IXD_630 30-Ampere Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description * 30A Peak Source/Sink Drive Current * High Operating Voltage Capability: 35V * -40C to +125C Extended Operating Temperature Range * Under-Voltage Lockout Protection * Logic Input Withstands Negative Swing of up to 5V * Fast Rise and Fall Times: < 20ns * Low Propagation Delay Time * Low 10A Supply Current * Low Output Impedance The IXDD630/IXDI630/IXDN630 high-speed gate drivers are especially well suited for driving the latest IXYS power MOSFETs and IGBTs. The IXD_630 output can source and sink 30A of peak current while producing voltage rise and fall times of less than 20ns. Internal circuitry eliminates cross conduction and current "shoot-through," and the driver is virtually immune to latch up. Under-voltage lockout (UVLO) circuitry holds the output LOW until sufficient supply voltage is applied (12.5V for the IXD_630 versions, and 9V for the IXD_630M versions). Low propagation delays and fast, matched rise and fall times make the IXD_630 family ideal for very high frequency and high-power applications. Applications * * * * * * Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver The IXDD630 is configured as a non-inverting driver with an enable. The IXDN630 is configured as a non-inverting driver, and the IXDI630 is configured as an inverting driver. The IXD_630 family is available in a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package. Ordering Information Part Number IXDD630CI IXDD630MCI IXDD630YI IXDD630MYI IXDI630CI IXDI630MCI IXDI630YI IXDI630MYI IXDN630CI IXDN630MCI IXDN630YI IXDN630MYI DS-IXD_630-R04 Logic Configuration IN OUT EN IN OUT IN OUT UVLO Package Type Packing Method Quantity 12.5V 9V 12.5V 9V 12.5V 9V 12.5V 9V 12.5V 9V 12.5V 9V 5-Pin TO-220 5-Pin TO-220 5-Pin TO-263 5-Pin TO-263 5-Pin TO-220 5-Pin TO-220 5-Pin TO-263 5-Pin TO-263 5-Pin TO-220 5-Pin TO-220 5-Pin TO-263 5-Pin TO-263 Tube Tube Tube Tube Tube Tube Tube Tube Tube Tube Tube Tube 50 50 50 50 50 50 50 50 50 50 50 50 www.ixysic.com 1 IXD_630 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Lead Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Lead Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40C to +125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 5 5 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 IXDD630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 IXDI630 Block Diagram & Truth Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 IXDN630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 3. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 10 10 10 10 10 11 R04 IXD_630 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Lead Configurations 1.2 Lead Definitions IXDD630 CI / YI Lead Name VCC 1 OUT 2 GND 3 IN 4 EN 5 IN Logic Input EN Output Enable - Drive lead low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI630 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 Description NC Not connected IXDN630 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 1.3 Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Range Output Current Symbol Minimum Maximum Units VCC -0.3 40 V VIN , VEN -5 VCC+0.3 V IOUT - 30 A Junction Temperature TJ -55 +150 C Storage Temperature TSTG -65 +150 C Unless stated otherwise, absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R04 www.ixysic.com 3 IXD_630 INTEGRATED CIRCUITS DIVISION 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range Symbol Range Units VCC UVLO to 35 V TA -40 to +125 C 1.5 