LM4895MM - National Semiconductor

LM4895

LM4895 1 Watt Fully Differential Audio Power Amplifier With Shutdown

Select and Fixed 6dB Gain

Literature Number: SNAS141E

LM4895 OBSOLETE

October 5, 2011

1 Watt Fully Differential Audio Power Amplifier With

Shutdown Select and Fixed 6dB Gain

General Description

The LM4895 is a fully differential audio power amplifier pri-

marily designed for demanding applications in mobile phones

and other portable communication device applications. It is

capable of delivering 1 watt of continuous average power to

an 8Ω load with less than 1% distortion (THD+N) from a

5VDC power supply.

Boomer audio power amplifiers were designed specifically to

provide high quality output power with a minimal amount of

external components. The LM4895 does not require output

coupling capacitors or bootstrap capacitors, and therefore is

ideally suited for mobile phone and other low voltage appli-

cations where minimal power consumption is a primary re-

quirement.

The LM4895 features a low-power consumption shutdown

mode. To facilitate this, Shutdown may be enabled by either

logic high or low depending on mode selection. Driving the

shutdown mode pin either high or low enables the shutdown

select pin to be driven in a likewise manner to enable Shut-

down. Additionally, the LM4895 features an internal thermal

shutdown protection mechanism.

The LM4895 contains advanced pop & click circuitry which

eliminates noises which would otherwise occur during turn-on

and turn-off transitions.

The LM4895 has an internally fixed gain of 6dB.

Key Specifications

■ Improved PSRR at 217Hz 80dB

■ Power Output at 5.0V & 1% THD 1.0W(typ.)

■ Power Output at 3.3V & 1% THD 400mW(typ.)

■ Shutdown Current 0.1µA(typ.)

Features

■Fully differential amplification

■Internal-gain-setting resistors

■Available in space-saving packages micro SMD, MSOP

and LLP

■Ultra low current shutdown mode

■Can drive capacitive loads up to 500 pF

■Improved pop & click circuitry eliminates noises during

turn-on and turn-off transitions

■2.2 - 5.5V operation

■No output coupling capacitors, snubber networks or

bootstrap capacitors required

■Shutdown high or low selectivity

Applications

■Mobile phones

■PDAs

■Portable electronic devices

Typical Application

20023201

FIGURE 1. Typical Audio Amplifier Application Circuit

Boomer® is a registered trademark of National Semiconductor Corporation.

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LM4895 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB

Gain

Connection Diagrams

9 Bump micro SMD Package

20023236

Top View

Order Number LM4895IBP

See NS Package Number BPA09CDB

LLP Package

20023235

Top View

Order Number LM4895LD

See NS Package Number LDA10B

Mini Small Outline (MSOP) Package

20023223

Top View

Order Number LM4895MM

See NS Package Number MUB10A

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LM4895

Absolute Maximum Ratings (Note 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage 6.0V

Storage Temperature −65°C to +150°C

Input Voltage −0.3V to VDD +0.3V

Power Dissipation (Note 3) Internally Limited

ESD Susceptibility (Note 4) 2000V

ESD Susceptibility (Note 5) 200V

Junction Temperature 150°C

Thermal Resistance

θJC (LD) 12°C/W

θJA (LD) 63°C/W

θJA (micro SMD) 220°C/W

θJC (MSOP) 56°C/W

θJA (MSOP) 190°C/W

Soldering Information

See AN-1112 "microSMD Wafers Level Chip Scale

Package".

See AN-1187 "Leadless

Leadframe Package (LLP)".

Operating Ratings

Temperature Range

TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ 85°C

Supply Voltage 2.2V ≤ VDD ≤ 5.5V

Electrical Characteristics VDD = 5V (Note 1, Note 2, Note 8)

The following specifications apply for VDD = 5V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.

