Ver. 201207 Multilayer Power Inductor CIG22B_MLE Series (2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter RECOMMENDED LAND PATTERN FEATURES LGA Type : Bottom Terminal Type High Current Magnetically shielded structure Saving upper space in shield case Optimizing SMT area DIMENSION Type 22 Dimension [mm] L W BW T 2.50.15 2.00.15 0.90.1 0.60.2 DESCRIPTION Size Inductance DC Rated Current (A)1 Rated Current (A)2 (inch/mm) (uH)@3MHz Resistance() Typ. Max. CIG22B1R5MLE 1008/2520 1.5 20 % 0.1525 % 1.60 1.00 CIG22B2R2MLE 1008/2520 2.2 20 % 0.1725 % 1.30 0.9 CIG22B3R3MLE 1008/2520 3.3 20 % 0.2225 % 0.90 0.8 CIG22B4R7MLE 1008/2520 4.7 20 % 0.2625 % 0.70 0.7 Part no. Rated Current (A)1: DC current value when Inductance drops to 30% of nominal Inductance value (ONLY REFERENCE) Rated Current (A)2: DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25) Operating temperature range: -40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201207 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 22 (3) B (4) Chip Inductor Dimension Inductance (4R7:4.7uH,2R2:2.2uH) LGA Type Packaging(C:paper tape, E:embossed tape) 4R7 (5) M (6) L (7) E (8) (2) Power Inductor (4) Product Series (B:High Current Type& Low Profile) (6) Tolerance (M:20%) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.