MSP430F550x, MSP430F5510
www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
MIXED SIGNAL MICROCONTROLLER
1FEATURES
Low Supply-Voltage Range, 1.8 V to 3.6 V 16-Bit Timer TA0, Timer_A With Five
Capture/Compare Registers
Ultra-Low Power Consumption
16-Bit Timer TA1, Timer_A With Three
Active Mode (AM) Capture/Compare Registers
All System Clocks Active
16-Bit Timer TA2, Timer_A With Three
195 µA/MHz at 8 MHz, 3 V, Flash Capture/Compare Registers
Program Execution (Typical)
16-Bit Timer TB0, Timer_B With Seven
115 µA/MHz at 8 MHz, 3 V, RAM Program Capture/Compare Shadow Registers
Execution (Typical)
Two Universal Serial Communication
Standby Mode (LPM3) Interfaces
Real Time Clock With Crystal, USCI_A0 and USCI_A1 Each Supporting
Watchdog, and Supply Supervisor
Operational, Full RAM Retention, Fast Enhanced UART Supporting
Wake-Up: Auto-Baudrate Detection
1.9 µA at 2.2 V, 2.1 µA at 3 V (Typical) IrDA Encoder and Decoder
Low-Power Oscillator (VLO), Synchronous SPI
General-Purpose Counter, Watchdog, USCI_B0 and USCI_B1 Each Supporting
and Supply Supervisor Operational, Full I2CTM
RAM Retention, Fast Wake-Up: Synchronous SPI
1.4 µA at 3 V (Typical)
Full-Speed Universal Serial Bus (USB)
Off Mode (LPM4)
Full RAM Retention, Supply Supervisor Integrated USB-PHY
Operational, Fast Wake-Up: Integrated 3.3-V/1.8-V USB Power System
1.1 µA at 3 V (Typical) Integrated USB-PLL
Shutdown Mode (LPM4.5) Eight Input, Eight Output Endpoints
0.18 µA at 3 V (Typical) 10-Bit Analog-to-Digital (A/D) Converter With
Wake-Up From Standby in Less Than 5 µsWindow Comparator
16-Bit RISC Architecture, Extended Memory, Comparator
Up to 25-MHz System Clock Hardware Multiplier Supporting 32-Bit
Flexible Power Management System Operations
Fully Integrated LDO With Programmable Serial Onboard Programming, No External
Regulated Core Supply Voltage Programming Voltage Needed
Supply Voltage Supervision, Monitoring, Three Channel Internal DMA
and Brownout Basic Timer With Real Time Clock Feature
Unified Clock System Family Members are Summarized in Table 1
FLL Control Loop for Frequency For Complete Module Descriptions, See the
Stabilization MSP430x5xx/MSP430x6xx Family User's Guide
Low-Power Low-Frequency Internal Clock (SLAU208)
Source (VLO)
Low-Frequency Trimmed Internal Reference
Source (REFO)
32-kHz Watch Crystals (XT1)
High-Frequency Crystals up to 32 MHz
(XT2)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright ©20092011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
DESCRIPTION
The Texas Instruments MSP430family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with extensive
low-power modes, is optimized to achieve extended battery life in portable measurement applications. The
device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to
maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to
active mode in less than 5 µs.
The MSP430F5510, MSP430F5509, and MSP430F5508 devices are microcontroller configurations with
integrated USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance 10-bit analog-to-digital
converter (ADC), two universal serial communication interfaces (USCI), hardware multiplier, DMA, real-time clock
module with alarm capabilities, and 31 or 47 I/O pins.
The MSP430F5507, MSP430F5506, MSP430F5505, and MSP430F5504 devices are microcontroller
configurations with integrated USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance 10-bit
analog-to-digital converter (ADC), two universal serial communication interfaces (USCI), hardware multiplier,
DMA, real-time clock module with alarm capabilities, and 31 I/O pins.
The MSP430F5503, MSP430F5502, and MSP430F5500 include all of these peripherals but have a comparator
instead of the 10-bit ADC.
Typical applications include analog and digital sensor systems, data loggers, etc., that require connectivity to
various USB hosts.
Family members available are summarized in Table 1.
Table 1. Family Members
USCI
PROGRAM SRAM ADC10_A Comp_B PACKAGE
CHANNEL A: CHANNEL B:
DEVICE MEMORY Timer_A(2) Timer_B(3) I/O
(KB)(1) (CH) (CH) TYPE
UART/LIN/ SPI/I2C
(KB) IrDA/SPI
64 RGC,
10 ext / 2 int 8 47 80 ZQE
MSP430F5510 32 4 + 2 5, 3, 3 7 2 2 48 PT,
6 ext / 2 int 4 31 48 RGZ
64 RGC,
10 ext / 2 int 8 47 80 ZQE
MSP430F5509 24 4 + 2 5, 3, 3 7 2 2 48 PT,
6 ext / 2 int 4 31 48 RGZ,
64 RGC,
10 ext / 2 int 8 47 80 ZQE
MSP430F5508 16 4 + 2 5, 3, 3 7 2 2 48 PT,
6 ext / 2 int 4 31 48 RGZ,
MSP430F5507 32 4 + 2 5, 3, 3 7 1 1 6 ext / 2 int - 31 48 RGZ
MSP430F5506 24 4 + 2 5, 3, 3 7 1 1 6 ext / 2 int - 31 48 RGZ
MSP430F5505 16 4 + 2 5, 3, 3 7 1 1 6 ext / 2 int - 31 48 RGZ
48 PT,
MSP430F5504 8 4 + 2 5, 3, 3 7 1 1 6 ext / 2 int - 31 48 RGZ
MSP430F5503 32 4 + 2 5, 3, 3 7 1 1 - 4 31 48 RGZ
MSP430F5502 24 4 + 2 5, 3, 3 7 1 1 - 4 31 48 RGZ
MSP430F5501 16 4 + 2 5, 3, 3 7 1 1 - 4 31 48 RGZ
MSP430F5500 8 4 + 2 5, 3, 3 7 1 1 - 4 31 48 RGZ
(1) The additional 2-KB USB SRAM that is listed can be used as general purpose SRAM when USB is not in use.
(2) Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
(3) Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
2Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
MSP430F550x, MSP430F5510
www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
Table 2. Ordering Information(1)
PACKAGED DEVICES(2)
TAPLASTIC 64-PIN VQFN PLASTIC 80-BALL BGA PLASTIC 48-PIN VQFN PLASTIC 48-PIN LQFP
(RGC) (ZQE) (RGZ) (PT)
MSP430F5510IRGC MSP430F5510IZQE MSP430F5510IRGZ MSP430F5510IPT
MSP430F5509IRGC MSP430F5509IZQE MSP430F5509IRGZ MSP430F5509IPT
MSP430F5508IRGC MSP430F5508IZQE MSP430F5508IRGZ MSP430F5508IPT
MSP430F5507IRGZ MSP430F5504IPT
MSP430F5506IRGZ
40°C to 85°C MSP430F5505IRGZ
MSP430F5504IRGZ
MSP430F5503IRGZ
MSP430F5502IRGZ
MSP430F5501IRGZ
MSP430F5500IRGZ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/package.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 3
Unified
Clock
System
32KB
24KB
16KB
Flash
4KB+2KB
RAM
MCLK
ACLK
SMCLK
I/O Ports
P1/P2
2×8 I/Os
Interrupt
& Wakeup
PA
1×16 I/Os
CPUXV2
and
Working
Registers
EEM
(S:3+1)
XIN XOUT
JTAG/
SBW
Interface
PA PB PC
DMA
3 Channel
XT2IN
XT2OUT
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
I/O Ports
P3/P4
1×5 I/Os
1
PB
1×13 I/Os
×8 I/Os
I/O Ports
P5/P6
1×6 I/Os
1
PC
1×14 I/Os
×8 I/Os
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
MPY32
TA0
Timer_A
5 CC
Registers
TA1
Timer_A
3 CC
Registers
TB0
Timer_B
7 CC
Registers
RTC_A CRC16
USCI0,1
Ax: UART,
IrDA, SPI
Bx: SPI, I2C
COMP_B
DVCC DVSS AVCC AVSS
P1.x P2.x P3.x P4.x P5.x P6.x
DP,DM,PUR
RST/NMI
TA2
Timer_A
3 CC
Registers
REF
VCORE
MAB
MDB
ADC10_A
200 KSPS
12 Channels
(10 ext/ 2 int)
Window
Comparator
10 Bit
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Functional Block Diagram MSP430F5510IRGC, MSP430F5509IRGC, MSP430F5508IRGC,
MSP430F5510IZQE, MSP430F5509IZQE, MSP430F5508IZQE
4Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
1P6.0/CB0/A0
2P6.1/CB1/A1
3P6.2/CB2/A2
4P6.3/CB3/A3
5P6.4/CB4/A4
6P6.5/CB5/A5
7P6.6/CB6/A6
8P6.7/CB7/A7
9P5.0/A8/VeREF+
10P5.1/A9/VeREF-
11AVCC1
12P5.4/XIN
13P5.5/XOUT
14AVSS1
15DVCC1
16DVSS1
17
VCORE
18
P1.0/TA0CLK/ACLK
19
P1.1/TA0.0
20
P1.2/TA0.1
21
P1.3/TA0.2
22
P1.4/TA0.3
23
P1.5/TA0.4
24
P1.6/TA1CLK/CBOUT
25
P1.7/TA1.0
26
P2.0/TA1.1
27
P2.1/TA1.2
28
P2.2/TA2CLK/SMCLK
29
P2.3/TA2.0
30
P2.4/TA2.1
31
P2.5/TA2.2
32
P2.6/RTCCLK/DMAE0
33 P2.7/UCB0STE/UCA0CLK
34 P3.0/UCB0SIMO/UCB0SDA
35 P3.1/UCB0SOMI/UCB0SCL
36 P3.2/UCB0CLK/UCA0STE
37 P3.3/UCA0TXD/UCA0SIMO
38 P3.4/UCA0RXD/UCA0SOMI
39 DVSS2
40 DVCC2
41 P4.0/PM_UCB1STE/PM_UCA1CLK
42 P4.1/PM_UCB1SIMO/PM_UCB1SDA
43 P4.2/PM_UCB1SOMI/PM_UCB1SCL
44 P4.3/PM_UCB1CLK/PM_UCA1STE
45 P4.4/PM_UCA1TXD/PM_UCA1SIMO
46 P4.5/PM_UCA1RXD/PM_UCA1SOMI
47 P4.6/PM_NONE
48 P4.7/PM_NONE
49
VSSU
50
PU.0/DP
51
PUR
52
PU.1/DM
53
VBUS
54
VUSB
55
V18
56
AVSS2
57
P5.2/XT2IN
58
P5.3/XT2OUT
59
TEST/SBWTCK
60
PJ.0/TDO
61
PJ.1/TDI/TCLK
62
PJ.2/TMS
63
PJ.3/TCK
64
RST/NMI/SBWTDIO
MSP430F5510IRGC
MSP430F5509IRGC
MSP430F5508IRGC
Note: Power Pad connection to
V recommended
ss
MSP430F550x, MSP430F5510
www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
Pin Designation MSP430F5510IRGC, MSP430F5509IRGC, MSP430F5508IRGC
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 5
A1 A2 A3 A4 A5 A6 A7 A8 A9
B1 B2 B3 B4 B5 B6 B7 B8 B9
C1 C2
D1 D2 D4 D5 D6 D7 D8 D9
E1 E2 E4 E5 E6 E7 E8 E9
F1 F2 F4 F5 F8 F9
G1 G2 G4 G5 G8 G9
J1 J2 J4 J5 J6 J7 J8 J9
H1 H2 H4 H5 H6 H7 H8 H9
ZQEPACKAGE
(TOP VIEW)
C4 C5 C6 C7 C8 C9
D3
E3
F3
G3
J3
H3
F6
G6
F7
G7
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Pin Designation MSP430F5510IZQE, MSP430F5509IZQE, MSP430F5508IZQE
6Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Unified
Clock
System
32KB
24KB
16KB
Flash
4KB+2KB
RAM
MCLK
ACLK
SMCLK
CPUXV2
and
Working
Registers
EEM
(S:3+1)
XIN XOUT
JTAG/
SBW
Interface
DMA
3 Channel
XT2IN
XT2OUT
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
MPY32
TA0
Timer_A
5 CC
Registers
TA1
Timer_A
3 CC
Registers
TB0
Timer_B
7 CC
Registers
RTC_A CRC16
USCI0,1
Ax: UART,
IrDA, SPI
Bx: SPI, I2C
COMP_B
DVCC DVSS AVCC AVSS
DP,DM,PUR
RST/NMI
TA2
Timer_A
3 CC
Registers
REF
VCORE
MAB
MDB
ADC10_A
200 KSPS
8 Channels
(6 ext/ 2 int)
Window
Comparator
10 Bit
I/O Ports
P1/P2
1×8 I/Os
1
Interrupt
& Wakeup
PA
1×9 I/Os
×1 I/Os
PA PB PC
I/O Ports
P4
1
PB
1×8 I/Os
×8 I/Os
I/O Ports
P5/P6
1×6 I/Os
1
PC
1×10 I/Os
×4 I/Os
P1.x P2.x P3.x P4.x P5.x P6.x
MSP430F550x, MSP430F5510
www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
Functional Block Diagram MSP430F5510IRGZ, MSP430F5509IRGZ, MSP430F5508IRGZ,
MSP430F5510IPT, MSP430F5509IPT, MSP430F5508IPT
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 7
1P6.0/CB0/A0
2P6.1/CB1/A1
3P6.2/CB2/A2
4P6.3/CB3/A3
5P5.0/A8/VeREF+
6P5.1/A9/VeREF-
7AVCC1
8P5.4/XIN
9P5.5/XOUT
10AVSS1
11DVCC1
12DVSS1
13
VCORE
14
P1.0/TA0CLK/ACLK
15
P1.1/TA0.0
16
P1.2/TA0.1
17
P1.3/TA0.2
18
P1.4/TA0.3
19
P1.5/TA0.4
20
P1.6/TA1CLK/CBOUT
21
P1.7/TA1.0
22
P2.0/TA1.1
23
PJ.0/TDO
24
PJ.1/TDI/TCLK
25 PJ.2/TMS
26 PJ.3/TCK
27 DVSS2
28 DVCC2
29 P4.0/PM_UCB1STE/PM_UCA1CLK
30 P4.1/PM_UCB1SIMO/PM_UCB1SDA
31 P4.2/PM_UCB1SOMI/PM_UCB1SCL
32 P4.3/PM_UCB1CLK/PM_UCA1STE
33 P4.4/PM_UCA1TXD/PM_UCA1SIMO
34 P4.5/PM_UCA1RXD/PM_UCA1SOMI
35 P4.6/PM_NONE
36 P4.7/PM_NONE
37
VSSU
38
PU.0/DP
39
PUR
40
PU.1/DM
41
VBUS
42
VUSB
43
V18
44
AVSS2
45
P5.2/XT2IN
46
P5.3/XT2OUT
47
TEST/SBWTCK
48
RST/NMI/SBWTDIO
MSP430F5510IRGZ
MSP430F5509IRGZ
MSP430F5508IRGZ
MSP430F5510IPT
MSP430F5509IPT
MSP430F5508IPT
Note: for RGZ package Power Pad
connection to V recommended
ss
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Pin Designation MSP430F5510IRGZ, MSP430F5509IRGZ, MSP430F5508IRGZ,
MSP430F5510IPT, MSP430F5509IPT, MSP430F5508IPT
8Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Unified
Clock
System
32KB
24KB
16KB
8KB
Flash
4KB+2KB
RAM
MCLK
ACLK
SMCLK
I/O Ports
P1/P2
1×8 I/Os
1
Interrupt
& Wakeup
PA
1×9 I/Os
×1 I/Os
CPUXV2
and
Working
Registers
EEM
(S:3+1)
XIN XOUT
JTAG/
SBW
Interface
PA PB PC
DMA
3 Channel
XT2IN
XT2OUT
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
I/O Ports
P4
1
PB
1×8 I/Os
×8 I/Os
I/O Ports
P5/P6
1×6 I/Os
1
PC
1×10 I/Os
×4 I/Os
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
MPY32
TA0
Timer_A
5 CC
Registers
TA1
Timer_A
3 CC
Registers
TB0
Timer_B
7 CC
Registers
RTC_A CRC16
USCI0
Ax: UART,
IrDA, SPI
Bx: SPI, I2C
ADC10_A
200 KSPS
8 Channels
(6 int/ 2 ext)
Window
Comparator
10 Bit
DVCC DVSS AVCC AVSS
P1.x P2.x P3.x P4.x P5.x P6.x
DP,DM,PUR
RST/NMI
TA2
Timer_A
3 CC
Registers
REF
VCORE
MAB
MDB
MSP430F550x, MSP430F5510
www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
Functional Block Diagram MSP430F5507IRGZ, MSP430F5506IRGZ, MSP430F5505IRGZ,
MSP430F5504IRGZ, MSP430F5504IPT
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 9
1P6.0/A0
2P6.1/A1
3P6.2/A2
4P6.3/A3
5P5.0/A8/VeREF+
6P5.1/A9/VeREF-
7AVCC1
8P5.4/XIN
9P5.5/XOUT
10AVSS1
11DVCC1
12DVSS1
13
VCORE
14
P1.0/TA0CLK/ACLK
15
P1.1/TA0.0
16
P1.2/TA0.1
17
P1.3/TA0.2
18
P1.4/TA0.3
19
P1.5/TA0.4
20
P1.6/TA1CLK
21
P1.7/TA1.0
22
P2.0/TA1.1
23
PJ.0/TDO
24
PJ.1/TDI/TCLK
25 PJ.2/TMS
26 PJ.3/TCK
27 DVSS2
28 DVCC2
29 P4.0/PM_UCB1STE/PM_UCA1CLK
30 P4.1/PM_UCB1SIMO/PM_UCB1SDA
31 P4.2/PM_UCB1SOMI/PM_UCB1SCL
32 P4.3/PM_UCB1CLK/PM_UCA1STE
33 P4.4/PM_UCA1TXD/PM_UCA1SIMO
34 P4.5/PM_UCA1RXD/PM_UCA1SOMI
35 P4.6/PM_NONE
36 P4.7/PM_NONE
37
VSSU
38
PU.0/DP
39
PUR
40
PU.1/DM
41
VBUS
42
VUSB
43
V18
44
AVSS2
45
P5.2/XT2IN
46
P5.3/XT2OUT
47
TEST/SBWTCK
48
RST/NMI/SBWTDIO
MSP430F5507IRGZ
MSP430F5506IRGZ
MSP430F5505IRGZ
MSP430F5504IRGZ
MSP430F5504IPT
Note: For RGZ package Power Pad
connection to V recommended
ss
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Pin Designation MSP430F5507IRGZ, MSP430F5506IRGZ, MSP430F5505IRGZ,
MSP430F5504IRGZ, MSP430F5504IPT
10 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Unified
Clock
System
32KB
24KB
16KB
8KB
Flash
4KB+2KB
RAM
MCLK
ACLK
SMCLK
I/O Ports
P1/P2
1×8 I/Os
1
Interrupt
& Wakeup
PA
1×9 I/Os
×1 I/Os
CPUXV2
and
Working
Registers
EEM
(S:3+1)
XIN XOUT
JTAG/
SBW
Interface
PA PB PC
DMA
3 Channel
XT2IN
XT2OUT
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
I/O Ports
P4
1
PB
1×8 I/Os
×8 I/Os
I/O Ports
P5/P6
1×6 I/Os
1
PC
1×10 I/Os
×4 I/Os
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
MPY32
TA0
Timer_A
5 CC
Registers
TA1
Timer_A
3 CC
Registers
TB0
Timer_B
7 CC
Registers
RTC_A CRC16
USCI0
Ax: UART,
IrDA, SPI
Bx: SPI, I2C
COMP_B
DVCC DVSS AVCC AVSS
P1.x P2.x P3.x P4.x P5.x P6.x
DP,DM,PUR
RST/NMI
TA2
Timer_A
3 CC
Registers
VCORE
MAB
MDB
MSP430F550x, MSP430F5510
www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
Functional Block Diagram MSP430F5503IRGZ, MSP430F5502IRGZ, MSP430F5501IRGZ,
MSP430F5500IRGZ
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 11
1P6.0/CB0
2P6.1/CB1
3P6.2/CB2
4P6.3/CB3
5P5.0
6P5.1
7AVCC1
8P5.4/XIN
9P5.5/XOUT
10AVSS1
11DVCC1
12DVSS1
13
VCORE
14
P1.0/TA0CLK/ACLK
15
P1.1/TA0.0
16
P1.2/TA0.1
17
P1.3/TA0.2
18
P1.4/TA0.3
19
P1.5/TA0.4
20
P1.6/TA1CLK/CBOUT
21
P1.7/TA1.0
22
P2.0/TA1.1
23
PJ.0/TDO
24
PJ.1/TDI/TCLK
25 PJ.2/TMS
26 PJ.3/TCK
27 DVSS2
28 DVCC2
29 P4.0/PM_UCB1STE/PM_UCA1CLK
30 P4.1/PM_UCB1SIMO/PM_UCB1SDA
31 P4.2/PM_UCB1SOMI/PM_UCB1SCL
32 P4.3/PM_UCB1CLK/PM_UCA1STE
33 P4.4/PM_UCA1TXD/PM_UCA1SIMO
34 P4.5/PM_UCA1RXD/PM_UCA1SOMI
35 P4.6/PM_NONE
36 P4.7/PM_NONE
37
VSSU
38
PU.0/DP
39
PUR
40
PU.1/DM
41
VBUS
42
VUSB
43
V18
44
AVSS2
45
P5.2/XT2IN
46
P5.3/XT2OUT
47
TEST/SBWTCK
48
RST/NMI/SBWTDIO
MSP430F5503IRGZ
MSP430F5502IRGZ
MSP430F5501IRGZ
MSP430F5500IRGZ
Note: Power Pad connection to
V recommended
ss
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
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Pin Designation MSP430F5503IRGZ, MSP430F5502IRGZ, MSP430F5501IRGZ,
MSP430F5500IRGZ
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Table 3. TERMINAL FUNCTIONS
TERMINAL
NO. I/O(1) DESCRIPTION
NAME RGZ
RGC ZQE
/PT
General-purpose digital I/O
P6.4/CB4/A4 5 N/A C1 I/O Comparator_B input CB4 (not available on PT and RGZ package devices)
Analog input A4 ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
P6.5/CB5/A5 6 N/A D2 I/O Comparator_B input CB5 (not available on PT and RGZ package devices)
Analog input A5 ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
P6.6/CB6/A6 7 N/A D1 I/O Comparator_B input CB6 (not available on PT and RGZ package devices)
Analog input A6 ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
P6.7/CB7/A7 8 N/A D3 I/O Comparator_B input CB7 (not available on PT and RGZ package devices)
Analog input A7 ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
Analog input A8 ADC (not available on '5503, '5502, '5501, '5500 devices)
P5.0/A8/VeREF+ 9 5 E1 I/O Input for an external reference voltage to the ADC (not available on '5503,
'5502, '5501, '5500 devices)
General-purpose digital I/O
Analog input A9 ADC (not available on '5503, '5502, '5501, '5500 devices)
P5.1/A9/VeREF- 10 6 E2 I/O Negative terminal for an externally provided ADC reference (not available on
'5503, '5502, '5501, '5500 devices)
AVCC1 11 7 F2 Analog power supply
General-purpose digital I/O
P5.4/XIN 12 8 F1 I/O Input terminal for crystal oscillator XT1
General-purpose digital I/O
P5.5/XOUT 13 9 G1 I/O Output terminal of crystal oscillator XT1
AVSS1 14 10 G2 Analog ground supply
DVCC1 15 11 H1 Digital power supply
DVSS1 16 12 J1 Digital ground supply
Regulated core power supply output (internal use only, no external current
VCORE(2) 17 13 J2 loading)
General-purpose digital I/O with port interrupt
P1.0/TA0CLK/ACLK 18 14 H2 I/O TA0 clock signal TA0CLK input ; ACLK output (divided by 1, 2, 4, or 8)
General-purpose digital I/O with port interrupt
P1.1/TA0.0 19 15 H3 I/O TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
General-purpose digital I/O with port interrupt
P1.2/TA0.1 20 16 J3 I/O TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
General-purpose digital I/O with port interrupt
P1.3/TA0.2 21 17 G4 I/O TA0 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
P1.4/TA0.3 22 18 H4 I/O TA0 CCR3 capture: CCI3A input compare: Out3 output
General-purpose digital I/O with port interrupt
P1.5/TA0.4 23 19 J4 I/O TA0 CCR4 capture: CCI4A input, compare: Out4 output
General-purpose digital I/O with port interrupt
P1.6/TA1CLK/CBOUT 24 20 G5 I/O TA1 clock signal TA1CLK input
Comparator_B output
General-purpose digital I/O with port interrupt
P1.7/TA1.0 25 21 H5 I/O TA1 CCR0 capture: CCI0A input, compare: Out0 output
General-purpose digital I/O with port interrupt
P2.0/TA1.1 26 22 J5 I/O TA1 CCR1 capture: CCI1A input, compare: Out1 output
(1) I = input, O = output, N/A = not available
(2) VCORE is for internal use only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE.