Symbol Parameter Conditions

LM4895 Units

(Limits)

Typical Limit

(Note 6) (Note 7)

IDD Quiescent Power Supply Current VIN = 0V, Io = 0A 4 8 mA (max)

ISD Shutdown Current Vshutdown = GND 0.1 1 µA (max)

PoOutput Power

THD = 1% (max); f = 1 kHz

LM4895LD, RL = 4Ω (Note 11) 1.4 W (min)

LM4895, RL = 8Ω 1 0.850

THD+N Total Harmonic Distortion+Noise Po = 0.4 Wrms; f = 1kHz 0.1 %

PSRR Power Supply Rejection Ratio

Vripple = 200mV sine p-p

f = 217Hz (Note 9) 84

dB (min)

f =1kHz (Note 9) 80

f = 217Hz (Note 10) 80 60

f =1kHz (Note 10) 77

CMRR Common-Mode Rejection Ratio f =217Hz 50 dB

Electrical Characteristics VDD = 3V (Note 1, Note 2, Note 8)

The following specifications apply for VDD = 3V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.

Symbol Parameter Conditions

LM4895 Units

(Limits)

Typical Limit

(Note 6) (Note 7)

IDD Quiescent Power Supply Current VIN = 0V, Io = 0A 3.5 6 mA (max)

ISD Shutdown Current Vshutdown = GND 0.1 1 µA (max)

PoOutput Power THD = 1% (max); f = 1kHz 0.35 W

THD+N Total Harmonic Distortion+Noise Po = 0.25Wrms; f = 1kHz 0.325 %

PSRR Power Supply Rejection Ratio

Vripple = 200mV sine p-p

f = 217Hz (Note 9) 84

f = 1kHz (Note 9) 80

f = 217Hz (Note 10) 77

f = 1kHz (Note 10) 75

CMRR Common-Mode Rejection Ratio f = 217Hz 49 dB

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions

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LM4895

which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters

where no limit is given, however, the typical value is a good indication of device performance.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum

allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4895, see power derating

currents for additional information.

Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.

Note 5: Machine Model, 220pF–240pF discharged through all pins.

Note 6: Typicals are measured at 25°C and represent the parametric norm.

Note 7: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.

Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA.

Note 9: Unterminated input.

Note 10: 10Ω terminated input.

Note 11: When driving 4Ω loads from a 5V supply, the LM4895LD must be mounted to a circuit board.

External Components Description

(Figure 1)

Components Functional Description

1. CSSupply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for

information concerning proper placement and selection of the supply bypass capacitor.

2. CBBypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External

Components, for information concerning proper placement and selection of CB.

