TANTALUM CAPACITORS
In order to meet the user need of miniaturization and high performance of mobile communication
equipment, we have developed the fillet-less surface mounted tantalum chip capacitor which is
considered for not only miniaturization / low profile but also mounting area.
Tantalum chip capacitors are used in digital mobile communication equipment, such as mobile
phone and PHS, and mobile AV equipment, such as digital video camera, digital still camera and mini-
disk player. The tantalum chip capacitors corresponding fillet-less surface mounting will contribute to
the micro-miniaturizing and higher performance of these mobile multimedia equipment.
1. Original face-down terminal structure makes possible of the miniaturization of components and
also mounting area because land dimensions can be designed almost the same size as the
terminal. Also, as it can form micro fillet, checking at mounting is possible.
2. In addition to the 1608 and 2012 size, 3216L and 3528L size are added to the series. These
correspond to a wide range capacitance of 4.7-220µF.
3. Standardized the height of the product to 1.1 mm (low profile) for all 2012 size to 3528L size.
4. The most suitable for high performance miniaturized mobile equipment such as DVC, DSC,
mobile phone, and PHS.
5. Type 251’s M case (face-down terminal, 1608 size) and S case (face-down terminal, 2012 size)
are registered products with JEITA / Electronic Devices Registration Center’s registration
system of surface-mount devices.
6. Lead free products.
Catalog number (1)
251 M 4001 226 M _1
251 M 4001 476 M _1
251 M 4001 107 M _1
251 M 4001 227 M _1
251 M 6301 106 M _1
251 M 6301 226 M _1
251 M 6301 336 M _1
251 M 6301 476 M _1
251 M 6301 107 M _1
251 M 6301 157 M _1
251 M 1002 475 M _1
251 M 1002 106 M _1
251 M 1002 156 M _1
251 M 1002 226 M _1
251 M 1002 476 M _1
251 M 1002 686 M _1
4
4
4
4
6.3
6.3
6.3
6.3
6.3
6.3
10
10
10
10
10
10
85°C
4.6
7.2
11.5
125
°C
3
4.8
7.6
22
47
100
220
10
22
33
47
100
150
4.7
10
15
22
47
68
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
M
S
A
B
M
S
S
A
B
B
M
S
S
A
B
B
20°C
0.9
1.9
4
8.8
0.6
1.4
2.1
3.0
6.3
9.5
0.5
1
1.5
2.2
4.7
6.8
85°C
18
38
80
176
6
14
21
30
63
95
5
10
15
22
47
68
125
°C
22
47
100
220
7.9
17
26
37
79
118
6.3
13
19
28
59
85
-55°C20°C85°C
125
°C
0.30
0.30
0.30
0.30
0.15
0.16
0.30
0.20
0.20
0.30
0.12
0.16
0.16
0.20
0.20
0.20
0.106
0.15
0.15
0.15
0.08
0.08
0.15
0.10
0.10
0.15
0.06
0.08
0.08
0.10
0.10
0.10
0.30
0.30
0.30
0.30
0.15
0.16
0.30
0.20
0.20
0.30
0.12
0.16
0.16
0.20
0.20
0.20
0.30
0.30
0.03
0.03
0.15
0.16
0.30
0.20
0.20
0.30
0.12
0.16
0.16
0.20
0.20
0.20
4
4
2
1
8
4
4
2
1
1
10
4
4
2
1
1
Rated
Voltage
VDC
ESR
Ω
100kHz
Surge voltage
VDC
Tolerance
±%
Capacitance
µF
Case
Code
(2)
Max dissipation factorMax DC Lct. µA
(1)
_
1 : No code for single item. Put code “R” for taping specification.
(2) A and B Case are under development.
