TLP292-4
2015-10-21
1
T OS HIBA PHOT O COUPL ER InGaAs IRED & PHOTO-TRANSISTOR
TLP292-4
Programmable Controllers
Switching Power Supplies
Simplex/Multiplex Data Transmissions
TLP292-4 consi sts of ph ototr ansi stors optica lly couple d to two InGaAs infrared
emitting diodes connected inverse parallel, and can operate directly by AC
input current.
TLP292-4 is housed in the very small and thin SO 16 pac ka g e.
Since TLP292-4 is guaranteed wide operating temperature (Ta=-55 to 125 ˚C)
and high isolation voltage (3750 Vrms), it is suitable for high-density surface
mount appli cations such as programmab le cont r oll ers.
Collector-Emitter Voltage : 80 V (min)
Current Transfer Ratio : 50% (min)
Rank GB: 100 %(min)
Isolation Voltage : 3750 Vrms (min)
Operation temperature range: -55 to 125 ˚C
Safety standards
UL- approved: UL1577, File No. E67349
cUL- approved: CSA Component Acceptance Service No.5A,
File No. E67349
CQC- approved : GB4943.1, GB8898
仅适用干海拔
2000 m
以下地区安全使用
VDE-under application : EN60747-5-5 (Note)
Note : When an EN60747-5-5 approved type is needed,
please designate the Option (V4).
Construction Mechanical Rating
Start of commercial production
2014-04
TOSHIBA
11-11F1
Weight: 0.19 g (typ.)
Creepage Distanc e
Clearance
Internal isol ation t hickness
5.0 mm (min)
5.0 mm (min)
0.4 mm (min)
1,3,5,7 : Cathode, An ode
2,4,6,8 : Anode, Cathode
9,11,13,15 : Emitter
10,12,14,16 : Collector
TLP292-4
Unit: mm
8
9
1
2
3
4
5
6
7
10
11
12
13
14
15
16
TLP292-4
2015-10-21
2
Current Transfer Ratio (Unless otherw ise specified, Ta=25°C)
Note 1: Specify both the part number and a rank in this format when ordering.
Example: rank GB: TLP292-4(GB,E
For safety standard certification, however, specify the part number alone.
TLP292−4 (GB,E: TLP292-4
Note2: The LA and LGB rank are made CTR rank of the low input current condition.
Rank
(Note1) Test conditi on
Current Transf er Ratio
(%)
Marking of Classif ication
IC / IF
Min Max
Blank IF =±5 mA, VCE = 5 V 50 600 Brank
GB 100 600 GB
LA (Note2) IF =±0.5 mA, VCE = 5 V 50 600 LA
LGB (Note2) 100 600 LB
TLP292-4
2015-10-21
3
Absolute Maxim um Ratings (Note)(Unless otherwise specified, Ta = 25°C)
Characteristics Symbol Note Rating Unit
LED
R.M.S. forward current IF(RMS) ±50 mA
Input forward current derating (Ta≥50°C) ∆IF /ΔTa −0.59 mA /°C
Input forward current(Pulsed) IFP (Note1) ±1 A
LED power disipati on PD 70 mW
LED power diss i pation derat i ng(Ta≥50°C) ∆PD /ΔTa -0.82 mW /°C
Junction temperature Tj 125 °C
DETECTOR
Collector-em itter voltage VCEO 80 V
Emitter-collector voltage VECO 7 V
Collector current IC 50 mA
Collector power dissipation (1 Circuit) PC 100 mW
Collect or power dissipation
derating(Ta≥25°C) (1 Circuit) ∆PC /ΔTa -0.91 mW /°C
Junction temperature Tj 125 °C
COMMON
Operating tem perature range Topr −55 to 125 °C
Storage temperature range Tstg −55 to 125 °C
Lead soldering temperature Tsol 260 (10 s) °C
Total power dissipation
(1 Circuit) PT 170 mW
Input power dissipation derating (Ta≥25°
C)
(1 Circuit)
∆PT /ΔTa −1.55 mW /°C
Isolation Voltage AC, 60s, R.H.≤60% BVS (Note2) 3750 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating t emper at ur e/ current/voltage, etc .) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data ( i. e. r elia bil it y test
report and estimated failure rate, etc).
Note1: Pulse width ≤ 100 μs, frequency 100 Hz
Note2: This device is considered as a two-terminal device: All pins on the LED side are shorted together,
and all pin on the photodetector side are shorted together.
