HLMP-Nxxx T-1 (3 mm) Auto Insertable LED Lamps Data Sheet HLMP-N305, HLMP-N405, HLMP-NG0x, HLMP-NL06, HLMP-NH04 Description This family of 3 mm LED Lamps is capable of withstanding automatic insertion and wave soldering processes. Designed with a thick epoxy flange and soft leadframe material, it is ideal for clinch and cut operations. Features * T-1 (3 mm) auto insertable package * AlInGaP SunPower intensity * High light output * Tinted diffused and tinted non-diffused lens options * Wide viewing angle * Variety of colors * Available with straight or formed lead tape and reel options Applications * General purpose * High volume manufacturing Device Selection Guides High Brightness Lamps Color Part Number Red HLMP-NG05 HLMP-NG07 Amber HLMP-NL06 Red Orange HLMP-NH04 Package Tinted High Efficiency Lamps Color Part Number GaP Yellow HLMP-N305 GaP Orange HLMP-N405 Package Tinted X X Diffused Diffused Luminous Intensity, Min. Iv @ 20 mA 90.2 90.2 96.2 90.2 Viewing Angle, 1/2 2 45 60 60 60 Package Outline A B B B Luminous Intensity, Min. Iv @ 10 mA 14.7 13.8 Viewing Angle, 1/2 2 45 45 Package Outline A A Note: 1. 21/2 is the off axis angle where the luminous intensity is 1/2 the on axis intensity. Package Dimensions Package Outline "A" SEATING PLANE 5.9 0.5 (0.23 0.02) 1.0 0.5 (0.04 0.02) 23.0 (0.91) 3.5 0.3 (0.14 0.01) CATHODE MARKS 0.65 (0.03) MAX. 0.4 0.2 (0.02 0.01) 4.4 0.3 3.1 0.2 (0.17 0.01) (0.12 0.01) 2.5 0.3 (0.10 0.01) 0.4 0.2 (0.01 0.01) + 0.1 0 + 0.00 (0.2 - 0.00 ) 0.45 0.10 (0.02 0.007) 0.4 2.0 (0.08) REF. 3.4 0.2 (0.13 0.01) Package Outline "B" 5.70 0.5 23.0 MIN. 1.0 MIN. 3.50 0.30 CATHODE FLAT 0.65 MAX. CATHODE LEAD 0.44 0.2 3.80 0.30 3.10 0.20 2.54 0.3 0.8 MAX. EPOXY MENISCUS + 0.1 0.4 - 0 2.0 3.60 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. LEADS ARE MILD STEEL. SOLDER COATED. 3. EPOXY MENISCUS OF 0.8 mm (0.03 in.) MAXIMUM MAY EXTEND TO THE LEADS. 2 Part Numbering System HLMP - N x xx # xxx Mechanical Option 002: Tape & Reel, Straight Leads Viewing Angle Options 01: 45 Degree 05: 45 Degree 04, 06, 07: 60 Degree Color Options 3: GaP Yellow 4: GaP Orange G: AlInGaP Red L: AlInGaP Amber H: AlInGaP Red Orange Absolute Maximum Ratings at TA = 25 C Parameter Orange Yellow AlInGaP Red Orange, Amber & Red Units DC Forward Current[1] 30 20 30[2,3] mA Reverse Voltage (Ir = 100 A) 5 V Junction Temperature, Tjmax 110 C Storage Temperature Range -40 to +85 C Operating Temperature Range -20 to +85 Notes: 1. See Figure 4 for maximum current derating vs. ambient temperature. 2. Suggested minimum DC current: 10 mA. 3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average. 3 -40 to +85 C Electrical Characteristics at TA = 25C Part Number HLMP-N30x HLMP-N40x HLMP-NLO6[1] HLMP-NG0x[1] HLMP-NH04 Forward Voltage Vf (Volts) Typ. Max. If (mA) 2.00 2.6 10 1.90 2.6 10 2.02 2.4 20 1.90 2.4 20 1.94 2.4 20 Capacitance C (pF) Vf = 0, f = 1 MHz Typ. 15 4 40 40 40 Thermal J-PIN Resistance R (C/W) 290 290 240 240 250 Speed of Response s (ns) Time Constant e-t/s Typ. 90 280 20 20 20 Note: 1. Please contact your Avago Sales Representative about operating currents below 10 mA. Optical Characteristics at TA = 25 C Part Number HLMP-NG05 HLMP-NG07 HLMP-NL06 HLMP-N305 HLMP-N405 HLMP-NH04 Luminous Intensity Min. If (mA) 90.2 20 90.2 20 96.2 20 14.7 10 13.8 10 90.2 20 Typ. Peak Wavelength (nm) 635 635 592 583 600 621 Typ. Dominant Wavelength (nm) 626 626 590 585 602 615 Typ. Spectral Half Width 17 17 17 36 37 17 Luminous Efficacy Width (lm/W) 150 150 480 500 380 235 Notes: 1. The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device. 