TPS60150DRVR - Texas Instruments - Datasheet.Directory

4.7μF

CP-

VIN

VOUT

GND

CP+

ENA

2.2μF

VIN

VOUT

(5.0V)

ENABLE

/DISABLE

TPS60150

www.ti.com

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

TPS60150 5V/140mA Charge Pump Device

Check for Samples: TPS60150

1FEATURES DESCRIPTION

•2.7V to 5.5V Input Voltage Range The TPS60150 is a switched capacitor voltage

converter which produces a regulated, low noise, and

•Fixed Output Voltage of 5.0V low-ripple output voltage (5V) from an unregulated

•X2 Charge Pump input voltage.

•1.5 MHz Switching Frequency The 5V output can supply a minimum of 140mA

•Maximum Output Current : 140mA current with a small 2X2 QFN package.

•2X2 QFN With 0.8mm Height TPS60150 operates in skip mode when the load

•Typical 90μA Quiescent Current at no Load current falls below 8mA under typical condition. In

Condition (Skip mode) skip mode operation, quiescent current is reduced to

•Hardware En/Disable Function 90μA.

•Built-in Soft Start Only 3-external capacitors are needed to generate

•Built-in Under Voltage Lock Out Protection the output voltage, therefore saving PCB space.

•Thermal and Over Current Protection Inrush current is limited by the soft start function

during power on and power transient states.

APPLICATIONS

•USB OTG

•HDMI

•Portable Communication Devices

•Personal Digital Assistance

•PCMCIA Cards

•Cellular Phones

•Handheld Meters

Figure 1. Typical Application Circuit

ORDERING INFORMATION

PART OUTPUT PACKAGE

TAPACKAGE(2) ORDERING PKG MARKING

NUMBER(1) VOLTAGE DESIGNATOR

–40°C to 85°C TPS60150 5.0V SON 2x2-6 DRV TPS60150DRV CGO

(1) The DRV (2-mm x 2-mm 6-terminal SON) package is available in tape on reel. Add R suffix to order quantities of 3000 parts per reel

and T suffix to order quantities with 250 parts per reel.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TPS60150

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

www.ti.com

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted) (1)

VALUE UNIT

VIInput voltage range (all pins) –0.3 to 7 V

HBM ESD Rating (2) 2 kV

CDM ESD Rating(3) 500 V

MM ESD Rating (4) 200 V

TAOperating temperature range –40 to 85 °C

TJMaximum operating junction temperature 150 °C

Tst Storage temperature –55 to 150 °C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The Human body model (HBM) is a 100pF capacitor discharged through a 1.5kΩresistor into each pin. The testing is done according

JEDECs EIA/JESD22-A114.

(3) Charged Device Model

(4) Machine Model (MM) is a 200pF capacitor discharged through a 500nH inductor with no series resistor into each pin. The testing is

done according JEDECs EIA/JESD22-A115.

THERMAL INFORMATION TPS60150

THERMAL METRIC(1) UNITS

DRV (6 Pins)

θJA Junction-to-ambient thermal resistance 69.1

θJCtop Junction-to-case (top) thermal resistance 79.8

θJB Junction-to-board thermal resistance 38.6 °C/W

ψJT Junction-to-top characterization parameter 1.2

ψJB Junction-to-board characterization parameter 38.4

θJCbot Junction-to-case (bottom) thermal resistance 9.2

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT

VIN Input voltage range 2.7 5.5 V

TAOperating ambient temperature –40 85 °C

TJOperating junction temperature –40 125 °C

Cin Input capacitor 2.2 μF

CoOutput capacitor 2.2 μF

CfFlying capacitor 1.0 μF

ELECTRICAL CHARACTERISTICS

VIN=3.6V, TA=–40°C to 85°C, typical values are at TA= 25°C, C1 = C3 = 2.2μF, C2 = 1.0μF (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

POWER STAGE

VIN Input voltage range 2.7 5.5 V

VUVLO Undervoltage lockout threshold 1.9 2.1

IQOperating quiescent current IOUT = 140 mA, Enable = VIN 4.7 mA

IQskip Skip mode operating quiescent IOUT = 0 mA, Enable=VIN (No switching) 80 μA

current IOUT = 0 mA, Enable = VIN(Minimum switching) 90 μA

ISD Shut down current 2.7 V ≤VIN ≤5.5 V, Enable = 0 V 1 μA

VOUT Output voltage(1) IOUT ≤50 mA, 2.7 V ≤VIN <5.5V 4.8 5.0 5.2 V

(1) When in skip mode, Output voltage can exceed VOUT spec because VOUT(skip)=VOUT+0.1.

