1. Product profile
1.1 General description
The BGA6489 is a silicon Monolithic Microwave Integrated Circuit (MMIC) wideband
medium power amplifier with internal matching circuit in a 3-pin SOT89 plastic, low
thermal resistance, SMD package.
The BGA6x89 series of medium power gain blocks are resistive feedback Darlington
configured amplifiers. Resistive feedback provides large bandwidth with high accuracy.
1.2 Features
nBroadband 50 Ω gain block
n20 dBm output power
nSOT89 package
nSingle supply voltage needed
1.3 Applications
nBroadband medium power gain blocks
nSmall signal high linearity amplifiers
nVariable gain and high output power in combination with the BGA2031
nCellular, PCS and CDPD
nIF/RF buffer amplifier
nWireless data SONET
nOscillator amplifier, final PA
nDrivers for CATV amplifier
BGA6489
MMIC wideband medium power amplifier
Rev. 02 — 15 June 2009 Product data sheet
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 2 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
1.4 Quick reference data
2. Pinning information
3. Ordering information
4. Marking
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDDC device voltage on pin 1; IS = 78 mA - 5.1 - V
ISDC supply current VS = 8 V; R1 = 39 Ω;
Tj=25°C-78-mA
|s21|2insertion power gain f = 1950 MHz - 16 - dB
NF noise figure f = 1950 MHz - 3.3 - dB
PL1dB load power at 1 dB
gain compression f = 850 MHz - 20 - dBm
f = 1950 MHz - 17 - dBm
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 RF_OUT/BIAS
2 GND
3 RF_IN
321
sym130
2
13
Table 3. Ordering information
Type number Package
Name Description Version
BGA6489 SC-62 plastic surface-mounted package; collector pad for
good heat transfer; 3 leads SOT89
Table 4. Marking codes
Type number Marking code
BGA6489 4A
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 3 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
5. Limiting values
[1] Tsp is the temperature at the solder point of the ground lead, pin 2.
6. Thermal characteristics
[1] Tsp is the temperature at the solder point of the ground lead, pin 2.
7. Characteristics
[1] VS= DC operating supply voltage applied to Rbias; see Figure 10
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDDC device voltage on pin 1; RF input AC coupled - 6 V
ISDC supply current - 150 mA
Ptot total power dissipation Tsp ≤ 70 °C[1] - 800 mW
Tstg storage temperature −65 +150 °C
Tjjunction temperature - 150 °C
PDmaximum drive power - 15 dBm
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-sp) thermal resistance from junction to solder point Tsp ≤ 70 °C[1] 100 K/W
Table 7. Static characteristics
V
S
= 8 V; T
j
= 25
°
C; R
bias
=39
Ω
[1]
Symbol Parameter Conditions Min Typ Max Unit
VDDC device voltage on pin 1; IS=78mA - 5.1 - V
ISsupply current 70 78 86 mA
Table 8. Characteristics
V
S
=8V;I
S
= 78 mA; T
amb
=25
°
C; IP3
(out)
tone spacing = 1 MHz; P
L
= 0 dB per tone, R
bias
=39
Ω
;
Z
L
=Z
S
=50
Ω
; unless otherwise specified; see Figure 10.
Symbol Parameter Conditions Min Typ Max Unit
|s21|2Insertion power gain f = 850 MHz - 20 - dB
f = 1950 MHz - 16 - dB
f = 2500 MHz - 15 - dB
RLIN return losses input f = 850 MHz - 14 - dB
f = 1950 MHz - 16 - dB
f = 2500 MHz - 19 - dB
RLOUT return losses output f = 850 MHz - 16 - dB
f = 1950 MHz - 12 - dB
f = 2500 MHz - 10 - dB
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 4 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
NF noise figure f = 850 MHz - 3.1 - dB
f = 1950 MHz - 3.3 - dB
f = 2500 MHz - 3.4 - dB
K stability factor f = 850 MHz - 1.2 -
f = 2500 MHz - 1.3 -
PL1dB load power at 1 dB gain compression f = 850 MHz - 20 - dBm
f = 1950 MHz - 17 - dBm
IP3(in) input intercept point f = 850 MHz - 13 - dBm
f = 2500 MHz - 12 - dBm
IP3(out) output intercept point f = 850 MHz - 33 - dBm
f = 2500 MHz - 27 - dBm
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig 1. Input reflection coefficient (s11); typical values
Table 8. Characteristics
…continued
V
S
=8V;I
S
= 78 mA; T
amb
=25
°
C; IP3
(out)
tone spacing = 1 MHz; P
L
= 0 dB per tone, R
bias
=39
Ω
;
Z
L
=Z
S
=50
Ω
; unless otherwise specified; see Figure 10.
