CO LO & MP LI GE AN N T FR EE Features n High power ratings n Compatible with Pb and Pb-free solder reflow profiles n Low profile n RoHS compliant* and halogen free** *R oH S n Utilizes innovative freeXpansionTM design n Agency recognition: ** HA n Standard 3425 mils (8764 mm) footprint n Surface mount packaging for automated PL IA N T assembly *R oH S CO M MF-GSMF Series - PTC Resettable Fuses Electrical Characteristics Model Itrip FR EE I max. LE AD V max. Ihold at 23 C Volts 36 Amps 20 Amps 3.0 Environmental Characteristics 5.2 Max. Time To Trip at 23 C Ohms at 23 C Rmin 0.01 R1max 0.06 Amps 8.0 Seconds 20.0 Tripped Power Dissipation Watts at 23 C Typ. 1.5 Agency Recognition cUL TUV E174545 R50256634 3 3 Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * MF-GSMF300/36X Resistance Operating Temperature.......................................... -40 C to +85 C Recommended Storage........................................ +40 C max. / 70 % RH max. Passive Aging........................................................ +85 C, 1000 hours................................................ 5 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 1000 hours.............................. 5 % typical resistance change Thermal Shock...................................................... -40 C to +85 C, 20 times..................................... 10 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change (Marking still legible) Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change (Rmin<R<R1max) Condition A Moisture Sensitivity Level (MSL)........................... See Note ESD Classification - HBM...................................... 6 Test Procedures and Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 C.................................................. Rmin R R1max Time to Trip............................................................ At specified current, Vmax, 23 C........................... T max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold....................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles.......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... 245 C 5 C, 5 seconds....................................... 95 % min. coverage How to Order MF - GSMF 300 / 36X - 2 Typical Part Marking Represents total content. Layout may vary. Multifuse Product Designator (R) PART IDENTIFICATION: MF-GSMF300/36X = N Series GSMF = 3425 mils (8764 mm) Surface Mount Component Hold Current, Ihold 300 (3.0 Amps) Maximum Voltage, Vmax 36 = 36 Volts X = Multifuse(R) freeXpansionTM Design Packaging -2 = Tape and Reel Packaged per EIA-481 BI-WEEKLY DATE CODE WEEK 05 & 06 = C WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be "halogen free" if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Applications n Telematics with CAN, Bluetooth, WLAN, GPS and UMTS/LTE n Industrial controls n IEEE ports MF-GSMFSeries Series -- PTC PTC Resettable MF-NSMF ResettableFuses Fuses Product Dimensions A Model MF-GSMF300/36X DIMENSIONS: B C D E Min. Max. Min. Max. Min. Max. Min. Min. Max. 8.3 (0.327) 9.0 (0.354) 6.0 (0.236) 6.7 (0.264) 0.7 (0.028) 1.6 (0.063) 0.3 (0.012) 0.25 (0.010) 2.0 (0.079) MM (INCHES) Side View Top View A C Terminal material: ENIG-plated terminals Bottom View D E Recommended Pad Layout 1.0 (.039) 1.0 (.039) B 2.5 (.098) 2.0 (.079) Packaging Quantity 3,000 pcs. per reel Typical Time to Trip @ 23 C TIME TO TRIP (SECONDS) 100 Note: The Time to Trip curve represents typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. 