SDED7-256M-N9T - SanDisk - Datasheet.Directory

mDOC H3

Embedded F lash Drive (EFD) featuring Embedded TrueFFS

Flash Management Software

Data Sheet, May 2008

HIGHLIGHTS

mDOC H3 is an Embedded Flash Drive (EFD)

designed for mobile handsets and consumer

electronics devices. mDOC H3 is the new

generation of SanDisk’s successful mDOC

product family, enabling tens of millions of

handsets and other mobile devices since the

year 2000.

mDOC H3 is a hybrid device combining an

embedded thin flash controller and standard

flash memory.

In addition to the high reliability and high

system performance offered by the current

mDOC family of products, mDOC H3 offers

plug-and-play integration, support for multiple

NAND technologies and more features such as

advanced power management schemes.

mDOC H3 uses advanced Multi-Level Cell

(MLC) and binary (SLC) NAND flash

technologies, enhanced by SanDisk’s

proprietary TrueFFS embedded flash

management software running as firmware on

the flash controller.

The breakthrough in performance, size, cost

and design makes mDOC H3 the ideal solution

for mobile handsets and consumer electronics

manufacturers who require easy integration,

fast time to market, high-capacity, small form

factor, high-performance and most importantly,

highly reliable storage.

mDOC H3 enables multimedia driven

applications such as music, photo, video, TV,

GPS, games, email, office and other

applications.

EMBEDDED TRUEFFS

SanDisk’s proprietary TrueFFS flash

management software is now embedded within

the mDOC H3 device and runs as firmware

from the flash controller.

Legacy mDOC Architecture

Host Flash

Controller Flash

+++

mDOC H3 Architecture

Host Flash

Controller Flash

+++

Legacy mDOC Architecture

Host Flash

Controller Flash

+++

Host Flash

Controller Flash

+++

mDOC H3 Architecture

Host Flash

Controller Flash

+++

Host Flash

Controller Flash

+++

Figure 1: TrueFFS - Legacy mDOC vs.

mDOC H3 Architecture

Embedded TrueFFS enables mDOC H3 to

fully emulate a hard disk to the host processor,

Rev. 1.3 mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

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enabling read/write operations that are

identical to a standard, sector-based hard drive.

In addition, Embedded TrueFFS employs

patented methods, such as virtual mapping,

dynamic and static wear-leveling, and

automatic block management to ensure high

data reliability and maximize flash life

expectancy.

Furthermore, it provides performance

enhancements such as multi-plane operations,

DMA support, Burst operation and Dual Data

RAM buffering.

mDOC H3 extended features are enabled by a

small driver that runs on the host side, called

DOC Driver. DOC Driver provides the host

OS with a standard Block Device interface.

The combination of Embedded TrueFFS and

DOC Driver enables a practically Plug & Play

integration in the system.

PLUG-AND-PLAY INTEGRATION

mDOC H3 optimized architecture with

Embedded TrueFFS eliminates the need for

complicated software integration and testing

processes and enables a practically plug-and-

play integration in the system.

The replacement of one mDOC H3 device with

another, of a newer generation, requires

virtually no changes to the host. This makes

mDOC H3 the perfect solution for platforms

and reference designs, as it allows for the

utilization of more advanced NAND Flash

technology with minimal integration or

qualification efforts.

Embedded TrueFFS running from mDOC H3

means there is no need to modify and re-

qualify the flash management software on the

host system, or update mass production tools.

MULTIPLE FLASH SUPPORT

mDOC H3 with Embedded TrueFFS enables

access to advanced binary SLC NAND and

MLC NAND flash technology, making mDOC

H3 the only multi-sourced and multi-

technology EFD.

Embedded TrueFFS overcomes SLC and MLC

NAND-related error patterns by using a robust

error detection and correction (EDC/ECC)

mechanism.

mDOC H3 optimized architecture with

Embedded TrueFFS offers high reliability and

high system performance for whatever flash

technology or density utilized.

MDOC H3 PROVIDES:

 Flash disk for both code and data storage

 Code and data storage protection

 Low voltage:

1.8V Core and I/O

3.3V Core and 3.3V/1.8V I/O (auto-detect)

 Typical Current Consumption

 Turbo mode: 30mA

 Power Save mode: 20mA

 Standby mode: 5mA

 Deep Power-Down mode: 60uA-

110uA

 1Gb (128MB) – 64Gb (8GB) data storage

capacity, with device cascading options for

up to 128Gb (16GB).

 Enhanced Programmable Boot Block

(32KB) enabling eXecute In Place (XIP)

functionality using 16-bit access.

 Small form factors:

 mDOC H3 1Gb/2Gb - 115-ball

Fine-Pitch Ball Grid Array

(FBGA) 9x12mm.

 mDOC H3 4Gb/8Gb - 115-ball

Fine-Pitch Ball Grid Array

(FBGA) 10x14mm.

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 mDOC H3 8Gb/16Gb/32Gb/64Gb

- 115-ball Fine-Pitch Ball Grid

Array (FBGA) 12x18mm

 Ball to ball compatible with

mDOC G3/G4/H1 families.

 Enhanced performance by implementation

of:

 Multi-plane operations

 DMA support

 Burst operation

 Dual Data RAM buffering

 Read/Write Cache

 Fast partition configuration

 Powerful data integrity with a robust Error

Detection Code/Error Correction Code

(EDC/ECC) specifically tailored for the most

advanced flash technology.

 Strong flash endurance with TrueFFS

advanced flash management software.

 Reduced complexity for the host system by

moving flash management functionality to

the device.

 Plug & Play integration with the host

system, due to embedding TrueFFS within

the device itself.

 Support for major mobile operating

systems (OSs), including Symbian OS,

Windows Mobile, Windows CE, Linux and

more.

 Compatibility with major mobile CPUs

 Performance:

 Sustained write: 4-8 MB/sec.

 Sustained read: 15-25 MB/sec

PROTECTION & SECURITY-

ENABLING

 16-byte Unique Identification (UID)

number.

 14 configurable protected partitions for

data and code:

 Write protected

 Read and Write protected

 One Time Programmable (OTP)

 Protection key and LOCK# signal

 Sticky Lock (SLOCK) to lock boot

partition

 Protected Bad Block Table.

RELIABILITY AND DATA INTEGRITY

 Hardware on-the-fly Error Detection

Code/Error Correction Code (EDC/ECC),

based on a BCH algorithm, tailored for the

most advanced flash technology.

 Data integrity after power failure.

 Transparent bad-block management.

 Dynamic and static wear-leveling.

BOOT CAPABILITY

 32KB Programmable Boot Block with XIP

capability to replace boot ROM or NOR.

 254KB Paged RAM IPL

 Boot Agent for automatic download of

boot code to the Programmable Boot

Block.

 Asynchronous Boot mode to enable ARM-

based CPUs, e.g. TI OMAP, Intel PXAxxx,

to boot without the need for external glue

logic.

 Exceptional boot performance with Burst

operation and DMA support enhanced by

external clock.

HARDWARE COMPATIBILITY

 Configurable interface: simple SRAM-like

or multiplexed address/data interface.

 CPU compatibility, including:

 ARM-based CPUs

 Texas Instruments OMAP, DBB

 Marvell PXAxxx family

 Infineon xGold family

 Analog Devices (ADI) digital

Baseband devices

 Freescale i.MXxx Application

processors and i.xx digital

Baseband devices

Rev. 1.3 mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

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 Zoran ER4525

 Renesas SH mobile

 EMP platforms

 Qualcomm MSMxxxx

 Hitachi SuperH™ SH-x

 Supports 16 and 32-bit architectures

EMBEDDED TRUEFFS SOFTWARE

TrueFFS (True Flash File System) is

SanDisk’s field proven patented flash

management software. TrueFFS is embedded

within the mDOC H3 device, providing full

Block Device functionality to the Operating

System (OS) file system via either TrueFFS

7.1 (for supporting both earlier mDOC

products and mDOC H3) or the DOC Driver.

TrueFFS allows for mDOC H3 to appear to the

OS as a regular hard drive, while at the same

time transparently providing robust flash media

management.

 DOC Driver provides full block device

emulation for transparent file system

management

 Disk-like interface

 Dynamic virtual mapping

 Automatic bad block management

 Dynamic and static wear-leveling

 Programming, duplicating and testing tools

available in source code

CAPACITY AND PACKAGING

 1Gb (128MB) – 64Gb (8GB) capacity,

with device cascading option for up to two

devices (128Gb).

 FBGA package: 115 balls, 9x12x1.2 mm

(width x length x height)

 FBGA package: 115 balls, 10x14x1.2 mm

(width x length x height)

 FBGA package: 115 balls, 12x18x1.4 mm

and 12x18x1.2 mm (width x length x

height)

 Ball-out compatible with mDOC G3, G4

and H1 products: Refer to Migration Guide

mDOC G3-P3 G3P3-LP G4 H1 to mDOC

H3 for further details.

OPERATING ENVIRONMENT

 Wide OS support, including:

 Symbian OS

 Windows Mobile

 Windows CE

 Linux

 Nucleus

 OSE

 PalmOS

 DOC Driver Software Development Kit

(SDK) for quick and easy support of

proprietary OSs or OS-less environments.

Rev. 1.3 mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

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REVISION HISTORY

Doc. No Revision Date Description Reference

0.1 January 2006 Preliminary version

RSRVD balls left floating changed

from a recommendation to a

requirement

Section 2

Demux (Standard) I/F Ball H9

changed from RSRVD to VSS

Section 2.2

Ballout change – Some NC balls

removed, resulting in 115 balls for

all products

Section 2.2

Ball H2 changed from DPD to A0 Sections 2.2 and 2.3

Details on internal pull up and pull

down resistors added

Sections 2.2.2 and 2.3.2

DPD signal removed (replaced with

A0, which should be connected to

CPU A0 or to VSS)

Sections 2, 2.2.2 and

2.3.2

Balls G1,H1,J1,K1 marked as

reserved

Ball G4 changed from RSRVD to

VCCQ

Sections 2.2.2 and 2.3.2

Ball D9 changed from NC to

RSRVD

Section 2.3.2

Modes of operation diagram

updated

Section 5

“Normal mode” name changed to

“Turbo mode”

Section 5

8KB address space settings added Section 6.5

Added register addresses for 8KB

address space

Section 7

Burst mode can only be used in

conjunction with mDOC H3 DMA

functionality

Section 9.8.2

Operating Conditions updated Section 10.3

Asynchronous boot mode timing

diagram added

Section 10.3.1

Multiplexed timing updated Section 10.3.4

Section 10.3.5

Power up timing updated Section 10.3.11

92-DS-1205-10

0.2 June 2006

Mechanical drawing updated

(removed balls from 12x18mm

drawing)

Section 10.4.3

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Doc. No Revision Date Description Reference

Ordering information modified Section 11

Refer to Standard Interface as

Demux

Entire Document

Current/Power consumption

numbers modified

Highlights and Section

10.2.3

Number of partitions available

changed from 10 to 14

Highlights and Section

2.1

Note that CLK should be half-

frequency at Power-Save mode

Section 10.3

Added clarifications about

capacitor requirements for different

voltage configurations

Section 9.5

Marking section added Section 0

BUSY#, DMARQ# and IRQ#:

changed from CMOS 3-STATE to

CMOS output and added

clarification about pull ups

Table 1 and Table 2

Key size modified Section 4

Modes of operation section

enhanced

Section 5

mDOC H3 registers section

updated

Section 7

GPIO_TIMER and WARM_RST#

description updated

Entire Document

Synchronous Burst Operation

description modified

Section 9.8.2

Storage temperature modified and

section enhanced

Section 10.2.1

Demux asynchronous read access

time modified; Tdh max added;

Tah, Tw(oeh) and Tw(oel) added

Section 10.3.2

Demux asynchronous write timing

– Tw(wel) and Tw(weh) added

Section 10.3.2

Demux burst read minimal clock

cycle time modified

Section 10.3.6

Mechanical dimensions tolerance

corrected

Section 10.4

Power up timing section updated Section 10.3.12

Max input fall and rise time info

added

Section 10.3.1

1.0 February 2007

Figure modified Figure 9

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Doc. No Revision Date Description Reference

Add 10x14 package size Sections 2.2, 2.3

Paragraph revisited Section 3.5

Change requirement for capacitor

on VCC

Section 9.5

Modified comment 14

Add comment 17

Section 9.5

Added drawings to depict power

connectivity

Section 9.5

Added temperature range for new

products

Section 10.1.1

DC characteristics: added

disclaimer for Icc / Iccs parameters

for new products

Section 10.2.3

Updated parameter Tcesu Sections 10.3.6,

10.3.8

Add 10x14 package mechanical

description

Section 10.4.2

Added note on ball size change of

new products

Sections 10.4.1,

10.4.3

Ordering info section updated Section 11

Added new SanDisk top marking Section 12

128KB window updated Section 6.4

1.1 April/May 2007

Updated DMA transfer timing

diagram

Section 10.3.9

Remove internal pull up of #AVD

signal

Section 2.3.2

Updated Icc max values for new

products

Table 9

Multiplexed Synchronous write

timing updated

Section 10.3.4

Mechanical dimension updated:

ball size reduced for 9x12 package

Section 10.4.1

Marking section revised Section 12

Burst mode section revised Section 9.8.2

92-DS-1205-10 1.2 November 2007

mDOC 8GB product added Entire document

Ordering information updated 11

92-DS-1205-10 1.3 May 2008

Power Failure Management

updated

Section 6.3.4

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TABLE OF CONTENTS

1. Introduction..............................................................................................................................12

2. Product Overview....................................................................................................................13

2.1 Product Description ..........................................................................................................13

2.2 Demux (Standard) Interface .............................................................................................14

2.2.1 9x12/10x14/12x18 FBGA Ball Diagrams ............................................................................14

2.2.2 9x12/10x14/12x18 FBGA Signal Description......................................................................16

2.2.3 System Interface .................................................................................................................19

2.3 Multiplexed Interface.........................................................................................................19

2.3.1 9x12/10x14/12x18 FBGA Ball Diagram ..............................................................................19

2.3.2 9x12/10x14/12x18 FBGA Signal Description......................................................................21

2.3.3 System Interface .................................................................................................................23

3. Theory of Operation ................................................................................................................25

3.1 Overview...........................................................................................................................25

3.2 Host Interface ...................................................................................................................26

3.2.1 Demux (NOR-Like) Interface...............................................................................................26

3.2.2 Multiplexed Interface ...........................................................................................................26

3.2.3 Serial Interface ....................................................................................................................27

3.3 Host Agent........................................................................................................................27

3.3.1 Host Protocol.......................................................................................................................27

3.3.2 Boot Block (XIP)..................................................................................................................27

3.4 Boot Agent........................................................................................................................27

3.5 Error Detection Code/Error Correction Code (EDC/ECC) ................................................28

3.6 Block Device Management...............................................................................................28

4. Data Protection and Security-Enabling features..................................................................29

4.1.1 Read/Write-Protected partitions..........................................................................................29

4.1.2 LOCK# signal ......................................................................................................................29

4.1.3 Sticky Lock (SLOCK) ..........................................................................................................29

4.1.4 Unique Identification (UID) Number ....................................................................................30

4.1.5 One-Time Programmable (OTP) Partitions.........................................................................30

5. mDOC H3 Modes of Operation...............................................................................................31

5.1 Reset State.......................................................................................................................32

5.2 Turbo Mode ......................................................................................................................32

5.3 Power Save Mode ............................................................................................................32

5.4 Standby Mode...................................................................................................................32

5.5 Deep Power-Down Mode..................................................................................................33

