35661 UART Receive flow control (RTSX) HOST CPU UART Transmit flow control (CTSX) UART Receive data (RX) UART Transmit data (TX) Figure 4-4 UART connection example Reset UART Transmit data Output direction UART Receive data Input direction UART Receive flow control Output direction UART Transmit flow control Reset Input direction GPIO Configuration (Pulled-up/ input) UART Communication Figure 4-5 Assignment of UART function 25 2016-12-20 TC35661SBG/DBG-503 4.2.3. Frame Format TC35661 supporting format is as follows. Number of data bits: 8 bits Parity bit: no parity Stop bit: 1 stop bit Flow control: RTSX/CTSX Figure 4-6 shows UART data frame. 1 2 3 4 5 6 7 8 9 10 UART Transmit flow control UART Transmit data LSB 1 2 3 4 5 6 MSB Start bit Stop bit UART Receive flow control UART Receive data LSB 1 Start bit 2 3 4 5 OverSampling (x12 to17) /bit 6 MSB Stop bit Figure 4-6 UART data frame 4.2.4. Flow Control Function TC35661 UART interface uses flow control function by hardware signals, Transmit flow control (CTSX) and Receive flow control (RTSX). Figure 4-4 shows the signal input and output directions. Figure 4-6 shows the signal polarities. CTSX input signal is used for UART transmitting. Low input indicates the completion of the preparation for the other party to receive data and TC35661 does UART transmitting if there is data for transmission. In case of High level input, TC35661 stops transmitting in the units of the UART frame. RTSX output signal is used for UART receiving. Low output indicates data transmission request to UART transmission side device of the other party. TC35661 outputs Low level from RTSX when it can receive data, and it prepares to receive data. When it becomes Busy where data reception is disabled, it outputs High level and stops UART transmitting in the units of the UART frame. Response time of UART transmitting and receiving for the flow control signal depends on the baud rate and the frame internal process status. It is from 1 frame to 4 frames. 26 2016-12-20 TC35661SBG/DBG-503 4.2.5. UART Baud Rate Setting TC35661 UART interface has a programmable baud rate setting function. The UART baud rate can be set using the over-sampling number and the dividing ratio according to the following equation. The baud rate generating clock frequency is set to either 39 MHz or 52 MHz. The over-sampling number is set to an integer that ranges from 12 to 17. The dividing ratio is set to an integer that ranges from 1 to 65,535. UART BaudRate = Baud Rate Generating Clock Frequency Over - Sampling Number x Dividing Ratio Table 4-1 shows examples of the target baud rates supported by TC35661. If the other target baud rate is necessary, please contact our representative. Table 4-1 UART Baud rate setting Baud rate generating clock frequency Target baud rate Actual baud rate [bps] [bps] 115,200 116,071 39 12 28 +0.7564 921,600 928,571 39 14 3 +0.7564 2,764,800 2,785,714 39 14 1 +0.7564 [MHz] Over-sampling number Dividing ratio Deviation [%] 4.2.6. Error Detection Function TC35661 UART interface has 3 kinds of error detection functions. Receiver timeout error Receiver overrun error Receiver frame error Receiver timeout error judges as an error if the interval between reception frames counted by TC35661 internal timer is equal to or greater than a predetermined time Receiver overrun error judges as an error if UART reception frame buffer in TC35661 overflows. When data transfer is done according to the flow control in Section 4.2.4, the overflow does not occur. Receiver frame error judges as an error if a frame unit is not recognized. If "0" is detected as Stop bit field after Start bit detection, it is considered that the frame organization fails. 27 2016-12-20 TC35661SBG/DBG-503 4.3. Audio CODEC Digital Interface About enabling or disabling this function, it depends on ROM version. Please see the firmware data sheet. 4.3.1. Features TC35661 has the following main features for an audio CODEC digital interface. Operation voltage: 3.3 V or 1.8 V Data format: A-law, -law, and Linear PCM Frame format: MSB left-justified, I2S, and PCM digital Frame frequency: 8 kHz and 16 kHz Data length: 8-bit and 16-bit Bit clock function: Master and Slave Data sampling edge: Rise and fall edges Frame synchronization signal polarity: High-active and Low-active Built-in CODEC: * CVSD (Continuous variable slope delta modulation) * PCM (Pulse code modulation) TC35661 transmits and receives audio data through the audio CODEC digital interface. The pins in the audio CODEC digital interface are multiplexed with GPIO pins. After release of the reset, TC35661 firmware sets the interface function to the related GPIO pins in Boot procedure. This interface does not share a power supply pin with the other hardware interface so it is able to use its own voltage. 4.3.2. Connection Examples This CODEC digital interface can be connected to a CODEC IC and a DSP (Digital signal processor) using the same digital interface. Figure 4-7 through Figure 4-9 show connection examples for each operation mode. The selection of Master mode or Slave mode is done at the configuration setting. When this IC operates in Slave mode, the master is the device which has the bit clock and control function of the frame synchronization signal. Figure 4-10 shows a sequence of the assignment of the CODEC function to the related GPIO pins. TC35661 Bit clock CODEC IC Frame synchronization DAC digital output ADC digital input Figure 4-7 CODEC connection example (TC35661 is Master.) TC35661 Bit clock CODEC IC Frame synchronization DAC digital output ADC digital input Figure 4-8 CODEC connection example (TC35661 is Slave.) 