MS5803-30BA Miniature 30 bar Module
DA5803-30BA_007 ww.meas-spec.com August. 25, 2014
000058031759 ECN2319 1/18
• High resolution module, 0.5 mbar
• Fast conversion down to 1 ms
• Low power, 1 µA (standby < 0.15 µA)
• Integrated digital pressure sensor (24 bit ΔΣ ADC)
• Supply voltage 1.8 to 3.6 V
• Operati n g ra n g e: 0 to 30 bar, -40 to +85 °C
• I2C and SPI interface (Mode 0, 3)
• No external components (Internal oscillator)
• Excell ent long term stability
• Hermetically sealable for outdoor devices
•
High Endurance (HE version)
DESCRIPTION
The MS5803-30BA is a new generation of high resolu tion pressure sens ors with SPI and I2C bus interface. The
MS5803-30A HE is the hig h endur anc e pa d tec hn ol og y versi on of the MS5803-30BA pres sur e s ensor module. It
is optimized for depth measurement systems with a water depth resolution of 2.5cm and below. The sensor
module includes a high linear pressure sensor and an ultra low power 24 bit ΔΣ ADC with internal factory
calibrated c oef f ic ients. It provides a prec ise d ig ita l 24 Bit pres s ure a nd temperatur e value a nd dif ferent opera tion
modes that allow the user to optimize for conversion speed and current consumption. A high resolution
temperature output allows the implementation of a depth measurement systems and thermometer function
without an y addition al sensor. T he MS5803-30BA can be interfac ed to any mic rocontroller. T he communic ation
protocol is simple, without the need to programming internal registers in the device. The gel protection and
antimagnet ic stainles s steel c ap mak e the module water resistant. T his new sensor module generat ion is bas ed
on leading MEMS techn ology and latest benefits from MEAS Switzer land's proven ex perience a nd know-how in
high volume manufacturing of pressure modules have been widely used for over a decade. This sensing
principle employed leads to very low hysteresis and high stability of both pressure and temperature signal.
FEATURES
FIELD OF APPL ICATION TECHNICAL DATA
Mobile water depth measurements systems Sensor Performances (VDD = 3 V)
Diving computers
Pressure
Min
Typ
Max
Unit
Adventure or multi-mode watches
High endurance pad technology (HE version)
Range 0 30 bar
FUNCTIONAL BLOCK DIAGRAM
VDD
GND
PS
SCLK
SDO
SDI/SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
PGA
CSB
ADC 24 bit
Resolution (1)
2.5 / 1.5 / 1 / 0.75
/ 0.5
mbar
Accuracy 0°C to +40°C,
0 to 6 bar (2)
-50 +50 mbar
Accuracy -40°C to + 85°C
0 to 6 bar (2)
-100 +100 mbar
Response time
0.5 / 1.1 / 2.1 / 4.1 /
8.22
ms
Long term stabilit y -50 mbar/yr
Temperature Min Typ Max Unit
Range -40 +85 °C
Resolution <0.01 °C
Accuracy -0.8 +0.8 °C
Notes: (1) Oversampling Rat i o: 256 / 512 / 1024 / 2048 / 4096
(2) With autozero at one press ure point
MS5803-30BA Miniature 30 bar Module
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PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Supply voltage
VDD
-0.3
+4.0
V
Storage temperature
TS
-40
+125
°C
Overpressure
Pmax
ISO 6425
50
bar
Maximum Soldering
Temperature
Tmax 40 sec max 250 °C
ESD rating
Human Body
Model
-4 +4 kV
Latch up
JEDEC standard
No 78
-100 +100 mA
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Operating Supply voltage
VDD
1.8
3.0
3.6
V
Operating Temperature
T
-40
+25
+85
°C
Supply current
(1 sample per sec.) IDD
OSR 4096
2048
1024
512
256
12.5
6.3
3.2
1.7
0.9
µA
Peak supply current
during conversion
1.4
mA
Standby supply current
at 25°C
0.02
0.14
µA
VDD Capacitor
From VDD to GND
100
nF
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output Word
24
bit
Conversion time tc
OSR 4096
2048
1024
512
256
7.40
3.72
1.88
0.95
0.48
8.22
4.13
2.08
1.06
0.54
9.04
4.54
2.28
1.17
0.60
ms
MS5803-30BA Miniature 30 bar Module
