LM4895 LM4895 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB Gain Literature Number: SNAS141E October 5, 2011 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB Gain General Description Key Specifications The LM4895 is a fully differential audio power amplifier primarily designed for demanding applications in mobile phones and other portable communication device applications. It is capable of delivering 1 watt of continuous average power to an 8 load with less than 1% distortion (THD+N) from a 5VDC power supply. Boomer audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of external components. The LM4895 does not require output coupling capacitors or bootstrap capacitors, and therefore is ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement. The LM4895 features a low-power consumption shutdown mode. To facilitate this, Shutdown may be enabled by either logic high or low depending on mode selection. Driving the shutdown mode pin either high or low enables the shutdown select pin to be driven in a likewise manner to enable Shutdown. Additionally, the LM4895 features an internal thermal shutdown protection mechanism. The LM4895 contains advanced pop & click circuitry which eliminates noises which would otherwise occur during turn-on and turn-off transitions. The LM4895 has an internally fixed gain of 6dB. Improved PSRR at 217Hz 80dB Power Output at 5.0V & 1% THD 1.0W(typ.) Power Output at 3.3V & 1% THD 400mW(typ.) Shutdown Current 0.1A(typ.) Features Fully differential amplification Internal-gain-setting resistors Available in space-saving packages micro SMD, MSOP and LLP Ultra low current shutdown mode Can drive capacitive loads up to 500 pF Improved pop & click circuitry eliminates noises during turn-on and turn-off transitions 2.2 - 5.5V operation No output coupling capacitors, snubber networks or bootstrap capacitors required Shutdown high or low selectivity Applications Mobile phones PDAs Portable electronic devices Typical Application 20023201 FIGURE 1. Typical Audio Amplifier Application Circuit Boomer(R) is a registered trademark of National Semiconductor Corporation. (c) 2011 National Semiconductor Corporation 200232 200232 Version 6 Revision 2 www.national.com Print Date/Time: 2011/10/05 08:10:57 LM4895 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB Gain OBSOLETE LM4895 LM4895 Connection Diagrams 9 Bump micro SMD Package 20023236 Top View Order Number LM4895IBP See NS Package Number BPA09CDB LLP Package 20023235 Top View Order Number LM4895LD See NS Package Number LDA10B Mini Small Outline (MSOP) Package 20023223 Top View Order Number LM4895MM See NS Package Number MUB10A www.national.com 2 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 JC (MSOP) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 3) ESD Susceptibility (Note 4) ESD Susceptibility (Note 5) Junction Temperature Thermal Resistance 12C/W JA (LD) 63C/W Electrical Characteristics VDD = 5V 56C/W 190C/W JA (MSOP) Soldering Information See AN-1112 "microSMD Wafers Level Chip Scale Package". See AN-1187 "Leadless Leadframe Package (LLP)". 6.0V -65C to +150C -0.3V to VDD +0.3V Internally Limited 2000V 200V 150C JC (LD) 220C/W Operating Ratings Temperature Range TMIN TA TMAX Supply Voltage -40C TA 85C 2.2V VDD 5.5V (Note 1, Note 2, Note 8) The following specifications apply for VDD = 5V and 8 load unless otherwise specified. Limits apply for TA = 25C. LM4895 Symbol Parameter Conditions Typical Limit Units (Limits) (Note 6) (Note 7) IDD Quiescent Power Supply Current VIN = 0V, Io = 0A 4 8 mA (max) ISD Shutdown Current Vshutdown = GND 0.1 1 A (max) THD = 1% (max); f = 1 kHz Po LM4895LD, RL = 4 (Note 11) Output Power LM4895, RL = 8 THD+N Total Harmonic Distortion+Noise Po = 0.4 Wrms; f = 1kHz 1.4 W (min) 1 0.850 0.1 % Vripple = 200mV sine p-p PSRR CMRR Power Supply Rejection Ratio Common-Mode Rejection Ratio f = 217Hz (Note 9) 84 f =1kHz (Note 9) 80 f = 217Hz (Note 10) 80 f =1kHz (Note 10) 77 f =217Hz 50 Electrical Characteristics VDD = 3V 60 dB (min) dB (Note 1, Note 2, Note 8) The following specifications apply for VDD = 3V and 8 load unless otherwise specified. Limits apply for TA = 25C. LM4895 Symbol Parameter Conditions Typical Limit Units (Limits) (Note 6) (Note 7) IDD Quiescent Power Supply Current VIN = 0V, Io = 0A 3.5 6 mA (max) ISD Shutdown Current Vshutdown = GND 0.1 1 A (max) Po Output Power THD = 1% (max); f = 1kHz 0.35 W THD+N Total Harmonic Distortion+Noise Po = 0.25Wrms; f = 1kHz 0.325 % Vripple = 200mV sine p-p PSRR CMRR Power Supply Rejection Ratio Common-Mode Rejection Ratio f = 217Hz (Note 9) 84 f = 1kHz (Note 9) 80 f = 217Hz (Note 10) 77 f = 1kHz (Note 10) 75 f = 217Hz 49 dB dB Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions 3 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 www.national.com LM4895 JA (micro SMD) Absolute Maximum Ratings (Note 2) LM4895 which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, JA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX = (TJMAX-TA)/JA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4895, see power derating currents for additional information. Note 4: Human body model, 100pF discharged through a 1.5k resistor. Note 5: Machine Model, 220pF-240pF discharged through all pins. Note 6: Typicals are measured at 25C and represent the parametric norm. Note 7: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a maximum of 2A. Note 9: Unterminated input. Note 10: 10 terminated input. Note 11: When driving 4 loads from a 5V supply, the LM4895LD must be mounted to a circuit board. External Components Description (Figure 1) Components Functional Description 1. CS Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for information concerning proper placement and selection of the supply bypass capacitor. 