M TC1412/TC1412N 2A High-Speed MOSFET Drivers Features General Description * Latch-Up Protected: Will Withstand 500 mA Reverse Current * Input Will Withstand Negative Inputs Up to 5V * ESD Protected: 4 kV * High Peak Output Current: 2A * Wide Input Supply Voltage Operating Range: - 4.5V to 16V * High Capacitive Load Drive Capability: - 1000 pF in 18 nsec * Short Delay Time: 35 nsec Typ. * Matched Delay Times * Low Supply Current: - With Logic `1' Input: 500 A - With Logic `0' Input: 100 A * Low Output Impedance: 4 * Available in Space-Saving 8-pin MSOP Package * Pinout Same as TC1410/TC1411/TC1413 The TC1412/TC1412N are 2A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge. As MOSFET drivers, the TC1412/TC1412N can easily charge a 1000 pF gate capacitance in 18 nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET's intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. Applications * * * * Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Relay Driver Package Type 8-Pin MSOP/PDIP/SOIC VDD 1 8 VDD IN 2 OUT TC1412 7 NC 3 GND 4 2 VDD 1 IN 2 6 OUT NC 3 5 GND GND 4 6,7 Inverting 8 VDD TC1412N 7 OUT 6 OUT 5 GND 2 6,7 Non-Inverting NC = No Internal Connection NOTE: Duplicate pins must be connected together for proper operation. 2003 Microchip Technology Inc. DS21391C-page 1 TC1412/TC1412N Functional Block Diagram TC1412 VDD Inverting Outputs 300 mV Output Non-Inverting Outputs Input Effective Input C = 10 pF 4.7V TC1412N GND DS21391C-page 2 2003 Microchip Technology Inc. TC1412/TC1412N 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Symbol Absolute Maximum Ratings Description VDD Supply input, 4.5V to 16V Control input INPUT Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND - 5.0V Power Dissipation (TA 70C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range.............. -65C to +150C Maximum Junction Temperature ...................... +150C NC No connection GND Ground GND Ground OUTPUT CMOS push-pull output, common to pin 7 OUTPUT CMOS push-pull output, common to pin 6 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Supply input, 4.5V to 16V VDD DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 16V. Typical values are measured at TA = +25C, VDD = 16V. Parameters Sym Min Typ Max Units Logic `1', High Input Voltage VIH 2.0 -- -- V Logic `0', Low Input Voltage VIL -- -- 0.8 V Input Current IIN -1.0 -- 1.0 A -10 -- 10 Conditions Input 0V VIN VDD, TA = +25C -40C TA +85C Output High Output Voltage VOH VDD - 0.025 -- -- Low Output Voltage VOL -- -- Output Resistance RO -- 4 -- 5 7 V DC Test 0.025 V DC Test 6 VDD = 16V, IO = 10 mA, TA = +25C 0C TA +70C -40C TA +85C -- 5 7 2.0 -- A VDD = 16V Duty cycle 2%, t 300 sec, VDD = 16V Peak Output Current IPK -- Latch-Up Protection Withstand Reverse Current IREV -- 0.5 -- A tR -- 18 26 nsec -- 20 31 Switching Time (Note 1) Rise Time Fall Time tF TA = +25C 0C TA +70C -40C TA +85C, Figure 4-1 -- 22 31 -- 18 26 -- 20 31 0C TA +70C -- 22 31 -40C TA +85C, Figure 4-1 nsec TA = +25C Note 1: Switching times ensured by design. 