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Table 3. TERMINAL FUNCTIONS (continued)
TERMINAL
NO. I/O(1) DESCRIPTION
NAME RGZ
RGC ZQE
/PT
General-purpose digital I/O with port interrupt
P2.1/TA1.2 27 N/A G6 I/O TA1 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
P2.2/TA2CLK/SMCLK 28 N/A J6 I/O TA2 clock signal TA2CLK input ; SMCLK output
General-purpose digital I/O with port interrupt
P2.3/TA2.0 29 N/A H6 I/O TA2 CCR0 capture: CCI0A input, compare: Out0 output
General-purpose digital I/O with port interrupt
P2.4/TA2.1 30 N/A J7 I/O TA2 CCR1 capture: CCI1A input, compare: Out1 output
General-purpose digital I/O with port interrupt
P2.5/TA2.2 31 N/A J8 I/O TA2 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
P2.6/RTCCLK/DMAE0 32 N/A J9 I/O RTC clock output for calibration
DMA external trigger input
General-purpose digital I/O
Slave transmit enable USCI_B0 SPI mode
P2.7/UCB0STE/UCA0CLK 33 N/A H7 I/O Clock signal input USCI_A0 SPI slave mode
Clock signal output USCI_A0 SPI master mode
General-purpose digital I/O
P3.0/UCB0SIMO/UCB0SDA 34 N/A H8 I/O Slave in, master out USCI_B0 SPI mode
I2C data USCI_B0 I2C mode
General-purpose digital I/O
P3.1/UCB0SOMI/UCB0SCL 35 N/A H9 I/O Slave out, master in USCI_B0 SPI mode
I2C clock USCI_B0 I2C mode
General-purpose digital I/O
Clock signal input USCI_B0 SPI slave mode
P3.2/UCB0CLK/UCA0STE 36 N/A G8 I/O Clock signal output USCI_B0 SPI master mode
Slave transmit enable USCI_A0 SPI mode
General-purpose digital I/O
P3.3/UCA0TXD/UCA0SIMO 37 N/A G9 I/O Transmit data USCI_A0 UART mode
Slave in, master out USCI_A0 SPI mode
General-purpose digital I/O
P3.4/UCA0RXD/UCA0SOMI 38 N/A G7 I/O Receive data USCI_A0 UART mode
Slave out, master in USCI_A0 SPI mode
General-purpose digital I/O with reconfigurable port mapping secondary
function
P4.0/PM_UCB1STE/ 41 29 E8 I/O Default mapping: Slave transmit enable USCI_B1 SPI mode
PM_UCA1CLK Default mapping: Clock signal input USCI_A1 SPI slave mode
Default mapping: Clock signal output USCI_A1 SPI master mode
General-purpose digital I/O with reconfigurable port mapping secondary
P4.1/PM_UCB1SIMO/ function
42 30 E7 I/O
PM_UCB1SDA Default mapping: Slave in, master out USCI_B1 SPI mode
Default mapping: I2C data USCI_B1 I2C mode
General-purpose digital I/O with reconfigurable port mapping secondary
P4.2/PM_UCB1SOMI/ function
43 31 D9 I/O
PM_UCB1SCL Default mapping: Slave out, master in USCI_B1 SPI mode
Default mapping: I2C clock USCI_B1 I2C mode
General-purpose digital I/O with reconfigurable port mapping secondary
function
P4.3/PM_UCB1CLK/ 44 32 D8 I/O Default mapping: Clock signal input USCI_B1 SPI slave mode
PM_UCA1STE Default mapping: Clock signal output USCI_B1 SPI master mode
Default mapping: Slave transmit enable USCI_A1 SPI mode
DVSS2 39 27 F9 Digital ground supply
DVCC2 40 28 E9 Digital power supply
General-purpose digital I/O with reconfigurable port mapping secondary
P4.4/PM_UCA1TXD/ function
45 33 D7 I/O
PM_UCA1SIMO Default mapping: Transmit data USCI_A1 UART mode
Default mapping: Slave in, master out USCI_A1 SPI mode
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Table 3. TERMINAL FUNCTIONS (continued)
TERMINAL
NO. I/O(1) DESCRIPTION
NAME RGZ
RGC ZQE
/PT
General-purpose digital I/O with reconfigurable port mapping secondary
P4.5/PM_UCA1RXD/ function
46 34 C9 I/O
PM_UCA1SOMI Default mapping: Receive data USCI_A1 UART mode
Default mapping: Slave out, master in USCI_A1 SPI mode
General-purpose digital I/O with reconfigurable port mapping secondary
P4.6/PM_NONE 47 35 C8 I/O function
Default mapping: no secondary function.
General-purpose digital I/O with reconfigurable port mapping secondary
P4.7/PM_NONE 48 36 C7 I/O function
Default mapping: no secondary function.
B8,
VSSU 49 37 USB PHY ground supply
B9 General-purpose digital I/O - controlled by USB control register
PU.0/DP 50 38 A9 I/O USB data terminal DP
PUR 51 39 B7 I/O USB pullup resistor pin (open drain)
General-purpose digital I/O - controlled by USB control register
PU.1/DM 52 40 A8 I/O USB data terminal DM
VBUS 53 41 A7 USB LDO input (connect to USB power source)
VUSB 54 42 A6 USB LDO output
V18 55 43 B6 USB regulated power (internal use only, no external current loading)
AVSS2 56 44 A5 Analog ground supply
General-purpose digital I/O
P5.2/XT2IN 57 45 B5 I/O Input terminal for crystal oscillator XT2
General-purpose digital I/O
P5.3/XT2OUT 58 46 B4 I/O Output terminal of crystal oscillator XT2
Test mode pin select digital I/O on JTAG pins
TEST/SBWTCK 59 47 A4 I Spy-bi-wire input clock
General-purpose digital I/O
PJ.0/TDO 60 23 C5 I/O Test data output port
General-purpose digital I/O
PJ.1/TDI/TCLK 61 24 C4 I/O Test data input or test clock input
General-purpose digital I/O
PJ.2/TMS 62 25 A3 I/O Test mode select
General-purpose digital I/O
PJ.3/TCK 63 26 B3 I/O Test clock
Reset input active low
RST/NMI/SBWTDIO 64 48 A2 I/O Non-maskable interrupt input
Spy-bi-wire data input/output
General-purpose digital I/O
P6.0/CB0/A0 1 1 A1 I/O Comparator_B input CB0 (not available on '5507, '5506, '5505, '5504 devices)
Analog input A0 ADC (not available on '5503, '5502, '5501, '5500 devices)
General-purpose digital I/O
P6.1/CB1/A1 2 2 B2 I/O Comparator_B input CB1 (not available on '5507, '5506, '5505, '5504 devices)
Analog input A1 ADC (not available on '5503, '5502, '5501, '5500 devices)
General-purpose digital I/O
P6.2/CB2/A2 3 3 B1 I/O Comparator_B input CB2 (not available on '5507, '5506, '5505, '5504 devices)
Analog input A2 ADC (not available on '5503, '5502, '5501, '5500 devices)
General-purpose digital I/O
P6.3/CB3/A3 4 4 C2 I/O Comparator_B input CB3 (not available on '5507, '5506, '5505, '5504 devices)
Analog input A3 ADC (not available on '5503, '5502, '5501, '5500 devices)
Reserved N/A N/A (3)
(3) C6, D4, D5, D6, E3, E4, E5, E6, F3, F4, F5, F6, F7, F8, G3 are reserved and should be connected to ground.
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Table 3. TERMINAL FUNCTIONS (continued)
TERMINAL
NO. I/O(1) DESCRIPTION
NAME RGZ
RGC ZQE
/PT
Exposed QFN package pad. Connection to VSS recommended (not available
QFN Pad Pad Pad N/A on PT package devices)
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ProgramCounter PC/R0
StackPointer SP/R1
StatusRegister SR/CG1/R2
ConstantGenerator CG2/R3
General-PurposeRegister R4
General-PurposeRegister R5
General-PurposeRegister R6
General-PurposeRegister R7
General-PurposeRegister R8
General-PurposeRegister R9
General-PurposeRegister R10
General-PurposeRegister R11
General-PurposeRegister R12
General-PurposeRegister R13
General-PurposeRegister R15
General-PurposeRegister R14
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SHORT-FORM DESCRIPTION
CPU
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations,
other than program-flow instructions, are performed as register operations in conjunction with seven addressing
modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-register
operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant
generator, respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all
instructions.
The instruction set consists of the original 51 instructions with three formats and seven address modes and
additional instructions for the expanded address range. Each instruction can operate on word and byte data.
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Operating Modes
The MSP430 devices have one active mode and six software selectable low-power modes of operation. An
interrupt event can wake up the device from any of the low-power modes, service the request, and restore back
to the low-power mode on return from the interrupt program.
The following seven operating modes can be configured by software:
Active mode (AM)
All clocks are active
Low-power mode 0 (LPM0)
CPU is disabled
ACLK and SMCLK remain active, MCLK is disabled
FLL loop control remains active
Low-power mode 1 (LPM1)
CPU is disabled
FLL loop control is disabled
ACLK and SMCLK remain active, MCLK is disabled
Low-power mode 2 (LPM2)
CPU is disabled
MCLK and FLL loop control and DCOCLK are disabled
DCO's dc-generator remains enabled
ACLK remains active
Low-power mode 3 (LPM3)
CPU is disabled
MCLK, FLL loop control, and DCOCLK are disabled
DCO's dc generator is disabled
ACLK remains active
Low-power mode 4 (LPM4)
CPU is disabled
ACLK is disabled
MCLK, FLL loop control, and DCOCLK are disabled
DCO's dc generator is disabled
Crystal oscillator is stopped
Complete data retention
Low-power mode 4.5 (LPM4.5)
Internal regulator disabled
No data retention
Wakeup from RST/NMI, P1, and P2.
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Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 4. Interrupt Sources, Flags, and Vectors
SYSTEM WORD
INTERRUPT SOURCE INTERRUPT FLAG PRIORITY
INTERRUPT ADDRESS
System Reset
Power-Up
External Reset WDTIFG, KEYV (SYSRSTIV)(1) (2) Reset 0FFFEh 63, highest
Watchdog Timeout, Password
Violation
Flash Memory Password Violation
System NMI SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
PMM VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG, (Non)maskable 0FFFCh 62
Vacant Memory Access JMBOUTIFG (SYSSNIV)(1)
JTAG Mailbox
User NMI
NMI NMIIFG, OFIFG, ACCVIFG, BUSIFG (Non)maskable 0FFFAh 61
Oscillator Fault (SYSUNIV)(1) (2)
Flash Memory Access Violation
Comp_B Comparator B interrupt flags (CBIV)(1) (3) Maskable 0FFF8h 60
TB0 TB0CCR0 CCIFG0 (3) Maskable 0FFF6h 59
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,
TB0 Maskable 0FFF4h 58
TB0IFG (TB0IV)(1) (3)
Watchdog Timer_A Interval Timer WDTIFG Maskable 0FFF2h 57
Mode
USCI_A0 Receive/Transmit UCA0RXIFG, UCA0TXIFG (UCA0IV)(1) (3) Maskable 0FFF0h 56
USCI_B0 Receive/Transmit UCB0RXIFG, UCB0TXIFG (UCAB0IV)(1) (3) Maskable 0FFEEh 55
ADC10_A ADC10IFG0(1) (3) (4) Maskable 0FFECh 54
TA0 TA0CCR0 CCIFG0(3) Maskable 0FFEAh 53
TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,
TA0 Maskable 0FFE8h 52
TA0IFG (TA0IV)(1) (3)
USB_UBM USB interrupts (USBIV)(1) (3) Maskable 0FFE6h 51
DMA DMA0IFG, DMA1IFG, DMA2IFG (DMAIV)(1) (3) Maskable 0FFE4h 50
TA1 TA1CCR0 CCIFG0(3) Maskable 0FFE2h 49
TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,
TA1 Maskable 0FFE0h 48
TA1IFG (TA1IV)(1) (3)
I/O Port P1 P1IFG.0 to P1IFG.7 (P1IV)(1) (3) Maskable 0FFDEh 47
USCI_A1 Receive/Transmit UCA1RXIFG, UCA1TXIFG (UCA1IV)(1) (3) Maskable 0FFDCh 46
USCI_B1 Receive/Transmit UCB1RXIFG, UCB1TXIFG (UCB1IV)(1) (3) Maskable 0FFDAh 45
TA2 TA2CCR0 CCIFG0(3) Maskable 0FFD8h 44
TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2,
TA2 Maskable 0FFD6h 43
TA2IFG (TA2IV)(1) (3)
I/O Port P2 P2IFG.0 to P2IFG.7 (P2IV)(1) (3) Maskable 0FFD4h 42
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RTC_A Maskable 0FFD2h 41
RT0PSIFG, RT1PSIFG (RTCIV)(1) (3)
0FFD0h 40
Reserved Reserved(5)
0FF80h 0, lowest
(1) Multiple source flags
(2) A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
(3) Interrupt flags are located in the module.
(4) Only on devices with ADC, otherwise reserved.
(5) Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatibility with other devices, it is recommended to reserve these locations.
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Memory Organization
Table 5. Memory Organization(1)
MSP430F5508 MSP430F5509 MSP430F5510
MSP430F5504 MSP430F5505 MSP430F5506 MSP430F5507
MSP430F5500 MSP430F5501 MSP430F5502 MSP430F5503
Memory (flash) Total Size 8 KB 16 KB 24 KB 32 KB
Main: interrupt vector 00FFFFh00FF80h 00FFFFh00FF80h 00FFFFh00FF80h 00FFFFh00FF80h
Main: code memory 00FFFFh-00E000h 00FFFFh-00C000h 00FFFFh-00A000h 00FFFFh-008000h
Sector 1 2 KB 2 KB 2 KB 2 KB
0033FFh002C00h 0033FFh002C00h 0033FFh002C00h 0033FFh002C00h
RAM Sector 0 2 KB 2 KB 2 KB 2 KB
002BFFh002400h 002BFFh002400h 002BFFh002400h 002BFFh002400h
2 KB 2 KB 2 KB 2 KB
USB RAM(2) 0023FFh001C00h 0023FFh001C00h 0023FFh001C00h 0023FFh001C00h
Info A 128 B 128 B 128 B 128 B
0019FFh001980h 0019FFh001980h 0019FFh001980h 0019FFh001980h
Info B 128 B 128 B 128 B 128 B
00197Fh001900h 00197Fh001900h 00197Fh001900h 00197Fh001900h
Information memory
(flash) Info C 128 B 128 B 128 B 128 B
0018FFh001880h 0018FFh001880h 0018FFh001880h 0018FFh001880h
Info D 128 B 128 B 128 B 128 B
00187Fh001800h 00187Fh001800h 00187Fh001800h 00187Fh001800h
BSL 3 512 B 512 B 512 B 512 B
0017FFh001600h 0017FFh001600h 0017FFh001600h 0017FFh001600h
BSL 2 512 B 512 B 512 B 512 B
0015FFh001400h 0015FFh001400h 0015FFh001400h 0015FFh001400h
Bootstrap loader (BSL)
memory (flash) BSL 1 512 B 512 B 512 B 512 B
0013FFh001200h 0013FFh001200h 0013FFh001200h 0013FFh001200h
BSL 0 512 B 512 B 512 B 512 B
0011FFh001000h 0011FFh001000h 0011FFh001000h 0011FFh001000h
Size 4 KB 4 KB 4 KB 4 KB
Peripherals 000FFFh0h 000FFFh0h 000FFFh0h 000FFFh0h
(1) N/A = Not available
(2) USB RAM can be used as general purpose RAM when not used for USB operation.
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Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using various serial interfaces. Access to the
device memory via the BSL is protected by an user-defined password. For complete description of the features of
the BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader User's Guide
(SLAU319).
USB BSL
All devices come pre-programmed with the USB BSL. Use of the USB BSL requires external access to the six
pins shown in Table 6. In addition to these pins, the application must support external components necessary for
normal USB operation (for example, proper crystal on XT2IN and XT2OUT, proper decoupling, etc.).
Table 6. USB BSL Pin Requirements and Functions
DEVICE SIGNAL BSL FUNCTION
RST/NMI/SBWTDIO Entry sequence signal
PU.0/DP USB data terminal DP
PU.1/DM USB data terminal DM
PUR USB pullup resistor terminal
VBUS USB bus power supply
VSSU USB ground supply
UART BSL
A UART BSL is also available that can be programmed by the user into the BSL memory by replacing the
pre-programmed, factory supplied, USB BSL. Use of the UART BSL requires external access to the six pins
shown in Table 7.
Table 7. UART BSL Pin Requirements and Functions
DEVICE SIGNAL BSL FUNCTION
RST/NMI/SBWTDIO Entry sequence signal
TEST/SBWTCK Entry sequence signal
P1.1 Data transmit
P1.2 Data receive
VCC Power supply
VSS Ground supply
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JTAG Operation
JTAG Standard Interface
The MSP430 family supports the standard JTAG interface, which requires four signals for sending and receiving
data. The JTAG signals are shared with general-purpose I/Os. The TEST/SBWTCK pin is used to enable the
JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430
development tools and device programmers. The JTAG pin requirements are shown in Table 8. For further
details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's
Guide, literature number SLAU278.
Table 8. JTAG Pin Requirements and Functions
DEVICE SIGNAL DIRECTION FUNCTION
PJ.3/TCK IN JTAG clock input
PJ.2/TMS IN JTAG state control
PJ.1/TDI/TCLK IN JTAG data input/TCLK input
PJ.0/TDO OUT JTAG data output
TEST/SBWTCK IN Enable JTAG pins
RST/NMI/SBWTDIO IN External reset
VCC Power supply
VSS Ground supply
Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire interface.
Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire
interface pin requirements are shown in Table 9. For further details on interfacing to development tools and
device programmers, see the MSP430 Hardware Tools User's Guide, literature number SLAU278.
Table 9. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL DIRECTION FUNCTION
TEST/SBWTCK IN Spy-Bi-Wire clock input
RST/NMI/SBWTDIO IN, OUT Spy-Bi-Wire data input/output
VCC Power supply
VSS Ground supply
Flash Memory
The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the
CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the
flash memory include:
Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
Segments 0 to n may be erased in one step, or each segment may be individually erased.
Segments A to D can be erased individually, or as a group with segments 0 to n. Segments A to D are also
called information memory.
Segment A can be locked separately.
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RAM Memory
The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage,
however all data is lost. Features of the RAM memory include:
RAM memory has n sectors. The size of a sector can be found in the Memory Organization section.
Each sector 0 to n can be completely disabled, however data retention is lost.
Each sector 0 to n automatically enters low power retention mode when possible.
For Devices that contain USB memory, the USB memory can be used as normal RAM if USB is not required.
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x5xx/MSP430x6xx Family User's Guide,
literature number SLAU208.