28 2016-12-20 TC35661SBG/DBG-503 Timing master IC TC35661 Bit clock CODEC IC Frame synchronization DAC digital output ADC digital input Figure 4-9 CODEC connection example (TC35661 and CODEC are Slaves.) Reset Bit clock Output direction @MasterMode, Input direction @SlaveMode Frame synchronization Output direction @MasterMode, Input direction @SlaveMode DAC digital output ADC digital input Output direction Reset Input direction GPIO Configuration (Pull-up/ input) CODEC operation Figure 4-10 Assignment of CODEC interface function 29 2016-12-20 TC35661SBG/DBG-503 4.3.3. Frame Format There are several frame formats for a CODEC digital interface. TC35661 supports one of the most popular frame formats. MSB left-justified MSB right-justified I2S PCM digital short frame PCM digital long frame The following data lengths are supported. 8 bits 16 bits Figure 4-11 through Figure 4-15 show the frame formats of the audio CODEC digital interface. Note that if monaural data are handled using MSB left-justified format and I2S format, either left channel or right channel always has the dummy data that can be all-0 data, all-1 data or previously transferred data. 1fs Right Channel Left Channel Frame synchronization Bit clock DAC digital output ADC digital input 1 2 3 n-2 n-1 n MSB 1 LSB 1 2 MSB 3 2 3 n-2 n-1 n MSB n-2 n-1 n LSB LSB 1 2 MSB 3 n-2 n-1 n LSB *n=8,16 1fs Left Channel Frame Right Channel synchronization Bit clock DAC digital output ADC digital input 1 2 3 n-2 n-1 n MSB 1 1 2 3 LSB MSB 2 3 n-2 n-1 n MSB 1 n-2 n-1 n LSB 2 3 LSB MSB n-2 n-1 n LSB *n=8,16 Figure 4-11 MSB left-justified format 30 2016-12-20 TC35661SBG/DBG-503 1fs Right Channel Left Channel Frame synchronization Bit clock DAC digital 1 output 2 3 n-2 n-1 n MSB ADC digital 1 input 1 LSB 2 3 3 n-2 n-1 n MSB n-2 n-1 n MSB 2 1 LSB LSB 2 3 n-2 n-1 n MSB LSB *n=8,16 1fs Frame Left Channel synchronization Right Channel Bit clock DAC digital output ADC digital input 1 2 3 n-2 n-1 n 2 3 n-2 n-1 n MSB 1 1 2 3 n-2 n-1 n 2 3 n-2 n-1 n LSB MSB MSB 1 LSB LSB MSB LSB *n=8,16 Figure 4-12 MSB right-justified format 1fs Frame Left Channel synchronization 1 bit clock Bit clock DAC digital output ADC digital input Right Channel 1 bit clock 1 2 3 n-2 n-1 n 2 3 n-2 n-1 n MSB 1 1 LSB MSB 1 LSB input 2 3 n-2 n-1 n LSB MSB *n=8,16 LSB 1fs Right Channel 1 bit clock 1 bit clock Bit clock ADC digital n-2 n-1 n Left Channel synchronization output 3 MSB Frame DAC digital 2 1 2 3 n-2 n-1 n 2 3 n-2 n-1 n MSB 1 1 2 3 n-2 n-1 n 2 3 n-2 n-1 n LSB MSB MSB 1 LSB MSB LSB *n=8,16 LSB 2 Figure 4-13 I S format 31 2016-12-20 TC35661SBG/DBG-503 1fs Frame synchronization Bit clock DAC digital output ADC digital input 1 2 3 n-2 n-1 n MSB 1 LSB 2 3 n-2 n-1 n MSB LSB *n=8,16 1fs Frame synchronization Bit clock DAC digital output ADC digital input 1 2 n-2 n-1 n 3 LSB MSB 1 2 n-2 n-1 n 3 MSB *n=8,16 LSB Figure 4-14 PCM digital long frame format 1fs Frame synchronization 1 bit clock Bit clock DAC digital output ADC digital input 1 2 3 n-2 n-1 n 2 3 n-2 n-1 n MSB 1 LSB MSB LSB *n=8,16 1fs Frame synchronization 1 bit clock Bit clock DAC digital output ADC digital input 1 2 3 n-2 n-1 n MSB 1 LSB 2 3 n-2 n-1 n MSB *n=8,16 LSB Figure 4-15 PCM digital short frame format 32 2016-12-20 TC35661SBG/DBG-503 4.3.4. Programmable Polarity Changing The audio CODEC digital interface can program the change of the polarity of the sampling edge and the polarity of the frame synchronization signal, respectively. Data transmitting and receiving timings can be configured as shown in Figure 4-16. Edge polarity can be settings of two types. A: transmission timing @ falling edge, reception sampling @ rising edge B: transmission timing @ rising edge, reception sampling @ falling edge (default) Master mode (A) Frame synchronization Transmission timing Master mode (B) Transmission timing Reception timing Reception timing Bit clock DAC digital output ADC digital input Slave mode (A) Slave mode (B) Frame synchronization Bit clock DAC digital output ADC digital input Figure 4-16 Transmission and reception sampling edges 33 2016-12-20 TC35661SBG/DBG-503 Figure 4-17 shows the timing chart of the frame synchronization polarity and the data channel. 4 different settings can be done for the frame synchronization polarity and the stereo data L/R swap. A: Frame synchronization signal: Low (Lch) High (Rch) B: Frame synchronization signal: High (Lch) Low (Rch) (Default) C: Frame synchronization signal: Low (Rch) High (Lch) D: Frame synchronization signal: High (Rch) Low (Lch) Setting (A) Setting (B) = Default setting 1fs Frame 1fs synchronization DAC digital output Lch Rch Lch Rch ADC digital input Lch Rch Lch Rch Setting (C) Setting (D) 1fs Frame 1fs synchronization DAC digital output Rch Lch Rch Lch ADC digital input Rch Lch Rch Lch Figure 4-17 Frame synchronization polarity and data channels 34 2016-12-20 TC35661SBG/DBG-503 4.3.5. Bit Clock Frequency in Master Mode The audio CODEC digital interface has a bit clock and control function of the frame synchronization signal, and has Master mode and Slave mode. This section describes the Master mode. TC35661 outputs the bit clock and the frame signal when it is a bit clock master device. The frequency of the bit clock is either fixed or switched between two frequencies. This can be done because the bit clock is generated by dividing the internal reference clock of TC35661. The examples of mixed frequencies are shown in Figure 4-18 and Figure 4-19.The example of a fixed frequency is shown in Figure 4-20 In the bit clock slave mode, the frequency of the bit clock should be a frequency of the integral multiple of the sampling frequency. 