DATA SH EET
Product specification
Supersedes data of September 1993
File under Integrated Circuits, IC06
1997 Nov 25
INTEGRATED CIRCUITS
74HC/HCT4046A
Phase-locked-loop with VCO
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
1997 Nov 25 2
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
FEATURES
Low power consumption
Centre frequency of up to 17 MHz (typ.) at VCC = 4.5 V
Choice of three phase comparators: EXCLUSIVE-OR;
edge-triggered JK flip-flop;
edge-triggered RS flip-flop
Excellent VCO frequency linearity
VCO-inhibit control for ON/OFF keying and for low
standby power consumption
Minimal frequency drift
Operating power supply voltage range:
VCO section 3.0 to 6.0 V
digital section 2.0 to 6.0 V
Zero voltage offset due to op-amp buffering
Output capability: standard
ICC category: MSI.
GENERAL DESCRIPTION
The 74HC/HCT4046A are high-speed Si-gate CMOS
devices and are pin compatible with the “4046” of the
“4000B” series. They are specified in compliance with
JEDEC standard no. 7A.
The 74HC/HCT4046A are phase-locked-loop circuits that
comprise a linear voltage-controlled oscillator (VCO) and
three different phase comparators (PC1, PC2 and PC3)
with a common signal input amplifier and a common
comparator input.
The signal input can be directly coupled to large voltage
signals, or indirectly coupled (with a series capacitor) to
small voltage signals. A self-bias input circuit keeps small
voltage signals within the linear region of the input
amplifiers. With a passive low-pass filter, the “4046A”
forms a second-order loop PLL. The excellent VCO
linearity is achieved by the use of linear op-amp
techniques.
The VCO requires one external capacitor C1 (between
C1Aand C1B) and one external resistor R1 (between
R1and GND) or two external resistors R1 and R2
(between R1and GND, and R2and GND). Resistor R1
and capacitor C1 determine the frequency range of the
VCO. Resistor R2 enables the VCO to have a frequency
offset if required.
The high input impedance of the VCO simplifies the design
of low-pass filters by giving the designer a wide choice of
resistor/capacitor ranges. In order not to load the low-pass
filter, a demodulator output of the VCO input voltage is
provided at pin 10 (DEMOUT). In contrast to conventional
techniques where the DEMOUT voltage is one threshold
voltage lower than the VCO input voltage, here the
DEMOUT voltage equals that of the VCO input. If
DEMOUT is used, a load resistor (RS) should be connected
from DEMOUT to GND; if unused, DEMOUT should be left
open. The VCO output (VCOOUT) can be connected
directly to the comparator input (COMPIN), or connected
via a frequency-divider. The VCO output signal has a duty
factor of 50% (maximum expected deviation 1%), if the
VCO input is held at a constant DC level. A LOW level at
the inhibit input (INH) enables the VCO and demodulator,
while a HIGH level turns both off to minimize standby
power consumption.
The only difference between the HC and HCT versions is
the input level specification of the INH input. This input
disables the VCO section. The sections of the comparator
are identical, so that there is no difference in the
SIGIN (pin 14) or COMPIN (pin 3) inputs between the HC
and HCT versions.
Phase comparators
The signal input (SIGIN) can be directly coupled to the
self-biasing amplifier at pin 14, provided that the signal
swing is between the standard HC family input logic levels.
Capacitive coupling is required for signals with smaller
swings.
Phase comparator 1 (PC1)
This is an EXCLUSIVE-OR network. The signal and
comparator input frequencies (fi) must have a 50% duty
factor to obtain the maximum locking range. The transfer
characteristic of PC1, assuming ripple (fr=2f
i
) is
suppressed, is:
where VDEMOUT is the demodulator output at pin 10;
VDEMOUT =V
PC1OUT (via low-pass filter).
The phase comparator gain is:
The average output voltage from PC1, fed to the VCO
input via the low-pass filter and seen at the demodulator
output at pin 10 (VDEMOUT), is the resultant of the phase
differences of signals (SIGIN) and the comparator input
(COMPIN) as shown in Fig.6. The average of VDEMOUT is
equal to 12VCC when there is no signal or noise at
SIGIN and with this input the VCO oscillates at the centre
frequency (fo). Typical waveforms for the PC1 loop locked
at foare shown in Fig.7.
VDEMOUT VCC
π
----------- φSIGIN φCOMPIN
()=
K
p
V
CC
π
----------- Vr()
˙
.=
1997 Nov 25 3
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
The frequency capture range (2fc) is defined as the
frequency range of input signals on which the PLL will lock
if it was initially out-of-lock. The frequency lock range
(2fL) is defined as the frequency range of input signals on
which the loop will stay locked if it was initially in lock. The
capture range is smaller or equal to the lock range.
With PC1, the capture range depends on the low-pass
filter characteristics and can be made as large as the lock
range.
This configuration retains lock even with very noisy input
signals. Typical behaviour of this type of phase
comparator is that it can lock to input frequencies close to
the harmonics of the VCO centre frequency.
Phase comparator 2 (PC2)
This is a positive edge-triggered phase and frequency
detector. When the PLL is using this comparator, the loop
is controlled by positive signal transitions and the duty
factors of SIGIN and COMPIN are not important. PC2
comprises two D-type flip-flops, control-gating and a
3-state output stage. The circuit functions as an up-down
counter (Fig.5) where SIGIN causes an up-count and
COMPIN a down-count. The transfer function of PC2,
assuming ripple (fr=f
i
) is suppressed,
is:
where VDEMOUT is the demodulator output at pin 10;
VDEMOUT =V
PC2OUT (via low-pass filter).