Digital I/O
There are up to six 8-bit I/O ports implemented: For 64 pin options, P1, P2, P4, P6, and are complete, P5 is
reduced to 6-bit I/O and P3 to 5-bit I/O. For 48 pin options, P6 is reduced to 4-bit I/O, P2 to 1-bit I/O, and P3 is
completely removed. Port PJ contains four individual I/O ports, common to all devices.
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Pullup or pulldown on all ports is programmable.
Drive strength on all ports is programmable.
Edge-selectable interrupt and LPM4.5 wakeup input capability is available for all bits of ports P1 and P2.
Read/write access to port-control registers is supported by all instructions.
Ports can be accessed byte-wise (P1 through P6) or word-wise in pairs (PA through PC).
Port Mapping Controller
The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P4.
Table 10. Port Mapping, Mnemonics, and Functions
VALUE PxMAPy MNEMONIC INPUT PIN FUNCTION OUTPUT PIN FUNCTION
0 PM_NONE None DVSS
PM_CBOUT0 - Comparator_B output
1PM_TB0CLK TB0 clock input
PM_ADC10CLK - ADC10CLK
2PM_DMAE0 DMAE0 input
PM_SVMOUT - SVM output
3TB0 high impedance input
PM_TB0OUTH TB0OUTH
4 PM_TB0CCR0A TB0 CCR0 capture input CCI0A TB0 CCR0 compare output Out0
5 PM_TB0CCR1A TB0 CCR1 capture input CCI1A TB0 CCR1 compare output Out1
6 PM_TB0CCR2A TB0 CCR2 capture input CCI2A TB0 CCR2 compare output Out2
7 PM_TB0CCR3A TB0 CCR3 capture input CCI3A TB0 CCR3 compare output Out3
8 PM_TB0CCR4A TB0 CCR4 capture input CCI4A TB0 CCR4 compare output Out4
9 PM_TB0CCR5A TB0 CCR5 capture input CCI5A TB0 CCR5 compare output Out5
10 PM_TB0CCR6A TB0 CCR6 capture input CCI6A TB0 CCR6 compare output Out6
PM_UCA1RXD USCI_A1 UART RXD (Direction controlled by USCI - input)
11 PM_UCA1SOMI USCI_A1 SPI slave out master in (direction controlled by USCI)
PM_UCA1TXD USCI_A1 UART TXD (Direction controlled by USCI - output)
12 PM_UCA1SIMO USCI_A1 SPI slave in master out (direction controlled by USCI)
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Table 10. Port Mapping, Mnemonics, and Functions (continued)
VALUE PxMAPy MNEMONIC INPUT PIN FUNCTION OUTPUT PIN FUNCTION
PM_UCA1CLK USCI_A1 clock input/output (direction controlled by USCI)
13 PM_UCB1STE USCI_B1 SPI slave transmit enable (direction controlled by USCI)
PM_UCB1SOMI USCI_B1 SPI slave out master in (direction controlled by USCI)
14 PM_UCB1SCL USCI_B1 I2C clock (open drain and direction controlled by USCI)
PM_UCB1SIMO USCI_B1 SPI slave in master out (direction controlled by USCI)
15 PM_UCB1SDA USCI_B1 I2C data (open drain and direction controlled by USCI)
PM_UCB1CLK USCI_B1 clock input/output (direction controlled by USCI)
16 PM_UCA1STE USCI_A1 SPI slave transmit enable (direction controlled by USCI)
17 PM_CBOUT1 None Comparator_B output
18 PM_MCLK None MCLK
19 PM_RTCCLK None RTCCLK output
PM_UCA0RXD USCI_A0 UART RXD (Direction controlled by USCI - input)
20 PM_UCA0SOMI USCI_A0 SPI slave out master in (direction controlled by USCI)
PM_UCA0TXD USCI_A0 UART TXD (Direction controlled by USCI - output)
21 PM_UCA0SIMO USCI_A0 SPI slave in master out (direction controlled by USCI)
PM_UCA0CLK USCI_A0 clock input/output (direction controlled by USCI)
22 PM_UCB0STE USCI_B0 SPI slave transmit enable (direction controlled by USCI)
PM_UCB0SOMI USCI_B0 SPI slave out master in (direction controlled by USCI)
23 PM_UCB0SCL USCI_B0 I2C clock (open drain and direction controlled by USCI)
PM_UCB0SIMO USCI_B0 SPI slave in master out (direction controlled by USCI)
24 PM_UCB0SDA USCI_B0 I2C data (open drain and direction controlled by USCI)
PM_UCB0CLK USCI_B0 clock input/output (direction controlled by USCI)
25 PM_UCA0STE USCI_A0 SPI slave transmit enable (direction controlled by USCI)
26 - 30 Reserved None DVSS
Disables the output driver as well as the input Schmitt-trigger to prevent
31 (0FFh)(1) PM_ANALOG parasitic cross currents when applying analog signals.
(1) The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are
ignored resulting in a read out value of 31.
Table 11. Default Mapping
PIN PxMAPy MNEMONIC INPUT PIN FUNCTION OUTPUT PIN FUNCTION
USCI_B1 SPI slave transmit enable (direction controlled by USCI)
P4.0/P4MAP0 PM_UCB1STE/PM_UCA1CLK USCI_A1 clock input/output (direction controlled by USCI)
USCI_B1 SPI slave in master out (direction controlled by USCI)
P4.1/P4MAP1 PM_UCB1SIMO/PM_UCB1SDA USCI_B1 I2C data (open drain and direction controlled by USCI)
USCI_B1 SPI slave out master in (direction controlled by USCI)
P4.2/P4MAP2 PM_UCB1SOMI/PM_UCB1SCL USCI_B1 I2C clock (open drain and direction controlled by USCI)
USCI_A1 SPI slave transmit enable (direction controlled by USCI)
P4.3/P4MAP3 PM_UCB1CLK/PM_UCA1STE USCI_B1 clock input/output (direction controlled by USCI)
USCI_A1 UART TXD (Direction controlled by USCI - output)
P4.4/P4MAP4 PM_UCA1TXD/PM_UCA1SIMO USCI_A1 SPI slave in master out (direction controlled by USCI)
USCI_A1 UART RXD (Direction controlled by USCI - input)
P4.5/P4MAP5 PM_UCA1RXD/PM_UCA1SOMI USCI_A1 SPI slave out master in (direction controlled by USCI)
P4.6/P4MAP6 PM_NONE None DVSS
P4.7/P4MAP7 PM_NONE None DVSS
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Oscillator and System Clock
The clock system in the MSP430F550x family of devices is supported by the Unified Clock System (UCS)
module that includes support for a 32-kHz watch crystal oscillator (XT1 LF mode; XT1 HF mode is not
supported), an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency
oscillator (REFO), an integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal
oscillator XT2. The UCS module is designed to meet the requirements of both low system cost and low power
consumption. The UCS module features digital frequency locked loop (FLL) hardware that, in conjunction with a
digital modulator, stabilizes the DCO frequency to a programmable multiple of the selected FLL reference
frequency. The internal DCO provides a fast turn-on clock source and stabilizes in less than 5 µs. The UCS
module provides the following clock signals:
Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the
internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal
digitally-controlled oscillator DCO.
Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by
same sources made available to ACLK.
ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
Power Management Module (PMM)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains
programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor
(SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is
implemented to provide the proper internal reset signal to the device during power-on and power-off. The
SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply
voltage supervision (the device is automatically reset) and supply voltage monitoring (SVM, the device is not
automatically reset). SVS and SVM circuitry is available on the primary supply and core supply.
Hardware Multiplier
The multiplication operation is supported by a dedicated peripheral module. The module performs operations with
32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication
as well as signed and unsigned multiply and accumulate operations.
Real-Time Clock (RTC_A)
The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated
real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit timers
that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by software. Calendar
mode integrates an internal calendar which compensates for months with less than 31 days and includes leap
year correction. The RTC_A also supports flexible alarm functions and offset-calibration hardware.
Watchdog Timer (WDT_A)
The primary function of the watchdog timer (WDT_A) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
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System Module (SYS)
The SYS module handles many of the system functions within the device. These include power on reset and
power up clear handling, NMI source selection and management, reset interrupt vector generators, boot strap
loader entry mechanisms, as well as, configuration management (device descriptors). It also includes a data
exchange mechanism via JTAG called a JTAG mailbox that can be used in the application.
Table 12. System Module Interrupt Vector Registers
INTERRUPT VECTOR REGISTER ADDRESS INTERRUPT EVENT VALUE PRIORITY
SYSRSTIV , System Reset 019Eh No interrupt pending 00h
Brownout (BOR) 02h Highest
RST/NMI (POR) 04h
PMMSWBOR (BOR) 06h
Wakeup from LPMx.5 08h
Security violation (BOR) 0Ah
SVSL (POR) 0Ch
SVSH (POR) 0Eh
SVML_OVP (POR) 10h
SVMH_OVP (POR) 12h
PMMSWPOR (POR) 14h
WDT timeout (PUC) 16h
WDT password violation (PUC) 18h
KEYV flash password violation (PUC) 1Ah
FLL unlock (PUC) 1Ch
Peripheral area fetch (PUC) 1Eh
PMM password violation (PUC) 20h
Reserved 22h to 3Eh Lowest
SYSSNIV , System NMI 019Ch No interrupt pending 00h
SVMLIFG 02h Highest
SVMHIFG 04h
SVSMLDLYIFG 06h
SVSMHDLYIFG 08h
VMAIFG 0Ah
JMBINIFG 0Ch
JMBOUTIFG 0Eh
SVMLVLRIFG 10h
SVMHVLRIFG 12h
Reserved 14h to 1Eh Lowest
SYSUNIV, User NMI 019Ah No interrupt pending 00h
NMIFG 02h Highest
OFIFG 04h
ACCVIFG 06h
Reserved 08h
Reserved 0Ah to 1Eh Lowest
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DMA Controller
The DMA controller allows movement of data from one memory address to another without CPU intervention. For
example, the DMA controller can be used to move data from the ADC10_A conversion register to RAM. Using
the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system
power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or
from a peripheral.
The USB timestamp generator also utilizes the DMA trigger assignments described in Table 13.
Table 13. DMA Trigger Assignments(1)
CHANNEL
TRIGGER 0 1 2
0 DMAREQ DMAREQ DMAREQ
1 TA0CCR0 CCIFG TA0CCR0 CCIFG TA0CCR0 CCIFG
2 TA0CCR2 CCIFG TA0CCR2 CCIFG TA0CCR2 CCIFG
3 TA1CCR0 CCIFG TA1CCR0 CCIFG TA1CCR0 CCIFG
4 TA1CCR2 CCIFG TA1CCR2 CCIFG TA1CCR2 CCIFG
5 TA2CCR0 CCIFG TA2CCR0 CCIFG TA2CCR0 CCIFG
6 TA2CCR2 CCIFG TA2CCR2 CCIFG TA2CCR2 CCIFG
7 TB0CCR0 CCIFG TB0CCR0 CCIFG TB0CCR0 CCIFG
8 TB0CCR2 CCIFG TB0CCR2 CCIFG TB0CCR2 CCIFG
9 Reserved Reserved Reserved
10 Reserved Reserved Reserved
11 Reserved Reserved Reserved
12 Reserved Reserved Reserved
13 Reserved Reserved Reserved
14 Reserved Reserved Reserved
15 Reserved Reserved Reserved
16 UCA0RXIFG UCA0RXIFG UCA0RXIFG
17 UCA0TXIFG UCA0TXIFG UCA0TXIFG
18 UCB0RXIFG UCB0RXIFG UCB0RXIFG
19 UCB0TXIFG UCB0TXIFG UCB0TXIFG
20 UCA1RXIFG UCA1RXIFG UCA1RXIFG
21 UCA1TXIFG UCA1TXIFG UCA1TXIFG
22 UCB1RXIFG UCB1RXIFG UCB1RXIFG
23 UCB1TXIFG UCB1TXIFG UCB1TXIFG
24 ADC10IFG0(2) ADC10IFG0(2) ADC10IFG0(2)
25 Reserved Reserved Reserved
26 Reserved Reserved Reserved
27 USB FNRXD USB FNRXD USB FNRXD
28 USB ready USB ready USB ready
29 MPY ready MPY ready MPY ready
30 DMA2IFG DMA0IFG DMA1IFG
31 DMAE0 DMAE0 DMAE0
(1) If a reserved trigger source is selected, no Trigger1 is generated.
(2) Only on devices with ADC. Reserved on devices without ADC.
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Universal Serial Communication Interface (USCI)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions,
A and B.
The USCI_An module provides support for SPI (3 pin or 4 pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3 pin or 4 pin) or I2C.
The MSP430F55xx series includes two complete USCI modules (n = 0, 1).
TA0
TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 14. TA0 Signal Connections
INPUT PIN NUMBER DEVICE MODULE MODULE DEVICE OUTPUT PIN NUMBER
MODULE
INPUT INPUT OUTPUT OUTPUT
BLOCK
RGC/ZQE RGZ, PT RGC/ZQE RGZ, PT
SIGNAL SIGNAL SIGNAL SIGNAL
18/H2-P1.0 14-P1.0 TA0CLK TACLK
ACLK ACLK
(internal) Timer NA NA
SMCLK SMCLK
(internal)
18/H2-P1.0 14-P1.0 TA0CLK TACLK
19/H3-P1.1 15-P1.1 TA0.0 CCI0A 19/H3-P1.1 15-P1.1
DVSS CCI0B CCR0 TA0 TA0.0
DVSS GND
DVCC VCC
20/J3-P1.2 16-P1.2 TA0.1 CCI1A 20/J3-P1.2 16-P1.2
ADC10 ADC10
CBOUT (internal)(1) (internal)(1)
CCI1B
(internal) ADC10SHSx = ADC10SHSx =
CCR1 TA1 TA0.1 {1} {1}
DVSS GND
DVCC VCC
21/G4-P1.3 17-P1.3 TA0.2 CCI2A 21/G4-P1.3 17-P1.3
ACLK CCI2B
(internal) CCR2 TA2 TA0.2
DVSS GND
DVCC VCC
22/H4-P1.4 18-P1.4 TA0.3 CCI3A 22/H4-P1.4 18-P1.4
DVSS CCI3B CCR3 TA3 TA0.3
DVSS GND
DVCC VCC
23/J4-P1.5 19-P1.5 TA0.4 CCI4A 23/J4-P1.5 19-P1.5
DVSS CCI4B CCR4 TA4 TA0.4
DVSS GND
DVCC VCC
(1) Only on devices with ADC.
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TA1
TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 15. TA1 Signal Connections
INPUT PIN NUMBER DEVICE MODULE MODULE DEVICE OUTPUT PIN NUMBER
MODULE
INPUT INPUT OUTPUT OUTPUT
BLOCK
RGC/ZQE RGZ, PT RGC/ZQE RGZ, PT
SIGNAL SIGNAL SIGNAL SIGNAL
24/G5-P1.6 20-P1.6 TA1CLK TACLK
ACLK ACLK
(internal) Timer NA NA
SMCLK SMCLK
(internal)
24/G5-P1.6 20-P1.6 TA1CLK TACLK
25/H5-P1.7 21-P1.7 TA1.0 CCI0A 25/H5-P1.7 21-P1.7
DVSS CCI0B CCR0 TA0 TA1.0
DVSS GND
DVCC VCC
26/J5-P2.0 22-P2.0 TA1.1 CCI1A 26/J5-P2.0 22-P2.0
CBOUT CCI1B
(internal) CCR1 TA1 TA1.1
DVSS GND
DVCC VCC
27/G6-P2.1 TA1.2 CCI2A 27/G6-P2.1
ACLK CCI2B
(internal) CCR2 TA2 TA1.2
DVSS GND
DVCC VCC
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TA2
TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 16. TA2 Signal Connections
INPUT PIN NUMBER DEVICE MODULE MODULE DEVICE OUTPUT PIN NUMBER
MODULE
INPUT INPUT OUTPUT OUTPUT
BLOCK
RGC, ZQE RGZ, PT RGC, ZQE RGZ, PT
SIGNAL SIGNAL SIGNAL SIGNAL
28/J6-P2.2 TA2CLK TACLK
ACLK ACLK
(internal) Timer NA NA
SMCLK SMCLK
(internal)
28/J6-P2.2 TA2CLK TACLK
29/H6-P2.3 TA2.0 CCI0A 29/H6-P2.3
DVSS CCI0B CCR0 TA0 TA2.0
DVSS GND
DVCC VCC
30/J7-P2.4 TA2.1 CCI1A 30/J7-P2.4
CBOUT CCI1B
(internal) CCR1 TA1 TA2.1
DVSS GND
DVCC VCC
31/J8-P2.5 TA2.2 CCI2A 31/J8-P2.5
ACLK CCI2B
(internal) CCR2 TA2 TA2.2
DVSS GND
DVCC VCC
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TB0
TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 17. TB0 Signal Connections
INPUT PIN NUMBER DEVICE MODULE MODULE DEVICE OUTPUT PIN NUMBER
MODULE
INPUT INPUT OUTPUT OUTPUT
BLOCK
RGC/ZQE(1) RGZ, PT(1) RGC/ZQE(1) RGZ, PT(1)
SIGNAL SIGNAL SIGNAL SIGNAL
TB0CLK TBCLK
ACLK ACLK
(internal) Timer NA NA
SMCLK SMCLK
(internal)
TB0CLK TBCLK ADC10 ADC10
(internal)(2) (internal)(2)
TB0.0 CCI0A ADC10SHSx = ADC10SHSx =
{2} {2}
CCR0 TB0 TB0.0
TB0.0 CCI0B
DVSS GND
DVCC VCC ADC10 (internal) ADC10 (internal)
TB0.1 CCI1A ADC10SHSx = ADC10SHSx =
{3} {3}
CBOUT CCR1 TB1 TB0.1
CCI1B
(internal)
DVSS GND
DVCC VCC
TB0.2 CCI2A
TB0.2 CCI2B CCR2 TB2 TB0.2
DVSS GND
DVCC VCC
TB0.3 CCI3A
TB0.3 CCI3B CCR3 TB3 TB0.3
DVSS GND
DVCC VCC
TB0.4 CCI4A
TB0.4 CCI4B CCR4 TB4 TB0.4
DVSS GND
DVCC VCC
TB0.5 CCI5A
TB0.5 CCI5B CCR5 TB5 TB0.5
DVSS GND
DVCC VCC
TB0.6 CCI6A
ACLK CCI6B
(internal) CCR6 TB6 TB0.6
DVSS GND
DVCC VCC
(1) Timer functions selectable via the port mapping controller.
(2) Only on devices with ADC.
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Comparator_B
The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,
battery voltage supervision, and monitoring of external analog signals.
ADC10_A
The ADC10_A module supports fast 10-bit analog-to-digital conversions. The module implements a 10-bit SAR
core, sample select control, reference generator, and a conversion result buffer. A window comparator with lower
and upper limits allows CPU-independent result monitoring with three window comparator interrupt flags.
CRC16
The CRC16 module produces a signature based on a sequence of entered data values and can be used for data
checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
REF Voltage Reference
The reference module (REF) is responsible for generation of all critical reference voltages that can be used by
the various analog peripherals in the device.
USB Universal Serial Bus
The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The module
supports full-speed operation of control, interrupt, and bulk transfers. The module includes an integrated LDO,
PHY, and PLL. The PLL is highly-flexible and can support a wide range of input clock frequencies. USB RAM,
when not used for USB communication, can be used by the system.