1fs Frame synchronization Xfs Bit clock DAC digital output 1 2 n-2 3 4 ADC digital input 1 2 n-2 3 4 MSB n-1 n n-1 n MSB LSB Short cycle time Long cycle time LSB *n=8 or16 Figure 4-18 Bit clock whose frequency is switched (1) 1fs Frame synchronization Xfs Bit clock DAC digital output 1 2 n-2 n-1 n 3 MSB ADC digital input 1 LSB 2 MSB 3 n-2 n-1 n Short cycle time LSB Long cycle time *n=8 or16 Figure 4-19 Bit clock whose frequency is switched (2) 1fs Frame synchronization Xfs Bit clock DAC digital output 1 2 3 n-2 n-1 2 3 n-2 n-1 MSB ADC digital input 1 MSB n LSB Fixed frequency n LSB *n=8 or16 Figure 4-20 Bit clock of a fixed frequency 35 2016-12-20 TC35661SBG/DBG-503 Table 4-2 shows examples of the bit clock frequency which can be generated. Table 4-2 Examples of the generated bit clock frequency Frame synch frequency [kHz] Number of Bit clock 8 [FS] Bit clock frequency switching Bit clock frequency for a short cycle time [kHz] Bit clock frequency for a long cycle time [kHz] 50 No 400 -- 52 416 -- 100 800 -- 130 1040 -- 250 2000 -- 64.20 63.88 16 128.71 127.45 32 257.43 254.90 64 520.00 500.00 128 1040 1000.00 800 -- 130 2080 -- 250 4000 -- 8 16 50 32 Yes No 509.80 514.85 64 Yes 1040 1000.00 128 2080 2000.00 36 2016-12-20 TC35661SBG/DBG-503 4.4. Serial Memory Interface Each supported function depends on ROM version. Please see the firmware data sheet. 4.4.1. Features TC35661 has the following main features for a serial memory interface. Operation voltage: 3.3 V or 1.8 V Supports two formats (One of either SPI interface or I2C bus interface should be selected.) SPI interface Chip select: 2 channels Chip select polarity: High-active or Low-active, selectable Serial clock master function: Selectable clock polarity and phase (One is selected from among 4 cases.) Serial clock frequency: 76.47 kHz to 19.5 MHz (CPU: 39 MHz) Serial data transfer mode: MSB-first and LSB-first I2C bus interface Serial clock master operation Serial clock frequency: Standard mode (100 kHz or less) Fast mode (400 kHz or less) Output mode: Open-drain output and CMOS output Device address format: 7-bit address (10-bit address is not supported.) 4.4.2. Connection Example A serial EEPROM and a serial Flash-ROM are connected to TC35661 using the serial memory interface. The interface frame format can be either I2C bus or SPI format. SPI format can be used as a control interface for some voice CODEC devices, too. Figure 4-21 shows a connection example of a serial EEPROM using I2C bus interface of the open-drain mode. Each external pull-up resistor (Rext) is necessary for both the serial clock line and the serial data line. Figure 4-22 shows another connection example where I2C bus is in the CMOS output mode. Only the serial data line needs Rext because this line can be driven by neither TC35661 nor the serial EEPROM. Rext TC35661 Rext Serial clock output Serial EEPROM Serial data input / output Serial EEPROM Figure 4-21 Connection example for serial EEPROM with I2C-bus interface (Open-drain output) 37 2016-12-20 TC35661SBG/DBG-503 Rext TC35661 Serial clock output Serial EEPROM Serial data input / output Serial EEPROM Figure 4-22 Connection example for serial EEPROM with I2C-bus interface (CMOS output) TC35661 has 2 Chip select ports for SPI interface. Figure 4-23 shows a connection example, where both a serial Flash-ROM and a voice CODEC chip are connected to TC35661. Figure 4-24 shows another connection example, where two serial Flash-ROM's are connected to TC35661. Chip select [1:0] TC35661 Serial Serial clock output Flash-ROM Write data output Read data input Codec with Program Controller Figure 4-23 Connection example for serial Flash-ROM and CODEC using SPI interface 38 2016-12-20 TC35661SBG/DBG-503 Chip select [1:0] TC35661 Serial clock output Serial Flash-ROM Write data output Read data input Serial Flash-ROM Figure 4-24 Connection example for two serial Flash-ROM's with SPI interface Note: Some connections may need pull-up resistors on the data lines. 39 2016-12-20 TC35661SBG/DBG-503 4.4.3. Selection of External Pull-up Resistor Value for I2C Bus Interface The external pull-up resistor value needs to be selected by the following equations in case of I2C bus interface. Its maximum value 2 is defined by the equation (1) in which tr is a rise time of the serial clock and data, and Cb is I C bus capacity. Its minimum value is defined by the equation (2) in which Vdd is a supply voltage for TC35661, Vol_max is the maximum value of the low level output voltage, and Iol is the low level output current. Please select the value of the pull-up resistor in the range of the minimum value and the maximum value. Rext_max = tr 0.8473 x Cb (1) Rext_min = Vdd - Vol _ max Iol (2) TC35661 supports I2C bus standard mode (100 kHz or less) and I2C bus fast mode (400 kHz or less). The rise time tr is 1000 ns for the standard mode and it is 300 ns for the fast mode. Cb value depends on a PCB and implementation on the board. Table 4-3 and Table 4-4 show examples when I2C bus capacity is 20 pF. 2 Table 4-3 External pull-up resistor value for I C standard mode (Cb = 20 pF) I2C bus frequency 100 kHz or less tr [ns] 1000 Cb [pF] 