Data sheet OMNIMATE Signal - series BL/SL 3.50 SL-SMT 3.50/03/90F 3.2SN BK BX Weidmuller Interface GmbH & Co. KG Klingenbergstrae 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Product image Similar to illustration High-temperature-resistant male header, 3.50 mm pitch. * Plugging direction parallel (90), straight 180 or angled (135) to PCB * Housing variants: closed side (G), screw flange (F), solder flange (LF) or snap-on solder flange (RF) * Optimised for the SMT process * Pin length 3.2 mm universal for all soldering methods * Pin length 1.5 mm optimised for reflow soldering methods * Packed either in a box (BX) or tape-on-reel (RL) * Male header can be coded General ordering data Type Order No. Version GTIN (EAN) Qty. Product data Packaging SL-SMT 3.50/03/90F 3.2SN BK BX 1842090000 PCB plug-in connector, male header, Flange, THT/ THR solder connection, 3.50 mm, No. of poles: 3, 90, Solder pin length (l): 3.2 mm, tinned, black, Box 4032248353446 102 pc(s). IEC: 320 V / 15 A UL: 300 V / 10 A Box Creation date October 14, 2019 5:51:46 AM CEST Catalogue status 27.09.2019 / We reserve the right to make technical changes. 1 Data sheet OMNIMATE Signal - series BL/SL 3.50 SL-SMT 3.50/03/90F 3.2SN BK BX Weidmuller Interface GmbH & Co. KG Klingenbergstrae 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Technical data Dimensions and weights Width Height Height of lowest version Depth (inches) 17.5 mm 10.7 mm 7.5 mm 0.437 inch Width (inches) Height (inches) Depth Net weight Type of connection Pitch in mm (P) Outgoing elbow Number of solder pins per pole Solder pin length tolerance Solder pin dimensions Solder eyelet hole diameter (D) Outside diameter of solder pad L1 in mm Number of rows Touch-safe protection acc. to DIN VDE 57 106 Volume resistance Plugging cycles Pulling force/pole, max. Colour Insulating material group Insulation strength 0.689 inch 0.421 inch 11.1 mm 1.706 g System specifications Product family OMNIMATE Signal - series BL/SL 3.50 Mounting onto the PCB THT/THR solder connection Pitch in inches (P) 0.138 inch No. of poles 3 Solder pin length (l) 3.2 mm Tolerance of solder pin position 0.1 mm Solder pin dimensions = d tolerance 0 / -0,03 mm Solder eyelet hole diameter tolerance (D)+ 0,1 mm Template aperture diameter 2.1 mm L1 in inches 0.276 inch Pin series quantity 1 Touch-safe protection acc. to DIN VDE 0470 IP 10 Can be coded Yes Plugging force/pole, max. 6N Board connection 3.5 mm 90 1 0 / -0.3 mm d = 1.2 mm, Octagonal 1.4 mm 2.3 mm 7 mm 1 Safe from back-of-hand touch 4.50 m 25 6N Material data Insulating material Colour chart (similar) Comparative Tracking Index (CTI) Moisture Level (MSL) GWIT Contact material Layer structure of solder connection Storage temperature, min. Max. relative humidity during storage Operating temperature, max. Temperature range, installation, max. LCP GF RAL 9011 175 1 930 C CuSn 2-3 m Ni / 5-7 m Sn -25 C 80 % 100 C 100 C UL 94 flammability rating GWFI Contact surface Layer structure of plug contact Storage temperature, max. Operating temperature, min. Temperature range, installation, min. black IIIa 108 V-0 960 C tinned 2-3 m Ni / 5-7 m Sn 55 C -50 C -30 C Rated data acc. to IEC tested acc. to standard Rated current, max. no. of poles (Tu=20C) Rated current, max. no. of poles (Tu=40C) Rated voltage for surge voltage class / pollution degree III/2 Rated impulse voltage for surge voltage class/ pollution degree II/2 Rated impulse voltage for surge voltage class/ contamination degree III/3 IEC 60664-1, IEC 61984 12 A 10 A 160 V 2.5 kV 2.5 kV Rated current, min. no. of poles (Tu=20C) Rated current, min. no. of poles (Tu=40C) Rated voltage for surge voltage class / pollution degree II/2 Rated voltage for surge voltage class / pollution degree III/3 Rated impulse voltage for surge voltage class/ pollution degree III/2 Short-time withstand current resistance 15 A 13 A 320 V 160 V 2.5 kV 3 x 1s with 100 A Creation date October 14, 2019 5:51:46 AM CEST Catalogue status 27.09.2019 / We reserve the right to make technical changes. 2 Data sheet OMNIMATE Signal - series BL/SL 3.50 SL-SMT 3.50/03/90F 3.2SN BK BX Weidmuller Interface GmbH & Co. KG Klingenbergstrae 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Technical data Rated data acc. to CSA Institute (CSA) Rated voltage (Use group B / CSA) Rated current (Use group B / CSA) Reference to approval values 300 V 10 A Specifications are maximum values, details see approval certificate. Certificate No. (CSA) Rated voltage (Use group D / CSA) Rated current (Use group D / CSA) 200039-1176845 300 V 10 A Rated data acc. to UL 1059 Institute (UR) Rated voltage (Use group B / UL 1059) 300 V Rated current (Use group B / UL 1059) 10 A Reference to approval values Specifications are maximum values, details see approval certificate. Certificate No. (UR) E60693 Rated voltage (Use group D / UL 1059) 300 V Rated current (Use group D / UL 1059) 10 A Packing Packaging VPE width Box 110 mm VPE length VPE height 340 mm 100 mm EC002637 27-44-04-02 27-44-04-02 ETIM 7.0 eClass 9.1 UNSPSC EC002637 27-44-04-02 30-21-18-10 Classifications ETIM 6.0 eClass 9.0 eClass 10.0 Notes Notes * Gold-plated contact surfaces on request * Rated current related to rated cross-section & min. No. of