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PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Operating Pressure Range
Prange
Full Accuracy
0
30
bar
Absolute Accuracy,
Temperature range 0 … 40 °C
0 … 6 bar
0 … 20 bar
0 … 30 bar
-50
-100
-250
+50
+100
+250
mbar
Absolute Accuracy,
Temperature range -40 … 85 °C
0 … 6 bar
0 … 20 bar
0 … 30 bar
-100
-200
-400
+100
+200
+400
mbar
Maximum error with supply
voltage (1)
VDD = 1.8 V … 3.6 V +/-50 mbar
Long-term stability
-50
mbar/yr
Resolution RMS
OSR 4096
2048
1024
512
256
0.5
0.75
1
1.5
2.5
mbar
(1) With autozero at 3V point
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Absolute Accuracy
0 …10 bar
-20..85°C
-40..85°C
-0.8
-2.0
-4.0
+0.8
+2.0
+4.0
°C
Maximum error with supply
voltage(1)
VDD = 1.8 V … 3.6 V +/-0.5 °C
Resolution RMS
OSR 4096
2048
1024
512
256
0.002
0.003
0.005
0.008
0.012
°C
(1) With autozero at 3V point
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PERFORMANCE SPECIFICATIONS (CONT INUED)
DIGITAL INPUTS (PS, CSB, DIN, SCLK, SDA, SCL)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Serial data cloc k
SCLK
SPI protocol
20
MHz
Serial data clock
SCL
I2C protocol
400
kHz
Input high volta ge
VIH
Pins CSB
80% VDD
100% VDD
V
Input low voltage
VIL
0% VDD
20% VDD
V
Input leakage cur rent
I
leak25°C
at 25°c
0.15
µA
CS low to first SCLK rising
tCSL
21
ns
CS low from last SCLK falling
tCSH
21
ns
DIGITAL OUTPUTS (DOUT, SDA, SCL)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output high voltage
VOH
Isource = 0.6 mA
80% VDD
100% VDD
V
Output low voltage
VOL
Isink = 0.6 mA
0% VDD
20% VDD
V
Load capacitan ce
CLOAD
16
pF
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PERFORMANCE CHARACTERISTICS
PRESSURE ERROR VS PRESSURE AND TEMPERATURE
-500.00
-400.00
-300.00
-200.00
-100.00
0.00
100.00
200.00
300.00
400.00
500.00
05000 10000 15000 20000 25000 30000
Pressure error [mbar]
Pressure [m bar]
Absol ut e pressure accur acy wit h 2nd order compensat i on
Typical
85
25
-40
-400.0
-300.0
-200.0
-100.0
0.0
100.0
200.0
300.0
400.0
-40 -20 020 40 60 80
Pressure error [mbar]
Temperat ur e [°C]
Pressure accuracy vs t em perat ure
Typical
30000mbar
2nd order
14000 mbar
2nd order
30000 mbar
1st order
14000mbar
1st order
TEM PERAT U RE ER RO R VS TEMPERATURE
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
-40 -20 020 40 60 80
Temperature error [°C]
Temperat ur e [°C]
Temperat ur e accur acy vs temperat ure
Typical
30000mbar
2nd order
1000 mbar
2nd order
30000mbar
1st or der
1000 mbar
1st or der
PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY
-50.0
-30.0
-10.0
10.0
30.0
50.0
1.8 22.2 2.4 2.6 2.8 33.2 3.4 3.6
Pr essure er ro r [ mbar ]
Supply Voltage [V]
Pressure err or vs suppl y vol t age at 25°C
Typical
1000 m bar
4000 m bar
6000 m bar
14000 m abr
-0.5
-0.3
-0.1
0.1
0.3
0.5
1.8 22.2 2.4 2.6 2.8 33.2 3.4 3.6
T emper atu re er r or [ °C]
Supply Voltage [V]
Temperat ure er r or vs supply vol t age at 25°C
Typical
1000 m bar
4000 m bar
6000 m bar
14000 m bar
MS5803-30BA Miniature 30 bar Module
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FUNCTIONAL DESCRIPTION
Figure 1: Block diagr am of MS5803-30BA
GENERAL
The MS5803-30BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5803-30BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure
sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every m odule is indi viduall y factor y calibrated at t wo t em peratures and two press ures. As a result, 6 c oeff icients
necessary to compensate for process variations and temperature variations are calculated and stored in the
128-bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the
microcontroller software and used in the program converting D1 and D2 into compensated pressure and
temperature values.