Electrical Characteristics (U nless other wise specified, Ta = 25°C)
CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT
LED
Input forward voltage VF IF = ±10 mA 1.1 1.25 1.4 V
Input capacitance CT V = 0 V, f = 1 MHz — 60 — pF
DETECTOR
Collector-emitter breakdown voltage V(BR) CEO IC = 0.5 mA 80 — — V
Emitter-collector breakdown voltage V(BR) ECO IE = 0.1 mA 7 — — V
Dark current IDARK VCE = 48 V, — 0.01 0.08 μA
VCE = 48 V, Ta = 85°C — 2 50 μA
Collector-emitter capacitance CCE V = 0 V, f = 1 MHz — 10 — pF
TLP292-4
2015-10-21
4
Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT
Current transf er ratio IC / IF IF = ±5 mA, VCE = 5 V 50 — 600 %
Rank GB
100 — 600
Saturated current transfer ratio IC / IF (sat) IF = ±1 mA, VCE = 0.4 V — 60 — %
Rank GB
30 — —
Collector-emitter saturation voltage VCE (sat)
IC = 2.4 mA, IF = ±8 mA — — 0.3
V
IC = 0.2 mA, IF = ±1 mA — 0.2 —
Rank GB
—
— 0.3
Off-state collector current IC (off) VF = ±0.7 V, VCE = 48 V — — 10 μA
Collector current ratio IC (ratio) IC (IF = −5 mA) / IC (IF = 5 mA)
(Figure 1)
0.33 — 3 —
Figure 1: Collector current ratio test circuit
)V5
CE
V,
1F
I
F
I(
1C
I)V5
CE
V,
2F
I
F
I(
2C
I
)ratio(C
I==
==
=
Isolation Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT
Total capacitance (input to output) CS VS = 0 V, f = 1 MHz — 0.8 — pF
Isolation resistance RS VS = 500 V, R.H.≤60% 1×10
12
10
14
—
Ω
Isolation voltage BVS
AC , 60 s 3750 — —
Vrms
AC , 1 s, in OIL — 10000 —
DC , 60 s, in OIL — 10000 — Vdc
Switching Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT
Rise time tr
VCC = 10 V, IC = 2 mA
RL = 100 Ω
— 2 —
μs
Fall time tf —
3 —
Turn-on time ton — 3 —
Turn-off time toff —
3 —
Turn-on time ton RL = 1.9 kΩ (Figure 2)
VCC = 5 V, IF = 16 mA
—
1.5 —
μs Storage time ts —
20 —
Turn-off time toff — 35 —
Figure 2: Switchin Time Test Circuit
V
CE
V
CC
R
L
I
F
I
F
V
CE
VCC
0.5 V
4.5 V
t
off
t
on
t
S
TLP292-4
2015-10-21
5
Characteristics Curves (Note)
IF-Ta PC-Ta
Input forward current IF (mA)
Collect or power dissipat i on
PC (mW)
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
IFP- D R IF- V F
Input forward current (puls ed)
IFP (mA)
Input
forward current I
F (mA)
Duty c ycl e r atio DR Input forward voltage VF (V)
∆VF/∆Ta- I F IF P – V F P
Input forward current temperature coefficient
ΔVF /ΔTa (mV/°C)
Input forward
current (pulsed) IFP (mA)
Input forward current IF (mA) Input forward voltage (pulsed) V FP (V)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherw ise not ed.
Pules width ≤100 μs
Ta=25˚C
10-3
10-2
10-1
100
Pulse width ≤10 μs
Repetitive frequency=100 Hz
Ta=25°C
This curve shows the
maximum limit to the input
forward current.
This curv e s ho ws the ma ximum
limit to the
collector power
dissipation.
This curve shows the
maximum limit to the input
forward current (pulsed).
125˚C
110˚C
85˚C
50˚C
25˚C
0˚C
-25˚C
-55˚C
TLP292-4
2015-10-21
6
IC- V CE IC- V CE
Collector current
IC (mA)
Collector current
IC (mA)
Collector-emitter voltage VCE (V) Collector-emitter voltage VCE (V)
IC- I F
I
C
/I
F
- I
F
Collector current I
C (mA)
Current transf er ratio
IC / IF (%)
Input forward voltage IF (mA) Input forward current IF (mA)
IDARK-Ta VCE(sat) - Ta
Dark current IDARK (μA)
Collector-
emitter saturation voltage
VCE(sat) (V)
Ambient temperature Ta (°C) Ambient temperature Ta (°C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherw ise not ed.