2. CB Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External Components, for information concerning proper placement and selection of CB. www.national.com 4 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 LM4895 Typical Performance Characteristics LD Specific Characteristics LM4895LD THD+N vs Frequency VDD = 5V, 4 RL, and Power = 1W LM4895LD THD+N vs Output Power VDD = 5V, 4 RL 20023202 20023210 LM4895LD Power Dissipation vs Output Power LM4895LD Power Derating Curve 20023211 20023212 5 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 www.national.com LM4895 Typical Performance Characteristics Non-LD Specific Characteristics THD+N vs Frequency at VDD = 5V, 8 RL, and PWR = 400mW THD+N vs Frequency VDD = 3V, 8 RL, and PWR = 250mW 20023213 20023230 THD+N vs Frequency at VDD = 3V, 4 RL, and PWR = 225mW THD+N vs Frequency VDD = 2.6V, 8 RL, and PWR = 150mW 20023231 www.national.com 20023232 6 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 LM4895 THD+N vs Frequency at VDD = 2.6V, 4 RL, and PWR = 150mW THD+N vs Output Power VDD = 5V, 8 RL 20023233 20023234 THD+N vs Output Power at VDD = 3V, 8 RL THD+N vs Output Power VDD = 3V, 4 RL 20023270 20023271 THD+N vs Output Power at VDD = 2.6V, 8 RL THD+N vs Output Power VDD = 2.6V, 4 RL 20023272 20023274 7 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 www.national.com LM4895 Power Supply Rejection Ratio (PSRR) VDD = 5V Input 10 Terminated Power Supply Rejection Ratio (PSRR) VDD = 5V Input Floating 20023276 20023275 Power Supply Rejection Ratio (PSRR) VDD = 3V Input 10 Terminated Power Supply Rejection Ratio (PSRR) VDD = 3V Input Floating 20023278 20023277 Output Power vs Supply Voltage Output Power vs Supply Voltage 20023279 www.national.com 20023280 8 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 LM4895 Power Dissipation vs Output Power Power Dissipation vs Output Power 20023281 20023282 Power Dissipation vs Output Power Output Power vs Load Resistance 20023283 20023284 Supply Current vs Shutdown Voltage Shutdown Low Supply Current vs Shutdown Voltage Shutdown High 20023285 20023286 9 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 www.national.com LM4895 Clipping (Dropout) Voltage vs Supply Voltage Open Loop Frequency Response 20023288 20023287 Power Derating Curve Noise Floor 20023289 20023290 Input CMRR vs Frequency Input CMRR vs Frequency 20023291 www.national.com 20023292 10 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 LM4895 PSRR vs DC Common-Mode Voltage PSRR vs DC Common-Mode Voltage 20023293 20023294 THD vs Common-Mode Voltage THD vs Common-Mode Voltage 20023295 20023296 11 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 www.national.com LM4895 cient thermal conductivity by plating-through and solder-filling the vias. Best thermal performance is achieved with the largest practical copper heat sink area. If the heatsink and amplifier share the same PCB layer, a nominal 2.5in2 (min) area is necessary for 5V operation with a 4 load. Heatsink areas not placed on the same PCB layer as the LM4895 should be 5in2 (min) for the same supply voltage and load resistance. The last two area recommendations apply for 25C ambient temperature. In all circumstances and conditions, the junction temperature must be held below 150C to prevent activating the LM4895's thermal shutdown protection. The LM4895's power de-rating curve in the Typical Performance Characteristics shows the maximum power dissipation versus temperature. Example PCB layouts for the exposed-DAP TSSOP and LLP packages are shown in the Demonstration Board Layout section. Further detailed and specific information concerning PCB layout, fabrication, and mounting an LLP package is available from National Semiconductor's package Engineering Group under application note AN-1187. Application Information DIFFERENTIAL AMPLIFIER EXPLANATION The LM4895 is a fully differential audio amplifier that features differential input and output stages. Internally this is accomplished by two circuits: a differential amplifier and a common mode feedback amplifier that adjusts the output voltages so that the average value remains VDD/2. The LM4895 features precisely matched internal gain-setting resistors, thus eliminating the need for external resistors and fixing the differential gain at AVD = 6dB. A differential amplifier works in a manner where the difference between the two input signals is amplified. In most applications, this would require input