SN54LS11, SN54S11,
SN74LS11, SN74S11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDLS131 – APRIL 1985 – REVISED MARCH 1988
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright  1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54LS11, SN54S11,
SN74LS11, SN74S11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDLS131 – APRIL 1985 – REVISED MARCH 1988
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS11, SN54S11,
SN74LS11, SN74S11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDLS131 – APRIL 1985 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS11, SN54S11,
SN74LS11, SN74S11
TRIPLE 3-INPUT POSITIVE-AND GATES
SDLS131 – APRIL 1985 – REVISED MARCH 1988
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
JM38510/08001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
08001BCA
JM38510/08001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
08001BDA
JM38510/31001B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
31001B2A
JM38510/31001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
31001BCA
JM38510/31001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
31001BDA
M38510/08001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
08001BCA
M38510/08001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
08001BDA
M38510/31001B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
31001B2A
M38510/31001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
31001BCA
M38510/31001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
31001BDA
SN54LS11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS11J
SN54S11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S11J
SN74LS11D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS11
SN74LS11DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS11
SN74LS11DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS11
SN74LS11DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS11
SN74LS11DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS11
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
SN74LS11DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS11
SN74LS11J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70
SN74LS11N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS11N
SN74LS11N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74LS11NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS11N
SN74LS11NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS11
SN74LS11NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS11
SN74LS11NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS11
SN74S11D OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70
SN74S11N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74S11N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SNJ54LS11FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
11FK
SNJ54LS11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS11J
SNJ54LS11W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS11W
SNJ54S11FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S
11FK
SNJ54S11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S11J
SNJ54S11W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S11W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 3
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS11, SN54S11, SN74LS11, SN74S11 :
•Catalog: SN74LS11, SN74S11
•Military: SN54LS11, SN54S11
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS11DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS11DR SOIC D 14 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