The 2 coefficients W0 and W7 are for factory configuration and CRC.
SERIAL INTERFACE
The MS5803-30BA has built in two t ypes of seria l interfaces : SPI and I2C. P ulling the Protoc ol Select p in PS to
low selects the SPI protocol, pulling PS to high activates the I2C bus protocol.
Pin PS
Mode
Pins used
High
I2C
SDA, SCL, CSB
Low
SPI
SDI, SDO, SCLK, CSB
SPI MODE
The ext ernal m icrocontroll er clock s in the data throu gh the i nput SCL K (Seria l CLoc K) and SDI (Serial Data In) .
In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor
responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the
interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the
command is sent or after the end of the command execution (for example end of conversion). The best noise
performance from the module is obtain ed when t he SPI bus is qui et a nd witho ut c ommunication to ot her devices
during the ADC conversion in progress.
VDD
GND
PS
SCLK / SCL
SDO
SDI / SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interfa ce IC
PGA
CSB
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I2C MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta).
The sens or res ponds on th e sam e pin SDA wh ich is bidirecti onal f or the I2C bus i nterfac e. So this interface type
uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In
I2C-Mode the com plement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to
use two sensors with two different addresses on the I2C bus. The pin CSB shall be connected to VDD or GND
(do not leave unconnected!).
Pin CSB
Address (7 bits)
High
0x76 (1110110 b)
Low
0x77 (1110111 b)
COMMANDS
The MS5803-30BA has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Size of each c ommand is 1 byte (8 bits ) as described in the tab le below. After AD C read commands the device
will return 24 bit result and after the PROM read 16bit result. The address of the PROM is em bedded inside of
the PROM read command using the a2, a1 and a0 bits .
Command by te
hex value
Bit number
0
1
2
3
4
5
6
7
Bit name PRM COV - Typ Ad2/
Os2
Ad1/
Os1
Ad0/
Os0
Stop
Command
Reset
0
0
0
1
1
1
1
0
0x1E
Convert D1 (OSR=256)
0
1
0
0
0
0
0
0
0x40
Convert D1 (OSR=512)
0
1
0
0
0
0
1
0
0x42
Convert D1 (OSR=1024)
0
1
0
0
0
1
0
0
0x44
Convert D1 (OSR=2048)
0
1
0
0
0
1
1
0
0x46
Convert D1 (OSR=4096)
0
1
0
0
1
0
0
0
0x48
Convert D2 (OSR=256)
0
1
0
1
0
0
0
0
0x50
Convert D2 (OSR=512)
0
1
0
1
0
0
1
0
0x52
Convert D2 (OSR=1024)
0
1
0
1
0
1
0
0
0x54
Convert D2 (OSR=2048)
0
1
0
1
0
1
1
0
0x56
Convert D2 (OSR=4096)
0
1
0
1
1
0
0
0
0x58
ADC Read
0
0
0
0
0
0
0
0
0x00
PROM Read
1
0
1
0
Ad2
Ad1
Ad0
0
0xA0 to
0xAE
Figure 2: Comm and stru cture
MS5803-30BA Miniature 30 bar Module
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PRESSURE AND TEMPERATU RE C ALCUL ATION