signals that are 180 out of phase with each other. The LM4895 provides what is known as a "bridged mode" output (bridge-tied-load, BTL). This results in output signals at Vo1 and Vo2 that are 180 out of phase with respect to each other. Bridged mode operation is different from the singleended amplifier configuration that connects the load between the amplifier output and ground. A bridged amplifier design has distinct advantages over the single-ended configuration: it provides differential drive to the load, thus doubling maximum possible output swing for a specific supply voltage. Four times the output power is possible compared with a singleended amplifier under the same conditions. This increase in attainable output power assumes that the amplifier is not current limited or clipped. A bridged configuration, such as the one used in the LM4895, also creates a second advantage over single-ended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists across the load. BTL configuration eliminates the output coupling capacitor required in single-supply, single-ended amplifier configurations. If an output coupling capacitor is not used in a single-ended output configuration, the half-supply bias across the load would result in both increased internal IC power dissipation as well as permanent loudspeaker damage. Further advantages of bridged mode operation specific to fully differential amplifiers like the LM4895 include increased power supply rejection ratio, common-mode noise reduction, and click and pop reduction. PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 3 AND 4 LOADS Power dissipated by a load is a function of the voltage swing across the load and the load's impedance. As load impedance decreases, load dissipation becomes increasingly dependent on the interconnect (PCB trace and wire) resistance between the amplifier output pins and the load's connections. Residual trace resistance causes a voltage drop, which results in power dissipated in the trace and not in the load as desired. For example, 0.1 trace resistance reduces the output power dissipated by a 4 load from 1.4W to 1.37W. This problem of decreased load dissipation is exacerbated as load impedance decreases. Therefore, to maintain the highest load dissipation and widest output voltage swing, PCB traces that connect the output pins to a load must be as wide as possible. Poor power supply regulation adversely affects maximum output power. A poorly regulated supply's output voltage decreases with increasing load current. Reduced supply voltage causes decreased headroom, output signal clipping, and reduced output power. Even with tightly regulated supplies, trace resistance creates the same effects as poor sup-ply regulation. Therefore, making the power supply traces as wide as possible helps maintain full output voltage swing. EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS The LM4895's exposed-DAP (die attach paddle) package (LD) provide a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the surrounding PCB copper traces, ground plane and, finally, surrounding air. The result is a low voltage audio power amplifier that produces 1.4W at 1% THD with a 4 load. This high power is achieved through careful consideration of necessary thermal design. Failing to optimize thermal design may compromise the LM4895's high power performance and activate unwanted, though necessary, thermal shutdown protection. The LD package must have its DAP soldered to a copper pad on the PCB. The DAP's PCB copper pad is connected to a large plane of continuous unbroken copper. This plane forms a thermal mass and heat sink and radiation area. Place the heat sink area on either outside plane in the case of a two-sided PCB, or on an inner layer of a board with more than two layers. Connect the DAP copper pad to the inner layer or backside copper heat sink area with 4 (2x2) vias. The via diameter should be 0.012in - 0.013in with a 0.050in pitch. Ensure effi- www.national.com POWER DISSIPATION Power dissipation is a major concern when designing a successful amplifer, whether the amplifier is bridged or singleended. Equation 2 states the maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a specified output load. PDMAX=(VDD)2/(22RL) Single-Ended However, a direct consequence of the increased power delivered to the load by a bridge amplifier is an increase in internal power dissipation versus a single-ended amplifier operating at the same conditions. PDMAX = 4*(VDD)2/(22RL) Bridge Mode (2) Since the LM4895 has bridged outputs, the maximum internal power dissipation is 4 times that of a single-ended amplifier. Even with this substantial increase in power dissipation, the 12 200232 Version 6 Revision 2 (1) Print Date/Time: 2011/10/05 08:10:57 PDMAX = (TJMAX - TA)/JA not eliminate the need for bypassing the supply nodes of the LM4895. Although the LM4895 will operate without the bypass capacitor CB, although the PSRR may decrease. A 1F capacitor is recommended for CB. This value maximizes PSRR performance. Lesser values may be used, but PSRR decreases at frequencies below 1kHz. The issue