Symbol Parameter Conditions Min Typ Max Unit
mgx400
90°
−90°
5
0.50.2
+0.2
0
+2
+5
−5
−2
−0.2
+0.5
−0.5
+1
−1
210 0
0.2
0.6
0.4
0.8
1.0
1.0
−45°−135°
45°135°
180°0°
2.6 GHz
200 MHz
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 5 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig 2. Output reflection coefficient (s22); typical values
mgx401
90°
−90°
5
0.50.2
+0.2
0
+2
+5
−5
−2
−0.2
+0.5
−0.5
+1
−1
2
110 0
0.2
0.6
0.4
0.8
1.0
1.0
−45°−135°
45°135°
180°0°
2.6 GHz
200 MHz
IS = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.I
S = 78 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig 3. Insertion power gain (|s21|2) as a function of
frequency; typical values Fig 4. Isolation (|s12|2) as a function of frequency;
typical values
0
25
15
20
5
10
mgx403
0 1500500 2000 2500
f (MHz)
1000
|s21|2
(dB)
0 1500500 2000 2500
f (MHz)
1000
mgx402
0
−10
−30
−40
−20
|s12|2
(dB)
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 6 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
IS = 78 mA; VS = 8 V; ZO = 50 Ω.I
S = 78 mA; VS = 8 V; ZO = 50 Ω.
Fig 5. Load power as a function of frequency; typical
values Fig 6. Output intercept as a function of frequency;
typical values
PL1dB
(dBm)
0 1500500 2000 2500
f (MHz)
1000
0
25
15
20
5
10
mgx404 mgx405
IP3(out)
(dBm)
0
40
30
10
20
0 1500500 2000 2500
f (MHz)
1000
IS = 78 mA; VS = 8 V; ZO = 50 Ω.I
S = 78 mA; VS = 8 V; ZO = 50 Ω.
Fig 7. Stability factor as a function of frequency;
typical values Fig 8. Noise figure as a function of frequency; typical
values
K
0 1500500 2000 2500
f (MHz)
1000
0
5
3
4
1
2
mgx407
NF
(dB)
0
5
4
3
1
2
mgx406
0 1500500 2000 2500
f (MHz)
1000
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 7 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
8. Application information
Figure 10 shows a typical application circuit for the BGA6489 MMIC. The device is
internally matched to 50 Ω and therefore does not require any external matching. The
value of the input and output DC blocking capacitors C1 and C2 depends on the operating
frequency; see Table 9. Capacitors C1 and C2 are used in conjunction with L1 and C3 to
fine tune the input and output impedance. Capacitor C4 is a supply decoupling capacitor.
A1µF capacitor (C5) can be added for optimum supply decoupling. The external
components should be placed as close as possible to the MMIC. When using via holes,
use multiple via holes per pin in order to limit ground path induction. Resistor R1 is a bias
resistor providing DC current stability with temperature.
VS = 8 V; Rbias =39Ω.
Fig 9. Supply current as function of operating junction temperature; typical values
Is
(mA)
−40 40−20 0 60 80
Tj (°C)
20
60
100
90
70
80
mgx408
(1) Optional capacitor for optimum supply decoupling.
(2) R1 values at operating supply voltage:
VS = 6 V; R1 = 27 Ω.
VS = 8 V; R1 = 39 Ω.
VS = 11 V; R1 = 82 Ω.
Fig 10. Typical application circuit
50 Ω
microstrip C1 C2
C3
L1
VS
50 Ω
microstrip
C4 C5(1)
R1(2)
mgx419
1VD
2
3
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 8 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
[1] Optional.
8.1 Scattering parameters
Table 9. List of components
See Figure 10 for circuit.