ITEM CHARACTERISTICS
Failure rate level
Operating temperature
Rated voltage
Capacitance range
Capacitance tolerance
1%/1000h (M)
-55 ~ +125°C (voltage derating when exceeding +85°C)
When +125°C, 2/3✕RV
4-6.3-10 VDC
4.7 ~ 220 µF
±20%(M)
Case
Size
M
S
A
B
Case
Code
1608
2012
3216L
3528L
L±0.1
1.6
2.0
3.2
3.5
W±0.1
0.85
1.25
1.6
2.8
T±0.1
0.8
1.1
1.1
1.1
P
1±
0.1
0.5
0.5
0.8
0.8
P
2±
0.1
0.65
1.05
1.65
1.95
C±0.1
(mm)
0.75
0.9
1.2
2.2
L
P1P1P2
W
T
C
Table-1
FEATURES
CHARACTERISTICS
CATALOG NUMBERS AND RATINGS
DIMENSIONS
/// ///// /////
/// ///// /////
“
20
251M 6.3VDC-10µF M-case
20%
Capacitance
change(%)
Capacitance
change(%)
Dissipation factor Impedance&ESR(Ω)
0%
-20%
-40%
-60%
-80%
-100%
1000
100
10
1
0.1
0.001 0.01 0.1 1 10 100
Frequency(kHz) 1,000 10,000
100,000 1,000,000
0
-20
-40
-60
-80
-100
Phase angle(deg)
12
10
8
6
4
2
0
-2
-4
-6
-8
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
-60
-60 -40 -20 0 20 40 60 80 100 120
020406080
100 120
-40 -20 0 20 40
Temperature (°C)
Temperature (°C)
Leakage current (µA)
Temperature (°C)
60 80 100 120
100
10
1
0.1
0.01
0.001
MAX
Xbar
MIN
Capacitance
change
Phase angle
Impedance
ESR
FREQUENCY CHARACTERISTICS
TEMPERATURE CHARACTERISTICS
251M 6.3VDC-10µF M-case
TEST ITEM
NO
PERFORMANCE TEST METHOD
Leakage Current (µA)
1Shall not exceed 0.01CV or 0.5 whichever
is greater Applied voltage: Rated voltage for 5
minutes
Substrate Bending
Test
7
Initial value to remain steady during measurement.
There shall be no evidence of mechanical damage.
Bend: 1mm
Capacitance
2
Characteristics
at High and
Low
Temperature
Leakage Current (µA)
Capacitance
Dissipation Factor
4
Surge
5
Shear (formerly adhesion) Test
6
Step 1
Shall be within tolerance of the nominal
value specified.
Shall not exceed the value in No 1.
Shall be within tolerance of the nominal value specified.
Shall not exceed the value in Table 1.
Temperature: 20±2°C
Leakage Current (µA)
Capacitance
Dissipation Factor
Step 3 Shall not exceed the value in No 1.
Within ±2% of the value in Step 1.
Shall not exceed the value in Table 1.
Temperature: 20±2°C
Leakage Current (µA)
Capacitance
Dissipation Factor
Step 6 Shall not exceed the value in No 1.
Within ±2% of the value in Step 1.
Shall not exceed the value in Table 1.
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed the value in No 1.
Within ±15% of the value before the test.
Shall not exceed the value in Table 1.
There shall be no evidence of mechanical
damage.
No exfoliation between lead terminal and
board.
Temperature: 20±2°C
Temperature, Applied voltage: half of the samples each
•85±2°C, rated voltage×1.15
•125±2°C, 2/3×rated voltage×1.15
Series protective resistance: 1000Ω
Discharge resistance: 1000Ω
Vibration
8Capacitance
Visual Examination
Initial value to remain steady during
measurement.
There shall be no evidence of mechanical
damage.
Frequency range: 10-55Hz
Total swing width:1.5mm
Vibration direction: 3 directions with
mutually right-angled.
Duration: 2 hours in each of these mutually
perpendicular directions (total of 6 hours)
Mounting: Solder terminal to the printed board
Resistance to
Soldering Heat
11
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed the value in No 1
Within ±15% of the value before the test.
Shall not exceed the value in Table 1.
There shall be no evidence of mechanical damage.
IR Reflow
Preheat: 130-160°C, approx. 60seconds
Reflow: 200°C, <60seconds max 260°C
Number of reflow: 2
Rapid Change of
Temperature
12
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed 2 times value shown in No 1.
Within ±15% of the value before the test.
Shall not exceed 150% of the value in Table 1.
There shall be no evidence of mechanical
damage.
Step 1: -55±3°C 30±3minutes
Step 2: 25 (-5/+10) °C, 3minutes or less
Step 3: 125±2°C, 30±3minutes
Step 4: 25 (-5/+10) °C, 3minutes or less
Number of cycle: 5
Damp heat,
Steady state
13
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed 2 times value shown in No 1.
Within ±15% of the value before the test.
Shall not exceed 150% of the value in Table 1.
There shall be no evidence of mechanical
damage. Marking shall be clear.
Temperature: 40±2°C
Moisture: 90-95%R.H.
Duration: 500 (-0/+24) hours
Endurance
14
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed 2 times value shown in No 1.