Size
[1]
[bit] min max
C1
Pressure sensitivity | SENS
T1
unsigned int 16 16 065535 29112
C2
Pressure offset | OFF
T1
unsigned int 16 16 065535 26814
C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 065535 19125
C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 065535 17865
C5
Reference temperature | T
REF
unsigned int 16 16 065535 32057
C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 065535 31305
D1
Digital pressure value unsigned int 32 24 016777216 4944364
D2
Digital temperature value unsigned int 32 24 016777216 8198974
dT
Difference between actual and reference temperature
[2]
dT = D2 - T
REF
= D2 - C5 * 2
8
signed int 32 25 -16776960 16777216 -7618
1971
= 19.71 °C
OFF
Offset at actual temperature
[3]
OFF
=
OFF
T1
+
TCO
*
dT =
C2
*
2
16
+
(C4
*
dT)
/
2
7
signed int 64 41 -8589672450 12884705280 1756219057
SENS
Sensitivity at actual temperature
[4]
SENS
=
SENS
T1
+
TCS
*
dT
=
C1 * 2
15
+
(C3
*
dT)
/
2
8
signed int 64 41 -4294836225 6442352640 953372897
59998
= 5999.8 mbar
Notes
[1]
[2]
[3]
[4]
Calculate temperature compensated pressure
8500
-4000
TEMP
41
Convert calibration data into coefficients (see bit pattern of W1 to W4)
Variable
Example /
Typical
Value
Recommended
variable type
Descript ion | Equation
signed int 32
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP
=
20°C
+
dT
*
TEMPSENS
=
2000
+
dT
*
C6
/
2
23
Read digital pressure and temperature data
signed int 32
Temperature compensated pressure (0…30bar with
0.1mbar resolution)
P = D1 * SENS - OFF = (D1 * SENS / 2
21
- OFF) / 2
13
min and max have to be defined
min and max have to be defined
min and max have to be defined
Maximal size of intermediate result during evaluation of variable
300000
0
58
P
Start
Maximum values for calculation results:
P
MIN
= 0mbar P
MAX
= 30bar
T
MIN
= -40°C T
MAX
= 85°C T
REF
= 20°C
Read calibration data (factory calibrated) from PROM
Read digital pressure and temperature data
Calculate temperat ure
Calculate temperat ure compensated pressure
Display pressure and t em perature value
Figure 3: Flow chart for pressure and temperature reading and software compensation.
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SECOND ORDER TEMPERATURE CO MPENS ATIO N
Yes
No
SENS2 = 5 ⋅ (T EMP – 2000)
2
/ 2
3
SENS = SENS - SENS2
TEMP<20°C
Low temperature
OFF2 = 1 ⋅ (TEMP – 2000)
2
/ 2
4
OFF2 = 3 ⋅ (TEMP – 2000)
2
/ 2
1
OFF = OFF - OFF2
TEMP = TEMP - T2
Low temperature
High temperature
Calculate pressure and temperature
TEMP<-15°C
No
Yes
OFF2 = OFF2 + 7 ⋅ (TEMP + 1500)
2
Low temperature
Very low temperature
SENS2 = 0
T2 = 3 ⋅ dT
2
/ 2
33
T2 = 7 ⋅ dT
2
/ 2
37
SENS2 = SENS2 + 4 ⋅ (TEMP + 1500)
2
Figure 4: Flow chart for pressure and temperature to the optimum accuracy.