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LM4895

Typical Performance Characteristics

LD Specific Characteristics

LM4895LD

THD+N vs Output Power

VDD = 5V, 4Ω RL

20023202

LM4895LD

THD+N vs Frequency

VDD = 5V, 4Ω RL, and Power = 1W

20023210

LM4895LD

Power Dissipation vs Output Power

20023211

LM4895LD

Power Derating Curve

20023212

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LM4895

Typical Performance Characteristics

Non-LD Specific Characteristics

THD+N vs Frequency

at VDD = 5V, 8Ω RL, and PWR = 400mW

20023213

THD+N vs Frequency

VDD = 3V, 8Ω RL, and PWR = 250mW

20023230

THD+N vs Frequency

at VDD = 3V, 4Ω RL, and PWR = 225mW

20023231

THD+N vs Frequency

VDD = 2.6V, 8Ω RL, and PWR = 150mW

20023232

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LM4895

THD+N vs Frequency

at VDD = 2.6V, 4Ω RL, and PWR = 150mW

20023233

THD+N vs Output Power

VDD = 5V, 8Ω RL

20023234

THD+N vs Output Power

at VDD = 3V, 8Ω RL

20023270

THD+N vs Output Power

VDD = 3V, 4Ω RL

20023271

THD+N vs Output Power

at VDD = 2.6V, 8Ω RL

20023272

THD+N vs Output Power

VDD = 2.6V, 4Ω RL

20023274

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LM4895

Power Supply Rejection Ratio (PSRR) VDD = 5V

Input 10Ω Terminated

20023275

Power Supply Rejection Ratio (PSRR) VDD = 5V

Input Floating

20023276

Power Supply Rejection Ratio (PSRR) VDD = 3V

Input 10Ω Terminated

20023277

Power Supply Rejection Ratio (PSRR) VDD = 3V

Input Floating

20023278

Output Power vs

Supply Voltage

20023279

Output Power vs

Supply Voltage

20023280

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LM4895

Power Dissipation vs

Output Power

20023281

Power Dissipation vs

Output Power

20023282

Power Dissipation vs

Output Power

20023283

Output Power vs

Load Resistance

20023284

Supply Current vs Shutdown Voltage

Shutdown Low

20023285

Supply Current vs Shutdown Voltage

Shutdown High

20023286

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LM4895

Clipping (Dropout) Voltage vs

Supply Voltage

20023287

Open Loop Frequency Response

20023288

Power Derating Curve

20023289

Noise Floor

20023290

Input CMRR vs Frequency

20023291

Input CMRR vs Frequency

20023292

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LM4895

PSRR vs

DC Common-Mode Voltage

20023293

PSRR vs

DC Common-Mode Voltage

20023294

THD vs

Common-Mode Voltage

20023295

THD vs

Common-Mode Voltage

20023296

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LM4895

Application Information

DIFFERENTIAL AMPLIFIER EXPLANATION

The LM4895 is a fully differential audio amplifier that features

differential input and output stages. Internally this is accom-

plished by two circuits: a differential amplifier and a common

mode feedback amplifier that adjusts the output voltages so

that the average value remains VDD/2. The LM4895 features

precisely matched internal gain-setting resistors, thus elimi-

nating the need for external resistors and fixing the differential

gain at AVD = 6dB.

A differential amplifier works in a manner where the difference

between the two input signals is amplified. In most applica-

tions, this would require input signals that are 180° out of

phase with each other.

The LM4895 provides what is known as a "bridged mode"

output (bridge-tied-load, BTL). This results in output signals

at Vo1 and Vo2 that are 180° out of phase with respect to each

other. Bridged mode operation is different from the single-

ended amplifier configuration that connects the load between

the amplifier output and ground. A bridged amplifier design

has distinct advantages over the single-ended configuration:

it provides differential drive to the load, thus doubling maxi-

mum possible output swing for a specific supply voltage. Four

times the output power is possible compared with a single-

ended amplifier under the same conditions. This increase in

attainable output power assumes that the amplifier is not cur-

rent limited or clipped.

A bridged configuration, such as the one used in the LM4895,

also creates a second advantage over single-ended ampli-

fiers. Since the differential outputs, Vo1 and Vo2, are biased at

half-supply, no net DC voltage exists across the load. BTL

configuration eliminates the output coupling capacitor re-

quired in single-supply, single-ended amplifier configurations.

If an output coupling capacitor is not used in a single-ended

output configuration, the half-supply bias across the load

would result in both increased internal IC power dissipation

as well as permanent loudspeaker damage. Further advan-

tages of bridged mode operation specific to fully differential

amplifiers like the LM4895 include increased power supply

rejection ratio, common-mode noise reduction, and click and

pop reduction.

EXPOSED-DAP PACKAGE PCB MOUNTING

CONSIDERATIONS

The LM4895's exposed-DAP (die attach paddle) package

(LD) provide a low thermal resistance between the die and

the PCB to which the part is mounted and soldered. This al-

lows rapid heat transfer from the die to the surrounding PCB

copper traces, ground plane and, finally, surrounding air. The

result is a low voltage audio power amplifier that produces

1.4W at ≤ 1% THD with a 4Ω load. This high power is

achieved through careful consideration of necessary thermal

design. Failing to optimize thermal design may compromise

the LM4895's high power performance and activate unwant-

ed, though necessary, thermal shutdown protection. The LD

package must have its DAP soldered to a copper pad on the

PCB. The DAP's PCB copper pad is connected to a large

plane of continuous unbroken copper. This plane forms a

thermal mass and heat sink and radiation area. Place the heat

sink area on either outside plane in the case of a two-sided

PCB, or on an inner layer of a board with more than two layers.

