Z0109NN0 - NXP Semiconductors - Datasheet.Directory

1. Product profile

1.1 General description

Planar passivated sensitive gate four quadrant triac in a SOT223 (S C- 73)

surface-mount able plastic package intended for applications requiring enhan ced immunity

to noise and direct interfacing to logic level ICs and low power gate drivers.

1.2 Features and benefits

Direct interfacing to logic level ICs

Enhanced current surge capability

Enhanced noise immunity

High blocking voltage capability

Planar passivated for voltage

ruggedness and reliability

Sensitive gate in four quadrants

Surface-mountable package

Triggering in all four quadrants

1.3 Applications

General purpose low power motor

control

Home appliances

Industrial pro cess control

Low power AC Fan controllers

1.4 Quick reference data

Z0109NN0

4Q Triac

Rev. 3 — 10 May 2011 Product data sheet

SOT223

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDRM repetitive peak off-state

voltage --800V

ITSM non-repetitive peak

on-state current full sine wave; Tj(init) =25°C;

tp= 20 ms; see Figure 4;

see Figure 5

--12.5A

IT(RMS) RMS on-state current full sine wave; Tsp ≤105 °C;

see Figure 3; see Figure 1;

see Figure 2

--1A

Product data sheet Rev. 3 — 10 May 2011 2 of 17

NXP Semiconductors Z0109NN0

4Q Triac

2. Pinning information

3. Ordering information

4. Marking

[1] % = placeholder for manufacturing site code

Static characteristics

IGT gate trigger current VD=12V; I

T= 0.1 A; T2+ G+;

Tj=25°C; see Figure 9 0.4 - 10 mA

VD=12V; I

T= 0.1 A; T2+ G-;

Tj=25°C; see Figure 9 0.4 - 10 mA

VD=12V; I

T= 0.1 A; T2- G-;

Tj=25°C; see Figure 9 0.4 - 10 mA

VD=12V; I

T= 0.1 A; T2- G+;

Tj=25°C; see Figure 9 0.4 - 10 mA

Table 1. Quick reference data …continued

Symbol Parameter Conditions Min Typ Max Unit

Table 2. Pinning info rmation

Pin Symbol Description Simplified outline Graphi c sy mbol

1 T1 main terminal 1

SOT223 (SOT223)

2 T2 main terminal 2

3 G gate

4 T2 main terminal 2 132

ym051

Table 3. Orderi ng information

Type number Package

Name Description Version

Z0109NN0 SOT223 plastic surface-mounted package with increased heatsink;

4 leads SOT223

Table 4. Marking codes

Type number Marking code[1]

Z0109NN0 109NN0

Product data sheet Rev. 3 — 10 May 2011 3 of 17

NXP Semiconductors Z0109NN0

4Q Triac

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maxi mum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage - 800 V

IT(RMS) RMS on-state current full sine wave; Tsp ≤105 °C; see Figure 3;

see Figure 1; see Figure 2 -1A

ITSM non-repetitive peak on-state

current full sine wave; Tj(init) =25°C; t

p=20ms;

see Figure 4; see Figure 5 - 12.5 A

full sine wave; Tj(init) =25°C; t

p= 16.7 ms - 13.8 A

I2t I

2t for fusing tp= 10 ms; sine-wave pulse - 0.78 A2s

dIT/dt rate of rise of on-state current IT=1A; I

G=20mA; dI

G/dt = 100 mA/µs;

T2+ G+ -50A/µs

IT=1A; I

G=20mA; dI

G/dt = 100 mA/µs;

T2+ G- -50A/µs

IT=1A; I

G=20mA; dI

G/dt = 100 mA/µs;

T2- G- -50A/µs

IT=1A; I

G=20mA; dI

G/dt = 100 mA/µs;

T2- G+ -20A/µs

IGM peak gate current - 1 A

PGM peak gate power - 2 W

PG(AV) average gate power over any 20 ms period - 0.1 W

Tstg storage temperature -40 150 °C

Tjjunction temperature - 125 °C

Fig 1. RMS on-state current as a function of solder

point temperature; maximum values Fig 2. RMS on-state current as a function of surge

duration; maximum values

003aac270

0.4

0.8

1.2

-50 0 50 100 150

(°C)

T(RMS)

(A)

003aac269

10-2 10-1 1 10

surge duration (s)

IT(RMS)

(A)

Product data sheet Rev. 3 — 10 May 2011 4 of 17

NXP Semiconductors Z0109NN0

4Q Triac

Fig 3. Total power dissipation as a function of RMS on-state current; maximum values

