General Description
The MAX8581/MAX8582 high-frequency step-down con-
verters are optimized for dynamically powering the power
amplifier (PA) in CDMA handsets. They integrate a high-
efficiency PWM step-down converter for medium- and
low-power transmission and a 60mΩ(typ) bypass mode
to power the PA directly from the battery during high-
power transmission. They use an analog input driven by
an external DAC to control the output voltage linearly for
continuous PA power adjustment. The MAX8581/
MAX8582 use an internal feedback network, and the
switching frequency is internally set to 2.5MHz and
1.5MHz, respectively.
Fast switching (up to 2.5MHz) and fast soft-start allow
the use of ceramic 2.2µF input and output capacitors
while maintaining low voltage ripple. The small 1.5µH to
3.3µH inductor size can be optimized for efficiency.
The MAX8581/MAX8582 are available in 10-pin, 3mm x
3mm TDFN packages (0.8mm max height).
Applications
WCDMA/NCDMA Cell Phones
Wireless PDAs, Smartphones
Features
♦600mA Step-Down Converter
♦60mΩ(typ) Bypass Mode with Integrated FET
♦Dynamically Adjustable Output from 0.4V to VIN
♦2.5MHz and 1.5MHz Switching Frequency
♦Small LC Components: 1.5µH to 3.3µH and 2.2µF
♦Up to 94% Efficiency
♦Low Output Ripple at All Loads
♦2.7V to 5.5V Input
♦0.1µA Shutdown Mode
♦Output Short-Circuit Protection
♦Thermal Shutdown
♦10-Pin, 3mm x 3mm TDFN Packages
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
________________________________________________________________ Maxim Integrated Products 1
TOP VIEW
OUT
IC
IN
12
LX
OUT
IN
SHDN
GND
34
MAX8581/
MAX8582
10 98
7
REFIN
6
HP
5
+
Pin Configuration
Ordering Information
INPUT
Li+ BATTERY
2.2µF
IN
GND
SHDN
REFIN
OUT
LX
HP FORCED BYPASS
OUTPUT
0.4V TO VBATT
1.5µH OR 3.3µH
2.2µF
ON/OFF
ANALOG
CONTROL
MAX8581
MAX8582
Typical Operating Circuit
19-0593; Rev 1; 1/07
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
*All devices are specified in the -40°C to +85°C extended
temperature range.
**EP = Exposed pad.
+Denotes a lead-free package.
EVALUATION KIT
AVAILABLE
PART* PIN-
PACKAGE
TOP
MARK
PKG
CODE
MAX8581ETB+ 10 TDFN-EP** ACT T1033-1
MAX8582ETB+ 10 TDFN-EP** ACU T1033-1
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
2_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = V SHDN = 3.6V, VREFIN = 0.9V, VHP = VIC = 0V, TA= -40°C to +85°C, typical values are at TA= +25°C, unless otherwise
noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN, SHDN, HP, REFIN to GND ...............................-0.3V to +6.0V
LX, OUT, IC to GND.....................................-0.3V to (VIN + 0.3V)
OUT Short Circuit to GND ..........................................Continuous
LX Current ......................................................................0.7ARMS
IN, OUT Current..............................................................2.5ARMS
Continuous Power Dissipation (TA= +70°C)
10-Pin TDFN (derate 24.4mW/°C above +70°C).........1951mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
UNITS
SUPPLY
Supply Voltage Range VIN 2.7 5.5 V
UVLO Threshold UVLO VIN rising, 180mV hysteresis
2.55 2.63 2.70
V
ILOAD = 0A, switching at 1.5MHz
4000
Shutdown, TA = +25°C 0.1 10Supply Current IIN
Shutdown, TA = +85°C 1.0
µA
OUT
VIN = 4.2V, VREFIN = 1.7V
3.33 3.40 3.47
VREFIN = 0.9V
1.75 1.80 1.85
OUT Voltage Accuracy VOUT VIN = 3.6V VREFIN = 0.4V
0.75 0.80 0.85
V
MAX8581
360
OUT Input Resistance ROUT VLX = VOUT MAX8582
558
kΩ
REFIN
REFIN Common-Mode Range 0 2.2 V
REFIN to OUT Gain
2.00
V/V
REFIN Input Resistance
518
kΩ
REFIN Dual Mode Threshold
VREFIN rising, 77mV hysteresis 0.45 x
VIN
0.463 x
VIN
0.475 x
VIN V
LOGIC INPUTS
VIH VIN = 2.7V to 5.5V 1.4
Logic Input Level VIL VIN = 2.7V to 5.5V 0.4 V
TA = +25°C
0.01
1
Logic Input Bias Current IIH, IIL VINPUT = 0V or VIN TA = +85°C 0.1 µA
Dual Mode is a trademark of Maxim Integrated Products, Inc.
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
_______________________________________________________________________________________ 3
Note 1: All devices are 100% production tested at TA= +25°C. Limits over the operating temperature range are guaranteed by design.
ELECTRICAL CHARACTERISTICS (continued)
(VIN = VSHDN = 3.6V, VREFIN = 0.9, VHP = VIC = 0V, TA= -40°C to +85°C, typical values are at TA= +25°C, unless otherwise noted.)
(Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LX
RONP p-channel MOSFET switch, ILX = -40mA 0.2 0.4
On-Resistance RONN n-channel MOSFET rectifier, ILX = 40mA
0.18 0.35
Ω
TA = +25°C 0.1 5
LX Leakage Current ILXLKG VIN = 5.5V,
LX = GND TA = +85°C1
µA
p-Channel MOSFET Peak
Current Limit ILIMP
700 1077 1400
mA
n-Channel MOSFET Valley
Current Limit ILIMN
790 985 1150
mA
tON(MIN) 70
114
150
Minimum On- and Off-Times tOFF(MIN) 70
112
150 ns
tON/tOFF Ratio tON(MIN) / tOFF(MIN)
0.90 1.02 1.13
s/s
MAX8581 2.5
Switching Frequency MAX8582 1.5
MHz
BYPASS
p-channel MOSFET bypass,
IOUT = -400mA, TA = +25°C
0.06
0.1
On-Resistance RONBYP
p-channel MOSFET bypass, IOUT = -400mA 0.12
Ω
Bypass Current Limit 1.0 2.1 A
Step-Down Current Limit in
Bypass
700 1077 1400
mA
GENERAL
Thermal Shutdown
+160
°C
Thermal-Shutdown Hysteresis 20 °C
Power-Up Delay VSHDN rising to VLX rising 50 130 µs
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
4_______________________________________________________________________________________
Typical Operating Characteristics
(VIN = 3.6V, VOUT = 1.2V, MAX8582 EV Kit, TA= +25°C, unless otherwise noted.)
BYPASS MODE DROPOUT VOLTAGE
vs. LOAD CURRENT
MAX8581/2 toc01
LOAD CURRENT (A)
DROPOUT VOLTAGE (VIN - VOUT) (V)
0.80.60.2 0.4
0.01
0.02
0.03
0.04
0.06
0.05
0.07
0.08
0
0 1.0
VOUT = 3.2V
VOUT = 3.6V
EFFICIENCY vs. OUTPUT VOLTAGE
MAX8581/2 toc02
OUTPUT VOLTAGE (V)
EFFICIENCY (%)
2.82.42.01.2 1.6
65
70
75
80
90
85
95
100
60
0.8 3.2
RLOAD = 7.5Ω
EFFICIENCY
vs. LOAD CURRENT (VOUT = 1.8V)
MAX8581/2 toc03
LOAD CURRENT (mA)
EFFICIENCY (%)
100
20
10
30
40
50
60
80
70
90
100
0
10 1000
EFFICIENCY
vs. LOAD CURRENT (VOUT = 1.2V)
MAX8581/2 toc04
LOAD CURRENT (mA)
EFFICIENCY (%)
100
20
10
30
40
50
60
80
70
90
100
0
10 1000
EFFICIENCY
vs. LOAD CURRENT (VOUT = 0.6V)
MAX8581/2 toc05
LOAD CURRENT (mA)
EFFICIENCY (%)
100
20
10
30
40
50
60
80
70
90
0
10 1000
NO-LOAD SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX8581/2 toc06
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
4.0 4.5 5.0
2
1
3
4
5
6
8
7
9
0
2.5 3.0 3.5 5.5
OUTPUT VOLTAGE vs. LOAD CURRENT
MAX8581/2 toc07
LOAD CURRENT (mA)
OUTPUT VOLTAGE (V)
300 400 500
1.160
1.170
1.180
1.190
1.200
1.210
1.150
0100200 600
OUTPUT VOLTAGE vs. REFIN VOLTAGE
MAX8581/2 toc08
REFIN VOLTAGE (V)
OUTPUT VOLTAGE VOUT (V)
1.20.9 1.5 1.8
0.5
1.5
1.0
2.0
3.0
2.5
4.0
3.5
4.5
0
00.30.6 2.1
VIN = 4.2V
VIN = 3.6V
VIN = 3.0V
RLOAD = 7.5Ω
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
_______________________________________________________________________________________ 5
Typical Operating Characteristics (continued)
(VIN = 3.6V, VOUT = 1.2V, MAX8582 EV Kit, TA= +25°C, unless otherwise noted.)