poles. * Diameter of solder eyelet D = 1.4+0.1mm * Solder eyelet diameter D = 1.5 + 0.1 mm, from 9 poles * P on drawing = pitch * Rated data refer only to the component itself. Clearance and creepage distances to other components are to be designed in accordance with the relevant application standards. IPC conformity * For additional mechanical support for male connectors with screw flange (...F), we recommend an additional cable gland with fastening screws (sheet metal screw ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C - see Accessories). Cable gland only permitted before soldering. Conformity: The products are developed, manufactured and delivered according international recognized standards and norms and comply with the assured properties in the data sheet resp. fulfill decorative properties in accordance with IPC-A-610 "Class 2". Further claims on the products can be evaluated on request. Creation date October 14, 2019 5:51:46 AM CEST Catalogue status 27.09.2019 / We reserve the right to make technical changes. 3 Data sheet OMNIMATE Signal - series BL/SL 3.50 SL-SMT 3.50/03/90F 3.2SN BK BX Technical data Weidmuller Interface GmbH & Co. KG Klingenbergstrae 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Approvals Approvals ROHS Conform Downloads Approval/Certificate/Document of Conformity Brochure/Catalogue Engineering Data SMT white paper Declaration of the Manufacturer FL DRIVES EN MB SMT EN FL DRIVES DE MB DEVICE MANUF. EN CAT 2 PORTFOLIOGUIDE EN FL BUILDING SAFETY EN FL APPL LED LIGHTING EN FL INDUSTR.CONTROLS EN FL MACHINE SAFETY EN FL HEATING ELECTR EN FL APPL_INVERTER EN FL_BASE_STATION_EN FL ELEVATOR EN FL POWER SUPPLY EN FL 72H SAMPLE SER EN PO OMNIMATE EN SL-SMT.zip STEP Download Whitepaper Creation date October 14, 2019 5:51:46 AM CEST Catalogue status 27.09.2019 / We reserve the right to make technical changes. 4 Data sheet OMNIMATE Signal - series BL/SL 3.50 SL-SMT 3.50/03/90F 3.2SN BK BX Drawings Weidmuller Interface GmbH & Co. KG Klingenbergstrae 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Dimensional drawing Creation date October 14, 2019 5:51:46 AM CEST Catalogue status 27.09.2019 / We reserve the right to make technical changes. 5 Wave Solder Profile Recommended wave solderding profiles Weidmuller Interface GmbH & Co. KG Klingenbergstrae 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com Single Wave: 260 Contact time appr. 3 sec. 260 C 255 C 250 C 240 220 200 Temperature [C] 180 160 140 appr. 150 C Preheating 120 100 Cooling rate < 6 K/s 80 60 Typical process Prozess limits Temperature on board 40 Heating rate < 3 K/s 20 0 0 20 40 60 80 100 120 time [s] 140 160 180 200 220 240 Double Wave: 255 C Total contact time max. 10 sec. 260 240 260 C 250 C 220 200 Temperature [C] 180 160 140 appr. 150C Preheating 120 100 Cooling rate < 6 K/s 80 60 Typical process Process limits Temperature on board 40 Heating rate < 3 K/s 20 0 0 20 40 60 Wave soldering profiles 80 100 120 time [s] 140 160 180 200 220 240 Wired connection elements should be processed in accordance with the DIN EN 61760-1 standard. We have included two recommendations for practical wave soldering profiles, with which Weidmuller PCB terminals and connectors are qualified. When choosing a suitable profile for your application, the following factors also need to be considered: - PCB thickness - Proportion of Cu in the layers - Single/double-sided assembly - Product range - Heating and cooling rates The single and double wave profiles each indicate the recommended operating range, including the maximum soldering temperature of 260C. In practice, the maximum soldering temperature is quite often well below the above maximum profile. We reserve the right to make technical changes. Reflow Solder Profile Recommended reflow soldering profile Weidmuller Interface GmbH & Co. KG Klingenbergstrae 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com 300 254 C Temperature [C] 250 217 200 235 C Melting point lead-free solder paste 245 C 190 C approx. 60 s > 217 C 180 C 150 preheating Cooling rate: < 6 K/s 100 Heating rate: < 3 K/s 50 Continuous line: Typical process Dotted line: Process limits 0 0 50 100 150 200 250 300 350 Time [sec] Reflow soldering profile The perfect soldering profile for SMT Surface Mount Technology is one the most exiting question in SMT production. But there are more than one correct answer: The diagram of temperature-on-time is related to processing features of solder paste and to maximum load of components. We have to consider the following parameters: * Time for pre heating * Maximum temperature * Time above melting point * Time for cooling * Maximum heating rate * Maximum cooling rate We recommend a typical solder profile with associated process limits. With preheating components and board are prepared smoothly for the solder phase. Heating rate is typically +3K/s. In parallel the solder paste is activated'. The time above melting point of 217C the paste gets liquid and components and boards begin to connect. The maximum temperature of 245C to 254C should stay between 10 and 40 seconds. In the cooling phase at -6K/s solder is cured. Board and components cool down while avoiding cold cracks. We reserve the right to make technical changes.