APTGT150A120TG
APTGT150A120TG – Rev 1 July, 2006
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Absolute maximum ratings
Symbol Parameter Max ratings Unit
VCES Collector - Emitter Breakdown Voltage 1200 V
TC = 25°C 220
IC Continuous Collector Current TC = 80°C 150
ICM Pulsed Collector Current TC = 25°C 350
A
VGE Gate – Emitter Voltage ±20 V
PD Maximum Power Dissipation TC = 25°C 690 W
RBSOA Reverse Bias Safe Operating Area Tj = 125°C 300A @ 1150V
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
VBUS
Q1
G1
E1
OUT
NTC2
0/VBU S
G2
E2
NTC1
Q2
OUT
OUT
NTC2
VBUS
E1
G2
E2
NTC1
0/VBUS
G2
E2
G1
VCES = 1200V
IC = 150A @ Tc = 80°C
Applicatio
n
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Features
Fast Trench + Field Stop IGBT® Technology
- Low voltage drop
- Low tail current
- Switching freque ncy up to 20 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- Avalanche energy rated
- RBSOA and SCSOA rated
Kelvin emitter for easy drive
Very low stray inductance
- Symmetrical design
- Lead frames for power connections
High level of integration
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Easy paralleling due to positive TC of VCEsat
Low profile
RoHS Compliant
Phase leg
Fast Trench + Field Stop IGBT®
Power Module
APTGT150A120TG
APTGT150A120TG – Rev 1 July, 2006
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All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
ICES Zero Gate Voltage Collector Current VGE = 0V, VCE = 1200V 250 µA
Tj = 25°C 1.7 2.1
VCE(sat) Collector Emitter Saturation Voltage VGE = 15V
IC = 150A Tj = 125°C 2.0 V
VGE(th) Gate Threshold Voltage VGE = VCE , IC = 3 mA 5.0 5.8 6.5 V
IGES Gate – Emitter Leakage Current VGE = 20V, VCE = 0V 400 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Cies Input Capacitance 10.7
Coes Output Capacitance 0.56
Cres Reverse Transfer Capacitance
VGE = 0V
VCE = 25V
f = 1MHz 0.48
nF
Td(on) Tur n-o n Delay Ti me 280
Tr Rise Time 40
Td(off) Turn-off Delay Time 420
Tf Fall Time
Inductive Switching (25°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2 75
ns
Td(on) Tur n-o n Delay Ti me 290
Tr Rise Time 45
Td(off) Turn-off Delay Time 520
Tf Fall Time
Inductive Switching (125°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2 90
ns
Eon Tur n-on Switchi ng Energy Tj = 125°C 14
Eoff Turn-off Switching Energy
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2 Tj = 125°C 16
mJ
Reverse diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
VRRM Maximum Peak Repetitive Reverse Voltage 1200 V
Tj = 25°C 250
IRM Maximum Reverse Leakage Current VR=1200V Tj = 125°C 500 µA
IF DC Forward Current Tc = 80°C 150 A
Tj = 25°C 1.6 2.1
VF Diode Forward Voltage IF = 150A Tj = 125°C 1.6 V
Tj = 25°C 170
trr Reverse Recovery Time Tj = 125°C 280 ns
Tj = 25°C 15
Qrr Reverse Recovery Charge Tj = 125°C 29 µC
Tj = 25°C 7
Er Reverse Recovery Energy
IF = 150A
VR = 600V
di/dt =3000A/µs
Tj = 125°C 12 mJ
APTGT150A120TG
APTGT150A120TG – Rev 1 July, 2006
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Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol Characteristic Min Typ Max Unit
R25 Resistance @ 25°C 50 k
B 25/85 T
25 = 298.15 K 3952 K
=
TT
B
R
RT
11
exp
25
85/25
25
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
IGBT 0.18
RthJC Junction to Case Thermal Resistance Diode 0.34 °C/W
VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
TJ Operating junction temperature range -40 150
TSTG Storage Temperature Range -40 125
TC Operating Case Temperature -40 125
°C
Torque Mounting torque To Heatsink M5 2.5 4.7 N.m
Wt Package Weight 160 g
SP4 Package outline (dimensions in mm)
ALL DIMENSIO NS MARKE D " * " ARE T OLERENCED AS :
See application note APT0501 - Mounting Instructions for SP4 Power Modules on www.microsemi.com
T: Thermistor temperature
RT: Thermistor value at T
APTGT150A120TG
APTGT150A120TG – Rev 1 July, 2006
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Typical Performance Curve
Output Characteristics (VGE=15V)
TJ=25°C TJ=125°C
0
50
100
150
200
250
300
01234
VCE (V)
IC (A)
Output Ch aracteristics
VGE=15V
VGE
=13V
VGE
=17V
VGE
=9V
0
50
100
150
200
250
300
01234
VCE (V)
IC (A)
TJ = 125°C
Transfert Characteristics
TJ=25°C
TJ=125°C
TJ=125°C
0
50
100
150
200
250
300
56789101112
VGE (V)
IC (A)
Energy losses vs Collector Current
Eon
Eoff
Er
0
10
20
30
40
0 50 100 150 200 250 300
IC (A)
E (mJ)
VCE = 600V
VGE = 15V
RG = 2.2
TJ = 125°C
Eon
Eoff
Er
0
5
10
15
20
25
30
35
40
0246810121416
Gate Resistance (ohms)
E (mJ)
VCE = 600V
VGE =15V
IC = 150A
TJ
= 125°C
Switching Energy Losses vs Gate Resistanc
e
Reverse Bias Safe Operating Area
0
50
100
150
200
250
300
350
0 400 800 1200 1600
VCE (V)
IC (A)
VGE=15V
TJ=125°C
RG=2.2
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.04
0.08
0.12
0.16
0.2
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal ImpedanceC/W)
IGBT
APTGT150A120TG
APTGT150A120TG – Rev 1 July, 2006
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Forward Characteristic of diode
TJ=2C
TJ=125°C
TJ=125°C
0
50
100
150
200
250
300
0 0.4 0.8 1.2 1.6 2 2.4
VF (V)
IC (A)
Hard
Switching
ZCS
ZVS
0
10
20
30
40
50
60
10 40 70 100 130 160 190 220
IC (A)
Fmax, Operating Frequency (kHz)
VCE=600V
D=50%
RG=2.2
TJ=125°C
TC=75°C
Operating Frequency vs Collector Curren
t
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.7
0.5
0.3
0.1
0.05 Single Pulse
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Diode
M icros e mi re se rve s the rig ht to c ha nge , witho ut notice , the spe cificatio ns and i nfo rmatio n co nta ine d he rein
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