VCE=10 V
VCE=5 V
VCE=0.4 V
VCE=10 V
VCE=5 V
VCE=0.4 V
IF=8 mA, IC=2.4 mA
IF=1 mA, I C=0.2 mA
Ta=25˚C
Ta=25˚C
5 mA
10 mA
20 mA
30 mA
50 mA
P
C
(max)
5 mA
10 mA
I
F
= 2 mA
20 mA
30 mA
50 mA
Ta=25˚C
VCE=48 V
VCE=24 V
VCE=10 V
VCE=5 V
I
F
= 2 mA
Ta=25˚C
TLP292-4
2015-10-21
7
I
C
- Ta
Switching time - R
L
Collector current
IC (mA)
Switching time (μs)
Ambient temperature Ta (°C)
Load resistanc e RL (kΩ)
Switching time - R
L
Switching time - Ta
Switching time (μs)
Switching time (μs)
Load resistanc e RL (kΩ)
Ambient temperature Ta (°C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherw ise not ed.
t
off
Ta=25˚C
IF=16 mA
VCC=5 V
IF=16 mA
VCC=5 V
RL=1.9 kΩ
ts
ton
t
off
ts
ton
VCE=5V
IF=0.5 mA
5 mA
1 mA
3 mA
10 mA
25 mA
Ta=25˚C
IF=1.6 mA
VCC=5 V
toff
ts
ton
TLP292-4
2015-10-21
8
Solder ing and Stor age
1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown
below, irrespectiveof whether a soldering iron or a reflow soldering method is used.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is used
∙
∙ The soldering temperature pr of il e is based on the package surface temperature
(See the figur e shown below, which is based on the package surface temperature.)
Reflow sol der ing must be performed once or twice.
The mounti ng should be completed with the interval from the f irst t o the last mountings being 2
weeks.
2) When using soldering Flow
Preheat the device at a temp er at ur e of 150 °C (package surface temperature ) for 60 t o 120
seconds.
Mounti ng condition of 260 °C within 10 seconds is reco m me nded
Flow soldering must be performed once.
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperatur e not ex ceeding 260 °C or within 3
seconds not exceeding 350 °C
Heating by soldering iron must be done on ly onc e per lead.
2. Precautions for General Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
TLP292-4
2015-10-21
9
Option: Specification for Embossed-Tape Packing
(TP) for M ini-Flat Coupler
1. Applicable Package
Package Name Product T ype
SO16 Mini-Flat Coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
Example) TLP292-4(GB-TP,E
Part number: TLP292-4
CTR rank: GB
Tape type: TP
[[G]]/RoHS COMPATIBLE: E (Note)
Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 Jun 2011 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
3. Tape Dimensions Specification
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 3.1.1.
Figure3.1.1 Device Orientation
3.2 Packing Quantity
2000 pcs per reel
3.3 Empty Device Recesses are as Shown in Table 1.
Table1 Empty Device Recesses
Standard Remarks
Occurrenc es of 2 or m ore
successive empty device
recesses 0 device Within any given 40-
mm section of
tape, not including l eader and trailer
Single empty devic e
recesses 6 device (m ax) per reel Not incl udi ng l eader and trailer
3.4 Tape Leader and Trailer
The start end of the tape has 50 or more empty cavities. The hub end of the tape has 50 or more empty
cavities and two empty turns only for a cover tape.
Direction of Tape feed
TLP292-4
TLP292-4
2015-10-21
10
3.5 Tape Dimensions
Tape material: Plastic (protection against electrostatics)
Figure3.5.1 Tape Forms
Table 3.5.1 Tape Dimensions
Unit: mm
unless otherwise specified: ±0.1
Symbol Dimension Remark
A 7.5 ―
B 10.5 ―
D 7.5 Center line of indented square hole and sprocket hole
E 1.75 Distance between tape edge and hole center
F 12.0 Cumulative error +0.1/-0.3 (max) per 10 feed holes
G 4.0 Cumul ative error +0.1/-0.3 (m ax) per 10 feed holes
K0 2.2 Internal space
0.3 ± 0.05
2.6 ± 0.2
K0
F
φ
1.5
±
0.1
E D
B
16.0 ± 0.3
φ
1.5
+0.1
−0
A
G
2.0
± 0.1
TLP292-4
2015-10-21
11
3.6 Reel specification
Material: Plastic
Figure 3.6.1 Reel Dimensions
4. Packing
Either one reel or ten reels (maximum) of photocouplers are packed in a shipping carton.
5. Label Format
The label on each carton provides the part number, quantity, lot number, the Toshiba logo, CTR rank, etc.