Embedded Emulation Module (EEM) (S Version)
The Embedded Emulation Module (EEM) supports real-time in-system debugging. The S version of the EEM
implemented on all devices has the following features:
Three hardware triggers/breakpoints on memory access
One hardware trigger/breakpoint on CPU register write access
Up to four hardware triggers can be combined to form complex triggers/breakpoints
One cycle counter
Clock control on module level
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Peripheral File Map
Table 18. Peripherals
OFFSET ADDRESS
MODULE NAME BASE ADDRESS RANGE
Special Functions (see Table 19) 0100h 000h - 01Fh
PMM (see Table 20) 0120h 000h - 01Fh
Flash Control (see Table 21) 0140h 000h - 00Fh
CRC16 (see Table 22) 0150h 000h - 007h
RAM Control (see Table 23) 0158h 000h - 001h
Watchdog (see Table 24) 015Ch 000h - 001h
UCS (see Table 25) 0160h 000h - 01Fh
SYS (see Table 26) 0180h 000h - 01Fh
Shared Reference (see Table 27) 01B0h 000h - 001h
Port Mapping Control (see Table 28) 01C0h 000h - 002h
Port Mapping Port P4 (see Table 28) 01E0h 000h - 007h
Port P1/P2 (see Table 29) 0200h 000h - 01Fh
Port P3/P4 (see Table 30) 0220h 000h - 00Bh
Port P5/P6 (see Table 31) 0240h 000h - 00Bh
Port PJ (see Table 32) 0320h 000h - 01Fh
TA0 (see Table 33) 0340h 000h - 02Eh
TA1 (see Table 34) 0380h 000h - 02Eh
TB0 (see Table 35) 03C0h 000h - 02Eh
TA2 (see Table 36) 0400h 000h - 02Eh
Real Timer Clock (RTC_A) (see Table 37) 04A0h 000h - 01Bh
32-bit Hardware Multiplier (see Table 38) 04C0h 000h - 02Fh
DMA General Control (see Table 39) 0500h 000h - 00Fh
DMA Channel 0 (see Table 39) 0510h 000h - 00Ah
DMA Channel 1 (see Table 39) 0520h 000h - 00Ah
DMA Channel 2 (see Table 39) 0530h 000h - 00Ah
USCI_A0 (see Table 40) 05C0h 000h - 01Fh
USCI_B0 (see Table 41) 05E0h 000h - 01Fh
USCI_A1 (see Table 42) 0600h 000h - 01Fh
USCI_B1 (see Table 43) 0620h 000h - 01Fh
ADC10_A (see Table 44) 0740h 000h - 01Fh
Comparator_B (see Table 45) 08C0h 000h - 00Fh
USB configuration (see Table 46) 0900h 000h - 014h
USB control (see Table 47) 0920h 000h - 01Fh
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Table 19. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION REGISTER OFFSET
SFR interrupt enable SFRIE1 00h
SFR interrupt flag SFRIFG1 02h
SFR reset pin control SFRRPCR 04h
Table 20. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION REGISTER OFFSET
PMM Control 0 PMMCTL0 00h
PMM control 1 PMMCTL1 02h
SVS high side control SVSMHCTL 04h
SVS low side control SVSMLCTL 06h
PMM interrupt flags PMMIFG 0Ch
PMM interrupt enable PMMIE 0Eh
PMM Power mode 5 control PMM5CTL 10h
Table 21. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION REGISTER OFFSET
Flash control 1 FCTL1 00h
Flash control 3 FCTL3 04h
Flash control 4 FCTL4 06h
Table 22. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION REGISTER OFFSET
CRC data input CRC16DI 00h
CRC data input reverse byte CRCDIRB 02h
CRC initialization and result CRCINIRES 04h
CRC result reverse byte CRCRESR 06h
Table 23. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION REGISTER OFFSET
RAM control 0 RCCTL0 00h
Table 24. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION REGISTER OFFSET
Watchdog timer control WDTCTL 00h
Table 25. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION REGISTER OFFSET
UCS control 0 UCSCTL0 00h
UCS control 1 UCSCTL1 02h
UCS control 2 UCSCTL2 04h
UCS control 3 UCSCTL3 06h
UCS control 4 UCSCTL4 08h
UCS control 5 UCSCTL5 0Ah
UCS control 6 UCSCTL6 0Ch
UCS control 7 UCSCTL7 0Eh
UCS control 8 UCSCTL8 10h
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Table 26. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION REGISTER OFFSET
System control SYSCTL 00h
Bootstrap loader configuration area SYSBSLC 02h
JTAG mailbox control SYSJMBC 06h
JTAG mailbox input 0 SYSJMBI0 08h
JTAG mailbox input 1 SYSJMBI1 0Ah
JTAG mailbox output 0 SYSJMBO0 0Ch
JTAG mailbox output 1 SYSJMBO1 0Eh
Bus Error vector generator SYSBERRIV 18h
User NMI vector generator SYSUNIV 1Ah
System NMI vector generator SYSSNIV 1Ch
Reset vector generator SYSRSTIV 1Eh
Table 27. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION REGISTER OFFSET
Shared reference control REFCTL 00h
Table 28. Port Mapping Registers
(Base Address of Port Mapping Control: 01C0h, Port P4: 01E0h)
REGISTER DESCRIPTION REGISTER OFFSET
Port mapping key/ID register PMAPKEYID 00h
Port mapping control register PMAPCTL 02h
Port P4.0 mapping register P4MAP0 00h
Port P4.1 mapping register P4MAP1 01h
Port P4.2 mapping register P4MAP2 02h
Port P4.3 mapping register P4MAP3 03h
Port P4.4 mapping register P4MAP4 04h
Port P4.5 mapping register P4MAP5 05h
Port P4.6 mapping register P4MAP6 06h
Port P4.7 mapping register P4MAP7 07h
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Table 29. Port P1/P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION REGISTER OFFSET
Port P1 input P1IN 00h
Port P1 output P1OUT 02h
Port P1 direction P1DIR 04h
Port P1 pullup/pulldown enable P1REN 06h
Port P1 drive strength P1DS 08h
Port P1 selection P1SEL 0Ah
Port P1 interrupt vector word P1IV 0Eh
Port P1 interrupt edge select P1IES 18h
Port P1 interrupt enable P1IE 1Ah
Port P1 interrupt flag P1IFG 1Ch
Port P2 input P2IN 01h
Port P2 output P2OUT 03h
Port P2 direction P2DIR 05h
Port P2 pullup/pulldown enable P2REN 07h
Port P2 drive strength P2DS 09h
Port P2 selection P2SEL 0Bh
Port P2 interrupt vector word P2IV 1Eh
Port P2 interrupt edge select P2IES 19h
Port P2 interrupt enable P2IE 1Bh
Port P2 interrupt flag P2IFG 1Dh
Table 30. Port P3/P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION REGISTER OFFSET
Port P3 input P3IN 00h
Port P3 output P3OUT 02h
Port P3 direction P3DIR 04h
Port P3 pullup/pulldown enable P3REN 06h
Port P3 drive strength P3DS 08h
Port P3 selection P3SEL 0Ah
Port P4 input P4IN 01h
Port P4 output P4OUT 03h
Port P4 direction P4DIR 05h
Port P4 pullup/pulldown enable P4REN 07h
Port P4 drive strength P4DS 09h
Port P4 selection P4SEL 0Bh
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Table 31. Port P5/P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION REGISTER OFFSET
Port P5 input P5IN 00h
Port P5 output P5OUT 02h
Port P5 direction P5DIR 04h
Port P5 pullup/pulldown enable P5REN 06h
Port P5 drive strength P5DS 08h
Port P5 selection P5SEL 0Ah
Port P6 input P6IN 01h
Port P6 output P6OUT 03h
Port P6 direction P6DIR 05h
Port P6 pullup/pulldown enable P6REN 07h
Port P6 drive strength P6DS 09h
Port P6 selection P6SEL 0Bh
Table 32. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION REGISTER OFFSET
Port PJ input PJIN 00h
Port PJ output PJOUT 02h
Port PJ direction PJDIR 04h
Port PJ pullup/pulldown enable PJREN 06h
Port PJ drive strength PJDS 08h
Table 33. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION REGISTER OFFSET
TA0 control TA0CTL 00h
Capture/compare control 0 TA0CCTL0 02h
Capture/compare control 1 TA0CCTL1 04h
Capture/compare control 2 TA0CCTL2 06h
Capture/compare control 3 TA0CCTL3 08h
Capture/compare control 4 TA0CCTL4 0Ah
TA0 counter register TA0R 10h
Capture/compare register 0 TA0CCR0 12h
Capture/compare register 1 TA0CCR1 14h
Capture/compare register 2 TA0CCR2 16h
Capture/compare register 3 TA0CCR3 18h
Capture/compare register 4 TA0CCR4 1Ah
TA0 expansion register 0 TA0EX0 20h
TA0 interrupt vector TA0IV 2Eh
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Table 34. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION REGISTER OFFSET
TA1 control TA1CTL 00h
Capture/compare control 0 TA1CCTL0 02h
Capture/compare control 1 TA1CCTL1 04h
Capture/compare control 2 TA1CCTL2 06h
TA1 counter register TA1R 10h
Capture/compare register 0 TA1CCR0 12h
Capture/compare register 1 TA1CCR1 14h
Capture/compare register 2 TA1CCR2 16h
TA1 expansion register 0 TA1EX0 20h
TA1 interrupt vector TA1IV 2Eh
Table 35. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION REGISTER OFFSET
TB0 control TB0CTL 00h
Capture/compare control 0 TB0CCTL0 02h
Capture/compare control 1 TB0CCTL1 04h
Capture/compare control 2 TB0CCTL2 06h
Capture/compare control 3 TB0CCTL3 08h
Capture/compare control 4 TB0CCTL4 0Ah
Capture/compare control 5 TB0CCTL5 0Ch
Capture/compare control 6 TB0CCTL6 0Eh
TB0 register TB0R 10h
Capture/compare register 0 TB0CCR0 12h
Capture/compare register 1 TB0CCR1 14h
Capture/compare register 2 TB0CCR2 16h
Capture/compare register 3 TB0CCR3 18h
Capture/compare register 4 TB0CCR4 1Ah
Capture/compare register 5 TB0CCR5 1Ch
Capture/compare register 6 TB0CCR6 1Eh
TB0 expansion register 0 TB0EX0 20h
TB0 interrupt vector TB0IV 2Eh
Table 36. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION REGISTER OFFSET
TA2 control TA2CTL 00h
Capture/compare control 0 TA2CCTL0 02h
Capture/compare control 1 TA2CCTL1 04h
Capture/compare control 2 TA2CCTL2 06h
TA2 counter register TA2R 10h
Capture/compare register 0 TA2CCR0 12h
Capture/compare register 1 TA2CCR1 14h
Capture/compare register 2 TA2CCR2 16h
TA2 expansion register 0 TA2EX0 20h
TA2 interrupt vector TA2IV 2Eh
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Table 37. Real Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION REGISTER OFFSET
RTC control 0 RTCCTL0 00h
RTC control 1 RTCCTL1 01h
RTC control 2 RTCCTL2 02h
RTC control 3 RTCCTL3 03h
RTC prescaler 0 control RTCPS0CTL 08h
RTC prescaler 1 control RTCPS1CTL 0Ah
RTC prescaler 0 RTCPS0 0Ch
RTC prescaler 1 RTCPS1 0Dh
RTC interrupt vector word RTCIV 0Eh
RTC seconds/counter register 1 RTCSEC/RTCNT1 10h
RTC minutes/counter register 2 RTCMIN/RTCNT2 11h
RTC hours/counter register 3 RTCHOUR/RTCNT3 12h
RTC day of week/counter register 4 RTCDOW/RTCNT4 13h
RTC days RTCDAY 14h
RTC month RTCMON 15h
RTC year low RTCYEARL 16h
RTC year high RTCYEARH 17h
RTC alarm minutes RTCAMIN 18h
RTC alarm hours RTCAHOUR 19h
RTC alarm day of week RTCADOW 1Ah
RTC alarm days RTCADAY 1Bh
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Table 38. 32-bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION REGISTER OFFSET
16-bit operand 1 multiply MPY 00h
16-bit operand 1 signed multiply MPYS 02h
16-bit operand 1 multiply accumulate MAC 04h
16-bit operand 1 signed multiply accumulate MACS 06h
16-bit operand 2 OP2 08h
16 ×16 result low word RESLO 0Ah
16 ×16 result high word RESHI 0Ch
16 ×16 sum extension register SUMEXT 0Eh
32-bit operand 1 multiply low word MPY32L 10h
32-bit operand 1 multiply high word MPY32H 12h
32-bit operand 1 signed multiply low word MPYS32L 14h
32-bit operand 1 signed multiply high word MPYS32H 16h
32-bit operand 1 multiply accumulate low word MAC32L 18h
32-bit operand 1 multiply accumulate high word MAC32H 1Ah
32-bit operand 1 signed multiply accumulate low word MACS32L 1Ch
32-bit operand 1 signed multiply accumulate high word MACS32H 1Eh
32-bit operand 2 low word OP2L 20h
32-bit operand 2 high word OP2H 22h
32 ×32 result 0 least significant word RES0 24h
32 ×32 result 1 RES1 26h
32 ×32 result 2 RES2 28h
32 ×32 result 3 most significant word RES3 2Ah
MPY32 control register 0 MPY32CTL0 2Ch
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Table 39. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h)
REGISTER DESCRIPTION REGISTER OFFSET
DMA channel 0 control DMA0CTL 00h
DMA channel 0 source address low DMA0SAL 02h
DMA channel 0 source address high DMA0SAH 04h
DMA channel 0 destination address low DMA0DAL 06h
DMA channel 0 destination address high DMA0DAH 08h
DMA channel 0 transfer size DMA0SZ 0Ah
DMA channel 1 control DMA1CTL 00h
DMA channel 1 source address low DMA1SAL 02h
DMA channel 1 source address high DMA1SAH 04h
DMA channel 1 destination address low DMA1DAL 06h
DMA channel 1 destination address high DMA1DAH 08h
DMA channel 1 transfer size DMA1SZ 0Ah
DMA channel 2 control DMA2CTL 00h
DMA channel 2 source address low DMA2SAL 02h
DMA channel 2 source address high DMA2SAH 04h
DMA channel 2 destination address low DMA2DAL 06h
DMA channel 2 destination address high DMA2DAH 08h
DMA channel 2 transfer size DMA2SZ 0Ah
DMA module control 0 DMACTL0 00h
DMA module control 1 DMACTL1 02h
DMA module control 2 DMACTL2 04h
DMA module control 3 DMACTL3 06h
DMA module control 4 DMACTL4 08h
DMA interrupt vector DMAIV 0Ah
Table 40. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION REGISTER OFFSET
USCI control 0 UCA0CTL1 00h
USCI control 1 UCA0CTL0 01h
USCI baud rate 0 UCA0BR0 06h
USCI baud rate 1 UCA0BR1 07h
USCI modulation control UCA0MCTL 08h
USCI status UCA0STAT 0Ah
USCI receive buffer UCA0RXBUF 0Ch
USCI transmit buffer UCA0TXBUF 0Eh
USCI LIN control UCA0ABCTL 10h
USCI IrDA transmit control UCA0IRTCTL 12h
USCI IrDA receive control UCA0IRRCTL 13h
USCI interrupt enable UCA0IE 1Ch
USCI interrupt flags UCA0IFG 1Dh
USCI interrupt vector word UCA0IV 1Eh
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Table 41. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION REGISTER OFFSET
USCI synchronous control 1 UCB0CTL1 00h
USCI synchronous control 0 UCB0CTL0 01h
USCI synchronous bit rate 0 UCB0BR0 06h
USCI synchronous bit rate 1 UCB0BR1 07h
USCI synchronous status UCB0STAT 0Ah
USCI synchronous receive buffer UCB0RXBUF 0Ch
USCI synchronous transmit buffer UCB0TXBUF 0Eh
USCI I2C own address UCB0I2COA 10h
USCI I2C slave address UCB0I2CSA 12h
USCI interrupt enable UCB0IE 1Ch
USCI interrupt flags UCB0IFG 1Dh
USCI interrupt vector word UCB0IV 1Eh
Table 42. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION REGISTER OFFSET
USCI control 0 UCA1CTL1 00h
USCI control 1 UCA1CTL0 01h
USCI baud rate 0 UCA1BR0 06h
USCI baud rate 1 UCA1BR1 07h
USCI modulation control UCA1MCTL 08h
USCI status UCA1STAT 0Ah
USCI receive buffer UCA1RXBUF 0Ch
USCI transmit buffer UCA1TXBUF 0Eh
USCI LIN control UCA1ABCTL 10h
USCI IrDA transmit control UCA1IRTCTL 12h
USCI IrDA receive control UCA1IRRCTL 13h
USCI interrupt enable UCA1IE 1Ch
USCI interrupt flags UCA1IFG 1Dh
USCI interrupt vector word UCA1IV 1Eh
Table 43. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION REGISTER OFFSET
USCI synchronous control 0 UCB1CTL1 00h
USCI synchronous control 1 UCB1CTL0 01h
USCI synchronous bit rate 0 UCB1BR0 06h
USCI synchronous bit rate 1 UCB1BR1 07h
USCI synchronous status UCB1STAT 0Ah
USCI synchronous receive buffer UCB1RXBUF 0Ch
USCI synchronous transmit buffer UCB1TXBUF 0Eh
USCI I2C own address UCB1I2COA 10h
USCI I2C slave address UCB1I2CSA 12h
USCI interrupt enable UCB1IE 1Ch
USCI interrupt flags UCB1IFG 1Dh
USCI interrupt vector word UCB1IV 1Eh
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Table 44. ADC10_A Registers (Base Address: 0740h)
REGISTER DESCRIPTION REGISTER OFFSET
ADC10_A Control register 0 ADC10CTL0 00h
ADC10_A Control register 1 ADC10CTL1 02h
ADC10_A Control register 2 ADC10CTL2 04h
ADC10_A Window Comparator Low Threshold ADC10LO 06h
ADC10_A Window Comparator High Threshold ADC10HI 08h
ADC10_A Memory Control Register 0 ADC10MCTL0 0Ah
ADC10_A Conversion Memory Register ADC10MEM0 12h
ADC10_A Interrupt Enable ADC10IE 1Ah
ADC10_A Interrupt Flags ADC10IGH 1Ch
ADC10_A Interrupt Vector Word ADC10IV 1Eh
Table 45. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION REGISTER OFFSET
Comp_B control register 0 CBCTL0 00h
Comp_B control register 1 CBCTL1 02h
Comp_B control register 2 CBCTL2 04h
Comp_B control register 3 CBCTL3 06h
Comp_B interrupt register CBINT 0Ch
Comp_B interrupt vector word CBIV 0Eh
Table 46. USB Configuration Registers (Base Address: 0900h)
REGISTER DESCRIPTION REGISTER OFFSET
USB key/ID USBKEYID 00h
USB module configuration USBCNF 02h
USB PHY control USBPHYCTL 04h
USB power control USBPWRCTL 08h
USB PLL control USBPLLCTL 10h
USB PLL divider USBPLLDIV 12h
USB PLL interrupts USBPLLIR 14h
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Table 47. USB Control Registers (Base Address: 0920h)
REGISTER DESCRIPTION REGISTER OFFSET
Input endpoint#0 configuration IEPCNF_0 00h
Input endpoint #0 byte count IEPCNT_0 01h
Output endpoint#0 configuration OEPCNF_0 02h
Output endpoint #0 byte count OEPCNT_0 03h
Input endpoint interrupt enables IEPIE 0Eh
Output endpoint interrupt enables OEPIE 0Fh
Input endpoint interrupt flags IEPIFG 10h
Output endpoint interrupt flags OEPIFG 11h
USB interrupt vector USBIV 12h
USB maintenance MAINT 16h
Time stamp TSREG 18h
USB frame number USBFN 1Ah
USB control USBCTL 1Ch
USB interrupt enables USBIE 1Dh
USB interrupt flags USBIFG 1Eh
Function address FUNADR 1Fh
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Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS 0.3 V to 4.1 V
Voltage applied to any pin (excluding VCORE, VBUS, V18)(2) 0.3 V to VCC + 0.3 V
Diode current at any device pin ±2 mA
Storage temperature range, Tstg (3) 55°C to 150°C
Maximum junction temperature, TJ95°C
(1) Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions"is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to VSS. VCORE is for internal device use only. No external DC loading or voltage should be applied.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics(1)
PARAMETER VALUE UNIT
VQFN (RGC) 30
VQFN (RGZ) 28.6
θJA Junction-to-ambient thermal resistance, still air(2) °C/W
LQFP (PT) 62.8
BGA (ZQE) 55.5
VQFN (RGC) 15.6
VQFN (RGZ) 14.4
θJC(TOP) Junction-to-case (top) thermal resistance(3) °C/W
LQFP (PT) 18.2
BGA (ZQE) 21.2
VQFN(RGC) 1.6
VQFN (RGZ) 1.6
θJC(BOTTOM) Junction-to-case (bottom) thermal resistance(4) °C/W
LQFP (PT) N/A
BGA (ZQE) N/A
VQFN (RGC) 8.9
VQFN (RGZ) 5.5
θJB Junction-to-board thermal resistance(5) °C/W
LQFP (PT) 28.3
BGA (ZQE) 19.3
(1) N/A = not applicable
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard
test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
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Recommended Operating Conditions MIN NOM MAX UNIT
PMMCOREVx = 0 1.8 3.6 V
PMMCOREVx = 0, 1 2.0 3.6 V
Supply voltage during program execution and flash
VCC programming(AVCC = DVCC1/2 = DVCC)(1) PMMCOREVx = 0, 1, 2 2.2 3.6 V
PMMCOREVx = 0, 1, 2, 3 2.4 3.6 V
PMMCOREVx = 0 1.8 3.6 V
PMMCOREVx = 0, 1 2.0 3.6 V
Supply voltage during USB operation, USB PLL disabled
USB_EN = 1, UPLLEN = 0 PMMCOREVx = 0, 1, 2 2.2 3.6 V
VCC,USB PMMCOREVx = 0, 1, 2, 3 2.4 3.6 V
PMMCOREVx = 2 2.2 3.6 V
Supply voltage during USB operation, USB PLL enabled(2)
USB_EN = 1, UPLLEN = 1 PMMCOREVx = 2, 3 2.4 3.6 V
VSS Supply voltage (AVSS = DVSS1/2 = DVSS) 0 V
TAOperating free-air temperature I version 40 85 °C
TJOperating junction temperature I version -40 85 °C
CVCORE Capacitor at VCORE 470 nF
CDVCC/Capacitor ratio of DVCC to VCORE 10
CVCORE PMMCOREVx = 0,
1.8 V VCC 3.6 V 0 8.0
(default condition)
PMMCOREVx = 1, 0 12.0
Processor frequency (maximum MCLK frequency)(3) 2.0 V VCC 3.6 V
fSYSTEM MHz
(see Figure 1)PMMCOREVx = 2, 0 20.0
2.2 V VCC 3.6 V
PMMCOREVx = 3, 0 25.0
2.4 V VCC 3.6 V
fSYSTEM_USB Minimum processor frequency for USB operation 1.5 MHz
USB_wait Wait state cycles during USB operation 16 cycles
(1) It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
(2) USB operation with USB PLL enabled requires PMMCOREVx 2 for proper operation.
(3) Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
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Figure 1. Maximum System Frequency
Electrical Characteristics
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted)(1) (2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
EXECUTION
PARAMETER VCC PMMCOREVx 1 MHz 8 MHz 12 MHz 20 MHz 25 MHz UNIT
MEMORY TYP MAX TYP MAX TYP MAX TYP MAX TYP MAX
0 0.25 0.27 1.55 1.68
1 0.28 1.74 2.58 2.78
IAM, Flash Flash 3 V mA
2 0.30 1.91 2.84 4.68 5.06
3 0.32 2.09 3.10 5.13 6.0 6.5
0 0.17 0.19 0.91 1.00
1 0.19 1.03 1.54 1.67
IAM, RAM RAM 3 V mA
2 0.20 1.16 1.73 2.84 3.11
3 0.21 1.24 1.87 3.1 3.9 4.3
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3) Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0).
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0.