The phase comparator gain is:
VDEMOUT is the resultant of the initial phase differences of
SIGIN and COMPIN as shown in Fig.8. Typical waveforms
for the PC2 loop locked at foare shown in Fig.9.
When the frequencies of SIGIN and COMPIN are equal but
the phase of SIGIN leads that of COMPIN, the p-type
output driver at PC2OUT is held “ON” for a time
corresponding to the phase difference (φDEMOUT). When
the phase of SIGIN lags that of COMPIN, the n-type driver
is held “ON”.
When the frequency of SIGIN is higher than that of
COMPIN, the p-type output driver is held “ON” for most of
the input signal cycle time, and for the remainder of the
cycle both n and p- type drivers are ”OFF” (3-state). If the
SIGIN frequency is lower than the COMPIN frequency, then
it is the n-type driver that is held “ON” for most of the cycle.
Subsequently, the voltage at the capacitor (C2) of the
low-pass filter connected to PC2OUT varies until the signal
VDEMOUT VCC
4π
----------- φSIGIN φCOMPIN
()=
K
p
V
CC
4π
----------- Vr().=
and comparator inputs are equal in both phase and
frequency. At this stable point the voltage on C2 remains
constant as the PC2 output is in 3-state and the VCO input
at pin 9 is a high impedance. Also in this condition, the
signal at the phase comparator pulse output (PCPOUT) is a
HIGH level and so can be used for indicating a locked
condition.
Thus, for PC2, no phase difference exists between
SIGIN and COMPIN over the full frequency range of the
VCO. Moreover, the power dissipation due to the low-pass
filter is reduced because both p and n-type drivers are
“OFF” for most of the signal input cycle. It should be noted
that the PLL lock range for this type of phase comparator
is equal to the capture range and is independent of the
low-pass filter. With no signal present at SIGIN the
VCO adjusts, via PC2, to its lowest frequency.
Phase comparator 3 (PC3)
This is a positive edge-triggered sequential phase detector
using an RS-type flip-flop. When the PLL is using this
comparator, the loop is controlled by positive signal
transitions and the duty factors of SIGIN and COMPIN are
not important. The transfer characteristic of PC3,
assuming ripple (fr=f
i
) is suppressed,
is:
where VDEMOUT is the demodulator output at pin 10;
VDEMOUT =V
PC3OUT (via low-pass filter).
The phase comparator gain is:
The average output from PC3, fed to the VCO via the
low-pass filter and seen at the demodulator output at
pin 10 (VDEMOUT), is the resultant of the phase differences
of SIGIN and COMPIN as shown in Fig.10. Typical
waveforms for the PC3 loop locked at foare shown in
Fig.11.
The phase-to-output response characteristic of PC3
(Fig.10) differs from that of PC2 in that the phase angle
between SIGIN and COMPIN varies between 0°and
360°and is 180°at the centre frequency. Also PC3 gives
a greater voltage swing than PC2 for input phase
differences but as a consequence the ripple content of the
VCO input signal is higher. The PLL lock range for this type
of phase comparator and the capture range are dependent
on the low-pass filter. With no signal present at SIGIN the
VCO adjusts, via PC3, to its lowest frequency.
VDEMOUT VCC
2π
----------- φSIGIN φCOMPIN
()=
K
p
V
CC
2π
----------- Vr().=
1997 Nov 25 4
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C
Notes
1. CPD is used to determine the dynamic power dissipation (PDin µW):
PD=C
PD ×VCC2×fi+(CL×VCC2×fo) where:
fi= input frequency in MHz.
fo= output frequency in MHz.
CL= output load capacitance in pF.
VCC = supply voltage in V.
(CL×VCC2×fo) = sum of outputs.
2. Applies to the phase comparator section only (VCO disabled). For power dissipation of the VCO and demodulator
sections see Figs 22, 23 and 24.
ORDERING INFORMATION
See
“74HC/HCT/HCU/HCMOS Logic Package Information”
.
APPLICATIONS
FM modulation and demodulation
Frequency synthesis and multiplication
Frequency discrimination
Tone decoding
Data synchronization and conditioning
Voltage-to-frequency conversion
Motor-speed control.
PACKAGE OUTLINES
See
“74HC/HCT/HCU/HCMOS Logic Package Outlines”
.
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
HC HCT
foVCO centre frequency C1 = 40 pF; R1 = 3 k;V
CC = 5 V 19 19 MHz
CIinput capacitance (pin 5) 3.5 3.5 pF
CPD power dissipation capacitance per
package notes 1 and 2 24 24 pF
1997 Nov 25 5
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
PIN DESCRIPTION
PIN NO. SYMBOL NAME AND FUNCTION
1 PCPOUT phase comparator pulse output
2 PC1OUT phase comparator 1 output
3 COMPIN comparator input
4 VCOOUT VCO output
5 INH inhibit input
6C1
Acapacitor C1 connection A
7C1
Bcapacitor C1 connection B
8 GND ground (0 V)
9 VCOIN VCO input
10 DEMOUT demodulator output
11 R1resistor R1 connection
12 R2resistor R2 connection
13 PC2OUT phase comparator 2 output
14 SIGIN signal input
15 PC3OUT phase comparator 3 output
16 VCC positive supply voltage
Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.3 IEC logic symbol.
