Datasheet Sensor for Heart Rate Monitor ICs Optical Sensor for Heart Rate Monitor IC BH1792GLC General Description Key Specifications BH1792GLC is optical sensor for heart rate monitor IC in which LED driver, green light and IR detection photodiode are incorporated. This device drives LED and provides the intensity of light reflected from body. LED brightness can be adjusted by LED driver current. The photodiode having the high sensitivity for green light and excellent wavelength selectivity achieves accurate pulse wave detection. VCC Voltage Range: Current Consumption: Standby Mode Current: Operating Temperature Range: Package 2.5V to 3.6V 200A(Typ) 0.8A (Typ) -20C to +85C W(Typ) x D(Typ) x H(Max) WLGA010V28 2.8mm x 2.8mm x 1.0mm Features Build-in green photodiode with excellent wavelength selective green filter and IR curt filter. Built-in IR photodiode for touch detection. Correspond to high sampling frequency. (1024Hz) LED driver with current selection. I2C bus Interface(f/s mode support) Built-in FIFO Applications Wearable device, smart phone, Tablet PC. WLGA010V28 Typical Application Circuit IR LED VCC Green LED LED Driver LED1 LED2 LED Control LED Driver LED3 FIFO SCL Green IRCUT ADC ADC Control PD Interface (I2C+INT) ADC SDA Micro Controller INT(Note 1) ) PD POR TMONI GND Product structure : Silicon monolithic integrated circuit. This product does not include laser transmitter. This product includes Photo detector, ( Photo Diode ) inside of it. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 OSC (Note 1) Do not share INT pin with other IC. TEST This product has no designed protection against radioactive rays. This product does not include optical load. 1/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package.. ........................................................................................................................................................................................ 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Pin Configuration ............................................................................................................................................................................ 3 Pin Description................................................................................................................................................................................ 3 Block Diagram ................................................................................................................................................................................ 4 Description of Blocks ...................................................................................................................................................................... 4 Absolute Maximum Ratings .......................................................................................................................................................... 5 Thermal Resistance ........................................................................................................................................................................ 5 Recommended Operating Conditions ............................................................................................................................................. 6 Electrical Characteristics................................................................................................................................................................. 6 Power Sequence ............................................................................................................................................................................ 7 I2C Bus Timing Characteristics ....................................................................................................................................................... 8 I2C bus Communication .................................................................................................................................................................. 8 Typical Performance Curves ........................................................................................................................................................... 