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Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
-40°C 25°C 60°C 85°C
PARAMETER VCC PMMCOREVx UNIT
TYP MAX TYP MAX TYP MAX TYP MAX
2.2 V 0 73 77 85 80 85 97
ILPM0,1MHz Low-power mode 0(3)(4) µA
3 V 3 79 83 92 88 95 105
2.2 V 0 6.5 6.5 8 7.5 8 11
ILPM2 Low-power mode 2(5)(4) µA
3 V 3 7.0 7.0 9 7.9 8.9 13
0 1.60 1.90 2.6 3.4
2.2 V 1 1.65 2.00 2.7 3.6
2 1.75 2.15 2.9 3.8
Low-power mode 3,
ILPM3,XT1LF 0 1.8 2.1 2.6 2.8 3.6 6.0 µA
crystal mode(6)(4) 1 1.9 2.3 2.9 3.8
3 V 2 2.0 2.4 3.0 4.0
3 2.0 2.5 3.0 3.1 4.0 6.5
0 1.1 1.3 1.8 1.9 2.7 5.0
1 1.1 1.4 2.0 2.8
Low-power mode 3,
ILPM3,VLO 3 V µA
VLO mode(7)(4) 2 1.2 1.5 2.1 2.9
3 1.3 1.5 2.0 2.2 3.0 5.5
0 0.9 1.1 1.5 1.8 2.5 4.8
1 1.1 1.2 2.0 2.6
ILPM4 Low-power mode 4(8)(4) 3 V µA
2 1.2 1.2 2.1 2.7
3 1.3 1.3 1.6 2.2 2.8 5.0
ILPM4.5 Low-power mode 4.5(9) 3 V 0.15 0.18 0.35 0.26 0.45 0.80 µA
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3) Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(4) Current for brownout, high side supervisor (SVSH) normal mode included. Low side supervisor and monitors disabled (SVSL, SVML).
High side monitor disabled (SVMH). RAM retention enabled.
(5) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting
= 1 MHz operation, DCO bias generator enabled.
USB disabled (VUSBEN = 0, SLDOEN = 0)
(6) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(7) Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(8) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(9) Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
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Schmitt-Trigger Inputs General Purpose I/O(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
1.8 V 0.80 1.40
VIT+ Positive-going input threshold voltage V
3 V 1.50 2.10
1.8 V 0.45 1.00
VITNegative-going input threshold voltage V
3 V 0.75 1.65
1.8 V 0.3 0.85
Vhys Input voltage hysteresis (VIT+ VIT) V
3 V 0.4 1.0
For pullup: VIN = VSS
RPull Pullup/pulldown resistor 20 35 50 k
For pulldown: VIN = VCC
CIInput capacitance VIN = VSS or VCC 5 pF
(1) Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
Inputs Ports P1 and P2(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN MAX UNIT
Port P1, P2: P1.x to P2.x, External trigger pulse width to
t(int) External interrupt timing(2) 2.2 V/3 V 20 ns
set interrupt flag
(1) Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
(2) An external signal sets the interrupt flag every time the minimum interrupt pulse width t(int) is met. It may be set by trigger signals shorter
than t(int).
Leakage Current General Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN MAX UNIT
Ilkg(Px.x) High-impedance leakage current (1) (2) 1.8 V/3 V ±50 nA
(1) The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
(2) The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is
disabled.
Outputs General Purpose I/O (Full Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN MAX UNIT
I(OHmax) =3 mA(1) VCC 0.25 VCC
1.8 V
I(OHmax) =10 mA(2) VCC 0.60 VCC
VOH High-level output voltage V
I(OHmax) =5 mA(1) VCC 0.25 VCC
3 V
I(OHmax) =15 mA(2) VCC 0.60 VCC
I(OLmax) = 3 mA(1) VSS VSS + 0.25
1.8 V
I(OLmax) = 10 mA(2) VSS VSS + 0.60
VOL Low-level output voltage V
I(OLmax) = 5 mA(1) VSS VSS + 0.25
3 V
I(OLmax) = 15 mA(2) VSS VSS + 0.60
(1) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
(2) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
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MSP430F550x, MSP430F5510
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Outputs General Purpose I/O (Reduced Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS VCC MIN MAX UNIT
I(OHmax) =1 mA(2) VCC 0.25 VCC
1.8 V
I(OHmax) =3 mA(3) VCC 0.60 VCC
VOH High-level output voltage V
I(OHmax) =2 mA(2) VCC 0.25 VCC
3 V
I(OHmax) =6 mA(3) VCC 0.60 VCC
I(OLmax) = 1 mA(2) VSS VSS + 0.25
1.8 V
I(OLmax) = 3 mA(3) VSS VSS + 0.60
VOL Low-level output voltage V
I(OLmax) = 2 mA(2) VSS VSS + 0.25
3 V
I(OLmax) = 6 mA(3) VSS VSS + 0.60
(1) Selecting reduced drive strength may reduce EMI.
(2) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
(3) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
Output Frequency General Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN MAX UNIT
(1)(2)VCC = 1.8 V 16
PMMCOREVx = 0
Port output frequency
fPx.y MHz
(with load) VCC = 3 V 25
PMMCOREVx = 3
VCC = 1.8 V
ACLK 16
PMMCOREVx = 0
SMCLK
fPort_CLK Clock output frequency MHz
MCLK VCC = 3 V 25
CL= 20 pF(2) PMMCOREVx = 3
(1) A resistive divider with 2 ×R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 . For reduced drive strength, R1 = 1.6 k. CL= 20 pF is connected to the output to VSS.
(2) The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
50 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
0.0 0.5 1.0 1.5 2.0
T = 25°C
A
T = 85°C
A
V = 1.8 V
Px.y
CC
V – Low-Level Output Voltage – V
OL
I Typical Low-Level Output Current – mA
OL
0.0
5.0
10.0
15.0
20.0
25.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
T = 25°C
A
T = 85°C
A
V = 3.0 V
Px.y
CC
V – Low-Level Output Voltage – V
OL
I Typical Low-Level Output Current – mA
OL
-8.0
-7.0
-6.0
-5.0
-4.0
-3.0
-2.0
-1.0
0.0
0.0 0.5 1.0 1.5 2.0
T = 25°C
A
T = 85°C
A
V = 1.8 V
Px.y
CC
V – High-Level Output Voltage – V
OH
I Typical High-Level Output Current – mA
OH
-25.0
-20.0
-15.0
-10.0
-5.0
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
T = 25°C
A
T = 85°C
A
V = 3.0 V
Px.y
CC
V – High-Level Output Voltage – V
OH
I Typical High-Level Output Current – mA
OH
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Typical Characteristics Outputs, Reduced Drive Strength (PxDS.y = 0)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYPICAL LOW-LEVEL OUTPUT CURRENT TYPICAL LOW-LEVEL OUTPUT CURRENT
vs vs
LOW-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE
Figure 2. Figure 3.
TYPICAL HIGH-LEVEL OUTPUT CURRENT TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs vs
HIGH-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE
Figure 4. Figure 5.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 51
0
4
8
12
16
20
24
0.0 0.5 1.0 1.5 2.0
T = 25°C
A
T = 85°C
A
V = 1.8 V
Px.y
CC
V – Low-Level Output Voltage – V
OL
I Typical Low-Level Output Current – mA
OL
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
55.0
60.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
T = 25°C
A
T = 85°C
A
V = 3.0 V
Px.y
CC
V – Low-Level Output Voltage – V
OL
I Typical Low-Level Output Current – mA
OL
-60.0
-55.0
-50.0
-45.0
-40.0
-35.0
-30.0
-25.0
-20.0
-15.0
-10.0
-5.0
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
T = 25°C
A
T = 85°C
A
V = 3.0 V
Px.y
CC
V – High-Level Output Voltage – V
OH
I Typical High-Level Output Current – mA
OH
-20
-16
-12
-8
-4
0
0.0 0.5 1.0 1.5 2.0
T = 25°C
A
T = 85°C
A
V = 1.8 V
Px.y
CC
V – High-Level Output Voltage – V
OH
I Typical High-Level Output Current – mA
OH
MSP430F550x, MSP430F5510
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Typical Characteristics Outputs, Full Drive Strength (PxDS.y = 1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYPICAL LOW-LEVEL OUTPUT CURRENT TYPICAL LOW-LEVEL OUTPUT CURRENT
vs vs
LOW-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE
Figure 6. Figure 7.
TYPICAL HIGH-LEVEL OUTPUT CURRENT TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs vs
HIGH-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE
Figure 8. Figure 9.
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SLAS645F JULY 2009REVISED MARCH 2011
Crystal Oscillator, XT1, Low-Frequency Mode(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1, 0.075
TA= 25°C
Differential XT1 oscillator crystal fOSC = 32768 Hz, XTS = 0,
ΔIDVCC.LF current consumption from lowest XT1BYPASS = 0, XT1DRIVEx = 2, 3 V 0.170 µA
drive setting, LF mode TA= 25°C
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3, 0.290
TA= 25°C
XT1 oscillator crystal frequency,
fXT1,LF0 XTS = 0, XT1BYPASS = 0 32768 Hz
LF mode
XT1 oscillator logic-level
fXT1,LF,SW square-wave input frequency, XTS = 0, XT1BYPASS = 1(2) (3) 10 32.768 50 kHz
LF mode XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0, 210
fXT1,LF = 32768 Hz, CL,eff = 6 pF
Oscillation allowance for
OALF k
LF crystals(4) XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1, 300
fXT1,LF = 32768 Hz, CL,eff = 12 pF
XTS = 0, XCAPx = 0(6) 2
XTS = 0, XCAPx = 1 5.5
Integrated effective load
CL,eff pF
capacitance, LF mode(5) XTS = 0, XCAPx = 2 8.5
XTS = 0, XCAPx = 3 12.0
XTS = 0, Measured at ACLK,
Duty cycle LF mode 30 70 %
fXT1,LF = 32768 Hz
Oscillator fault frequency,
fFault,LF XTS = 0(8) 10 10000 Hz
LF mode(7)
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0, 1000
TA= 25°C,
CL,eff = 6 pF
tSTART,LF Startup time, LF mode 3 V ms
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3, 500
TA= 25°C,
CL,eff = 12 pF
(1) To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(2) When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this datasheet.
(3) Maximum frequency of operation of the entire device cannot be exceeded.
(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
(a) For XT1DRIVEx = 0, CL,ef f 6 pF.
(b) For XT1DRIVEx = 1, 6 pF CL,ef f 9 pF.
(c) For XT1DRIVEx = 2, 6 pF CL,ef f 10 pF.
(d) For XT1DRIVEx = 3, CL,ef f 6 pF.
(5) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(6) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8) Measured with logic-level input frequency but also applies to operation with crystals.
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Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
fOSC = 4 MHz, XT2OFF = 0, 200
XT2BYPASS = 0, XT2DRIVEx = 0, TA= 25°C
fOSC = 12 MHz, XT2OFF = 0, 260
XT2BYPASS = 0, XT2DRIVEx = 1, TA= 25°C
XT2 oscillator crystal current
IDVCC.XT2 3 V µA
consumption fOSC = 20 MHz, XT2OFF = 0, 325
XT2BYPASS = 0, XT2DRIVEx = 2, TA= 25°C
fOSC = 32 MHz, XT2OFF = 0, 450
XT2BYPASS = 0, XT2DRIVEx = 3, TA= 25°C
XT2 oscillator crystal
fXT2,HF0 XT2DRIVEx = 0, XT2BYPASS = 0(3) 4 8 MHz
frequency, mode 0
XT2 oscillator crystal
fXT2,HF1 XT2DRIVEx = 1, XT2BYPASS = 0(3) 8 16 MHz
frequency, mode 1
XT2 oscillator crystal
fXT2,HF2 XT2DRIVEx = 2, XT2BYPASS = 0(3) 16 24 MHz
frequency, mode 2
XT2 oscillator crystal
fXT2,HF3 XT2DRIVEx = 3, XT2BYPASS = 0(3) 24 32 MHz
frequency, mode 3
XT2 oscillator logic-level
fXT2,HF,SW square-wave input frequency, XT2BYPASS = 1(4) (3) 0.7 32 MHz
bypass mode XT2DRIVEx = 0, XT2BYPASS = 0, 450
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
XT2DRIVEx = 1, XT2BYPASS = 0, 320
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
Oscillation allowance for
OAHF
HF crystals(5) XT2DRIVEx = 2, XT2BYPASS = 0, 200
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
XT2DRIVEx = 3, XT2BYPASS = 0, 200
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
fOSC = 6 MHz,
XT2BYPASS = 0, XT2DRIVEx = 0, 0.5
TA= 25°C, CL,eff = 15 pF
tSTART,HF Startup time 3 V ms
fOSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 2, 0.3
TA= 25°C, CL,eff = 15 pF
Integrated effective load
CL,eff 1 pF
capacitance, HF mode(6) (1)
Duty cycle Measured at ACLK, fXT2,HF2 = 20 MHz 40 50 60 %
fFault,HF Oscillator fault frequency(7) XT2BYPASS = 1(8) 30 300 kHz
(1) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(2) To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(3) This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
(4) When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this datasheet.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8) Measured with logic-level input frequency but also applies to operation with crystals.
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Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
fVLO VLO frequency Measured at ACLK 1.8 V to 3.6 V 6 9.4 14 kHz
dfVLO/dTVLO frequency temperature drift Measured at ACLK(1) 1.8 V to 3.6 V 0.5 %/°C
dfVLO/dVCC VLO frequency supply voltage drift Measured at ACLK(2) 1.8 V to 3.6 V 4 %/V
Duty cycle Measured at ACLK 1.8 V to 3.6 V 40 50 60 %
(1) Calculated using the box method: (MAX(-40 to 85°C) MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C(40°C))
(2) Calculated using the box method: (MAX(1.8 to 3.6 V) MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V 1.8 V)
Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
IREFO REFO oscillator current consumption TA= 25°C 1.8 V to 3.6 V 3 µA
REFO frequency calibrated Measured at ACLK 1.8 V to 3.6 V 32768 Hz
fREFO Full temperature range 1.8 V to 3.6 V ±3.5 %
REFO absolute tolerance calibrated TA= 25°C 3 V ±1.5 %
dfREFO/dTREFO frequency temperature drift Measured at ACLK(1) 1.8 V to 3.6 V 0.01 %/°C
dfREFO/dVCC REFO frequency supply voltage drift Measured at ACLK(2) 1.8 V to 3.6 V 1.0 %/V
Duty cycle Measured at ACLK 1.8 V to 3.6 V 40 50 60 %
tSTART REFO startup time 40%/60% duty cycle 1.8 V to 3.6 V 25 µs
(1) Calculated using the box method: (MAX(-40 to 85°C) MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C(40°C))
(2) Calculated using the box method: (MAX(1.8 to 3.6 V) MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V 1.8 V)
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01 2 34567
Typical DCO Frequency, V = 3.0 V, T = 25°C
CC A
DCORSEL
100
10
1
0.1
f – MHz
DCO
DCOx = 31
DCOx = 0
MSP430F550x, MSP430F5510
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DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fDCO(0,0) DCO frequency (0, 0) DCORSELx = 0, DCOx = 0, MODx = 0 0.07 0.20 MHz
fDCO(0,31) DCO frequency (0, 31) DCORSELx = 0, DCOx = 31, MODx = 0 0.70 1.70 MHz
fDCO(1,0) DCO frequency (1, 0) DCORSELx = 1, DCOx = 0, MODx = 0 0.15 0.36 MHz
fDCO(1,31) DCO frequency (1, 31) DCORSELx = 1, DCOx = 31, MODx = 0 1.47 3.45 MHz
fDCO(2,0) DCO frequency (2, 0) DCORSELx = 2, DCOx = 0, MODx = 0 0.32 0.75 MHz
fDCO(2,31) DCO frequency (2, 31) DCORSELx = 2, DCOx = 31, MODx = 0 3.17 7.38 MHz
fDCO(3,0) DCO frequency (3, 0) DCORSELx = 3, DCOx = 0, MODx = 0 0.64 1.51 MHz
fDCO(3,31) DCO frequency (3, 31) DCORSELx = 3, DCOx = 31, MODx = 0 6.07 14.0 MHz
fDCO(4,0) DCO frequency (4, 0) DCORSELx = 4, DCOx = 0, MODx = 0 1.3 3.2 MHz
fDCO(4,31) DCO frequency (4, 31) DCORSELx = 4, DCOx = 31, MODx = 0 12.3 28.2 MHz
fDCO(5,0) DCO frequency (5, 0) DCORSELx = 5, DCOx = 0, MODx = 0 2.5 6.0 MHz
fDCO(5,31) DCO frequency (5, 31) DCORSELx = 5, DCOx = 31, MODx = 0 23.7 54.1 MHz
fDCO(6,0) DCO frequency (6, 0) DCORSELx = 6, DCOx = 0, MODx = 0 4.6 10.7 MHz
fDCO(6,31) DCO frequency (6, 31) DCORSELx = 6, DCOx = 31, MODx = 0 39.0 88.0 MHz
fDCO(7,0) DCO frequency (7, 0) DCORSELx = 7, DCOx = 0, MODx = 0 8.5 19.6 MHz
fDCO(7,31) DCO frequency (7, 31) DCORSELx = 7, DCOx = 31, MODx = 0 60 135 MHz
Frequency step between range
SDCORSEL SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO) 1.2 2.3 ratio
DCORSEL and DCORSEL + 1
Frequency step between tap
SDCO SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO) 1.02 1.12 ratio
DCO and DCO + 1
Duty cycle Measured at SMCLK 40 50 60 %
DCO frequency temperature
dfDCO/dT fDCO = 1 MHz, 0.1 %/°C
drift(1)
dfDCO/dVCC DCO frequency voltage drift(2) fDCO = 1 MHz 1.9 %/V
(1) Calculated using the box method: (MAX(-40 to 85°C) MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C(40°C))
(2) Calculated using the box method: (MAX(1.8 to 3.6 V) MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V 1.8 V)
Figure 10. Typical DCO frequency
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PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BORHon voltage,
V(DVCC_BOR_IT) | dDVCC/dt|<3 V/s 1.45 V
DVCC falling level
BORHoff voltage,
V(DVCC_BOR_IT+) | dDVCC/dt|<3 V/s 0.80 1.30 1.50 V
DVCC rising level
V(DVCC_BOR_hys) BORHhysteresis 60 250 mV
Pulse length required at
tRESET RST/NMI pin to accept a 2 µs
reset
PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Core voltage, active mode,
VCORE3(AM) 2.4 V DVCC 3.6 V 1.90 V
PMMCOREV = 3
Core voltage, active mode,
VCORE2(AM) 2.2 V DVCC 3.6 V 1.80 V
PMMCOREV = 2
Core voltage, active mode,
VCORE1(AM) 2.0 V DVCC 3.6 V 1.60 V
PMMCOREV = 1
Core voltage, active mode,
VCORE0(AM) 1.8 V DVCC 3.6 V 1.40 V
PMMCOREV = 0
Core voltage, low-current mode,
VCORE3(LPM) 2.4 V DVCC 3.6 V 1.94 V
PMMCOREV = 3
Core voltage, low-current mode,
VCORE2(LPM) 2.2 V DVCC 3.6 V 1.84 V
PMMCOREV = 2
Core voltage, low-current mode,
VCORE1(LPM) 2.0 V DVCC 3.6 V 1.64 V
PMMCOREV = 1
Core voltage, low-current mode,
VCORE0(LPM) 1.8 V DVCC 3.6 V 1.44 V
PMMCOREV = 0
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PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SVSHE = 0, DVCC = 3.6 V 0 nA
I(SVSH) SVS current consumption SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0 200 nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1 1.5 µA
SVSHE = 1, SVSHRVL = 0 1.57 1.68 1.78
SVSHE = 1, SVSHRVL = 1 1.79 1.88 1.98
V(SVSH_IT)SVSHon voltage level(1) V
SVSHE = 1, SVSHRVL = 2 1.98 2.08 2.21
SVSHE = 1, SVSHRVL = 3 2.10 2.18 2.31
SVSHE = 1, SVSMHRRL = 0 1.62 1.74 1.85
SVSHE = 1, SVSMHRRL = 1 1.88 1.94 2.07
SVSHE = 1, SVSMHRRL = 2 2.07 2.14 2.28
SVSHE = 1, SVSMHRRL = 3 2.20 2.30 2.42
V(SVSH_IT+) SVSHoff voltage level(1) V
SVSHE = 1, SVSMHRRL = 4 2.32 2.40 2.55
SVSHE = 1, SVSMHRRL = 5 2.52 2.70 2.88
SVSHE = 1, SVSMHRRL = 6 2.90 3.10 3.23
SVSHE = 1, SVSMHRRL = 7 2.90 3.10 3.23
SVSHE = 1, dVDVCC/dt = 10 mV/µs, 2.5
SVSHFP = 1
tpd(SVSH) SVSHpropagation delay µs
SVSHE = 1, dVDVCC/dt = 1 mV/µs, 20
SVSHFP = 0
SVSHE = 0 112.5
SVSHFP = 1
t(SVSH) SVSHon/off delay time µs
SVSHE = 0 1100
SVSHFP = 0
dVDVCC/dt DVCC rise time 0 1000 V/s
(1) The SVSHsettings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use
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PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SVMHE = 0, DVCC = 3.6 V 0 nA
I(SVMH) SVMHcurrent consumption SVMHE = 1, DVCC = 3.6 V, SVMHFP = 0 200 nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1 1.5 µA
SVMHE = 1, SVSMHRRL = 0 1.62 1.74 1.85
SVMHE = 1, SVSMHRRL = 1 1.88 1.94 2.07
SVMHE = 1, SVSMHRRL = 2 2.07 2.14 2.28
SVMHE = 1, SVSMHRRL = 3 2.20 2.30 2.42
V(SVMH) SVMHon/off voltage level(1) SVMHE = 1, SVSMHRRL = 4 2.32 2.40 2.55 V
SVMHE = 1, SVSMHRRL = 5 2.52 2.70 2.88
SVMHE = 1, SVSMHRRL = 6 2.90 3.10 3.23
SVMHE = 1, SVSMHRRL = 7 2.90 3.10 3.23
SVMHE = 1, SVMHOVPE = 1 3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs, 2.5
SVMHFP = 1
tpd(SVMH) SVMHpropagation delay µs
SVMHE = 1, dVDVCC/dt = 1 mV/µs, 20
SVMHFP = 0
SVMHE = 0 112.5
SVMHFP = 1
t(SVMH) SVMHon/off delay time µs
SVMHE = 0 1100
SVMHFP = 0
(1) The SVMHsettings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use
PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SVSLE = 0, PMMCOREV = 2 0 nA
I(SVSL) SVSLcurrent consumption SVSLE = 1, PMMCOREV = 2, SVSLFP = 0 200 nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1 2.0 µA
SVSLE = 1, dVCORE/dt = 10 mV/µs, 2.5
SVSLFP = 1
tpd(SVSL) SVSLpropagation delay µs
SVSLE = 1, dVCORE/dt = 1 mV/µs, 20
SVSLFP = 0
SVSLE = 0 112.5
SVSLFP = 1
t(SVSL) SVSLon/off delay time µs
SVSLE = 0 1100
SVSLFP = 0
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PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SVMLE = 0, PMMCOREV = 2 0 nA
I(SVML) SVMLcurrent consumption SVMLE = 1, PMMCOREV = 2, SVMLFP = 0 200 nA
SVMLE = 1, PMMCOREV = 2, SVMLFP = 1 1.5 µA
SVMLE = 1, dVCORE/dt = 10 mV/µs, SVMLFP = 1 2.5
tpd(SVML) SVMLpropagation delay µs
SVMLE = 1, dVCORE/dt = 1 mV/µs, SVMLFP = 0 20
SVMLE = 0 1, SVMLFP = 1 12.5
t(SVML) SVMLon/off delay time µs
SVMLE = 0 1, SVMLFP = 0 100
Wake-Up From Low Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PMMCOREV = SVSMLRRL = n, fMCLK 4.0 MHz 5
tWAKE-UP- Wake-up time from LPM2, LPM3, or where n = 0, 1, 2, or 3, µs
FAST LPM4 to active mode(1) fMCLK <4.0 MHz 6
SVSLFP = 1
PMMCOREV = SVSMLRRL = n,
tWAKE-UP- Wake-up time from LPM2, LPM3 or where n = 0, 1, 2, or 3, 150 165 µs
SLOW LPM4 to active mode(2) SVSLFP = 0
tWAKE-UP- Wake-up time from LPM4.5 to active 2 3 ms
LPM5 mode(3)
tWAKE-UP- Wake-up time from RST or BOR event to 2 3 ms
RESET active mode(3)
(1) This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVMLin full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVMLwhile
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx
Family User's Guide (SLAU208).