Electrical Characteristics: TA = 25C Test Conditions: UVLO < VCC < 35V (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High UVLO < VCC < 18V VIH 3.5 - - Input Voltage, Low UVLO < VCC < 18V VIL - - 0.8 Input Current 0V < VIN < VCC IIN - - 10 EN Input Voltage, High IXDD630 only VENH 2/3VCC - - EN Input Voltage, Low IXDD630 only VENL - - 1/3VCC Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT= -100mA ROH - 0.17 0.4 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.16 0.3 IDC - - 8 tr - 11 20 Units V A V V Rise Time Limited by package power dissipation CLOAD=5.6nF, VCC=18V Fall Time CLOAD=5.6nF, VCC=18V tf - 11 18 On-Time Propagation Delay CLOAD=5.6nF, VCC=18V tondly - 46 65 Off-Time Propagation Delay CLOAD=5.6nF, VCC=18V toffdly - 46 65 Output Enable Time IXDD630 only tPZL, tPZH - 34 65 Output Disable Time IXDD630 only tPLZ, tPHZ - 65 125 IXDD630 only REN - 400 - k - 2.5 4 mA - - 0.75 - - 0.75 7 9 9.9 10 12.5 13.5 Output Current, Continuous Enable Pull-Up Resistor VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V ICC VCC=18V, VIN=VCC Under-Voltage Lockout Threshold Under-Voltage Lockout Hysteresis 4 VCC Rising, IXD_630M VCC Rising, IXD_630 IXD_630M IXD_630 www.ixysic.com UVLO - - 1 - - 1.5 - A ns mA V V R04 IXD_630 INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics: TA = - 40C to +125C Test Conditions: UVLO < VCC < 35V, TJ<150C. Parameter Conditions Symbol Minimum Maximum Input Voltage, High UVLO < VCC < 18V VIH 4 - Input Voltage, Low UVLO < VCC < 18V VIL - 0.8 Output Resistance, High State VCC=18V, IOUT= -100mA ROH - 0.6 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.45 Rise Time CLOAD=5.6nF, VCC=18V tr - 35 Fall Time CLOAD=5.6nF, VCC=18V tf - 35 On-Time Propagation Delay CLOAD=5.6nF, VCC=18V tondly - 100 Off-Time Propagation Delay CLOAD=5.6nF, VCC=18V toffdly - 100 Units V ns 1.7 Thermal Characteristics Package IXD_630CI (5-Lead TO-220) IXD_630YI (5-Lead TO-263) IXD_630CI (5-Lead TO-220) IXD_630YI (5-Lead TO-263) R04 Parameter Symbol Rating Thermal Impedance, Junction-to-Ambient JA 36 Thermal Impedance, Junction-to-Case JC 3 www.ixysic.com 46 2 Units C/W C/W 5 IXD_630 INTEGRATED CIRCUITS DIVISION 2 Functional Description 2.1 IXDD630 Block Diagram & Truth Table 2.3 IXDN630 Block Diagram & Truth Table IXDD630 IXDN630 VCC VCC IN IN OUT UVLO OUT UVLO GND GND EN IN EN OUT IN OUT 0 1 or open 0 0 0 1 1 or open 1 1 1 0 0 Z 1 0 Z 2.2 IXDI630 Block Diagram & Truth Table IXDI630 VCC IN OUT UVLO GND 6 IN OUT 0 1 1 0 www.ixysic.com R04 IXD_630 INTEGRATED CIRCUITS DIVISION CLOAD=200nF CLOAD=100nF CLOAD=50nF CLOAD=25nF CLOAD=10nF 10 15 20 25 Supply Voltage (V) 30 110 100 90 80 70 60 50 40 30 20 10 0 26 20 25 Supply Voltage (V) Fall Time (ns) Rise Time (ns) 60 40 60 tondly toffdly 20 30 0 50 100 150 Load Capacitance (nF) 80 60 toffdly 40 tondly 20 35 5 10 15 20 Input Voltage (V) 25 70 60 Max VIL 2.6 2.4 2.2 toffdly 40 30 -50 -30 -10 10 30 50 70 Temperature (C) 90 110 130 Enable Thresholds vs. Supply Voltage Input Threshold vs. Supply Voltage 22 4.0 Enable Threshold (V) 2.8 tondly 50 30 3.5 Min VIH 3.0 Max VIL 2.5 2.0 18 16 14 VENH VENL 12 10 8 6 1.8 4 2.0 -50 -30 -10 R04 Propagation Delay vs. Junction Temperature (VIN=0-5V, CLOAD= 5.6nF, VCC=18V, f=1kHz) 20 Min VIH 3.0 200 20 0 Input Threshold vs. Temperature (VCC=18V, CLOAD=5.6nF) 3.2 Input Threshold (V) 200 0 15 20 25 Supply Voltage (V) Input Threshold (V) 3.4 110 130 40 Propagation Delay vs. Input Voltage (VCC=25V, CLOAD=5.6nF, f=1kHz) 100 Propagation Delay (ns) Propagation Delay (ns) 