1997 Nov 25 6
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
MGA847
PHASE
COMPARATOR
2
LOCK
DETECTOR
PC2OUT
LD
13
1
identical to 4046A
CLD
CCLD 15
7046A
PHASE
COMPARATOR
2
PC2OUT 13
PHASE
COMPARATOR
3
PC3OUT 15
PHASE
COMPARATOR
1
PC1OUT 2
PCPOUT 1
SIG IN
COMPIN
VCO OUT
C1AC1B
DEMOUTINH VCOIN
R2
R1
R2
12
11
314476
5109
(a) (b)
C1
4046A
VCO
RS
R1 R4
R3
C2
Fig.4 Functional diagram.
(a) (b)
Fig.5 Logic diagram.
1997 Nov 25 7
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.6 Phase comparator 1: average output voltage versus input phase difference.
VDEMOUT =V
PC2OUT =
φDEMOUT =(φ
SIGIN −φ
COMPIN).
VCC
π
----------- φSIGIN φCOMPIN
()
Fig.7 Typical waveforms for PLL using phase comparator 1, loop locked at fo.
Fig.8 Phase comparator 2: average output voltage versus input phase difference.
VDEMOUT =V
PC2OUT =
φDEMOUT =(φ
SIGIN −φC
OMPIN).
VCC
4π
----------- φSIGIN φCOMPIN
()
1997 Nov 25 8
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.9 Typical waveforms for PLL using phase comparator 2, loop locked at fo.
Fig.10 Phase comparator 3: average output voltage versus input phase difference:
VDEMOUT =V
PC3OUT =
φDEMOUT =(φ
SIGIN −φ
COMPIN).
VCC
2π
----------- φSIGIN φCOMPIN
()
Fig.11 Typical waveforms for PLL using phase comparator 3, loop locked at fo.
1997 Nov 25 9
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
RECOMMENDED OPERATING CONDITIONS FOR 74HC/HCT
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Voltages are referenced to GND (ground = 0 V)
SYMBOL PARAMETER 74HC 74HCT UNIT CONDITIONS
min. typ. max. min. typ. max.
VCC DC supply voltage 3.0 5.0 6.0 4.5 5.0 5.5 V
VCC DC supply voltage if VCO
section is not used 2.0 5.0 6.0 4.5 5.0 5.5 V
VIDC input voltage range 0 VCC 0V
CC V
VODC output voltage range 0 VCC 0V
CC V
Tamb operating ambient
temperature range 40 +85 40 +85 °C see DC and AC
CHARACTERISTICS
Tamb operating ambient
temperature range 40 +125 40 +125 °C
tr,t
finput rise and fall times (pin 5) 6.0 1000 6.0 500 ns VCC = 2.0 V
6.0 500 6.0 500 ns VCC = 4.5 V
6.0 400 6.0 500 ns VCC = 6.0 V
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VCC DC supply voltage 0.5 +7 V
±IIK DC input diode current 20 mA for VI<−0.5 V or VI>VCC + 0.5 V
±IOK DC output diode current 20 mA for VO<−0.5 V or VO>VCC + 0.5 V
±IODC output source or sink
current 25 mA for 0.5 V <VO<VCC + 0.5 V
±ICC; ±IGND DC VCC or GND current 50 mA
Tstg storage temperature range 65 +150 °C
Ptot power dissipation per package
plastic DIL 750 mW
for temperature range: 40 to +125 °C
74HC/HCT
above + 70 °C: derate linearly with 12 mW/K
plastic mini-pack (SO) 500 mW above + 70 °C: derate linearly with 8 mW/K
1997 Nov 25 10
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
DC CHARACTERISTICS FOR 74HC
Quiescent supply current
Voltages are referenced to GND (ground = 0 V)
Phase comparator section
Voltages are referenced to GND (ground = 0 V)
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
(V) OTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
ICC
quiescent supply
current (VCO
disabled) 8.0 80.0 160.0 µA 6.0 pins 3, 5, and 14 at VCC;
pin 9 at GND; IIat pins
3 and 14 to be excluded
SYM-
BOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
(V) VIOTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
VIH DC coupled
HIGH level input voltage
SIGIN, COMPIN
1.5 1.2 1.5 1.5 V 2.0
3.15 2.4 3.15 3.15 4.5
4.2 3.2 4.2 4.2 6.0
VIL DC coupled
LOW level input voltage
SIGIN, COMPIN
0.8 0.5 0.5 0.5 V 2.0
2.1 1.35 1.35 1.35 4.5
2.8 1.8 1.8 1.8 6.0
VOH HIGH level output voltage
PCPOUT,PC
nOUT
1.9 2.0 1.9 1.9 V 2.0 VIH
or
VIL
IO=20µA
4.4 4.5 4.4 4.4 4.5 IO=20µA
5.9 6.0 5.9 5.9 6.0 IO=20µA
V
OH HIGH level output voltage
PCPOUT,PC
nOUT
3.98 4.32 3.84 3.7 V 4.5 VIH
or
VIL
IO= 4.0 mA
5.48 5.81 5.34 5.2 6.0 IO= 5.2 mA
VOL LOW level output voltage
PCPOUT,PC
nOUT
0 0.1 0.1 0.1 V 2.0 VIH
or
VIL
IO=20µA
0 0.1 0.1 0.1 4.5 IO=20µA
0 0.1 0.1 0.1 6.0 IO=20µA
V
OL LOW level output voltage
PCPOUT,PC
nOUT
0.15 0.26 0.33 0.4 V 4.5 VIH
or
VIL
IO= 4.0 mA
0.16 0.26 0.33 0.4 6.0 IO= 5.2 mA
±IIinput leakage current
SIGIN, COMPIN
3.0 4.0 5.0 µA 2.0 VCC
or
GND
7.0 9.0 11.0 3.0
18.0 23.0 27.0 4.5