LIGHT-LOAD SWITCHING WAVEFORMS
MAX8581/2 toc09
200ns/div
ILX
VLX
VOUT
100mA/div
20mV/div
AC-COUPLED
2V/div
0A
0V
ILOAD = 50mA
HEAVY-LOAD SWITCHING WAVEFORMS
MAX8581/2 toc10
200ns/div
ILX
VLX
VOUT
600mA
400mA
200mA
20mV/div
AC-COUPLED
2V/div
0V
ILOAD = 500mA
SOFT-START WAVEFORMS
MAX8581/2 toc11
20µs/div
ILX
IIN
VOUT
2V
2V/div
1V/div
0V
100mA/div
0A
500mA/div
0A
VSHDN
LINE-TRANSIENT WAVEFORMS
MAX8581/2 toc12
20µs/div
ILX
VIN
VOUT
4V
3V
50mV/div
AC-COUPLED
200mA/div
0A
RLOAD = 7.5Ω
LOAD TRANSIENT
MAX8581/2 toc13
20µs/div
VOUT
IOUT
50mV/div
AC-COUPLED
100mA/div
0A
REFIN TRANSIENT RESPONSE
MAX8581/2 toc14
20µs/div
ILX
VREFIN
VOUT
2V
1V
1V
0.5V
200mA/div
0A
RLOAD = 7.5Ω
REFIN TRANSIENT WITH AUTOBYPASS
MAX8581/2 toc15
20µs/div
ILX
VREFIN
VOUT
IOUT
2V/div
0V
1V/div
0V
500mA/div
0A
500mA/div
0A
RLOAD = 7.5Ω
HP TRANSIENT RESPONSE
WITH FORCED AUTOBYPASS
MAX8581/2 toc16
20µs/div
ILX
VHP
VOUT
IOUT
2V/div
0V
1V/div
0V
500mA/div
0A
500mA/div
0A
RLOAD = 7.5Ω
VREFIN = 0.6V
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
6_______________________________________________________________________________________
Detailed Description
The MAX8581/MAX8582 step-down converters deliver
over 600mA to dynamically power the PA in CDMA
handsets. The hysteretic PWM control scheme switches
with nearly fixed frequency at 1.5MHz (MAX8582) to
2.5MHz (MAX8581), allowing efficiency and tiny external
components. A 60mΩbypass mode connects the PA
directly to the battery during high-power transmission.
Control Scheme
A hysteretic PWM control scheme ensures high effi-
ciency, fast switching, fast transient response, low out-
put ripple, and physically tiny external components.
This control scheme is simple: When the output voltage
is below the regulation voltage, the error comparator
begins a switching cycle by turning on the high-side
switch. This switch remains on until the minimum on-
time expires and the output voltage is in regulation or
the current-limit threshold is exceeded. Once off, the
high-side switch remains off until the minimum off-time
expires and the output voltage falls out of regulation.