Fig 4. Non-repetitive peak on-state curre nt as a function of the number of sinusoidal current cycles; maximum

values

003aac259

0.0

0.4

0.8

1.2

1.6

2.0

0 0.2 0.4 0.6 0.8 1 1.2

T(RMS )

(A)

tot

(W)

a = 180

120

conduction

angle

(degrees)

form

factor

120

180

2.8

2.2

1.9

1.57

003aaf449

ITSM

(A)

number of cycles

1 103

102

ITSM

Tj(init) = 25 °C max

1/f

Product data sheet Rev. 3 — 10 May 2011 5 of 17

NXP Semiconductors Z0109NN0

4Q Triac

Fig 5. Non-repetitive peak on-state curre nt as a function of pulse width; maximum values

003aaf490

102

103

10−510−410−310−210−1

(s)

ITSM

(A)

(2)

(1)

TSM

j(init)

= 25 °C max

Product data sheet Rev. 3 — 10 May 2011 6 of 17

NXP Semiconductors Z0109NN0

4Q Triac

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-sp) thermal resistance from

junction to solder poi nt full cycle; see Figure 8 --15K/W

Rth(j-a) thermal resistance from

junction to ambient in free air; printed-circuit board mounted:

minimum footprint; full cycle; see Figure 6 - 156 - K/W

in free air; printed-circuit board mounted: pad

area; full cycle; see Figure 7 -70-K/W

All dimensions are in mm

Printed circuit board:

FR4 epoxy glass (1.6 mm thick), copper laminate

(35 um thick)

Fig 6. Minimum footprint SOT223 Fig 7. Printed circuit board pad area: SOT223

001aab508

3.8 min

1.5

min

1.5

min

(3×)

2.3

4.6

6.3

1.5

min

001aab509

4.6

4.5

Product data sheet Rev. 3 — 10 May 2011 7 of 17

NXP Semiconductors Z0109NN0

4Q Triac

Fig 8. Tran sient thermal impedance from junction to solder point as a junction of pulse width

003aac210

-2

-1

-5

-4

-3

-2

(s)

th(j-sp)

(K/W)

-1

Product data sheet Rev. 3 — 10 May 2011 8 of 17

NXP Semiconductors Z0109NN0

4Q Triac

7. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

IGT gate trigger current VD=12V; I

T= 0.1 A; T2+ G+;

Tj= 25 °C; see Figure 9 0.4 - 10 mA

VD=12V; I

T= 0.1 A; T2+ G-;

Tj= 25 °C; see Figure 9 0.4 - 10 mA

VD=12V; I

T= 0.1 A; T2- G-;

Tj= 25 °C; see Figure 9 0.4 - 10 mA

VD=12V; I

T= 0.1 A; T2- G+;

Tj= 25 °C; see Figure 9 0.4 - 10 mA

ILlatching current VD=12V; I

G= 0.1 A; T2+ G+ ;

Tj= 25 °C; see Figure 10 --15mA

VD=12V; I

G= 0.1 A; T2+ G-;

Tj= 25 °C; see Figure 10 --30mA

VD=12V; I

G= 0.1 A; T2- G-;

Tj= 25 °C; see Figure 10 --15mA

VD=12V; I

G= 0.1 A; T2- G+;

Tj= 25 °C; see Figure 10 --15mA

IHholding current VD=12V; T

j= 25 °C; see Figure 11 --10mA

VTon-state voltage IT= 1.4 A; Tj=25°C; see Figure 12 -1.31.6V

VGT gate trigger voltage VD=12V; I

T= 0.1 A; Tj=25°C;

see Figure 13 --1.3V

VD=800V; I

T= 0.1 A; Tj= 125 °C;

see Figure 13 0.2--V

IDoff-state current VD=800V; T

j=125°C --0.5mA

Dynamic character i stics

dVD/dt rate of rise of off-state voltage VDM = 536 V; Tj= 110 °C; gate open

circuit; exponential waveform;

see Figure 14

120 - - V/µs

dVcom/dt rate of change of commutating

voltage VD=400V; T

j=110°C;

dIcom/dt = 0.44 A/ms; gate open circuit 2--V/µs

Product data sheet Rev. 3 — 10 May 2011 9 of 17

NXP Semiconductors Z0109NN0

4Q Triac

(1) T2- G+

(2) T2- G-

(3) T2+ G-

(4) T2+ G+

Fig 9. Normalized gate trigger cu rrent as a function of

junction temperature Fig 10. Normalized latching current as a function of

junction temperature

Vo = 1.13 V

Rs = 0.31 Ω

(1) Tj = 125 °C; typical values

(2) Tj = 125 °C; maximum values

(3) Tj = 25 °C; maximum values

Fig 11. Normalized holding current as a function of

junction temperature Fig 12. On-state current as a function of on-state

voltage

Tj (°C)