Within ±15% of the value before the test.
Shall not exceed 150% of the value in Table 1.
There shall be no evidence of mechanical
damage. Marking shall be clear.
Temperature, applied voltage:
85±2°C, DC rated voltage or
125±3°C, 2/3×rated voltage
Duration: 2000 (-0/+72) hours
Series resistance: do not exceed 3Ω
Samples are mounted with the following conditions.
•Indirect heating method (reflow)
•
Temperature: 240±10°C/Time: 10seconds or less
Applied pressure: 5N
Duration: 10±1seconds
Shock (specified pulse)
9
There shall be no intermittent contact of 0.5ms
or greater, short, or open. Nor shall there be
any spark discharge, insulation breakdown, or
evidence of mechanical damage.
Peak acceleration: 490m/s2
Duration: 11ms
Wave form: Half-sine
Solderability
10 Solder shall stick well on the terminal. (No
pinhole, damp, and solder repel) Solder temperature: 235±5°C
Dipping time: 2±0.5seconds
Dipping depth: Capacitor terminal shall be
dipped into melted solder
Leakage Current (µA)
Capacitance
Dissipation Factor
Step 4
Shall not exceed 0.1CV or 5 whichever is greater.
For rated voltage 4V or less, shall not exceed 0.2CV.
Within -0/+10% of the value in Step 1.
Shall not exceed the value in Table 1.
Temperature: 85±2°C
Leakage Current (µA)
Capacitance
Dissipation Factor
Step 5
Shall not exceed 0.125CV or 6.3 whichever is greater.
For rated voltage 4V or less, shall not exceed 0.25CV.
Within -0/+15% of the value in Step 1.
Shall not exceed the value in Table 1.
Temperature: 125±2°C
Voltage: 125°C voltage derating
Capacitance
Dissipation Factor
Capacitance
Visual Examination
Step 2 Within -15/+0% of the value in Step 1.
Shall not exceed the value in Table 1. Temperature: -55±3°C
Dissipation Factor
3Shall not exceed the value in Table 1.
Frequency: 120Hz ±20%
Voltage: 0.5Vrms+1.5-2VDC
PERFORMANCE AND TEST METHOD
Rated voltage
4VDC
6.3VDC
10VDC
Marking
4001
6301
1002
Case
Size
M
S
A
B
Case
Code
1608
2012
3216L
3528L
a
0.50min
0.50min
0.80min
0.80min
b
0.65
0.8
1.1
2.1
c
0.65
1.05
1.65
1.95
Mask thickness
100µm
100µm
100µm
100µm
(mm)
Rated voltage VDC
Rated voltage code
4
G
6.3
J
10
A
Rated capacitance µF
Rated capacitance code
1
A
1.5
E
2.2
J
3.3
N
4.7
S
6.8
W
Code
φ180 Reel
R
Anode notation
Feed hole side:
-
Capacitance
4.7µF
10µF
15µF
22µF
33µF
47µF
68µF
100µF
150µF
220µF
Marking
475
106
156
226
336
476
686
107
157
227
ITEM
Tantalum element
Tantalum wire
Manganese dioxide
Graphite
Silver paste
Sub electrode
+ terminal
- terminal
Mold resin
MATERIAL
Tantalum
Tantalum
Manganese dioxide
Carbon
Silver
Tantalum
Nickel alloy
Nickel alloy
Epoxy resin
MEMO
Tin-plating
Tin-plating
251 M 6301 106 M R
TYPE FAILURE
RATE RATED
VOLTAGE CAPACITANCE CAPACITANCE
TOLERANCE STYLE OF
REELED PACKAGE
(Taping Specification)
Rated voltage (1)
Polarity (anode notation)
Polarity (anode notation)
(1)
(3)Refer “ORDERING INFORMATION”
(2)
Mark of rated capacitance except above: _(1/10), _(×10)
(e.g. J indicates 0.22 (J(2.2)×1/10))
Manufacturing date code
Capacitance (3)
Rated voltage (1)
Capacitance (2)
Polarity (anode notation)
Polarity (anode notation)
Manufacturing date code
Rated voltage
Capacitance (3)
[M Case (1608)] [S Case (2012)]
[A Case (3216L)] [B Case (3528L)]
ca
b
Mold resin Graphite
Manganese dioxide
Tantalum element
Silver paste
- terminal
Tantalum wire
Sub electrode
+ terminal
In order to increase the self alignment effect for appropriate soldering, it is recommended that land be almost the same size as terminal of capacitor,
and space between lands (c) nearly equal to the space between terminals or slightly smaller.