9 I2C bus Slave address .................................................................................................................................................................. 11 Register Map ................................................................................................................................................................................ 11 Control Sequence ......................................................................................................................................................................... 17 Application Example ..................................................................................................................................................................... 21 I/O equivalent circuit ..................................................................................................................................................................... 22 Operational Notes ......................................................................................................................................................................... 23 Ordering information ..................................................................................................................................................................... 25 Marking Diagram .......................................................................................................................................................................... 25 Optical design for the device......................................................................................................................................................... 25 Physical Dimension and Packing Information ............................................................................................................................... 26 Revision History ............................................................................................................................................................................ 27 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Pin Configuration TOP VIEW 1 VCC 9 SDA 10 SCL 2 GND 8 TMONI 3 LED1 7 TEST 4 LED2 5 LED3 6 INT Pin Description Pin No. Pin Name 1 VCC Power supply(Note 1) Function 2 GND Ground 3 LED1 LED1 driver output 4 LED2 LED2 driver output 5 LED3 LED3 driver output 6 INT 7 TEST 8 TMONI 9 SDA I2C bus serial data 10 SCL I2C bus serial clock Interrupt(Note 2) TEST pin (Connect to GND) TEST Monitor pin (open) (Note 1) Dispose a bypass capacitor as close as possible to the IC (Note 2) Do not share INT pin with other IC www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Block Diagram VCC LED Driver LED1 LED2 LED Driver LED3 LED Control FIFO SCL Green IRCUT ADC PD ADC Control Interface (I2C+INT) ADC SDA INT PD POR TMONI GND OSC TEST Description of Blocks IRCUT This filter passes visible light and blocks infrared light. GREEN Green color pass filter PD Photodiodes (PD) convert light into current. LED Driver LED driver circuit ADC AD converter OSC Internal oscillator generates clock for internal logic. POR Power on reset Interface (I2C+INT) I2C bus and interrupt pin Interface block ADC control AD converter control block LED control LED driver control block FIFO FIFO circuit www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Absolute Maximum Ratings (Ta=25C) Parameter Supply Voltage Terminal input Voltage1(Note 1) Symbol Rating Unit VCC_MR 4.5 V VIN_MR -0.3 to +4.5 V Terminal input Voltage2(Note 2) VLED_MR 7 V Storage Temperature Range Tstg -40 to +100 C Tjmax 100 C Maximum Junction Temperature (Note 1)INT, SCL, SDA pins (Note 2)LED1, LED2, LED3 pins Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit WLGA010V28 Junction to Ambient JA 319.5 182.1 C/W Junction - Top Characterization Parameter(Note 2) JT 102 65 C/W (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70m (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 and 3 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70m 74.2mm x 74.2mm 35m 74.2mm x 74.2mm 70m www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Topr -20 +25 +85 C Supply Voltage VCC 2.5 