Component Description Package Value at operating frequency
500 MHz 800 MHz 1950 MHz 2400 MHz 3500 MHz
C1, C2 multilayer ceramic chip capacitor 0603 220 pF 100 pF 68 pF 56 pF 39 pF
C3 multilayer ceramic chip capacitor 0603 100 pF 68 pF 22 pF 22 pF 15 pF
C4 multilayer ceramic chip capacitor 0603 1 nF 1 nF 1 nF 1 nF 1 nF
C5[1] electrolytic or tantalum capacitor 0603 1 µF1µF1µF1µF1µF
L1 SMD inductor 0603 68 nH 33 nH 22 nH 18 nH 15 nH
R1 SMD resistor 0.5 W; VS = 8 V - 39 Ω39 Ω39 Ω39 Ω39 Ω
Table 10. Scattering parameters
I
S
= 78 mA; V
S
=8V; P
D
=
−
30 dBm; Z
O
=50
Ω
; T
amb
=25
°
C
f (MHz) s11 s21 s12 s22 K
Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree)
200 0.06 28.11 12.79 164.42 0.06 −0.30 0.12 −22.91 1.1
300 0.09 27.41 12.59 156.85 0.06 −0.39 0.13 −35.38 1.1
400 0.11 21.64 12.31 149.28 0.06 −0.35 0.14 −46.54 1.1
500 0.12 15.28 11.97 141.88 0.06 −0.32 0.14 −57.20 1.1
600 0.14 8.01 11.57 134.79 0.06 0.04 0.15 −61.41 1.1
700 0.16 0.34 11.18 127.97 0.06 0.63 0.16 −76.76 1.1
800 0.17 −7.27 10.75 121.56 0.05 1.57 0.16 −85.75 1.2
900 0.18 −14.78 10.24 115.06 0.05 1.85 0.17 −94.28 1.2
1000 0.19 −22.18 9.80 109.18 0.05 3.16 0.17 −102.4 1.2
1100 0.20 −29.33 9.40 103.40 0.05 4.29 0.17 −110.3 1.2
1200 0.21 −36.41 8.96 98.12 0.05 5.64 0.17 −118.5 1.2
1300 0.21 −42.47 8.53 92.76 0.05 7.03 0.17 −126.7 1.2
1400 0.22 −49.06 8.16 87.50 0.06 7.74 0.17 −134.8 1.2
1500 0.22 −55.46 7.85 82.76 0.06 9.08 0.17 −143.5 1.3
1600 0.22 −61.20 7.51 78.52 0.06 10.76 0.16 −152.7 1.3
1700 0.22 −67.02 7.16 74.16 0.06 11.89 0.16 −161.8 1.3
1800 0.21 −73.40 6.90 69.37 0.06 12.34 0.16 −171.9 1.3
1900 0.21 −78.99 6.69 65.14 0.06 13.16 0.16 177.4 1.3
2000 0.20 −84.54 6.42 61.15 0.06 14.33 0.16 166.81 1.3
2100 0.19 −91.32 6.16 56.80 0.07 14.84 0.17 156.07 1.3
2200 0.18 −97.58 5.99 52.55 0.07 15.05 0.17 145.29 1.3
2300 0.17 −103.60 5.83 49.08 0.07 15.72 0.19 135.65 1.3
2400 0.16 −111.90 5.58 45.43 0.07 15.96 0.20 126.23 1.3
2500 0.14 −120.80 5.39 40.67 0.08 15.27 0.22 117.16 1.3
2600 0.13 −129.80 5.30 36.66 0.08 14.68 0.24 110.35 1.3
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 9 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
2700 0.13 −143.80 5.18 33.88 0.08 15.64 0.28 104.05 1.3
2800 0.12 −154.47 5.08 30.28 0.08 15.56 0.31 97.10 1.3
2900 0.11 −164.40 4.71 22.43 0.09 11.60 0.28 91.75 1.3
3000 0.11 178.65 4.66 18.90 0.09 11.05 0.31 84.80 1.3
3100 0.12 160.01 4.45 18.63 0.10 10.63 0.33 80.37 1.3
Table 10. Scattering parameters
I
S
= 78 mA; V
S
=8V; P
D
=
−
30 dBm; Z
O
=50
Ω
; T
amb
=25
°
C
f (MHz) s11 s21 s12 s22 K
Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree)
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 10 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
9. Package outline
Fig 11. Package outline SOT89 (SC-62)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
DIMENSIONS (mm are the original dimensions)
SOT89 TO-243 SC-62 06-03-16
06-08-29
wM
e1
e
EHE
B
B
0 2 4 mm
scale
bp3
bp2
bp1
c
D
Lp
A
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89
123
UNIT A
mm 1.6
1.4 0.48
0.35
c
0.44
0.23
D
4.6
4.4
E
2.6
2.4
HELp
4.25
3.75
e
3.0
w
0.13
e1
1.5 1.2
0.8
bp2
bp1
0.53
0.40
bp3
1.8
1.4
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 11 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
10. Abbreviations
11. Revision history
Table 11. Abbreviations
Acronym Description
CDPD Cellular Digital Packet Data
IF Intermediate Frequency
PCS Personal Communication Service
SMD Surface Mount Device
SONET Synchronous Optical NETwork
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BGA6489_2 20090615 Product data sheet - BGA6489_1
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Changed IS from 74 mA to 78 mA throughout.
•Table 1: changed symbol VS to VD.
•Table 5: changed symbol VS to VD and added “on pin 1;” to Conditions.
•Table 7: added row for VD DC device voltage.
•Section 8: added sentence.
•Table 9: added 39 Ω to all value columns for resistor R1.
•Table 9: amended values of C3 and C4.
BGA6489_1 20030918 Product data sheet - -
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 12 of 13
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BGA6489
MMIC wideband medium power amplifier
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 June 2009
Document identifier: BGA6489_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Application information. . . . . . . . . . . . . . . . . . . 7
8.1 Scattering parameters . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Contact information. . . . . . . . . . . . . . . . . . . . . 12
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