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6. Embedded TrueFFS Technology............................................................................................34

6.1 General Description..........................................................................................................34

6.2 Operating System Support ...............................................................................................34

6.3 DOC Driver Software Development Kit (SDK)..................................................................35

6.3.1 File Management ................................................................................................................35

6.3.2 Bad-Block Management......................................................................................................35

6.3.3 Wear-Leveling .....................................................................................................................35

6.3.4 Power Failure Management ................................................................................................36

6.3.5 Error Detection/Correction ..................................................................................................36

6.3.6 Special Features through I/O Control (IOCTL) Mechanism................................................36

6.3.7 Compatibility........................................................................................................................37

6.4 128KB Memory Window ...................................................................................................37

6.5 8KB Memory Window .......................................................................................................39

7. mDOC H3 Registers ................................................................................................................40

7.1 Definition of Terms............................................................................................................40

7.2 Reset Values ....................................................................................................................40

7.3 Registers Description........................................................................................................41

7.3.1 Paged RAM Command Register.........................................................................................41

7.3.2 Paged RAM Select Register ...............................................................................................41

7.3.3 Paged RAM Unique ID Download Register ........................................................................42

7.3.4 Chip Identification (ID) Register [0:1] ..................................................................................42

7.3.5 Burst Mode Control Registers (Read & Write) ....................................................................42

7.3.6 Burst Write Mode Exit Register...........................................................................................43

7.3.7 DPD Wakeup Trigger Register............................................................................................43

7.3.8 DPD Activation Register......................................................................................................44

7.3.9 DMA Control Register .........................................................................................................44

7.3.10 DMA Negation Register ......................................................................................................45

7.3.11 Software Lock Register .......................................................................................................45

7.3.12 Endian Control Register ......................................................................................................46

8. Booting from mDOC H3 ..........................................................................................................47

8.1 Introduction.......................................................................................................................47

8.1.1 Asynchronous Boot Mode ...................................................................................................48

8.1.2 Paged RAM Boot ................................................................................................................48

9. Design Considerations ...........................................................................................................49

9.1 General Guidelines...........................................................................................................49

9.2 Configuration ....................................................................................................................49

9.3 Demux (Standard) Interface .............................................................................................49

9.4 Multiplexed Interface.........................................................................................................50

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9.5 mDOC H3 Power Supply Connectivity .............................................................................51

9.6 Connecting Control Signals ..............................................................................................55

9.6.1 Demux Interface..................................................................................................................55

9.6.2 Multiplexed Interface ...........................................................................................................55

9.7 Implementing the Interrupt Mechanism ............................................................................56

9.7.1 Hardware Configuration ......................................................................................................56

9.7.2 Software Configuration........................................................................................................56

9.8 DMA and Burst Operation.................................................................................................56

9.8.1 DMA Operation ...................................................................................................................56

9.8.2 Synchronous Burst Operation .............................................................................................57

9.9 Device Cascading.............................................................................................................60

9.10 Platform-Specific Issues ...................................................................................................61

9.10.1 Wait State............................................................................................................................61

9.10.2 Big and Little Endian Systems ............................................................................................61

9.10.3 Busy Signal .........................................................................................................................61

9.10.4 Working with 16/32-Bit Systems .........................................................................................61

9.11 Design Environment .........................................................................................................63

10. Product Specifications............................................................................................................64

10.1 Environmental Specifications............................................................................................64

10.1.1 Operating Temperature.......................................................................................................64

10.1.2 Thermal Characteristics ......................................................................................................64

10.1.3 Humidity ..............................................................................................................................64

10.2 Electrical Specifications....................................................................................................64

10.2.1 Absolute Maximum Ratings ................................................................................................64

10.2.2 Capacitance ........................................................................................................................65

10.2.3 DC Characteristics ..............................................................................................................65

10.3 Timing Specifications........................................................................................................68

10.3.1 Operating Conditions ..........................................................................................................68

10.3.2 Demux Asynchronous Read Timing ...................................................................................69

10.3.3 Demux Asynchronous Write Timing....................................................................................70

10.3.4 Multiplexed Asynchronous Read Timing.............................................................................70

10.3.5 Multiplexed Asynchronous Write Timing.............................................................................71

10.3.6 Demux Burst Read Timing ..................................................................................................72

10.3.7 Demux Burst Write Timing ..................................................................................................73

10.3.8 Multiplexed Burst Read Timing ...........................................................................................74

10.3.9 DMA Request Timing Diagram ...........................................................................................75

10.3.10 SPI Timing...........................................................................................................................76

10.3.11 Power Supply Sequence.....................................................................................................77

10.3.12 Power-Up Timing ................................................................................................................77

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10.4 Mechanical Dimensions....................................................................................................79

10.4.1 mDOC H3 1Gb (128MB)/2Gb (256MB) ..............................................................................79

10.4.2 mDOC H3 4Gb (512MB)/8Gb (1GB) ..................................................................................80

10.4.3 mDOC H3 8Gb (1GB)/ 16Gb (2GB)/ 32Gb (4GB) / 64Gb (8GB)........................................81

11. Ordering Information...............................................................................................................82

12. Markings...................................................................................................................................83

12.1 mDOC H3 1Gb (128MB)...................................................................................................83

12.2 mDOC H3 2Gb (256MB)/ 4Gb (512MB)/ 8Gb (1GB)/ 16Gb (2GB)/ 32Gb (4GB) / 64Gb

(8GB) .........................................................................................................................................84

Disclaimer of Liability ...................................................................................................................85

Rev. 1.3

Introduction

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

1. INTRODUCTION

This data sheet includes the following sections:

Section 1: Introduction and overview of data sheet contents

Section 2: Product overview, including a brief product description, ball diagrams and signal

descriptions

Section 3: Theory of operation for the major building blocks

Section 4: Data protection and security enabling features overview

Section 5: Detailed description of modes of operation

Section 6: Embedded TrueFFS Technology overview, including power failure management

and 8KB/128KByte memory window

Section 7: mDOC H3 register descriptions

Section 8: Overview of how to boot from mDOC H3

Section 9: Hardware and software design considerations

Section 10: Environmental, electrical, timing and product specifications

Section 11: Information on ordering mDOC H3

Section 12: Marking information

For additional information on SanDisk’s flash disk products, please contact one of the offices

listed on the back page.

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

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2. PRODUCT OVERVIEW

2.1 Product Description

mDOC H3 is the latest addition to SanDisk’s mDOC product family. mDOC H3, packaged in a

small FBGA package and offering densities ranging from 1Gb (128MB) to 16Gb (2GB), is a

hybrid device with an embedded flash controller and high capacity flash memory. It uses

advanced Flash technologies, enhanced by SanDisk’s proprietary TrueFFS embedded flash

management software.

All mDOC H3 devices are ball to ball compatible. The replacement of one mDOC H3 device

with another of a newer generation requires virtually no changes to the host. This makes mDOC

H3 the perfect solution for platforms and reference designs, as it allows for the utilization of

more advanced NAND Flash technology and new mDOC functionality with minimal integration

efforts.

mDOC H3 has a 32KB Programmable Boot Block. This block provides eXecute In Place (XIP)

functionality, enabling mDOC H3 to replace the boot device and to function as the only

non-volatile memory device on-board. Eliminating the need for an additional boot device

reduces hardware expenditures, board real estate, programming time, and logistics. The Paged

RAM IPL feature separates the Boot Block into sections: The first section provides constant

data, while the other sections (up to 254KB) can be loaded with data that is automatically

downloaded from the flash. One application of this feature is to support processors’ secure boot

requirements.

Sandisk’s proprietary TrueFFS flash management software overcomes NAND-related error

patterns by using a robust error detection and correction (EDC/ECC) mechanism. Furthermore, it

provides performance enhancements such as multi-plane operations, DMA support, Burst

operation and Dual Data RAM buffering.

The new generation of patented flash management software, Embedded TrueFFS, is run on the

embedded thin controller of the mDOC H3 device, instead of on the host. This results in

improvements in performance, ease of integration and overall utilization of latest NAND

technologies. Embedded TrueFFS guarantees high reliability and isolates all the complexity of

flash management from the host SW.

Embedded TrueFFS enables mDOC H3 to fully emulate a hard disk to the host processor,

enabling read/write operations that are identical to a standard, sector-based hard drive. In

addition, Embedded TrueFFS employs patented methods, such as virtual mapping, dynamic and

static wear-leveling, and automatic bad block management to ensure high data reliability and

maximize flash life expectancy. mDOC H3 extended features are enabled by a small driver that

runs on the host side, called DOC Driver. DOC Driver provides the host O/S with a standard

Block Device interface, together with APIs for mDOC H3’s extended features. The combination

of Embedded TrueFFS and DOC Driver practically enables Plug and Play integration.

mDOC H3 offers extended content protection and security-enabling features. Up to 14 write

protected, read-and-write protected, or One Time Programmable (OTP) partitions can be

configured independently for maximum design flexibility. A 16-byte Unique ID (UID) identifies

each device, eliminating the need for a separate ID device on the motherboard. The combination

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

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of these features enables mDOC H3 to implement better security schemes to protect the code and

data it stores.

mDOC H3 can be configured to work with either demux (standard) interface or multiplexed

(MUX) interface. Using a multiplexed interface where data and address lines are multiplexed on

the same lines, reduces the number of signals required to connect mDOC H3 to the CPU.

The combination of unique H3 design, latest NAND technology and Embedded TrueFFS results

in a low-cost, minimal-sized flash disk that achieves unsurpassed reliability levels, enhanced

performance and ease of integration.

This breakthrough in performance, size, cost and design makes mDOC H3 the ideal solution for

mobile handsets and consumer electronics manufacturers who require easy integration, fast time

to market, high-capacity, small size, high-performance and, above all, high-reliability storage to

enable multimedia driven applications such as music, photo, video, TV, GPS, games, email,

office and other applications.

mDOC H3 offers advanced power consumption management throughout the selection of

different operating modes. The operating modes of the mDOC H3 device are designed to be

easily controlled by the chipset and DOC Driver to ensure optimal battery life in mobile devices.

mDOC H3 can be placed in any of the following four operating modes:

• Turbo mode - While in Turbo mode, device internal clocks are optimized for maximal

performance.

• Power Save mode – While in Power Save mode, device internal clocks are optimized to

balance between device performance and power consumption.

• Standby mode – While in Standby mode, the clock of most internal cores is either

disconnected or reduced to a minimum. There is no wake-up time penalty.

• Deep Power Down (DPD) mode - While in Deep Power-Down mode, device quiescent

power dissipation is reduced by disabling internal high current consumers (e.g. flash,

voltage regulators, input buffers, oscillator etc.)

The power management flexibility of mDOC H3 allows for the system designers to substantially

reduce the power consumption of the mDOC device, based on the requirements of the mobile

device, to effectively and considerably prolong battery life.

2.2 Demux (Standard) Interface

2.2.1 9x12/10x14/12x18 FBGA Ball Diagrams

Figure 2 shows the mDOC H3 115 ball demux interface ball diagram.

To ensure proper device functionality, balls marked RSRVD are reserved for future use and

should be connected as described in Table 1, Section 2.2.2.

Note: mDOC H3 is designed as a ball to ball compatible with mDOC G3, G4 and H1 products,

assuming that the latter were integrated according to the guidelines in the migration

guide. Refer to Migration Guide mDOC G3-P3 G3P3-LP G4 H1 to mDOC H3, for

further information.

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

15 92-DS-1205-10

9x12/10x14/12x18 FBGA Package

Figure 2: Demux Interface Ball Diagram for 9x1 2, 10x14 and 1 2x18 FBGA – Top View

D5D2D 8 D11 D14

13 C- LOCK#

2 BUSY#RSRVD

WARM

RST #

D4 D15D3CE # D9 D13

VCCQD 0 SCLK

RSRVD D10 VCC D12

RSRVDRSRVD RSRVDRSRVD RSRVD RSRVD RSRVDRSRVD RSRVD RSRVD

NCNC RSRVD NC

8VSS VCC2WE#

6 C+

12VCC1RSTIN#

SCS#

1 IRQ # ID0

4 VCCQ

10NCNCRSRVD

VSS D1RSRVD D6NCNC SO

NC NC NCRSRVD

NC NC NCNC

RSRVD RSRVD RSRVD RSRVDRSRVD RSRVD RSRVD RSRVD RSRVD

RSRVD RSRVD

RSRVD

VSS

RSRVD

RSRVD RSRVD RSRVD RSRVD

RSRVD

GPIO

TIMER

CLK

DMARQ#

RSRVD

VSS

OE #

RSRVD

9 101 2 3 4 5 6 7 8

Rev. 1.3

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mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

16 92-DS-1205-10

2.2.2 9x12/10x14/12x18 FBGA Signal Description

mDOC H3 (115 ball) package ball designations are listed in the signal descriptions, presented in

logic groups, in Table 1.

Table 1: Demux Interface Signal Description

Signal Ball No. Signal Type1 Description Signal

Direction

System Interface

A[16:15]

A[14:13]

A[12:11]

A[10:8]

A[7:4]

A[3:0]

F10, E10

E4, F4

E8, D8

G7, F7, D7

D3, E3,

F3, G3

E2, F2,

G2, H2

A[12:0] ST

A[16:13]IN/PD Address bus.

Input

D[7:6]

D[5:3]

D[2:0]

K8, H7

L7, J6, J5

L4, H4, K3

Data bus, low byte.

Input/output

D[15:14]

D[13:12]

D[11:8]

J8, L8

J7, K7

L5, K4, J4,

Data bus, high byte.

Input/output

CE# J2 ST Chip Enable, active low. Input

OE# J3 ST Output Enable, active low. Input

WE# D6 ST Write Enable, active low Input

Configuration

GPIO_TIMER E1 ST/PU RSRVD. This signal may be left floating or

pulled up.

Input/output

ID0 G8 PD

Identification. Configuration control to

support up to two chips cascaded in the

same memory window.

Chip 1: ID0 = VSS

Chip 2: ID0 = VCCQ

Input

LOCK# F8 ST

Lock, active low. When active, provides full

hardware data protection of selected

partitions.

Input

Control

WARM_RST# J9 ST/PU RSRVD. This signal may be left floating or

pulled up.

Input

BUSY# F5 CMOS output

Busy. Active low. Indicates that mDOC is

initializing and should not be accessed5

Output

RSTIN# E5 ST/PU Reset, active low. input

Rev. 1.3

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mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

17 92-DS-1205-10

Signal Ball No. Signal Type1 Description Signal

Direction

CLK L6 ST

External clock input used for burst mode

data transfers. If not used may be left

floating.

Input

DMARQ# H8 CMOS output

DMA request. If not used may be left

floating5.

Output

IRQ# G9 CMOS output

Interrupt Request. Active low. If not used

may be left floating. 5

Output

Serial Interface

SCS# G10

ST/PU/CMOS 3-

STATE

Serial Interface chip select. Active low. If not

used may be left floating.

Input/Output

SO H10

ST/PU/CMOS 3-

STATE

Serial Interface data out (In Serial slave

mode) 2. If not used may be left floating.

Output/Input

SI J10

ST/PU/CMOS 3-

STATE

Serial Interface data in (In serial slave mode)

2. If not used may be left floating.

Input/Output

SCLK K10

ST/PU/CMOS 3-

STATE

Serial Interface clock. If not used may be left

floating.

Input/Output

Power

VCC2 D5 - Internal supply. Supply

VCC1 E7 - Internal supply. Supply

VCCQ K6, G4 - I/O power supply.