(2) This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVMLare in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVMLwhile operating in LPM2, LPM3, and
LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide
(SLAU208).
(3) This value represents the time from the wakeup event to the reset vector execution.
Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
Internal: SMCLK, ACLK
fTA Timer_A input clock frequency External: TACLK 1.8 V/ 3 V 25 MHz
Duty cycle = 50% ±10%
All capture inputs.
tTA,cap Timer_A capture timing Minimum pulse width required for 1.8 V/ 3 V 20 ns
capture.
Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
Internal: SMCLK, ACLK
fTB Timer_B input clock frequency External: TBCLK 1.8 V/ 3 V 25 MHz
Duty cycle = 50% ±10%
All capture inputs.
tTB,cap Timer_B capture timing Minimum pulse width required for 1.8 V/ 3 V 20 ns
capture.
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USCI (UART Mode) Recommended Operating Conditions
PARAMETER CONDITIONS VCC MIN TYP MAX UNIT
Internal: SMCLK, ACLK
fUSCI USCI input clock frequency External: UCLK fSYSTEM MHz
Duty cycle = 50% ±10%
BITCLK clock frequency
fBITCLK 1 MHz
(equals baud rate in MBaud)
USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
2.2 V 50 600
tτUART receive deglitch time(1) ns
3 V 50 600
(1) Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized their width should exceed the maximum specification of the deglitch time.
USCI (SPI Master Mode) Recommended Operating Conditions
PARAMETER CONDITIONS VCC MIN TYP MAX UNIT
Internal: SMCLK, ACLK
fUSCI USCI input clock frequency fSYSTEM MHz
Duty cycle = 50% ±10%
USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1),Figure 11 and Figure 12)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
SMCLK, ACLK
fUSCI USCI input clock frequency fSYSTEM MHz
Duty cycle = 50% ±10% 1.8 V 55
PMMCOREV = 0 ns
3 V 38
tSU,MI SOMI input data setup time 2.4 V 30
PMMCOREV = 3 ns
3 V 25
1.8 V 0
PMMCOREV = 0 ns
3 V 0
tHD,MI SOMI input data hold time 2.4 V 0
PMMCOREV = 3 ns
3 V 0
1.8 V 20
UCLK edge to SIMO valid, ns
CL= 20 pF, PMMCOREV = 0 3 V 18
tVALID,MO SIMO output data valid time(2) 2.4 V 16
UCLK edge to SIMO valid, ns
CL= 20 pF, PMMCOREV = 3 3 V 15
1.8 V -10
CL= 20 pF, PMMCOREV = 0 ns
3 V -8
tHD,MO SIMO output data hold time(3) 2.4 V -10
CL= 20 pF, PMMCOREV = 3 ns
3 V -8
(1) fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave) see the SPI parameters of the attached slave.
(2) Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 11 and Figure 12.
(3) Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in
Figure 11 and Figure 12.
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tSU,MI
tHD,MI
UCLK
SOMI
SIMO
tVALID,MO
tHD,MO
CKPL =0
CKPL =1
tLO/HI tLO/HI
1/fUCxCLK
tSU,MI
tHD,MI
UCLK
SOMI
SIMO
tVALID,MO
CKPL =0
CKPL =1
1/fUCxCLK
tHD,MO
tLO/HI tLO/HI
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Figure 11. SPI Master Mode, CKPH = 0
Figure 12. SPI Master Mode, CKPH = 1
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USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1),Figure 13 and Figure 14)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
1.8 V 11
PMMCOREV = 0 ns
3 V 8
tSTE,LEAD STE lead time, STE low to clock 2.4 V 7
PMMCOREV = 3 ns
3 V 6
1.8 V 3
PMMCOREV = 0 ns
3 V 3
tSTE,LAG STE lag time, Last clock to STE high 2.4 V 3
PMMCOREV = 3 ns
3 V 3
1.8 V 66
PMMCOREV = 0 ns
3 V 50
tSTE,ACC STE access time, STE low to SOMI data out 2.4 V 36
PMMCOREV = 3 ns
3 V 30
1.8 V 30
PMMCOREV = 0 ns
3 V 23
STE disable time, STE high to SOMI high
tSTE,DIS impedance 2.4 V 16
PMMCOREV = 3 ns
3 V 13
1.8 V 5
PMMCOREV = 0 ns
3 V 5
tSU,SI SIMO input data setup time 2.4 V 2
PMMCOREV = 3 ns
3 V 2
1.8 V 5
PMMCOREV = 0 ns
3 V 5
tHD,SI SIMO input data hold time 2.4 V 5
PMMCOREV = 3 ns
3 V 5
UCLK edge to SOMI valid, 1.8 V 76
CL= 20 pF ns
3 V 60
PMMCOREV = 0
tVALID,SO SOMI output data valid time(2) UCLK edge to SOMI valid, 2.4 V 44
CL= 20 pF ns
3 V 40
PMMCOREV = 3 1.8 V 18
CL= 20 pF ns
PMMCOREV = 0 3 V 12
tHD,SO SOMI output data hold time(3) 2.4 V 10
CL= 20 pF ns
PMMCOREV = 3 3 V 8
(1) fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master's parameters tSU,MI(Master) and tVALID,MO(Master) see the SPI parameters of the attached slave.
(2) Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 11 and Figure 12.
(3) Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 11
and Figure 12.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 63
STE
UCLK
CKPL =0
CKPL =1
SOMI
SIMO
tSU,SI
tHD,SI
tVALID,SO
tSTE,LEAD
1/fUCxCLK
tLO/HI tLO/HI
tSTE,LAG
tSTE,DIS
tSTE,ACC
tHD,SO
STE
UCLK
CKPL =0
CKPL =1
SOMI
SIMO
tSU,SI
tHD,SI
tVALID,SO
tSTE,LEAD
1/fUCxCLK
tSTE,LAG
tSTE,DIS
tSTE,ACC
tHD,MO
tLO/HI tLO/HI
MSP430F550x, MSP430F5510
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Figure 13. SPI Slave Mode, CKPH = 0
Figure 14. SPI Slave Mode, CKPH = 1
64 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
SDA
SCL
tHD,DAT
tSU,DAT
tHD,STA
tHIGH
tLOW
tBUF
tHD,STA
tSU,STA
tSP
tSU,STO
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USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 15)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
Internal: SMCLK, ACLK
fUSCI USCI input clock frequency External: UCLK fSYSTEM MHz
Duty cycle = 50% ±10%
fSCL SCL clock frequency 2.2 V/3 V 0 400 kHz
fSCL 100 kHz 4.0
tHD,STA Hold time (repeated) START 2.2 V/3 V µs
fSCL >100 kHz 0.6
fSCL 100 kHz 4.7
tSU,STA Setup time for a repeated START 2.2 V/3 V µs
fSCL >100 kHz 0.6
tHD,DAT Data hold time 2.2 V/3 V 0 ns
tSU,DAT Data setup time 2.2 V/3 V 250 ns
fSCL 100 kHz 4.0
tSU,STO Setup time for STOP 2.2 V/3 V µs
fSCL >100 kHz 0.6
2.2 V 50 600
tSP Pulse width of spikes suppressed by input filter ns
3 V 50 600
Figure 15. I2C Mode Timing
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10-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
AVCC and DVCC are connected together,
AVCC Analog supply voltage AVSS and DVSS are connected together, 1.8 3.6 V
V(AVSS) = V(DVSS) = 0 V
All ADC10_A pins: P1.0 to P1.5 and P3.6 and P3.7
V(Ax) Analog input voltage range(2) 0 AVCC V
terminals
Operating supply current into fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0, 2.2 V 60 100
AVCC terminal, REF module SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF µA
3 V 75 110
and reference buffer off = 00
Operating supply current into fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 1,
AVCC terminal, REF module SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF 3 V 113 150 µA
on, reference buffer on = 01
IADC10_A Operating supply current into fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
AVCC terminal, REF module SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF 3 V 105 140 µA
off, reference buffer on = 10, VEREF = 2.5 V
Operating supply current into fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
AVCC terminal, REF module SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF 3 V 70 110 µA
off, reference buffer off = 11, VEREF = 2.5 V
Only one terminal Ax can be selected at one time
CIInput capacitance from the pad to the ADC10_A capacitor array 2.2 V 3.5 pF
including wiring and pad.
AVCC >2.0V, 0 V VAx AVCC 36
RIInput MUX ON resistance k
1.8V <AVCC <2.0V, 0 V VAx AVCC 96
(1) The leakage current is defined in the leakage current table with P6.x/Ax parameter.
(2) The analog input voltage range must be within the selected reference voltage range VR+ to VRfor valid conversion results. The external
reference voltage requires decoupling capacitors. Two decoupling capacitors, 10 µF and 100 nF, should be connected to VeREF to
decouple the dynamic current required for an external reference source if it is used for the ADC10_A. Also see the
MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208).
10-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
For specified performance of ADC10_A linearity
fADC10CLK 2.2 V/3 V 0.45 5 5.5 MHz
parameters
Internal ADC10_A
fADC10OSC ADC10DIV = 0, fADC10CLK = fADC10OSC 2.2 V/3 V 4.2 4.8 5.4 MHz
oscillator(1)
REFON = 0, Internal oscillator, 12 ADC10CLK
cycles, 10-bit mode 2.2 V/3 V 2.4 3.0
fADC10OSC = 4 MHz to 5 MHz
tCONVERT Conversion time µs
External fADC10CLK from ACLK, MCLK or SMCLK, (2)
ADC10SSEL 0
Turn on settling time of
tADC10ON See (3) 100 ns
the ADC RS= 1000 , RI= 96 k, CI= 3.5 pF(4) 1.8 V 3 µs
tSample Sampling time RS= 1000 , RI= 36 k, CI= 3.5 pF(4) 3 V 1 µs
(1) The ADC10OSC is sourced directly from MODOSC inside the UCS.
(2) 12 ×ADC10DIV ×1/fADC10CLK
(3) The condition is that the error in a conversion started after tADC10ON is less than ±0.5 LSB. The reference and input signal are already
settled.
(4) Approximately eight Tau (τ) are needed to get an error of less than ±0.5 LSB
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10-Bit ADC, Linearity Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
1.4 V (VeREF+ VeREF)min 1.6 V ±1.0
Integral
EI2.2 V/3 V LSB
linearity error 1.6 V <(VeREF+ VeREF)min VAVCC ±1.0
Differential (VeREF+ VeREF)min (VeREF+ VeREF),
ED2.2 V/3 V ±1.0 LSB
linearity error CVREF+ = 20 pF
(VeREF+ VeREF)min (VeREF+ VeREF),
EOOffset error 2.2 V/3 V ±1.0 LSB
Internal impedance of source RS<100 , CVREF+ = 20 pF
(VeREF+ VeREF)min (VeREF+ VeREF),
EGGain error 2.2 V/3 V ±1.0 LSB
CVREF+ = 20 pF
Total unadjusted (VeREF+ VREF/VeREF)min (VeREF+ VREF/VeREF),
ET2.2 V/3 V ±1.0 ±2.0 LSB
error CVREF+ = 20 pF
REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
Positive external
VeREF+ VeREF+ >VeREF(2) 1.4 AVCC V
reference voltage input
Negative external
VeREFVeREF+ >VeREF(3) 0 1.2 V
reference voltage input
(VeREF+ Differential external VeREF+ >VeREF(4) 1.4 AVCC V
VeREF) reference voltage input 1.4 V VeREF+ VAVCC , VeREF= 0 V,
fADC10CLK = 5 MHz, ADC10SHTx = 0x0001, 2.2 V/3 V ±8.5 ±26 µA
Conversion rate 200 ksps
IVeREF+ Static input current
IVeREF1.4 V VeREF+ VAVCC , VeREF= 0 V,
fADC10CLK = 5 MHZ, ADC10SHTX = 0x1000, 2.2 V/3 V ±1µA
Conversion rate 20 ksps
Capacitance at VeREF+/-
CVREF+/- (5) 10 µF
terminal
(1) The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, CI, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
(2) The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
(3) The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
(4) The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
(5) Two decoupling capacitors, 10 µF and 100 nF, should be connected to VeREF to decouple the dynamic current required for an external
reference source if it is used for the ADC10_A. Also see the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208).
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REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
REFVSEL = {2} for 2.5 V 3 V 2.51 ±1.5%
REFON = 1
Positive built-in reference REFVSEL = {1} for 2.0 V
VREF+ 3 V 1.99 ±1.5% V
voltage REFON = 1
REFVSEL = {0} for 1.5 V 2.2 V/ 3 V 1.5 ±1.5%
REFON = 1
REFVSEL = {0} for 1.5 V 2.2
AVCC minimum voltage,
AVCC(min) Positive built-in reference REFVSEL = {1} for 2.0 V 2.2 V
active REFVSEL = {2} for 2.5 V 2.7
fADC10CLK = 5.0 MHz
REFON = 1, REFBURST = 0, REFVSEL = 3 V 18 24 µA
{2} for 2.5 V
fADC10CLK = 5.0 MHz
Operating supply current
IREF+ REFON = 1, REFBURST = 0, REFVSEL = 3 V 15.5 21 µA
into AVCC terminal(2) {1} for 2.0 V
fADC10CLK = 5.0 MHz
REFON = 1, REFBURST = 0, REFVSEL = 3 V 13.5 21 µA
{0} for 1.5 V
Temperature coefficient of IVREF+ = 0 A ppm/
TCREF+ 30 50
built-in reference(3) REFVSEL = (0, 1, 2}, REFON = 1 °C
2.2 V 20 22
Operating supply current REFON = 0, INCH = 0Ah,
ISENSOR µA
into AVCC terminal(4) ADC10ON = N A, TA= 30°C3 V 20 22
2.2 V 770
ADC10ON = 1, INCH = 0Ah,
VSENSOR See (5) mV
TA= 30°C3 V 770
2.2 V 1.06 1.1 1.14
ADC10ON = 1, INCH = 0Bh,
VMID AVCC divider at channel 11 V
VMID is ~0.5 ×VAVCC 3 V 1.46 1.5 1.54
Sample time required if ADC10ON = 1, INCH = 0Ah,
tSENSOR(sample) 30 µs
channel 10 is selected(6) Error of conversion result 1 LSB
Sample time required if ADC10ON = 1, INCH = 0Bh,
tVMID(sample) 1µs
channel 11 is selected(7) Error of conversion result 1 LSB
AVCC = AVCC (min) - AVCC(max)
Power supply rejection ratio
PSRR_DC TA= 25 °C 120 µV/V
(dc) REFVSEL = (0, 1, 2}, REFON = 1
AVCC = AVCC (min) - AVCC(max)
Power supply rejection ratio TA= 25 °C
PSRR_AC 6.4 mV/V
(ac) f = 1 kHz, ΔVpp = 100 mV
REFVSEL = (0, 1, 2}, REFON = 1
Settling time of reference AVCC = AVCC (min) - AVCC(max)
tSETTLE 75 µs
voltage(8) REFVSEL = (0, 1, 2}, REFON = 0 1
(1) The leakage current is defined in the leakage current table with P6.x/Ax parameter.
(2) The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC10ON control bit, unless a
conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion.
(3) Calculated using the box method: (MAX(-40 to 85°C) MIN(-40 to 85°C)) / MIN(-40 to 85°C)/(85°C(40°C)).
(4) The sensor current ISENSOR is consumed if (ADC10ON = 1 and REFON = 1) or (ADC10ON = 1 and INCH = 0Ah and sample signal is
high). When REFON = 1, ISENSOR is already included in IREF+.
(5) The temperature sensor offset can be as much as ±20°C. A single-point calibration is recommended in order to minimize the offset error
of the built-in temperature sensor.
(6) The typical equivalent impedance of the sensor is 51 k. The sample time required includes the sensor-on time tSENSOR(on).
(7) The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
(8) The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB.
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Comparator B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VCC Supply voltage 1.8 3.6 V
1.8 V 40
Comparator operating CBPWRMD = 00, CBON = 1, CBRSx = 00 2.2 V 30 50
supply current into AVCC.
IAVCC_COMP 3 V 40 65 µA
Excludes reference CBPWRMD = 01, CBON = 1, CBRSx = 00 2.2/3 V 10 17
resistor ladder. CBPWRMD = 10, CBON = 1, CBRSx = 00 2.2/3 V 0.1 0.5
CBREFACC = 0, CBREFLx = 01,
Quiescent current of 2.2/3 V 10 17 µA
CBRSx = 10, REFON = 0, CBON = 0
resistor ladder into AVCC.
IAVCC_REF Including REF module CBREFACC = 1, CBREFLx = 01, 2.2/3 V 22 µA
current. CBRSx = 10, REFON = 0, CBON = 0
Common mode input
VIC 0 VCC-1 V
range CBPWRMD = 00 ±20 mV
VOFFSET Input offset voltage CBPWRMD = 01, 10 ±10 mV
CIN Input capacitance 5 pF
ON - switch closed 3 4 k
RSIN Series input resistance OFF - switch opened 50 M
CBPWRMD = 00, CBF = 0 450 ns
Propagation delay,
tPD CBPWRMD = 01, CBF = 0 600 ns
response time CBPWRMD = 10, CBF = 0 50 µs
CBPWRMD = 00, CBON = 1, CBF = 1, 0.35 0.6 1.0 µs
CBFDLY = 00
CBPWRMD = 00, CBON = 1, CBF = 1, 0.6 1.0 1.8 µs
CBFDLY = 01
Propagation delay with
tPD,filter filter active CBPWRMD = 00, CBON = 1, CBF = 1, 1.0 1.8 3.4 µs
CBFDLY = 10
CBPWRMD = 00, CBON = 1, CBF = 1, 1.8 3.4 6.5 µs
CBFDLY = 11
CBON = 0 to CBON = 1 1 2 µs
CBPWRMD = 00, 01
tEN_CMP Comparator enable time CBON = 0 to CBON = 1 1.5 µs
CBPWRMD = 10
Resistor reference enable
tEN_REF CBON = 0 to CBON = 1 1 1.5 µs
time VIN ×VIN ×VIN ×
Reference voltage for a VIN = reference into resistor ladder.
VCB_REF (n+0.5) (n+1) (n+1.5) V
given tap n = 0 to 31 /32 /32 /32
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Ports PU.0 and PU.1
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VUSB = 3.3 V ±10%, IOH = -25 mA.
VOH High-level output voltage Refer to Figure 17 for typical 2.4 V
characteristics.
VUSB = 3.3 V ±10%, IOL = 25 mA.
VOL Low-level output voltage Refer to Figure 16 for typical 0.4 V
characteristics.
VUSB = 3.3 V ±10%
VIH High-level input voltage Refer to Figure 18 for typical 2.0 V
characteristics.
VUSB = 3.3 V ±10%
VIL Low-level input voltage Refer to Figure 18 for typical 0.8 V
characteristics.
