1
FEATURES
1
PW PACKAGE
(TOP VIEW)
VCCA
A1
A2
A3
A4
A5
A6
OE
VCCB
B1
B2
B3
B4
B5
B6
GND
2
3
4
5
6
7
89
10
11
12
13
14
15
16
DESCRIPTION/ORDERING INFORMATION
TXB0106-Q1
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................................................................................................................................................................................................ SCES791 – AUGUST 2009
6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATORWITH AUTO-DIRECTION SENSING AND ± 10-kV ESD PROTECTION
•Qualified for Automotive Applications•1.2 V to 3.6 V on A Port and 1.65 to 5.5 V onB Port (V
CCA
≤V
CCB
)•V
CC
Isolation Feature – If Either V
CC
Input Is atGND, All Outputs Are in the High-ImpedanceState
•OE Input Circuit Referenced to V
CCA•I
off
Supports Partial-Power-Down ModeOperation
The exposed center pad, if used, must beconnected as a secondary ground or left•ESD Protection Exceeds AEC-Q100
electrically open.– A Port
– 2000-V Human-Body Model– 1500-V Charged-Device Model– B Port
– ± 10-kV Human-Body Model– 1500-V Charged-Device Model
This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed totrack V
CCA
. V
CCA
accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V
CCB
. V
CCBaccepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translationbetween any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V
CCA
should not exceed V
CCB
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
The TXB0106 is designed so that the OE input circuit is supplied by V
CCA
.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through apulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
– 40 ° C to 85 ° C TSSOP – PW Reel of 2000 TXB0106IPWRQ1 YE06Q1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
TYPICAL OPERATING CIRCUIT
OE
A1
A2
A3
A4
A5
A6
B1
B2
B3
B4
B5
B6
3.3-V
System
1.8 -V
System
Data Data
Controller
1.8 V 3.3 V
TXB0106
VCCA VCCB
TXB0106-Q1
SCES791 – AUGUST 2009 ................................................................................................................................................................................................
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PIN DESCRIPTION
NO. NAME FUNCTION
1 A1 Input/output 1. Referenced to V
CCA
.2 V
CCA
A-port supply voltage. 1.2 V ≤V
CCA
≤3.6 V, V
CCA
≤V
CCB
.3 A2 Input/output 2. Referenced to V
CCA
.4 A3 Input/output 3. Referenced to V
CCA
.5 A4 Input/output 4. Referenced to V
CCA
.6 A5 Input/output 5. Referenced to V
CCA
.7 A6 Input/output 6. Referenced to V
CCA
.Output enable. Pull OE low to place all outputs in 3-state mode.8 OE
Referenced to V
CCA
.9 GND Ground10 B6 Input/output 6. Referenced to V
CCB
.11 B5 Input/output 5. Referenced to V
CCB
.12 B4 Input/output 4. Referenced to V
CCB
.13 B3 Input/output 3. Referenced to V
CCB
.14 B2 Input/output 2. Referenced to V
CCB
.15 V
CCB
B-port supply voltage. 1.65 V ≤V
CCB
≤5.5 V.16 B1 Input/output 1. Referenced to V
CCB
.
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ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
(1) (2)
TXB0106-Q1
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................................................................................................................................................................................................ SCES791 – AUGUST 2009
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CCA
Supply voltage range – 0.5 4.6 VV
CCB
Supply voltage range – 0.5 6.5 VV
I
Input voltage range
(2)
– 0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
– 0.5 6.5 VA inputs – 0.5 V
CCA
+ 0.5V
O
Voltage range applied to any output in the high or low state
(2) (3)
VB inputs – 0.5 V
CCB
+ 0.5I
IK
Input clamp current V
I
< 0 – 50 mAI
OK
Output clamp current V
O
< 0 – 50 mAI
O
Continuous output current ± 50 mAContinuous current through V
CCA
, V
CCB
, or GND ± 100 mA
JA
Package thermal impedance
(4)
83 ° C/WT
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CCA
and V
CCB
are provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
V
CCA
V
CCB
MIN MAX UNIT
V
CCA
1.2 3.6Supply voltage VV
CCB
1.65 5.5Data inputs V
CCI
× 0.65
(3)
V
CCIV
IH
High-level input voltage 1.2 V to 3.6 V 1.65 V to 5.5 V VOE V
CCA
× 0.65 5.5Data inputs 1.2 V to 5.5 V 0 V
CCI
× 0.35
(3)V
IL
Low-level input voltage 1.65 V to 5.5 V VOE 1.2 V to 3.6 V 0 V
CCA
× 0.35A-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 40
Δt/ Δv Input transition rise or fall rate 1.65 V to 3.6 V 40 ns/VB-port inputs 1.2 V to 3.6 V
4.5 V to 5.5 V 30T
A
Operating free-air temperature – 40 85 ° C
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at V
CCI
or both at GND.(2) V
CCA
must be less than or equal to V
CCB
and must not exceed 3.6 V.(3) V
CCI
is the supply voltage associated with the input port.