Supply

VCC K5 - Device supply. Supply

VSS D4, H3,

H9, K9

- Ground. All VSS balls must be connected. Supply

C+ E6 - C1 capacitor positive terminal3. Supply

C- F6 - C1 capacitor negative terminal3. Supply

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

18 92-DS-1205-10

Signal Ball No. Signal Type1 Description Signal

Direction

Reserved

C2, C3,

C4, C5,

C6, C7,

C8, C9,

C10, D1,

D2, D9,

D10, E9,

F1, F9,

G1, H1,

J1, K1, K2,

L2, L9,

L10, M2,

M3, M4,

M5,

M6,M7,

M8, M9,

M10

All reserved signals are not connected

internally, and if not identified in this

document then it is recommended to leave

them floating to guarantee forward

compatibility with future products. They

should not be connected to arbitrary signals,

and must not be connected to GND

P1 ST/PU

Test Data In (JTAG).

Used for dedicated developer product only4.

Input

M1 CMOS output

Test Data Out (JTAG).

Used for dedicated developer product only4.

Output

L1 ST/PU

Test Mode Select (JTAG)

Used for dedicated developer product only4.

Input

RSRVD

N1 ST/PU

Test Clock (JTAG).

Used for dedicated developer product only4.

Input

Mechanical

A1, A2,

A9, A10,

B1, B2,

B9, B10,

G5, G6,

H5, H6,

N2, N9,

N10, P2,

P9, P10

Not Connected.

1. The following abbreviations are used: ST - Schmitt Trigger input. IN/PD – CMOS input with internal pull down resistor (77KΩ to 312KΩ;

135KΩ typical), which is enabled only when 8KB memory window is in use, ST/PU - Schmitt Trigger input with internal pull up resistor

(95KΩ to 261 KΩ; 149 KΩ typical).

2. When mDOC H3 is used as a Master device, SO is used for Serial Interface Data In, and SI is used for Serial Interface Data Out.

3. The capacitor is required only for 1.8V Core and 1.8V I/O configuration. Please see section 9.5 for further details.

4. The RSRVD JTAG balls will only be enabled on special versions of the mDOC H3 devices that will be used for debugging severe system

problems. In order to support this feature, the JTAG balls should be brought out to a separate header or test points. The JTAG RSRVD

balls must not be connected to the JTAG scan chain that is used for the rest of the PCB. If not used they should be left floating.

5. BUSY#, DMARQ# and IRQ# should not be pulled up to any voltage higher than VCCQ. A pull-up resistor is required if this pin will be

connected to an input. A 10K ohm resistor to Vccq is recommended, however the exact value depends on system power, timing and signal

integrity requirements.

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

19 92-DS-1205-10

2.2.3 System Interface

See Figure 3 for a simplified I/O diagram of a Demux interface to mDOC H3. The power

connections and capacitors in this diagram are for illustration only. For detailed

recommendations regarding power connections and required capacitors, please refer to section

9.5.

For power connectivity please refer to mDOC H3 power supply connectivity in section 9.5.

Figure 3: Demux Interface Sim plified I/O Diagram

2.3 Multiplexed Interface

2.3.1 9x12/10x14/12x18 FBGA Ball Diagram

Figure 4 shows the mDOC H3 115 ball multiplexed interface ball diagram. To ensure proper

device functionality, balls marked RSRVD are reserved for future use and should be connected

as described in Table 2, Section 2.3.2.

Note: mDOC H3 designed as a ball to ball compatible with mDOC G3, G4 and H1 products, assuming that the

latter were integrated according to the guidelines in the migration guide. Refer to mDOC G3-P3 G3P3 -LP

G4 and H1 to mDOC H3 Migration Guide, for further information.

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

20 92-DS-1205-10

9x12/10x14/12x18 FBGA Package

Figure 4 : Multiplexed Interface Ball Diagram for 9x12/10x14/12x18 FBGA – Top View

D 8

D11

D14

VSSVSS C- LOCK#VSS BUSY#RSRVD VSS

WARM

RST #

D15

D3CE #

D13

VCCQ

D 0 SCLK

RSRVD

D10 VCC

D12

RSRVDRSRVD RSRVDRSRVD RSRVD RSRVD RSRVDRSRVD RSRVD RSRVD

NCNC RSRVD NC

VSSVSS VCC2WE# VSSVSS

VSS C+ VSSVCC1RSTIN#VSS VSS

VSS

SCS#VSS IRQ # ID0VSS VCCQ VSSNCNCRSRVD

VD #

D1RSRVD

D6NCNC SO

NC NC NCRSRVD

NC NC NCNC

RSRVD RSRVD RSRVD RSRVDRSRVD RSRVD RSRVD RSRVD RSRVD

RSRVD RSRVD

RSRVD

VSS

RSRVD

RSRVD RSRVD RSRVD RSRVD

RSRVD

GPIO

TIMER

CLK

DMARQ#

VSS VSS

OE #

RSRVD RSRVD

9 101 2 3 4 5 6 7 8

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

21 92-DS-1205-10

2.3.2 9x12/10x14/12x18 FBGA Signal Description

mDOC H3 FBGA related ball designations are listed in the signal descriptions, presented in logic

groups, in Table 2.

Table 2: Signal Descriptions for Multiplexed Interface

Signal Ball No. Signal Type1Description Signal

Direction

System Interface

AD[15:12]

AD[11:8]

AD[7:4]

AD[3:0]

J8, L8, J7,

L5, K4, J4,

K8, H7,

L7,J6 J5,

L4, H4, K3

Multiplexed bus. Address and data signals.

Input

CE# J2 ST Chip Enable, active low. Input

OE# J3 ST Output Enable, active low. Input

WE# D6 ST Write Enable, active low Input

Configuration

GPIO_TIMER E1 ST/PU RSRVD. This signal may be left floating or

pulled up.

Input/output

AVD# H9 ST Address Valid strobe. Set multiplexed

interface.

Input

ID0 G8

PD Identification. Configuration control to support

up to two chips cascaded in the same memory

window.

Chip 1: ID0 = VSS

Chip 2: ID0 = VCCQ

Input

LOCK# F8

ST Lock. Active low. When active, provides full

hardware data protection of selected

partitions.

Input

Control

WARM_RST# J9 ST/PU RSRVD. This signal may be left floating or

pulled up.

Input

BUSY# F5

CMOS output

Busy. Active low. Indicates that mDOC is

initializing and should not be accessed. 5

Output

RSTIN# E5 ST/PU Reset, active low. Input

CLK L6 ST External clock input used for burst mode data

transfers. If not used may be left floating.

Input

DMARQ# H8

CMOS output

DMA request. If not used may be left floating. 5 Output

IRQ# G9

CMOS output Interrupt Request. Active low. If not used may

be left floating. 5

Output

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

22 92-DS-1205-10

Signal Ball No. Signal Type1Description Signal

Direction

Serial Interface

SCS# G10

ST/PU/CMOS

3-STATE

Serial Interface chip select. Active low. If not

used may be left floating.

Input/Output

SO H10

ST/PU/CMOS

3-STATE

Serial Interface data out (In Serial slave

mode)2. If not used may be left floating.

Output/Input

SI J10

ST/PU/CMOS

3-STATE

Serial Interface data in (In Serial slave mode)2.

If not used may be left floating.

Input/Output

SCLK K10

ST/PU/CMOS

3-STATE

Serial Interface clock. If not used may be left

floating.

Input/Output

Power

VCC2 D5 - Internal supply. Supply

VCC1 E7 - Internal supply. Supply

VCCQ K6, G4 - I/O power supply. Supply

VCC K5 - Device supply. Supply

VSS D3, D4, D7,

D8, E2, E3,

E4 E8, E10,

F2, F3, F4,

F7, F10, G2,

G3, G7, H2,

H3, K9,

- Ground. All VSS balls must be connected. Supply

C+ E6 - C1 capacitor positive terminal3. Supply

C- F6 - C1 capacitor negative terminal3. Supply

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

23 92-DS-1205-10

Signal Ball No. Signal Type1Description Signal

Direction

Reserved

C2, C3, C4,

C5, C6, C7,

C8, C9,

C10, D1,

D2, D9,

D10, E9, F1,

F9, G1, H1,

J1, K1, K2,

L2, L9, L10,

M2, M3, M4,

M5, M6,M7,

M8, M9,

M10

All reserved signals are not connected

internally, and if not identified in this document

then it is recommended to leave them floating

to guarantee forward compatibility with future

products. They should not be connected to

arbitrary signals.

P1 ST/PU Test Data In (JTAG).

Used for dedicated developer product only4.

Input

M1 CMOS output Test Data Out (JTAG).

Used for dedicated developer product only4.

Output

L1 ST/PU Test Mode Select (JTAG)

Used for dedicated developer product only4.

Input

RSRVD

N1 ST/PU Test Clock (JTAG).

Used for dedicated developer product only4.

Input

Mechanical

A1, A2, A9,

10, B1, B2,

B9, B10,

G5, G6, H5,

H6, N2, N9,

N10, P2,

P9, P10

Not Connected.

1. The following abbreviations are used: ST - Schmidt Trigger input. IN/PD – CMOS input with internal pull down resistor (77KΩ to 312KΩ;

135KΩ typical), which is enabled only when the 8KB memory window is in use, ST/PU - Schmitt Trigger input with internal pull up

resistor (95KΩ to 261 KΩ; 149 KΩ typical).

2. When mDOC H3 is used as a Master device, SO is used for Serial Interface Data In, and SI used for Serial Interface Data Out.

3. The capacitor is required only for 1.8V Core and 1.8V I/O configuration. Please see section 9.5 for further details.

4. The RSRVD JTAG balls will only be enabled on special versions of the mDOC H3 devices that will be used for debugging severe system

problems. In order to support this feature, the JTAG balls should be brought out to a separate header or test points. The JTAG RSRVD

balls must not be connected to the JTAG scan chain that is used for the rest of the PCB. If not used they should be left floating.

5. BUSY#, DMARQ# and IRQ# should not be pulled up to any voltage higher than VCCQ. A pull-up resistor is required if this pin will be

connected to an input. A 10K ohm resistor to Vccq is recommended, however the exact value depends on system power, timing and signal

integrity requirements.

2.3.3 System Interface

See Figure 5 for a simplified I/O diagram of multiplexed interface mDOC H3. The power

connections and capacitors in this diagram are for illustration only. For detailed

recommendations regarding power connections and required capacitors, please refer to section

9.5.

Rev. 1.3

Product Overvie

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

24 92-DS-1205-10

For power connectivity please refer to mDOC H3 power supply connectivity in section 9.5.

Figure 5: Multiplexed Interface Simplified I/O Diagram

Rev. 1.3

Theory of Operation

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

25 92-DS-1205-10

3. THEORY OF OPERATION

3.1 Overview

mDOC H3 consists of the following major functional blocks, as shown in Figure 6.

Figure 6: Simplified Block Diagram

These components are described briefly below and in more detail in the following sections.

• Host IF – Host physical interface block. Includes the following interfaces: Demux

(Standard), Multiplexed, and Serial.

• Host Agent – Logical host interface supporting the host protocol and Programmable

Boot Block with XIP functionality.

• Flash Partition Management – High level management of the Flash media,

managing flash logical partitions, and their attributes.

• Flash BD Management – Management of the Flash media at a Block Device level,

primarily performing logical to physical address translation.

• Boot Agent – Management of host boot sequence – Loading of Boot code from flash

media upon power up.

• ECC / EDC - Error Detection and Error Correction Codes (EDC/ECC) - On-the-fly

Flash error handling.

• Data Buffer – 4KB Dual-Port RAM memory, used as a pipeline buffer, for enhanced

data transfer rate.

• Flash Agent – Provides High level Flash management functions and sequences for

Flash control and error condition handling.

Rev. 1.3

Theory of Operation

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

26 92-DS-1205-10

• Flash IF – Physical interface to the Flash Media.

• Power and Timing – Analog and clock circuits to provide power and timing for the

H3 controller and flash.

• Embedded CPU – Runs Embedded TrueFFS SW and mDOC H3 controller

firmware.

3.2 Host Interface

3.2.1 Demux (NOR-Like) Interface

The host interface block provides an easy-to-integrate NOR-like (also SRAM and EEPROM-

like) interface to mDOC H3, enabling various CPU interfaces, such as a local bus, ISA bus, NOR

interface, SRAM interface, EEPROM interface or any other compatible interface. In addition, the

NOR-like interface enables direct access to the Programmable Boot Block to permit XIP

(Execute-In-Place) functionality during system initialization.

A1-A16 address lines enable access to the mDOC H3 128KB memory window. When migrating

from mDOC G3/G4/H1 without changing the PCB, thus using only A1-A12 address lines,

mDOC H3 exports 8KB memory window, like in mDOC G3/G4 and H1.

The Chip Enable (CE#), Write Enable (WE#) and Output Enable (OE#) signals trigger read and

write cycles. A write cycle occurs while both the CE# and the WE# inputs are asserted.

Similarly, a read cycle occurs while both the CE# and OE# inputs are asserted. Note that mDOC

H3 does not require a clock signal. The CE#, WE# and OE# signals trigger the controller (e.g.,

system interface block, bus control and data pipeline) and flash access.

The Reset-In (RSTIN#) and Busy (BUSY#) control signals are used in the reset phase.

The Interrupt Request (IRQ#) signal is used to indicate completion of assorted operations. Using

this signal frees the CPU to run other tasks, continuing read/write operations with mDOC H3

only after the IRQ# signal has been asserted and an interrupt handling routine (implemented in

the OS) has been called to return control to the DOC Driver.

The DMARQ# output is used to control DMA operations, and the CLK input is used to support

Burst operation when reading flash data. See Section 10.3 for further information.

3.2.2 Multiplexed Interface

In this configuration, the address and data signals are multiplexed. The AVD# input is driven by

the host AVD# signal, and the D[15:0] signals, used for both address inputs and data, are

connected to the host AD[15:0] bus. While AVD# is asserted, the host drives AD[15:0] with bits

[16:1] of the address.

This interface is automatically used when a falling edge is detected on AVD#. This edge must

occur after RSTIN# is de-asserted and before the first read or write cycle to the controller.

Rev. 1.3

Theory of Operation

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

27 92-DS-1205-10

3.2.3 Serial Interface

The Serial interface (SPI) provides mDOC H3 a secondary interface with debug and

programming capabilities. mDOC H3 SPI Interface is configured as Slave. All four combinations

of clock phase (CPHA) and clock polarity (CPOL) which are defined by the SPI specification are

supported.

The Serial interface supports two usage scenarios:

1. Debug port: Allowing the host with an SPI interface to read debug messages.

2. Format and Program port: Allowing a programmer to use this port in order to format and

program the device.

The serial protocol debug port provides a means for the serial interface (SPI Slave) to queue and

transmit debug messages to a host equipped with an SPI interface.

All transfers are performed in multiples of 8 bits, with the MSB of each byte transmitted first.

3.3 Host Agent

3.3.1 Host Protocol

Block of registers and logic required for implementing block device operations over the host

interface. This block implements a set of complex transactions required for operating the mDOC

H3 device. These transactions include data storage operations as well as device configuration and

management.

3.3.2 Boot Block (XIP)

The Programmable Boot Block with XIP functionality enables mDOC H3 to act as a boot device

(in addition to performing flash disk data storage functions). This eliminates the need for

expensive, legacy NOR flash or any other boot device on the motherboard.

The Programmable Boot Block is 32KB in size. The Boot Agent, described in the next section, is

responsible for copying the boot code/data from the flash into the boot block.