70 10 90 0 50 100 150 Load Capacitance (nF) 80 5 10 30 50 70 Temperature (C) 20 Propagation Delay vs. Supply Voltage (VIN=0-5V, CLOAD=5.6nF, f=1KHz) 30 -50 -30 -10 35 VCC=10V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 80 0 40 30 Fall Time vs. Load Capacitance 0 50 tr 100 20 60 tf 23 20 15 80 90 24 21 VCC=10V VCC=12V,18V,25V,30V,35V 25 22 CLOAD=10nF Rise Time vs. Load Capacitance 100 Rise & Fall Times vs. Temperature (VIN=0-5V, VCC=18V, CLOAD=25nF) 27 CLOAD=50nF CLOAD=25nF 10 35 28 CLOAD=200nF CLOAD=100nF Propagation Delay (ns) 110 100 90 80 70 60 50 40 30 20 10 0 Fall Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25C) Time (ns) Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25C) Fall Time (ns) Rise Time (ns) 3 Typical Performance Characteristics 10 30 50 70 Temperature (C) 90 110 130 10 15 20 25 Supply Voltage (V) www.ixysic.com 30 35 10 12 14 16 18 20 22 24 26 28 30 32 34 36 Supply Voltage (V) 7 IXD_630 INTEGRATED CIRCUITS DIVISION f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz 1 Supply Current vs. Load Capacitance (VCC=10V) f=1MHz f=500kHz f=100kHz f=50kHz 100 10 f=10kHz 1 5000 10 1 0.1 10 1 5000 0.1 10 100 Frequency (kHz) 10 100 Frequency (kHz) 1 0.1 1000 1 1 0.1 1.0 0.8 0.6 0.4 0.2 0.0 -50 -30 -10 10 30 50 70 Temperature (C) 90 110 130 1000 VIN=3.5V VIN=5V VIN=10V VIN=0V & 18V 2.5 2.0 1.5 1.0 0.5 0.0 1 Output Source Current (A) 1.2 10 100 Frequency (kHz) Quiesent Supply Current vs. Temperature (VCC=18V) 3.0 CLOAD=25nF CLOAD=10nF CLOAD=5.6nF 10 1.4 CLOAD=25nF CLOAD=10nF CLOAD=5.6nF 10 Supply Current vs. Frequency (VCC=10V) 100 Dynamic Supply Current vs. Temperature (VCC=18V, VIN=0-5V, f =1kHz, CLOAD=5.6nF) 25000 0.01 1 1000 10000 15000 20000 Load Capacitance (pF) Supply Current vs. Frequency (VCC=18V) 100 0.01 1 Supply Current (mA) 1 1000 CLOAD=25nF 100 CLOAD=10nF CLOAD=5.6nF 0.01 8 10 25000 f=100kHz f=50kHz f=10kHz 1000 CLOAD=25nF CLOAD=10nF CLOAD=5.6nF 100 100 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5 Load Capacitance (nF) Supply Current vs. Frequency (VCC=35V) 1000 Supply Current (mA) Supply Current (mA) 5.0 0.01 10000 15000 20000 Load Capacitance (pF) Supply Current vs. Frequency (VCC=12V) 1000 f=100kHz f=50kHz f=10kHz 1 Supply Current (mA) Supply Current (mA) 1000 10 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5 Load Capacitance (nF) f=1MHz f=500kHz Supply Current (mA) 5.0 f=1MHz f=500kHz 100 Supply Current vs. Load Capacitance (VCC=12V) 1000 Supply Current (mA) 10 1000 Supply Current (mA) 100 Supply Current vs. Load Capacitance (VCC=18V) 10 100 Frequency (kHz) -50 -30 -10 1000 Output Source Current vs. Supply Voltage (VIN=7V, CLOAD=1F) -65 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 Output Sink Current (A) Supply Current (mA) 1000 Supply Current (mA) Supply Current vs. Load Capacitance (VCC=35V) 10 15 20 25 Supply Voltage (V) www.ixysic.com 30 35 10 30 50 70 Temperature (C) 90 110 130 Output Sink Current vs. Supply Voltage (VIN=7V, CLOAD=1F) 65 60 55 50 45 40 35 30 25 20 15 10 10 15 20 25 Supply Voltage (V) 30 35 R04 IXD_630 INTEGRATED CIRCUITS DIVISION 36 Output Sink Current (A) -34 -32 -30 -28 -26 -50 -30 -10 34 32 30 28 10 30 50 70 Temperature (C) 90 10 30 50 70 Temperature (C) 90 UVLO Threshold (V) 0.18 0.16 0.14 ROL @ +100mA 0.10 30 0.12 35 10 15 20 25 Supply Voltage (V) 30 35 Under-Voltage Lockout Threshold vs. Temperature - IXD_630 13.0 8.5 8.0 VCC Falling 7.5 12.5 VCC Rising 12.0 11.5 11.0 VCC Falling 10.5 10.0 7.0 15 20 25 Supply Voltage (V) 0.14 5 VCC Rising 10 ROH @ -100mA 0.16 110 130 9.0 0.20 5 0.18 Under Voltage Lockout Threshold vs. Temperature - IXD_630M 0.22 0.12 0.20 0.10 -50 -30 -10 110 130 Low-State Output Resistance vs. Supply Voltage Output Resistance () 0.22 26 -24 R04 High-State Output Resistance vs. Supply Voltage UVLO Threshold (V) Output Source Current (A) -36 Output Sink Current vs. Temperature (VCC=18V, CLOAD=1F) Output Resistance () Output Source Current vs. Temperature (VCC=18V, CLOAD=1F) -50 -30 -10 10 30 50 70 Temperature (C) www.ixysic.com 90 110 130 -50 -30 -10 10 30 50 70 Temperature (C) 90 110 130 9 IXD_630 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device IXD_630YI / IXD_630MYI IXD_630CI / IXD_630MCI Moisture Sensitivity Level (MSL) Classification MSL 3 MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Reflow Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles IXD_630YI / IXD_630MYI IXD_630CI / IXD_630MCI 245C 245C 30 seconds 30 seconds 3 1 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 10 www.ixysic.com R04 IXD_630 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 4.5.1 IXD_630YI & IXD_630MYI (5-Lead TO-263) E (Note 2) E1 E3 SYMBOL A A1 b b1 c c1 c2 D D1 D2 E E1 E3 e H L L1 L3 R R1 L1 D2 D1 D (Note 2) H * Pin 1 Indicator C C e ~4x b ~5x * Circular feature will be present on devices with the Optional Tip Lead Form. A c2 JEDEC TO-263 Optional Tip Lead Form MM MIN MAX 4.064 4.826 0.000 0.254 0.508 0.991 0.508 0.889 0.381 0.737 0.381 0.584 1.143 1.651 8.382 9.652 6.858 7.700 1.358 1.562 9.652 10.668 6.223 8.000 5.092 6.869 1.702 BSC 14.605 15.875 1.778 2.794 1.000 1.676 0.254 BSC 0.460 TYP 0.506 TYP 8 R1 10.75 (0.423) 2.20 (0.087) 8.40 (0.331) 3.80 (0.150) 8.05 (0.317) 10.50 (0.413) 1.05 (0.041) 1.702 (0.067) Dimensions mm (inches) BASE METAL c1 A1 b R1 Recommended PCB Pattern SECTION: C-C b1 PLATING (Note 3) c A1 INCH MIN MAX 0.160 0.190 0.000 0.010 0.020 0.039 0.020 0.035 0.015 0.029 0.015 0.023 0.045 0.065 0.330 0.380 0.270 0.303 0.053 0.062 0.380 0.420 0.245 0.315 0.200 0.270 0.067 BSC 0.575 0.625 0.070 0.110 0.039 0.066 0.010 BSC 0.018 TYP 0.02 TYP 8 L R NOTES: 1. Reference JEDEC TO-263 Type "BA". 2. Dimension does not include mold flash; mold flash shall not exceed 0.127mm (0.005 inch) per side. 3. Minimum plating: 1000 microinches. 4. Controlling dimension: millimeters. L R L3 L3 4.5.2 IXD_630CI & IXD_630MCI(5-Lead TO-220) A 0.127 BSC (0.005 BSC) 9.652 - 10.668 (0.380 - 0.420) B 3.810 - 3.860 (0.150 - 0.152) 3.556 - 4.826 (0.140 - 0.190) 0.508 - 1.397 (0.020 - 0.055) 0.355 M B A M 9.652 - 10.668 (0.380 - 0.420) 2.540 - 3.048 (0.100 - 0.120) 5.842 - 6.858 (0.230 - 0.270) 4.826 - 5.334 (0.190 - 0.210) 5.842 - 6.858 (0.230 - 0.270) 7.550 - 8.100 (0.297 - 0.319) 14.224 - 16.510 (0.560 - 0.650) 12.192 - 12.878 (0.480 - 0.507) 6.300 - 6.700 (0.248 - 0.264) 8.382 - 9.017 (0.330 - 0.355) THERMAL PAD 6.858 - 8.890 (0.270 - 0.350) 2.032 - 2.921 (0.080 - 0.115) C C 0.356 - 0.610 (0.014 - 0.024) 12.700 - 14.732 (0.500 - 0.580) 1.702 4x BSC (0.067 4x BSC) 0.381 - 1.016 5x (0.015 - 0.040 5x) 0.381 M B A M SECTION C-C PLATING 0.381 - 1.016 (0.015 - 0.040) BASE METAL Dimensions mm (inches) 0.356 - 0.559 (0.014 - 0.022) 0.356 - 0.610 (0.014 - 0.024) LEAD TIP 0.381 - 0.965 (0.015 - 0.038) R04 www.ixysic.com 11 IXD_630 INTEGRATED CIRCUITS DIVISION For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_630-R04 (c)Copyright 2017, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 4/5/2017 12 www.ixysic.com R04 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: IXDN630CI