1
CSM_EE-SY1200_E_1_1
EE-SY1200 Photomicrosensor (Reflective)
■Electrical and Optical Characteristics (Ta=25°C)
*1. The letter “d” indicates the distance between the top surface of the sensor and the sensing object.
*2. Depends on the installed condition of the Photomicrosensor, the detector may receive the sensor's LED light and/or the external light which
is reflected from surroundings of the Photomicrosensor and /or the background object.
Please confirm the condition of the Photomicrosensor by actual intended application prior to the mass production use.
Item Symbol
Value
Unit Condition
MIN. TYP. MAX.
Emitter
Forward voltage VF--- 1.2 1.4 V IF = 20 mA
Reverse current IR--- --- 10 μAVR = 4 V
Peak emission wave-
length λP--- 940 --- nm ---
Detector
Light current 1 IL1 200 --- 1000 μAIF = 10 mA, VCE = 2 V, Aluminum-
deposited surface, d = 4 mm*1
Light current 2 IL2 150 --- --- μAIF = 4 mA, VCE = 2 V, Aluminum-de-
posited surface, d = 1 mm*1
Dark current ID--- 2 200 nA VCE = 10 V, 0 lx
Leakage current 1 ILEAK1 --- --- 500 nA IF = 10 mA, VCE = 2 V,
with no reflection*2
Leakage current 2 ILEAK2 --- --- 200 nA IF = 4 mA, VCE = 2 V,
with no reflection*2
Collector-Emitter satu-
rated voltage VCE (sat)--- --- --- V ---
Peak spectral sensitivi-
ty wavelength λP--- 850 --- nm ---
Rising time t r --- 30 --- μsVCC = 2 V, RL = 1 kΩ,
IL = 100 μA, d = 1 mm*1
Falling time t f --- 30 --- μsVCC = 2 V, RL = 1 kΩ,
IL = 100 μA, d = 1 mm*1
■Dimensions
(Unit: mm)
A
K
C
E
Emitter centerDetector center
(0.7)
(0.8)
(1) (
0.8
)
3.2
1.9
1.2
0.7
1.1
CA
EK 2-0.65
2-0.45
2-12-1.72-1
2-0.65
Terminal No. Name
A Anode
K Cathode
C Collector
E Emitter
Internal Circuit
Recommended Soldering Pattern
Note 1. The shaded portion in the
above figure may cause short-
ing. Do not wire in this portion.
2. The dimensional tolerance for
the recommended soldering
pattern is ±0.1 mm.
Note.
Unless otherwise specified tolerances
are ±0.15.
No burrs dimensions are included in out-
line dimensions.
The burrs dimensions are 0.15 MAX.
Diagonal line indicate the region is part
Au plating area.
■Features
• Ultra-compact model.
• PCB surface mounting type.
• High S/N ratio
(High light current / Low leakage current)
■Absolute Maximum Ratings
(Ta=25°C)
*1. Refer to the temperature rating chart if the ambient tem-
perature exceeds 25°C.
*2. The pulse width is 10 μs maximum with a frequency of
100 Hz.
*3. Complete soldering within 10 seconds for reflow soldering.
Item Symbol Rated value Unit
Emitter
Forward current IF50*1 mA
Pulse forward
current IFP 500*2 mA
Reverse voltage VR4V
Detector
Collector-Emitter
voltage VCEO 30 V
Emitter-Collector
voltage VECO 5V
Collector current IC20 mA
Collector dissipa-
tion PC50*1 mW
Operating temperature Topr −25 to +85 °C
Storage temperature Tstg −
40 to +100
°C
Reflow soldering temperature Tsol 240*3 °C
EE-SY1200
2
■Engineering Data
Fig 1. Forward Current vs. Collector
Dissipation Temperature Rating
Fig 2. Forward Current vs. Forward Voltage
Characteristics (Typical)
Fig 3. Light Current vs. Forward Current
Characteristics (Typical)
Fig 4. Light Current vs. Collector-Emitter
Voltage Characteristics (Typical)
Fig 5. Relative Light Current vs. Ambient
Temperature Characteristics (Typical)
Fig 6. Dark Current vs. Ambient
Temperature Characteristics (Typical)
Fig 7. Response Time vs. Load Resistance
Characteristics (Typical)
Fig 8. Sensing Distance Characteristics
(Typical)
Fig 9. Sensing Position Characteristics
(Typical)
Fig 10. Sensing Position Characteristics
(Typical)
Fig 11. Response Time Measurement
Circuit
Fig 12. Light Current Measurement Setup
Diagram
Ambient temperature Ta (°C)
Collector dissipation P
C
(mW)
Forward current I
F
(mA)
60
50
40
30
20
10
0-20 0 20 40 60 80 100-40
P
C
I
F
Forward voltage VF (V)
Forward current IF (mA)
60
50
40
30
20
10
00
Ta=+70°C