20 Vdd [V] 1.8 3.0 3.3 Vol_max [V] 0.3 0.4 0.4 Iol [mA] 1 2 4 1 2 4 1 2 4 Rext_min [k] 1.50 0.75 0.38 2.60 1.30 0.65 2.90 1.45 0.73 Rext_max [k] 59.01 Table 4-4 External pull-up resistor value for I2C fast mode (Cb = 20 pF) I2C bus frequency 400 kHz or less tr [ns] 300 Cb [pF] 20 Vdd [V] 1.8 3.0 3.3 Vol_max [V] 0.3 0.4 0.4 Iol [mA] 1 2 4 1 2 4 1 2 4 Rext_min [k] 1.50 0.75 0.38 2.60 1.30 0.65 2.90 1.45 0.73 Rext_max [k] 17.70 40 2016-12-20 TC35661SBG/DBG-503 4.4.4. Frame Format There are several frame formats of the serial memory interface. TC35661 supports SPI and I2C frame formats. These interfaces cannot be used simultaneously. Please select one appropriate interface. When using SPI format serial memory, TC35661 sends a command identification code (Ck to C0) and an address (Am to A0) in turn. For example, in the case of a read command (Figure 4-25), the serial memory transmits the byte data (a read data) specified by the address. TC35661 continues to assert Chip select until the read data amount reaches the expected byte count. In the case of a programming command (Figure 4-26), TC35661 continues to assert Chip select and transmits write byte data until the amount reaches the expected byte count. The command identification code system and the address bit width will need to match the specifications of the serial memory to be used. Chip select Serial clock Write data Ck MSB C1 C0 Am LSB MSB A1 A0 LSB Read data k = 6, 7 m = 8, 15, 23 Dn D0 Dn D0 Dn D0 MSB LSB MSB LSB MSB LSB n=7 Figure 4-25 SPI format (Serial memory, read command) Chip select Serial clock Write data Ck MSB C1 C0 Am A1 A0 Dn LSB MSB MSB D0 Dn D0 Dn D0 LSB MSB LSB MSB LSB Read data k = 6, 7 m = 8, 15, 23 n=7 Figure 4-26 SPI format (Serial memory, programming command) 41 2016-12-20 TC35661SBG/DBG-503 When using I2C format serial memory, TC35661 generates Start condition at first. Then It sends a device identification address (7 bits: [A6: A0]) and the first byte address of the access memory ([B7: B0]) to follow a read or write command bit. Any data in I2C is transferred as MSB first. The value of the device identification address and how to specify the byte address are determined depending on the device to be connected, so they will need to match. In case of read, TC35661 will return an acknowledgment bit (ACK: Acknowledge) or a reception denial bit (NACK: Not acknowledge) to the serial memory each time at 1 byte reception. In case of write, TC35661 receives ACK or NACK from the serial memory each time at 1 byte transmission. Multi-byte, not limited to 1 byte, is able to be handled continuously. TC35661 generates Stop condition after read or write of all bytes has been completed. Figure 4-27 shows the case of 2-byte data read. Figure 4-28 shows the case of 2-byte data write. The gray signals and signal names are the output from the serial memory in those figures. In the read mode, TC35661 returns NACK after it receives the last byte data, which notifies the serial memory of the completion of the read. Start condition Start condition Stop condition Serial clock Serial data A6 MSB A0 W LSB ACK B7 MSB ACK B0 LSB A6 MSB A0 R LSB ACK ACK D0 D7 D0 NAC D7 MSB LSB MSB LSB Figure 4-27 I2C format (Serial memory, read) Start condition Stop condition Serial clock Serial data A6 MSB A0 W LSB ACK B7 MSB ACK B0 LSB ACK ACK D0 D7 D7 D0 MSB LSB MSB LSB Figure 4-28 I2C format (Serial memory, write) 42 2016-12-20 TC35661SBG/DBG-503 When connecting the CODEC IC whose control interface is SPI interface, a specified address, the read or write type and so on are transmitted in the first 8 bits (X7 to X0). Please refer to each CODEC IC document for its format. Figure 4-29 shows an example to read a specified address byte data. Figure 4-30 shows an example to write data to a specified address. And Figure 4-31 shows an example to write continuously byte data to a specified address and the following addresses. Chip select Serial clock X1 X0 X7 Write data MSB LSB D7 Read data D2 D1 D0 MSB LSB Figure 4-29 SPI format (CODEC IC, single byte read) Chip select Serial clock Write data X7 X1 X0 D7 MSB D1 D0 LSB MSB X7 X1 X0 D7-2 LSB MSB MSB D1 D0 LSB Read data Figure 4-30 SPI format (CODEC IC, single byte write) Chip select Serial clock Write data X7 MSB X1 X0 D7 LSB MSB D0 D7 D0 D7 D0 LSB MSB LSB MSB LSB Read data Figure 4-31 SPI format (CODEC IC, continuous byte write) 43 2016-12-20 TC35661SBG/DBG-503 4.5. Wi-Fi Co-existence Interface About enabling or disabling this function, it depends on ROM version. Please see the firmware data sheet. 4.5.1. Features TC35661 has a Wi-Fi co-existence interface. TC35661 can co-operate with the Wi-Fi IC which uses 2.4-GHz band in the same box and is connected by dedicated control lines to prevent from mutual interference. This interface has the following features: Operation voltage: Mode: 3.3 V or 1.8 V 2-wire, 3-wire, and 4-wire 4.5.2. Connection Example The connection examples are shown in Figure 4-32, Figure 4-33, and Figure 4-34. TC35661 Wi-Fi communication request Wi-Fi IC (R) Bluetooth communication request Figure 4-32 Connection example of 2-wire TC35661 Wi-Fi communication request Wi-Fi IC (R) Bluetooth communication request (R) Bluetooth communication status Figure 4-33 Connection example of 3-wire TC35661 Wi-Fi communication request Wi-Fi IC (R) Bluetooth communication request (R) Bluetooth communication status 1 (R) Bluetooth communication status 2 Figure 4-34 Connection example of 4-wire 44 2016-12-20 TC35661SBG/DBG-503 