HLMP-RL20, HLMP-SL20
Precision Optical Performance Amber
New 4mm Superwide Oval LED
Data Sheet
Description
The Precision Optical Performance Oval LED is specifically
designed for variable message signs and passenger infor-
mation signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
Features
x Well defined spatial radiation pattern
x High brightness material
x Available in amber
– Amber AlInGaP 590nm
x Superior resistance to moisture
x Typical viewing angle 60° x 120°
x Standoff Package
Applications
x Variable message signs
x Commercial outdoor advertising
Notes:
All dimensions in millimeters (inches).
6.2 ± 0.25
0.244 ± 0.010
3.9 ± 0.25
0.154 ± 0.010
9.9 ± 0.5
0.39 ± 0.02
1.0
0.04 TYP. 0.5
0.02 TYP.
2.54
0.100 NOM.
1.4
0.055 TYP.
1.0
0.039 MIN.
25.4
1.0 MIN.
CATHODE LEAD
3.0 ± 0.25
0.118 ± 0.010
Package Dimensions
Package Drawing A
Package Drawing B
6.3 ± 0.25
0.248 ± 0.010
4 ± 0.25
0.157 ± 0.010
9.9 ± 0.5
0.39 ± 0.020
0.5
0.02 TYP.
2.54
0.100 NOM.
1.4
0.055 TYP.
1.0
0.04 MIN.
25.4
1.0 MIN.
CATHODE LEAD
4 ± 0.25
0.157 ± 0.010
1.2
0.047 TYP.
2
Part Numbering System
Device Selection Guide
Part Number
Color and Dominant
Wavelength Od (nm) Typ
Luminous Intensity
Iv (mcd) at 20 mA-Min
Luminous Intensity
Iv (mcd) at 20 mA-Max Package Drawing
HLMP-RL20-MP0DD Amber 590 520 1150 A
HLMP-SL20-MP0DD Amber 590 520 1150 B
Tolerance for each intensity limit is ± 15%.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
Note:
Please refer to AB 5337 for complete information about part numbering system.
Packaging Option
DD: Ammo pack
00 : Bulk
Color Bin Selection
0: Full color bin distribution
Maximum Intensity Bin
Refer to Intensity Bin Limit Table
Minimum Intensity Bin
Refer to Intensity Bin Limit Table
Color
L: Amber 590
Package
R: 4mm Oval 60° x 120°, Parallel
S: 4mm Oval 60° x 120°, Perpendicular
HLMP – x x 20 – x x x xx
3
Electrical / Optical Characteristics
TA = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage VF1.80 2.02 2.40 V IF = 20 mA
Reverse Voltage VR5VI
R = 100 PA
Dominant Wavelength[1] Od584.5 594.5 nm IF = 20 mA
Peak Wavelength OPEAK 594 nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance RTJ-PIN 240 °C/W LED Junction-to-Cathode Lead
Luminous Efficacy [2]
Amber
KV480 lm/W Emitted Luminous Flux/Emitted
Radiant Flux
Luminous Flux Mv500 mlm IF = 20 mA
Luminous Efficiency [3] Ke12 lm/W Emitted Luminous Flux/Electrical
Power
IF = 20 mA
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is
the luminous efficacy in lumens/watt.
3. Ke = MV / IF x VF, where MV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
Absolute Maximum Ratings
TA = 25°C
Parameter Amber Unit
DC Forward Current [1] 50 mA
Peak Forward Current [2] 100 mA
Average Forward Current 30 mA
Reverse Voltage (IR = 100 PA) 5 V
LED Junction Temperature 130 °C
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, frequency 1KHz.
4
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5. Representative Radiation Pattern – Major Axis Figure 6. Representative Radiation Pattern – Minor Axis
TA - AMBIENT TEMPERATURE - °C
IF - FORWARD CURRENT - mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
500 550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
0
10
20
30
40
50
0123
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0
5
10
15
20
25
30
35
40
45
50
55
0 20 40 60 80 100 120
0
0.5
1
1.5
2
0 1020304050
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
5
Intensity Bin Limit Table
Bin Name Min. Max.
M 520 680
N 680 880
P 880 1150
Q 1150 1500
Tolerance for each bin limit is ± 15%
Color Bin Limit
Bin ID Min. Max.
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
Tolerance for each bin limit is ±1.0 nm
6
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59 mm
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105°C Max. –
Preheat time 60 sec Max –
Peak temperature 250°C Max. 260°C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
x Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is
advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 250°C and
the solder contact time does not exceeding 3sec. Over-stressing
the LED during soldering process might cause premature failure
to the LED due to delamination.
Avago Technologies LED Configuration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
CATHODE
7
Example of Wave Soldering Temperature Profile for TH LED
Ammo Packs Drawing
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
PREHEAT
TEMPERATURE (°C)
6.35±1.30
0.25±0.0512
CATHODE
VIEW A - A
Ø TYP.
12.70±1.00
0.50±0.0394
20.5±1.00
0.8071±0.0394
4.00±0.20
0.1575±0.0079
0.70±0.20
0.276±0.0079
12.70±0.30
0.50±0.0118
9.125±0.625
0.3593±0.025
18.00±0.50
0.7087±0.0197
AA
8
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS
ANODE LEAD LEAVES
THE BOX FIRST
LABEL ON THIS
SIDE OF BOX
CATHODE
+
ANODE
AVAGO
TECHNOLOGIES
MOTHER LABEL
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-2258EN - November 30, 2009
Acronyms and Definition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(ii) Avago Baby Label (Only available on bulk packaging)
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