3.0 3.6 V Terminal Input Voltage (Note 1) VLED 0.7 - 5.5 V Operating Temperature (Note 1)LED1, LED2, LED3 pins Electrical Characteristics (Unless otherwise specified VCC=3.0V, Ta=25C, MSR=000) Parameter Symbol Min Typ Max Unit Supply Current ICC1 - 200 400 A No LED emitting Supply Current during LED current drive ICC2 - 1.4 3.0 mA LED emitting No input light Standby Mode Current Conditions ICC3 - 0.8 1.5 A DGREEN 3000 5100 7200 count EV=10uW/cm2 (Note 1) DIR 2500 4300 6000 count EV=200uW/cm2 (Note 2) Dark Count Value (Green Data) SGR_0 - - 200 count No input light Dark Count Value (IR Data) SIR_0 - - 200 count No input light Synchronized Signal Interval Tsync - 1 - s LED Emitting Time twlLED - 300 400 s LED Output Current ILED 1 2 3 mA LED pin input voltage = 1.0V LED_CURRENT=2mA Mode LED Off Leakage Current IOFF - 0 1 A LED terminal voltage = 5.0V OSC Cycle tOSC - 0.5 0.67 s L Input Voltage (Note 3) VIL - - 0.54 V Voltage(Note 3) VIH 1.26 - - V L Input Current(Note 3) VIL -10 - - A VIL=GND VIH - - 10 A VIH=VCC VOL 0 - 0.4 V IL=3mA Green Data Count Value IR Data Count Value H Input H Input Current(Note 3) L Output Voltage(Note 4) (Note 1) Green LED is used as optical source. (Note 2) IR LED is used as optical source. (Note 3) SDA, SCL pins (Note 4) SDA, INT pins www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Power Sequence (Unless otherwise specified VCC=3.0V, Ta=25C) There is a Power on reset function which monitors VCC power. All registers are reset by Power ON Reset function when power is supplied to VCC. tPSL VCC VCC(Min) 0.4V tPSC Undefined Behavior Command Acceptable VCC(Min) VCC(Min) VCC(Min) 0.4V 0.4V tCPS tPSC Command Acceptable Undefined Behavior Send Parameter Command input time after power-on Symbol Min Typ Max Unit tPSC 2 - - ms Power supply OFF time tPSL 1 - - ms Wait time from power down command tCPS 100 - - s RESET command Conditions tPSC after VCC power-on, command can be input. Internal condition becomes undefined when VCC is lower than recommended operating voltage range. In this case power off VCC once and power-on again. Please keep VCC Low (VCC<0.4V) more than tPSL before VCC power-on. Send RESET command before tCPS from power-off VCC. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 7/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC I2C Bus Timing Characteristics (Unless otherwise specified VCC=3.0V, Ta=25C) VIH VIH SDA P : STOP S : Repeated START S : START VIL VIL VIL S : START VIH VIH VIL tBUF tHD;STA tSU;DAT VIH SCL VIL tLOW tHD;STA VIH VIH VIL VIH VIH VIH VIL tHIGH tHD;DAT Parameter Symbol tSU;STA tSU;STO Min. Typ. Max. Units SCL Clock frequency fSCL 0 - 400 kHz `L' Period of the SCL Clock tLOW 1.3 - - s `H' Period of the SCL Clock tHIGH 0.6 - - s Setup Time for Repeated START tSU;STA 0.6 - - s Hold Time for START tHD;STA 0.6 - - s Data Setup Time tSU;DAT 100 - - ns Data Hold Time tHD;DAT 0 - - s Setup Time for STOP tSU;STO 0.6 - - s tBUF 1.3 - - s Bus Free Time between STOP and START Conditions I2C bus Communication 1. Write format (1) Indicate register address S W 0 Slave Address ACK Register Address ACK ACK Register Address ACK P (2) Write data after indicating register address S W 0 Slave Address Data specified at register address field ACK ACK Data specified at register address field + N ACK P NACK P NACK P 2. Read format (1) Read data after indicating register address (Master issues restart condition) S Slave Address W 0 ACK S Slave Address R 1 ACK Data specified at register address field + 1 ACK Register Address ACK Data specified at register address field ACK ACK Data specified at register address field + N (2) Read data from the specified register S Slave Address Data specified at register address field + 1 R 1 ACK ACK Data specified at register address field ACK from master to slave www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 ACK Data specified at register address field + N from slave to master 8/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC 1.0 1.0 0.8 0.8 Sensitivity Ratio Sensitivity Ratio Typical Performance Curves 0.6 0.4 0.6 0.4 0.2 0.2 0.0 0.0 400 500 600 700 800 400 900 1000 1100 500 Figure 1. Sensitivity Ratio vs Wavelength ("Green Spectral Response") 1.2 1.0 1.0 + Ratio Ratio 900 1000 1100 0.8 1pin 0.6 0.4 0.6 0.4 - 800 Figure 2. Sensitivity Ratio vs Wavelength ("IR Spectral Response") 1.2 - 700 Wavelength[nm] Wavelength[nm] 0.8 600 - - + + + 0.2 0.2 0.0 1pin 0.0 -90 -60 -30 0 30 Angle[deg] 60 90 -90 Figure 3. Green Ratio vs Angle ("Directional Characteristics 1") www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 -60 -30 0 30 Angle[deg] 60 90 Figure 4. Green Ratio vs Angle ("Directional Characteristics 2") 9/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Typical Performance Curves 1.2 1.2 1.0 1.0 0.8 - 1pin + Ratio Ratio 0.8 0.6 0.4 0.6 0.4 - + 0.2 0.2 0.0 0.0 -90 -60 -30 0 30 Angle[deg] 60 90 -90 Figure 5. IR Ratio vs Angle ("Directional Characteristics 1") www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 -60 - - + + -30 1pin 0 30 Angle[deg] 60 90 Figure 6. IR Ratio vs Angle ("Directional Characteristics 2") 10/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC I2C bus Slave address Slave address is"1011011". Register Map (Note 1) Register Address Register Name R/W D7 D6 D5 D4 D3 D2 0x0F MANUFACTURER_ID R MANUFACTURER_ID [7:0] 0x10 PART_ID R PART_ID[7:0] 0x40 RESET RW SW RESET 0 0 0 0 0x41 MEAS_CONTROL1 RW RDY 0 0 SEL_ ADC 0 0x42 MEAS_CONTROL2 RW LED_EN1[1:0] LED_CURRENT1[5:0] 0x43 MEAS_CONTROL3 RW LED_ EN2 LED_CURRENT2[5:0] 0x44 0x45 MEAS_CONTROL4 0 RW TH_IR[7:0] RW TH_IR[15:8] 0 D1 D0 0 0 MSR[2:0] 0x46 MEAS_CONTROL5 RW 0 0 0 0 0 0 0x47 MEAS_START RW 0 0 0 0 0 0 0 MEAS_ ST 0x48 MEAS_SYNC RW 0 0 0 0 0 0 0 MEAS_ SYNC 0x4B FIFO_LEV R 0 0 - - 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 FIFODATA0 FIFODATA1 IRDATA_LEDOFF IRDATA_LEDON GDATA_LEDOFF GDATA_LEDON INT_CLEAR FIFO_LEV[5:0] R FIFODATA0 [7:0] R FIFODATA0 [15:8] R FIFODATA1 [7:0] R FIFODATA1 [15:8] R IRDATA_LEDOFF [7:0] R IRDATA_LEDOFF [15:8] R IRDATA_LEDON [7:0] R IRDATA_LEDON [15:8] R GDATA_LEDOFF [7:0] R GDATA_LEDOFF [15:8] R GDATA_LEDON [7:0] R GDATA_LEDON [15:8] R - - INT_SEL[1:0] - - - - (Note 1) Do not write any commands to other addresses except above. Do not write `1' to the fields in which value is `0'in above table. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 11/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC (0x0F) MANUFACTURER_ID Fields MANUFACTURER_ID[7:0] Function Manufacturer ID : 0xE0 (0x10) PART_ID Fields PART_ID[7:0] Function Part ID : 0x0E (0x40) RESET Fields SWRESET Function Reset all registers when writing "1". "1" is not written in register. Read value is always" 0". default value 0x00 (0x41) MEAS_CONTROL1 Fields Function RDY 0 : Prohibited 1 : OSC block is active SEL_ADC Select channel of ADC measurement 0 : GREEN Measurement Mode LED1 and LED2 drivers are active. 1 : IR Measurement Mode Only in Non Synchronized Measurement Mode and Single Measurement Mode this mode can be used. LED3 driver is active. MSR[2:0] Select Measurement Mode default value 0x00 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 12/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC < MSR > Select measurement mode. Measurement mode LED Emitting Frequency 000 32Hz Mode 128Hz setting 32Hz setting Storing Tsync/32 Measurement time after receiving MEAS_SYNC 32 001 128Hz Mode 128Hz setting 128Hz setting Storing Tsync/128 128 010 64Hz Mode 256Hz setting 64Hz setting Storing Tsync/64 64 011 256Hz Mode 256Hz setting 256Hz setting Storing Tsync/256 256 100 Prohibited - - - - - 101 1024Hz Mode Non Synchronized Measurement Mode Single Measurement Mode 1024Hz setting 1024Hz setting Storing Tsync/1024 1024 4Hz setting 4Hz setting No storing - - - - No storing - - MSR 110 111 Output Data Rate FIFO storing FIFO_input_ cycle[ms] Synchronized Measurement Mode (MSR : 000 to 101) Adjust LED emitting frequency and output data rate by synchronizing with MEAS_SYNC received interval. After receiving MEAS_SYNC, the measurements for a set number of times are performed. After finishing measurements for a set number of times, measurement stops until receiving MEAS_SYNC. When starting measurement, LED emission is operated with default frequency. And start synchronized operation after receiving next MEAS_SYNC. Use the measurement value of after starting synchronized operation LED_CURRENT1and LED_CURRENT2 can be changed during measurement. The value becomes effective when receiving MEAS_SYNC. Send SWRESET first, in case of changing other registers above. Measurement data is stored in FIFO. FIFO can store 35 samples. Refer to FIFODATA0 and FIFODATA1 for data to store in FIFO. It becomes FULL condition when the number of samples reaches 35, and stop storing samples in FIFO. Water Mark Interrupt occurs when the number of samples reaches 32 or more. Refer INT_SEL for setting interrupt output of INT pin. After the interruption, read FIFO data before it becomes FULL condition. FIFO FULL Interrupt for water mark FIFO_LEV ... 31 32 33 34 35 INT Start read data less than (FIFO_input_cycle * 3). Non Synchronized Measurement Mode Measurement starts after receiving MEAS_ST. LED_CURRENT1 and LED_CURRENT2 can be changed during measurement. New value becomes effective when receiving MEAS_ST. Send SWRESET first, in case of changing other registers above. LED emitting frequency depends on OSC oscillation frequency. LED emitting frequency: (499968 * tosc) s Single Measurement mode Measurement starts after receiving MEAS_ST. Send SWRESET first, in case of changing registers. After finishing measurement, the measurement stops until receiving MEAS_ST. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 13/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC (0x42) MEAS_CONTROL2 Fields Function LED_EN1[1:0] Select the mode of LED driver LED_CURRENT1[5:0] Set the current of LED driver default value 0x00 (0x43) MEAS_CONTROL3 Fields Function LED_EN2 Select the mode of LED driver LED_CURRENT2[5:0] Set the current of LED driver default value 0x00 <LED_EN1/LED_EN2> Select the mode of LED driver LED_EN1[1:0] LED_EN2 00 x 01 x LED1 Pulsed Light Emission ON LED2 Pulsed Light Emission OFF LED3 Pulsed Light Emission OFF (Note 1) 10 0 OFF ON OFF (Note 2) 10 1 OFF OFF ON (Note 2) 11 0 ON ON OFF (Note 2) 11 1 ON OFF ON (Note 2) (Note 2) (Note 1) LED driver is selected by SEL_ADC. Use for measurement. (Note 2) This setting is for the operation check of LED. <LED_CURRENT1> Adjust the output current of LED1 and LED2 drivers. New parameters becomes effective when receiving MEAS_ST. <LED_CURRENT2> Adjust the output current of LED3 driver. New parameters becomes effective when receiving MEAS_ST. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 14/27 LED_CURRENT1[5:0] Current setting mode 0x00 Stop emission mode 0x01 1mA mode 0x02 2mA mode 0x03 3mA mode ... ... 0x09 9mA mode 0x0A 10mA mode 0x0B 11mA mode ... ... 0x3D 61mA mode 0x3E 62mA mode 0x3F 63mA mode LED_CURRENT2[5:0] Current setting mode 0x00 Stop emission mode 0x01 1mA mode 0x02 2mA mode 0x03 3mA mode ... ... 0x09 9mA mode 0x0A 10mA mode 0x0B 11mA mode ... ... 0x3D 61mA mode 0x3E 62mA mode 0x3F 63mA mode TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC (0x44/0x45) MEAS_CONTROL4 Fields TH_IR[15:0] Function IR Interrupt Threshold Value default value 0xFFFC (0x46) MEAS_CONTROL5 Fields INT_SEL[1:0] Function Select interrupt factor of INT pin INT pin outputs L when the interruption factor occurs. 00 : Disenable (No interrupt output) 01 : Water Mark interrupt of FIFO Interrupt when the stored sample number reaches 32 or more, and it's cleared when the number of sample falls below 32. 10 : IR threshold judgement interruption Use only in Non Synchronized Measurement Mode. Compare IRDATA_LEDON[15:4] and TH_IR[15:4] when updating data. Interruption occurs when IRDATA_LEDON[15:4] is TH_IR[15:4] or more. Interruption will be cleared when reading INT_CLEAR. 11 : Measurement completion interruption In Single Measurement Mode this is effective. Interrupt when the measurement finished. Interruption will be cleared when reading INT_CLEAR. default value 0x00 (0x47) MEAS_START Fields MEAS_ST Function Flag of start measurement 0 : Prohibited 1 : Measurement start Starts measurement by writing "MEAS_ST=1" after setting up "RDY =1" (Non Synchronized Measurement Mode, Single Measurement Mode). When stop measurement, write "SWRESET=1" without writing "MEAS_ST=0". Restart measurement restart by writing "MEAS_ST=1", while it is in Single Measurement Mode. default value 0x00 (0x48) MEAS_SYNC Fields MEAS_SYNC Function Input measurement synchronization signal 0 : Prohibited 1 : Input synchronization signal Starts measurement by writing "MEAS_SYNC=1" after setting up "MEAS_ST =1" (Synchronized Measurement Mode). Send MEAS_SYNC in every 1 second. Measurements set in "MSR" are performed within the interval of sending MEAS_SYNC. `1' can't be written in this register. Always `0' is read. default value 0x00 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 15/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC (0x4B) FIFO_LEV Fields FIFO_LEV[5:0] Function Number of stored sample in FIFO FIFO_LEV=0x00 : FIFO Empty FIFO_LEV=0x23 : FIFO FULL default value 0x00 (0x4C/0x4D) FIFODATA0 Fields FIFODATA0[15:0] Function FIFO Output Data 0 default value 0x0000 (0x4E/0x4F) FIFODATA1 Fields FIFODATA1[15:0] Function FIFO Output Data 1 default value 0x0000 Built-in 35 slot of FIFO. FIFO store 4 byte data by 1 slot. Measurement data stored in FIFO is determined by Measurement Mode. Measurement data is stored in FIFO in every measurement. Stop storing data in FIFO, after FIFO become FULL condition. Measurement Mode FIFODATA0 FIFODATA1 32Hz Mode GDATA_LEDOFF GDATA_LEDON 128Hz Mode GDATA_LEDOFF GDATA_LEDON 64Hz Mode GDATA_LEDOFF GDATA_LEDON 256Hz Mode GDATA_LEDOFF GDATA_LEDON 1024Hz Mode Non Synchronized Measurement Mode Single Measurement Mode No storing GDATA_LEDON No storing No storing No storing No storing (0x50/0x51) IRDATA_LEDOFF Fields IRDATA_LEDOFF[15:0] Function IR Data Count Value during no LED emission. default value 0x0000 (0x52/0x53) IRDATA_LEDON Fields IRDATA_LEDON[15:0] (0x54/0x55) GDATA_LEDOFF Fields GDATA_LEDOFF[15:0] Function IR Data Count Value during LED emission - IR Data Count Value during no LED emission default value 0x0000 Function Green Data Count Value during no LED emission default value 0x0000 (0x56/0x57) GDATA_LEDON Fields GDATA_LEDON[15:0] Function Green Data Count Value during LED emission default value 0x0000 (0x58) INT_CLEAR By reading INT_CLEAR, interruption of IR threshold judgement and measurement completion is cleared. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Control Sequence <Synchronized Measurement Mode> During measurement(Note 1) Synchronized Measurement Mode Processing priority: High MEAS_SYNC sending (Note 2) Processing priority: Low Watermark interrupt occurrence Set operation mode Write : 0x418X (MSR=000 to 101) (Note 5) Send measurement Synchronization signal Write : 0x4801 Write : 0x42xx Times of Reading FIFO < 32 No Yes End Read FIFO Data Read : 0x4C to 0x4F TRI2C(Note 3) (Note 4) Write : 0x43xx Write : 0x44xx Read FIFO_LEV Read : 0x4B Write : 0x45xx Set interrupt condition Write : 0x4601 Refreshing parameter or changing LED current Start measurement Write : 0x4701 No Yes Set parameter Write : 0x41 to 0x47 TWI2C(Note 3) Finish measurement? No End Yes SWRESET Write : 0x4080 (Note 1) Between `Start measurement' and `Finish measurement'. (Note 2) Send signal every 1 second. (Note 3) TRI2C : time to read FIFO data. TWI2C : time to set parameter. (Note 4) Data registers (0x4C, 0x4D, 0x4E, 0x4F) should be read by burst read. End www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 (Note 5) During a period form a start of FIFO reading (write to address 0x4C) to FIFO_LEV reading (write to address 0x4B), do not communicate with this device except for FIFO reading or SYNC signal (address 0x48). When communicating with this device during FIFO reading, read FIFO_LEV and finish FIFO read sequence before other communication. If don't read FIFO_LEV before other communication, there is a possibility to lose FIFO data. 17/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC MEAS_SYNC sending LED emitting frequency and output data rate depend on the interval of MEAS_SYNC. Set the priority of `MEAS_SYNC sending' higher than `Watermark interrupt occurrence' to send MEAS_SYNC without delay. Since processing of `MEAS_SYNC sending' and `Watermark interrupt occurrence' is asynchronous, avoid conflicts of I2C Bus as below. [Avoidance example] Prohibit I2C access for a certain period of time just before `MEAS_SYNC sending'. Set the prohibit time longer than `TRI2C' and `TWI2C'. And restart reading FIFO data before it becomes FULL condition. Write 0x4801 