4.6. Reference Clock Interface 4.6.1. Features TC35661 has the following features for the reference clock interface. Type: Able to connect to a crystal oscillator or TCXO Clock frequency: 26 MHz (The frequency uncertainty should be 20 ppm or less in the range of the operation temperature.) The crystal oscillator should be connected between XOIN pin and XOOUT pin. TC35661 has an internal feed-back resistor between them so that an external feed-back resistor is unnecessary. Please select external capacitors (CIN and COUT) whose capacitance values should match the crystal oscillator specification. Note that the resistor value and the connection of an external output resistor should be selected according to implementation on a PCB with TC35661. In case of an external clock, the input TCXO needs XOIN pin only. Please keep XOOUT pin open. 4.6.2. Connection Example TC35661 XOIN CIN Clock Control COUT Clock XOOUT Figure 4-35 Cristal oscillator connection example 4.6.3. Fine Tuning Function for Cristal Oscillator The crystal oscillator circuit has a built-in capacitor array, and the oscillator frequency can be trimmed by a register bit value. The bit value can take 0 to 31. Figure 4-36 shows an example of trimming values using 26-MHz crystal oscillator on one of the Toshiba PCB's. The trimming characteristics depend on a crystal oscillator, external capacitors, resistors, layout of a PCB, and others. Crystal Triming Frequency Range 30 delta Freq. [kHz] 20 10 0 -10 -20 -30 0 5 10 15 20 25 30 bit value Figure 4-36 Trimming frequency range example 45 2016-12-20 TC35661SBG/DBG-503 4.7. JTAG Interface 4.7.1. Features Following shows features of TC35661 JTAG interface. Operation voltage: 3.3 V or 1.8 V ICE interface Chip boundary test function 4.7.2. Connection Example Figure 4-37 shows an example of the connection between TC35661 and an ICE. For the timing chart of the connection between a JTAG interface and an ICE, refer to the related information produced by ARM. TC35661 ICE reset Multi-ICE ICE clock debugger ICE mode select ICE data input ICE data output ICE return clock Figure 4-37 ICE connection example 46 2016-12-20 TC35661SBG/DBG-503 5. Electrical Characteristics 5.1. Absolute Maximum Ratings The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant. If any of these ratings would be exceeded during operation, the device electrical characteristics may be irreparably altered, and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break-down, damage and/or degradation to any other equipment. Applications using the device should be designed such that each absolute maximum rating will never be exceeded in any operating conditions. Table 5-1 Absolute Maximum Ratings (CDVSS = AVSS* = LVSS33 = 0 V) Item Symbol (Power supply category) Power supply Input voltage Rating Unit Min Max DVDD* -0.3 +3.9 V LVDD33* -0.3 +3.9 V AVDD12* -0.3 +1.8 V AVDD33PA -0.3 +3.9 V CVDD -0.3 +1.8 V VIN (DVDDA) -0.3 DVDDA + 0.3 V VIN (DVDDB) -0.3 DVDDB + 0.3 V VIN (AVDD12X) -0.3 AVDD12X + 0.3 V GPIO* -0.3 DVDD* + 0.3 V XOIN -0.3 AVDD12X + 0.3 V Other IO pins -0.3 DVDDA + 0.3 V VOUT (DVDDA) -0.3 DVDDA + 0.3 V VOUT (DVDDB) -0.3 DVDDB + 0.3 V VOUT (AVDD12X) -0.3 AVDD12X + 0.3 V VOUT (LDOOUT12A) -0.3 CVDD + 0.3 V GPIO* -0.3 DVDD* + 0.3 V XOOUT -0.3 AVDD12X + 0.3 V Other IO pins -0.3 DVDDA + 0.3 V Input current IIN (DVDD*) -10 +10 mA Input power RFIO (AVDD12SG) -- +6 dBm Storage temperature -- -40 +125 C Output voltage Note: AVSS *: AVSS12X, AVSS12SYN, AVSS12ADC and AVSSSG. DVDD *: DVDDA and DVDDB. LVDD33 *: LVDD33D and LVDD33A. AVDD12 *: AVDD12X, AVDD12SYN and AVDD12SG. GPIO*: GPIO0 to GPIO18. 47 2016-12-20 TC35661SBG/DBG-503 5.2. Operation Condition The recommended operation conditions are the conditions where this product can operate normally with enough good quality. Malfunction may occur when every condition is not kept at operation. Please keep all operation conditions when application equipment using this product is designed. Table 5-2 Operating condition (CDVSS = AVSS* = LVSS33 = 0 V) Rating Item Symbol Power supply DVDDA DVDDB LVDD33* AVDD33PA (Note1) Operating Temperature (Note2) Unit Min Typ. Max 1.7 1.9 2.7 1.8 or 3.3 AVDD12SG AVDD12SYN AVDD12X -- 1.2 -- V CVDD -- 1.2 -- V Ta -40 or -20 (Note3) +25 +85 C V 3.6 Note1: Please refer to different appropriate documents for the recommended connection examples of each power pin. CVDD is generated by a built-in regulator and supplied internally. Please connect a bypass capacitor to CVDD pin. AVDD12X is generated by a built-in regulator and supplied internally. Please connect a bypass capacitor to AVDD12X pin. AVDD12SYN and AVDD12SG are supplied by LDOOUT12A. LDOOUT12A cannot be used for a power supply to another device because it is a 1.2-V output from a built-in regulator. Please supply the same voltage level at LVDD33* and DVDDA. Please use less noise power supply voltage. Note2: This item is the design value. Note3: If the ending of the product number (the added code) is "(ELA" or "(ELC", the minimum rating is -20C. Note4: AVSS *: AVSS12X, AVSS12SYN, AVSS12ADC and AVSSSG. LVDD33 *: LVDD33D and LVDD33A. 48 2016-12-20 TC35661SBG/DBG-503 5.3. DC Characteristics 5.3.1. Current consumption The current consumption is shown in Table 5-3. The values in the table are operating average current consumption values with the recommended connections of the power supply pins in the ambient temperature of 25C. Some items in the table are not measured values at the design value. Table 5-3 Current consumption (CDVSS = LVSS33 = AVSS* = 0 V) Condition Rating Item Symbol Supply voltage Note Measured pin (Note2) Average current consumed by LVDD33D digital part IDDDIG 3.3 V or 1.8 V -- LVDD33D -- 6.5 -- Average current consumed by X'tal OSC digital part IDDANA 3.3 V or 1.8 V -- LVDD33A -- 2.0 -- Average current consumed by analog part during RX IDDDRX 3.3 V or 1.8 V -- LVDD33A -- 54 -- 3.3 V or 1.8 V -- LVDD33A -- 24 -- 3.3 V or 1.8 V -- AVDD33PA -- 30 -- Min Typ. Max Average current consumed by analog part during TX IDDDTX Average current consumed by IO part (Not1) IDDDIOA 3.3 V or 1.8 V -- DVDDA -- 0.40 -- IDDDIOB 3.3 V or 1.8 V -- DVDDB -- 0.16 -- IDDPDIG 3.3 V or 1.8 V LVDD33D -- 0.028 -- IDDPANA 3.3 V or 1.8 V LVDD33A -- 0.000 -- AVDD33PA -- 0.001 -- Current consumed during SLEEPCLK, no clock input to XOIN Stand-by current consumed during reset operation, no clock input to XOIN and no SLEEPCLK 3.3 V or 1.8 V IDDPIO (Note1) 3.3 V or 1.8 V DVDD* -- -- -- IDDPDIG 3.3 V or 1.8 V LVDD33D -- 0.37 -- IDDPANA 3.3 V or 1.8 V LVDD33A -- 2.0 -- AVDD33PA -- 0.020 -- DVDD* -- -- -- 3.3 V or 1.8 V IDDPIO (Note1) 3.3 V or 1.8 V mA -- IDDP33PA IDDP33PA Unit -- Note1: Average current consumed by IO part changes depending on the buffer settings. Note2: Each measured pin is an LDO output pin in Table 2-2. Note3: AVSS *: AVSS12X, AVSS12SYN, AVSS12ADC and AVSSSG. DVDD *: DVDDA and DVDDB. 49 2016-12-20 TC35661SBG/DBG-503 The DC characteristics of each pin are shown in Table 5-4. The table shows the values in the ambient temperature of 25C. Some items in the table are not measured values at the design value. Table 5-4 DC characteristics (CDVSS = LVSS33 = AVSS* = 0 V) Condition Item Symbol High level input voltage VIH Others 3.3 V LVCMOS level input DVDDA and DVDDB categories LVCMOS level input DVDDA and DVDDB categories 1.8 V 3.3 V Low level input voltage VIL High level input current IIH Low level input current Interface voltage Pin (Note1) 1.8 V IIL DVDD* = Interface voltage 3.3 V High level output voltage Pull-down On Pull-up Off 0.8 x DVDD* -- -- 0.8 x DVDD* -- -- -- -- 0.2 x DVDD* -- -- 0.2 x DVDD* - 10 -- 10 10 -- 200 - 10 -- 10 - 200 -- - 10 -- -- IOH = 2 mA DVDD* - 0.6 -- -- DVDD* - 0.6 -- -- DVDD* - 0.3 -- -- IOH = 2 mA DVDD* - 0.3 -- -- IOH = 4 mA DVDD* - 0.3 -- -- IOL = 1 mA -- -- 0.4 IOL = 2 mA -- -- 0.4 -- -- 0.4 -- -- 0.3 IOL = 2 mA -- -- 0.3 IOL = 4 mA -- -- 0.3 IOL = 1 mA 1.8 V Max DVDD* - 0.6 IOL = 4 mA VOL Typ. Pull-up On IOH = 1 mA 3.3 V DVDDA and DVDDB categories Min IOH = 1 mA IOH = 4 mA VOH 1.8 V Low level output voltage Pull-down Off Rating DVDDA and DVDDB categories DVDDA and DVDDB categories Unit V A V V External reference clock input level (Note2) VCLK 1.2 V -- XOIN -- 1.0 -- Vpp External 32 kHz reference clock high level input V Sleep CLK H 3.3 V -- SLEEPCLK 0.8 x DVDDA -- DVDDA+ 0.2 V External 32 kHz reference clock low level input V Sleep CLK L 3.3 V -- SLEEPCLK -- -- 0.2 x DVDDA V Note1: About each pin category, see Table 2-2. Note2: In case of using an external clock, not use of a crystal oscillator. Note3: AVSS *: AVSS12X, AVSS12SYN, AVSS12ADC and AVSSSG. DVDD *: DVDDA and DVDDB. 50 2016-12-20 TC35661SBG/DBG-503 5.4. Internal Regulator Characteristics Table 5-5 Internal regulator characteristics Item Symbol Pin Input Voltage Range Vin LVDD33* Vout1 Output Voltage Rating Unit Min Typ. Max 2.7 3.3 3.6 V 1.7 1.8 1.9 V LDOOUT12A -- 1.2 -- V Vout2 AVDD12X -- 1.2 -- V Vout3 CVDD -- 1.2 -- V Note: LVDD33 *: LVDD33D and LVDD33A 51 2016-12-20 TC35661SBG/DBG-503 5.5. RF Characteristics The following conditions are applied unless special notations are described: Ta = 25C DVDDA=DVDDB = LVDD33A =LVDD33D = 3.3 V f = 2441 MHz (RF channel = 39 channel) fx'tal = 26 MHz (tolerance: +/-2 ppm or less) PAOUT1 = +2.0 dBm Measurement points: Measuring pins of Toshiba's evaluation board. 5.5.1. Basic Rate The RF reception characteristics and the RF transmission characteristics in Basic Rate are shown in Table 5-6 and Table 5-7, respectively. Some items in the tables are not measured values at the design value. Table 5-6 RF reception characteristics (Basic rate) Item Symbol Conditions Sensitivity Sense1 Max Input level C/I Performance (Note1) Intermodulation Out of band blocking (Note2) Rating Unit Min Typ. Max Bit error rate (BER): 0.1 % or less f = 2402 MHz, 2441 MHz, and 2480 MHz -- -91.0 -- dBm maxRange1 -- -20 -10 -- dBm CI_Co -- -- 9 -- dB CI + 1 MHz -- -- -4.5 -- dB CI - 1 MHz -- -- -2.8 -- dB CI + 2 MHz -- -- -36 -- dB CI - 2 MHz -- -- -34 -- dB CI + 3 MHz -- -- -28 -- dB CI - 3 MHz -- -- -43 -- dB CI + 4 MHz -- -- -40 -- dB CI + 5 MHz or greater -- -- -45 -- dB CI - 4 MHz or less -- -- -45 -- dB IM |f1-f2| = 5 MHz -39 -26 -- dBm OBB1 fTX = fRX = 2460 MHz, and 30 to 2000 MHz -10 0 -- dBm OBB2 fTX = fRX = 2460 MHz, and 2 to 2.4 GHz -27 -- -- dBm OBB3 fTX = fRX = 2460 MHz, and 2.498 to 3 GHz -27 -- -- dBm OBB4 fTX = fRX = 2460 MHz, and 3 to 12.75 GHz -10 0 -- dBm (R) Note1: Adopts the relaxed specification of Bluetooth C/I Performance, -17 dB, at -3 MHz, +/-26 MHz and +/-52 MHz. (R) Note2: Adopts the relaxed specification of Bluetooth Blocking Performance, -50 dBm, at 820 MHz, 1230 MHz, 2356 MHz, 2564 MHz, 4921 MHz and 4922 MHz. Note3: Conditions are conformed to the specification of Bluetooth SIG Inc. 52 2016-12-20 TC35661SBG/DBG-503 Table 5-7 RF transmission characteristics (Basic rate) Item Symbol Conditions TX Output level (Note1) PAOUT1 Frequency range Rating Unit Min Typ. Max f = 2402 