3. The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/hv, where lv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 4 HIGH BRIGHTNESS LAMPS 1.0 RELATIVE INTENSITY AMBER AlInGaP RED DH AlGaAs RED RED-ORANGE 0.5 0 550 600 650 700 WAVELENGTH - nm HIGH EFFICIENCY LAMPS RELATIVE INTENSITY 1.0 ORANGE 0.5 YELLOW 0 500 550 600 650 700 WAVELENGTH - nm Figure 1. Relative intensity vs. peak wavelength. HIGH EFFICIENCY LAMPS HIGH BRIGHTNESS LAMPS 90 60 50 40 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA 70 AlInGaP RED/REDORANGE DH AsAlGaAs RED AMBER 30 20 10 0 1.0 1.5 2.0 2.5 3.0 VF - FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. 5 80 70 60 50 YELLOW 40 ORANGE 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VF - FORWARD VOLTAGE - V ORANGE,AND YELLOW HIGH BRIGHTNESS LAMPS 4.0 1.5 AlInGaP DH As AlGaAs 1.0 0.5 0 0 10 20 30 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 40 0 5 15 10 20 30 25 IDC - DC CURRENT PER LED - mA IF - DC FORWARD CURRENT - mA Figure 3. Relative luminous intensity vs. forward current. ORANGE AND YELLOW AlInGaP 40 35 30 25 RJA = 500 C/W 20 RJA = 650 C/W 15 RJA = 750 C/W 10 5 0 0 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA 40 10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum forward DC current vs. ambient temperature. 6 35 ORANGE 30 RJA = 470 C/W 25 RJA = 300 C/W 20 YELLOW 15 RJA = 705 C/W 10 5 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 1 NORMALIZED INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT - DEGREES Figure 5. Representative spatial radiation pattern for 45 viewing angle. 1 NORMALIZED INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT - DEGREES Figure 6. Representative spatial radiation pattern for 60 viewing angle. 7 Intensity Bin Limits Color Red/Orange /Red-Orange Yellow/Amber Bin H I J K L M N O P Q R S T U V W X Y Z G H I J K L M N O P Q R S T U V W Intensity Range (mcd) Min. Max. 13.8 27.6 22.0 44.0 35.2 70.4 56.4 112.8 90.2 180.4 138.0 276.0 200.0 400.0 290.0 580.0 500.0 1000.0 700.0 1400.0 1000.0 2000.0 1400.0 2800.0 2000.0 4000.0 2900.0 5800.0 4200.0 8400.0 6000.0 12000.0 8700.0 17400.0 12600.0 25200.0 18200.0 36400.0 14.7 29.4 23.5 47.0 37.6 75.2 60.1 120.2 96.2 192.4 147.0 294.0 212.0 424.0 300.0 600.0 450.0 900.0 700.0 1400.0 1000.0 2000.0 1600.0 3200.0 2600.0 5200.0 4000.0 8000.0 6500.0 13000.0 10000.0 20000.0 16000.0 30000.0 Maximum tolerance for each bin limit is 18%. 8 Amber Color Bin Limits (nm at 20 mA) Bin Name Min. 1 584.5 2 587.0 4 589.5 6 592.0 Tolerance for each bin limit is 0.5 nm. Max. 587.0 589.5 592.0 594.5 Color Categories Color Yellow Orange Lambda (nm) Min. 582.0 584.5 587.0 589.5 592.0 597.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 Category # 1 3 2 4 5 1 2 3 4 5 6 7 8 Max. 584.5 587.0 589.5 592.0 593.