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SPI INTERFACE
RESET SEQUENCE
The Res et s e que nce s ha ll be s en t o nc e af ter po wer -on to make sur e that th e c a li bratio n PRO M ge ts lo ad ed into
the internal register. It can be also used to reset the device ROM from an unknown condition
Figure 5: Reset command sequenc e SPI (mode 0)
Figure 6: Reset command sequence SPI (mode 3)
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
2.8ms RELOAD
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CONVERSION SEQUENC E
The conver sion com m and is used to init iate uncom pens ated press ure (D1) or unc om pensated tem per ature (D2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the con version, using ADC read comm and the result is clock ed out with the MSB f irst. If the convers ion is
not execut ed bef ore the ADC r ead comm and, or the A DC read c omm and is r epeated, it wil l give 0 as the o utput
result. If the ADC read c ommand is s ent during c onversion the r esult will be 0, the con version will not stop and
the final resu lt will be wrong. Convers ion sequ ence sent dur ing the alre ady starte d conversion pr ocess will yield
incorrect result as well.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
8.22ms ADC CONVERSION
Figure 7: Conversion out sequence, Typ=d1, OSR = 4096
Figure 8: ADC Read sequence
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the
calibrati on PROM and to c alculate the calibration coefficients. T here are in tota l 8 address es resulting in a total
memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and
address 7 conta ins t he ser ial co de and CRC. T he comm and s equence is 8 b its l ong with a 16 bit resul t whic h is
clocked with the MSB first.
Figure 9: PROM Read sequence, address = 011 (Coefficient 3).
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I2C INTERFACE
COMMANDS
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5803-30BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does
not have a microcontroller inside, the commands for I2C and SPI are quite similar.
RESET SEQUENCE
The reset can be sent at any time except when the power on did not work it could be possible that the
acknowledge blocks the SDA. When SDA is blocked by an undefined state the only way to get the
MS5803-30BA to work is to send a power on reset.
1
1
1
0
1
1
CSB
0
0
0
0
0
1
1
1
1
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
Figure 10: I2C Reset Command
CONVERSION SEQUENC E
A convers ion can be started b y sendin g the comm and to MS5803-30BA. W hen command is sent to the s ystem
it stays busy until conver sio n is don e. When convers io n is f inishe d t he d ata can be acces s ed b y sendi ng a R ead
command, when an acknowledge appears from the MS5803-30BA, you may then send 24 SCLK cycles to get
all result bits. Every 8 bit the system waits for an acknowledge signal.
1
1
1
0
1
1
CSB
0
0
0
1
0
0
1
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
command
cmd byte
Device Address
Device Address
Figure 11: I2C Command to initiate a pressure conversion (OSR=4096, ty p=D 1)
1
1
1
0
1
1
CSB
0
0
0
0
0
0
0
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
command
Device Address
Device Address
cmd byte
Figure 12: I2C ADC read sequence
Figure 13: I2C pressure response (D1) on 24 bit from MS5803-30BA
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PROM READ SEQUENCE
The PROM Read command consists of two parts. First command sets up the system into PROM read mode.
The second part gets the data from the system.
Figure 14: I2C Command to read memory address= 011 (Coefficient 3)
Figure 15: I2C answer from MS5803-30BA
CYCLIC REDUNDANCY CHECK (CRC)
MS5803-30BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The application note AN520 describes in detail CRC-4 code used.
A
d
d
D
B
1
5
D
B
1
4
D
B
1
3
D
B
1
2
D
B
1
1
D
B
1
0
D
B
9
D
B
8
D
B
7
D
B
6
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
0
16 bit reserved for manufacturer
1
Coefficient 1 (16 bit unsigned)
2
Coefficient 2 (16 bit unsigned)
3
Coefficient 3 (16 bit unsigned)
4
Coefficient 4 (16 bit unsigned)
5
Coefficient 5 (16 bit unsigned)
6
Coefficient 6 (16 bit unsigned)
7
CRC
Figure 16: Memory PROM mapping
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APPLICATION CIRCUIT
The MS5803-30BA is a circuit that can be used in conjunction with a microcontroller in mobile depth-meter
applicat ions. It is desig ne d for low-voltage systems with a supply voltage of 3 V.