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ELECTRICAL CHARACTERISTICS
(1) (2)
TIMING REQUIREMENTS
TIMING REQUIREMENTS
TXB0106-Q1
SCES791 – AUGUST 2009 ................................................................................................................................................................................................
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over recommended operating free-air temperature range (unless otherwise noted)
T
A
= 25 ° C – 40 ° C to 85 ° CTESTPARAMETER V
CCA
V
CCB
UNITCONDITIONS
MIN TYP MAX MIN MAX
1.2 V 1.1V
OHA
I
OH
= – 20 µA V1.4 V to 3.6 V V
CCA
– 0.41.2 V 0.9V
OLA
I
OL
= 20 µA V1.4 V to 3.6 V 0.4V
OHB
I
OH
= – 20 µA 1.65 V to 5.5 V V
CCB
– 0.4 VV
OLB
I
OL
= 20 µA 1.65 V to 5.5 V 0.4 VI
I
OE 1.2 V to 3.6 V 1.65 V to 5.5 V ± 1 ± 2 µAA port 0 V 0 V to 5.5 V ± 1 ± 2I
off
µAB port 0 V to 3.6 V 0 V ± 1 ± 2I
OZ
A or B port OE = GND 1.2 V to 3.6 V 1.65 V to 5.5 V ± 1 ± 2 µA1.2 V 0.061.65 V to 5.5 V1.4 V to 3.6 V 9V
I
= V
CCI
or GND,I
CCA
µAI
O
= 0
3.6 V 0 V 20 V 5.5 V 21.2 V 3.41.65 V to 5.5 V1.4 V to 3.6 V 9V
I
= V
CCI
or GND,I
CCB
µAI
O
= 0
3.6 V 0 V – 20 V 5.5 V 21.2 V 3.5V
I
= V
CCI
or GND,I
CCA
+ I
CCB
1.65 V to 5.5 V µAI
O
= 0
1.4 V to 3.6 V 18V
I
= V
CCI
or GND, 1.2 V 0.05I
CCZA
I
O
= 0, 1.65 V to 5.5 V µA1.4 V to 3.6 V 5OE = GNDV
I
= V
CCI
or GND, 1.2 V 3.3I
CCZB
I
O
= 0, 1.65 V to 5.5 V µA1.4 V to 3.6 V 5OE = GNDC
I
OE 1.2 V to 3.6 V 1.65 V to 5.5 V 5 5.5 pFA port 5 6.5C
io
1.2 V to 3.6 V 1.65 V to 5.5 V pFB port 8 10
(1) V
CCI
is the supply voltage associated with the input port.(2) V
CCO
is the supply voltage associated with the output port.
V
CCA
= 1.2 V, T
A
= 25 ° C
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V
UNITTYP TYP TYP TYP
Data rate 20 20 20 20 Mbpst
w
Pulse duration Data inputs 50 50 50 50 ns
V
CCA
= 1.5 V ± 0.1 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX MIN MAX MIN MAX
Data rate 50 50 50 50 Mbpst
w
Pulse duration Data inputs 20 20 20 20 ns
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TIMING REQUIREMENTS
TIMING REQUIREMENTS
TIMING REQUIREMENTS
SWITCHING CHARACTERISTICS
TXB0106-Q1
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................................................................................................................................................................................................ SCES791 – AUGUST 2009
V
CCA
= 1.8 V ± 0.15 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX MIN MAX MIN MAX
Data rate 52 60 60 60 Mbpst
w
Pulse duration Data inputs 19 17 17 17 ns
V
CCA
= 2.5 V ± 0.2 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V± 0.2 V ± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX MIN MAX
Data rate 70 100 100 Mbpst
w
Pulse duration Data inputs 14 10 10 ns
V
CCA
= 3.3 V ± 0.3 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 3.3 V V
CCB
= 5 V± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX
Data rate 100 100 Mbpst
w
Pulse duration Data inputs 10 10 ns
V
CCA
= 1.2 V, T
A
= 25 ° C
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TOPARAMETER UNIT(INPUT) (OUTPUT)
TYP TYP TYP TYP
A B 9.5 7.9 7.6 8.5t
pd
nsB A 9.2 8.8 8.4 8A 1 1 1 1t
en
OE µsB 1 1 1 1A 20 17 17 18t
dis
(1)
OE nsB 20 16 15 15t
rA
, t
fA
A-port rise and fall times 4.1 4.4 4.1 3.9 nst
rB
, t
fB
B-port rise and fall times 5 5 5.1 5.1 nst
SK(O)
Channel-to-channel skew 2.4 1.7 1.9 7 nsMax data rate 20 20 20 20 Mbps
(1) Test procedure uses a 25-MHz sine wave on the input.