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 619.5 Tolerance for each bin limit is 0.5 nm. Taping Options Straight Lead Option #002 #2CA #2CD Dimension "B" - - - Dimension "H" 20.5 1.0 18.0 1.0 20.5 1.0 (0.81 0.04) (0.71 0.04) (0.81 0.04) Formed Lead Option #2UK Dimension "B" 12.0 1.0 9.0 1.0 (0.47 0.04) (0.35 0.04) Dimension "H" Units: mm (inches) 9 #2UL #2UM #2UN 10.0 1.0 (0.39 0.04) 11.0 1.0 13.0 1.0 14.0 1.0 15.0 1.0 (0.43 0.04) (0.51 0.04) (0.55 0.04) (0.59 0.04) 16.0 1.0 (0.63 0.04) #2UP #2UQ #2UR Tape Outline Drawing 0.0 1.0 (0.00 0.04) 6.4 1.3 (0.25 0.05) 0.0 1.0 (0.00 0.04) 12.7 1.0 (0.50 0.04) CATHODE LEAD 1.5 (0.06) MAX. 5.1 0.7 (0.20 0.03) DIMENSION "H" (SEE TABLE) 2.5 (0.10) MAX. 18.0 1.0 (0.71 0.04) 14.0 1.7 (0.55 0.07) 11.0 MAX. (0.43) 9.1 0.6 (0.36 0.03) 2.5 0.3 (0.10 0.01) A 12.7 0.3 (0.50 0.01) A 4.0 0.2 TYP. (0.16 0.01) VIEW A-A 0.7 0.2 (0.03 0.01) STRAIGHT LEAD 0.0 1.0 (0.00 0.04) 6.4 1.3 (0.25 0.05) 0.0 1.0 (0.00 0.04) 12.7 1.0 (0.50 0.04) CATHODE LEAD 1.5 (0.06) MAX. DIMENSION "B" (SEE TABLE) 3.9 0.7 (0.15 0.03) DIMENSION "H" (SEE TABLE) 2.5 (0.10) MAX. 18.0 1.0 (0.71 0.04) 14.0 1.7 (0.55 0.07) 11.0 MAX. (0.43) 9.1 0.6 (0.36 0.03) 2.5 0.3 (0.10 0.01) A 12.7 0.3 (0.50 0.01) 0.7 0.2 (0.03 0.01) FORMED LEAD 10 A VIEW A-A 4.0 0.2 TYP. (0.16 0.01) Package Options Lead Option Straight Lead Formed Lead Ammo Pack (1000 pcs.) #2C -- #2U -- Tape & Reel (2000 pcs.) #002 - . .... .... ... OR ..... AT # ... ...... R . . T E . OP PARODE E .... . HP TE C DAT ....... . . DAPING........ .... S . TA ..... GAP ........ . BIN. OF TY . I NOANT QU FROM LEFT SIDE OF BOX, ADHESIVE TAPE IS FACING UPWARD. A + E OD AN DE IN MA ANODE LEAD LEAVES THE BOX FIRST. SIA DS LE 140 (5.51) AY L MA E - OD TH CA C 336 (13.23) 52 (2.05) DIMENSIONS IN MILLIMETERS (INCHES). AMMO PACK (for All options except #002) REELING ORIENTATION CLOCKWISE ADHESIVE TAPE MUST BE FACING TOWARDS THE OUTSIDE OF THE REEL. ANODE LEAD LEAVES THE REEL FIRST. 110 (4.33) DIA. PROTECTIVE CARDBOARD 336 (13.23) DIA. DIMENSIONS IN MILLIMETERS (INCHES). TAPE & REEL (for option #002 only) 11 Recommended Assembly Condition * A single-sided phenolic printed circuit board (PCB) is preferred. Double-sided PCB and other materials may cause greater lead stress. Recommended through-hole diameter is 0.93 to 1.03 mm. Leadlength below the PCB should be 1.5 to 2.0 mm, and the clinching angle (angle between the lead and PCB) should be 30 10 degrees. * If SMT devices and an adhesive are used on the same pcb as these lamps, the adhesive should be cured before the lamps are autoinserted. If curing must be done after lamp insertion, the cure temperature and time should not exceed 140 C, 100 seconds. This is the temperature of the surface normal to the IR source. Precautions Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE - C Manual Solder Dipping - - 260 C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME - SECONDS Figure 7. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 12 * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Recommended PC board plated through hole sizes for LED component leads: * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. Wave Soldering 105 C Max. 30 sec Max. 250 C Max. 3 sec Max. * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4093EN 5989-4257EN May 21, 2006