©2008 Fairchild Semiconductor Corporation 1www.fairchildsemi.com
FCD7N60/FCU7N60 Rev. A1
FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60 / FCU7N60
600V N-Channel MOSFET
Features
•650V @T
J = 150°C
Typ. Rds(on)=0.53
Ultra low gate charge (typ. Qg=23nC)
Low effective output capacitance (typ. Coss.eff=60pF)
100% avalanche tested
Description
SuperFETTM is, Fairchild’s proprietary, new generation of high
voltage MOSFET family that is utilizing an advanced charge
balance mechanism for outstanding low on-resistance and
lower gate charge performance.
This advanced technology has been tailored to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate and higher avalanche energy.
Consequently, SuperFET is very suitable for various AC/DC
power conversion in switching mode operation for system
miniaturization and higher efficiency.
D-PAK
FCD Series
GS
D
GSDI-PAK
FCU Series
D
G
S
Absolute Maximum Ratings
Symbol Parameter FCD7N60/FCU7N60 Unit
VDSS Drain-Source Voltage 600 V
IDDrain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C) 7
4.4 A
A
IDM Drain Current - Pulsed (Note 1) 21 A
VGSS Gate-Source voltage ± 30 V
EAS Single Pulsed Avalanche Energy (Note 2) 230 mJ
IAR Avalanche Current (Note 1) 7 A
EAR Repetitive Avalanche Energy (Note 1) 8.3 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
PDPower Dissipation (TC = 25°C)
- Derate above 25°C83
0.67 W
W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
TLMaximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds 300 °C
Thermal Characteristics
Symbol Parameter FCD7N60/FCU7N60 Unit
RθJC Thermal Resistance, Junction-to-Case 1.5 °C/W
RθJA Thermal Resistance, Junction-to-Ambient 83 °C/W
December 2008
SuperFET
TM
RoHS Compliant
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FCD7N60 FCD7N60TM D-PAK 380mm 16mm 2500
FCD7N60 FCD7N60TF D-PAK 380mm 16mm 2000
FCU7N60 FCU7N60 I-PAK - - 70
Electrical Characteristics TC = 25°C unless otherwise noted
Symbol Parameter Conditions Min Typ Max Units
Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250µA, TJ = 25°C600 -- -- V
VGS = 0V, ID = 250µA, TJ = 150°C-- 650 -- V
BVDSS
/ TJ
Breakdown Voltage Temperature
Coefficient ID = 250µA, Referenced to 25°C-- 0.6 -- V/°C
BVDS Drain-Source Avalanche Breakdown
Voltage VGS = 0V, ID = 7A -- 700 -- V
IDSS Zero Gate Voltage Drain Current VDS = 600V, VGS = 0V
VDS = 480V, TC = 125°C--
-- --
-- 1
10 µA
µA
IGSSF Gate-Body Leakage Current, Forward VGS = 30V, VDS = 0V -- -- 100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = -30V, VDS = 0V -- -- -100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250µA3.0 -- 5.0 V
RDS(on) Static Drain-Source
On-Resistance VGS = 10V, ID = 3 . 5A -- 0.53 0.6
gFS Forward Transconductance VDS = 40V, ID = 3.5A (Note 4) -- 6-- S
Dynamic Characteristics
Ciss Input Capacitance VDS = 25V, VGS = 0V,
f = 1.0MHz -- 710 920 pF
Coss Output Capacitance -- 380 500 pF
Crss Reverse Transfer Capacitance -- 34 -- pF
Coss Output Capacitance VDS = 480V, VGS = 0V, f = 1.0MHz -- 22 29 pF
Coss eff. Effective Output Capacitance VDS = 0V to 400V, VGS = 0V -- 60 -- pF
Switching Characteristics
td(on) Turn-On Delay Time VDD = 300V, ID = 7A
RG = 25
(Note 4, 5)
-- 35 80 ns
trTurn-On Rise Time -- 55 120 ns
td(off) Turn-Off Delay Time -- 75 160 ns
tfTurn-Off Fall Time -- 32 75 ns
QgTotal Gate Charge VDS = 480V, ID = 7A
VGS = 10V
(Note 4, 5)
-- 23 30 nC
Qgs Gate-Source Charge -- 4.2 5.5 nC
Qgd Gate-Drain Charge -- 11.5 -- nC
Drain-Source Diode Characteristics and Maximum Ratings