3.4 Boot Agent

Upon power-up or when the RSTIN# signal is de-asserted, the Boot Agent automatically

downloads the Initial Program Loader (IPL) to the Programmable Boot Block. The IPL contains

the code for starting the Host boot process. The download process is quick, and is designed so

that when the CPU accesses mDOC H3 for code execution, the IPL code is already located in the

Programmable Boot Block. During the download process, mDOC H3 does not respond to read or

write accesses. Host systems must therefore observe the requirements described in Section

10.3.12.

During the download process, mDOC H3 asserts the BUSY# signal to indicate to the system that

it is not yet ready to be accessed. Once BUSY# is de-asserted, the system can access mDOC H3.

Note that after IPL is loaded and BUSY# is de-asserted, the Boot Agent continues to download

the embedded TrueFFS from Flash to the mDOC H3 internal RAM, and then executes it.

Downloading the embedded TrueFFS is done in parallel to the host system accessing the IPL

Rev. 1.3

Theory of Operation

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

28 92-DS-1205-10

code. During the time between BUSY# signal de-assertion and completing the download of

Embedded TrueFFS, mDOC H3 will respond only to accesses to the XIP Boot Block (including

Paged RAM accesses) in order to facilitate completion of the IPL execution.

Once Embedded TrueFFS is loaded, executed and has completed its media mount process,

mDOC H3 is ready to be used as a fully functional storage device.

3.5 Error Detection Code/Error Correction Code (EDC/ECC)

Since NAND-based flash is prone to errors, it requires unique error-handling capabilities to

ensure required reliability. SanDisk’s TrueFFS technology, embedded within mDOC H3,

includes a powerful Error Detection Code / Error Correction Code (EDC/ECC), based on the

Bose, Chaudhuri and Hocquenghem (BCH) algorithm. Both EDC and ECC are implemented in

hardware to optimize performance.

Each time a 512-byte sector is written, additional parity bits are calculated and written to the

flash. Each time data is read from the flash, the parity bits are read and used for calculating error

locations.

It ensures that the minimal amount of code is used for detection and correction to deliver the

required reliability without degrading performance.

3.6 Block Device Management

Block device management is performed by an embedded SW module, responsible for execution

of all Block Device operations, such as address calculation, erase, read and writes operations etc.

This module translates these operations from virtual media terms (i.e. sector addresses) to flash

media terms (i.e. flash planes, blocks and pages).

These Block Device operations are typically initiated by the host File System, translated by the

DOC Driver and sent to the device over the host interface. The Host Agent (above) is responsible

for capture and transfer to the Block Device management.

Rev. 1.3

Data Protection and Security-Enabling features

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

29 92-DS-1205-10

4. DATA PROTECTION AND SECURITY-ENABLING FEATURES

4.1.1 Read/Write-Protected partitions

Data and code protection is implemented on a per-partition basis. The user can configure each

partition as read protected, write protected, or read and write protected.

A protected partition may be protected by either/both of these mechanisms:

• Up to 64 bit protection key

• Hard-wired LOCK# signal

• Sticky lock (SLOCK)

In order to set or remove read/write protection, the protection key must be used as follows:

• Insert the protection key to remove read/write protection

• Remove the protection key to set read/write protection

The only way to read or write from/to a partition that is protected against read or write, is to

insert the key. This is also true for modifying its attributes (protection key, read, write and lock).

Read/write access is disabled (the key is automatically removed) in each of the following events:

• Power-down

• Removal of the protection key

For further information on protection, please refer to the DOC Driver 1.0 Block Device (BD)

Software Development Kit (SDK) developer guide.

4.1.2 LOCK# signal

mDOC H3 has an additional hardware safety measure. If the Lock option is enabled for a

specific partition, and the LOCK# signal is asserted, the protected partition has an additional

hardware lock that prevents read/write access to the partition, even with the use of the correct

protection key.

4.1.3 Sticky Lock (SLOCK)

It is possible to set the Lock protection for one session only; that is, until the next power-up or

reset. This Sticky Lock feature can be useful when the boot code in the boot partition must be

read/write protected. Upon power-up, the boot code must be unprotected so the CPU can run it

directly from mDOC H3. At the end of the boot process, protection can be set until the next

power-up or reset. This is done by setting the Sticky Lock (SLOCK) bit in the Software Lock

Once set, SLOCK can only be cleared by asserting the RSTIN# input. Like the LOCK# input,

assertion of this bit prevents the protection key from disabling the protection for a given

partition. There is no need to mount the partition prior to this operation.

Rev. 1.3

Data Protection and Security-Enabling features

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

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4.1.4 Unique Identification (UID) Number

Each mDOC H3 is assigned a 16-byte UID number. Burned onto the flash during production, the

UID cannot be altered and is worldwide unique. The UID is essential for security-related

applications, and can be used to identify end-user products in order to fight fraudulent

duplication by imitators.

4.1.5 One-Time Programmable (OTP) Partitions

OTP feature is implemented on a per-partition basis, for full flexibility. Once a partition has been

defined as OTP (upon initial media-formatting), it can be written only once, after which it is

automatically and permanently locked. After it is locked, the OTP partition becomes read only,

just like a ROM device.

Regardless of the state of any of the LOCK options, OTP partitions cannot be erased.

Typically, the OTP partition is used to store customer and product information such as: product

ID, software version, production data, customer ID, PKI keys, service provider information and

tracking information.

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5. MDOC H3 MODES OF OPERATION

Figure 7 shows the different modes of mDOC H3 device operation and the interchange between

optional modes.

mDOC H3 can operate in any one of five basic power modes/states:

• Reset state

• Turbo mode

• Power save mode

• Standby mode

• Deep Power-Down mode

Figure 7: Operation Modes State Machine

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The above power modes are separated into two main groups:

• Work mode group – in which the device is active and performs various transactions.

• Idle mode group – in which the device is not active.

The power mode is determined as follows:

• Assertion of the RSTIN# signal sets the device in Reset state.

• Upon power up the device enters its pre-configured work mode.

• Default work mode is Turbo mode. The default can be changed to PowerSave mode

and vice-versa using S/W API.

• Once in any idle mode the device will move to work mode upon any transaction. It

may return to idle mode upon inactivity, if so configured.

• Entry and exit to/from Deep Power-Down mode is described below.

5.1 Reset State

While in Reset State, mDOC H3 ignores all write transactions and returns undefined values in

response to any read access.

5.2 Turbo Mode

This mode is defined as a "work mode" and is optimized for performance. All internal clocks are

set to maximal work frequency.

In this mode all standard operations involving the flash memory can be performed.

5.3 Power Save Mode

This mode is defined as a "work mode" and is optimized for balance between power

consumption and performance. Balance is achieved by setting internal clocks to predefined

optimal settings.

In this mode all standard operations involving the flash memory can be performed.

5.4 Standby Mode

mDOC H3 enters standby mode upon device inactivity. In Standby mode the clock of most

internal cores is either disconnected or reduced to a minimum. There is no wake-up time penalty

when switching back to working mode.

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5.5 Deep Power-Down Mode

While in Deep Power-Down (DPD) mode, the quiescent power dissipation of the mDOC H3

device is further reduced by disabling internal high current consumers (e.g. voltage regulators,

input buffers, oscillator etc.)

Entering Deep Power-Down mode is done by either of the following:

• Writing to POWER_DN bit in the Power Mode Register.

• Activating a SW API to put the device immediately in DPD.

• Setting Auto DPD mode by SW. Depending on Auto DPD mode chosen the device

will either enter DPD upon device inactivity, or enter Standby mode upon device

inactivity and switch to DPD after a configurable period of inactivity.

Entering Deep Power-Down mode and then returning to the previous mode does not affect the

value of any register.

Exiting Deep Power-Down mode is done using one of the following methods:

• Performing a read/write access from/to mDOC H3.

• RSTIN# assertion.

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6. EMBEDDED TRUEFFS TECHNOLOGY

6.1 General Description

SanDisk’s patented TrueFFS technology was designed to maximize the benefits of flash memory

while overcoming inherent flash limitations that would otherwise reduce its performance,

reliability and lifetime. TrueFFS emulates a hard disk making flash transactions completely

transparent to the OS. In addition, since DOC Driver operates under the OS file system layer,

and exports standard Block Device API, it is completely transparent to the application.

TrueFFS is now embedded within the mDOC H3 device, eliminating the need for complicated

software integrations and enabling a practically Plug & Play integration with the system. mDOC

H3 with Embedded TrueFFS handles all the complexity of flash management for the host SW.

This dramatically simplifies software integration and test. It also allows for cost reductions to be

achieved in projects using mDOC by upgrading to newer generations of mDOC devices based on

newer and more cost effective NAND technologies. The embedded flash management offered by

TrueFFS assures that software on the host system or mass production tools need not to be

changed or re-qualified when flash technology is changed.

mDOC SW support includes:

• Drivers support for all major OSs

• DOC Driver Software Development Kit (DOC Driver SDK)

• TrueFFS 7.1 Software Development Kit (TrueFFS 7.1 SDK) – One SW package to

support both earlier mDOC technologies (such as G3, G4 and H1) and mDOC H3.

• Support for all major CPUs, including 16 and 32-bit bus architectures

Embedded TrueFFS technology features:

• Flash management

• Bad-block management

• Dynamic virtual mapping

• Dynamic and static wear-leveling

• Power failure management

• Implementation of EDC/ECC

• Performance optimization

6.2 Operating System Support

The DOC Driver is integrated into all major OSs, including Symbian, Microsoft Windows

Mobile, Windows CE, Linux and others. For a complete listing of all available drivers, please

contact your local SanDisk sales office or distributor.

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6.3 DOC Driver Software Devel opment Kit (SDK)

DOC Driver Software Development Kit (SDK) provides the source code for the DOC Driver. It

can be used in an OS-less environment or when special customization of the driver is required

for proprietary OSs. The DOC Driver SDK is used also for utilizing mDOC H3 as the boot

device. TrueFFS 7.1 Software Development Kit (TrueFFS 7.1 SDK) provides the DOC Driver

code, bundled with the TrueFFS code needed to support earlier mDOC technologies (such as G3,

G4 and H1) as well.

6.3.1 File Management

DOC Driver accesses the flash memory within mDOC H3 through either 8KB or 128KB window

in the CPU memory space, depending on the mDOC H3 configuration. DOC Driver provides

block device API by using standard file system calls, identical to those used for a hard disk, to

enable reading from and writing to mDOC H3. This makes mDOC H3 compatible with any file

system and file system utilities, such as diagnostic tools and applications.

Note: mDOC H3 is shipped unformatted and contains virgin media.

6.3.2 Bad-Block Management

Since NAND flash is an imperfect storage media, it can contain bad blocks that cannot be used

for storage because of their high error rates. Embedded TrueFFS automatically detects and maps

out bad blocks upon system initialization, ensuring that they are not used for storage. During run-

time, if additional bad blocks are detected they are automatically retired and replaced by blocks

that are located in a pool of spares. This management process is completely transparent to the

user, who is unaware of the existence and location of bad blocks, while remaining confident of

the integrity of data stored.

6.3.3 Wear-Leveling

Flash memory can be erased a limited number of times. This number is called the erase cycle

limit, or write endurance limit, and is defined by the flash device vendor. The erase cycle limit

applies to each individual erase block in the flash device.

In a typical application, and especially if a file system is used, specific pages are constantly

updated (e.g., the pages that contain the FAT, registry, etc.). Without any special handling, these

pages would wear out more rapidly than other pages, reducing the lifetime of the entire flash.

To overcome this inherent deficiency, Embedded TrueFFS uses SanDisk’s patented wear-

leveling algorithm. This wear-leveling algorithm ensures that consecutive writes of a specific

sector are not written physically to the same page in the flash. This spreads flash media usage

evenly across all pages, thereby maximizing flash lifetime.

Dynamic Wear-Leveling

Embedded TrueFFS uses statistical allocation to perform dynamic wear-leveling on newly

written data. This means that new data will be written to flash units which are less worn out.

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Static Wear-Leveling

Areas on the flash media may contain static files, characterized by blocks of data that remain

unchanged for very long periods of time, or even for the whole device lifetime. If wear-leveling

were only applied on newly written pages, static areas would never be cycled. This limited

application of wear-leveling would lower life expectancy significantly in cases where flash

memory contains large static areas. To overcome this problem, Embedded TrueFFS forces data

transfer in static areas as well as in dynamic areas, thereby applying wear-leveling to the entire

media.

6.3.4 Power Failure Management

Embedded TrueFFS uses algorithms based on “erase after write” instead of "erase before write"

to ensure data integrity during normal operation and in the event of a power failure. Used areas

are reclaimed for erasing and writing the flash management information into them only after an

operation is complete. This procedure serves as a check on data integrity.

The “erase after write” algorithm is also used to update and store mapping information on the

flash memory. This keeps the mapping information coherent even during power failures. The

only mapping information held in RAM is a table pointing to the location of the actual mapping

information. This table is reconstructed during power-up or after reset from the information

stored in the flash memory.

To prevent data from being lost or corrupted, Embedded TrueFFS uses the following

mechanisms:

• When writing, copying, or erasing the flash device, the data format remains valid at

all intermediate stages. Previous data is never erased until the operation has been

completed and the new data has been verified.

• A data sector cannot exist in a partially written state. The operation is either

successfully completed, in which case the new sector contents are valid, or the

operation has not yet been completed or has failed, in which case the old sector

contents remain valid.

In addition, Embedded TrueFFS applies a unique algorithm to ensure that new data written to the

device will not affect any data already programmed to the device.

6.3.5 Error Detection/Correction

Embedded TrueFFS implements a unique Error Correction Code (ECC) algorithm to ensure data

reliability. Refer to Section 3.5 for further information on the EDC/ECC mechanism.

6.3.6 Special Features through I/O Control (IOCTL) Mechanism

In addition to standard storage device functionality, the DOC Driver provides extended

functionality. This functionality goes beyond simple data storage capabilities to include features

such as: formatting the media, read/write protection, boot partition(s) access and other options.

This unique functionality is available in all DOC Drivers through the standard I/O control

command of the native file system.

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6.3.7 Compatibility

Migrating from mDOC G3/G4/H1 and mDOC G3/G4 -based MCP to mDOC H3 and mDOC H3

-based MCP can be done by TrueFFS 7.1.

TrueFFS 7.1 supports all mDOC product line including mDOC G3/G4/H1 and mDOC H3.

DOC Driver 1.0 and higher provides stand alone SW support for mDOC H3 only. It does not

support mDOC G3/G4 and H1.

When using different software modules (e.g. Block Device DOC Driver, Boot application,

formatting utilities, etc.) to access mDOC H3 it is crucial to verify that all software modules are

based on the same code base version. It is also important to use only tools (e.g. DFORMAT,

DINFO, DIMAGE, etc.) from the same version as the DOC Drivers used by the application.

Failure to do so may lead to unexpected results, such as lost or corrupted data. The driver version

can be verified by the sign-on messages displayed, or by the version information presented by

the driver or tool.

6.4 128KB Memory Window

mDOC H3 utilizes a 128KB memory window in the CPU address space, consisting of four 32KB

sections as depicted in Figure 8. The addresses described here are relative to the absolute starting

address of the 128KB memory window.

The 32KB Programmable Boot Block (XIP) is aliased to section 0, 2 and 3. The sections are

aligned to addresses 00000H, 10000H and 18000H additionally the second half of section 1

contains the second half of the IPL. This is done in order to enable additional flexibility in the

IPL addressing schemes. For compatibility with next generation mDOC H3 devices, it is

recommended to use only 8KB of the 32KB Programmable Boot Block.

Address 8000H + offset is the base address for the mDOC H3 registers used for communication

with the mDOC H3 device (excluding the Paged RAM Registers).