2003 Microchip Technology Inc. DS21391C-page 3 TC1412/TC1412N DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 16V. Typical values are measured at TA = +25C, VDD = 16V. Parameters Delay Time Delay Time Sym Min Typ Max Units tD1 -- 35 45 nsec -- 40 50 0C TA +70C -- 40 50 -- 35 45 -40C TA +85C, Figure 4-1 TA = +25C -- 40 50 -- 40 50 -- 0.5 1.0 -- 0.1 0.15 tD2 nsec Conditions TA = +25C, 0C TA +70C -40C TA +85C, Figure 4-1 Power Supply Power Supply Current IS mA VIN = 3V, VDD = 16V VIN = 0V Note 1: Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Sym Min Typ Max Units Specified Temperature Range (C) TA 0 -- +70 C Specified Temperature Range (E) TA -40 -- +85 C Maximum Junction Temperature TJ -- -- +150 C Storage Temperature Range TA -65 -- +150 C Thermal Resistance, 8L-MSOP JA -- 206 -- C/W Thermal Resistance, 8L-PDIP JA -- 125 -- C/W Thermal Resistance, 8L-SOIC JA -- 155 -- C/W Conditions Temperature Ranges Package Thermal Resistances DS21391C-page 4 2003 Microchip Technology Inc. TC1412/TC1412N 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 16V. 500 500 TA = +25C 400 VIN = 3V ISUPPLY (A) ISUPPLY (A) 400 300 200 100 0 VSUPPLY = 16V VIN = 3V 6 8 10 12 14 200 100 VIN = 0V 4 300 0 16 VIN = 0V -40 -20 VDD (V) FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage. FIGURE 2-4: vs. Temperature. 1.6 1.6 TA = +25C 20 40 60 80 Quiescent Supply Current VSUPPLY = 16V 1.5 VIH VTHRESHOLD (V) VTHRESHOLD (V) 1.5 1.4 1.3 1.2 4 6 VIH 1.4 1.3 VIL 1.2 VIL 1.1 8 10 12 14 16 1.1 -40 -20 FIGURE 2-2: Voltage. Input Threshold vs. Supply FIGURE 2-5: Temperature. 13 13 11 11 RDS-ON (Ohms) TA = +85C 9 TA = +25C 7 5 TA = -40C 3 0 20 40 60 80 TEMPERATURE (C) VDD (V) RDS-ON (Ohms) 0 TEMPERATURE (C) Input Threshold vs. TA = +85C 9 7 TA = +25C 5 3 TA = -40C 1 1 4 6 8 10 VDD (V) 12 14 FIGURE 2-3: High-State Output Resistance vs. Supply Voltage. 2003 Microchip Technology Inc. 16 4 6 8 10 VDD (V) 12 14 16 FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage. DS21391C-page 5 TC1412/TC1412N Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 16V. 70 CLOAD = 1000 pF 60 60 50 50 40 tFALL (nsec) tRISE (nsec) 70 TA = +85C 30 TA = +25C CLOAD = 1000 pF 40 TA = +85C 30 TA = +25C 20 20 TA = -40C 10 4 6 TA = -40C 8 10 12 14 10 16 4 6 8 10 VDD (V) FIGURE 2-7: Voltage. 100 Rise Time vs. Supply FIGURE 2-10: Voltage. 100 CLOAD = 1000 pF 70 60 tD2 (nsec) tD1 (nsec) TA = +85C TA = +25C 50 Fall Time vs. Supply CLOAD = 1000 pF TA = +85C 70 60 TA = +25C 50 40 40 TA = -40C 30 4 6 8 30 10 12 14 TA = -40C 20 16 4 6 8 10 VDD (V) FIGURE 2-8: Supply Voltage. 12 14 16 VDD (V) Propagation Delay vs. FIGURE 2-11: Supply Voltage. Propagation Delay vs. 39 TA = +25C VDD = 16V 50 tRISE 40 tFALL 30 20 10 Propagation Delays (nsec) 60 tRISE, tFALL (nsec) 16 80 80 0 14 90 90 20 12 VDD (V) TA = +25C VDD = 16V 38 tD2 37 36 tD1 35 34 33 32 0 1000 2000 3000 4000 5000 0 1000 CLOAD (pF) FIGURE 2-9: Capacitive Load. DS21391C-page 6 Rise and Fall Times vs. 2000 3000 4000 5000 CLOAD (pF) FIGURE 2-12: Capacitive Load. Propagation Delays vs. 2003 Microchip Technology Inc. TC1412/TC1412N 3.0 PIN DESCRIPTIONS 3.3 The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. Symbol 1 VDD 2 INPUT PIN FUNCTION TABLE Description Supply input, 4.5V to 16V Control input 3 NC 4 GND No connection Ground 5 GND Ground 6 OUTPUT CMOS push-pull output, common to pin 7 7 OUTPUT CMOS push-pull output, common to pin 6 8 3.1 VDD CMOS Push-Pull Output (OUTPUT) The MOSFET driver output is a low-impedance, CMOS push-pull style output, capable of driving a capacitive load with 2A peak currents. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 No Connect (NC) No internal connection. Supply input, 4.5V to 16V Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 F is suggested. 