Product Folder Link(s): TPS60150

VOUT

t1 t2

VoutisshorttoGND

SoftStart

IOUT_MAX

50mA(min)

CurrentLimit

300mA

4.2V

Vout

5.0V

4.5V

Output

Shortcircuitcurrent

Outputcurrent

TPS60150

www.ti.com

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

ELECTRICAL CHARACTERISTICS (continued)

VIN=3.6V, TA=–40°C to 85°C, typical values are at TA= 25°C, C1 = C3 = 2.2μF, C2 = 1.0μF (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOUT(skip) Skip mode output voltage IOUT = 0 mA, 2.7 V ≤VIN ≤5.5 V VOUT+0.1 V

FSW Switching frequency 1.5 MHz

SSTIME Soft-start time From the rising edge of enable to 90% output 150 μs

OUTPUT CURRENT

IOUT_nom Maximum output current VOUT remains between 4.8 V and 5.2 V, 120 mA

3.1 V ≤VIN ≤5.5 V

3.3 V <VIN <5.5 V 140

IOUT_short Short circuit current(2) VOUT = 0 V 80 mA

RIPPLE VOLTAGE

VROutput ripple voltage IOUT = 140 mA 30 mV

ENABLE CONTROL

VHI Logic high input voltage 2.7 V ≤VIN ≤5.5 V 1.3 VIN V

VLI Logic low input voltage –0.2 0.4 V

IHI Logic high input current 1 μA

ILI Logic low input current 1 μA

THERMAL SHUTDOWN

TSD Shutdown temperature 160 °C

TRC Shutdown recovery 140 °C

(2) TPS60150 has internal protection circuit to protect IC when VOUT shorted to GND.

Figure 2. Maximum Output Current Capability and Short Circuit protection

Product Folder Link(s): TPS60150

CP-

VIN

VOUT

GND

CP+

ENA

QFN(2x2)

(TOP VIEW)

CP-

CP+

Φ2

VOUT

ErrorAmp

SkipComp

GND

VREF

TPS60150

Regulation

CurrentLimit

SoftStart

EnableIC

5 4

VIN

ENA

Control

Biascircuit

TSD

UVLO Φ1

OSC

1.5MHz

Φ1Φ2

TPS60150

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

www.ti.com

DEVICE INFORMATION

PIN ASSIGNMENTS (TOP VIEW)

PIN FUNCTIONS

PIN I/O DESCRIPTION

NAME NO.

GND 1 –Ground

VIN 2 I Supply voltage input

VOUT 3 O Output, Connect to the output capacitor

CP+ 4 –Connect to the flying capacitor

CP–5–Connect to the flying capacitor

ENA 6 I Hardware Enable/Disable Pin (High = Enable)