-50 150100050

003aaa205

IGT(25°C)

IGT

(1)

(2)

(3)

(4)

Tj (°C)

-50 150100050

003aaa203

IL(25°C)

Tj (°C)

-50 150100050

003aaa204

IH(25°C)

003aac258

0.4

0.8

1.2

1.6

0 0.4 0.8 1.2 1.6 2

(V)

(A)

(1) (2) (3)

Product data sheet Rev. 3 — 10 May 2011 10 of 17

NXP Semiconductors Z0109NN0

4Q Triac

Fig 13. Normalized gate trigger voltage as a function of

junction temperature Fig 14. Normalized critical rate of rise of off-state

voltage as a function of junc tion temperature;

typical values

Tj (°C)

-50 150100050

003aaa209

0.8

0.4

1.2

1.6

VGT(25°C)

VGT

1.6

1.2

0.8

0.4

0 50 100 150

Tj (°C)

003aaa208

Product data sheet Rev. 3 — 10 May 2011 11 of 17

NXP Semiconductors Z0109NN0

4Q Triac

8. Package outline

Fig 15. Package outline SOT223 (SOT223)

UNIT A1bpcDEe1HELpQywv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.10

0.01

1.8

1.5

0.80

0.60

3.1

2.9

0.32

0.22

6.7

6.3

3.7

3.3 2.3

4.6 7.3

6.7

1.1

0.7

0.95

0.85 0.1 0.10.2

DIMENSIONS (mm are the original dimensions)

SOT223 SC-73 04-11-10

06-03-16

detail X

vMA

0 2 4 mm

scale

132

lastic surface-mounted package with increased heatsink; 4 leads SOT22

Product data sheet Rev. 3 — 10 May 2011 12 of 17

NXP Semiconductors Z0109NN0

4Q Triac

9. Package outline

10. Soldering

Fig 16. Package outline SOT223 (SOT223)

04-11-10Dimensions in mm

6.7

6.3

3.1

2.9

1.8

1.5

7.3

6.7

3.7

3.3

1.1

0.7

132

4.6

2.3 0.8

0.6

0.32

0.22

Fig 17. Re flow soldering footprint for SOT223 (SOT223)

sot223_

1.2

(4×)

1.2

(3×)

1.3

(4×)

1.3

(3×)

6.15

3.85

3.6

3.5

0.3

3.9 7.65

2.3 2.3

6.1

231

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

Product data sheet Rev. 3 — 10 May 2011 13 of 17

NXP Semiconductors Z0109NN0

4Q Triac

Fig 18. Wave soldering footprint for SOT223 (SOT223)

sot223_fw

1.9

6.7

8.9

8.7

1.9

(3×)

1.9

(2×)

1.1

6.2

2.7 2.7

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Product data sheet Rev. 3 — 10 May 2011 14 of 17

NXP Semiconductors Z0109NN0

4Q Triac

11. Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

Z0109NN0 v.3 20110510 Product data sheet - Z0109NN0 v.2

Modifications: •Various changes to content.

Z0109NN0 v.2 20110318 Product data sheet - Z0109NN0 v.1

Product data sheet Rev. 3 — 10 May 2011 15 of 17

NXP Semiconductors Z0109NN0

4Q Triac

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The p r oduct status of device(s) described in this document may ha ve changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modificat ions or additions.

NXP Semiconductors does not give any representati ons or warranties as to

the accuracy or completeness of informati on included herein and shall have

no liability for the consequences of use of such info rmation.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict wit h the short data sheet, the

full data sheet shall pre va il.

Product specifica t ion — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this d ocument is be lieved to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incide ntal,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersed es an d r eplaces all inf ormation supplied pri or

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Document status [1] [2] Product status [3] Definition

Objective [short] data sheet Development This document contai ns data from the objective specification for product development.

Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 10 May 2011 16 of 17

NXP Semiconductors Z0109NN0

4Q Triac

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document ma y be interpret ed or

construed as an of fer to se ll product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) d escribed herein may

be subject to export control regulat i ons. Export might require a prior

authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and st andards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting f rom customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors Z0109NN0

4Q Triac

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 10 May 2011

Document identifier: Z0109NN0

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . .6

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .8

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .1 2

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .14

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . .15

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .15

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .15

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .16

13 Contact information. . . . . . . . . . . . . . . . . . . . . .16