MHz, 2441 MHz, and 2480 MHz -- 2.0 -- dBm Frange -- 2400 -- 2483.5 MHz 20 dB Band Width 20 dBBW -- -- 915 1000 kHz Frequency deviation1 Dev1(TX) -- 140 162 175 kHz Frequency deviation2 Dev2(TX) -- 115 132 -- kHz Frequency deviation ratio Deviation(TX) f2ave/ f1avg 0.8 0.93 -- -- Initial carrier Frequency Tolerance ICFT -- -75 -4.7 75 kHz Frequency drift1 DH1 Fdrift1 DH1 packet -25 2.5 25 kHz Frequency drift2 DH5 Fdrift2 DH5 packet -40 2.5 40 kHz Frequency drift rate Fdrift rate -- -20 6.7 20 kHz/ 50s IBsp1 Frequency offset = 2 MHz -- -47 -20 IBsp2 Frequency offset = 3 MHz or greater -- -52 -40 Adjacent channel power dBm Note1: Connecting the external filter whose insertion loss is 2 dB is supposed. Note2: Conditions are conformed to the specification of Bluetooth SIG Inc. 53 2016-12-20 TC35661SBG/DBG-503 5.5.2. Enhanced Data Rate Each supported function depends on ROM version. Please see the firmware data sheet. The RF reception characteristics and the RF transmission characteristics in Enhanced Data Rate are shown in Table 5-8 and Table 5-9, respectively. Some items in the tables are not measured values at the design value. Table 5-8 RF reception characteristics (Enhanced Data Rate) Item Sensitivity Max Input level BER Floor Performance Symbol Conditions /4DQPSK Sense2 8DPSK Rating Min Typ. Max BER = 0.01 % or less -- -92.0 -- Sense3 BER = 0.01 % or less -- -85.5 -- /4DQPSK maxRange2 -- -20 -- -- 8DPSK maxRange3 -- -20 -- -- /4DQPSK BERfloor2 RFin = -60 dBm -- 0 10 8DPSK BERfloor3 RFin = -60 dBm -- 0 10-5 CI_Co2 -- -- 10.5 -- CI + 1 MHz_2 -- -- -10 -- CI - 1 MHz_2 -- -- -10 -- CI + 2 MHz_2 -- -- -37 -- CI - 2 MHz_2 -- -- -35 -- CI + 3 MHz_2 -- -- -28 -- CI - 3 MHz_2 -- -- -45 -- CI + 4 MHz_2 -- -- -46 -- CI + 5 MHz or greater_2 -- -- -47 -- CI - 4 MHz or less_2 -- -- -47 -- CI_Co3 -- -- 18 -- CI + 1 MHz_3 -- -- -5 -- CI - 1 MHz_3 -- -- -5 -- CI + 2 MHz_3 -- -- -32 -- CI - 2 MHz_3 -- -- -30 -- C I + 3 MHz_3 -- -- -22 -- CI - 3 MHz_3 -- -- -40 -- CI + 4 MHz_3 -- -- -40 -- CI + 5 MHz or greater_3 -- -- -42 -- CI - 4 MHz or less_3 -- -- -42 -- /4DQPSK C/I performance (Note1) 8DPSK Unit dBm dBm -5 BER dB dB (R) Note1: Adopts the relaxed specification of Bluetooth C/I Performance, -15 dB for /4DQPSK and -10 dB for 8DPSK, at -3 MHz, +/-26 MHz and +/-52 MHz. Note2: Conditions are conformed to the specification of Bluetooth SIG Inc. 54 2016-12-20 TC35661SBG/DBG-503 Table 5-9 RF transmission characteristics (Enhanced Data Rate) Item Symbol Conditions Relative Transmit Power Prtv i_2 /4DQPSK Typ. Max -- -4.0 -0.6 1.0 dB -- -75 -3.4 75 kHz -- -75 -3.1 75 kHz 0_2 -- -10 0.6 10 kHz i_3 -- -75 -3.4 75 kHz i+0_3 -- -75 -3.1 75 kHz 0_3 -- -10 0.6 10 kHz DEVM_R2 RMS DEVM -- 6 20 % DEVM_P2 Peak DEVM -- 15 35 % DEVM_99_2 99 % DEVM, DEVM = 30 % or less 99 100 -- % DEVM_R3 RMS DEVM -- 6 13 % DEVM_P3 Peak DEVM -- 15 25 % DEVM_99_3 99 % DEVM, DEVM = 20 % or less 99 100 -- % |M-N| = 1 IBSE1 -- -- -39 -26 dB |M-N| = 2 IBSE2 -- -- -37 -20 dBm |M-N| = 3 or greater IBSE3 -- -- -44 -40 dBm /4DQPSK DFE_2 -- 99 100 -- % 8DPSK DFE_3 -- 99 100 -- % 8DPSK /4DQPSK Modulation Accuracy 8DPSK Differential Phase Encoding Unit Min i+0_2 Carrier Frequency Stability In-band Spurious Emission (Note1) Rating Note1: Connecting external filter whose insertion loss is 2 dB is supposed. Note2: Conditions are conformed to the specification of Bluetooth SIG Inc. 55 2016-12-20 TC35661SBG/DBG-503 (R) 5.5.3. Bluetooth Low Energy Each supported function depends on ROM version. Please see the firmware data sheet. (R) The RF reception characteristics and the RF transmission characteristics in Bluetooth Low Energy are shown in Table 5-10 and Table 5-11, respectively. Some items in the tables are not measured values at the design value. (R) Table 5-10 RF reception characteristics (Bluetooth Low Energy) Item Symbol Condition Sensitivity Sense_4 Max Input level PER Report Integrity C/I performance Intermodulation Blocking Performance Rating Unit Min Typ. Max f = 2402 MHz, 2426 MHz, 2440 MHz, and 2480 MHz PER = 30.8 % or less -- -95.0 -- dBm maxRange_4 PER = 30.8 % or less -10 -- -- dBm PERReport_4 -- 50.0 -- 65.4 % CI_Co_4 -- -- 12 -- CI + 1 MHz_4 -- -- 3 -- CI - 1 MHz_4 -- -- 3 -- CI + 2 MHz_4 -- -- -34 -- CI - 2 MHz_4 -- -- -33 -- CI + 3 MHz_4 -- -- -28 -- CI + 4 MHz_4 -- -- -37 -- CI + 5 MHz or greater_4 -- -- -42 -- CI - 3 MHz or less_4 -- -- -42 -- IM_4 |f1-f2| = 5 MHz -50 -38 -- OBB1_4 30 to 2000 MHz -30 0 -- OBB2_4 2003 to 2399 MHz -35 -- -- OBB3_4 2484 to 2997 MHz -35 -- -- OBB4_4 3.0 to 12.75 GHz -30 0 -- dB dBm dBm Note: Conditions are conformed to the specification of Bluetooth SIG Inc. 56 2016-12-20 TC35661SBG/DBG-503 (R) Table 5-11 RF transmission characteristics (Bluetooth Low Energy) Item Modulation Characteristics In-band Emission Condition PAOUT_4 Rating Unit Min Typ. Max -- -- 2.0 -- dBm PDiff_4 Differential between average and peak -- 0.5 -- dB Carrier freq. offset Cfreqoffset_4 fn ; n = 0,1,2,...,k -150 0 150 Drift Fdrift1_4 f0 - fn ; n = 2,3,4...,k -50 4.6 50 Drift rate Fdrift rate_4 f1 - f0 , fn - f(n - 5) ;n = 6,7,8,...,k -20 3.7 20 f1avg Dev1_4 f1avg 225 247 275 f2max Dev2_4 f2max 185 218 -- f2avg/f 1avg Devratio_4 f2avg/f1avg 80 96 -- |M-N|=2 IBE2_4 2 MHz offset -- -47 -20 |M-N|3 IBE3_4 3 MHz offset -- -53 -30 TX Output level Carrier Frequency Offset and Drift Symbol kHz kHz kHz % dBm Note: Conditions are conformed to the specification of Bluetooth SIG Inc. 57 2016-12-20 TC35661SBG/DBG-503 5.6. AC Characteristics 5.6.1. UART