30.0 38.0 45.0 6.0
±IOZ 3-state
OFF-state current
PC2OUT
0.5 5.0 10.0 µA 6.0 VIH
or
VIL
VO=V
CC or
GND
1997 Nov 25 11
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
VCO section
Voltages are referenced to GND (ground = 0 V)
RIinput resistance
SIGIN, COMPIN
800 k3.0 VIat self-bias
operating point;
VI= 0.5 V;
see Figs 12, 13
and 14
250 k4.5
150 k6.0
SYM-
BOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
(V) VIOTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
VIH HIGH level
input voltage
INH
2.1 1.7 2.1 2.1 V 3.0
3.15 2.4 3.15 3.15 4.5
4.2 3.2 4.2 4.2 6.0
VIL LOW level
input voltage
INH
1.3 0.9 0.9 0.9 V 3.0
2.1 1.35 1.35 1.35 4.5
2.8 1.8 1.8 1.8 6.0
VOH HIGH level
output voltage
VCOOUT
2.9 3.0 2.9 2.9 V 3.0 VIH
or
VIL
IO=20µA
4.4 4.5 4.4 4.4 4.5 IO=20µA
5.9 6.0 5.9 5.9 6.0 IO=20µA
V
OH HIGH level
output voltage
VCOOUT
3.98 4.32 3.84 3.7 V 4.5 VIH
or
VIL
IO= 4.0 mA
5.48 5.81 5.34 5.2 6.0 IO= 5.2 mA
VOL LOW level
output voltage
VCOOUT
0 0.1 0.1 0.1 V 3.0 VIH
or
VIL
IO=20µA
0 0.1 0.1 0.1 4.5 IO=20µA
0 0.1 0.1 0.1 6.0 IO=20µA
V
OL LOW level
output voltage
VCOOUT
0.15 0.26 0.33 0.4 V 4.5 VIH
or
VIL
IO= 4.0 mA
0.16 0.26 0.33 0.4 6.0 IO= 5.2 mA
VOL LOW level output
voltage C1A,C1
B
0.40 0.47 0.54 V 4.5 VIH
or
VIL
IO= 4.0 mA
0.40 0.47 0.54 6.0 IO= 5.2 mA
±IIinput leakage
current
INH, VCOIN
0.1 1.0 1.0 µA 6.0 VCC
or
GND
R1 resistor range 3.0 300 k3.0 note 1
3.0 300 4.5
3.0 300 6.0
SYM-
BOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
(V) VIOTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
1997 Nov 25 12
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Note
1. The parallel value of R1 and R2 should be more than 2.7 k. Optimum performance is achieved when R1 and/ or
R2 are/is >10 k.
Demodulator section
Voltages are referenced to GND (ground = 0 V)
R2resistor range 3.0 300 k3.0 note 1
3.0 300 4.5
3.0 300 6.0
C1 capacitor range 40 no
limit pF 3.0
40 4.5
40 6.0
VVCOIN operating voltage
range at VCOIN
1.1 1.9 V 3.0 over the range
specified for
R1; for linearity
see Figs 20
and 21
1.1 3.4 4.5
1.1 4.9 6.0
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
V
OTHER
+25 40 to+85 40 to +125
min. typ. max. min. max. min. max.
RSresistor range 50 300 k3.0 at RS>300 k
the leakage current can
influence VDEMOUT
50 300 4.5
50 300 6.0
VOFF offset voltage
VCOIN to VDEMOUT
±30 mV 3.0 VI=V
VCOIN = 1/2 VCC;
values taken over
RSrange; see Fig.15
±20 4.5
±10 6.0
RDdynamic output
resistance at DEMOUT
25 3.0 VDEMOUT = 1/2 VCC
25 4.5
25 6.0
SYM-
BOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
(V) VIOTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
1997 Nov 25 13
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
AC CHARACTERISTICS FOR 74HC
Phase comparator section
GND = 0 V; tr=t
f= 6 ns; CL= 50 pF
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST
CONDITIONS
74HC VCC
(V)
OTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
tPHL/
tPLH
propagation delay
SIGIN, COMPIN
to PC1OUT
63 200 250 300 ns 2.0 Fig.16
23 40 50 60 4.5
18 34 43 51 6.0
tPHL/
tPLH
propagation delay
SIGIN, COMPIN
to PCPOUT
96 340 425 510 ns 2.0 Fig.16
35 68 85 102 4.5
28 58 72 87 6.0
tPHL/
tPLH
propagation delay
SIGIN, COMPIN
to PC3OUT
77 270 340 405 ns 2.0 Fig.16
28 54 68 81 4.5
22 46 58 69 6.0
tPZH/
tPZL
3-state output enable
time SIGIN, COMPIN
to PC2OUT
83 280 350 420 ns 2.0 Fig.17
30 56 70 84 4.5
24 48 60 71 6.0
tPHZ/
tPLZ
3-state output disable
time SIGIN, COMPIN
to PC2OUT
99 325 405 490 ns 2.0 Fig.17
36 65 81 98 4.5
29 55 69 83 6.0
tTHL/
tTLH
output transition time 19 75 95 110 ns 2.0 Fig.16
7 15 19 22 4.5
6 13 16 19 6.0
VI(p-p) AC coupled input sensitivity
(peak-to-peak value) at
SIGIN or COMPIN
9 mV 2.0 fi= 1 MHz
11 3.0
15 4.5
33 6.0
1997 Nov 25 14
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
VCO section
GND = 0 V; tr=t
f= 6 ns; CL= 50 pF
DC CHARACTERISTICS FOR 74HCT
Quiescent supply current
Voltages are referenced to GND (ground = 0 V)
Note
1. The value of additional quiescent supply current (ICC) for a unit load of 1 is given above.
To determine ICC per input, multiply this value by the unit load coefficient shown in the table below.