FUNCTIONAL BLOCK DIAGRAM

Figure 3. Functional Block Diagram

Product Folder Link(s): TPS60150

4.80

4.85

4.90

4.95

5.05

5.10

2.7 3.2 3.7 4.2 4.7 5.2

V -OutputVoltage-V

V -InputVoltage-V

5.00

T =25°C

10mA 50mA

150mA

120mA

100mA

0 0.05 0.1 0.15 0.2

I -OutputCurrent- A

4.85

4.9

4.95

5.05

5.1

5.15

5.2

5.25

V -OutputVoltage-V

T =25°C

3.6V 4.2V

5V 5.5V

2.7V

TPS60150

www.ti.com

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

TYPICAL CHARACTERISTICS

Table 1. Table of Graphs

TITLE DESCRIPTION FIGURE

Output voltage vs output current, VIN = Variable, IOUT = Sweep,

Load Regulation Curve Figure 4

Temperature = 25°C

Output voltage vs input voltage, VIN = Sweep, IOUT = Variable,

Line Regulation Curve Figure 5

Temperature = 25°C

Efficiency vs input voltage, VIN = Sweep, IOUT = Variable,

Efficiency Curve Figure 6

Temperature = 25°C

Quiescent current vs input voltage, VIN = Sweep, IOUT = 0,

Quiescent Current Curve Figure 7

Temperature = Variable

Maximum output current vs input voltage, VIN = Sweep,

Maximum Output Current Curve Figure 8

Temperature = Variable Figure 9

Load Transient Curve Output voltage vs load current Figure 10

Figure 11

Output ripple voltage (Skip mode) Figure 12

Output Ripple Figure 13

Output ripple voltage (Normal mode) Figure 14

Figure 15

Power ON Power on start up Figure 16

Figure 17

Enable / Disable Soft start when enable Figure 18

TSD Operation VIN = 5.5V, RLOAD = 20ΩFigure 19

OUTPUT VOLTAGE OUTPUT VOLTAGE

vs vs

OUTPUT CURRENT INPUT VOLTAGE

Figure 4. Figure 5.

Product Folder Link(s): TPS60150

100

110

120

2.7 3.2 3.7 4.2 4.7 5.2

InputCurrent- Aµ

V -InputVoltage-V

Noload

NoSwitching

-85 C°

-40 C°

25 C°

2.7 3.2 3.7 4.2 4.7 5.2

V -InputVoltage-V

100

Efficiency-%

10mA

50mA

150mA

120mA

100mA

T =25°C

0.05

0.1

0.15

0.2

0.25

0.3

2.7 3.2 3.7 4.2 4.7 5.2

V -InputVoltage-V

I -MaxOutputCurrent- A

T =-40°C

T =25°C

AT =85°C

TPS60150

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

www.ti.com

EFFICIENCY QUIESCENT CURRENT

vs vs

INPUT VOLTAGE INPUT VOLTAGE

Figure 6. Figure 7.

MAXIMUM OUTPUT CURRENT

INPUT VOLTAGE AT TEMPERATURE

Figure 8.

Product Folder Link(s): TPS60150

20 s/divm

5ms/div

500ns/div

TPS60150

www.ti.com

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE

VIN = 2.7 V, Io = 30 mA to 50 mA VIN = 3.6 V, Io = 60 mA to 100 mA

Figure 9. Figure 10.

OUTPUT RIPPLE VOLTAGE (SKIP MODE) OUTPUT RIPPLE VOLTAGE (SKIP MODE)

VIN = 2.7 V, Io = 0 mA VIN = 3.6 V, Io = 0 mA

Figure 11. Figure 12.

OUTPUT RIPPLE VOLTAGE (NORMAL MODE) OUTPUT RIPPLE (NORMAL MODE)

VIN = 2.7 V, Io = 50 mA VIN = 3.6 V, Io = 100 mA

Figure 13. Figure 14.

Product Folder Link(s): TPS60150

1ms/div

200 s/divm

50ms/div

TPS60150

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

www.ti.com

POWER ON POWER ON

VIN = 2.7 V, Io = 50 mA VIN = 3.6 V, Io = 100 mA

Figure 15. Figure 16.

ENABLE / DISABLE ENABLE / DISABLE

VIN = 2.7 V, Io = 50 mA VIN = 3.6 V, Io = 100 mA

Figure 17. Figure 18.

THERMAL SHUT DOWN OPERATION

VIN = 5.5 V, RLOAD=20Ω

Figure 19.

