Technical Data 4140 Effective August 2017
Supersedes September 2011
Product features
•Low profile shielded drum core
•9.5 mm x 8.3 mm x 3.0 mm surface mount
inductor
•Ferrite core material
•Inductance range from 2.7 µH to 100 µH
•Current range from 0.8 A to 6.6 A
•Frequency range up to 1 MHz
Applications
•Storage temperature range (component):
-40 °C to +125 °C
•Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•Solder reflow temperature:
J-STD-020 (latest revision) compliant
SD8328
Low profile shielded drum core power inductors
•Buck or boost inductor
•Noise filtering output filter chokes
•Notebook and laptop power/display
•LCD Monitors/displays/televisions
•Battery chargers, LCD bias supplies
•Battery and Industrial power systems
•Computer, DVD and media players
•Portable power devices
•DC-DC converters
Environmental data
Pb HALOGEN
HF
FREE
2
SD8328
Low profile shielded drum core power inductors
www.eaton.com/electronics
Technical Data 4140
Effective August 2017
Product specifications
Dimensions-mm
Packaging information-mm
Rated OCL1Irms2Isat3DCR mΩDCR mΩ
Part Number Inductance (µH) µH±30% (A) (A) @ +20 °C Typ @ +20 °C Max K-factor4
SD8328-2R5-R 2.5 2.7 6.6 4.5 12 15.6 43
SD8328-3R3-R 3.3 3.4 6.1 4.0 14 18.0 33
SD8328-4R7-R 4.7 5.0 4.5 3.6 19 24.7 23
SD8328-7R3-R 7.3 7.6 3.4 2.9 30 39 15
SD8328-100-R 10 9.1 3.3 2.6 36 45 11
SD8328-150-R 15 14.5 2.35 2.0 53 69 7.2
SD8328-220-R 22 21.1 1.85 1.7 76 99 4.9
SD8328-330-R 33 31.9 1.45 1.4 120 156 3.3
SD8328-470-R 47 44.9 1.30 1.2 150 194 2.3
SD8328-680-R 68 64.2 0.98 1.0 220 286 1.6
SD8328-101-R 100 97.0 0.80 0.8 330 430 1.1
1. Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc.
2. Irms: DC current for an approximate ΔT of 40 °C without core loss. Derating is necessary for AC
currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating
components will affect the temperature rise. It is recommended that the temperature of the part
not exceed +125 °C under worst case operating conditions verified in the end application.
3. Isat Amps peak for approximately 35% rolloff (@ +25 °C)
4. K-factor: Used to determine Bp-p for core loss (see graph).
Bp-p = K*L*ΔI, Bp-p (mT), K: (K factor from table), L: (Inductance in µH), ΔI
(Peak to peak ripple current in Amps).
5. Part Number Definition: SD8328-xxx-R
SD8328 = Product code and size; -xxx = Inductance value in µH;
R = decimal point; If no R is present, third character equals number of zeros.
-R suffix = RoHS compliant
RECOMMENDED PCB LAYOUT SCHEMATIC
1
2
9.5
max
8.3
max3.0
max
2.5
typ 1.2
typ
6.3
typ
XXX
wwlly R
TOP VIEW FRONT VIEW
BOTTOM VIEW
5.7
2.9
1.8
1
2
LEFT VIEW
Part Marking: xxx = Inductance value in μH. (R = Decimal point). If no R is present, third character = number of zeros wwlly - or - wwllyy = Date code R = Revision level
Do not route traces or vias underneath the inductor
Supplied in tape-and-reel packaging, 1280 parts per reel, 13” diameter reel.
3
www.eaton.com/electronics
Technical Data 4140
Effective August 2017
SD8328
Low profile shielded drum core power inductors
Temperature rise vs total loss
Core loss vs Bp-p
Inductance characteristics
100kHz
200kHz
300kHz
500kHz
1MHz
0.0001
0.001
0.01
0.1
1
10
1101001000
Bp-p (mT)
Core Loss (W)
160
140
120
100
80
60
40
20
0
0.0 0.2 0.4 0.6 0.8 1.0
Total Power Loss (W)
Temperature Rise (ºC)
OCL Vs. Isat
120.0%
100.0%
80.0%
60.0%
40.0% +85 Deg.C
+25 Deg.C
20.0% -40 Deg.C
0.0%
0.0% 20.0% 40.0% 60.0% 80.0% 100.0% 120.0%
% Isat
% OCL
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4140 BU-SB111112
August 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
VolumeVolume
Package mm3mm3
Thickness <350 _
>350
<2.5mm 235°C220°C
_
>2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
3°C/ Second Max. 3°C/ Second Max.
183°C217°C
60-150 Seconds60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate Tsmaxto Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Technical Data 4140
Effective August 2017
SD8328
Low profile shielded drum core power inductors