70 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
0
10
20
30
40
50
60
70
80
90
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
VOL - Low-Level Output Voltage - V
IOL - Typical Low-Level Output Current - mA
V = 3.0 V
T = 85 ºC
CC
A
V = 1.8 V
T = 85 ºC
CC
A
V = 1.8 V
T = 25 ºC
CC
A
V = 3.0 V
T = 25 ºC
CC
A
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
0.5 1 1.5 2 2.5 3
VOH - High-Level Output Voltage - V
IOH - Typical High-Level Output Current - mA
V = 1.8 V
T = 85 ºC
CC
A
V = 1.8 V
T = 25 ºC
CC
A
V = 3.0 V
T = 85 ºC
CC
A
V = 3.0 V
T = 25 ºC
CC
A
TYPICAL PU.0, PU.1 INPUT THRESHOLD
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1.8 2.2 2.6 3 3.4
VUSB Supply Voltage, VUSB - V
Input Threshold - V
VIT+, postive-going input threshold
VIT-, negative-going input threshold
TA= 25 °C, 85 °C
MSP430F550x, MSP430F5510
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SLAS645F JULY 2009REVISED MARCH 2011
Figure 16. Ports PU.0, PU.1 Typical Low-Level Output Characteristics
Figure 17. Ports PU.0, PU.1 Typical High-Level Output Characteristics
Figure 18. Ports PU.0, PU.1 Typical Input Threshold Characteristics
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 71
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USB-Output Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VOH D+, D- single ended USB 2.0 load conditions 2.8 3.6 V
VOL D+, D- single ended USB 2.0 load conditions 0 0.3 V
Z(DRV) D+, D- impedance Including external series resistor of 27 28 44
Full speed, differential, CL= 50 pF,
tRISE Rise time 4 20 ns
10%/90%, Rpu on D+
Full speed, differential, CL= 50 pF,
tFALL Fall time 4 20 ns
10%/90%, Rpu on D+
USB-Input Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
V(CM) Differential input common mode range 0.8 2.5 V
Z(IN) Input impedance 300 k
VCRS Crossover voltage 1.3 2.0 V
VIL Static SE input logic low level 0.8 V
VIH Static SE input logic high level 2.0 V
VDI Differential input voltage 0.2 V
USB-PWR (USB Power System)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VLAUNCH VBUS detection threshold 3.75 V
VBUS USB bus voltage Normal operation 3.76 5.5 V
VUSB USB LDO output voltage 3.3 ±9% V
V18 Internal USB voltage(1) 1.8 V
Maximum external current from VUSB
IUSB_EXT USB LDO is on 12 mA
terminal(2)
IDET USB LDO current overload detection(3) 60 100 mA
Operating supply current into VBUS USB LDO on,
ISUSPEND 250 µA
terminal.(4) USB PLL disabled
USB LDO on,
Operating supply current into VBUS terminal. USB 1.8-V LDO disabled,
IUSB_LDO Represents the current of the 3.3 V LDO 1.8 V/3 V 60 µA
VBUS = 5 V,
only. USBDETEN = 0 or 1
USB LDO disabled,
Operating supply current into VBUS terminal. USB 1.8-V LDO disabled,
IVBUS_DETECT Represents the current of the VBUS 1.8 V/3 V 30 µA
VBUS >VLAUNCH,
detection logic. USBDETEN = 1
CBUS VBUS terminal recommended capacitance 4.7 µF
CUSB VUSB terminal recommended capacitance 220 nF
C18 V18 terminal recommended capacitance 220 nF
Within 2%, recommended
tENABLE Settling time VUSB and V18 2 ms
capacitances
RPUR Pullup resistance of PUR terminal(5) 70 110 150
(1) This voltage is for internal usages only. No external DC loading should be applied.
(2) This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB
operation.
(3) A current overload will be detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value.
(4) Does not include current contribution of Rpu and Rpd as outlined in the USB specification.
(5) This value, in series with an external resistor between PUR and D+, produces the Rpu as outlined in the USB specification.
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USB-PLL (USB Phase Locked Loop)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
IPLL Operating supply current 7 mA
fPLL PLL frequency 48 MHz
fUPD PLL reference frequency 1.5 3 MHz
tLOCK PLL lock time 2 ms
tJitter PLL jitter 1000 ps
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
DVCC(PGM/ERASE) Program and erase supply voltage 1.8 3.6 V
tREADMARGIN Read access time during margin mode 200 ns
IPGM Supply current from DVCC during program 3 5 mA
IERASE Supply current from DVCC during erase 2 6.5 mA
IMERASE, IBANK Supply current from DVCC during mass erase or bank erase 2.5 mA
tCPT Cumulative program time See (1) 16 ms
Program/erase endurance 104105cycles
tRetention Data retention duration TJ= 25°C 100 years
tWord Word or byte program time See (2) 64 85 µs
tBlock, 0 Block program time for first byte or word See (2) 49 65 µs
Block program time for each additional byte or word, except for last
tBlock, 1(N1) See (2) 37 49 µs
byte or word
tBlock, N Block program time for last byte or word See (2) 55 73 µs
Erase time for segment, mass erase, and bank erase when
tErase See (2) 23 32 ms
available.
(1) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
(2) These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
fSBW Spy-Bi-Wire input frequency 2.2 V/3 V 0 20 MHz
tSBW,Low Spy-Bi-Wire low clock pulse length 2.2 V/3 V 0.025 15 µs
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
tSBW, En 2.2 V/3 V 1 µs
edge)(1)
tSBW,Rst Spy-Bi-Wire return to normal operation time 15 100 µs
2.2 V 0 5 MHz
fTCK TCK input frequency - 4-wire JTAG(2) 3 V 0 10 MHz
Rinternal Internal pulldown resistance on TEST 2.2 V/3 V 45 60 80 k
(1) Tools accessing the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
(2) fTCK may be restricted to meet the timing requirements of the module selected.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 73
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
Direction
0:Input
1:Output
P1SEL.x
1
0
P1DIR.x
P1IN.x
P1IRQ.x
EN
Tomodule
1
0
Frommodule
P1OUT.x
Interrupt
Edge
Select
Q
EN
Set
P1SEL.x
P1IES.x
P1IFG.x
P1IE.x
1
0
DVSS
DVCC
P1REN.x PadLogic
1
P1DS.x
0:Lowdrive
1:Highdrive
D
Frommodule
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
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INPUT/OUTPUT SCHEMATICS
Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
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Table 48. Port P1 (P1.0 to P1.7) Pin Functions
CONTROL BITS/SIGNALS
PIN NAME (P1.x) x FUNCTION P1DIR.x P1SEL.x
P1.0/TA0CLK/ACLK 0 P1.0 (I/O) I: 0; O: 1 0
TA0CLK 0 1
ACLK 1 1
P1.1/TA0.0 1 P1.1 (I/O) I: 0; O: 1 0
TA0.CCI0A 0 1
TA0.0 1 1
P1.2/TA0.1 2 P1.2 (I/O) I: 0; O: 1 0
TA0.CCI1A 0 1
TA0.1 1 1
P1.3/TA0.2 3 P1.3 (I/O) I: 0; O: 1 0
TA0.CCI2A 0 1
TA0.2 1 1
P1.4/TA0.3 4 P1.4 (I/O) I: 0; O: 1 0
TA0.CCI3A 0 1
TA0.3 1 1
P1.5/TA0.4 5 P1.5 (I/O) I: 0; O: 1 0
TA0.CCI4A 0 1
TA0.4 1 1
P1.6/TA1CLK/CBOUT 6 P1.6 (I/O) I: 0; O: 1 0
TA1CLK 0 1
CBOUT comparator B 1 1
P1.7/TA1.0 7 P1.7 (I/O) I: 0; O: 1 0
TA1.CCI0A 0 1
TA1.0 1 1
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 75
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UB0STE/UCA0CLK
Direction
0:Input
1:Output
P2SEL.x
1
0
P2DIR.x
P2IN.x
Tomodule
EN
Tomodule
1
0
Frommodule
P2OUT.x
Interrupt
Edge
Select
Q
EN
Set
P2SEL.x
P2IES.x
P2IFG.x
P2IE.x
1
0
DVSS
DVCC
P2REN.x PadLogic
1
P2DS.x
0:Lowdrive
1:Highdrive
D
Frommodule
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
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SLAS645F JULY 2009REVISED MARCH 2011
Table 49. Port P2 (P2.0 to P2.7) Pin Functions
CONTROL BITS/SIGNALS(1)
PIN NAME (P2.x) x FUNCTION P2DIR.x P2SEL.x
P2.0/TA1.1 0 P2.0 (I/O) I: 0; O: 1 0
TA1.CCI1A 0 1
TA1.1 1 1
P2.1/TA1.2 1 P2.1 (I/O) I: 0; O: 1 0
TA1.CCI2A 0 1
TA1.2 1 1
P2.2/TA2CLK/SMCLK 2 P2.2 (I/O) I: 0; O: 1 0
TA2CLK 0 1
SMCLK 1 1
P2.3/TA2.0 3 P2.3 (I/O) I: 0; O: 1 0
TA2.CCI0A 0 1
TA2.0 1 1
P2.4/TA2.1 4 P2.4 (I/O) I: 0; O: 1 0
TA2.CCI1A 0 1
TA2.1 1 1
P2.5/TA2.2 5 P2.5 (I/O) I: 0; O: 1 0
TA2.CCI2A 0 1
TA2.2 1 1
P2.6/RTCCLK/DMAE0 6 P2.6 (I/O) I: 0; O: 1 0
DMAE0 0 1
RTCCLK 1 1
P2.7/UCB0STE/UCA0CLK 7 P2.7 (I/O) I: 0; O: 1 0
UCB0STE/UCA0CLK(2) (3) X 1
(1) X = Don't care
(2) The pin direction is controlled by the USCI module.
(3) UCA0CLK function takes precedence over UCB0STE function. If the pin is required as UCA0CLK input or output, USCI A0/B0 is forced
to 3-wire SPI mode if 4-wire SPI mode is selected.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 77
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
Direction
0:Input
1:Output
P3SEL.x
1
0
P3DIR.x
P3IN.x
EN
Tomodule
1
0
Frommodule
P3OUT.x
1
0
DVSS
DVCC
P3REN.x PadLogic
1
P3DS.x
0:Lowdrive
1:Highdrive
D
Frommodule
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
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Port P3, P3.0 to P3.4, Input/Output With Schmitt Trigger
Table 50. Port P3 (P3.0 to P3.7) Pin Functions
CONTROL BITS/SIGNALS(1)
PIN NAME (P3.x) x FUNCTION P3DIR.x P3SEL.x
P3.0/UCB0SIMO/UCB0SDA 0 P3.0 (I/O) I: 0; O: 1 0
UCB0SIMO/UCB0SDA(2) (3) X 1
P3.1/UCB0SOMI/UCB0SCL 1 P3.1 (I/O) I: 0; O: 1 0
UCB0SOMI/UCB0SCL(2) (3) X 1
P3.2/UCB0CLK/UCA0STE 2 P3.2 (I/O) I: 0; O: 1 0
UCB0CLK/UCA0STE(2) (4) X 1
P3.3/UCA0TXD/UCA0SIMO 3 P3.3 (I/O) I: 0; O: 1 0
UCA0TXD/UCA0SIMO(2) X 1
P3.4/UCA0RXD/UCA0SOMI 4 P3.4 (I/O) I: 0; O: 1 0
UCA0RXD/UCA0SOMI(2) X 1
(1) X = Don't care
(2) The pin direction is controlled by the USCI module.
(3) If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
(4) UCB0CLK function takes precedence over UCA0STE function. If the pin is required as UCB0CLK input or output, USCI A0/B0 is forced
to 3-wire SPI mode if 4-wire SPI mode is selected.
78 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
P4.0/P4MAP0
P4.1/P4MAP1
P4.2/P4MAP2
P4.3/P4MAP3
P4.4/P4MAP4
P4.5/P4MAP5
P4.6/P4MAP6
P4.7/P4MAP7
Direction
0:Input
1:Output
P4SEL.x
1
0
P4DIR.x
P4IN.x
EN
toPortMappingControl
1
0
fromPortMappingControl
P4OUT.x
1
0
DVSS
DVCC
P4REN.x PadLogic
1
P4DS.x
0:Lowdrive
1:Highdrive
D
fromPortMappingControl
MSP430F550x, MSP430F5510
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SLAS645F JULY 2009REVISED MARCH 2011
Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
Table 51. Port P4 (P4.0 to P4.7) Pin Functions
CONTROL BITS/SIGNALS
PIN NAME (P4.x) x FUNCTION P4DIR.x(1) P4SEL.x P4MAPx
P4.0/P4MAP0 0 P4.0 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
P4.1/P4MAP1 1 P4.1 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
P4.2/P4MAP2 2 P4.2 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
P4.3/P4MAP3 3 P4.3 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
P4.4/P4MAP4 4 P4.4 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
P4.5/P4MAP5 5 P4.5 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
P4.6/P4MAP6 6 P4.6 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
P4.7/P4MAP7 7 P4.7 (I/O) I: 0; O: 1 0 X
Mapped secondary digital function X 1 30
(1) The direction of some mapped secondary functions are controlled directly by the module. See Table 10 for specific direction control
information of mapped secondary functions.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 79
P5.0/(A8/VeREF+)
P5.1/(A9/VeREF–)
P5SEL.x
1
0
P5DIR.x
P5IN.x
EN
Tomodule
1
0
Frommodule
P5OUT.x
1
0
DVSS
DVCC
P5REN.x
PadLogic
1
P5DS.x
0:Lowdrive
1:Highdrive
D
Bus
Keeper
to/fromReference
to ADC10
INCHx=x
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
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Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
Table 52. Port P5 (P5.0 and P5.1) Pin Functions
CONTROL BITS/SIGNALS(1)
PIN NAME (P5.x) x FUNCTION P5DIR.x P5SEL.x
P5.0/A8/VeREF+(2) 0 P5.0 (I/O)(3) I: 0; O: 1 0
A8/VeREF+(4) X 1
P5.1/A9/VeREF(5) 1 P5.1 (I/O)(3) I: 0; O: 1 0
A9/VeREF(6) X 1
(1) X = Don't care
(2) VeREF+ available on devices with ADC10_A.
(3) Default condition
(4) Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC10_A when available.
(5) VeREF- available on devices with ADC10_A.
(6) Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF- and used as the reference for the ADC10_A when available.
80 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
P5.2/XT2IN
P5SEL.2
1
0
P5DIR.2
P5IN.2
EN
ModuleXIN
1
0
ModuleXOUT
P5OUT.2
1
0
DVSS
DVCC
P5REN.2
PadLogic
1
P5DS.2
0:Lowdrive
1:Highdrive
D
Bus
Keeper
ToXT2
MSP430F550x, MSP430F5510
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Port P5, P5.2, Input/Output With Schmitt Trigger
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P5.3/XT2OUT
P5SEL.3
1
0
P5DIR.3
P5IN.3
EN
ModuleXIN
1
0
ModuleXOUT
P5OUT.3
1
0
DVSS
DVCC
P5REN.3
PadLogic
1
P5DS.3
0:Lowdrive
1:Highdrive
D
Bus
Keeper
ToXT2
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Port P5, P5.3, Input/Output With Schmitt Trigger
Table 53. Port P5 (P5.2, P5.3) Pin Functions
CONTROL BITS/SIGNALS(1)
PIN NAME (P5.x) x FUNCTION P5DIR.x P5SEL.2 P5SEL.3 XT2BYPASS
P5.2/XT2IN 2 P5.2 (I/O) I: 0; O: 1 0 X X
XT2IN crystal mode(2) X 1 X 0
XT2IN bypass mode(2) X 1 X 1
P5.3/XT2OUT 3 P5.3 (I/O) I: 0; O: 1 0 X X
XT2OUT crystal mode(3) X 1 X 0
P5.3 (I/O)(3) X 1 X 1
(1) X = Don't care
(2) Setting P5SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P5.2 is configured for crystal
mode or bypass mode.
(3) Setting P5SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.3 can be used as
general-purpose I/O.
82 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
P5.4/XIN
P5SEL.4
1
0
P5DIR.4
P5IN.4
EN
ModuleXIN
1
0
ModuleXOUT
P5OUT.4
1
0
DVSS
DVCC
P5REN.4
PadLogic
1
P5DS.4
0:Lowdrive
1:Highdrive
D
Bus
Keeper
toXT1
MSP430F550x, MSP430F5510
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Port P5, P5.4 and P5.5 Input/Output With Schmitt Trigger
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P5.5/XOUT
P5SEL.5
1
0
P5DIR.5
P5IN.5
EN
ModuleXIN
1
0
ModuleXOUT
P5OUT.5
1
0
DVSS
DVCC
P5REN.5
PadLogic
1
P5DS.5
0:Lowdrive
1:Highdrive
D
Bus
Keeper
toXT1
XT1BYPASS
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
84 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
P6.0/CB0/(A0)
P6.1/CB1/(A1)
P6.2/CB2/(A2)
P6.3/CB3/(A3)
P6.4/CB4/(A4)
P6.5/CB5/(A5)
P6.6/CB6/(A6)
P6.7/CB7/(A7)
P6SEL.x
1
0
P6DIR.x
P6IN.x
EN
Tomodule
1
0
Frommodule
P6OUT.x
1
0
DVSS
DVCC 1
P6DS.x
0:Lowdrive
1:Highdrive
D
toComparator_B
fromComparator_B
PadLogic
to ADC10
INCHx=x
Bus
Keeper
Direction
0:Input
1:Output
CBPD.x
P6REN.x
MSP430F550x, MSP430F5510
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SLAS645F JULY 2009REVISED MARCH 2011
Table 54. Port P5 (P5.4 and P5.5) Pin Functions
CONTROL BITS/SIGNALS(1)
PIN NAME (P7.x) x FUNCTION P5DIR.x P5SEL.4 P5SEL.5 XT1BYPASS
P5.4/XIN 4 P5.4 (I/O) I: 0; O: 1 0 X X
XIN crystal mode(2) X 1 X 0
XIN bypass mode(2) X 1 X 1
P5.5/XOUT 5 P5.5 (I/O) I: 0; O: 1 0 X X
XOUT crystal mode(3) X 1 X 0
P5.5 (I/O)(3) X 1 X 1
(1) X = Don't care
(2) Setting P5SEL.4 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.4 is configured for crystal
mode or bypass mode.
(3) Setting P5SEL.4 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.5 can be used as
general-purpose I/O.
Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
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Table 55. Port P6 (P6.0 to P6.7) Pin Functions
CONTROL BITS/SIGNALS
PIN NAME (P6.x) x FUNCTION P6DIR.x P6SEL.x CBPD
P6.0/CB0/(A0) 0 P6.0 (I/O) I: 0; O: 1 0 0
A0 (only on devices with ADC) X 1 X
CB0(1) X X 1
P6.1/CB1/(A1) 1 P6.1 (I/O) I: 0; O: 1 0 0
A1 (only on devices with ADC) X 1 X
CB1(1) X X 1
P6.2/CB2/(A2) 2 P6.2 (I/O) I: 0; O: 1 0 0
A2 (only on devices with ADC) X 1 X
CB2(1) X X 1
P6.3/CB3/(A3) 3 P6.3 (I/O) I: 0; O: 1 0 0
A3 (only on devices with ADC) X 1 X
CB3(1) X X 1
P6.4/CB4/(A4) 4 P6.4 (I/O) I: 0; O: 1 0 0
A4 (only on devices with ADC) X 1 X
CB4(2) X X 1
P6.5/CB5/(A5) 5 P6.5 (I/O) I: 0; O: 1 0 0
A5 (only on devices with ADC) X 1 X
CB5(2) X X 1
P6.6/CB6/(A6) 6 P6.6 (I/O) I: 0; O: 1 0 0
A6 (only on devices with ADC) X 1 X
CB6(2) X X 1
P6.7/CB7/(A7) 7 P6.7 (I/O) I: 0; O: 1 0 0
A7 (only on devices with ADC) X 1 X
CB7(2) X X 1
(1) Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input
buffer for that pin, regardless of the state of the associated CBPD.x bit.
(2) Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input
buffer for that pin, regardless of the state of the associated CBPD.x bit.
86 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
PUOPE 0
1
0
1
PUOUT0
PUSEL
Pad Logic
PU.0/
DP
VUSB VSSU
PU.1/
DM
0
1
PUOUT1
.
PUIN1
USB DM input
PUIN0
USB DP input
USB DM output
USB DP output
USB output enable
PUSEL
Pad Logic
PUR
VUSB VSSU
“1”
PUREN
PURIN
PUIPE
MSP430F550x, MSP430F5510
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Port PU.0/DP, PU.1/DM, PUR USB Ports
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Table 56. Port PU.0/DP, PU.1/DM Output Functions(1)
CONTROL BITS PIN NAME
PUSEL PUOPE PUOUT1 PUOUT0 PU.1/DM PU.0/DP
0 0 X X Output disabled Output disabled
0 1 0 0 Output low Output low
0 1 0 1 Output low Output high
0 1 1 0 Output high Output low
0 1 1 1 Output high Output high
1 X X X DM(2) DP(2)
(1) PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the device using the integrated 3.3-V
LDO when enabled. VUSB can also be supplied externally when the 3.3-V LDO is not being used and is disabled.
(2) Output state set by the USB module.
Table 57. Port PU.0/DP, PU.1/DM Input Functions(1)
CONTROL BITS PIN NAME
PUSEL PUIPE PU.1/DM PU.0/DP
0 0 Input disabled Input disabled
0 1 Input enabled Input enabled
1 X DM input DP input
(1) PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the
device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the
3.3-V LDO is not being used and is disabled.
Table 58. Port PUR Input Functions
CONTROL BITS FUNCTION
PUSEL PUREN
Input disabled
0 0 Pull up disabled
Input disabled
0 1 Pull up enabled
Input enabled
1 0 Pull up disabled
Input enabled
1 1 Pull up enabled
88 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
PJ.0/TDO
FromJTAG
1
0
PJDIR.0
PJIN.0
EN
1
0
FromJTAG
PJOUT.0
1
0
DVSS
DVCC
PJREN.0 PadLogic
1
PJDS.0
0:Lowdrive
1:Highdrive
D
DVCC
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
FromJTAG
1
0
PJDIR.x
PJIN.x
EN
1
0
FromJTAG
PJOUT.x
1
0
DVSS
DVCC
PJREN.x PadLogic
1
PJDS.x
0:Lowdrive
1:Highdrive
D
DVSS
ToJTAG
MSP430F550x, MSP430F5510
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SLAS645F JULY 2009REVISED MARCH 2011
Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
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Table 59. Port PJ (PJ.0 to PJ.3) Pin Functions
CONTROL BITS/
SIGNALS(1)
PIN NAME (PJ.x) x FUNCTION PJDIR.x
PJ.0/TDO 0 PJ.0 (I/O)(2) I: 0; O: 1
TDO(3) X
PJ.1/TDI/TCLK 1 PJ.1 (I/O)(2) I: 0; O: 1
TDI/TCLK(3) (4) X
PJ.2/TMS 2 PJ.2 (I/O)(2) I: 0; O: 1
TMS(3) (4) X
PJ.3/TCK 3 PJ.3 (I/O)(2) I: 0; O: 1
TCK(3) (4) X
(1) X = Don't care
(2) Default condition
(3) The pin direction is controlled by the JTAG module.