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SWITCHING CHARACTERISTICS
SWITCHING CHARACTERISTICS
TXB0106-Q1
SCES791 – AUGUST 2009 ................................................................................................................................................................................................
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V
CCA
= 1.5 V ± 0.1 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
A B 1.4 13.5 1.2 10.5 1.1 10.5 0.8 10.1t
pd
nsB A 0.9 15.2 0.7 13.8 0.4 13.8 0.3 13.7A 1111t
en
OE µsB 1111A 6.6 33 6.4 25.3 6.1 23.1 5.9 24.6t
dis
(1)
OE nsB 6.6 35.6 5.8 25.6 5.5 22.1 5.6 20.6t
rA
, t
fA
A-port rise and fall times 0.8 6.5 0.8 6.3 0.8 6.3 0.8 6.3 nst
rB
, t
fB
B-port rise and fall times 1 7.3 0.7 4.9 0.7 4.6 0.6 4.6 nst
SK(O)
Channel-to-channel skew 2.6 1.9 1.6 1.3 nsMax data rate 50 50 50 50 Mbps
(1) Test procedure uses a 25-MHz sine wave on the input.
V
CCA
= 1.8 V ± 0.15 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
A B 1.6 12 1.4 7.7 1.3 6.8 1.2 6.5t
pd
nsB A 1.5 13.5 1.2 10 0.8 8.2 0.5 8A 1111t
en
OE µsB 1111A 5.9 26.7 5.6 21.6 5.4 18.9 4.8 18.7t
dis
(1)
OE nsB 6.1 33.9 5.2 23.7 5 19.9 5 17.6t
rA
, t
fA
A-port rise and fall times 0.7 5.1 0.7 5 1 5 0.7 5 nst
rB
, t
fB
B-port rise and fall times 1 7.3 0.7 5 0.7 3.9 0.6 3.8 nst
SK(O)
Channel-to-channel skew 0.8 0.7 0.6 0.6 nsMax data rate 52 60 60 60 Mbps
(1) Test procedure uses a 25-MHz sine wave on the input.
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SWITCHING CHARACTERISTICS
SWITCHING CHARACTERISTICS
TXB0106-Q1
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................................................................................................................................................................................................ SCES791 – AUGUST 2009
V
CCA
= 2.5 V ± 0.2 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO
± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX
A B 1.1 6.7 1 5.7 0.9 5t
pd
nsB A 1 8.5 0.6 7 0.3 7A 1 1 1t
en
OE µsB 1 1 1A 5 16.9 4.9 15 4.5 13.8t
dis
(1)
OE nsB 4.8 21.8 4.5 17.9 4.4 15.2t
rA
, t
fA
A-port rise and fall times 0.8 3.6 0.6 3.6 0.5 3.5 nst
rB
, t
fB
B-port rise and fall times 0.6 4.9 0.7 3.9 0.6 3.2 nst
SK(O)
Channel-to-channel skew 0.4 0.3 0.3 nsMax data rate 70 100 100 Mbps
(1) Test procedure uses a 25-MHz sine wave on the input.
V
CCA
= 3.3 V ± 0.3 V, over recommended operating free-air temperature range (unless otherwise noted)
V
CCB
= 3.3 V V
CCB
= 5 VFROM TO
± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX
A B 0.9 5.5 0.8 4.5t
pd
nsB A 0.5 6.5 0.2 6A 1 1t
en
OE µsB 1 1A 4.5 13.9 4.1 12.4t
dis
(1)
OE nsB 4.1 17.3 4 14.4t
rA
, t
fA
A-port rise and fall times 0.5 3 0.5 3 nst
rB
, t
fB
B-port rise and fall times 0.7 3.9 0.6 3.2 nst
SK(O)
Channel-to-channel skew 0.4 0.3 nsMax data rate 100 100 Mbps
(1) Test procedure uses a 25-MHz sine wave on the input.
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OPERATING CHARACTERISTICS
TXB0106-Q1
SCES791 – AUGUST 2009 ................................................................................................................................................................................................