Product Folder Link(s): TPS60150

VBUS

GND

CP-

VIN

VOUT

GND

CP+

ENA

USB

Transceiver

Controller

Comparator D+

D-

VIN=2.7V-5.5V

2.2 Fm

1 Fm

5V

50mA (VIN>2.7V)

140mA (VIN>3.3V)

CP-VIN

VOUT

GND

CP+

ENA ENABLE

VIN=2.7V~5.5V

2.2 FmC1

2.2 Fm

1 Fm

50mA (VIN>2.7V)

140mA (VIN>3.3V)

TPS60150

www.ti.com

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

APPLICATION INFORMATION

APPLICATION OVERVIEW

Most of today’s battery-powered portable electronics allow and/or require data transfer with a PC. One of the

fastest data transfer protocols is via USB On the Go (OTG). As Figure 20 shows, the USB OTG circuitry in the

portable device requires a 5-V power rail and up to 140mA of current. The TPS60150 may be utilized to provide

a 5-V power rail in a battery powered system.

Alternatively, low-cost portable electronics with small LCD displays require a low-cost solution for providing the

WLED backlight. As shown in Figure 21, the TPS60150 can also be used to drive several WLEDs in parallel, with

the help of ballast resistors.

Figure 20. Application Circuit for OTG System

Figure 21. Application Circuit for Driving White LEDs

BASIC OPERATION PRINCIPLE

The TPS60150, regulated charge pump, provides a regulated output voltage for various input voltages. The

TPS60150 regulates the voltage across the flying capacitor to 2.5V and controls the voltage drop of Q1 and Q2

while a conversion clock with 50% duty cycle drives the FETs.

Product Folder Link(s): TPS60150

VIN

OFF ON

ON OFF

VOUT

COUT

2.5V

Q1 Q2

Q3 Q4

VIN

OFF ON

ON OFF

VOUT

COUT

2.5V

VQ1

Q1 Q2

Q3 Q4

TPS60150

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

www.ti.com

Figure 22. Charging Mode

During the first half cycle, Q2 and Q3 transistors are turned on and flying capacitor, CF, will be charged to 2.5V

ideally.

Figure 23. Discharging Mode

During the second half cycle, Q1 and Q4 transistors are turned on. Capacitor CFwill then be discharged to

output.

The output voltage can be calculated as follows:

Vout = VIN - VQ1 + V(CF) - VQ4 = VIN - VQ1 + 2.5V - VQ4 = 5 V. (Ideal)

The output voltage is regulated by output feedback and an internally compensated voltage control loop.

Product Folder Link(s): TPS60150

VOUT

GateWaveform

OfQ1 Transistor

Loadcurrent

Noload

Startup

Waveform

SkipModeat

NoLoadCondition

NormalModeat

50 mA LoadCurrent

SkipModeat

NoLoadCondition

QuiescentCurrent

90 Am

4.7mA

50mA

5V+0.1V

5V

TPS60150

www.ti.com

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

NORMAL MODE AND SKIP MODE OPERATION

Figure 24. Normal Mode and Skip Mode Operation

The TPS60150 has skip mode operation as shown in Figure 24. The TPS60150 enters skip mode if the output

voltage reaches 5V+0.1V and the load current is below 8mA(typ). In Skip Mode, the TPS60150 disables the

oscillator and decreases the pre_bias current of the output stage to reduce the power consumption. Once the

output voltage dips below threshold voltage, 5V+0.1V, the TPS60150 begins switching to increase output voltage

until the output reaches 5V+0.1V. When the output voltage dips below 5V, the TPS60150 returns to normal PWM

mode; thereby re-enabling the oscillator and increasing the pre_bias current of the output stage to supply output

current.

The skip threshold voltage and current depend on input voltage and output current conditions.

SHORT CIRCUIT PROTECTION

The TPS60150 has internal short circuit protection to protect the IC when the output is shorted to ground. To

avoid damage when output is shorted to ground, the short circuit protection circuitry senses output voltage and

clamps the maximum output current to 80mA(typ).

THERMAL SHUT DOWN PROTECTION

The regulator has thermal shutdown circuitry that protects it from damage caused by overload conditions. The

thermal protection circuitry disables the output when the junction temperature reached approximately 160°C,

allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is

automatically re-enabled. Continuously running the regulator into thermal shutdown can degrade reliability. The

regulator also provides current limit to protect itself and the load.