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IPL RAM

(Host XIP)

00000h

32K /

4 X 8K

128K window

IPL RAM – Upper Area

(Host XIP)

IPL RAM Alias

(Host XIP)

IPL RAM Alias

(Host XIP)

10000h

18000h

32K /

4 X 8K

32K /

4 X 8K

0C000h

16KH3 Registers

16K

08000h

1FFFFh

Section 0 Section 1 Section 2 Section 3

Figure 8: mDOC H3 128KB Memory M ap

Note: In future mDOC H3, IPL RAM size is 8KB. For backward compatibility with the memory

map, each 32K window is composed of 8K IPL and 3 additional aliases.

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6.5 8KB Memory Window

For the purposes of backward compatibility, mDOC H3 can present an 8KB memory window in

the CPU address space, depicted in Figure 9. The addresses described here are relative to the

absolute starting address of the 8KB memory window.

The 2KB Programmable Boot Block (XIP) in section 0 is aligned to address 0000H.

Address 0800H + Offset is the base address for the H3 registers used for communication with the

mDOC H3 device (excluding the Paged RAM registers).

IPL RAM

(Host XIP)

0000h

8K window

RSRVD

1800h

H3 Registers

0800h

1FFFh

Section 0

Section 1

Section 2

Figure 9: mDOC H3 8KB Memory Map

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7. MDOC H3 REGISTERS

This section describes various mDOC H3 registers and their functions.

Table 3: Various mDOC H3 Registers

Address (Hex)

128KB Windo w Address (Hex)

8KB Window Width

(Bits) Register Name

0030 8 Paged RAM command

0070 8 Paged RAM Select

0080 8 Paged RAM Unique ID Download

9400/9422 1400/1422 16 Chip Identification [0:1]

9402/9424 1402/1424 16 Burst Write/Read Mode Control

9404 1404 16 Burst Write Mode Exit

940C 140C 16 DPD Wakeup Trigger Register

9416 1416 16 DPD Activation Register

940E 140e 16 DMA Control

9418 1418 16 DMA Negation

9410 1410 16 Software Lock

9412 1412 16 Endian Control

7.1 Definition of Terms

The following abbreviations and terms are used within this section:

RFU Reserved for future use. This bit is undefined during a read cycle and “don’t care”

during a write cycle.

RFU_0 Reserved for future use; when read, this bit always returns the value 0; when

written, software should ensure that this bit is always cleared to 0.

RFU_1 Reserved for future use; when read, this bit always returns the value 1; when

written, software should ensure that this bit is always set to 1.

Reset Value Refers to the value immediately present after moving from Reset State to one of

the work modes.

7.2 Reset Values

The Reset value written in the register description is the register value after mDOC H3 moves

out from Reset state and enters one of the Work modes. Registers for which a value is not

defined after moving from Reset State to one of the work modes, are marked by an N/A reset

value.

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7.3 Registers Description

This section describes various mDOC H3 registers and their functions.

7.3.1 Paged RAM Command Register

Description: This 8-bit register is used to enable Write to other Paged RAM registers.

Address (hex): 0030 (both 8KB window and 128KB Window)

Type: Write

D7 D6 D5 D4 D3 D2 D1 D0

Read/Write W W W W W W W W

Bit Name COMMAND

Reset Value N/A

Bit No. Description

COMMAND COMMAND The value 71H must be written to enable a subsequent write cycle to the

Paged RAM Page Select register. All other values: Reserved.

7.3.2 Paged RAM Select Register

Description: This 8-bit register is used to initiate a download operation of the specified 1KB

page. If the value 71H is not written to the Paged RAM Command register

immediately before writing this register, the write cycle will be ignored.

Address (hex): 0070 (both 8KB window and 128KB Window)

Type: Write

D7 D6 D5 D4 D3 D2 D1 D0

Read/Write W W W W W W W W

Description SEQ PAGE

Reset Value N/A 00H

Bit No. Description

SEQ Sequential indication. Setting this bit initiates a download from the NEXT_PAGE pointer

of the previously downloaded page. The value written to the PAGE field is ignored.

PAGE Only significant when writing a 0 to the SEQ field. Only value 00H is supported.

PAGE value of 00H loads the same data as in hardware or software reset.

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7.3.3 Paged RAM Unique ID Download Register

Description: Writing to this 8 bit register initiates a download of the 16-byte Unique

Identification (UID) number to offset 0 of the downloadable section of the IPL

RAM. After polling for ready status, the requested data may be read from the

IPL RAM.

Writes to this register will be ignored if the prior bus cycle was not a write cycle

to the Paged RAM Command Register with data 71H (intervening RAM read

cycles are allowed).

Address (hex): 0080 (both 8KB window and 128KB Window)

Type: Write

D7-D0

Read/Write W

Bit Name RFU_0

Reset Value N/A

7.3.4 Chip Identification (ID) Register [0:1]

Description: These two 16-bit registers are used to identify the mDOC device residing on the

host platform. They always return the same value.

Chip Identification Register [1] holds the bit inverse of Chip Identification

Address (hex): 128KB window: 9400 / 9422

8KB window 1400 / 1422

Type: Read only

D15-D0

Read/Write R

Bit Name ChipID / ChipID inverse

Reset Value Chip Identification Register[0]: 4833H

Chip Identification Register[1] – bit inverse: B7CCH

7.3.5 Burst Mode Control Registers (Read & Write)

Description: These 16 bit registers contain the parameters for the burst transactions.

There is one register for burst write and one for burst read. The structure of both

registers is the same.

Address (hex): 128KB window: 9424 (Burst Read) / 9402 (Burst Write)

8KB window: 1424 (Burst Read) / 1402 (Burst Write)

Type: Read / Write

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D15-D14 D13 D12-D11 D10-D8 D7-D6 D5-D4 D3-D2 D1 D0

Read/Write R R/W R/W R/W R R R R/W R

Bit name RFU HOLD LENGTH LATENCY RFU WAIT_STATE RFU BST_EN RFU

Reset value 0 0 0 0 0 0 0 0 0

HOLD See section 9.8.2.

LENGTH See section 9.8.2.

LATENCY See section 9.8.2.

WAIT_STATE See section 9.8.2.

BURST_EN Enables burst mode cycles.

0: Burst mode is disabled.

1: Burst mode is enabled.

Note: Burst mode can only be used in conjunction with mDOC H3 DMA functionality.

7.3.6 Burst Write Mode Exit Register

Description: Write to this 16-bit register takes the device out of Burst Write mode

Address (hex): 9404 (128KB window) / 1404 (8KB window)

Type: Write

D15-D0

Read/Write W

Bit Name RFU

Reset Value N/A

Note: Burst mode can only be used in conjunction with mDOC H3 DMA functionality.

7.3.7 DPD Wakeup Trigger Register

Description: This 16-bit register selects the device wake up trigger from DPD mode.

Address (hex): 940C (128KB window) / 140C (8KB window)

Type: Read / Write

Bit number D15-D9 D8 D7-D0

Read/Write R R/W R

Bit name RFU WAKE_UP_SEL_BIT RFU

Reset value 0 0 0

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WAKE_UP_SEL_BIT Selects the device wake up trigger

0: mDOC H3 CE# is the wakeup trigger.

1: Read access (CE# & OE# assertion) or write access (CE# and WE#

assertion) is the wakeup trigger.

7.3.8 DPD Activation Register

Description: This 16-bit register is used to put mDOC H3 into Deep Power Down mode.

Address (hex): 9416 (128KB window) / 1416 (8KB window)

Type: Read / Write

Bit number D15-D1 D0

Read/Write R W

Bit name RFU POWER_DN

Reset value 0 0

POWER_DN Setting this bit to ‘1’ will put the device to Deep Power Down mode.

7.3.9 DMA Control Register

Description: This 16-bit register controls the DMA_REQ signal to the host.

Address (hex): 940E (128KB window) / 140E (8KB window)

Type: Read / Write

Bit number D15-D9 D8-D4 D3 D2 D1 D0

Read/Write R R/W R R/W R/W R/W

Bit name RFU PULSE_WIDTH RFU EDGE DMA_POL DMA_EN

Reset value 0 4 0 0 1 0

PULSE_WIDTH The width of the DMARQ# signal will be:

PULSE_WIDTH * ICMU_CLK (cycle). Maximum 32 ICMU clocks.

Note: If the value is zero then DMARQ# signal will not be asserted.

EDGE Level or Edge:

0: Level – DMARQ# will be asserted when data is ready and will be de-asserted

before the end of the data according to DMA_PROG_NEG (DMA Negation).

1: Edge – DMARQ# will be generated for the number of clock specified in the

PULSE_WIDTH field.

DMA_POL DMARQ# polarity:

0: active high

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1: active low

DMA_EN DMA enable bit:

0: DMARQ# is disabled

1: DMARQ# is enabled

7.3.10 DMA Negation Register

Description: This 16-bit register controls the negation of DMARQ# signal to the host.

Address (hex): 9418 (128KB window) / 1418 (8KB window)

Type: Read / Write

Bit number D15-D10 D9-D0

Read/Write R R/W

Bit name RFU DMA_PROG_NEG

Reset value 0 4

DMA_PROG_NEG DMA programmable negation:

0-1023: Number of words in DRQ block before end of data transfer that

DMARQ# signal will be negated.

Note: DMA negation must be smaller than transfer size in words (16bit).

7.3.11 Software Lock Register

Description: This 16-bit register implements the Sticky Lock functionality. After setting it,

protected-partitions can no longer be accessed, until the device is reset.

Address (hex): 9410 (128KB window) / 1410 (8KB window)

Type: Read / Write

Bit number D15-D1 D0

Read/Write R R/W

Bit name RFU SLOCK

Reset value 0 0

SLOCK Sticky Lock bit.

0: Sticky Lock is not active

1: Sticky Lock is activated

This bit can only be set once by the host until device is reset.

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7.3.12 Endian Control Register

Description: This 16-bit register is used to control the swapping of the low and high data

bytes when reading or writing with a 16-bit host. This provides an Endian-

independent method of enabling/disabling the byte swap feature.

Address (hex): 9412 (128KB window) / 1412 (8KB window)

Type: Read / Write

Bit number D15-D9 D8 D7-D1 D0

Read/Write R R/W R R/W

Bit name RFU SWAP RFU SWAP

Reset value 0 0 0 0

SWAP Swap enable per byte. (This bit can be set by setting bit-0 OR bit-8). To clear

the bit both bits 0 & 8 need to be cleared to ‘0’;

0: Data from host is unchanged.

1: Data from host is swapped.

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8. BOOTING FROM MDOC H3

8.1 Introduction

mDOC H3 can function both as a flash disk and as the system boot device.

If mDOC H3 is used both as a flash disk and as the system boot device, it contains the boot

loader, an OS image and a file system. In such a configuration, mDOC H3 can serve as the only

non-volatile device on board.

When using mDOC H3 as the system boot device, the CPU fetches the first instructions from the

mDOC H3 Programmable Boot Block, which contains the IPL. The IPL handles the required

platform initializations, and then loads the required image or OS Boot loader from its dedicated

partition.

SanDisk’s DOC Driver, SDK and utilities enable the construction of a proper mDOC H3 layout

in order to support the boot sequence. For a complete description of these tools, refer to the DOC

Driver 1.0 Block Device (BD) Software Development Kit (SDK) developer guide and the DOC

Driver 1.0 Software Utilities developer guide. These tools enable the following operations:

• Formatting mDOC H3

• Creating multiple partitions for different storage needs (IPL, Boot loader, OS images

files, and FAT partitions)

• Programming the OS image file

Figure 10 illustrates an example of a boot sequence.

Boot Loader

OS Image

Flash Disk

Partition (OS

Image Storage)

Flash Disk

Partition

(File Storage)

Power-Up

RAM

Basic System Initialization

Boot Loader Copies

OS Image to RAM

OS Start-Up Code

mDOC H3

Copy

Image

to RAM

Take Image

from mDOC

Figure 10: System Boot Sequence with m DOC H3

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8.1.1 Asynchronous Boot Mode

Host platforms should use Asynchronous Boot mode when using mDOC H3 as the system boot

device.

During platform initialization, certain CPUs wake up in 32-bit mode and issue instruction fetch

cycles continuously. An Intel PXAxxx CPU, for example, initiates a 16-bit read cycle, but after

the first word is read, it continues to hold CE# and OE# asserted while it increments the address

and reads additional data as a burst.

Once in Asynchronous Boot mode, the CPU can fetch its instruction from the mDOC H3

Programmable Boot Block. After reading from this block and completing the boot, mDOC H3

returns to derive its internal clock signal from the CE#, OE#, and WE# inputs. Please refer to

Section 10 for read timing specifications for Asynchronous Boot mode.

8.1.2 Paged RAM Boot

The Paged RAM Boot feature uses the IPL SRAM as two 1KB sections. The first section

provides constant data, while the other section can be downloaded sequentially with flash data.

One application of this feature is to support Secure Boot requirements. The Paged RAM Boot

feature does not require support of the BUSY# output.

After a hardware or software reset, mDOC H3 initializes the first 2KB of XIP RAM with data

stored in the first 2KB of the pre-programmed IPL. The Paged RAM Boot feature permits 1KB

virtual pages (up to 254KB total) to be downloaded sequentially to the XIP RAM, upon

receiving the proper command sequence. Since the mDOC H3 BUSY# output is not asserted by

a page-load operation, a polling procedure is required to determine when the download is

complete. An XIP operation from the mDOC H3 RAM is not supported during this polling

operation, so it must be executed from system RAM or ROM instead.

When two mDOC H3 devices are cascaded, Paged RAM downloads occur only on the first

mDOC H3 device in the cascaded configuration (device-0).

For more information on booting from mDOC H3 in Paged RAM Boot mode, please contact

your local SanDisk sales office.

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9. DESIGN CONSIDERATIONS

9.1 General Guidelines

• A typical RISC processor memory architecture may include the following devices:

• mDOC H3: Contains the OS image, applications, registry entries, back-up data, user

files and data, etc. It can also be used to perform boot operation, thereby replacing the

need for a separate boot device.

• CPU: mDOC H3 is compatible with all major CPUs in the mobile phone, Digital TV

(DTV), Digital Still Camera (DSC), MP3, GPS and other Portable Consumer

Electronics Applications markets, including:

• ARM-based CPUs

• Texas Instruments OMAP, DBB

• Intel PXAxxx family

• Infineon xGold family

• Analog Devices (ADI) digital Baseband devices

• Freescale i.MXxx Application processors and i.xx digital Baseband devices

• Zoran ER4525

• Renesas SH mobile

• EMP platforms

• Qualcomm MSMxxxx

• Boot Device: In case mDOC H3 is not used as a boot device, ROM or NOR flash that

contains the boot code is required for system initialization, kernel relocation, loading

the operating systems and/or other applications and files into the RAM and executing

them.

• RAM/DRAM Memory: This memory is used for code execution.

• Other Devices: A DSP processor, for example, may be used in a RISC architecture

for enhanced multimedia support.

9.2 Configuration

The Configuration Interface enables the designer to configure mDOC H3 to operate in different

modes.

• The ID0 signal is used in a cascaded configuration.

• The LOCK# signal is used for hardware write/read protection

9.3 Demux (Standard) Interface

mDOC H3 uses a NOR-like interface that can easily be connected to any microprocessor bus.

With a demux interface, it requires 16 address lines, 16 data lines and basic memory control

signals (CE#, OE#, WE#), as shown in Figure 11 below. Typically, mDOC H3 can be mapped to

any free 128KB memory space (8KB address space requires less address lines).

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

50 92-DS-1205-10

For power connectivity please refer to mDOC H3 power supply connectivity in section 9.5.