Interface Table 5-12 UART Interface AC characteristics Symbol Item Min Typ. Max Unit tCLDTDLY Transmission Data ON from CTSX Low level 96 -- -- ns tCHDTDLY Transmission Data OFF from CTSX High level -- -- 2 byte tTXDIV Transmission Data Tolerance (Note) -0.756 -- +0.756 % tRLDTDLY Received Data ON from RTSX Low level 0 -- -- ns tRHDTDLY Received Data OFF from RTSX High level -- -- 8 byte tRXDIV Received Data Acceptable Tolerance (Note) -2.0 -- +2.0 % Note: This is the tolerance of the internal baud rate for each item. tCLDTDLY tCHDTDLY UARTCTSX (GPIO9) UART-TX (GPIO6) tTXDIV START BIT0 BIT1 BIT2 BIT3 BIT4 BIT5 BIT6 BIT7 STOP tRLDTDLY tRHDTDLY UARTRTSX (GPIO8) UART-RX (GPIO7) tRXDIV START BIT0 BIT1 BIT2 BIT3 BIT4 BIT5 BIT6 BIT7 STOP Figure 5-1 UART Interface Timing Diagram 58 2016-12-20 TC35661SBG/DBG-503 5.6.2. I2C Interface 5.6.2.1. Normal Mode Table 5-13 I2C Interface Normal mode AC Characteristics Symbol Item Min Typ. Max Unit tDATS Data set-up time 250 -- -- ns tDATH Data hold time 300 -- -- ns tDATVD Data validity period -- -- 3450 ns tACKVD ACK validity period -- -- 3450 ns tSTAS Restart condition set-up time 4700 -- -- ns tSTAH Restart condition hold time 4000 -- -- ns tSTOS Stop condition set-up time 4000 -- -- ns tBUF Bus open period from Stop condition to Start condition 4700 -- -- ns tr Rise time -- -- 1000 ns tf Fall time -- -- 300 ns tHIGH Serial clock period of High 4000 -- -- ns tLOW Serial clock period of Low 4700 -- -- ns Cb Bus load capacitance -- -- 400 pF S: Sr : P: START condition Repeated START Condition STOP condition tf SDA (GPIO15) tr tDATS 70% 30% tf tDATH tHIGH tr tDATVD 70% 30 % SCL (GPIO14) tSTAH tLOW 1/fSCL 1st clock S 2nd clock 3rd clock 9th clock tBUF SDA (GPIO15) 70% 30% tSTAS tSTAH tACKVD tSTOS 70% SCL (GPIO14) 30% 9th clock Sr P S Figure 5-2 I2C Interface Normal mode Timing diagram 59 2016-12-20 TC35661SBG/DBG-503 5.6.2.2. Fast mode Table 5-14 I2C Interface Fast mode AC Characteristics Symbol Item Min Typ. Max Unit tDATS Data set-up time 100 -- -- ns tDATH Data hold time 300 -- -- ns tDATVD Data validity period -- -- 900 ns tACKVD ACK validity period -- -- 900 ns tSTAS Restart condition set-up time 600 -- -- ns tSTAH Restart condition hold time 600 -- -- ns tSTOS Stop condition set-up time 600 -- -- ns tBUF Bus open period from Stop condition to Start condition 1300 -- -- ns tr Rise time 20 + 0.1 Cb -- 300 ns tf Fall time 20 + 0.1 Cb -- 300 ns tSP Spike pulse width that can be removed 0 -- 50 ns tHIGH Serial clock period of High 600 -- -- ns tLOW Serial clock period of Low 1300 -- -- ns Cb Bus load capacitance -- -- 400 pF tf SDA (GPIO15) tr S : START condition Sr : Repeated START Condition P : STOP condition tDATS 70% 30% tf tDATH tHIGH tr tDATVD 70% 30 % SCL (GPIO14) tSTAH tLOW 1/fSCL 1st clock S 2nd clock 3rd clock 9th clock tBUF SDA (GPIO15) 70% 30% tSTAS tSTAH tSP SCL (GPIO14) tACKVD tSTOS 70% 30% 9th clock Sr P S Figure 5-3 I2C Interface Fast mode Timing diagram 60 2016-12-20 TC35661SBG/DBG-503 6. System Configuration Example 6.1. System Configuration Example Each supported function depends on ROM version. Please see the firmware data sheet. 6.2. Application Circuit Example The application circuits shown in this document are provided for reference purpose only. Especially, thorough evaluation is required on the phase of mass production design. Toshiba dose not grant the use of any industrial property rights with these examples of application circuits. DVDD33 0 N.M H7 H5 D4 XOIN DVDDA_2 XOOUT LVSS33_1 AGND G2 10pF 1000pF 10F G5 G4 E5 E6 0.1F 10F AGND F5 F6 A8 GND 18pF 0.1F AGND E1 AGND 1F 0.1F 1F AGND F1 G1 AGND F3 F2 AGND H1 H3 E2 2 D2 3 4 0 TRSTX TCK TMS TDI LVDD33A AVDD33PA TDO TRTCK CLKREQ LVSS33_2 CDVSS_1 CDVSS_2 CDVSS_3 CDVSS_4 DVDD33USB GND H4 1 DVDDB LVDD33D GPIO6 GPIO7 GPIO8 GPIO9 SLEEPCLK RESETX GPIO0 LDOOUT12A GPIO1 AVDD12SYN GPIO2 AVDD12SG GPIO3 AVDD12X AVSS12ADC AVSS12SYN AVSSSG_1 AVSSSG_2 AVSS12X X'tal D1 GPIO4 GPIO5 GPIO10 GPIO11 GPIO12 GPIO13 GPIO16 GPIO17 B3 15pF A6 DVDDA_1 15pF 0.22H 0.22H TC35661 A1 AGND AGND AGND D6 B1 C5 C4 C3 C8 E7 UARTTX F8 UARTRX F7 RTS D7 CTS E8 SLEEPCLK D5 RESETX C7 GPIO0 A4 GPIO1 H8 GPIO2 G8 GPIO3 G7 GPIO4 G6 GPIO5 B2 GPIO10 A2 GPIO11 C6 GPIO12 D8 GPIO13 A5 GPIO16 A3 GPIO17 AGND AGND AGND AGND AGND AGND 2 3 5 H2 GPIO18 RFIO USBDP 3pF IN 1.0nH 2pF OUT 1.5pF 5.1nH GND SAW Filter 1 4 100k Feed AGND GPIO14 Antenna Fixing GPIO15 USBDM AGND AGND TMODE0 AGND TMODE1 TRTESTA TRTESTB TRTESTC TRTESTD B5 EEPROM 5 6 7 8 B6 B4 0.1F RF connector GND CVDD_2 VPGM 10k 0.1F 1F GND C2 VDD33 CVDD_1 10k A7 H6 B7 B8 C1 SDA SCL WP VCC GND A2 A1 A0 4 3 2 1 GND GND D3 E3 E4 GND G3 F4 AGND Figure 6-1 Application Circuit Example 61 2016-12-20 TC35661SBG/DBG-503 7. Package 7.1. TC35661SBG Package Outline Unit: mm Figure 7-1 Package outline (P-TFBGA64-0505-0.50) Weight: If the ending of the product number (the added code) is "(ELA", 0.052 g (typ.), the others are 0.049 g (typ.). Note: This figure is for explanation. For the dimensions and the others that are not listed in the figure, please contact our representative. 62 2016-12-20 TC35661SBG/DBG-503 7.2. TC35661DBG Package Outline Unit: mm Figure 7-2 Package outline (P-LFBGA64-0707-0.80-001) Weight: 0.118 g (typ.) Note: This figure is for explanation. For the dimensions and the others that are not listed in the figure, please contact our representative. 63 2016-12-20 TC35661SBG/DBG-503 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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