Connect the DAP copper pad to the inner layer or backside

copper heat sink area with 4 (2x2) vias. The via diameter

should be 0.012in - 0.013in with a 0.050in pitch. Ensure effi-

cient thermal conductivity by plating-through and solder-filling

the vias.

Best thermal performance is achieved with the largest prac-

tical copper heat sink area. If the heatsink and amplifier share

the same PCB layer, a nominal 2.5in2 (min) area is necessary

for 5V operation with a 4Ω load. Heatsink areas not placed on

the same PCB layer as the LM4895 should be 5in2 (min) for

the same supply voltage and load resistance. The last two

area recommendations apply for 25°C ambient temperature.

In all circumstances and conditions, the junction temperature

must be held below 150°C to prevent activating the LM4895's

thermal shutdown protection. The LM4895's power de-rating

curve in the Typical Performance Characteristics shows the

maximum power dissipation versus temperature. Example

PCB layouts for the exposed-DAP TSSOP and LLP packages

are shown in the Demonstration Board Layout section. Fur-

ther detailed and specific information concerning PCB layout,

fabrication, and mounting an LLP package is available from

National Semiconductor's package Engineering Group under

application note AN-1187.

PCB LAYOUT AND SUPPLY REGULATION

CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS

Power dissipated by a load is a function of the voltage swing

across the load and the load's impedance. As load impedance

decreases, load dissipation becomes increasingly dependent

on the interconnect (PCB trace and wire) resistance between

the amplifier output pins and the load's connections. Residual

trace resistance causes a voltage drop, which results in power

dissipated in the trace and not in the load as desired. For ex-

ample, 0.1Ω trace resistance reduces the output power dis-

sipated by a 4Ω load from 1.4W to 1.37W. This problem of

decreased load dissipation is exacerbated as load impedance

decreases. Therefore, to maintain the highest load dissipation

and widest output voltage swing, PCB traces that connect the

output pins to a load must be as wide as possible.

Poor power supply regulation adversely affects maximum

output power. A poorly regulated supply's output voltage de-

creases with increasing load current. Reduced supply voltage

causes decreased headroom, output signal clipping, and re-

duced output power. Even with tightly regulated supplies,

trace resistance creates the same effects as poor sup-ply

regulation. Therefore, making the power supply traces as

wide as possible helps maintain full output voltage swing.

POWER DISSIPATION

Power dissipation is a major concern when designing a suc-

cessful amplifer, whether the amplifier is bridged or single-

ended. Equation 2 states the maximum power dissipation

point for a single-ended amplifier operating at a given supply

voltage and driving a specified output load.

PDMAX=(VDD)2/(2π2RL) Single-Ended (1)

However, a direct consequence of the increased power de-

livered to the load by a bridge amplifier is an increase in

internal power dissipation versus a single-ended amplifier op-

erating at the same conditions.

PDMAX = 4*(VDD)2/(2π2RL) Bridge Mode (2)

Since the LM4895 has bridged outputs, the maximum internal

power dissipation is 4 times that of a single-ended amplifier.

