Ceramic Package
44
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the lim-
its of dimension k do not apply.
3. This dimension allows f or off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maxim um lim-
its of lead dimensions b and c or M shall be measured at the cen-
troid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners.
7. For bottom-br azed lead packages, no organic or polymeric mate-
rials shall be molded to the bottom of the package to cover the
leads.
8. Dimension Q shall be measured at the point of exit (be y ond the
meniscus) of the lead from the body. Dimension Q minimum
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-
der dip lead finish is applied.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
-D-
-C-
0.004 H A - B
MD
S S
-A- -B-
0.036 H A - B
MD
S S
e
E
A
Q
L
D
A
E1
SEATING AND
LE2
E3 E3
BASE PLANE
-H-
b
C
S1
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
PIN NO. 1
ID AREA
A
M
Ceramic Metal Seal Flatpack Packages (Flatpack)
K16.B
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.115 - 2.92 -
b 0.015 0.022 0.38 0.56 -
b1 0.015 0.019 0.38 0.48 -
c 0.003 0.009 0.08 0.23 -
c1 0.003 0.006 0.08 0.15 -
D - 0.440 - 11.18 3
E 0.280 0.295 7.24 7.49 -
E1 - 0.315 - 8.00 3
E2 0.130 - 3.30 - -
E3 0.030 - 0.76 - 7
e 0.050 BSC 1.27 BSC -
k 0.008 0.015 0.20 0.38 2
L 0.250 0.370 6.35 9.40 -
Q 0.026 0.045 0.66 1.14 8
S1 0.005 - 0.13 - 6
M - 0.0015 - 0.04 -
N16 16-
Rev. 0 5/18/94
