GE Data Sheet
October 1, 2015 ©2012 General Electric Company. All rights reserved.
EQW006 Series, Eight Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
Features
Compliant to RoHS EU Directive 2011/65/EU (Z versions)
Compliant to RoHS EU Directive 2011/65/EU under
exemption 7b (Lead solder exemption). Exemption 7b will
expire after June 1, 2016 at which time this produc twill no
longer be RoHS compliant (non-Z versions)
Delivers up to 6A output current
High efficiency: 91.5% at 12V full load (VIN = 48Vdc)
Industry-Standard Eighth-brick foot print:
57.9 mm x 22.8 mm x 8.52 mm
(2.28 in x 0.90 in x 0.335 in)
Low output ripple and noise
Surface mount or through hole
Cost efficient open frame design
Remote On/Off positive logic (primary referenced)
Remote Sense
Adjustable output voltage
Constant switching frequency (330 kHz)
Output over voltage and over current protection
Over temperature protection
Input undervoltage lockout
Wide operating temperature range (-40°C to 85°C)
UL* 60950 Recognized, CSA† C22.2 No. 60950-00 Certified,
and VDE‡ 0805 (IEC60950, 3rd edition) Licensed
CE mark meets 73/23/EEC and 93/68/EEC directives§
ISO** 9001 and ISO14001 certified manufacturing facilities
Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation
rating per IEC60950 3rd edition
Applications
Distributed power architectures
Wireless networks
Access and optical network Equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
Remote On/Off logic (positive or negative)
Surface Mount (-S Suffix)
Short Pins
Description
The EQW series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 6A of output current and
provide a precisely regulated output voltage of 12Vdc over a wide range of input voltages (Vi = 36 -75Vdc). The modules
achieve full load efficiency of 91.5% at 12Vdc output voltage. The open frame modules construction, available in both
surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions. Standard
features include remote On/Off, remote sense, output voltage adjustment, over voltage, over current and over
temperature protection.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient (100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation voltage (100% factory Hi-Pot tested) All 1500 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 2.5 Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current All IIN,No load 75 mA
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current All IIN,stand-by 3 mA
(VIN = VIN, nom, module disabled)
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN,
max, IO= IOmax ; See Test configuration section)
All 13 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
EMC,EN5022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a
time-delay fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in
this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used.
Refer to the fuse manufacturer’s data sheet for further information.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point All VO, set 11.8 12.0 12.2 Vdc
(VIN=IN, min, IO=IO, max, TA=25°C)
Output Voltage All VO 11.6 12.4 Vdc
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Adjustment Range All VO 10.8 13.2 Vdc
Selected by external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max) All
0.1 % VO, set
Load (IO=IO, min to IO, max) All
0.1 % VO, set
Temperature (Tref=TA, min to TA, max) All
0.2 % VO, set
Output Ripple and Noise on nominal output
measured with 10F Tantalum, 1F ceramic
(VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth) All 15 25 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 75 mVpk-pk
External Capacitance All CO, max 0 1000 μF
Output Current All Io 0 6 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 7.0 Adc
(VO= 90% of VO, set)
Output Short-Circuit Current All IO, s/c 0.5 Adc
(VO≤250mV) ( Hiccup Mode )
Efficiency
VIN= VIN, nom, TA=25°C All η 91.5 %
IO=IO, max , VO= VO,set
Switching Frequency All fsw 300 kHz
Dynamic Load Response
(dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% of Io,max; 220F
Tantalum or Electrolytic external capacitance
Peak Deviation All Vpk 200 mV
Settling Time (Vo<10% peak deviation) All ts 250 s
(Io/t=0.1A/s; Vin=Vin,set; TA=25°C)
Load Change from Io= 50% to 25% of Io,max;
220F Tantalum or Electrolytic external capacitance
Peak Deviation All Vpk 200 mV
Settling Time (Vo<10% peak deviation) All ts 250 s
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All Ciso 1000 pF
Isolation Resistance All Riso 10 MΩ
I/O Isolation Voltage All All 1500 Vdc
General Specifications
Parameter Device Min Typ Max Unit
Calculated MTBF (VIN=VIN, nom, IO=0.8IO,max, TA=40C) 1,795,700 Hours
Telcordia SR332 Issue 1: Method 1, Case 3
Weight All
15.2 (0.6) g (oz.)