Even with this substantial increase in power dissipation, the

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LM4895

LM4895 does not require additional heatsinking under most

operating conditions and output loading. From Equation 3,

assuming a 5V power supply and an 8Ω load, the maximum

power dissipation point is 625mW. The maximum power dis-

sipation point obtained from Equation 3 must not be greater

than the power dissipation results from Equation 4:

PDMAX = (TJMAX - TA)/θJA (3)

The LM4895's θJA in an MUA10A package is 190°C/W. De-

pending on the ambient temperature, TA, of the system sur-

roundings, Equation 4 can be used to find the maximum

internal power dissipation supported by the IC packaging. If

the result of Equation 3 is greater than that of Equation 4, then

either the supply voltage must be decreased, the load

impedance increased, the ambient temperature reduced, or

the θJA reduced with heatsinking. In many cases, larger traces

near the output, VDD, and GND pins can be used to lower the

θJA. The larger areas of copper provide a form of heatsinking

allowing higher power dissipation. For the typical application

of a 5V power supply, with an 8Ω load, the maximum ambient

temperature possible without violating the maximum junction

temperature is approximately 30°C provided that device op-

eration is around the maximum power dissipation point. Re-

call that internal power dissipation is a function of output

power. If typical operation is not around the maximum power

dissipation point, the LM4895 can operate at higher ambient

temperatures. Refer to the Typical Performance Charac-

teristics curves for power dissipation information.

POWER SUPPLY BYPASSING

As with any power amplifier, proper supply bypassing is crit-

ical for low noise performance and high power supply rejec-

tion ratio (PSRR). The capacitor location on both the bypass

and power supply pins should be as close to the device as

possible. A larger half-supply bypass capacitor improves

PSRR because it increases half-supply stability. Typical ap-

plications employ a 5V regulator with 10µF and 0.1µF bypass

capacitors that increase supply stability. This, however, does

not eliminate the need for bypassing the supply nodes of the

LM4895. Although the LM4895 will operate without the by-

pass capacitor CB, although the PSRR may decrease. A 1µF

capacitor is recommended for CB. This value maximizes

PSRR performance. Lesser values may be used, but PSRR

decreases at frequencies below 1kHz. The issue of CB se-

lection is thus dependant upon desired PSRR and click and

pop performance.

SHUTDOWN FUNCTION

In order to reduce power consumption while not in use, the

LM4895 contains shutdown circuitry that is used to turn off the

amplifier's bias circuitry. In addition, the LM4895 contains a

Shutdown Mode pin, allowing the designer to designate

whether the part will be driven into shutdown with a high level

logic signal or a low level logic signal. This allows the designer

maximum flexibility in device use, as the Shutdown Mode pin

may simply be tied permanently to either VDD or GND to set

the LM4895 as either a "shutdown-high" device or a "shut-

down-low" device, respectively. The device may then be

placed into shutdown mode by toggling the Shutdown Select

pin to the same state as the Shutdown Mode pin. For

simplicity's sake, this is called "shutdown same", as the

LM4895 enters shutdown mode whenever the two pins are in

the same logic state. The trigger point for either shutdown

high or shutdown low is shown as a typical value in the Supply

Current vs Shutdown Voltage graphs in the Typical Perfor-

mance Characteristics section. It is best to switch between

ground and supply for maximum performance. While the de-

vice may be disabled with shutdown voltages in between

ground and supply, the idle current may be greater than the

typical value of 0.1µA. In either case, the shutdown pin should

be tied to a definite voltage to avoid unwanted state changes.

In many applications, a microcontroller or microprocessor

output is used to control the shutdown circuitry, which pro-

vides a quick, smooth transition to shutdown. Another solution

is to use a single-throw switch in conjunction with an external

pull-up resistor (or pull-down, depending on shutdown high or

low application). This scheme guarantees that the shutdown

pin will not float, thus preventing unwanted state changes.

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LM4895

Physical Dimensions inches (millimeters) unless otherwise noted

9-Bump micro SMD

Order Number LM4895IBP

NS Package Number BPA09CDB

X1 = 1.336±0.03 X2 = 1.361±0.03 X3 = 0.850±0.10

LLP

Order Number LM4895LD

NSPackage Number LDA10B

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LM4895

Mini Small Outline (MSOP)

Order Number LM4895MM

NSPackage Number MUB10A

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LM4895

Notes

LM4895 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB

Gain

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