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
(V) OTHER
+25 40 to +85 40 to +125
min. typ. max. typ. max. min. max.
f/T frequency stability
with temperature
change
0.20 %/K 3.0 VI=V
VCOIN = 1/2 VCC;
R1 = 100 k;R2=;
C1 = 100 pF; see Fig.18
0.15 4.5
0.14 6.0
foVCO centre
frequency (duty
factor = 50%)
7.0 10.0 MHz 3.0 VVCOIN = 1/2 VCC;
R1 = 3 k;R2=;
C1 = 40 pF; see Fig.19
11.0 17.0 4.5
13.0 21.0 6.0
fVCO VCO frequency
linearity 1.0 % 3.0 R1 = 100 k;R2=;
C1 = 100 pF;
see Figs 20 and 21
0.4 4.5
0.3 6.0
δVCO duty factor at
VCOOUT
50 % 3.0
50 4.5
50 6.0
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) OTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
ICC quiescent supply
current
(VCO disabled)
8.0 80.0 160.0 µA 6.0 pins 3, 5 and 14
at VCC; pin 9 at
GND; IIat
pins 3 and 14 to
be excluded
ICC additional quiescent
supply current per
input pin for unit load
coefficient is 1 (note 1)
VI=V
CC 2.1 V
100 360 450 490 µA 4.5
to
5.5
pins 3 and 14
at VCC;
pin 9 at GND;
IIat pins 3 and 14
to be excluded
INPUT UNIT LOAD COEFFICIENT
INH 1.00
1997 Nov 25 15
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
DC CHARACTERISTICS FOR 74HCT
Phase comparator section
Voltages are referenced to GND (ground=0V)
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) VIOTHER
+25 40 to +85 40 to +125
min typ. max min max min. max.
VIH DC coupled
HIGH level input
voltage SIGIN, COMPIN
3.15 2.4 V 4.5
VIL DC coupled
LOW level input
voltage
SIGIN, COMPIN
2.1 1.35 V 4.5
VOH HIGH level output
voltage PCPOUT,
PCnOUT
4.4 4.5 4.4 4.4 V 4.5 VIH
or
VIL
IO=20µA
V
OH HIGH level output
voltage PCPOUT,
PCnOUT
3.98 4.32 3.84 3.7 V 4.5 VIH
or
VIL
IO= 4.0 mA
VOL LOW level output
voltage
PCPOUT,PC
nOUT
0 0.1 0.1 0.1 V 4.5 VIH
or
VIL
IO=20µA
V
OL LOW level output
voltage
PCPOUT,PC
nOUT
0.15 0.26 0.33 0.4 V 4.5 VIH
or
VIL
IO= 4.0 mA
±IIinput leakage current
SIGIN, COMPIN
30 38 45 µA 5.5 VCC
or
GN
D
±IOZ 3-state OFF-state
current PC2OUT
0.5 5.0 10.0 µA 5.5 VIH
or
VIL
VO=V
CC or
GND
RIinput resistance
SIGIN, COMPin
250 k4.5 VIat self-bias
operating
point;
VI= 0.5 V;
see Figs 12, 13 and
14
1997 Nov 25 16
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
DC CHARACTERISTICS FOR 74HCT
VCO section
Voltages are referenced to GND (ground = 0 V)
Note
1. The parallel value of R1 and R2 should be more than 2.7 k. Optimum performance is achieved when R1 and/or R2
are/is >10 k.
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) VIOTHER
+25 40 to +85 40 to +125
min typ. max min max min. max.