10 1 0.1 1 10 100 FAULT CURRENT (AMPS) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-GSMF Series - PTC Resettable Fuses 3312 - 2 mm SMD Trimming Potentiometer Thermal Derating Table - Ihold (Amps) Model MF-GSMF300/36X Ambient Operating Temperature -40 C -20 C 0 C 23 C 40 C 50 C 60 C 70 C 85 C 4.00 3.55 3.20 3.00 2.60 2.35 2.05 1.75 1.35 Solder Reflow Recommendations Notes: tp TP * CRITICAL ZONE T L TO TP RAMP-UP * TL Temperature tL * Ts max * RAMP-DOWN Ts min * ts PREHEAT * * 25 * t 25 C TO PEAK Time MF-GSMF models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. Hand soldering is not recommended for these devices. All temperatures refer to the topside of the device, measured on the device body surface. If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit. Please refer to the Multifuse(R) Polymer PTC Resettable Fuse Soldering Recommendations document for more details. Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts max to Tp) PREHEAT: Temperature Min. (Tsmin) Process Temperature Max. (Tsmax) Materials Description Time (Tsmin to Tsmax) (ts) 3 C / second max. 150 C Temperature 1. Apply solder paste to * Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature test board (8 - 10 mil thick)ABOVE: Alloy water soluble or no TIME MAINTAINED clean solder paste Temperature (TL) (see note 1) Time (tL) * single sided epoxy glass (G10) (UL approved) Peak Temperature (Tp)* PC board approx. 4x4x.06 in. Time200 C Interval Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint's surface). 60~180 seconds Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): A) Acceptable (see Figure 1) 217 C (1) The solder connection wetting angle (solder to 60~150 seconds component and solder to PCB termination) 260 C does not exceed 90 . 2. Place units onto 6 units/board Timetest within 5 Cboard of Actual Peak Temperature (tp) 3. Ramp up Convection oven (see note 2) (2) Solder balls that do not violate minimum 20~40 secondselectrical clearances and are attached (soldered) to a metal surface. 2.5 C 0.5 /sec. 4. Preheat (TS) 90 30 sec. Ramp-Down Rate Timeabove 25 C to Peak 5. Time liquidus (TL) Temperature 150 C to 190 C 220 C 6. Peak temperature (TP) (1) Solder connection wetting angle exceeding 60-90 sec.8 minutes max. 90 . 250 C +0 /-5 10-20 sec. within 5 C of peak 7. Ramp down 8. Cleaning water clean profile 6 C / second max. B) Unacceptable (see Figure 2) High pressure deionized water 65 PSI max. Temperature of Lead/Pad Junction (Derived using 6-zone Convection Oven) MF-GSMF SERIES, REV. A, 04/19 (2) Incomplete reflow of solder paste. (3) Dewetting. Room temperature (see note 2) 3 C 0.5 C/sec. If unacceptable, determine cause and correct prior to next run. 72 F to 160 F (22 C to 71 C) As required NOTES: 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at lead/pad junction with "K" type thermocouple. 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see "worst case conditions". Specifications are subject to change without notice. 4. Ramp down rate to be measured from 245 C to Users should verify actual device performance in their specific applications. 