of CB selection is thus dependant upon desired PSRR and click and pop performance. (3) SHUTDOWN FUNCTION In order to reduce power consumption while not in use, the LM4895 contains shutdown circuitry that is used to turn off the amplifier's bias circuitry. In addition, the LM4895 contains a Shutdown Mode pin, allowing the designer to designate whether the part will be driven into shutdown with a high level logic signal or a low level logic signal. This allows the designer maximum flexibility in device use, as the Shutdown Mode pin may simply be tied permanently to either VDD or GND to set the LM4895 as either a "shutdown-high" device or a "shutdown-low" device, respectively. The device may then be placed into shutdown mode by toggling the Shutdown Select pin to the same state as the Shutdown Mode pin. For simplicity's sake, this is called "shutdown same", as the LM4895 enters shutdown mode whenever the two pins are in the same logic state. The trigger point for either shutdown high or shutdown low is shown as a typical value in the Supply Current vs Shutdown Voltage graphs in the Typical Performance Characteristics section. It is best to switch between ground and supply for maximum performance. While the device may be disabled with shutdown voltages in between ground and supply, the idle current may be greater than the typical value of 0.1A. In either case, the shutdown pin should be tied to a definite voltage to avoid unwanted state changes. In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry, which provides a quick, smooth transition to shutdown. Another solution is to use a single-throw switch in conjunction with an external pull-up resistor (or pull-down, depending on shutdown high or low application). This scheme guarantees that the shutdown pin will not float, thus preventing unwanted state changes. The LM4895's JA in an MUA10A package is 190C/W. Depending on the ambient temperature, TA, of the system surroundings, Equation 4 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 3 is greater than that of Equation 4, then either the supply voltage must be decreased, the load impedance increased, the ambient temperature reduced, or the JA reduced with heatsinking. In many cases, larger traces near the output, VDD, and GND pins can be used to lower the JA. The larger areas of copper provide a form of heatsinking allowing higher power dissipation. For the typical application of a 5V power supply, with an 8 load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 30C provided that device operation is around the maximum power dissipation point. Recall that internal power dissipation is a function of output power. If typical operation is not around the maximum power dissipation point, the LM4895 can operate at higher ambient temperatures. Refer to the Typical Performance Characteristics curves for power dissipation information. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection ratio (PSRR). The capacitor location on both the bypass and power supply pins should be as close to the device as possible. A larger half-supply bypass capacitor improves PSRR because it increases half-supply stability. Typical applications employ a 5V regulator with 10F and 0.1F bypass capacitors that increase supply stability. This, however, does 13 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 www.national.com LM4895 LM4895 does not require additional heatsinking under most operating conditions and output loading. From Equation 3, assuming a 5V power supply and an 8 load, the maximum power dissipation point is 625mW. The maximum power dissipation point obtained from Equation 3 must not be greater than the power dissipation results from Equation 4: LM4895 Physical Dimensions inches (millimeters) unless otherwise noted 9-Bump micro SMD Order Number LM4895IBP NS Package Number BPA09CDB X1 = 1.3360.03 X2 = 1.3610.03 X3 = 0.8500.10 LLP Order Number LM4895LD NSPackage Number LDA10B www.national.com 14 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 LM4895 Mini Small Outline (MSOP) Order Number LM4895MM NSPackage Number MUB10A 15 200232 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:10:57 www.national.com LM4895 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB Gain Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH(R) Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise(R) Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagicTM www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise(R) Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL'S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright(c) 2011 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Technical Support Center Email: support@nsc.com www.national.com Tel: 1-800-272-9959 National Semiconductor Europe Technical Support Center Email: europe.support@nsc.com 200232 Version 6 Revision 2 National Semiconductor Asia Pacific Technical Support Center Email: ap.support@nsc.com Print Date/Time: 2011/10/05 08:10:58 National Semiconductor Japan Technical Support Center Email: jpn.feedback@nsc.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated