〇Product structure : Silicon monolithic integrated circuit. 〇This product has no designed protection against radioactive rays.
〇This product does not include laser transmitter. 〇This product does not include optical load.
〇This product includes Photo detector, ( Photo Diode ) inside of it.
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
13.Dec.2017 Rev.002
TSZ22111 • 14 • 001
www.rohm.com
Sensor for Heart Rate Monitor ICs
Optical Sensor for Heart Rate Monitor IC
BH1792GLC
General Description
BH1792GLC is optical sensor for heart rate monitor IC in
which LED driver, green light and IR detection photo-
diode are incorporated. This device drives LED and
provides the intensity of light reflected from body.
LED brightness can be adjusted by LED driver current.
The photodiode having the high sensitivity for green light
and excellent wavelength selectivity achieves accurate
pulse wave detection.
Features
Build-in green photodiode with excellent wavelength
selective green filter and IR curt filter.
Built-in IR photodiode for touch detection.
Correspond to high sampling frequency. (1024Hz)
LED driver with current selection.
I2C bus Interface(f/s mode support)
Built-in FIFO
Applications
Wearable device, smart phone, Tablet PC.
Key Specifications
VCC Voltage Range: 2.5V to 3.6V
Current Consumption: 200μA(Typ)
Standby Mode Current: 0.8μA (Typ)
Operating Temperature Range: -20°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
WLGA010V28 2.8mm x 2.8mm x 1.0mm
Typical Application Circuit
LED
Driver
ADC
Control
LED
Control
Interface
(I2C+INT)
POR
OSC
LED
Driver
LED1
LED2
LED3
VCC
ADC
ADC
Green
IRCUT
PD
PD
SCL
SDA
GND
TEST
TMONI
INT(Note 1)
)
Micro
Controller
Green
LED
IR
LED
FIFO
WLGA010V28
(Note 1) Do not share INT pin with other IC.
Datashee
t
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BH1792GLC
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package.. ........................................................................................................................................................................................ 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description ................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 4
Description of Blocks ...................................................................................................................................................................... 4
Absolute Maximum Ratings .......................................................................................................................................................... 5
Thermal Resistance ........................................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 6
Electrical Characteristics................................................................................................................................................................. 6
Power Sequence ............................................................................................................................................................................ 7
I2C Bus Timing Characteristics ....................................................................................................................................................... 8
I2C bus Communication .................................................................................................................................................................. 8
Typical Performance Curves ........................................................................................................................................................... 9
I2C bus Slave address .................................................................................................................................................................. 11
Register Map ................................................................................................................................................................................ 11
Control Sequence ......................................................................................................................................................................... 17
Application Example ..................................................................................................................................................................... 21
I/O equivalent circuit ..................................................................................................................................................................... 22
Operational Notes ......................................................................................................................................................................... 23
Ordering information ..................................................................................................................................................................... 25
Marking Diagram .......................................................................................................................................................................... 25
Optical design for the device ......................................................................................................................................................... 25
Physical Dimension and Packing Information ............................................................................................................................... 26
Revision History ............................................................................................................................................................................ 27
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© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BH1792GLC
Pin Configuration
TOP VIEW
Pin Description
Pin No.
Pin Name
Function
1
VCC
Power supply(Note 1)
2
GND
Ground
3
LED1
LED1 driver output
4
LED2
LED2 driver output
5
LED3
LED3 driver output
6
INT
Interrupt(Note 2)
7
TEST
TEST pin (Connect to GND)
8
TMONI
TEST Monitor pin (open)
9
SDA
I2C bus serial data
10
SCL
I2C bus serial clock
(Note 1) Dispose a bypass capacitor as close as possible to the IC
(Note 2) Do not share INT pin with other IC
9
SDA
8
TMONI
7
TEST
6
INT
1
VCC
2
GND
3
LED1
4
LED2
5
LED3
10
SCL
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
13.Dec.2017 Rev.002
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TSZ22111 • 15 • 001
BH1792GLC
Block Diagram
Description of Blocks
・IRCUT
This filter passes visible light and blocks infrared light.
・GREEN
Green color pass filter
・PD
Photodiodes (PD) convert light into current.
・LED Driver
LED driver circuit
・ADC
AD converter
・OSC
Internal oscillator generates clock for internal logic.
・POR
Power on reset
・Interface (I2C+INT)
I2C bus and interrupt pin Interface block
・ADC control
AD converter control block
・LED control
LED driver control block
・FIFO
FIFO circuit
LED
Driver
ADC
Control
LED
Control
Interface
(I2C+INT)
POR
OSC
LED
Driver
LED1
LED2
LED3
VCC
ADC
ADC
Green
IRCUT
PD
PD
SCL
SDA
GND
TEST
TMONI
INT
FIFO
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
13.Dec.2017 Rev.002
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TSZ22111 • 15 • 001
BH1792GLC
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC_MR
4.5
V
Terminal input Voltage1(Note 1)
VIN_MR
-0.3 to +4.5
V
Terminal input Voltage2(Note 2)
VLED_MR
7
V
Storage Temperature Range
Tstg
-40 to +100
°C
Maximum Junction Temperature
Tjmax
100
°C
(Note 1)INT, SCL, SDA pins
(Note 2)LED1, LED2, LED3 pins
Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
WLGA010V28
Junction to Ambient
θJA
319.5
182.1
°C/W
Junction – Top Characterization Parameter(Note 2)
ΨJT
102
65
°C/W
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 and 3 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
13.Dec.2017 Rev.002
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TSZ22111 • 15 • 001
BH1792GLC
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating Temperature
Topr
-20
+25
+85
°C
Supply Voltage
VCC
2.5
3.0
3.6
V
Terminal Input Voltage (Note 1)
VLED
0.7
-
5.5
V
(Note 1)LED1, LED2, LED3 pins
Electrical Characteristics
(Unless otherwise specified VCC=3.0V, Ta=25°C, MSR=000)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Supply Current
ICC1
-
200
400
µA
No LED emitting
Supply Current during LED current
drive
ICC2
-
1.4
3.0
mA
LED emitting
Standby Mode Current
ICC3
-
0.8
1.5
µA
No input light
Green Data Count Value
DGREEN
3000
5100
7200
count
EV=10uW/cm2 (Note 1)
IR Data Count Value
DIR
2500
4300
6000
count
EV=200uW/cm2 (Note 2)
Dark Count Value (Green Data)
SGR_0
-
-
200
count
No input light
Dark Count Value (IR Data)
SIR_0
-
-
200
count
No input light
Synchronized Signal Interval
Tsync
-
1
-
s
LED Emitting Time
twlLED
-
300
400
µs
LED Output Current
ILED
1
2
3
mA
LED pin input voltage = 1.0V
LED_CURRENT=2mA Mode
LED Off Leakage Current
IOFF
-
0
1
µA
LED terminal voltage = 5.0V
OSC Cycle
tOSC
-
0.5
0.67
µs
L Input Voltage (Note 3)
VIL
-
-
0.54
V
H Input Voltage(Note 3)
VIH
1.26
-
-
V
L Input Current(Note 3)
VIL
-10
-
-
µA
VIL=GND
H Input Current(Note 3)
VIH
-
-
10
µA
VIH=VCC
L Output Voltage(Note 4)
VOL
0
-
0.4
V
IL=3mA
(Note 1) Green LED is used as optical source.
(Note 2) IR LED is used as optical source.
(Note 3) SDA, SCL pins
(Note 4) SDA, INT pins
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© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BH1792GLC
Power Sequence (Unless otherwise specified VCC=3.0V, Ta=25°C)
There is a Power on reset function which monitors VCC power.
All registers are reset by Power ON Reset function when power is supplied to VCC.
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Command input time after power-on
tPSC
2
-
-
ms
Power supply OFF time
tPSL
1
-
-
ms
Wait time from power down command
tCPS
100
-
-
µs
tPSC after VCC power-on, command can be input.
Internal condition becomes undefined when VCC is lower than recommended operating voltage range. In this case power off
VCC once and power-on again.
Please keep VCC Low (VCC<0.4V) more than tPSL before VCC power-on.
Send RESET command before tCPS from power-off VCC.
0.4V
VCC
tPSC
Undefined
Behavior
Command
Acceptable
Undefined
Behavior
0.4V
tPSC
Command
Acceptable
tPSL
0.4V
VCC(Min)
VCC(Min)
VCC(Min)
VCC(Min)
tCPS
Send RESET command
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© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BH1792GLC
I2C Bus Timing Characteristics (Unless otherwise specified VCC=3.0V, Ta=25°C)
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
SCL Clock frequency
fSCL
0
-
400
kHz
‘L’ Period of the SCL Clock
tLOW
1.3
-
-
µs
‘H’ Period of the SCL Clock
tHIGH
0.6
-
-
µs
Setup Time for Repeated START
tSU;STA
0.6
-
-
µs
Hold Time for START
tHD;STA
0.6
-
-
µs
Data Setup Time
tSU;DAT
100
-
-
ns
Data Hold Time
tHD;DAT
0
-
-
µs
Setup Time for STOP
tSU;STO
0.6
-
-
µs
Bus Free Time between STOP and START
tBUF
1.3
-
-
µs
I2C bus Communication
1. Write format
(1) Indicate register address
S
Slave Address
W
0
ACK
Register Address
ACK
P
(2) Write data after indicating register address
S
Slave Address
W
0
ACK
Register Address
ACK
Data specified at register
address field
ACK
・・・
ACK
Data specified at register
address field + N
ACK
P
2. Read format
(1) Read data after indicating register address (Master issues restart condition)
S
Slave Address
W
0
ACK
Register Address
ACK
S
Slave Address
R
1
ACK
Data specified at register
address field
ACK
Data specified at register
address field + 1
ACK
・・・
ACK
Data specified at register
address field + N
NACK
P
(2) Read data from the specified register
S
Slave Address
R
1
ACK
Data specified at register
address field
ACK
Data specified at register
address field + 1
ACK
・・・
ACK
Data specified at register
address field + N
NACK
P
from master to slave
from slave to master
SDA
SCL
tHD;STA
tLOW
tHD;DAT
tSU;DAT
tHIGH
tSU;STA
tHD;STA
tSU;STO
tBUF
VIL
VIL
VIL
VIH
VIH
VIL
VIH
VIH
VIH
VIH
VIH
VIH
VIH
VIL
VIL
VIL
VIH
S : START
S : START
P : STOP
S : Repeated START
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TSZ22111 • 15 • 001
BH1792GLC
Typical Performance Curves
Figure 1. Sensitivity Ratio vs Wavelength
(“Green Spectral Response”)
Figure 2. Sensitivity Ratio vs Wavelength
(“IR Spectral Response”)
Figure 3. Green Ratio vs Angle
(“Directional Characteristics 1”)
Figure 4. Green Ratio vs Angle
(“Directional Characteristics 2”)
0.0
0.2
0.4
0.6
0.8
1.0
400 500 600 700 800 900 1000 1100
Sensitivity Ratio
Wavelength[nm]
0.0
0.2
0.4
0.6
0.8
1.0
400 500 600 700 800 900 1000 1100
Sensitivity Ratio
Wavelength[nm]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-90 -60 -30 0 30 60 90
Ratio
Angle[deg]
-
+
-
+
1pin
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-90 -60 -30 0 30 60 90
Ratio
Angle[deg]
-
+
-
+
1pin
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BH1792GLC
Typical Performance Curves
Figure 5. IR Ratio vs Angle
(“Directional Characteristics 1”)
Figure 6. IR Ratio vs Angle
(“Directional Characteristics 2”)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-90 -60 -30 0 30 60 90
Ratio
Angle[deg]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-90 -60 -30 0 30 60 90
Ratio
Angle[deg]
-
+
-
+
1pin
-
+
-
+
1pin
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
13.Dec.2017 Rev.002
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TSZ22111 • 15 • 001
BH1792GLC
I2C bus Slave address
Slave address is”1011011”.
Register Map (Note 1)
Register
Address
Register Name
R/W
D7
D6
D5
D4
D3
D2
D1
D0
0x0F
MANUFACTURER_ID
R
MANUFACTURER_ID [7:0]
0x10
PART_ID
R
PART_ID[7:0]
0x40
RESET
RW
SW
RESET
0
0
0
0
0
0
0
0x41
MEAS_CONTROL1
RW
RDY
0
0
SEL_
ADC
0
MSR[2:0]
0x42
MEAS_CONTROL2
RW
LED_EN1[1:0]
LED_CURRENT1[5:0]
0x43
MEAS_CONTROL3
RW
LED_
EN2
0
LED_CURRENT2[5:0]
0x44
MEAS_CONTROL4
RW
TH_IR[7:0]
0x45
RW
TH_IR[15:8]
0x46
MEAS_CONTROL5
RW
0
0
0
0
0
0
INT_SEL[1:0]
0x47
MEAS_START
RW
0
0
0
0
0
0
0
MEAS_
ST
0x48
MEAS_SYNC
RW
0
0
0
0
0
0
0
MEAS_
SYNC
0x4B
FIFO_LEV
R
0
0
FIFO_LEV[5:0]
0x4C
FIFODATA0
R
FIFODATA0 [7:0]
0x4D
R
FIFODATA0 [15:8]
0x4E
FIFODATA1
R
FIFODATA1 [7:0]
0x4F
R
FIFODATA1 [15:8]
0x50
IRDATA_LEDOFF
R
IRDATA_LEDOFF [7:0]
0x51
R
IRDATA_LEDOFF [15:8]
0x52
IRDATA_LEDON
R
IRDATA_LEDON [7:0]
0x53
R
IRDATA_LEDON [15:8]
0x54
GDATA_LEDOFF
R
GDATA_LEDOFF [7:0]
0x55
R
GDATA_LEDOFF [15:8]
0x56
GDATA_LEDON
R
GDATA_LEDON [7:0]
0x57
R
GDATA_LEDON [15:8]
0x58
INT_CLEAR
R
-
-
-
-
-
-
-
-
(Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’in above table.
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TSZ02201-0M3M0F617010-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BH1792GLC
(0x0F) MANUFACTURER_ID
Fields
Function
MANUFACTURER_ID[7:0]
Manufacturer ID : 0xE0
(0x10) PART_ID
Fields
Function
PART_ID[7:0]
Part ID : 0x0E
(0x40) RESET
Fields
Function
SWRESET
Reset all registers when writing “1”.
”1” is not written in register.
Read value is always” 0”.
default value 0x00
(0x41) MEAS_CONTROL1
Fields
Function
RDY
0 : Prohibited
1 : OSC block is active
SEL_ADC
Select channel of ADC measurement
0 : GREEN Measurement Mode
LED1 and LED2 drivers are active.
1 : IR Measurement Mode
Only in Non Synchronized Measurement Mode and Single Measurement Mode this
mode can be used.
LED3 driver is active.
MSR[2:0]
Select Measurement Mode
default value 0x00
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TSZ22111 • 15 • 001
BH1792GLC
< MSR >
Select measurement mode.
MSR
Measurement mode
LED
Emitting
Frequency
Output
Data
Rate
FIFO storing
FIFO_input_
cycle[ms]
Measurement
time after
receiving
MEAS_SYNC
000
32Hz Mode
128Hz setting
32Hz setting
Storing
Tsync/32
32
001
128Hz Mode
128Hz setting
128Hz setting
Storing
Tsync/128
128
010
64Hz Mode
256Hz setting
64Hz setting
Storing
Tsync/64
64
011
256Hz Mode
256Hz setting
256Hz setting
Storing
Tsync/256
256
100
Prohibited
-
-
-
-
-
101
1024Hz Mode
1024Hz setting
1024Hz setting
Storing
Tsync/1024
1024
110
Non Synchronized
Measurement Mode
4Hz setting
4Hz setting
No storing
-
-
111
Single Measurement
Mode
-
-
No storing
-
-
Synchronized Measurement Mode (MSR : 000 to 101)
Adjust LED emitting frequency and output data rate by synchronizing with MEAS_SYNC received interval. After receiving
MEAS_SYNC, the measurements for a set number of times are performed. After finishing measurements for a set number
of times, measurement stops until receiving MEAS_SYNC. When starting measurement, LED emission is operated with
default frequency. And start synchronized operation after receiving next MEAS_SYNC. Use the measurement value of
after starting synchronized operation
LED_CURRENT1and LED_CURRENT2 can be changed during measurement. The value becomes effective when
receiving MEAS_SYNC. Send SWRESET first, in case of changing other registers above.
Measurement data is stored in FIFO. FIFO can store 35 samples. Refer to FIFODATA0 and FIFODATA1 for data to store
in FIFO. It becomes FULL condition when the number of samples reaches 35, and stop storing samples in FIFO. Water
Mark Interrupt occurs when the number of samples reaches 32 or more. Refer INT_SEL for setting interrupt output of INT
pin. After the interruption, read FIFO data before it becomes FULL condition.
Non Synchronized Measurement Mode
Measurement starts after receiving MEAS_ST. LED_CURRENT1 and LED_CURRENT2 can be changed during
measurement. New value becomes effective when receiving MEAS_ST. Send SWRESET first, in case of changing other
registers above.
LED emitting frequency depends on OSC oscillation frequency.
LED emitting frequency: (499968 * tosc) s
Single Measurement mode
Measurement starts after receiving MEAS_ST. Send SWRESET first, in case of changing registers. After finishing
measurement, the measurement stops until receiving MEAS_ST.
…
31
32
33
34
35
Start read data less than (FIFO_input_cycle * 3).
Interrupt for water mark
FIFO_LEV
INT
FIFO FULL
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TSZ22111 • 15 • 001
BH1792GLC
(0x42) MEAS_CONTROL2
Fields
Function
LED_EN1[1:0]
Select the mode of LED driver
LED_CURRENT1[5:0]
Set the current of LED driver
default value 0x00
(0x43) MEAS_CONTROL3
Fields
Function
LED_EN2
Select the mode of LED driver
LED_CURRENT2[5:0]
Set the current of LED driver
default value 0x00
<LED_EN1/LED_EN2>
Select the mode of LED driver
LED_EN1[1:0]
LED_EN2
LED1
LED2
LED3
00
x
Pulsed
Light Emission
Pulsed
Light Emission
Pulsed
Light Emission
(Note 1)
01
x
ON
OFF
OFF
(Note 2)
10
0
OFF
ON
OFF
(Note 2)
10
1
OFF
OFF
ON
(Note 2)
11
0
ON
ON
OFF
(Note 2)
11
1
ON
OFF
ON
(Note 2)
(Note 1) LED driver is selected by SEL_ADC. Use for measurement.
(Note 2) This setting is for the operation check of LED.
<LED_CURRENT1>
Adjust the output current of
LED1 and LED2 drivers.
New parameters becomes effective
when receiving MEAS_ST.
<LED_CURRENT2>
Adjust the output current of LED3 driver.
New parameters becomes effective
when receiving MEAS_ST.
LED_CURRENT1[5:0]
Current setting mode
0x00
Stop emission mode
0x01
1mA mode
0x02
2mA mode
0x03
3mA mode
…
…
0x09
9mA mode
0x0A
10mA mode
0x0B
11mA mode
…
…
0x3D
61mA mode
0x3E
62mA mode
0x3F
63mA mode
LED_CURRENT2[5:0]
Current setting mode
0x00
Stop emission mode
0x01
1mA mode
0x02
2mA mode
0x03
3mA mode
…
…
0x09
9mA mode
0x0A
10mA mode
0x0B
11mA mode
…
…
0x3D
61mA mode
0x3E
62mA mode
0x3F
63mA mode
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TSZ22111 • 15 • 001
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(0x44/0x45) MEAS_CONTROL4
Fields
Function
TH_IR[15:0]
IR Interrupt Threshold Value
default value 0xFFFC
(0x46) MEAS_CONTROL5
Fields
Function
INT_SEL[1:0]
Select interrupt factor of INT pin
INT pin outputs L when the interruption factor occurs.
00 : Disenable (No interrupt output)
01 : Water Mark interrupt of FIFO
Interrupt when the stored sample number reaches 32 or more, and it’s cleared when
the number of sample falls below 32.
10 : IR threshold judgement interruption
Use only in Non Synchronized Measurement Mode.
Compare IRDATA_LEDON[15:4] and TH_IR[15:4] when updating data. Interruption
occurs when IRDATA_LEDON[15:4] is TH_IR[15:4] or more.
Interruption will be cleared when reading INT_CLEAR.
11 : Measurement completion interruption
In Single Measurement Mode this is effective.
Interrupt when the measurement finished.
Interruption will be cleared when reading INT_CLEAR.
default value 0x00
(0x47) MEAS_START
Fields
Function
MEAS_ST
Flag of start measurement
0 : Prohibited
1 : Measurement start
Starts measurement by writing “MEAS_ST=1” after setting up “RDY =1”
(Non Synchronized Measurement Mode, Single Measurement Mode).
When stop measurement, write “SWRESET=1” without writing “MEAS_ST=0”.
Restart measurement restart by writing ”MEAS_ST=1”, while it is in Single Measurement
Mode.
default value 0x00
(0x48) MEAS_SYNC
Fields
Function
MEAS_SYNC
Input measurement synchronization signal
0 : Prohibited
1 : Input synchronization signal
Starts measurement by writing “MEAS_SYNC=1” after setting up “MEAS_ST =1”
(Synchronized Measurement Mode).
Send MEAS_SYNC in every 1 second.
Measurements set in ”MSR” are performed within the interval of sending MEAS_SYNC.
‘1’ can’t be written in this register. Always ‘0’ is read.
default value 0x00
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TSZ22111 • 15 • 001
BH1792GLC
(0x4B) FIFO_LEV
Fields
Function
FIFO_LEV[5:0]
Number of stored sample in FIFO
FIFO_LEV=0x00 : FIFO Empty
FIFO_LEV=0x23 : FIFO FULL
default value 0x00
(0x4C/0x4D) FIFODATA0
Fields
Function
FIFODATA0[15:0]
FIFO Output Data 0
default value 0x0000
(0x4E/0x4F) FIFODATA1
Fields
Function
FIFODATA1[15:0]
FIFO Output Data 1
default value 0x0000
Built-in 35 slot of FIFO.
FIFO store 4 byte data by 1 slot.
Measurement data stored in FIFO is determined by Measurement Mode.
Measurement data is stored in FIFO in every measurement.
Stop storing data in FIFO, after FIFO become FULL condition.
Measurement Mode
FIFODATA0
FIFODATA1
32Hz Mode
GDATA_LEDOFF
GDATA_LEDON
128Hz Mode
GDATA_LEDOFF
GDATA_LEDON
64Hz Mode
GDATA_LEDOFF
GDATA_LEDON
256Hz Mode
GDATA_LEDOFF
GDATA_LEDON
1024Hz Mode
No storing
GDATA_LEDON
Non Synchronized
Measurement Mode
No storing
No storing
Single
Measurement Mode
No storing
No storing
(0x50/0x51) IRDATA_LEDOFF
Fields
Function
IRDATA_LEDOFF[15:0]
IR Data Count Value during no LED emission.
default value 0x0000
(0x52/0x53) IRDATA_LEDON
Fields
Function
IRDATA_LEDON[15:0]
IR Data Count Value during LED emission – IR Data Count Value during no LED emission
default value 0x0000
(0x54/0x55) GDATA_LEDOFF
Fields
Function
GDATA_LEDOFF[15:0]
Green Data Count Value during no LED emission
default value 0x0000
(0x56/0x57) GDATA_LEDON
Fields
Function
GDATA_LEDON[15:0]
Green Data Count Value during LED emission
default value 0x0000
(0x58) INT_CLEAR
By reading INT_CLEAR, interruption of IR threshold judgement and measurement completion is cleared.
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TSZ22111 • 15 • 001
BH1792GLC
Control Sequence
<Synchronized Measurement Mode>
During measurement(Note 1)
(Note 1) Between ‘Start measurement’ and ‘Finish measurement’.
(Note 2) Send signal every 1 second.
(Note 3) TRI2C : time to read FIFO data. TWI2C : time to set parameter.
(Note 4) Data registers (0x4C, 0x4D, 0x4E, 0x4F) should be read by burst read.
(Note 5) During a period form a start of FIFO reading (write to address 0x4C) to FIFO_LEV reading
(write to address 0x4B), do not communicate with this device except for FIFO reading or SYNC
signal (address 0x48). When communicating with this device during FIFO reading, read
FIFO_LEV and finish FIFO read sequence before other communication. If don't read
FIFO_LEV before other communication, there is a possibility to lose FIFO data.
Synchronized
Measurement Mode
Set operation mode
Write : 0x418X
(MSR=000 to 101)
Write : 0x42xx
Write : 0x43xx
Write : 0x44xx
Write : 0x45xx
Set interrupt condition
Write : 0x4601
Start measurement
Write : 0x4701
Finish
measurement?
SWRESET
Write : 0x4080
End
Yes
No
MEAS_SYNC
sending (Note 2)
Send measurement
Synchronization signal
Write : 0x4801
End
Processing priority: High
Watermark interrupt
occurrence
End
Times of
Reading
FIFO < 32
Yes
No
Read FIFO Data
Read : 0x4C to 0x4F
TRI2C(Note 3) (Note 4)
Refreshing
parameter
or changing
LED current
Set parameter
Write : 0x41 to 0x47
TWI2C(Note 3)
No
Yes
Processing priority: Low
Read FIFO_LEV
Read : 0x4B
(Note 5)
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・MEAS_SYNC sending
LED emitting frequency and output data rate depend on the interval of MEAS_SYNC.
Set the priority of ‘MEAS_SYNC sending’ higher than ‘Watermark interrupt occurrence’ to send MEAS_SYNC without
delay. Since processing of ‘MEAS_SYNC sending’ and ‘Watermark interrupt occurrence’ is asynchronous, avoid
conflicts of I2C Bus as below.
[Avoidance example]
Prohibit I2C access for a certain period of time just before ‘MEAS_SYNC sending’.
Set the prohibit time longer than ‘TRI2C’ and ‘TWI2C’.
And restart reading FIFO data before it becomes FULL condition.
・Watermark interrupt
Since LED emitting frequency is initial setting until the device receives MEAS_SYNC twice, ignore watermark interrupt
occurrence during initial setting and clear FIFO data just after sending 2nd MEAS_SYNC by reading all stored data
immediately. After clearing FIFO data, treat watermark interrupt normally. At the timing of T1 after sending 2nd
MEAS_SYNC 32 data are stored in FIFO. Pulse measurement starts just after MEAS_SYNC, and FIFO data should be
read before FIFO reaches full. Regarding a period that FIFO becomes full, please refer to measurement mode of MSR
register.
・Changing LED current
The updated LED current value is reflected after writing ‘MEAS_ST = 1’.
Send
Command
Write
0x4801
Read
FIFO Data
Read
0x4C
to 0x4F
Read
0x4C
to 0x4F
Read
0x4C
to 0x4F
Read
0x4C
to 0x4F
Shift
Prohibit I2C access
Read
0x4C
to 0x4F
Send
Command
Write
0x4701
LED pulse
Change
LED current
Write
0x4701
Change
LED current
Send
Command
Write
0x4801
Read
FIFO Data
Read
0x4C
to 0x4F
1s
Write
0x4701
Write
0x4801
Watermark
Interrupt
Ignore
Active
All data stored in FIFO
Write
0x4801
1s
LED pulse
LED emitting frequency :
Initial setting
LED emitting frequency :
Adjust from MEAS_SYNC Cycle
Read
0x4B
T1
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13.Dec.2017 Rev.002
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TSZ22111 • 15 • 001
BH1792GLC
<Non Synchronized Measurement Mode>
Non Synchronized
Measurement Mode
Set operation mode
Write : 0x4196
Write : 0x42xx
Write : 0x43xx
Write : 0x44xx
Write : 0x45xx
Set interrupt condition
Write : 0x4602
Start measurement
Write : 0x4701
INT pin =
Low?
SWRESET
Write : 0x4080
End
Yes
No
Refreshing
parameter
or changing
LED current
Read IR Data
Read : 0x50 to 0x53
Set parameter
Write : 0x41 to 0x47
Clear interrupt
Read : 0x58
Finish
measurement?
Yes
No
Yes
No
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TSZ22111 • 15 • 001
BH1792GLC
<Single Measurement Mode>
Single
Measurement Mode
Set operation mode
Write : 0x4187
Write : 0x42xx
Write : 0x43xx
Write : 0x44xx
Write : 0x45xx
Set interrupt condition
Write : 0x4603
Start measurement
Write : 0x4701
INT pin =
Low?
SWRESET
Write : 0x4080
End
Yes
No
Read IR/Green Data
Read : 0x50 to 0x53
Or 0x54 to 0x57
(Note 1)
Clear interrupt
Read : 0x58
Finish
measurement?
(Note 1) Depend on SEL_ADC
Yes
No
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13.Dec.2017 Rev.002
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TSZ22111 • 15 • 001
BH1792GLC
Application Example
LED
Driver
ADC
Control
LED
Control
Interface
(I2C+INT)
POR
OSC
LED
Driver
LED1
LED2
LED3
VCC
ADC
ADC
Green
IRCUT
PD
PD
SCL
SDA
GND
TEST
TMONI
INT
)
Micro
Controller
Green
LED
IR
LED
FIFO
1.0uF
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TSZ22111 • 15 • 001
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Terminals
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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TSZ22111 • 15 • 001
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
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TSZ22111 • 15 • 001
BH1792GLC
Ordering information
B
H
1
7
9
2
G
L
C
-
E 2
Part Number
Package
GLC: WLGA010V28
Packaging and forming specification
E2: Embossed tape and real
Marking Diagram
Optical design for the device
WLGA010V28(TOP VIEW)
Part Number Marking
LOT Number
G
A
sensitive area 0.6 x 0.6mm
1.4mm
2.8mm
1.4mm
2.8mm
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TSZ22111 • 15 • 001
BH1792GLC
Revision History
Date
Revision
Changes
03.Aug.2017
001
New Release
13.Dec.2017
002
P17 Modify the Synchronized Measurement Mode of Control Sequence.
P18 Modify the Timing chart in the Watermark interrupt
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