Send Command Shift Read FIFO Data Read 0x4C to 0x4F Read 0x4C to 0x4F Read 0x4C to 0x4F Read 0x4C to 0x4F Read 0x4C to 0x4F Prohibit I2C access Watermark interrupt Since LED emitting frequency is initial setting until the device receives MEAS_SYNC twice, ignore watermark interrupt occurrence during initial setting and clear FIFO data just after sending 2nd MEAS_SYNC by reading all stored data immediately. After clearing FIFO data, treat watermark interrupt normally. At the timing of T1 after sending 2nd MEAS_SYNC 32 data are stored in FIFO. Pulse measurement starts just after MEAS_SYNC, and FIFO data should be read before FIFO reaches full. Regarding a period that FIFO becomes full, please refer to measurement mode of MSR register. 1s 1s T1 Send Command Write 0x4701 Write 0x4801 Write 0x4801 Write 0x4801 Read 0x4C to 0x4F Read FIFO Data Read 0x4B All data stored in FIFO Watermark Interrupt Ignore Active LED pulse LED emitting frequency : Initial setting LED emitting frequency : Adjust from MEAS_SYNC Cycle Changing LED current The updated LED current value is reflected after writing `MEAS_ST = 1'. Send Command Write 0x4701 Change LED current Write 0x4701 Change LED current LED pulse www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC <Non Synchronized Measurement Mode> Non Synchronized Measurement Mode Set operation mode Write : 0x4196 Write : 0x42xx Write : 0x43xx INT pin = Low? No Write : 0x44xx Yes Read IR Data Read : 0x50 to 0x53 Write : 0x45xx Refreshing parameter or changing LED current No Yes Set interrupt condition Write : 0x4602 Clear interrupt Read : 0x58 Set parameter Write : 0x41 to 0x47 Start measurement Write : 0x4701 No Finish measurement? Yes SWRESET Write : 0x4080 End www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC <Single Measurement Mode> Single Measurement Mode Set operation mode Write : 0x4187 Write : 0x42xx Start measurement Write : 0x4701 Write : 0x43xx INT pin = Low? No Write : 0x44xx Yes Read IR/Green Data Read : 0x50 to 0x53 Or 0x54 to 0x57(Note 1) Write : 0x45xx Set interrupt condition Write : 0x4603 (Note 1) Depend on SEL_ADC Clear interrupt Read : 0x58 No Finish measurement? Yes SWRESET Write : 0x4080 End www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Application Example IR LED 1.0uF Green LED LED Driver LED1 LED2 LED Driver LED3 VCC LED Control FIFO SCL Green IRCUT ADC PD ADC Control Interface (I2C+INT) ADC SDA Micro Controller INT ) PD POR TMONI www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 GND OSC TEST 21/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC I/O equivalent circuit Pin Name Equivalent Circuit Diagram Pin Name SCL SDA LED1 LED2 LED3 INT TEST TMONI Equivalent Circuit Diagram VCC VCC www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 VCC VCC 22/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Terminals Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 23/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Operational Notes - continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by 12. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 24/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Ordering information B H 1 7 9 2 Part Number G L C Package GLC: WLGA010V28 - E2 Packaging and forming specification E2: Embossed tape and real Marking Diagram WLGA010V28(TOP VIEW) Part Number Marking A G LOT Number Optical design for the device 2.8mm 1.4mm 1.4mm 2.8mm sensitive area 0.6 x 0.6mm www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 25/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Physical Dimension and Packing Information Package Name www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 WLGA010V28 26/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 BH1792GLC Revision History Date Revision 03.Aug.2017 001 13.Dec.2017 002 Changes New Release P17 Modify the Synchronized Measurement Mode of Control Sequence. P18 Modify the Timing chart in the Watermark interrupt www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 27/27 TSZ02201-0M3M0F617010-1-2 13.Dec.2017 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BH1792GLC - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BH1792GLC WLGA010V28 3000 3000 Taping inquiry Yes