Figure 11: Demux System Interface

Notes: 1. mDOC H3 is an edge-sensitive device and care should be taken to prevent excessive

ringing on the CE#, OE# and WE# signals. If required, these signals should be

properly terminated (according to board layout; serial/parallel or both terminations) to

avoid ringing

2. Address line A0 should either be connected to the host CPU A0 or to GND.

9.4 Multiplexed Interface

With multiplexed interface, mDOC H3 requires the signals shown in Figure 12 below.

For power connectivity please refer to mDOC H3 power supply connectivity in section 9.5.

Figure 12: Multiplexed System Interface

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

51 92-DS-1205-10

Note: mDOC H3 is an edge-sensitive device and care should be taken to prevent excessive

ringing on the CE#, OE# and WE# signals. If required, these signals should be properly

terminated (according to board layout; serial/parallel or both terminations) to avoid

ringing.

9.5 mDOC H3 Power Supply Connectivity

mDOC H3 can be configured to support different combinations of Core (VCC) and IO (VCCQ)

voltages.

Table 4 lists the connectivity required to support the different available combinations.

Table 4: Power Connectivity and Capacitors

Power

Supply VCC VCCQ VCC1 VCC2 C+, C-

Core: 3.3V

IO: 3.3V

3.3V

Recommended:

0.1uF and 10nF

capacitors8

3.3V

Recommended:

0.1uF and 10nF

capacitors

Required:1uF

capacitor

Recommended:

Additional 0.1uF

capacitor9

3.3V8 No Capacitor10

Core: 3.3V

IO: 1.8V

3.3V

Recommended:

0.1uF and 10nF

capacitors8

1.8V

Recommend:

0.1uF and 10nF

capacitors

Required: 1uF

capacitor

Recommended:

Additional 0.1uF

capacitor9

3.3V8 No Capacitor10

Core: 1.8V

IO: 1.8V

1.8V

Required: 0.1 uF

or 0.33 uF14

Recommended:

additional 10nF

capacitor

1.8V

Recommended:

0.1uF and 10nF

capacitors

1.8V

No Capacitor11

Required: 1uF

or 1.5uF

capacitor

Recommended:

Additional 0.1uF

capacitor12

Required:

33nF or 47nF

capacitor13

Notes: 1. Voltages listed above are nominal voltages.

2. Capacitors that are listed as required must be installed. Failure to install these

capacitors will cause the device to fail.

3. The values of capacitors listed as required are critical for proper operation of the

device. The values listed are the minimum required values and may be increased.

However any major deviations from the values specified above should be verified

with SanDisk.

4. The values of capacitors listed as recommended may be modified based upon the

specific behavior of the system power supply and board layout. These are bypass

capacitors and they are required to minimize ripples on the power supply inputs.

Failure to provide adequate bypass capacitors may cause intermittent problems.

Designs that have been validated with different capacitor configurations do not need

to follow these recommendations.

5. All capacitors are assumed to have a worst case tolerance of +/- 20%.

6. We recommend using an X7R type capacitor for all capacitors listed above.

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

52 92-DS-1205-10

7. The series inductance of the capacitors marked as required should be less than 15nH.

8. For this configuration, we recommend that the 0.1uF capacitor will be located close

to the VCC ball and the 10nF capacitor will be located close to the VCC2 ball. If this

placement is not possible then both capacitors should be located as close as possible

to the VCC ball. The 10nF capacitor is only recommended in order to reduce high

frequency noise.

9. For compatibility with next generation mDOC H3 devices we recommend adding an

additional 0.1uF capacitor in parallel with the required 1uF capacitor. For designs that

will only use the current mDOC H3 device only the 1uF capacitor is required.

10. In this configuration the internal charge pump is disabled. Installing a 33nF or 47nF

capacitor will have no impact on the device.

11. In this configuration the voltage regulator is disabled and no capacitors are required

on this ball. Installing a capacitor on this ball will have no impact on the device.

12. In this configuration the internal charge pump is enabled. The current mDOC H3

device requires at least a 1uF capacitor on VCC2 but it can also be operated with

1.5uF capacitor. However, for SDED5-AAAB-CCC devices, a 1.5uF will be required.

The 0.1uF capacitor is only recommended in order to reduce high frequency noise.

13. This capacitor is critical for the operation of the internal charge pump. For the current

mDOC H3 device a 33nF capacitor is required but it can also be operated with a 47nF

capacitor. However, for for SDED5-AAAB-CCC devices, a 47nF capacitor will be

required.

14. For the current mDOC H3 device a 0.1uF capacitor is required but it can also be

operated with a 0.33uF capacitor. However, f for SDED5-AAAB-CCC devices, a

0.33uF capacitor will be required. This applies only to 1.8V Core and I/O

configuration.

15. In case there are multiple balls available for a power supply then the recommended

capacitors do not need to be duplicated for all balls but can be placed near one or

more balls.

16. For systems that use a cascaded configuration, each mDOC H3 device must have its

own set of required capacitors. Required capacitors cannot be shared between

devices. Capacitors that are recommended can be shared between devices, however

their effectiveness may be reduced. Careful analysis of the potential noise on the

power supply pins should be conducted before deciding to share capacitors and

reduce the total number of recommended capacitors.

17. The capacitors must be placed as close as possible to the package leads. Below are

some drawings that depict the various power connectivity options. All options are

valid for both MUX and DEMUX configurations.

18. BUSY#, DMARQ# and IRQ# should not be pulled up to any voltage higher than

VCCQ.

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

53 92-DS-1205-10

Host

control

Figure 13: mDOC H3 power connection for 3.3v core/3.3v I/O

Figure 14: mDOC H3 power connection for 3.3v core/1.8v I/O

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

54 92-DS-1205-10

Host

control

Figure 15: mDOC H3 power connection for 1.8v core/1.8v I/O

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

55 92-DS-1205-10

9.6 Connecting Control Signals

9.6.1 Demux Interface

When using a demux NOR-like interface, connect the control signals as follows:

• A[16:0] – Connect these signals to the host address signals (see Section 9.10 for

platform-related considerations). The A0 signal may be connected to either the host

CPU A0 signal or to VSS.

• D[15:0] – Connect these signals to the host data signals (see Section 9.10 for

platform-related considerations).

• OE# (Output Enable) and Write Enable (WE#) – Connect these signals to the host

RD# and WR# signals, respectively.

• CE# (Chip Enable) – Connect this signal to the memory address decoder. Most

RISC/mobile processors include a programmable decoder to generate various Chip

Select (CS) outputs for different memory zones. These CS signals can be

programmed to support different wait states to accommodate mDOC H3 timing

specifications.

• RSTIN# (Power-On Reset In) – Connect this signal to the host active-low Power-On

Reset signal.

• ID0 (Chip Identification) – This signal must be connected to VSS if the host uses

only one mDOC H3. If more than one device is being used, refer to Section 9.9 for

more information on device cascading.

• BUSY# (Busy) – This signal indicates when the device is ready for first access after

reset. It may be connected to an input port of the host, or alternatively it may be used

to hold the host in a wait-state condition. The later option is required for hosts that

boot from mDOC H3.

• DMARQ# (DMA Request) – Output used to control multi-page DMA operations.

Connect this output to the DMA controller of the host platform.

• IRQ# (Interrupt Request) – Connect this signal to the host interrupt.

• Lock# (LOCK) – Connect to a logical 0 to prevent the usage of the protection key to

open a protected partition. Connect to logical 1 in order to enable usage of protection

keys.

• CLK (Clock) – This input is used to support Burst operation when reading flash data.

Refer to Section 9.8 for further information on Burst operation.

9.6.2 Multiplexed Interface

mDOC H3 can use a multiplexed interface to connect to a multiplexed bus. In this configuration,

mDOC H3 AVD# signal is driven by the host's AVD# signal, and the D[15:0] balls, used for

both address inputs and data, are connected to the host AD[15:0] bus.

This mode is automatically entered when a falling edge is detected on AVD#. This edge must

occur after RSTIN# is negated and before OE# and CE# are both asserted; i.e., the first read

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

56 92-DS-1205-10

cycle made to mDOC must observe the multiplexed mode protocol. See Section 10 for more

information about the related timing requirements.

Please refer to Section 2.3 for ballout and signal descriptions, and to Section 10 for timing

specifications for a multiplexed interface.

9.7 Implementing the Interrupt Mechanism

9.7.1 Hardware Configuration

To configure the hardware for working with the interrupt mechanism, the IRQ# ball should be

connected to a host interrupt input.

9.7.2 Software Configuration

IRQ# signal may be used by mDOC H3 to interrupt the host system, provided that device

interrupts are enabled. Interrupts can be enabled or disabled using the flHwConfig DOC Driver

API. For more information see the DOC Driver 1.0 Block Device (BD) Software Developer Kit

(SDK) Developer Guide. When asserted, the IRQ# signal will remain asserted until cleaned

(level only). This cleaning is performed automatically by the DOC Driver as part of the API

(read or write) completion.

mDOC H3 will interrupt the host system in the following cases:

• Device is ready to receive a data block (excluding the first) during write operation.

• When using DMA transfers:

• On completion of block device operation to mDOC H3.

• Device is ready to send a data block during a read operation.

9.8 DMA and Burst Operation

mDOC H3 enhances performance using various proprietary techniques among them are

• Burst operation to read or write large chunks of data, providing a Burst speed.

• DMA operation to release the CPU for other tasks in coordination with the platform’s

DMA controller. This is especially useful during the boot stage. Up to 128KB of data

can be transferred during a DMA operation.

9.8.1 DMA Operation

mDOC H3 provides a DMARQ# output that enables data transfer using the host DMA

controller. During DMA operation, the DMARQ# output is used to notify the host DMA

controller that data is ready to be read or written. mDOC H3 protocol enables such data transfer

up to the maximal size of 128KB per read or write operation.

The DMARQ# output sensitivity is selected by setting the EDGE bit in the DMA Control

1. Edge DMARQ# output pulses to indicate to the DMA controller that a data is ready to be

transferred. The EDGE bit is set to 1 for this mode. The amount of data that will be

transferred corresponds to data block size.

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

57 92-DS-1205-10

2. Level DMARQ# output is asserted while the data is available for read, or data can be

accepted for write. The EDGE bit is set to 0 for this mode.

The following steps are required in order to initiate a DMA operation:

1. If the DMA controller supports an edge-sensitive DMARQ# signal, then initialize the DMA

controller to transfer 512 bytes (or your chosen data block size) upon each DMA request. If

the DMA controller supports a level-sensitive DMARQ# signal, then initialize the DMA

controller to transfer data continuously while DMARQ# is asserted.

2. Set in the DMA Control register values of EDGE bit, PULSE_WIDTH and DMA polarity

corresponding to settings of the host DMA controller. This can be done only once after

system power-up.

3. Enable DMA transfer with DMA_EN bit in the DMA control register.

4. If host DMA controller detects the de-assertion of the DMARQ# signal too late (and

attempts to transfer additional words as a result), then DMARQ# can be configured to be de-

asserted earlier by using the DMA Negation Register.

5. Program host DMA controller to transfer the same number of sectors as will be given in

following logical command.

6. Issue the DMA data-transfer read/write command with same number of sectors to transfer as

given in the previous step (prior to this, the device should be instructed to perform transfers

in DMA-mode).

Upon command completion IRQ# will be asserted (it is recommended to use IRQ# when

working with DMA). In case of a failure, less than expected amount of data could be transferred.

In commands that use DMA transfer, IRQ# is activated only at the completion of the whole

command; while in commands that do not use DMA transfer IRQ# is typically activated with

every data transfer.

Default setting of DMARQ# is level and active-low. It can be modified using the flHwConfig

DOC Driver API. For more information see the DOC Driver 1.0 Block Device (BD) Software

Developer Kit (SDK) Developer Guide..

9.8.2 Synchronous Burst Operation

In this mode the host reads full sections of 16-bit words synchronized to the CLK input.

Burst operation is controlled by 5 bit fields in each Burst Mode Control register (one for Burst

read and one for Burst write): BURST_EN, WAIT_STATE, LATENCY, HOLD and LENGTH.

For full details on this register, please refer to Section 7.

Burst Read / Write mode is enabled by setting the BURST_EN bit in each Burst Mode Control

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

58 92-DS-1205-10

9.8.2.1 Read Mode

The LATENCY field controls the number of clock cycles between mDOC H3 sampling CE#

being asserted and when the first word of data is available to be latched by the host. This number

of clock cycles is equal to 3 + LATENCY.

WAIT_STATE allows setting the number of CLK after the host has read the last word until the

release of the CE#.

• 1: One CLK clock before CE# release

• 2: Two CLK clocks before CE# release

• 3: Three CLK clocks before CE# release

The HOLD bit in the Burst Mode Control register can be set to hold each data word valid for two

clock cycles rather than one.

Note: If HOLD = 1, then the data is available to be latched on this clock and on the subsequent

clock.

The LENGTH field must be programmed with the length of the burst to be performed (0

corresponds to 4 cycles; 1 to 8 cycles, 2 to 16 and 3 corresponds to 32 cycles). Each burst cycle

must read exactly this number of words.

The CLK input can be toggled continuously or can be halted. When halting the CLK input, the

following guidelines must be observed:

• The host must provide a clock signal for the full sequence defined by the LATENCY,

WAIT STATE, HOLD and LENGTH bit fields. The clock can only be stopped after

the release of CE#.

• The clock can be halted momentarily during a burst sequence but the host must

provide rising clock edges for the completion of the burst sequence.

Note: For full information regarding the Synchronous Burst Mode see the DOC Driver 1.0 Block

Device (BD) Software Developer Kit (SDK) Developer Guide.

Figure 16: Demux Read Burst Mod e

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

59 92-DS-1205-10

Valid address D0 D1 D2 D3 D4 D5 D6 D7

Burst CLK

AVD

Data

Latency=1

Figure 17: Multiplexed Read Busrt Mode

Notes: 1. Note: AVD must be asserted on the following clock after the assertion of CE.

2. No collision should be allowed between the AVD and OE signal.

9.8.2.2 Write Mode

The Write mode is similar to the Read mode with the following exceptions:

• WAIT_STATE = 0: 1 clock added.

• WAIT_STATE = 1: 2 clocks added.

• WAIT_STATE = 2: 3 clocks added.

• WAIT_STATE = 3: 4 clocks added.

Figure 1818: Demux Write Burst Mode

Note: WE is sampled on the 1st clock after CE assertion. It must be active (low) for at least one

clock cycle, after that the status of the WE signal is not important (Ø).

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

60 92-DS-1205-10

Figure 19: Multiplexed Write Burst Mode

9.9 Device Cascading

Up to two devices can be cascaded with no external decoding circuitry. Figure 19 illustrates the

configuration required to cascade two devices on the host bus (only the relevant cascading

signals are included in this figure, although all other signals must also be connected). All balls of

the cascaded devices must be wired in common, except for ID0. The ID ball values determine the

identity of each device – the first device is identified by connecting the ID ball as 0, and the

second device by connecting the ID ball as 1. Systems that use only one mDOC H3 should

connect ID0 to GND.

Figure 19: mDOC H3 Cascaded Config uration

ID0

CE#

OE#

WE#

CE#

WE#

OE#

ID0

CE#

OE#

WE#

VCCQ

2nd

1st

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

61 92-DS-1205-10

9.10 Platform-Specific Issues

This section discusses hardware design issues for major embedded RISC processor families.

9.10.1 Wait State

Wait states can be implemented only when mDOC H3 is designed in a bus that supports a Wait

state insertion, and supplies a WAIT signal.