150 C. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 5. Process Description 8 does not apply to open frame trimmers. MF-GSMFSeries Series -- PTC PTC Resettable MF-NSMF ResettableFuses Fuses Packaging Specifications MF-GSMF Series per EIA-481 10X = 40.0 0.10 (1.575 .004) 0.60 MAX. (.024) 1.50 +0.10 / -0 DIA. (.059 +.004 / -0) 4.00 0.10* (.157 .004) 2.00 0.05 (.079 .002) 7.50 0.05 (.295 .002) 16.00 0.30 (.630 .012) 12.10 MAX. (.476) 1.45 0.10 (.057 .004) 1.75 0.10 (.069 .004) COVER TAPE 9.30 0.10 (.366 .004) 0.10 MAX. (.004) 8.00 0.10 (.315 .004) 6.90 0.10 (.272 .004) 14.25 TYP. (.561) TRAILER MIN. 160 (6.30) LEADER MIN. 390 (15.35) 331 MAX. (13.03) 22.4* MAX. (.88) 50 MIN. (1.97) HUB DIA. 16.4 +1.0 / -0* (.646 +.039 / -0) *MEASURED AT HUB DIMENSIONS: MM (INCHES) Asia-Pacific: Tel: +886-2 2562-4117 * Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 * Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 * Email: americus@bourns.com www.bourns.com Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Bourns PPTC Resettable Fuses 3312 - (R)2 Multifuse mm SMD(R) Trimming Potentiometer Application Notice * Users are responsible for independent and adequate evaluation of Bourns(R) Multifuse(R) Polymer PTC devices in the user's application, including the PPTC device characteristics stated in the applicable data sheet. * Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user's application during the PTC selection and qualification process. * Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. * In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user's application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. * Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. * Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. * Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse(R) Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns(R) products manufactured by or on behalf of Bourns, Inc. and P[ZHSPH[LZJVSSLJ[P]LS)V\YUZ Unless otherwise expressly indicated in writing, Bourns(R) products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL<ZLYZZOV\SKJOLJRMVYHUKVI[HPU[OLSH[LZ[YLSL]HU[PUMVYTH[PVUHUK]LYPM[OH[Z\JOPUMVYTH[PVUPZJ\YYLU[ and complete before placing orders for Bourns(R) products. The characteristics and parameters of a Bourns(R) product set forth in its data sheet are based on laboratory conditions, and statements regarding the suitability of products for certain types of applications are based on Bourns' knowledge of typical requirements in generic applications. The characteristics and parameters of a Bourns(R)WYVK\J[PUH\ZLYHWWSPJH[PVUTH]HY MYVT[OLKH[HZOLL[JOHYHJ[LYPZ[PJZHUKWHYHTL[LYZK\L[VP[OLJVTIPUH[PVUVM[OL)V\YUZ(R) product with other components PU[OL\ZLYZHWWSPJH[PVUVYPP[OLLU]PYVUTLU[VM[OL\ZLYHWWSPJH[PVUP[ZLSM;OLJOHYHJ[LYPZ[PJZHUKWHYHTL[LYZVMH)V\YUZ(R) WYVK\J[HSZVJHUHUKKV]HYPUKPLYLU[HWWSPJH[PVUZHUKHJ[\HSWLYMVYTHUJLTH]HYV]LY[PTL<ZLYZZOV\SKHS^HZ]LYPM the actual performance of the Bourns(R)WYVK\J[PU[OLPYZWLJPAJKL]PJLZHUKHWWSPJH[PVUZHUKTHRL[OLPYV^UPUKLWLUKLU[ Q\KNTLU[ZYLNHYKPUN[OLHTV\U[VMHKKP[PVUHS[LZ[THYNPU[VKLZPNUPU[V[OLPYKL]PJLVYHWWSPJH[PVU[VJVTWLUZH[LMVY KPLYLUJLZIL[^LLUSHIVYH[VYHUKYLHS^VYSKJVUKP[PVUZ <USLZZ)V\YUZOHZL_WSPJP[SKLZPNUH[LKHUPUKP]PK\HS)V\YUZ(R) product as meeting the requirements of a particular