During this period, the low-side synchronous rectifier
turns on and remains on until the high-side switch turns
on again. The internal synchronous rectifier eliminates
the need for an external Schottky diode.
Voltage-Positioning Load Regulation
The MAX8581/MAX8582 utilize a unique feedback net-
work. By taking feedback from the LX node, the usual
phase lag due to the output capacitor is removed, mak-
ing the loop exceedingly stable and allowing the use of
very small ceramic output capacitors. This configura-
tion yields load regulation equal to half the inductor’s
series resistance multiplied by the load current. This
voltage-positioning load regulation greatly reduces
overshoot during load transients or when changing
VOUT from one voltage to another. However, when cal-
culating REFIN voltage, the load regulation should be
considered. Because inductor resistance is typically
well specified and the typical PA is a resistive load, the
VREFIN to VOUT gain is slightly less than 2V/V for the
MAX8581/MAX8582.
Bypass Mode
During high-power transmission, the bypass mode’s
low on-resistance provides low dropout, long battery
life, and high output-current capability. Bypass mode
connects IN directly to OUT with the internal 60mΩ
(typ) bypass FET, while the step-down converter is
forced into 100% duty-cycle operation to slightly lower
total on-resistance to less than 60mΩ(typ).
Pin Description
PIN NAME FUNCTION
1GND Ground
2, 3 IN Supply Voltage Input. 2.7V to 5.5V. Bypass with a 2.2µF ceramic capacitor as close as possible to IN
and GND.
4SHDN Active-Low Shutdown Input. Connect to IN or logic-high for normal operation. Connect to GND or
logic-low for shutdown mode.
5HP
High-Power Mode Set Input. Drive HP high to invoke bypass mode. Bypass mode connects IN
directly to OUT with the internal bypass MOSFET.
6REFIN DAC-Controlled Input. Output regulates to 2 x VREFIN for the MAX8581 and MAX8582. Dual-mode
threshold at 0.465 VIN enables bypass mode.
7ICInternally Connected. Connect to ground.
8, 9 OUT Output Voltage Connection for Bypass Mode. Internally connected to IN using the internal bypass
MOSFET during bypass mode. Connects to the internal feedback network.
10 LX Inductor Connection. Connect inductor to the drains of the internal p-channel and n-channel
MOSFETs. Connects to the internal feedback network.
—EPExposed Paddle. Connect to GND.
Forced and Automatic Bypass Mode
Invoke forced-bypass mode by driving HP high or
invoke automatic bypass by applying a high voltage to
REFIN (VREFIN > 2.1V with a Li-ion (Li+) battery at IN).
To prevent excessive output ripple as the step-down
converter approaches dropout, the MAX8581/MAX8582
preemptively enter bypass mode automatically when
VREFIN > 0.465 VIN (see Figure 1).
Shutdown Mode
Connect SHDN to GND or logic-low to place the
MAX8581/MAX8582 in shutdown mode and reduce
supply current to 0.1µA. In shutdown, the control cir-
cuitry, internal switching MOSFET, and synchronous
rectifier turn off and LX becomes high impedance.
Connect SHDN to IN or logic-high for normal operation.
Fast Soft-Start
The MAX8581/MAX8582 have internal fast soft-start cir-
cuitry that limits inrush current at startup, reducing tran-
sients on the input source. Soft-start is particularly
useful for supplies with high output impedance such as
Li+ and alkaline cells. See the Soft-Start Waveforms in
the Typical Operating Characteristics.
Analog REFIN Control
The MAX8581/MAX8582 use REFIN to set the output
voltage and to switch to bypass mode. The output volt-
age is two times the voltage applied at REFIN minus
half the IR voltage drop caused by the inductor’s DC
resistance for the MAX8581/MAX8582. This allows the
converter to operate in applications where dynamic
voltage control is required.
Applications Information
The MAX8581/MAX8582 are optimized for use with a tiny
inductor and small ceramic capacitors. The correct
selection of external components ensures high efficiency,
low output ripple, and fast transient response.