ISMaximum Continuous Drain-Source Diode Forward Current -- -- 7 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 21 A
VSD Drain-Source Diode Forward Voltage VGS = 0V, IS = 7A -- -- 1.4 V
trr Reverse Recovery Time VGS = 0V, IS = 7A
dIF/dt =100A/µs (Note 4) -- 360 -- ns
Qrr Reverse Recovery Charge -- 4.5 -- µC
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. IAS = 3.5A, VDD = 50V, RG = 25, Starting TJ = 25°C
3. ISD 7A, di/dt 1200A/µs, VDD BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width 300µs, Duty Cycle 2%
5. Essentially Independent of Operating Temperature
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1
Typical Performance Characteristics
Figure 1. On-Region Characteristics Figure 2. Transfer Characterist ics
10-1 100101
10-1
100
101
VGS
Top : 15.0 V
10.0 V
8 .0 V
7 .0 V
6 .5 V
6 .0 V
Bottom : 5.5 V
* Notes :
1. 250µs Pulse Test
2. TC = 25oC
ID, Drain Current [A]
VDS, Drain-Source Voltage [V]
246810
10-1
100
101
* Note
1. VDS = 40V
2. 250µs Pulse Test
-55oC
150oC
25oC
ID , Drain Current [A ]
VGS , Gate-Source Voltage [V]
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue
0 5 10 15 20
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
VGS = 20V
VGS = 10V
* Note : TJ = 25oC
RDS(ON) [],
Drain-Source On-Resistance
ID, Drain Current [A] 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
10-1
100
101
25oC
150oC
* Notes :
1. V GS = 0V
2. 250µs Pulse Test
IDR , Reverse Drain Current [A]
VSD , Source-Drain Voltage [V]
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
10-1 100101
0
1000
2000
3000 Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
* Notes :
1. VGS = 0 V
2. f = 1 MHz
Crss
Coss
Ciss
Capacitance [pF]
VDS, Drain-S ource Voltage [V] 0 5 10 15 20 25
0
2
4
6
8
10
12
VDS = 250V
VDS = 100V
VDS = 400V
* Note : ID = 7A
VGS, Gate-Source Voltage [V]
QG, Tota l Ga te Charg e [oC]
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation
vs. Temperature vs. Temperature
-100 -50 0 50 100 150 200
0.8
0.9
1.0
1.1
1.2
* Note s :
1. VGS = 0V
2. ID = 250µA
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
TJ, Junction Temperature [oC] -100 -50 0 50 100 150 200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
* Notes :
1. VGS = 10 V
2. ID = 3.5 A
RDS(ON), (Normalized)
Drain-Source On-Resistance
TJ, Junction Temperature [oC]
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current
vs. Case Temperature
100101102103
10-2
10-1
100
101
102Operation in This Area
is Limited by R DS(on)
DC 10 ms
1 ms
100 µs
* Notes :
1. TC = 25 oC
2. TJ = 150 oC
3. S in g le Pulse
ID, Drain Current [A]
VDS, Drain-Source Vo ltage [V]
25 50 75 100 125 150
0.0
2.5
5.0
7.5
10.0
ID, Drain Curr ent [A]
TC, Case Temperature [oC]
Figure 11. Transient Thermal Response Curve
10-5 10-4 10-3 10-2 10-1 100101
10-2
10-1
100
* N ote s :
1 . Z θJC(t) = 1 .5 oC/W Max.
2 . Duty Fac to r, D= t1/t2
3 . T JM - T C = PDM * ZθJC(t)
single pulse
D=0.5
0.02
0.2
0.05
0.1
0.01
ZθJC(t), Thermal Response
t1, S quare Wave Pulse D uration [se c]
t1
PDM
t2
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & W aveforms
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1
Peak Diode Recovery dv/dt Test Circuit & Waveforms
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1
Mechanical Dimensions
D-PAK
Dimensions in Millimeters
Package Dimensions (Continued)
I-PAK
Dimensions in Millimeters
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1
Rev. I37
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tm
®
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FCD7N60/FCU7N60 600V N-Channel MOSFET
FCD7N60/FCU7N60 Rev. A1