Ta=+25°C
Ta=-30°C
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Forward current I
F
(mA)
Light current I
L
(µA)
Ta =25°C
V
CE
=2V
d=1mm
V
CE
=2V
d=4mm
3,000
2,500
2,000
1,500
1,000
500
0
0 5 10 15 20
Collector-Emitter voltage V
CE
(V)
Light current I
L
(mA)
1,600
1,400
1,200
1,000
800
600
400
200
0
0246810
I
F
=2mA, d=4mm
I
F
=4mA, d=4mm
I
F
=2mA, d=1mm
I
F
=7mA, d=4mm
I
F
=4mA, d=1mm
I
F
=10mA, d=4mm
I
F
=15mA, d=4mm
I
F
=7mA, d=1mm
I
F
=10mA, d=1mm
Ambient temperature Ta (°C)
Relative light current I
L
(%)
120
110
100
90
80
70
60
-40 -20 0 20 40 60 80 100
I
F
=10mA
V
CE
=2V
Ambient temperature Ta (°C)
Dark current I
D
(nA)
10,000
1,000
100
10
1
0.1
0.01
0.001
-30 80010 7020 4030 60-20 -10 50 90
Load resistance RL (kΩ)
Response time tr,tf (µs)
10,000
1,000
100
10
1
0.1 1 10 100
tr
tf
Distance d (mm)
Relative light current I
L
(%)
d
Aluminum-deposited surface
I
F
=4mA, 10mA
V
CE
=10V
100
90
80
70
60
50
40
30
20
10
0010.5 1.5 2.5 3.5 4.52345
Card moving distance L (mm)
Relative light current I
L
(%)
I
F
=10mA
V
CE
=2V
d=4mm
I
F
=4mA
V
CE
=2V
d=1mm
0
d
L
White Black
+-
-4 -3-5-6 2 43-1-2 0 1
120
100
80
60
40
20
0
Card movin
g
distance L (mm)
Relative light current IL (%)
IF=10mA
VCE=2V
d=4mm
IF=4mA
VCE=2V
d=1mm
d
L
White Black
0+-
-4 -3-5-6 2 43-1-2 0 1
120
100
80
60
40
20
0
Input
Output
Input
Output
90%
10%
t
t
f
t
r
t
0
V
CC
R
L
0
IL
Aluminum-deposited surface
Glass d
Sensor
3
EE-SY1200
■Tape and Reel
●Reel Dimension (Unit: mm)
●Tape Dimension (Unit: mm)
●Part Mounting Direction
• The devices are oriented in the rectangular holes in the carrier tape so that the edge with the LED faces the
round feeding holes.
●Tape Quantity
2,000 pcs./reel
φ21±0.8
φ13±0.5
2±0.5
15.4±1
13 +1
0
180
0
-3
φ60±1
0.2
0.4
0.8
0.6
0.2
0.4
0.6
0.8
4 2 4
1.75
5.5
12
φ1.5
2.15
3.45
1.35
0.3
C
A
E
K
Pull-out direction
0.2
0.4
0.8
0.6
0.2
0.4
0.6
0.8
EE-SY1200
4
■Precautions to be taken on mounting
●Temperature Profile
The reflow soldering can be implemented in two
times complying with the following diagram.
All the temperatures in the product must be within
the diagram.
●Manual soldering
The manual soldering cannot be applied to the prod-
ucts.
There is a possibility that the housing is deformed
and/or Au plating is peeled off by heat.
●Other Notes
The use of infrared lamp causes the temperature at
the resin to rise particularly too high.
All the temperatures in the product must be within
the above diagram.
Do not immerse the resin part into the solder.
Even if within the above temperature diagram, there
is a possibility that the gold wire in the products is
broken in case that the deformation of PCB gives the
stress to the product terminals.
Please confirm the conditions of the reflow soldering
fully by actual solder reflow machine prior to the
mass production use.
■Storage and Handling after Opening
●Storage Conditions
In order to avoid the absorption of moisture, the
products shall be stored in a dry box with desiccant
or in the following conditions.
Storage temp. : 5 to 30°C
Storage humidity : 70%RH or less
●Treatment after Opening
1. Reflow soldering must be done within 48 hours
stored at the conditions of humidity 60%RH or
less and temperature 5 to 25°C.
2. In case of long time storage after open, please
mount at the conditions of humidity 70%RH or
less and temperature 5 to 30°C within 1 week by
using dry box or resealing with desiccant in mois-
ture-proof bag by sealer.
●Baking before Mounting
In case that it could not carry out the above treat-
ment, it is able to mount by baking treatment.
However baking treatment shall be limited only 1
time.
Recommended conditions : 60°C, 12 to 24 hours
(reeled one)
100°C, 8 to 24 hours
(loose one)
Time (sec)
Temperature (°C)
120 sec MAX.
160°C MAX.
1to 4°C/sec
1to 4°C/sec
1to 4°C/sec
240°C MAX.
10 sec MAX.
50 sec MAX.
200°C