Figure 17: Typical application circuit with SPI / I2C prot o col comm uni cat ion
MS5803-30BA
MS5803-30BA
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PACKAGE OUTLINE AND PIN CONFIGURATION
TOP view
Pin Name Type Function
1
SCLK
I
Serial data clock
2 GND G Ground
3 CSB I Chip Sel ect (active low)
4 NC NC -
5 VDD P Positive supply voltage
6 PS I
Communication protocol select
SPI / I2C
7 SDI/SDA
I S eri al dat a input
8 SDO O Seri al data output
Figure 18: MS5803-30BA package outline s, pin con fig ur ati o n and descri ption
Notes: (1) Dimensi ons in mm
(2) General tolerance ±0. 1
(3) Cap centering ± 0.15 from center of the ceramic
RECOMMENDED PAD LAYOUT
8 1
7 2
6 3
5 4
5 4
6 3
7 2
8 1
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SHIPPING PAC KA GE
Tube
Tape & reel
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MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering issues.
MOUNTING
The MS5803-30BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacu um. Due to the l o w str ess as sembl y the sens or does not show pressur e hyst eres is ef fects.
It is impor tant to so lder al l contact pads .
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important
for applications in watches and other special devices.
SEALING WITH O-RINGS
In products like outdoor watches the electronics must be protected against direct water or humidity. For those
products the MS5803-30BA provides the possibility to seal with an O-ring. The protective cap of the
MS5803-30BA is made of special anticorrosive stainless steel with a polished surface. In addition to this the
MS5803-30BA is f illed with silico ne gel c overin g the s ens or and th e bond ing wires. The O -ring (or O-ri ngs) s hall
be placed at the outer diameter of the metal cap. This method avoids mechanical stress because the sensor can
move in vertical direction.
CLEANING
The MS5803-30BA has been manufactured under cleanroom conditions. It is therefore recommended to
assem ble the sens or under class 10 ’000 or b etter co nditions. Should this not be poss ible, it is recom mended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The
MS5803-30BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used
during the assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A minimum 100nF ceramic
capacitor must be placed as close as possible to the MS5803-30BA VDD pin. This capacitor will stabilize the
power supply during data conversion and thus, provide the highest possible accuracy.
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ORDERING INFORMATION
Part Number / Art. Number
Product
Delivery Form
MS580330BA01-00
MS5803-30BA Miniature Module
Tube
MS580330BA01-50
MS5803-30BA Miniature Module T&R
Tape & Reel
MS580330BA06-00
MS5803-30BA Miniature Module HE
Tube
MS580330BA06-50
MS5803-30BA Miniature Module HE T&R
Tape & Reel
FACTORY CONTACT S
EUROPE
ASIA
NORTH AMERICA
MEAS Switzerland Sàrl
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: + 41 32 847 9569
e-mail: sales.chameas-spec.com
Website: www.meas-spec.com
Measurement Specialties (China), Ltd.
No. 26 Langshan Road
Shenzhen High-Tech Park (North)
Nanshan District, Shenzhen, 518057
China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
e-mail: pfg.cs.asiaameas-spec.com
Website: www.meas-spec.com
Measurement Specialties
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
e-mail: pfg.cs.amerameas-spec.com
Website: www.meas-spec.com
The information i n this sheet has been carefully reviewed and is believed to be accurate; however, no responsibility is assumed for
inaccuracies. Furtherm ore, this i nformation does not convey to the purchaser of such devices any license under the patent rights to the
manufacturer. Measurement Specialties, Inc. reserves the right t o make changes without furt her notice to any product herein. Measurement
Specialti es, Inc. makes no warranty, represent ation or guarant ee regarding the sui t abi lit y of its product for any particular purpose, nor does
Measurement Specialties, Inc. assume any liability arisi ng out of the applicati on or use of any product or circuit and specifically disclaims
any and all liabilit y, includi ng without limitation consequential or incidental damages. Typical paramet ers can and do vary in different
applicat i ons. All operat i ng parameters must be validated for each customer applic at i on by customer’s technical experts. Measurement
Specialti es, Inc. does not convey any lic ense under its patent rights nor the rights of others.