Product Folder Link(s): TPS60150

CP-

VIN

VOUT

GND

CP+

ENA

VIN

VOUT

(5V)

ENABLE

/DISABLE

COUT CIN

charging FLY CFLY

dischargi ng di scharge LO AD(MAX)

Q = c v = C V ,

Q = i t = 2 I , half duty.

´ ´ D

æ ö

´ ´ ´ ç ÷

è ø

LOAD(MAX) FLY CFLY

2 I = C V

æ ö

\ ´ ´ ´ D

ç ÷

è ø

æ ö

´ ´ ç ÷

è ø

\ ³ D D ´ ¦

LOAD(MAX) LOAD(MAX)

FLY

CFLY CFLY

2 I I

C =

V V

( )

= + ´

´ ´

LOAD(MAX)

OUT(RIPPLE) LOAD(MAX) COUT

OUT

V 2I ESR

2 f C

´ ´ = ´

OUT OUT IN OUT Q

IN IN

V I

PD(out)

Efficiency(%) = 100 = 100 , I 2 I + I

PD(in) V I

TPS60150

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

www.ti.com

SHUTDOWN MODE

An enable pin on the regulator may be used to place the device into an energy-saving shutdown mode. In this

mode, the output is disconnected from the input and the input quiescent current is reduced to 1μA maximum.

CAPACITOR SELECTION

For minimum output voltage ripple, the output capacitor (COUT) should be a surface-mount ceramic capacitor.

Tantalum capacitors generally have a higher Effective Series Resistance (ESR) and may contribute to higher

output voltage ripple. Leaded capacitors also increase ripple due to the higher inductance of the package itself.

To achieve the best operation with low input voltage and high load current, the input and flying capacitors (CIN

and CF, respectively) should also be surface-mount ceramic types.

Figure 25. Capacitors

Generally, CFLY can be calculated by simple equation as follows,

(1)

Both equation should be same,

(2)

If ILOAD = 140 mA, f = 1.5MHZ, and ΔVCFLY = 100mV, the minimum value of the flying capacitor should be 1μF.

Output capacitance, COUT, is also strongly related to output ripple voltage and loop stability,

(3)

The minimum output capacitance for all output levels is 2.2μF due to control stability. Larger ceramic capacitors

or low ESR capacitors can be used to lower the output ripple voltage.

Table 2. Suggested Capacitors (Input / Output / Flying Capacitor)

Dielectric Rated working

Manufacturer Part number Value Tolerance Package Size

material voltage

4.7uF X7R 6.3V

2.2uF

The efficiency of the charge pump regulator varies with the output voltage, the applied input voltage and the load

current.

The approximate efficiency in normal operating mode is given by:

(4)

Product Folder Link(s): TPS60150

( )

OUT IN OUT

Efficiency(%) = × 100 I = 2 I Quiescent current was neglected.

2 × V ´

TPS60150

www.ti.com

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

(5)

PCB LAYOUT

Large transient currents flow in the VIN, VOUT, and GND traces. To minimize both input and output ripple, keep

the capacitors as close as possible to the regulator using short, direct circuit traces.

Figure 26. Recommended PCB Layout

Product Folder Link(s): TPS60150

TPS60150

SLVS888B –DECEMBER 2008–REVISED FEBRUARY 2011

www.ti.com

REVISION HISTORY

Changes from Revision A (April 2009) to Revision B Page

•Added the Thermal Table and deleted the Dissipation Rating Table ................................................................................... 2

Product Folder Link(s): TPS60150

PACKAGE OPTION ADDENDUM

www.ti.com 7-Mar-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

TPS60150DRVR ACTIVE SON DRV 6 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart

TPS60150DRVT ACTIVE SON DRV 6 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TPS60150DRVR SON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

TPS60150DRVT SON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 25-Aug-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS60150DRVR SON DRV 6 3000 210.0 185.0 35.0

TPS60150DRVT SON DRV 6 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 25-Aug-2012

Pack Materials-Page 2

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