VIH HIGH level
input voltage INH 2.0 1.6 2.0 2.0 V 4.5
to
5.5
VIL LOW level
input voltage INH 1.2 0.8 0.8 0.8 V 4.5
to
5.5
VOH HIGH level output
voltage VCOOUT
4.4 4.5 4.4 4.4 V 4.5 VIH
or
VIL
IO=20µA
V
OH HIGH level output
voltage VCOOUT
3.98 4.32 3.84 3.7 V 4.5 VIH
or
VIL
IO= 4.0 mA
VOL LOW level output
voltage VCOOUT
0 0.1 0.1 0.1 V 4.5 VIH
or
VIL
IO=20µA
V
OL LOW level output
voltage VCOOUT
0.15 0.26 0.33 0.4 V 4.5 VIH
or
VIL
IO= 4.0 mA
VOL LOW level output
voltage C1A,C1
B
(test purposes only)
0.40 0.47 0.54 V 4.5 VIH
or
VIL
IO= 4.0 mA
±IIinput leakage
current
INH, VCOIN
0.1 1.0 1.0 µA 5.5 VCC
or
GND
R1 resistor range 3.0 300 k4.5 note 1
R2resistor range 3.0 300 k4.5 note 1
C1 capacitor range 40 no
limit pF 4.5
VVCOIN operating voltage
range at VCOIN
1.1 3.4 V 4.5 over the
range
specified for
R1; for
linearity see
Figs 20
and 21
1997 Nov 25 17
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
DC CHARACTERISTICS FOR 74HCT
Demodulator section
Voltages are referenced to GND (ground = 0 V)
AC CHARACTERISTICS FOR 74HCT
Phase comparator section
GND = 0 V; tr=t
f= 6 ns; CL= 50 pF
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) OTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
RSresistor range 50 300 k4.5 at RS>300 k
the leakage current can
influence VDEMOUT
VOFF offset voltage
VCOIN to
VDEMOUT
±20 mV 4.5 VI=V
VCOIN = 1/2 VCC;
values taken over
RSrange; see Fig.15
RDdynamic output
resistance at
DEMOUT
25 4.5 VDEMOUT = 1/2 VCC
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) OTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
tPHL/
tPLH
propagation delay
SIGIN, COMPIN
to PC1OUT
23 40 50 60 ns 4.5 Fig.16
tPHL/
tPLH
propagation delay
SIGIN, COMPIN
to PCPOUT
35 68 85 102 ns 4.5 Fig.16
tPHL/
tPLH
propagation delay
SIGIN, COMPIN
to PC3OUT
28 54 68 81 ns 4.5 Fig.16
tPZH/
tPZL
3-state output enable
time SIGIN, COMPIN
to PC2OUT
30 56 70 84 ns 4.5 Fig.17
1997 Nov 25 18
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
VCO section
GND = 0 V; tr=t
f= 6 ns; CL= 50 pF
tPHZ/
tPLZ
3-state output disable
time SIGIN, COMPIN
to PC2OUT
36 65 81 98 ns 4.5 Fig.17
tTHL/
tTLH
output transition time 7 15 19 22 ns 4.5 Fig.16
VI (p-p) AC coupled input
sensitivity
(peak-to-peak value)
at
SIGIN or COMPIN
15 mV 4.5 fi= 1 MHz
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) OTHER
+25 40 to +85 40 to +125
min. typ. max min. max min. max.
f/T frequency stability
with temperature
change
0.15 %/K 4.5 VI=V
VCOIN withi
n recommended
range;
R1 = 100 k;
R2 = ;
C1 = 100 pF;
see Fig.18b
foVCO centre frequency
(duty factor = 50%) 11.0 17.0 MHz 4.5 VVCOIN = 1/2 VCC
;
R1 = 3 k;
R2 = ;
C1 = 40 pF;
see Fig.19
fVCO VCO frequency
linearity 0.4 % 4.5 R1 = 100 k;
R2 = ;
C1 = 100 pF;
see Figs 20
and 21
δVCO duty factor at VCOOUT 50 % 4.5
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) OTHER
+25 40 to +85 40 to +125
min. typ. max. min. max. min. max.
1997 Nov 25 19
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
FIGURE REFERENCES FOR DC CHARACTERISTICS
Fig.12 Typical input resistance curve at SIGIN,
COMPIN.Fig.13 Input resistance at SIGIN, COMPIN with
VI= 0.5 V at self-bias point.
Fig.14 Input current at SIGIN, COMPIN with
VI= 0.5 V at self-bias point. Fig.15 Offset voltage at demodulator output as a
function of VCOIN and RS.
 RS=50k
----R
S= 300 k
1997 Nov 25 20
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
AC WAVEFORMS
Fig.16 Waveforms showing input (SIGIN, COMPIN) to output (PCPOUT, PC1OUT, PC3OUT) propagation delays
and the output transition times.
(1) HC : VM= 50%; VI= GND to VCC
Fig.17 Waveforms showing the 3-state enable and disable times for PC2OUT.
(1) HC : VM= 50%; VI= GND to VCC
1997 Nov 25 21
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.18 Frequency stability of the VCO as a function of ambient temperature with supply voltage as a parameter.
 without offset (R2 = ): (a) R1 = 3 k; (b) R1 = 10 k; (c) R1 = 300 k.
−−− with offset (R1 = ): (a) R2 = 3 k; (b) R2 = 10 k; (c) R2 = 300 k.
In (b), the frequency stability for R1 = R2 = 10 kat 5 V is also given (curve A). This curve is set by the total VCO bias current, and is
not simply the addition of the two 10 kstability curves. C1 = 100 pF; VVCO IN = 0.5 VCC.
To obtain optimum temperature stability, C1 must be as small as possible but larger than 100 pF.
b
ook, halfpage
MSB710
Tamb (oC)
0
15010050050
25
20
15
10
5
5
10
15
20
25
f
(%)
5 V
6 V
3 V
4.5 V
5 V
6 V
V =
CC
3 V
(a)
handbook, halfpage
MSB711
T ( C)
amb
0
f
(%)
o15010050050
25
20
15
10
5
5
10
15
20
25
5 V
6 V
3 V
5 V
6 V
V =
CC
3 V
(b)
A
handbook, halfpage
MSB712
T ( C)
amb
0
f
(%)
o15010050050
25
20
15
10
5
5
10
15
20
25
5 V
6 V
(c)
V =
CC
3 V 3 V
6 V
5 V
1997 Nov 25 22
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.18 Continued.
(d) R2=3k
R
1=(e) R2=10k
R
1=(f) R2= 300 k
R1=
To obtain optimum temperature stability, C1 must be as small as possible but larger than 100 pF.
1997 Nov 25 23
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.19 Graphs showing VCO frequency (fVCO) as a function of the VCO input voltage (VVCOIN).
