HEXFET® MOSFET technology is the key to IR Hirel advanced
line of power MOSFET transistors. The efficient geometry and
unique processing of this latest “State of the Art” design
achieves: very low on-state resistance combined with high trans
conductance; superior reverse energy and diode recovery dv/dt
capability.
The HEXFET transistors also feature all of the well established
advantages of MOSFETs such as voltage control, very fast
switching and temperature stability of the electrical parameters.
They are well suited for applications such as switching power
supplies, motor controls, inverters, choppers, audio amplifiers
and high energy pulse circuits.
Absolute Maximum Ratings
Symbol Parameter Value Units
ID1 @ VGS = -10V, TC = 25°C Continuous Drain Current -11
A
ID2 @ VGS = -10V, TC = 100°C Continuous Drain Current -7.0
IDM @TC = 25°C Pulsed Drain Current -44
PD @TC = 25°C Maximum Power Dissipation 75 W
Linear Derating Factor 0.60 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy 207 mJ
IAR Avalanche Current -11 A
EAR Repetitive Avalanche Energy 7.5 mJ
dv/dt Peak Diode Recovery -5.5 V/ns
TJ Operating Junction and
°C
TSTG Storage Temperature Range
Lead Temperature 300 (0.063 in. (1.6mm) from case for 10s)
Weight 11.5 (Typical) g
-55 to + 150
PD- 90549E
IRF9130
JANTX2N6804
JANTXV2N68064
1 2019-07-29
Product Summary
Part Number BVDSS I
D
IRF9130 -100V -11A
RDS(on)

REPETITIVE AVALANCHE AND dv/dt RATED
HEXFET®TRANSISTORS
THRU-HOLE (TO-204AA)
Description
For footnotes refer to the page 2.
International Rectifier HiRel Products, Inc.
100V, P-CHANNEL
REF: MIL-PRF-19500/562
Features
Repetitive Avalanche Ratings
Dynamic dv/dt Rating
Hermetically Sealed
Simple Drive Requirements
ESD Rating: Class 1C per MIL-STD-750,
Method 1020
TO-3 (TO-204AA)
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International Rectifier HiRel Products, Inc.
Source-Drain Diode Ratings and Characteristics
Symbol Parameter Min. Typ. Max. Units Test Conditions
IS Continuous Source Current (Body Diode) ––– ––– -11
ISM Pulsed Source Current (Body Diode) ––– ––– -44
VSD Diode Forward Voltage ––– ––– -4.7 V TJ = 25°C,IS= -11A, VGS = 0V
trr Reverse Recovery Time ––– ––– 250 ns TJ = 25°C,IF = -11A,VDD 50V
Qrr Reverse Recovery Charge ––– ––– 3.0 µC di/dt = -100A/µs
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
A
Footnotes:
Repetitive Rating; Pulse width limited by maximum junction temperature.
VDD = -25V, starting TJ = 25°C, L= 3.4mH, Peak IL = -11A,VGS = -10V.
ISD  -11A, di/dt  -140A/µs, VDD  -100V, TJ 150°C. Suggested RG =7.5
Pulse width 300 µs; Duty Cycle 2%
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Symbol Parameter Min. Typ. Max. Units Test Conditions
BVDSS Drain-to-Source Breakdown Voltage -100 ––– ––– V VGS = 0V, ID = -1.0mA
BVDSS/TJ Breakdown Voltage Temp. Coefficient ––– -0.087 ––– V/°C Reference to 25°C, ID = -1.0mA
RDS(on) Static Drain-to-Source On-Resistance ––– ––– 0.30  VGS = -10V, ID2 = -7.0A 
––– ––– 0.36 VGS = -10V, ID1 = -11A 
VGS(th) Gate Threshold Voltage -2.0 ––– -4.0 V VDS = VGS, ID = -250µA
IDSS Zero Gate Voltage Drain Current ––– ––– -25 µA VDS = -80V, VGS = 0V
––– ––– -250 VDS = -80V,VGS = 0V,TJ =125°C
IGSS Gate-to-Source Leakage Forward ––– ––– -100 nA VGS = -20V
Gate-to-Source Leakage Reverse ––– ––– 100 VGS = 20V
QG Total Gate Charge ––– ––– 29
nC
ID1 = -11A
QGS Gate-to-Source Charge ––– ––– 7.1 VDS = -50V
QGD Gate-to-Drain (‘Miller’) Charge ––– ––– 21 VGS = -10V
td(on) Turn-On Delay Time ––– ––– 60
ns
VDD = -50V
tr Rise Time ––– ––– 140 ID1 = -11A
td(off) Turn-Off Delay Time ––– ––– 140 RG = 7.5
tf Fall Time ––– ––– 140 VGS = -10V
Ls +LD Total Inductance ––– 6.1 ––– nH
Measured from Drain lead (6mm /
0.25 in from package) to Source
lead (6mm/ 0.25 in from package)
Ciss Input Capacitance ––– 860 –––
pF
VGS = 0V
Coss Output Capacitance ––– 350 ––– VDS = -25V
Crss Reverse Transfer Capacitance ––– 125 ––– ƒ = 1.0MHz
Thermal Resistance
Symbol Parameter Min. Typ. Max. Units
RJC Junction-to-Case ––– ––– 1.67
°C/W
RJA Junction-to-Ambient (Typical socket mount) ––– ––– 30
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JANTX2N6804/JANTXV2N6804
International Rectifier HiRel Products, Inc.
Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 1. Typical Output Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
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JANTX2N6804/JANTXV2N6804
International Rectifier HiRel Products, Inc.
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 9. Maximum Drain Current Vs. Case Temperature Fig 10. Maximum Avalanche Energy
Vs. Drain Current
Fig 8. Maximum Safe Operating Area
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International Rectifier HiRel Products, Inc.
Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms
Fig 13b. Gate Charge Test Circuit
Fig 13a. Gate Charge Waveform
Fig 14b. Switching Time Waveforms
Fig 14a. Switching Time Test Circuit
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JANTX2N6804/JANTXV2N6804
International Rectifier HiRel Products, Inc.
Case Outline and Dimensions - TO-204AA (Modified TO-3)
www.infineon.com/irhirel
Infineon Technologies Service Center: USA Tel: +1 (866) 951-9519 and International Tel: +49 89 234 65555
Leominster, Massachusetts 01453, USA Tel: +1 (978) 534-5776
San Jose, California 95134, USA Tel: +1 (408) 434-5000
Data and specifications subject to change without notice.
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JANTX2N6804/JANTXV2N6804
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IMPORTANT NOTICE
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data contained herein is a characterization of the component based on internal standards and is intended to
demonstrate and provide guidance for typical part performance. It will require further evaluation, qualification and
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