6. Ordering Information
When placing an order, please specify the part number, CTR rank, tape type and quantity (must be a
multiple of 2000) as shown in the following example.
Example) TLP292-4(GB-TP,E 2000 Pcs
Part number: TLP292-4
CTR rank (GB
Tape type: TP
[[G]]/RoHS COMPATIBLE: E (Note)
Quantity (must be a multiple of 2000): 2000 Pcs
Note : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Counci l of 8 Jun 2011 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Symbol Dimension
A φ330 ± 2
B φ80 ± 1
C φ13 ± 0.5
E 2.0 ± 0.5
U 4.0 ± 0.5
W1 17.5 ± 0.5
W2 21.5 ± 1.0
E
W1
W2
A
B
C
U
Table 3.6.1 Reel Dimensions
Unit: mm
TLP292-4
2015-10-21
12
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, soft ware and systems (coll ect i vel y "Product" ) without not ice.
• This document and any information herein may not be reproduced without pr i or writt en permiss i on from TOSHIBA. Even wit h
TOSHIBA's written permission, reproduct i on is permiss i bl e only if reproduction is without alteration/omission.
• Though TOSHIB A works conti nually to improve Product 's qual ity and reliabil i t y, Product can malfunction or fail. Customers are
responsibl e for complyi ng with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimi ze risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before cust om ers use the Product, create designs including the
Product, or incorporat e the Product into thei r own applicati ons, c ust om ers must also refer t o and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specificati ons, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instruct i ons for the applicati on with which the Product will be used with or for. Customers are solely responsibl e for all as pects of their
own product design or applications, includi ng but not limit ed to (a) determini ng the appropriateness of the use of this Product in such
design or applications; (b) evaluat ing and determ i ni ng the applic abi lity of any information contained in this document, or in charts,
diagrams, programs, al gorithms , sample application circuits, or any other referenced docum ents; and (c) validati ng al l operati ng
parameters for such designs and applications. TOSHIBA ASSUM ES NO LIABIL ITY FOR CUSTOM ERS ' PRODUCT DE S IGN OR
APPLICATIONS.
• PRODUCT IS NEI THE R INTENDE D NO R WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR REL IABILITY, AND/OR A MALFUNCTION OR FAILURE OF W HICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJ URY, SERIOUS PROPERTY DAMAGE AND/OR SE RIOUS PUBLIC IMPAC T
("UNINTENDED USE"). Except for specific applicati ons as expressly stated i n this document, Uni ntended Us e i ncludes, without
limitati on, equipm ent used in nuclear fac ili t i es, equipm ent used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipm ent, equipment us ed to control combustions or explosions ,
safety devices, elevators and escalators , devic es rel ated to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNI NTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, pleas e contact your
TOSHIBA sales representative.
• Do not disassemble, anal yze, reverse-engineer, al t er, modify, transl ate or copy Produc t, whether in whole or in part.
• Product shall not be used for or incorporated int o any products or systems whose manufacture, us e, or sale is prohibit ed under any
applicable l aws or regulations.
• The information cont ai ned herein is presented onl y as guidance for Product use. No responsi bility is as sumed by TOSHIBA for any
infringement of patents or any other intellect ual property ri ght s of thi rd parties t hat may result f rom the use of Product. No license to
any intellectual property right is granted by this document, whether exp ress or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EX TENT ALLO WABLE BY LAW, TOS HIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONS EQUENTIAL, SPECIAL, O R INCI DENTAL DAMAGES OR
LOSS, INCL UDING WITHOUT LIMITATI O N, LOSS OF PROFITS, LOS S OF OPPO RTUNI TIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CO NDITIONS REL ATED TO
SALE, USE OF PRODUCT, O R INFORMATION, I NCL UDING WARRANTIES OR CONDI TIO NS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INF O RMATION, O R NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmf ul to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissol ve chemic al l y or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or tec hnol ogy for any milit ary purposes, i ncl uding without
limitati on, f or the design, development, use, stockpiling or manufacturing of nuclear, chemic al , or biologic al weapons or missile
technology products (m ass destruc tion weapons). Product and related software and technology may be control l ed under the
applicable export laws and regulat ions i ncludi ng, without limi tation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administrat i on Regulations. Export and re-export of P roduct or relat ed software or tec hnol ogy are stric tly prohibi ted
except in complianc e with all applicable export laws and regulati ons.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of
Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusi on or use of controll ed
substances, includi ng without limitation, the EU RoHS Directive. TOSHIBA AS S UMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICAB LE LAWS AND REGULATIONS.