3.2 Control Input (INPUT) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300 mV of hysteresis between the high and low thresholds which prevents output glitching even when the rise and fall time of the input signal is very slow. 2003 Microchip Technology Inc. DS21391C-page 7 TC1412/TC1412N 4.0 APPLICATION INFORMATION +5V 90% Input VDD = 16V 0V 1.0 F 0.1 F 1, 8 Input 10% tD1 tD2 tF VDD tR 90% 90% Output 2 6, 7 Output 10% 10% 0V CL = 1000 pF Inverting Driver TC1412 TC1412N TC1412 +5V 90% Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL 10 nsec 0V VDD 10% tD1 90% tR Output 0V 10% 90% tD2 tF 10% Non-Inverting Driver TC1412N FIGURE 4-1: DS21391C-page 8 Switching Time Test Circuit. 2003 Microchip Technology Inc. TC1412/TC1412N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW Example: 1412NE 347057 XXXXXXX YWWNNN Note: * Example: 057 8-Lead MSOP XX...X YY WW NNN TC1412 CPA057 0347 TC1412 COA0347 NNN Legend: Example: Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. 2003 Microchip Technology Inc. DS21391C-page 9 TC1412/TC1412N 8-Lead Plastic Dual In-line (PA) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B1 B eB MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21391C-page 10 2003 Microchip Technology Inc. TC1412/TC1412N 8-Lead Plastic Small Outline (OA) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 2003 Microchip Technology Inc. DS21391C-page 11 TC1412/TC1412N 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) E E1 p D 2 B n 1 A2 A c A1 (F ) L Units Dimens ion Limits n p MIN INC HE S NOM MAX MILLIME T E R S * NOM 8 0.65 B S C 0.75 0.85 0.00 4.90 B S C 3.00 B S C 3.00 B S C 0.40 0.60 0.95 R E F 0 0.08 0.22 5 5 - MIN Number of P ins 8 P itch .026 B S C Overall Height A .043 .030 .033 .037 Molded P ackage T hicknes s A2 .000 .006 S tandoff A1 Overall Width .193 B S C E Molded P ackage Width E1 .118 B S C Overall Length .118 B S C D .016 .024 .031 F oot Length L F ootprint (R eference) F .037 R E F F oot Angle 0 8 c Lead T hicknes s .003 .006 .009 B Lead Width .009 .012 .016 Mold Draft Angle T op 5 15 Mold Draft Angle B ottom 5 15 *C ontrolling P arameter Notes : Dimens ions D and E 1 do not include mold flas h or protrus ions . Mold flas h or protrus ions s hall not exceed .010" (0.254mm) per s ide. MAX 1.10 0.95 0.15 0.80 8 0.23 0.40 15 15 J E DE C E quivalent: MO-187 Drawing No. C 04-111 DS21391C-page 12 2003 Microchip Technology Inc. TC1412/TC1412N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Package Device: TC1412: 2 A Single MOSFET Driver, Inverting TC1412N: 2 A Single MOSFET Driver, Non-Inverting Temperature Range: C E Package: = = 0C to +70C -40C to +85C OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead Examples: a) b) c) a) b) c) TC1412COA: 2A Single MOSFET driver, SOIC package, 0C to +70C. TC1412CPA: 2A Single MOSFET driver, PDIP package, 0C to +70C. TC1412EUA713: Tape and Reel, 2A Single MOSFET driver, MSOP package, -40C to +85C. TC1412NCPA: 2A Single MOSFET driver, PDIP package, 0C to +70C. TC1412NEPA: 2A Single MOSFET driver, PDIP package, -40C to +85C. TC1412NEUA: 2A Single MOSFET driver, MSOP package, -40C to +85C. * MSOP package is only available in E-Temp. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21391C-page 13 TC1412/TC1412N NOTES: DS21391C-page 14 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2003 Microchip Technology Inc. DS21391C-page 15 M WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Corporate Office Australia 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Microchip Technology Australia Pty Ltd Marketing Support Division Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 China - Beijing 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. 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Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 03/25/03 DS21391C-page 16 2003 Microchip Technology Inc.