9.10.2 Big and Little Endian Systems

mDOC H3 is a Little Endian device. Therefore, byte lane 0 (D[7:0]) is its Least Significant Byte

(LSB) and byte lane 1 (D[15:8]) is its Most Significant Byte (MSB). Within the byte lanes, bit

D0 and bit D8 are the least significant bits of their respective byte lanes. mDOC H3 can be

connected to a Big Endian device in one of two ways:

1. Make sure to identify byte lane 0 and byte lane 1 of your processor. Then, connect the data

bus so that the byte lanes of the CPU match the byte lanes of mDOC H3. Pay special

attention to processors that also change the bit ordering within the bytes (for example,

PowerPC). Failing to follow these rules results in improper connection of mDOC H3, and

prevents the DOC Driver from identifying it.

2. If needed, set the SWAP bits in the Endian Control register. This enables byte swapping

when used with big endian 16-bit hosts.

9.10.3 Busy Signal

The Busy signal (BUSY#) indicates that mDOC H3 has not yet completed internal initialization.

After reset, BUSY# is asserted while the IPL is downloaded into the internal boot block. Once

the download process is completed, BUSY# is de-asserted. It can be used to delay the first access

to mDOC H3 until it is ready to accept valid cycles.

Note: mDOC H3 does NOT use this signal to indicate that the flash is in busy state (e.g.

program, read, or erase).

9.10.4 Working with 16/32-Bit Systems

mDOC H3 uses a 16-bit data bus and supports 16-bit data access by default. However, it can be

configured to support 32-bit data access mode. This section describes the connections required

for each mode.

The default of the DOC Driver for mDOC H3 is set to work in 16-bit mode. It must be specially

configured to support 32-bit mode. Please see DOC Driver or TrueFFS 7.1 documentation for

further details.

Note: The mDOC H3 data bus must be connected to the Least Significant Bits (LSB) of the

system.

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

62 92-DS-1205-10

16-Bit (Word) Data Access Mode

The mDOC H3 is 16 bit wide device. All accesses to and from the device are 16 bit wide.

mDOC H3 address lines should be connected to system host address lines, as depicted in Figure

20. mDOC H3 A0 line should be connected either to system host SA0 address line, or to VSS.

System Host

mDOC H3

SA16

Note: The prefix “SA” indicates system host address lines

Figure 20: 16-Bit Data Access Mode

32-Bit (Double Word) Data Access Mode

In a 32-bit bus system that cannot execute word-aligned accesses, the system address lines SA0

and SA1 are always 0. Consecutive double words (32-bit words) are differentiated by SA2

toggling. Therefore, in 32-bit systems that support only 32-bit data access cycles, mDOC H3

signal A1 is connected to the first system address bit that toggles; i.e., SA2.

mDOC H3 address lines should be connected to system host address lines, as depicted in Figure

21.

mDOC H3 A0 line should be connected either to system host SA1 address line, or to VSS

System Host

Note: The prefix “SA” indicates system host address lines

Figure 21: Address Shift Configuration for 32-Bit Data Access Mode

Rev. 1.3

Design Considerations

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

63 92-DS-1205-10

9.11 Design Environment

mDOC H3 provides a complete design environment consisting of:

• Evaluation boards (EVBs) for enabling software integration and development with

mDOC H3, even before the target platform is available.

• Programming solutions:

• Programmer

o Programming house

o On-board programming

o DOC Driver Software Development Kit (SDK)

• TrueFFs 7.1 Software Development Kit (SDK)

• XP utilities:

o DFormat

o DImage

o DInfo

• Documentation:

o Data sheet

o Application notes

o Technical notes

o Articles

o White papers

Please visit the SanDisk website (www.sandisk.com) for the most updated documentation.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

64 92-DS-1205-10

10. PRODUCT SPECIFICATIONS

10.1 Environmental Specifications

10.1.1 Operating Temperature

Table 5: Operating Temperature

Product Ordering Info Temperature Range

MD2534-XXX-YY -40°C to +85°C

SDE-ZZ-XXXY-BBB -25°C to +85°C

10.1.2 Thermal Characteristics

Table 6: Thermal Characteristics

Thermal Resistance (°C/W)

Junction to Case (θJC): 40 Junction to Ambient (θJA): 90

10.1.3 Humidity

10% to 90% relative, non-condensing.

10.2 Electrical Specifications

10.2.1 Absolute Maximum Ratings

Table 7: Absolute Maximum Ratings

Parameter Symbol Rating Units

1.8V DC supply voltage VCC1 -0.3 to 2 V

3.3V DC supply voltage VCC2 -0.3 to 4 V

1.8/3.3V DC supply voltage VCCQ -0.3 to 4 V

1.8/3.3V DC supply voltage VCC -0.3 to 4 V

Maximum duration of applying

only part of the power supplies

(some of the power supply ON

and the other OFF)

T1supply 500 msec

Input pin voltage Vin -0.3 to 3.6 V

Ambient Temperature OTR -25* to 85 °C

Storage temperature Tstg -55 to +125 °C

* For MD2534-XXX-YY products the value is -40oC

Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded.

Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

65 92-DS-1205-10

2. When operating mDOC H3 with separate power supplies for

VCCQ/VCC/VCC1/VCC2, it is recommended to turn the supplies on and off

simultaneously. Providing power separately (either at power-on or power-off) can

cause excessive power dissipation. Damage to the device may result if this condition

persists for more than 500 msec.

10.2.2 Capacitance

Table 8: Capacitance

Symbol Parameter Conditions Min Typ Max Unit

CIN Input capacitance VIN = 0V 10 pF

COUT Output capacitance VO = 0V 10 pF

10.2.3 DC Characteristics

10.2.3.1 1.8V Core, 1.8V I/O

Table 9: 1.8V Core, 1.8V I/O

Symbol Parameter Conditions Min Typ Max Unit

VCCQ I/O power supply 1.65 1.8 1.95 V

VCC2 Internal supply NC NC NC -

VCC Device supply 1.65 1.8 1.95 V

VCC1 Internal supply 1.65 1.8 1.95 V

VIH Input High-level Voltage 0.65*

VCCQ

0.3+

VCCQ

VIL Input Low-level Voltage -0.3 0.35*

VCCQ

II Input Leakage Current 0≤VIN≤VCCQ -10 10 uA

IOZ Tri-State output leakage current 0≤VIN≤VCCQ -10 10 uA

Vhys Hysteresis Schmidt trigger

inputs

400 mV

VOH High-level Output Voltage IOH=4mA-

12mA

VCCQ-

0.45

VOL Low-level Output Voltage IOH=4mA-

12mA

0.45 V

PU Pull up resistance 95 149 261 kΩ

PD Pull down resistance 77 135 312 kΩ

Turbo mode 30 75

Icc

Active supply current1

Power Save

mode

20 65

Standby mode 5 10 mA

ICCS Standby supply current1

DPD mode 75 130 uA

Note: Sum of all current on VCC, VCCQ and VCC1 balls. CL = 0 pF. T=25C.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

66 92-DS-1205-10

10.2.3.2 3.3V Core, 1.8V I/O

Table 10: 3.3V Core, 1.8V I/O

Symbol Parameter Conditions Min Typ Max Unit

VCCQ I/O power supply 1.65 1.8 1.95 V

VCC2 Internal supply 2.7 3.3 3.6 V

VCC Device supply 2.7 3.3 3.6 V

VCC1 Internal supply NC NC NC -

VIH Input High-level Voltage 0.65*

VCCQ

0.3+

VCCQ

VIL Input Low-level Voltage -0.3 0.35*

VCCQ

II Input Leakage Current 0≤VIN≤VCCQ -10 10 uA

IOZ Tri-State output leakage current 0≤VIN≤VCCQ -10 10 uA

Vhys Hysteresis Schmidt trigger

inputs

400 mV

VOH High-level Output Voltage IOH=4mA-

12mA

VCCQ-

0.45

VOL Low-level Output Voltage IOH=4mA-

12mA

0.45 V

PU Pull up resistance 95 149 261 kΩ

PD Pull down resistance 77 135 312 kΩ

Turbo mode 30 60

Icc3

Active supply current1

Power Save

mode

20 40

Standby mode 5 10 mA

ICCS

Standby supply current1

DPD mode 60 130 uA

Notes: 1. Sum of all current on VCC, VCCQ and VCC2 balls. CL = 0 pF. T=25C.

2. For all products with ordering info SDE-ZZ-XXXY-BBB, Icc and Iccs parameters are

estimations.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

67 92-DS-1205-10

10.2.3.3 3.3V Core, 3.3V I/O

Table 11: 3.3V Core, 3.3V I/O

Symbol Parameter Conditions Min Typ Max Unit

VCCQ I/O power supply 2.7 3.3 3.6 V

VCC2 Internal supply 2.7 3.3 3.6 V

VCC Device supply 2.7 3.3 3.6 V

VCC1 Internal supply NC NC NC -

VIH Input High-level Voltage 2.0 3.6 V

VIL Input Low-level Voltage -0.3 0.8 V

II Input Leakage Current 0≤VIN≤VCCQ -10 10 uA

IOZ Tri-State output leakage current 0≤VIN≤VCCQ -10 10 uA

Vhys Hysteresis Schmidt

trigger inputs

520 mV

VOH High-level Output Voltage IOH=4mA-

12mA

2.4 V

VOL Low-level Output Voltage IOH=4mA-

12mA

0.4 V

PU Pull up resistance 50 65 100 kΩ

PD Pull down resistance 40 56 107 kΩ

Turbo mode 30 60

Icc

Active supply current1

(cycle time = 60 ns) Power Save

mode

20 402

Standby mode 5 10 mA

ICCS

Standby supply current1

DPD mode

110

150

Note: Sum of all current on VCC, VCCQ and VCC2 balls. CL = 0 pF. T=25C.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

68 92-DS-1205-10

10.3 Timing Specifications

10.3.1 Operating Conditions

Timing specifications are based on the conditions defined in Table 12.

Table 12: Operating Condi t ions

Parameter 1.8V 3.3V

Ambient temperature (TA) -40°C to +85°C -40°C to +85°C

Supply Voltage (VCCQ) 1.65V – 1.95V 2.7V – 3.6V

CLK, SCS#, SI,

SO, SCLK 3ns 3ns

Input fall

and rise

time (10%-

90%

VCCQ)

All other inputs 5ns 5ns

Input timing level VCCQ/2 VCCQ/2

Output timing level VCCQ/2 VCCQ/2

Output Load

Push/Pull outputs 30pF 30pF

Note: Max input fall and rise is 100ns.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

69 92-DS-1205-10

10.3.2 Demux Asynchronous Read Timing

Figure 22: Demux Asynchronous Read Timing

D0 D1

Tacc (ipl_ram)

Tacc (ipl_ram) Tdh

Tsua

ddress

Data

Figure 23: Demux Read Tim i ng – Asynchronous Boot Mode

Table 13: Demux Asynch ronous Read Timing Parameters

Symbol 1.8V 3.3V

Description Min Max Min Max

Units

Tsua Address setup time (Figure 22) 1 1 ns

Tsua Address setup time (Figure 23)

– Asynchronous boot mode -2 -2 ns

Tacc(async) Asynchronous access time

(Registers) 18 15 ns

Tacc(ipl_ram) RAM access time 25 22 ns

Tdh Data hold time 1.5 10 1.5 10 ns

Tah Address hold time 0 0 ns

Tw(ceh) CE# high pulse width 10 10 ns

Tw(cel) CE# low pulse width 20 15 ns

Tw(oeh) OE# high pulse width 10 10 ns

Tw(oel) OE# low pulse width 20 15 ns

Note: Tw(cel) must be greater than or equal to Tw(oel).CE# falling edge should together with or

before OE# falling edge, not after.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

70 92-DS-1205-10

10.3.3 Demux Asynchronous Write Timing

Figure 24: Demux Asynch ronous Write Timing

Table 14: Demux Asynch ronous Write Timing Parameters

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tasu Address setup 1 1.2 ns

Tah Address hold time 3 3 ns

Tdsu Data setup 11 11 ns

Tdh Data hold 0 0 ns

Tw(ceh) CE# high pulse width 10 10 ns

Tw(cel) CE# low pulse width 15 15 ns

Tw(weh) WE# high pulse width 10 10 ns

Tw(wel) WE# low pulse width 15 15 ns

Note: Tw(cel) must be greater than or equal to Tw(wel).

10.3.4 Multiplexed Asynchronous Read Timing

Address valid D0

Tacc Tdh

Tah

Tasu

TavdoeTavdTav d

Tw (oeh)Tw (oeh)Tw (oel)Tw (oel)

Data

Figure 25: Multiplexed Asynchronous Rea d Timing Diagram

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

71 92-DS-1205-10

0 D0

Tdh

Tdsu

Tah

Tasu

TavdweTavd Tavd

Tw(weh)Tw(wel) Tw(weh)Tw(wel)

Data

Table 15: Multiplexed Asynchronous Read Timing Parameters

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tasu Address setup 3 2 ns

Tah Address hold 5 5 ns

Taccs Access time 15 13 ns

Tdh Data hold 1.5 1.4 ns

Tavd AVD# pulse width 6 6 ns

Tw(oel) OE# low pulse width 15 15 ns

Tw(oeh) OE# high pulse width 10 10 ns

Tavdoe AVD rising to OE falling 6 6 ns

10.3.5 Multiplexed Asynchronous Write Timing

Figure 26: Multiplexed Asynchronous Write Timing Diagram

Table 16:

Multiplexed

Asynchronous Write Timing Parameters

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tasu Address setup 3 2 ns

Tah Address hold 5 5 ns

Tdsu Data setup time 12 11 ns

Tdh Data hold 0 0 ns

Tavd AVD# pulse width 6 6 ns

Tw(wel)

WE# low pulse width

WE# should be negated

before or together with

CE#

15 15

Tw(weh) WE# high pulse width 5 5 ns

Tavdwe AVD rising to WE falling 1 1 ns

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

72 92-DS-1205-10

10.3.6 Demux Burst Read Timing

Figure 27: Demux Burst Read Tim ing Diagram

Table 17: Demux Burst Read Timing Parameters

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tasu Address setup 4 4 ns

Tah Address hold 2.5 2.5 ns

Tcesu CE# setup 9 9 ns

Tacc Access time 11.2 8.1 ns

Tcyc Burst clock cycle time 14 11 ns

Tdh Data hold time 2 2 ns

Notes: 1. All timing specifications are with reference to the rising edge of the Burst clock (CLK

signal).

2. Shown with the following Burst Mode Control Register (Read) parameters:

• HOLD = 0

• LENGTH = 8

• LATENCY = 0

• WAIT_STATE = 0

3. This diagram is applicable only if working with continuous clock.

4. Burst clock cycle time (Tcyc) values are specified for Turbo mode. While in Power-

Save mode, clock cycle time should be doubled.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

73 92-DS-1205-10

10.3.7 Demux Burst Write Timing

D0 D1 D2 D3

Tdh

Tdsu

Tweh

Twesu

Tah

Tasu

Tces u

TcycTcyc

Burst CLK

Addre s s

Data

Figure 28: Demux Burst Write Timing Diagram

Table 18: Demux Burst Write Timing Parameters

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tasu Address setup 4 4 ns

Tah Address hold 2.5 2.5 ns

Tcesu CE# setup 7 7 ns

Twesu WE# setup time 4 4 ns

Tweh WE# hold time 5 5 ns

Tcyc Burst clock cycle time 12.5 12.5 ns

Tdsu Data setup time 4 4 ns

Tdh Data hold time 2.5 2.5 ns

Notes: 1. All timing specifications are with reference to the rising edge of the Burst clock (CLK

signal).