ORDERING INFORMATION
CONFIGURATION (M, S CASE)
RECOMMENDED PAD DIMENSIONS
MARKING
Application Notes for Tantalum Capacitors
1. Operating Voltage
Tantalum capacitors shall be operated at the rated voltage or lower.
Rated voltage: Maximum value of DC voltage which can apply continuously to
capacitor’s terminals at rated temperature
Surge voltage: The voltage which can apply instantaneously to capacitors at rated
temperature or maximum high temperature. Also, the voltage which can endure 1000
times cycle through 1000Ω of series resistance for 30 seconds at 6 minutes cycle.
When designing the circuit, the equipment’s required reliability must be considered
and appropriate voltage derating must be performed.
2. Applications that contain AC Voltage
Special attention to the following 3 items.
(1) The sum of the DC bias voltage and the positive peak value of the AC voltage
should not exceed the rated voltage.
(2) Reverse voltage should not exceed the allowable values of the negative peak AC
voltage (refer page 3).
(3) Ripple voltage should not exceed the allowable values (refer page 4).
3. Permissible Reverse Voltage
To avoid an increase in failure rate and changes in leakage current, reverse voltage
should be kept below the values listed in the following table. In order to avoid the
reverse voltage exceeding allowable value, add bias voltage when necessary.
Note: The above information in the table applies to circuits with incidental reverse
voltage being applied.
For constant reverse voltage in a circuit, a non-polar device is always recommended.
4. Permissible Ripple Voltage
Permissible ripple voltage is determined by the heat loss of the element and heat
radiation of the lead wire, and is influenced by capacitance, ESR, operating
temperature, and frequency of ripple. Please consult Matsuo’s Engineering Bulletin for
details on calculating permissible ripple current values.
5. Low Impedance Applications
The failure rate of a low impedance circuit at 0.1Ω/V is about five times greater than
that of 1Ω/V circuit. To curtail this higher failure rate, the operating voltage of tantalum
capacitors used in low impedance circuits, such as filters for power supplies
(particularly switching power supplies) or for noise by-passing, should be derated to
less than half of the rated voltage (favorably, 1/3).
6. Non Polar Application
Tantalum capacitors can be used as a non-polar unit if two capacitors are connected
“BACK-TO-BACK” in a circuit when reverse voltage is applied at more than permissible
value or in a purely AC circuit. Please pay attention to the following points when
connecting two capacitors “BACK-TO-BACK”.
Ripple Voltage: Permissible Ripple Voltage shall not exceed the value allowed for
either C1 or C2.
Capacitance: C1 × C2
C1 + C2
Leakage Current:If terminal A is (+), the Leakage Current will be equal to C1’s
Leakage Current.
If terminal B is (+), the Leakage Current will be equal to C2’s
Leakage Current.
7. Soldering
7.1. Pre-heating
To obtain optimal reliability, lowering the heat shock during the soldering process is
favorable. Capacitors should be pre-heated at 130-160°C for approximately 60 seconds.
7.2. Soldering
The body of the capacitor should not exceed 260°C during soldering.
(1) Reflow Soldering
Reflow soldering is a process in which the capacitors are mounted on a printed
board with solder paste.
Two methods of Reflow Soldering: Direct Heat and Atmospheric Heat
· Direct Heat (Hot Plate)
During the Direct Heat method, the capacitor has been positioned on a
printed board, which is then placed on a hot plate. The capacitor maintains a
lower temperature than the printed board, which in turn stays at a lower
temperature than the hot plate.
· Atmospheric Heat
a) VPS(Vapor Phase Soldering)
During VPS, the printed board is heated by inert liquid with a high boiling
point. The temperature of the capacitor’s body and the temperature of the
printed board are about the same as the atmosphere. Please set this
temperature below 240°C.
b) Near and Far IR Ray
Due to the heat absorption of the capacitor’s body, the internal temperature
of the capacitors may be 20-30°C higher than the setting temperature and
may exceed 260°C. To prevent the capacitor’s internal temperature from
exceeding 260°C, temperature of the oven shall be set lower, or perform air
or nitrogen circulation (refer to the next item C) at the same time.
c) Convection Oven
An infrared ray is the main source of heat in this process. The temperature of
the printed board and the capacitors can be maintained at similar level by
the circulation of heated air, or inert gas.