industry Z[HUKHYKLN0:6;: VYHWHY[PJ\SHYX\HSPAJH[PVULN<3SPZ[LKVYYLJVNUPaLK)V\YUZPZUV[YLZWVUZPISLMVYHU MHPS\YLVMHUPUKP]PK\HS)V\YUZ(R)WYVK\J[[VTLL[[OLYLX\PYLTLU[ZVMZ\JOPUK\Z[YZ[HUKHYKVYWHY[PJ\SHYX\HSPAJH[PVU<ZLYZ of Bourns(R) products are responsible for ensuring compliance with safety-related requirements and standards applicable to [OLPYKL]PJLZVYHWWSPJH[PVUZ Bourns(R)WYVK\J[ZHYLUV[YLJVTTLUKLKH\[OVYPaLKVYPU[LUKLKMVY\ZLPUU\JSLHYSPMLZH]PUNSPMLJYP[PJHSVYSPMLZ\Z[HPUPUN HWWSPJH[PVUZUVYPUHUV[OLYHWWSPJH[PVUZ^OLYLMHPS\YLVYTHSM\UJ[PVUTHYLZ\S[PUWLYZVUHSPUQ\YKLH[OVYZL]LYLWYVWLY[ VYLU]PYVUTLU[HSKHTHNL<USLZZL_WYLZZSHUKZWLJPAJHSSHWWYV]LKPU^YP[PUNI[^VH\[OVYPaLK)V\YUZYLWYLZLU[H[P]LZ on a case-by-case basis, use of any Bourns(R)WYVK\J[ZPUZ\JO\UH\[OVYPaLKHWWSPJH[PVUZTPNO[UV[ILZHMLHUK[O\ZPZH[ [OL\ZLYZZVSLYPZR3PMLJYP[PJHSHWWSPJH[PVUZPUJS\KLKL]PJLZPKLU[PALKI[OL<:-VVKHUK+Y\N(KTPUPZ[YH[PVUHZ*SHZZ000 KL]PJLZHUKNLULYHSSLX\P]HSLU[JSHZZPAJH[PVUZV\[ZPKLVM[OL<UP[LK:[H[LZ )V\YUZL_WYLZZSPKLU[PALZ[OVZL)V\YUZ(R)Z[HUKHYKWYVK\J[Z[OH[HYLZ\P[HISLMVY\ZLPUH\[VTV[P]LHWWSPJH[PVUZVUZ\JO WYVK\J[ZKH[HZOLL[ZPU[OLZLJ[PVULU[P[SLK(WWSPJH[PVUZ<USLZZL_WYLZZSHUKZWLJPAJHSSHWWYV]LKPU^YP[PUNI[^V H\[OVYPaLK)V\YUZYLWYLZLU[H[P]LZVUHJHZLIJHZLIHZPZ\ZLVMHUV[OLY)V\YUZ(R)Z[HUKHYKWYVK\J[ZPUHUH\[VTV[P]L HWWSPJH[PVUTPNO[UV[ILZHMLHUK[O\ZPZUV[YLJVTTLUKLKH\[OVYPa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ourns(R)Z[HUKHYKWYVK\J[ZHYLUV[[LZ[LK[VJVTWS^P[O<UP[LK:[H[LZ-LKLYHS(]PH[PVU(KTPUPZ[YH[PVUZ[HUKHYKZNLULYHSS VYHUV[OLYNLULYHSSLX\P]HSLU[NV]LYUTLU[HSVYNHUPaH[PVUZ[HUKHYKHWWSPJHISL[VWYVK\J[ZKLZPNULKVYTHU\MHJ[\YLKMVY \ZLPUHPYJYHM[VYZWHJLHWWSPJH[PVUZ)V\YUZL_WYLZZSPKLU[PALZ)V\YUZ(R) standard products that are suitable for use in aircraft VYZWHJLHWWSPJH[PVUZVUZ\JOWYVK\J[ZKH[HZOLL[ZPU[OLZLJ[PVULU[P[SLK(WWSPJH[PVUZ<USLZZL_WYLZZSHUKZWLJPAJHSS HWWYV]LKPU^YP[PUNI[^VH\[OVYPaLK)V\YUZYLWYLZLU[H[P]LZVUHJHZLIJHZLIHZPZ\ZLVMHUV[OLY)V\YUZ(R) standard WYVK\J[PUHUHPYJYHM[VYZWHJLHWWSPJH[PVUTPNO[UV[ILZHMLHUK[O\ZPZUV[YLJVTTLUKLKH\[OVYPaLKVYPU[LUKLKHUKPZH[ the user's sole risk. ;OL\ZLHUKSL]LSVM[LZ[PUNHWWSPJHISL[V)V\YUZ(R) custom products shall be negotiated on a case-by-case basis by Bourns and the user for which such Bourns(R)J\Z[VTWYVK\J[ZHYLZWLJPHSSKLZPNULK(IZLU[H^YP[[LUHNYLLTLU[IL[^LLU)V\YUZ HUK[OL\ZLYYLNHYKPUN[OL\ZLHUKSL]LSVMZ\JO[LZ[PUN[OLHIV]LWYV]PZPVUZHWWSPJHISL[V)V\YUZ(R) standard products shall also apply to such Bourns(R) custom products. Users shall not sell, transfer, export or re-export any Bourns(R)WYVK\J[ZVY[LJOUVSVNMVY\ZLPUHJ[P]P[PLZ^OPJOPU]VS]L[OL KLZPNUKL]LSVWTLU[WYVK\J[PVU\ZLVYZ[VJRWPSPUNVMU\JSLHYJOLTPJHSVYIPVSVNPJHS^LHWVUZVYTPZZPSLZUVYZOHSS[OL\ZL Bourns(R)WYVK\J[ZVY[LJOUVSVNPUHUMHJPSP[^OPJOLUNHNLZPUHJ[P]P[PLZYLSH[PUN[VZ\JOKL]PJLZ;OLMVYLNVPUNYLZ[YPJ[PVUZ HWWS[VHSS\ZLZHUKHWWSPJH[PVUZ[OH[]PVSH[LUH[PVUHSVYPU[LYUH[PVUHSWYVOPIP[PVUZPUJS\KPUNLTIHYNVZVYPU[LYUH[PVUHS YLN\SH[PVUZ-\Y[OLY)V\YUZ(R) products and Bourns technology and technical data may not under any circumstance be exported or re-exported to countries subject to international sanctions or embargoes. Bourns(R) products may not, without WYPVYH\[OVYPa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bilingual versions are available at: Web Page: http://www.bourns.com/legal/disclaimers-terms-and-policies PDF: http://www.bourns.com/docs/Legal/disclaimer.pdf *9