2. Shown with the following Burst Mode Control Register (Read) parameters:

• HOLD = 0

• LENGTH = 8

• LATENCY = 0

• WAIT_STATE = 0

3. This diagram is applicable only if working with continuous clock.

4. Burst clock cycle time (Tcyc) values are specified for Turbo mode. While in Power-

Save mode, clock cycle time should be doubled.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

74 92-DS-1205-10

10.3.8 Multiplexed Burst Read Timing

Valid address D0 D1 D2 D3 D4 D5 D6 D7

Tacc

Tdh

Tah

Tasu

Tavdh

Tavdsu

Tcesu

TcycTcyc

Burst CLK

AVD

Data

Figure 29: Multiplexed Burst Read Timing Diagram

Table 19: Multiplexed Burst Read Timing Parameters

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tasu Address setup 4 4 ns

Tah Address hold 2.5 2.5 ns

Tcesu CE setup 9 9 ns

Tacc Access time 11 8 ns

Tcyc Burst clock cycle time 12.5 12.5 ns

Tdh Data hold time 2 2 ns

Tavdsu AVD setup time 7 7 ns

Tavdh AVD hold time 1 1 ns

Notes: 1. All timing specifications are with reference to the rising edge of the Burst clock (CLK

signal).

2. Shown with the following Burst Mode Control Register (Read) parameters:

• HOLD = 0

• LENGTH = 8

• LATENCY = 1

• WAIT_STATE = 0

3. Burst clock cycle time (Tcyc) values are specified for Turbo mode. While in Power-

Save mode, clock cycle time should be double.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

75 92-DS-1205-10

10.3.9 DMA Request Timing Diagram

10.3.9.1 Asynchronous Data Transfer

Table 20 lists DMA request timing parameters and Figure 30 shows the DMA request timing

diagram in Asynchronous data transfer.

Tp(ce/oe)

Tw(dmarq)Tw(dmarq)

CE/OE

DMARQ#

Figure 30: DMA Request Timing Diagram (Asynchronous Data Transfer)

Table 20: DMA Request Tim ing Parameters (Asynchronous Data Transfer)

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tw(dmarq) DMARQ# pulse width1 20 20 ns

Tp(ce/oe)

CE/OE to DMARQ#

negation2 19 16 ns

Notes: 1. Applies to EDGE mode only. The DMARQ# pulse width can be configured by SW.

2. Applies to LEVEL mode only. Values refer to rising of CE or OE signal, which ever

negated first.

10.3.9.2 Synchronous Data Transfer

Table 21 lists DMA request timing parameters and Figure 31 shows the DMA request timing

diagram in Synchronous data transfer.

Tp(bc lk)

Tw (dmarq)Tw (dmarq)

BCLK

MA RQ#

CLK

Figure 31: DMA request Timing Diagra m (Synchronous Data Transfer)

Table 21: DMA Request Tim i ng Parameters (Synchronou s Data Transfer)

1.8V 3.3V

Symbol Description

Min Max Min Max

Units

Tw(dmarq) DMARQ# pulse width1 20 20 ns

Tp(bclk) CLK to DMARQ# negation2 17 13 ns

Notes: 1. Applies to EDGE mode only. The DMARQ# pulse width can be configured by SW.

Timing is relative to the rising edge of CLK which samples CE# asserted.

2. Applies to LEVEL mode only.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

76 92-DS-1205-10

10.3.10 SPI Timing

Table 22 lists SPI slave timing parameters. Figure 32 and Figure 33 show the SPI slave timing

diagram.

Table 22: Slave SPI Timing Parameters

Symbol 1.8V 3.3V

Description Min Max Min Max Units Notes

tw(SCLK1) SCLK high pulse width 15 15 ns

tw(SCLK0) SCLK low pulse width 15 15 ns

tcyc(SCLK) SCLK period 40 40 ns

tsu(SI) SI to SCLK setup 8 8 ns

tho(SI) SCLK to SI hold 8 8 ns

tsu(SCS#) SCS# to SCLK setup 8 8 ns

tho(SCS#) SCLK to SCS# hold 16 16 ns

tw(SCS#1) SCS# high pulse width 16 16 ns

tp(SO1) SCLK to SO Ç delay 22 17 ns

tp(SO0) SCLK to SO È delay 22 16 ns

thiz(SO) SCS# Ç to SO Hi-Z 12 10 ns

tHIZ(SO)tp(SI0)

tp(SI1)

tHO(SI)

tSU(SI)

tw(SCS#1)tw(SCS#1)

tw(SCLK1)tw(SCLK1)

tw(SCLK0)tw(SCLK0)

tw(SCLK0)

tcyc(SCLK)

tw(SCLK0)tw(SCLK1)tw(SCLK1)

tcyc(SCLK)

SCLK (mode 0,3)

SCLK (mode 1,2)

SCS#

Figure 32: Slave SPI Data Timing

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

77 92-DS-1205-10

Figure 33: Slave SPI Control Timing

10.3.11 Power Supply Sequence

When operating mDOC H3 with separate power supplies powering the VCCQ, VCC, VCC1 or

VCC2 rails, it is desirable to turn the supplies on and off simultaneously. Providing power to one

supply rail and not the other (either at power-on or power-off) can cause excessive power

dissipation. Damage to the device may result if this condition persists for more than 500 msec.

10.3.12 Power-Up Timing

mDOC H3 is reset by assertion of the RSTIN# input. When this signal is negated, mDOC H3

initiates a download procedure from the flash memory into the internal Programmable Boot

Block. During this procedure, mDOC H3 does not respond to read or write access.

Host systems must therefore observe the requirements described below for initial access to

mDOC H3. Any of the following methods may be employed to guarantee first-access timing

requirements:

• Use a software loop to wait at least Tp (BUSY1) before accessing the device after the

reset signal is negated.

• Poll the state of the BUSY# output.

• Use the BUSY# output to hold the host CPU in wait state before initiating the first access

which will be a RAM read cycle. At least one of the signals CE# and OE# must be kept

negated (high) until BUSY# is negated.

Hosts that use mDOC H3 to boot the system must employ the latter option or use another method

to guarantee the required timing of initial access.

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

78 92-DS-1205-10

Table 23: Power-Up Timing Parameters

Symbol Description Min Max Units

TREC (VCC-RSTIN) VCC/VCCQ stable to RSTIN# Ç1 500

μs

TW (RSTIN) RSTIN# asserted pulse width 50 ns

TP (BUSY0) RSTIN# È to BUSY# È 50 ns

TP (BUSY1) RSTIN# Ç to BUSY# Ç3 75 ms

TP (VCC-BUSY0) VCC/VCCQ stable to BUSY# È 500 μs

Tsu (RSTIN-AVD) RSTIN# Ç to AVD# Ç2 3

μs

Tsu (BUSY-CE) BUSY# Ç to CE# È 0

μs

Trise (RSTIN) RSTIN# rise time 20 ns

Notes: 1. Specified from the final positive crossing of VCC/VCC1/VCC2/VCCQ minimum

voltages.

2. Applies to multiplexed interface only.

3. TP (BUSY1) depends on IPL mode (Normal / Paged ) and device capacity. For

unformatted devices this time may be up to one second.

Figure 34: Reset Timing

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

79 92-DS-1205-10

10.4 Mechanical Dimensions

10.4.1 mDOC H3 1Gb (128MB)/2Gb (256MB)/ 4Gb (512MB)

FBGA 128MB (1Gb) dimensions: 9.0 ±0.1 mm x 12.0 ±0.1 mm x 1.1 ±0.1 mm

Ball pitch: 0.8 mm

9.0

12.0

1.1±0.1

0.26±0.04 0.8

0.4

0.9

0.8

12345678910

0.46±0.05

Top Side Bottom

0.8

0.20 S A

0.20 S B

0.10 S

0.06

S AB

0.15

INDEX

Figure 35: Mechanical Dim ensions 9x12 FBGA Package

Dimensions in mm Symbol Ordering info

Min Nom Max

b MD2534-d2G-X-P 0.41 0.46 0.51

b SDED7-256M-N9 0.30 0.35 0.40

b SDED5-512M-N9 0.30 0.35 0.40

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

80 92-DS-1205-10

10.4.2 mDOC H3 4Gb (512MB)/8Gb (1GB)

FBGA dimensions: 10.0 ±0.1 mm x 14.0 ±0.1 mm x 1.1 ±0.1 mm

Ball pitch: 0.8 mm

10±0.1

14±0.1

1.1±0.1

0.23±0.05 0.4

0.4

0.8

1.4

1.8

12345678910

0.35±0.05

Top Side Bottom

INDEX

0.8

Figure 36: Mechanical Di mensions 10x14 FBGA Package

Rev. 1.3

Product Specifications

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

81 92-DS-1205-10

10.4.3 mDOC H3 8Gb (1GB)/ 16Gb (2GB)/ 32Gb (4GB) / 64Gb (8GB)

FBGA dimensions: 12.0 ±0.1 mm x 18.0 ±0.1 mm x 1.3 ±0.1 mm

Ball pitch: 0.8 mm

Symbol Ordering Info Max Height(mm)

h SDED7-001G-NT 1.4

h SDED7-002G-NT 1.4

h SDED5-002G-NC 1.2

h SDED5-004G-NC 1.2

h SDED5-008G-NC 1.4

Figure 37: Mechanical Dim ensions 12x18 FBGA Package

Rev. 1.3

Ordering Information

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

82 92-DS-1205-10

11. ORDERING INFORMATION

See Table 24 for mDOC H3 devices available and the associated order information.

Table 24: mDOC H3 Ordering Inform ation

Capacity

Ordering Code

MB Mb

Package Temperature

Range

MD2534-d1G-X-P

MD2534-d1G-X-P/Y

128 1024

(1Gbit)

9x12x1.2

BGA 115

balls

-40°C to +85°C

SDED7-256M-N9T

SDED7-256M-N9Y

256 2048

(2Gbit)

9x12x1.2

BGA 115

balls

-25°C to +85°C

SDED7-512M-NAT

SDED7-512M-NAY

512 4096

(4Gbit)

10x14x1.2

BGA 115

balls

-25°C to +85°C

SDED5-512M-N9T

SDED5-512M-N9Y

512 4096

(4Gbit)

9x12x1.2

BGA 115

balls

-25°C to +85°C

SDED5-001G-NAT

SDED5-001G-NAY

1024

(1GB)

8192

(8Gbit)

10x14x1.2

BGA 115

balls

-25°C to +85°C

SDED5-002G-NCT

SDED5-002G-NCY

2048

(2GB)

16384

(16Gbit)

12x18x1.2

BGA 115

balls

-25°C to +85°C

SDED5-004G-NCT

SDED5-004G-NCY

4096

(4GB)

32768

(32Gbit)

12x18x1.2

BGA 115

balls

-25°C to +85°C

SDED5-008G-NCT

SDED5-008G-NCY

8192

(8GB)

65536

(64Gbit)

12x18x1.4

BGA 115

balls

-25°C to +85°C

Notes: 1. SDE Product Codes: T suffix specifies shipment in Tape & Reel; Y suffix specifies

shipment in trays.

2. MD Product Codes:: Y suffix specifies shipment in trays; if not specified, shipment is in Tape

& Reel

Rev. 1.3

Markings

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

83 92-DS-1205-10

12. MARKINGS

12.1 mDOC H3 1Gb (128MB)

Markings for MD2533-d1G XXX and MD2533-d26G XXX products:

First row: Logo

Second row: Product name

Third row: Ordering information

Fourth row: Production information:

yyww - Year and week

xx - Product status: Engineering samples “-ES”, Customer samples “-CS”

Forth row: ddddddd - Internal marking

Figure 38: MD2534-d1G-X-P Product Marking

Rev. 1.3

Markings

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

84 92-DS-1205-10

12.2 mDOC H3 2Gb (256MB)/ 4Gb (512MB)/ 8Gb (1GB)/ 16Gb (2GB)/ 32Gb

(4GB) / 64Gb (8GB)

All products with ordering info of SDE-ZZ-XXXY-BBB will have following marking:

First row: Logo

Second row: VYWWXXXXN

V-Internal use

Y-year

WW-work week

XXXX – Internal use

N-Internal use

Third row: Ordering information

Fourth row: Internal use

Fifth row: country of origin i.e ‘TAIWAN’ or ‘CHINA’

XX is ‘ES’ or ‘CS’. There will be no XX marking for products in mass

production.

Figure 39: Example of SDED7-512M-NA Product Marking

Rev. 1.3

Disclaimer of Liability

mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

85 92-DS-1205-10

DISCLAIMER OF LIABILITY

SanDisk IL Ltd.’s general policy does not recommend the use of its products in life support

applications wherein a failure or malfunction of the product may directly threaten life or injury.

Accordingly, in any use of products in life support systems or other applications where failure

could cause damage, injury or loss of life, the products should only be incorporated in systems

designed with appropriate redundancy, fault tolerant or back-up features.

SanDisk IL shall not be liable for any loss, injury or damage caused by use of the Products in any

of the following applications:

Special applications such as military related equipment, nuclear reactor control, and aerospace

Control devices for automotive vehicles, train, ship and traffic equipment

Safety system for disaster prevention and crime prevention

Medical-related equipment including medical measurement device.

Rev. 1.3 mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet

86 92-DS-1205-10

HOW TO CONTACT US

USA

SanDisk Corporation, Corporate Headquarters.

601 McCarthy Blvd

Milpitas, CA 95035

Phone: +1-408-801-1000

Fax: +1-408-801-8657

China

SanDisk China Ltd.

Room 121-122

Bldg. 2, International Commerce & Exhibition Ctr.

Hong Hua Rd.

Futian Free Trade Zone

Shenzhen, China

Phone: +86-755-8348-5218

Fax: +86-755-8348-5418

Europe

SanDisk IL Ltd.

7 Atir Yeda St.

Kfar Saba 44425, Israel

Tel: +972-9-764-5000

Fax: +972-3-548-8666

Internet

Sandisk.com/oem

General Information

oemsupport@SanDisk.com

Japan

SanDisk Japan Inc.

Asahi Seimei Gotanda Bldg., 3F

5-25-16 Higashi-Gotanda

Shinagawa-ku Tokyo, 141-0022

Phone: +81-3-5423-8101

Fax: +81-3-5423-8102

Taiwan

SanDisk Asia Ltd.

14 F, No. 6, Sec. 3

Minquan East Road

Taipei, Taiwan, 104

Tel: +886-2-2515-2522

Fax: +886-2-2515-2295 Sales and Technical Information

oemsupport@SanDisk.com

This document is for information use only and is subject to change without prior notice.

SanDisk IL Ltd assumes no responsibility for any errors that may appear in this document, nor for incidental or consequential

damages resulting from the furnishing, performance or use of this material.

SanDisk IL’s products are not warranted to operate without failure. SanDisk IL’s general policy does not recommend the use of

its products in life support applications where a failure or malfunction of the product could cause injury or loss of life. Per

SanDisk IL’s Terms and Conditions of Sale, the user of SanDisk IL’s products in life support applications assumes all risk of

such use and indemnifies SanDisk IL against all damages. See “Disclaimer of Liability". Accordingly, in any use of the Product

in life support systems or other applications where failure could cause injury or loss of life, the Product should only be

incorporated in systems designed with appropriate and sufficient redundancy or backup features.

Contact your local SanDisk sales office or distributor, or visit our website at www.sandisk.com to obtain the latest specifications

before placing your order.

TrueFFS, SanDisk and SanDisk logo are registered trademarks of SanDisk IL Ltd. and SanDisk Corporation, respectively.

Other product names or service marks mentioned herein may be trademarks or registered trademarks of their respective owners

and are hereby acknowledged.