(4) In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
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SLAS645F JULY 2009REVISED MARCH 2011
DEVICE DESCRIPTORS
Table 60 list the complete contents of the device descriptor tag-length-value (TLV) structure for each device type.
Table 60. 'F5504 to 'F5510 Device Descriptor Table (1)
'F5510 'F5510 'F5509 'F5509 'F5508 'F5508 'F5507 'F5506 'F5505 'F5504
SIZE RGC RGZ RGC RGZ RGC RGZ
DESCRIPTION ADDRESS (bytes) VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE
Info Block Info length 01A00h 1 06h 06h 06h 06h 06h 06h 06h 06h 06h 06h
CRC length 01A01h 1 06h 06h 06h 06h 06h 06h 06h 06h 06h 06h
CRC value 01A02h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Device ID 01A04h 1 31h 31h 3Ah 3Ah 39h 39h 38h 37h 36h 35h
Device ID 01A05h 1 80h 80h 80h 80h 80h 80h 80h 80h 80h 80h
Hardware revision 01A06h 1 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Firmware revision 01A07h 1 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Die Record Die Record Tag 01A08h 1 08h 08h 08h 08h 08h 08h 08h 08h 08h 08h
Die Record length 01A09h 1 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah
Lot/Wafer ID 01A0Ah 4 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Die X position 01A0Eh 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Die Y position 01A10h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Test results 01A12h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
ADC10 ADC10 Calibration 01A14h 1 13h 13h 13h 13h 13h 13h 13h 13h 13h 13h
Calibration Tag
ADC10 Calibration 01A15h 1 10h 10h 10h 10h 10h 10h 10h 10h 10h 10h
length
ADC Gain Factor 01A16h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
ADC Offset 01A18h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
ADC 1.5-V Reference 01A1Ah 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Temp. Sensor 30°C
ADC 1.5-V Reference 01A1Ch 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Temp. Sensor 85°C
ADC 2.0-V Reference 01A1Eh 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Temp. Sensor 30°C
ADC 2.0-V Reference 01A20h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Temp. Sensor 85°C
ADC 2.5-V Reference 01A22h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Temp. Sensor 30°C
ADC 2.5-V Reference 01A24h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Temp. Sensor 85°C
REF REF Calibration Tag 01A26h 1 12h 12h 12h 12h 12h 12h 12h 12h 12h 12h
Calibration
REF Calibration length 01A27h 1 06h 06h 06h 06h 06h 06h 06h 06h 06h 06h
REF 1.5-V Reference 01A28h 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Factor
REF 2.0-V Reference 01A2Ah 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Factor
REF 2.5-V Reference 01A2Ch 2 per unit per unit per unit per unit per unit per unit per unit per unit per unit per unit
Factor
Peripheral Peripheral Descriptor 01A2Eh 1 02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
Descriptor Tag
Peripheral Descriptor 01A2Fh 1 61h 61h 62h 62h 61h 61h 5Dh 5Eh 5Dh 5Dh
Length
08h 08h 08h 08h 08h 08h 08h 08h 08h 08h
Memory 1 2 8Ah 8Ah 8Ah 8Ah 8Ah 8Ah 8Ah 8Ah 8Ah 8Ah
0Ch 0Ch 0Ch 0Ch 0Ch 0Ch 0Ch 0Ch 0Ch 0Ch
Memory 2 2 86h 86h 86h 86h 86h 86h 86h 86h 86h 86h
0Eh 0Eh 0Eh 00Eh 0Eh 0Eh 0Eh 0Eh 0Eh 0Eh
Memory 3 2 2Ah 2Ah 2Ah 2Ah 2Ah 2Ah 2Ah 2Ah 2Ah 2Ah
(1) N/A = Not applicable
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Table 60. 'F5504 to 'F5510 Device Descriptor Table (1) (continued)
'F5510 'F5510 'F5509 'F5509 'F5508 'F5508 'F5507 'F5506 'F5505 'F5504
SIZE RGC RGZ RGC RGZ RGC RGZ
DESCRIPTION ADDRESS (bytes) VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE
12h 12h 12h 12h 12h 12h 12h 12h 12h 12h
Memory 4 2 2Ch 2Ch 2Ch 2Ch 2Ch 2Ch 2Ch 2Ch 2Ch 2Ch
40h 40h 50h 50h 60h 60h 40h 50h 60h 70h
Memory 5 2 92h 92h 91h 91h 90h 90h 92h 91h 90h 8Eh
Memory 6 N/A N/A 8Eh 8Eh N/A N/A N/A 8Eh N/A N/A
delimiter 1 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
Peripheral count 1 20h 20h 20h 20h 20h 20h 1Eh 1Eh 1Eh 1Eh
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
MSP430CPUXV2 2 23h 23h 23h 23h 23h 23h 23h 23h 23h 23h
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
JTAG 2 09h 09h 09h 09h 09h 09h 09h 09h 09h 09h
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
SBW 2 0Fh 0Fh 0Fh 0Fh 0Fh 0Fh 0Fh 0Fh 0Fh 0Fh
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
EEM-S 2 03h 03h 03h 03h 03h 03h 03h 03h 03h 03h
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
TI BSL 2 FCh FCh FCh FCh FCh FCh FCh FCh FCh FCh
10h 10h 10h 10h 10h 10h 10h 10h 10h 10h
SFR 2 41h 41h 41h 41h 41h 41h 41h 41h 41h 41h
02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
PMM 2 30h 30h 30h 30h 30h 30h 30h 30h 30h 30h
02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
FCTL 2 38h 38h 38h 38h 38h 38h 38h 38h 38h 38h
01h 01h 01h 01h 01h 01h 01h 01h 01h 01h
CRC16 2 3Ch 3Ch 3Ch 3Ch 3Ch 3Ch 3Ch 3Ch 3Ch 3Ch
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
CRC16_RB 2 3Dh 3Dh 3Dh 3Dh 3Dh 3Dh 3Dh 3Dh 3Dh 3Dh
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
RAMCTL 2 44h 44h 44h 44h 44h 44h 44h 44h 44h 44h
00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
WDT_A 2 40h 40h 40h 40h 40h 40h 40h 40h 40h 40h
01h 01h 01h 01h 01h 01h 01h 01h 01h 01h
UCS 2 48h 48h 48h 48h 48h 48h 48h 48h 48h 48h
02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
SYS 2 42h 42h 42h 42h 42h 42h 42h 42h 42h 42h
03h 03h 03h 03h 03h 03h 03h 03h 03h 03h
REF 2 A0h A0h A0h A0h A0h A0h A0h A0h A0h A0h
01h 01h 01h 01h 01h 01h 01h 01h 01h 01h
Port Mapping 2 10h 10h 10h 10h 10h 10h 10h 10h 10h 10h
04h 04h 04h 04h 04h 04h 04h 04h 04h 04h
Port 1/2 2 51h 51h 51h 51h 51h 51h 51h 51h 51h 51h
02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
Port 3/4 2 52h 52h 52h 52h 52h 52h 52h 52h 52h 52h
02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
Port 5/6 2 53h 53h 53h 53h 53h 53h 53h 53h 53h 53h
0Eh 0Eh 0Eh 0Eh 0Eh 0Eh 0Eh 0Eh 0Eh 0Eh
JTAG 2 5Fh 5Fh 5Fh 5Fh 5Fh 5Fh 5Fh 5Fh 5Fh 5Fh
02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
TA0 2 62h 62h 62h 62h 62h 62h 62h 62h 62h 62h
04h 04h 04h 04h 04h 04h 04h 04h 04h 04h
TA1 2 61h 61h 61h 61h 61h 61h 61h 61h 61h 61h
04h 04h 04h 04h 04h 04h 04h 04h 04h 04h
TB0 2 67h 67h 67h 67h 67h 67h 67h 67h 67h 67h
04h 04h 04h 04h 04h 04h 04h 04h 04h 04h
TA2 2 61h 61h 61h 61h 61h 61h 61h 61h 61h 61h
0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah
RTC 2 68h 68h 68h 68h 68h 68h 68h 68h 68h 68h
02h 02h 02h 02h 02h 02h 02h 02h 02h 02h
MPY32 2 85h 85h 85h 85h 85h 85h 85h 85h 85h 85h
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Table 60. 'F5504 to 'F5510 Device Descriptor Table (1) (continued)
'F5510 'F5510 'F5509 'F5509 'F5508 'F5508 'F5507 'F5506 'F5505 'F5504
SIZE RGC RGZ RGC RGZ RGC RGZ
DESCRIPTION ADDRESS (bytes) VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE VALUE
04h 04h 04h 04h 04h 04h 04h 04h 04h 04h
DMA-3 2 47h 47h 47h 47h 47h 47h 47h 47h 47h 47h
0Ch 0Ch 0Ch 0Ch 0Ch 0Ch 10h 10h 10h 10h
USCI_A/B 2 90h 90h 90h 90h 90h 90h 90h 90h 90h 90h
04h 04h 04h 04h 04h 04h
USCI_A/B 2 N/A N/A N/A N/A
90h 90h 90h 90h 90h 90h
14h 14h 14h 14h 14h 14h 14h 14h 14h 14h
ADC10_A 2 D3h D3h D3h D3h D3h D3h D3h D3h D3h D3h
18h 18h 18h 18h 18h 18h
COMP_B 2 N/A N/A N/A N/A
A8h A8h A8h A8h A8h A8h
04h 04h 04h 04h 04h 04h 1Ch 1Ch 1Ch 1Ch
USB 2 98h 98h 98h 98h 98h 98h 98h 98h 98h 98h
Interrupts COMP_B 1 A8h A8h A8h A8h A8h A8h 01h 01h 01h 01h
TB0.CCIFG0 1 64h 64h 64h 64h 64h 64h 64h 64h 64h 64h
TB0.CCIFG1..6 1 65h 65h 65h 65h 65h 65h 65h 65h 65h 65h
WDTIFG 1 40h 40h 40h 40h 40h 40h 40h 40h 40h 40h
USCI_A0 1 90h 90h 90h 90h 90h 90h 01h 01h 01h 01h
USCI_B0 1 91h 91h 91h 91h 91h 91h 01h 01h 01h 01h
ADC10_A 1 D0h D0h D0h D0h D0h D0h D0h D0h D0h D0h
TA0.CCIFG0 1 60h 60h 60h 60h 60h 60h 60h 60h 60h 60h
TA0.CCIFG1..4 1 61h 61h 61h 61h 61h 61h 61h 61h 61h 61h
USB 1 98h 98h 98h 98h 98h 98h 98h 98h 98h 98h
DMA 1 46h 46h 46h 46h 46h 46h 46h 46h 46h 46h
TA1.CCIFG0 1 62h 62h 62h 62h 62h 62h 62h 62h 62h 62h
TA1.CCIFG1..2 1 63h 63h 63h 63h 63h 63h 63h 63h 63h 63h
P1 1 50h 50h 50h 50h 50h 50h 50h 50h 50h 50h
USCI_A1 1 92h 92h 92h 92h 92h 92h 92h 92h 92h 92h
USCI_B1 1 93h 93h 93h 93h 93h 93h 93h 93h 93h 93h
TA1.CCIFG0 1 66h 66h 66h 66h 66h 66h 66h 66h 66h 66h
TA1.CCIFG1..2 1 67h 67h 67h 67h 67h 67h 67h 67h 67h 67h
P2 1 51h 51h 51h 51h 51h 51h 51h 51h 51h 51h
RTC_A 1 68h 68h 68h 68h 68h 68h 68h 68h 68h 68h
delimiter 1 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h
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SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Table 61. 'F5500 to 'F5503 Device Descriptor Table(1)
'F5503RGZ 'F5502RGZ 'F5501RGC 'F5500RGZ
SIZE
DESCRIPTION ADDRESS (bytes) VALUE VALUE VALUE VALUE
Info Block Info length 01A00h 1 06h 06h 06h 06h
CRC length 01A01h 1 06h 06h 06h 06h
CRC value 01A02h 2 per unit per unit per unit per unit
Device ID 01A04h 1 34h 33h 32h 3Bh
Device ID 01A05h 1 80h 80h 80h 80h
Hardware revision 01A06h 1 per unit per unit per unit per unit
Firmware revision 01A07h 1 per unit per unit per unit per unit
Die Record Die Record Tag 01A08h 1 08h 08h 08h 08h
Die Record length 01A09h 1 0Ah 0Ah 0Ah 0Ah
Lot/Wafer ID 01A0Ah 4 per unit per unit per unit per unit
Die X position 01A0Eh 2 per unit per unit per unit per unit
Die Y position 01A10h 2 per unit per unit per unit per unit
Test results 01A12h 2 per unit per unit per unit per unit
ADC10 Calibration Empty Tag 01A14h 1 05h 05h 05h 05h
Empty Tag length 01A15h 1 10h 10h 10h 10h
REF Calibration REF Calibration Tag 01A26h 1 12h 12h 12h 12h
REF Calibration length 01A27h 1 06h 06h 06h 06h
REF 1.5-V Reference Factor 01A28h 2 per unit per unit per unit per unit
REF 2.0-V Reference Factor 01A2Ah 2 per unit per unit per unit per unit
REF 2.5-V Reference Factor 01A2Ch 2 per unit per unit per unit per unit
Peripheral Peripheral Descriptor Tag 01A2Eh 1 02h 02h 02h 02h
Descriptor
Peripheral Descriptor Length 01A2Fh 1 5Dh 5Eh 5Dh 5Dh
08h 08h 08h 08h
Memory 1 2 8Ah 8Ah 8Ah 8Ah
0Ch 0Ch 0Ch 0Ch
Memory 2 2 86h 86h 86h 86h
0Eh 0Eh 0Eh 0Eh
Memory 3 2 2Ah 2Ah 2Ah 2Ah
12h 12h 12h 12h
Memory 4 2 2Ch 2Ch 2Ch 2Ch
40h 50h 60h 70h
Memory 5 2 92h 91 90h 8Eh
Memory 6 1 N/A 8E N/A N/A
delimiter 1 00h 00h 00h 00h
Peripheral count 1 1Eh 1Eh 1Eh 1Eh
00h 00h 00h 00h
MSP430CPUXV2 2 23h 23h 23h 23h
00h 00h 00h 00h
JTAG 2 09h 09h 09h 09h
00h 00h 00h 00h
SBW 2 0Fh 0Fh 0Fh 0Fh
00h 00h 00h 00h
EEM-S 2 03h 03h 03h 03h
00h 00h 00h 00h
TI BSL 2 FCh FCh FCh FCh
10h 10h 10h 10h
SFR 2 41h 41h 41h 41h
02h 02h 02h 02h
PMM 2 30h 30h 30h 30h
02h 02h 02h 02h
FCTL 2 38h 38h 38h 38h
01h 01h 01h 01h
CRC16 2 3Ch 3Ch 3Ch 3Ch
(1) N/A = Not applicable
94 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
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www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
Table 61. 'F5500 to 'F5503 Device Descriptor Table(1) (continued)
'F5503RGZ 'F5502RGZ 'F5501RGC 'F5500RGZ
SIZE
DESCRIPTION ADDRESS (bytes) VALUE VALUE VALUE VALUE
00h 00h 00h 00h
CRC16_RB 2 3Dh 3Dh 3Dh 3Dh
00h 00h 00h 00h
RAMCTL 2 44h 44h 44h 44h
00h 00h 00h 00h
WDT_A 2 40h 40h 40h 40h
01h 01h 01h 01h
UCS 2 48h 48h 48h 48h
02h 02h 02h 02h
SYS 2 42h 42h 42h 42h
03h 03h 03h 03h
REF 2 A0h A0h A0h A0h
01h 01h 01h 01h
Port Mapping 2 10h 10h 10h 10h
04h 04h 04h 04h
Port 1/2 2 51h 51h 51h 51h
02h 02h 02h 02h
Port 3/4 2 52h 52h 52h 52h
02h 02h 02h 02h
Port 5/6 2 53h 53h 53h 53h
0Eh 0Eh 0Eh 0Eh
JTAG 2 5Fh 5Fh 5Fh 5Fh
02h 02h 02h 02h
TA0 2 62h 62h 62h 62h
04h 04h 04h 04h
TA1 2 61h 61h 61h 61h
04h 04h 04h 04h
TB0 2 67h 67h 67h 67h
04h 04h 04h 04h
TA2 2 61h 61h 61h 61h
0Ah 0Ah 0Ah 0Ah
RTC 2 68h 68h 68h 68h
02h 02h 02h 02h
MPY32 2 85h 85h 85h 85h
04h 04h 04h 04h
DMA-3 2 47h 47h 47h 47h
0Ch 0Ch 0Ch 0Ch
USCI_A/B 2 90h 90h 90h 90h
04h 04h 04h 04h
USCI_A/B 2 90h 90h 90h 90h
ADC10_A 2 N/A N/A N/A N/A
2Ch 2Ch 2Ch 2Ch
COMP_B 2 A8h A8h A8h A8h
04h 04h 04h 04h
USB 2 98h 98h 98h 98h
Interrupts COMP_B 1 A8h A8h A8h A8h
TB0.CCIFG0 1 64h 64h 64h 64h
TB0.CCIFG1..6 1 65h 65h 65h 65h
WDTIFG 1 40h 40h 40h 40h
USCI_A0 1 01h 01h 01h 01h
USCI_B0 1 01h 01h 01h 01h
ADC10_A 1 01h 01h 01h 01h
TA0.CCIFG0 1 60h 60h 60h 60h
TA0.CCIFG1..4 1 61h 61h 61h 61h
USB 1 98h 98h 98h 98h
DMA 1 46h 46h 46h 46h
TA1.CCIFG0 1 62h 62h 62h 62h
TA1.CCIFG1..2 1 63h 63h 63h 63h
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 95
MSP430F550x, MSP430F5510
SLAS645F JULY 2009REVISED MARCH 2011
www.ti.com
Table 61. 'F5500 to 'F5503 Device Descriptor Table(1) (continued)
'F5503RGZ 'F5502RGZ 'F5501RGC 'F5500RGZ
SIZE
DESCRIPTION ADDRESS (bytes) VALUE VALUE VALUE VALUE
P1 1 50h 50h 50h 50h
USCI_A1 1 92h 92h 92h 92h
USCI_B1 1 93h 93h 93h 93h
TA1.CCIFG0 1 66h 66h 66h 66h
TA1.CCIFG1..2 1 67h 67h 67h 67h
P2 1 51h 51h 51h 51h
RTC_A 1 68h 68h 68h 68h
delimiter 1 00h 00h 00h 00h
96 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
MSP430F550x, MSP430F5510
www.ti.com
SLAS645F JULY 2009REVISED MARCH 2011
REVISION HISTORY
VERSION COMMENTS
SLAS645 Product Preview release
SLAS645A Changes throughout for updated Product Preview
SLAS645B Changes throughout for updated Product Preview
SLAS645C Updated Embedded Emulation Module (EEM, Version S) section
SLAS645D Changes throughout for Production Data release
Released BGA package
Corrected VCB_REF min and max values by swapping them as they were backward
SLAS645E Added IUSB_LDO and IVBUS_DETECT to USB-PWR table
Added QFN thermal pad connection to pinout drawing and terminal function table
Updated tEN_REF typ value from 0.3 to 1
Corrected 'F5504 to 'F5510 Device Descriptor Table (Table 60) addresses for ADC10 ADC Gain to Peripheral Descriptor
SLAS645F Tag
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 97
PACKAGE OPTION ADDENDUM
www.ti.com 2-Apr-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MSP430F5500IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5500IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5501IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5501IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5502IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5502IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5503IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5503IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5504IPT ACTIVE LQFP PT 48 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5504IPTR ACTIVE LQFP PT 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5504IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5504IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5505IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5505IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5506IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5506IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5507IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
PACKAGE OPTION ADDENDUM
www.ti.com 2-Apr-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MSP430F5507IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5508IPT ACTIVE LQFP PT 48 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5508IPTR ACTIVE LQFP PT 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5508IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5508IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5508IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5508IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5508IZQE ACTIVE BGA
MICROSTAR
JUNIOR
ZQE 80 360 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
MSP430F5508IZQER ACTIVE BGA
MICROSTAR
JUNIOR
ZQE 80 2500 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
MSP430F5509IPT ACTIVE LQFP PT 48 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5509IPTR ACTIVE LQFP PT 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5509IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5509IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5509IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5509IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5509IZQE ACTIVE BGA
MICROSTAR
JUNIOR
ZQE 80 360 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
PACKAGE OPTION ADDENDUM
www.ti.com 2-Apr-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MSP430F5509IZQER ACTIVE BGA
MICROSTAR
JUNIOR
ZQE 80 2500 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
MSP430F5510IPT ACTIVE LQFP PT 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5510IPTR ACTIVE LQFP PT 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5510IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5510IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5510IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5510IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
MSP430F5510IZQE ACTIVE BGA
MICROSTAR
JUNIOR
ZQE 80 360 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
MSP430F5510IZQER ACTIVE BGA
MICROSTAR
JUNIOR
ZQE 80 2500 Green (RoHS
& no Sb/Br) SNAGCU Level-3-260C-168 HR
XMS430F5510IRGCR OBSOLETE VQFN RGC 64 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Apr-2012
Addendum-Page 4
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
MTQF003A – OCTOBER 1994 – REVISED DECEMBER 1996
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PT (S-PQFP-G48) PLASTIC QUAD FLATPACK
4040052/C 11/96
0,13 NOM
0,17
0,27
25
24
SQ
12
13
36
37
6,80
7,20
1
48
5,50 TYP
0,25
0,45
0,75
0,05 MIN
SQ
9,20
8,80
1,35
1,45
1,60 MAX
Gage Plane
Seating Plane
0,10
0°–7°
0,50 M
0,08
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. This may also be a thermally enhanced plastic package with leads conected to the die pads.
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