(a) R1=3k;
C
1= 40 pF
(c) R1= 300 k;
C1=40pF (d) R1= 300 k;
C1= 100 nF
(b) R1=3k;
C
1= 100 nF
To obtain optimum temperature stability, C1 must be as small as possible but larger than 100 pF.
1997 Nov 25 24
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.20 Definition of VCO frequency linearity:
V = 0.5 V over the VCC range:
for VCO linearity
f‘0f1f2
+
2
---------------
=
linearity f‘0f0
f‘0
---------------- 100%×=Fig.21 Frequency linearity as a function of R1, C1
and VCC: R2 = and V = 0.5 V.
Fig.22 Power dissipation
versus the value of R1:
CL= 50 pF;
R2 = ;
VVCOIN = 1/2 VCC;
Tamb =25°C.
 C1 = 40 pF
- - - -C1 = 1 µF
Fig.23 Power dissipation
versus the value of R2:
CL= 50 pF;
R1 = ;
VVCOIN =GND=0V;
T
amb =25°C.
 C1 = 40 pF
- - - - C1 = 1 µFFig.24 Typical dc power
dissipation of
demodulator sections
as a function of RS:
R1=R2=;
T
amb =25°C;
VVCOIN = 1/2 VCC.
1997 Nov 25 25
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
APPLICATION INFORMATION
This information is a guide for the approximation of values of external components to be used with the 74HC/HCT4046A
in a phase-lock-loop system.
References should be made to Figs 29, 30 and 31 as indicated in the table.
Values of the selected components should be within the following ranges:
R1 between 3 kand 300 k;
R2 between 3 kand 300 k;
R1 + R2 parallel value >2.7 k;
C1 greater than 40 pF.
SUBJECT PHASE
COMPARATOR DESIGN CONSIDERATIONS
VCO frequency characteristic
VCO frequency
without extra
offset
PC1, PC2 or PC3 With R2 = and R1 within the range 3 kΩ<R1 <300 k, the
characteristics of the VCO operation will be as shown in Fig.25.
(Due to R1, C1 time constant a small offset remains when R2 = .).
Fig.25 Frequency characteristic of VCO operating without offset:
f0= centre frequency; 2fL= frequency lock range.
Selection of R1 and C1
PC1 Given fo, determine the values of R1 and C1 using Fig.29.
PC2 or PC3 Given fmax and fo, determine the values of R1 and C1 using Fig.29, use
Fig.31 to obtain 2fLand then use this to calculate fmin.
1997 Nov 25 26
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
VCO frequency characteristic
VCO frequency
with extra
offset
PC1, PC2 or PC3 With R1 and R2 within the ranges 3 kΩ<R1 <300 k,
3kΩ<R2 <300 k, the characteristics of the VCO operation will be as
shown in Fig.26.
Fig.26 Frequency characteristic of VCO operating with offset:
fo= centre frequency; 2fL= frequency lock range.
Selection of R1, R2 and C1
PC1, PC2 or PC3 Given foand fL, determine the value of product R1C1 by using Fig.31.
Calculate foff from the equation foff =f
o1.6fL.
Obtain the values of C1 and R2 by using Fig.30.
Calculate the value of R1 from the value of C1 and the product R1C1.
PLL conditions
with no signal at
the SIGIN input
PC1 VCO adjusts to fowith φDEMOUT =90°and VVCOIN = 1/2 VCC (see Fig.6).
PC2 VCO adjusts to fowith φDEMOUT =360°and VVCOIN = min. (see Fig.8).
PC3 VCO adjusts to fowith φDEMOUT =360°and VVCOIN = min. (see Fig.10).
SUBJECT PHASE
COMPARATOR DESIGN CONSIDERATIONS
1997 Nov 25 27
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
PLL frequency
capture range PC1, PC2 or PC3 Loop filter component selection
(a) τ= R3 x C2 (b) amplitude characteristic (c) pole-zero diagram
A small capture range (2fc) is obtained if
Fig. 27 Simple loop filter for PLL without offset; R3 500 .
(a) τ1 = R3 x C2; (b) amplitude characteristic (c) pole-zero diagram
τ2 = R4 x C2;
τ3 = (R3 + R4) x C2
Fig.28 Simple loop filter for PLL with offset; R3 + R4 500 .
PLL locks on
harmonics at
centre frequency
PC1 or PC3 yes
PC2 no
noise rejection at
signal input PC1 high
PC2 or PC3 low
AC ripple content
when PLL is
locked
PC1 fr=2f
i
, large ripple content at φDEMOUT =90°
PC2 fr=f
i
, small ripple content at φDEMOUT =0°
PC3 fr=f
i
, large ripple content at φDEMOUT = 180°
SUBJECT PHASE
COMPARATOR DESIGN CONSIDERATIONS
2fc1
π
--- 2πfLτ
1997 Nov 25 28
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.29 Typical value of VCO centre frequency (fo) as a function of C1: R2 = ; VVCOIN = 1/2 VCC; INH = GND;
Tamb =25°C.
To obtain optimum VCO performance, C1 must be as small as possible but larger than 100 pF.
Interpolation for various values of R1 can be easily calculated because a constant R1C1 product will produce almost the same VCO output frequency.
1997 Nov 25 29
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.30 Typical value of frequency offset as a function of C1: R1 = ;V
VCOIN = 1/2 VCC; INH = GND; Tamb =25°C.
To obtain optimum VCO performance, C1 must be as small as possible but larger than 100 pF.
Interpolation for various values of R2 can be easily calculated because a constant R2C1 product will produce almost the same VCO output frequency.
