All specification &
dimensions are subjec
t to change, please
call yo
ur nearest Foxconn sales repre
sentative for update
information.
Mating Area Plating:
7=15u"(0.40um)MIN. GOLD PLATING
5=50u"(1.27um)MIN. GOLD PLATING
PRODUCT NO.: 1 F 6 4 0 0 1 * -
S 4 0 L 0 *
- * *
POS. NO.:
001=001 pos.
Lead Free Code:
N=None
F=Lead Free
Package Type:
D=Box
Extension Code:
N,T,L,M
Tail Style:
S=Solder Type
BODY STYLE
L0=Future Bus Power
Tail Length(DIM.L)
4=3.50mm
SPECIFICA
TIONS
F
U
T
U
R
E
B
U
S
C
O
N
N
E
C
T
O
R
1
F
S
e
r
i
e
s
REC.,
p
o
w
e
r
c
o
n
n
e
c
t
o
r
Mechanical
Contact Retention Force
:
0.25Kg min.
Electrical
V
oltage Rat
ing:
500V
Current Rating:
30A
Contact Resistance
:
1m
Ω
m
ax.
Dielectrical Wi
thstanding V
o
ltage:
2000V
Insulation Resistanc
e:
5000M
Ω
min.
Physical
Housing:
LCP
, UL
94-0 rated, Ivory
White
Contact:
Phosphor Bronz
e
Plating:
See
“ORD
ERING INFORM
A
TION”
DRAWING
ORDERING
I
N
F
O
R
M
A
T
I
O
N
pp
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