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current All Ion/off 0.15 1.0 mA
Logic Low - On/Off Voltage All Von/off -0.7 1.2 V
Logic High Voltage – (Typ = Open Collector) All Von/off 15 V
Logic High maximum allowable leakage current All Ion/off 10 μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25 oC)
Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (delay from
instant at which VIN = VIN, min until Vo=10% of Vo,set)
All Tdelay — 20 — msec
Case 2: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (Tdelay =
from instant at which VIN=VIN, min until VO = 10% of VO, set).
All Tdelay — 12 — msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise — 5 — msec
Output voltage overshoot – Startup — 5
% VO, set
IO= 80% of IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Remote Sense Range All VSENSE 0.5 Vdc
Over temperature Protection
All Tref 120 °C
Output Overvoltage Protection All VO, limit 13.8 15 V
Input Undervoltage Lockout
Turn-on Threshold All VUVLO — 32 36 V
Turn-off Threshold 25 27 — V
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6
Characteristic Curves
The following figures provide typical characteristics for the EQW006A0B1 (12V, 6A) at 25oC. The figures are identical for
either positive or negative remote On/Off logic.
EFFICIENCY, (%)
70
74
78
82
86
90
94
0 123456
VIN=36
V
VIN=48
V
VIN=75
V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
7
20 30 40 50 60 70 80 90
10 0 LF M
200 LFM
400 LFM
NC
300 LFM
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 1. Converter Efficiency versus Output Current. Figure 4. Derating Output Current versus Local Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
VO (V) (10mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
V On/off (V) (2V/div) VO (V) (5V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 2. Typical output ripple and noise (VIN
= VIN,NOM, Io
=
Io,max).
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
OUTPUT CURRENT, OUTPUT VOLTAGE
Io (A) (1A/div) VO (V) (200mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (20V/div) VO (V) (5V/div)
TIME, t (200 s /div) TIME, t (5ms/div)
Figure 3. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 6. Typical Start-up Using Input Voltage (VIN
=
VIN,NOM, Io = Io,max).
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O (+)
V O ( – ) 0.01uF
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
0.1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power module.
For the test configuration in Figure 7 a 33μF electrolytic
capacitor (ESR<0.7 at 100kHz), mounted close to the
power module helps ensure the stability of the unit.
Consult the factory for further application guidelines.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.,
UL60950, CSA C22.2 No. 60950-00 and VDE 0805:2001-
12 (IEC60950, 3rd Ed).
These converters have been evaluated to the spacing
requirements for Basic Insulation, per the above safety
standards; and 1500 Vdc is applied from Vi to Vo to
100% of outgoing production.
For all input voltages, other than DC MAINS, where the
input voltage is less than 60V dc, if the input meets all of
the requirements for SELV, then:
The output may be considered SELV. Output
voltages will remain within SELV limits even with
internally-generated non-SELV voltages. Single
component failure and fault tests were performed
in the power converters.
One pole of the input and one pole of the output are
to be grounded, or both circuits are to be kept
floating, to maintain the output voltage to ground
voltage within ELV or SELV limits.
For all input sources, other than DC MAINS, where the
input voltage is between 60 and 75V dc (Classified as
TNV-2 in Europe), the following must be adhered to, if the
converter’s output is to be evaluated for SELV:
The input source is to be provided with reinforced
insulation from any hazardous voltage, including
the AC mains.
One Vi pin and one Vo pin are to be reliably earthed,
or both the input and output pins are to be kept
floating.
Another SELV reliability test is conducted on the
whole system, as required by the safety agencies,
on the combination of supply source and the
subject module to verify that under a single fault,
hazardous voltages do not appear at the module’s
output.
The power module has ELV (extra-low voltage) outputs
when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, and UL60950 A.2 for
reduced thickness. The input to these units is to be
provided with a maximum 6A time- delay in the
unearthed lead.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module
off during a logic high and on during a logic low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (Von/off) between the ON/OFF terminal and the
VIN(-) terminal (see Figure 10). Logic low is
0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a logic low
is 1mA, the switch should be maintain a logic low level
whilst sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 15V, and the maximum
allowable leakage current at Von/off = 5V is 1μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution losses
by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim.