1997 Nov 25 30
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.31 Typical frequency lock range (2fL) versus the product R1C1: VVCOIN range = 0.9 to (VCC 0.9) V;
R2 = ; VCO gain:
KV2fL
VVCOIN range
------------------------------------- 2πrsV()
˙
.=
1997 Nov 25 31
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
PLL design example
The frequency synthesizer, used in
the design example shown in Fig.32,
has the following parameters:
Output frequency: 2 MHz to 3 MHz
frequency steps : 100 kHz
settling time : 1 ms
overshoot : <20%
The open-loop gain is
H (s) x G (s) = Kp×Kf×Ko×Kn.
Where:
Kp= phase comparator gain
Kf= low-pass filter transfer gain
Ko=K
v
/s VCO gain
Kn= 1/n divider ratio
The programmable counter ratio
Kncan be found as follows:
The VCO is set by the values of R1,
R2 and C1, R2 = 10 k(adjustable).
The values can be determined using
the information in the section
“DESIGN CONSIDERATIONS”.
With fo= 2.5 MHz and fL= 500 kHz
this gives the following values
(VCC = 5.0 V):
R1 = 10 k
R2 = 10 k
C1 = 500 pF
Nmin. fout
fstep
----------- 2MHz
100 kHz
---------------------- 20== =
N
max. fout
fstep
----------- 3MHz
100 kHz
---------------------- 30== =
The VCO gain is:
The gain of the phase
comparator is:
The transfer gain of the filter is
given by:
Where:
The characteristics equation is:
1+H(s)×G (s) = 0.
This results in:
The natural frequency ωnis
defined as follows:
Kv2fL2π××
0.9 VCC 0.9()
-----------------------------------------------
˙==
1MHz
3.2
----------------- 2π210
6
×× r/s/V=
KpVCC
4π×
------------ 0.4 V/r.==
K
f1τ
2
s+
1τ
1
τ
2
+()s+
------------------------------------- .=
τ1R3C2 and τ2R4C2.==
s21K
pK
vK
nτ
2
×××+τ
1τ
2
+()
----------------------------------------------------- s++
KpKvKn
××
τ1τ2
+()
-------------------------------- 0.=
ωnKpKvKn
××
τ1τ2
+()
-------------------------------- .=
and the damping value ζis defined as
follows:
In Fig.33 the output frequency response to
a step of input frequency is shown.
The overshoot and settling time
percentages are now used to determine
ωn. From Fig.33 it can be seen that the
damping ratio ζ= 0.45 will produce an
overshoot of less than 20% and settle to
within 5% at ωnt = 5. The required settling
time is 1 ms.
This results in:
Rewriting the equation for natural
frequency results in:
The maximum overshoot occurs at Nmax.:
When C2 = 470 nF, then
now R3 can be calculated:
ζ1
2ωn
---------- 1K
pK
vK
nτ
2
×××+τ
1τ
2
+()
-----------------------------------------------------
×=
ωn5
t
--- 5
0.001
--------------- 510
3
×r/s.== =
τ
1τ
2
+()
K
p
K
v
K
n
××
ω
n
2
-------------------------------- .=
τ1τ2
+()
0.4210
6
××
5000230×
--------------------------------- 0.0011 s.==
R4 τ1τ2
+()2ω
n
ζ1×××
K
p
K
v
K
n
C2×××
----------------------------------------------------------------- 315 ==
R3 τ1
C2
-------- R4 =2 k.=
1997 Nov 25 32
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
Fig.32 Frequency synthesizer.
note
For an extensive description and application example
please refer to application note ordering number
9398 649 90011.
Also available a computer design program for PLL’s
ordering number 9398 961 10061.
Fig.33 Type 2, second order frequency step response.
full pagewidth
012 4
1.6
1.0
0.6
0
0.8
MSB740
3
1.4
1.2
0.4
0.2
5678
ω
n
t
0.6
0
0.4
1.0
0.2
0.4
0.2
0.6
0.8
= 5.0
ζ
0.5
0.707
1.0
= 0.3
ζ
= 2.0
ζ
∆Θe/ωn
∆Θe (t)
∆ωe/ωn
∆ωe (t)
Since the output frequency is proportional to the VCO
control voltage, the PLL frequency response can be
observed with an oscilloscope by monitoring pin 9 of the
VCO. The average frequency response, as calculated by
the Laplace method, is found experimentally by smoothing
this voltage at pin 9 with a simple RC filter, whose time
constant is long compared to the phase detector sampling
rate but short compared to the PLL response time.
Fig.34 Frequency compared to the time response.
1997 Nov 25 33
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO, SSOP and TSSOP
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO, SSOP
and TSSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method.
Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering can be used for all SO packages. Wave
soldering is not recommended for SSOP and TSSOP
packages, because of the likelihood of solder bridging due
to closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering is used - and cannot be avoided for
SSOP and TSSOP packages - the following conditions
must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder
thieves at the downstream end.
Even with these conditions:
Only consider wave soldering SSOP packages that
have a body width of 4.4 mm, that is
SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
Do not consider wave soldering TSSOP packages
with 48 leads or more, that is TSSOP48 (SOT362-1)
and TSSOP56 (SOT364-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1997 Nov 25 34
Philips Semiconductors Product specification
Phase-locked-loop with VCO 74HC/HCT4046A
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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NXP:
74HC4046AD,652 74HC4046AD,653 74HC4046AN,652 74HCT4046AD,112 74HCT4046AD,118
74HCT4046AN,112