SS103VD
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website: www.bitechnologies.com
May 6, 2009 page 2 of 3 BI technologies
TEMPERATURE COEFFICIENT OF RESISTANCE (TCR)
TCR Code (-55°C to 125°C) Q P S L
Absolute (ppm/°C) ± 25 ± 50 ± 100 ± 200
Tracking (R1 Ref) (ppm/°C) ± 5 ± 5 N/A N/A
POWER DERATING CURVE
ENVIRONMENTAL (MIL-R-83401)
Thermal Shock plus Power Conditioning ∆R 0.25%
Short Time Overload ∆R 0.1%
Moisture Resistance ∆R 0.2%
Mechanical Shock ∆R 0.25%
Vibration ∆R 0.25%
Low Temperature Operation ∆R 0.1%
High Temperature Exposure ∆R 0.1%
Resistance to Solder Heat ∆R 0.05%
Marking Permanency Per MIL-STD-202, Method 215
Storage Temperature Range -55°C to +125°C
MECHANICAL
Lead Plating 80/20 Tin Lead (Standard)
100 matte Tin (RoHS)
Lead Material Copper Alloy
Lead Configurations (SLP/SS1) No lead, Gull Wing
Lead Coplanarity (SS1 only) 0.003” (0.102 mm)
Substrate Material Silicon
Resistor Material Passivated Nichrome
Body Material Molded Epoxy
Package Types 6 pad SON 2mm square, 3 lead SOT23