Ver. 201207
Part no. Size
(inch/mm) Inductance
(uH)@3MHz DC
Resistance(Ω)Rated Current (A)
＊1
Typ. Rated Current (A)
＊2
Max.
CIG22B1R5MLE 1008/2520 1.5 ±20 % 0.15±25 % 1.60 1.00
CIG22B2R2MLE 1008/2520 2.2 ±20 % 0.17±25 % 1.30 0.9
CIG22B3R3MLE 1008/2520 3.3 ±20 % 0.22±25 % 0.90 0.8
CIG22B4R7MLE 1008/2520 4.7 ±20 % 0.26±25 % 0.70 0.7
※Rated Current (A)
＊1
:DC current value when Inductance dropsto 30% of nominal Inductance value (ONLY REFERENCE)
※Rated Current (A)
＊2
:DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
Type Dimension [mm]
L W T BW
22 2.5±0.15 2.0±0.15 0.9±0.1 0.6±0.2
DESCRIPTION
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG22B_MLE Series (2520/ EIA 1008)
LGA Type :Bottom Terminal Type
High Current
Magnetically shielded structure
Saving upper space in shield case
Optimizing SMT area
Ver. 201207
CI G 22 B 4R7 M L E
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (B:High Current Type& Low Profile)
(5) Inductance (4R7:4.7uH,2R2:2.2uH) (6) Tolerance (M:±20%)
(7) LGA Type
(8) Packaging(C:paper tape, E:embossed tape)
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 3,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