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T
A
= 25 ° C
V
CCA
1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V
V
CCBPARAMETER TEST CONDITIONS UNIT3.3 V5 V 1.8 V 1.8 V 1.8 V 2.5 V 5 V to
5 V
TYP TYP TYP TYP TYP TYP TYP
A-port input, B-port output 9 8 7 7 7 7 8C
L
= 0, f = 10 MHz,C
pdA
B-port input, A-port output 12 11 11 11 11 11 11t
r
= t
f
= 1 ns,
pFOE = V
CCAA-port input, B-port output 35 26 27 27 27 27 28C
pdB
(outputs enabled)B-port input, A-port output 26 19 18 18 18 20 21A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01C
L
= 0, f = 10 MHz,C
pdA
B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01t
r
= t
f
= 1 ns,
pFOE = GNDA-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03C
pdB
(outputs disabled)B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03
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PRINCIPLES OF OPERATION
Applications
Architecture
4k
4k
A B
VCCA VCCB
One
Shot
One
Shot
One
Shot
One
Shot
T1
T2
T3
T4
TXB0106-Q1
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................................................................................................................................................................................................ SCES791 – AUGUST 2009
The TXB0106 can be used in level-translation applications for interfacing devices or systems operating atdifferent interface voltages with one another.
The TXB0106 architecture (see Figure 1 ) does not require a direction-control signal to control the direction ofdata flow from A to B or from B to A. In a dc state, the output drivers of the TXB0106 can maintain a high or low,but are designed to be weak, so that they can be overdriven by an external driver when data on the bus startsflowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turnson the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds upthe high-to-low transition. The typical output impedance during output transition is 70 Ωat V
CCO
= 1.2 V to 1.8 V,50 Ωat V
CCO
= 1.8 V to 3.3 V and 40 Ωat V
CCO
= 3.3 V to 5 V.
Figure 1. Architecture of TXB0106 I/O Cell
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Input Driver Requirements
IIN
VIN
VT/4 k
–(VD–VT)/4 k
Power Up
Enable and Disable
Pullup or Pulldown Resistors on I/O Lines
TXB0106-Q1
SCES791 – AUGUST 2009 ................................................................................................................................................................................................
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Typical I
IN
vs V
IN
characteristics of the TXB0106 are shown in Figure 2 . For proper operation, the device drivingthe data I/Os of the TXB0106 must have drive strength of at least ± 2 mA.
A. V
T
is the input threshold voltage of the TXB0106 (typically V
CCI
/ 2).B. V
D
is the supply voltage of the external driver.
Figure 2. Typical I
IN
vs V
IN
Curve
During operation, ensure that V
CCA
≤V
CCB
at all times. During power-up sequencing, V
CCA
≥V
CCB
does notdamage the device, so any power supply can be ramped up first. The TXB0106 has circuitry that disables alloutput ports when either V
CC
is switched off (V
CCA/B
= 0 V).
The TXB0106 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in thehigh-impedance (Hi-Z) state. The disable time (t
dis
) indicates the delay between when OE goes low and when theoutputs actually get disabled (Hi-Z). The enable time (t
en
) indicates the amount of time the user must allow for theone-shot circuitry to become operational after OE is taken high.
The TXB0106 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0106 have lowdc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must bekept higher than 50 k Ωto ensure that they do not contend with the output drivers of the TXB0106.
For the same reason, the TXB0106 should not be used in applications such as I
2
C or 1-Wire where anopen-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TITXS01xx series of level translators.
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PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
S1
2 × VCCO
Open
50 kW
VCCI
0 V
VCCI/2 VCCI/2
tw
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS
PULSE DURATION
Input
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
TEST S1
A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
C. The outputs are measured one at a time, with one transition per measurement.
D. tPLH and tPHL are the same as tpd.
E. VCCI is the VCC associated with the input port.
F. VCCO is the VCC associated with the output port.
G. All parameters and waveforms are not applicable to all devices.
50 kW
From Output
Under Test
1 MW
15 pF 15 pF
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
tPLH tPHL
0 V
VCCO/2
VCCI/2 VCCI/2
0.9 y VCCO
VCCO/2
tr
0.1 y VCCO tf
VCCI
Input
Output VOH
VOL
TXB0106-Q1
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................................................................................................................................................................................................ SCES791 – AUGUST 2009
Figure 3. Load Circuits and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com 30-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TXB0106IPWRQ1 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TXB0106-Q1 :
•Catalog: TXB0106
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TXB0106IPWRQ1 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TXB0106IPWRQ1 TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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