(2)Soldering Iron
Soldering with a soldering iron cannot be recommended due to the lack of consistency in
maintaining temperatures and process times. If this method should be necessary, the iron
should never touch the capacitors’ terminals, and the temperature of the soldering iron
should never exceed 290°C. The application of the iron should not exceed 3 seconds.
(3) Please consult Matsuo’s Sales Department for other methods.
8. Solvent Cleaning
Cleaning by organic solvent may damage capacitor’s appearance and performance. However, our
capacitors are not effected even when soaked at 20-30°C 2-propanol for 5 minutes. When introducing
new cleaning methods or changing the cleaning term, please consult Matsuo’s Sales Department.
9. Protective Resin Coating
If molded with resin coating after assembly on printed board, the heat generated by resin
causes it to harden, and the inner stress caused by temperature change after hardenings may
cause failure. Sufficient advance test shall be done before selecting resin or buffer coating.
10. Vibration
When a capacitor is dropped to a concrete floor from 1 meter height, approximately 2940m/s2
shall be applied to the capacitor. Although capacitors are made to withstand this drop test,
stress from falling shock can cause damage to the capacitors and may increase the failure rate.
11. Ultrasonic Cleaning
Ultrasonic cleaning under severe condition may break terminals. Also, from an electrical
characteristics aspect, it is unfavorable. Therefore, please do not use ultrasonic cleaning
if possible. If the Ultrasonic cleaning process will be used, please note the following:
(1)The solvent should not be boiled. (Lower the ultrasonic wave output or use a
solvent with the high boiling point)
(2)The recommended wattage is less than 0.5 watts per cm2.
(3)The cleaning time should be kept to a minimum. Also, samples must be shook.
Please consult Matsuo’s Sales Department before use.
12. Additional Notes
· When connecting two or more capacitors in series, connect the resistors in parallel
to share the voltage evenly to each capacitor.
· Cutting of capacitor’s wrapping material must not be done because of the limitation
of the mounting space.
· During a customer’s aging process, voltage should remain under the capacitor’s
rated voltage at all times.
· Capacitors should never be touched or manipulated while operating.
· Capacitors should not be dismantled.
· When testing capacitors, please examine the power source before conducting tests
to insure the tester’s polarity. When checking by applying electrode while turning on
electricity, please do not touch the polarity of other components.
· In the event of a capacitor burning, smoking, or emitting an offensive smell during
operation, please cut the power supply or unplug. Keep away from the burned
capacitor.
· When capacitors are shorted, they become very hot and tantalum capacitor
elements may ignite. It may burn the printed circuit board and other parts.
· Capacitors should be stored at room temperature under normal humidity and
packaged to avoid direct sunlight and dust. Capacitors exceeding shelf life shall be
disposed of.
· Equipment with capacitors shall be stored at normal temperature and humidity. If
they are operated in a humid environment, they should be moisture proof. Avoid
condensation on capacitors. Capacitors shall be coated under the operation in
active gasses so that the gasses will not touch the capacitors directly. Capacitors
should not be operated in environments containing acids and alkalis.
· When capacitors are disposed of as “scrap” or waste, they should be treated as
Industrial Waste since they contain various metals and resin.
· Capacitors submitted as samples should not be used for equipment coming onto
the market. We provide samples for only specific purpose (configuration sample,
check for electric characteristics, etc.).
Specifications on this catalog are subject to change without prior notice. Also, since this catalog is designed
for providing general information, please inquire of our Sales Department to confirm specifications prior to use.
Ambient Temperature 25°C
Permissible Reverse
Voltage or 0.5V whichever is greater.
R. V. × 10%
55°C
R. V. × 6%
85°C
R. V. × 3%
125°C
R. V. × 1%
AC1
++
--
C2B
Head Office
Export Dep.
USA
URL
3-5-3 Sennari-cho, Toyonaka-shi, Osaka 561-8558, Japan
Takara Bldg., 8-7 Toyotsu-cho, Suita-shi, Osaka 564-0051, Japan
Matsuo Electronics of America, Inc.
2134 Main Street, Suite 200, Huntington Beach, CA 92648
http://www.ncc-matsuo.co.jp/
Please feel free to ask our Sales Department for more information of the Tantalum Capacitors.
Tel : 06-6332-0871
Tel : 06-6337-6450
Tel : 714-969-2491
Fax : 06-6331-1386
Fax : 06-6337-6456
Fax : 714-960-6492