The amount of power delivered by the module is defined
as the voltage at the output terminals multiplied by the
output current. When using remote sense and trim, the
output voltage of the module can be increased, which at
the same output current would increase the power
output of the module. Care should be taken to ensure
that the maximum output power of the module remains
at or below the maximum rated power (Maximum rated
power = Vo,set x Io,max).
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSS
E
SUPPLY II
CONTACT
RESISTANCE
Figure 11. Circuit Configuration for remote sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
only begin to operate once the input voltage is raised
above the undervoltage lockout turn-on threshold,
VUV/ON.
Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-
off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions, the
unit is equipped with a thermal shutdown circuit. The
unit will shutdown if the thermal reference point Tref
(Figure 14), exceeds 110oC (typical), but the thermal
shutdown is not intended as a guarantee that the unit
will survive temperatures beyond its rating. The module
will automatically restarts after it cools down.
Output Overvoltage Protection
The output overvoltage protection consists of circuitry
that internally clamps the output voltage. If a more
accurate output overvoltage protection scheme is
required then this should be implemented externally via
use of the remote on/off pin.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10
Feature Descriptions (continued)
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin (COM pin) .
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between the
TRIM pin and the Vo(-) (or Sense(-)) pin decreases the
output voltage set point. To maintain set point accuracy,
the trim resistor tolerance should be ±0.1%.
The following equation determines the required external
resistor value to obtain a percentage output voltage
change of ∆%
For output voltage: 12Vdc
2.10
%
510
downRtrim
Where
100
,
,
%
setVoVdesiredsetVo
For example, to trim-down the output voltage of 12V
module (EQW006A0B1) by 8% to 11.04V, Rtrim-down is
calculated as follows:
8%
2.10
8
510
downRtrim
55.53downRtrim
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases the
output voltage set point. The following equations
determine the required external resistor value to obtain
a percentage output voltage change of ∆%:
For output voltage: 12Vdc
2.10
%
510
%225.1 %)100(,1.5 setVo
upRtrim
Where
100
,,
%
setVo setVoVdesired
For example, to trim-up the output voltage of 12V
module by 6% to 12.72V, Rtrim-up is calculated is as
follows:
6%
2.10
6
510
6225.1 )6100(121.5
upRtrim
787upRtrim
The voltage between the Vo(+) and Vo(–) terminals must
not exceed the minimum output overvoltage protection
value shown in the Feature Specifications table. This limit
includes any increase in voltage due to remote-sense
compensation and output voltage set-point adjustment
trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim. The amount of power delivered by the
module is defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can be
increased, which at the same output current would
increase the power output of the module. Care should be
taken to ensure that the maximum output power of the
module remains at or below the maximum rated power
(Maximum rated power = Vo,set x Io,max).
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current limiting
continuously. At the point of current-limit inception, the
unit enters hiccup mode. The unit operates normally
once the output current is brought back into its specified
range. The average output current during hiccup is 10%
IO, max.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel as shown in the
Figure 13.
Figure 13. Thermal Test Set-up.
The thermal reference point, Tref used in the
specifications is shown in Figure 14. For reliable
operation this temperature should not exceed 120oC.
Air Flow
Tref
Figure 14. Tref Temperature Measurement Locations.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (TA) for natural
convection and up to 2m/s (400 ft./min) are shown in the
respective Characteristics Curves section.
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. Recommended SMT layout
shown in the mechanical section are for reference only.
SMT layout depends on the end PCB configuration and
the location of the load. For additional layout
guide-lines, refer to FLTR100V10 data sheet or contact
your local GE field application engineer.
A
i
r
flow
x
Po w e r M o d ule
W
ind Tunne l
PWBs
5.97_
(0.235)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top View
Side View
Bottom View
Pin Function
1 VI(+)
2 On/Off
3 VI(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top View
Side View
Bottom View
Pin Function
1 VI(+)
2 On/Off
3 VI(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Low Current
High Current
0
1.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Component
side view
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16
Packaging Details
The surface mount versions of the EQW surface mount
modules (suffix –S) are supplied as standard in the
plastic tray shown in Figure 15. The tray has external
dimensions of 135.1mm (W) x 321.8mm (L) x 12.42mm (H)
or 5.319in (W) x 12.669in (L) x 0..489in (H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1box of 4 full trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray giving
a total number of 48 power modules.
Figure 15. Surface Mount Packaging Tray.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17
Surface Mount Information
Pick and Place
The SMT versions of the EQW series of DC-to-DC power
converters use an open-frame construction and are
designed for surface mount assembly within a fully
automated manufacturing process.
The EQW-S series modules are fitted with a label
designed to provide a large flat surface for pick and
placing. The label is located covering the center of
gravity of the power module. The label meets all the
requirements for surface-mount processing, as well as
meeting UL safety agency standards. The label will
withstand reflow temperatures up to 300C. The label
also carries product information such as product code,
date and location of manufacture.
Figure 16. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place label is 9.15
mm (0.360 in) nominal with an RSS tolerance of +/-0.25
mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with conventional
smt components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process.
The minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component
spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9
mm may also be used within the space available.
For further information please contact your local GE
Technical Sales Representative.
Tin Lead Soldering
The following instructions must be observed when SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause damage
to the modules, and can adversely affect long-term
reliability.
The surface mountable modules in the EQW family use
our newest SMT technology called “Column Pin” (CP)
connectors. Figure 17 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
EQW Board
Insulator
Solder Ball
End assembly PCB
Figure 17. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb-63/37) solder. The CP connector design is
able to compensate for large amounts of co-planarity
and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the
connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used
in the industry. These surface mount power modules
can be reliably soldered using natural forced convection,
IR (radiant infrared), or a combination of convection/IR.
For reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (C)
0
50
10 0
15 0
200
250
300
Preheat zo ne
max 4oCs-1
So ak zo ne
30-240s
Heat zone
max 4oCs-1
Peak Temp 235oC
Cooling
zo ne
1- 4 oCs-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 18. Reflow Profile for Tin/Lead (Sn/Pb) process.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 18
Surface Mount Information (continued)
MAX TEMP SOLDER (C)
200
205
210
215
220
225
230
235
240
0 102030405060
Figure 19. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process.
Lead Free Soldering
The –Z version of the EQW006 modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules
and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air-
convection reflow profile based on the volume and
thickness of the package (table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). The recommended
linear reflow profile using Sn/Ag/Cu solder is shown in
Fig. 20.
MSL Rating
The EQW006 modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of 30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to GE Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Pe r J-STD-020 Re v. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Hea ting Zone
1°C/Second
Pe ak Temp 260°C
* Min. Time Above 235 °C
15 Seco nds
*Time Above 217°C
60 Sec o nds
Cooling
Zone
Figure 20. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with
your GE representative for more details.
GE Data Sheet
EQW006 Series, Ei
g
ht Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such
product(s) or information.
October 1, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.11
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Input Voltage Output
Voltage
Output
Current
On/Off Logic
Connector
Type Product codes Comcodes
48V (36-75Vdc) 12.0 V 6 A Negative Through Hole EQW006A0B1 108986415
48V (36-75Vdc) 12.0 V 6 A Negative Through Hole EQW006A0B1Z CC109107034
48V (36-75Vdc) 12.0 V 6 A Negative Surface Mount EQW006A0B1-SB 108994851
48V (36-75Vdc) 12.0 V 6 A Negative Surface Mount EQW006A0B1-SZ 108995635
-Z Indicates RoHS Compliant modules
Table 2. Device Options
*Note: Legacy device codes may contain a –B option suffix to indicate 100% factory Hi-Pot tested to the isolation voltage specified in the
Absolute Maximum Ratings table. The 100% Hi-Pot test is now applied to all device codes, with or without the –B option suffix. Existing
comcodes for devices with the –B suffix are still valid; however, no new comcodes for devices containing the –B suffix will be created.
Option* Suffix*
Negative remote on/off logic (On/Off pin fitted) 1
Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 6
Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in) 8
Surface mount connections -S