Setting the Output Voltage
The MAX8581/MAX8582 output voltages are set by the
voltage applied to REFIN. The output voltage is 2 VREFIN
minus half the IR voltage drop caused by the inductor’s
DC resistance for the MAX8581/MAX8582.
Inductor Selection
The MAX8581/MAX8582 use 1.5µH and 3.3µH, respec-
tively. Low inductance values are physically smaller
but require faster switching, which results in some effi-
ciency loss (see the Typical Operating Characteristics
for efficiency).
The inductor’s DC current rating only needs to match the
maximum load of the application because the
MAX8581/MAX8582 feature zero current overshoot during
startup and load transients. For optimum transient
response and high efficiency, choose an inductor with
DC series resistance in the 50mΩto 150mΩrange.
Output Capacitor Selection
The output capacitor is required to keep the output volt-
age ripple small and to ensure regulation loop stability.
The output capacitor must have low impedance at the
switching frequency. Ceramic capacitors with X5R or
X7R dielectric are highly recommended due to their
small size, low ESR, and small temperature coefficients.
Due to the unique feedback network, the output capa-
citance can be very low. In most applications, 2.2µF
works well. For optimum load-transient performance
and very low output ripple, the output capacitor value
can be increased.
Input Capacitor Selection
The input capacitor reduces the current peaks drawn
from the battery or input power source and reduces
switching noise in the MAX8581/MAX8582. The imped-
ance of the input capacitor at the switching frequency
should be kept very low. Ceramic capacitors with X5R
or X7R dielectric are highly recommended due to their
small size, low ESR, and small temperature coefficients.
Due to the MAX8581/MAX8582s’ fast soft-start, the input
capacitance can be very low. In most applications,
2.2µF works well. For optimum noise immunity and low
input ripple, the input capacitor value can be increased.
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
_______________________________________________________________________________________ 7
VIN = 3.2V TO 3.66V
200mV/div
VOUT = 3V
200mV/div
5ms/div
Figure 1. VIN and VOUT with Automatic Entry/Exit into Bypass
Mode
MAX8581/MAX8582
PCB Layout
Checklist
High switching frequencies and relatively large peak cur-
rents make the PCB layout a very important part of
design. Good design minimizes excessive EMI on the
feedback paths and voltage gradients in the ground
plane, both of which can result in instability or regulation
errors. Connect the input capacitor close to IN and GND.
Connect the inductor and output capacitor as close to
the IC as possible and keep their traces short, direct,
and wide. Keep noisy traces, such as the LX node, as
short as possible. Connect GND to the exposed paddle
directly under the IC. Figure 2 illustrates an example
PCB layout and routing scheme.
Chip Information
PROCESS: BiCMOS
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
8_______________________________________________________________________________________
Table 1. Suggested Inductors
MANUFACTURER
SERIES INDUCTANCE
(µH)
ESR
(Ω)
CURRENT
RATING (mA)
DIMENSIONS
1.5 0.10 1400
Coilcraft LP03310 3.3 0.16 950 3.3 x 3.3 x 1.0 = 11mm3
SD3110 1.5 0.11 970 3.1 x 3.1 x 1.05 = 10mm3
1.5 0.10 1090
Cooper SD3112 3.3 0.17 840 3.1 x 3.1 x 1.2 = 12mm3
1.5 0.07 1500
FDK MIPF2520D 3.3 0.10 1200 2.5 x 2.0 x 1.0 = 5mm3
Panasonic ELC3FN 2.2 0.12 1000 3.2 x 3.2 x 1.2 = 12mm3
CDRH2D09 1.5 0.05 680
Sumida CDRH2D11 3.3 0.10 450 3.2 x 3.2 x 1.2 = 12mm3
CB2016 2.2 0.13 510
CBC2016 2.2 0.20 750 2.0 x 1.25 x 1.45 = 3.6mm3
CB2518 2.2 0.09 510 2.0 x 1.6 x 1.8 = 5.8mm3
CBC2518 2.2 0.13 890 2.5 x 1.8 x 2.0 = 9mm3
1.5 0.08 1200
Taiyo Yuden
NR3010 3.3 0.14 840 3.2 x 3.2 x 1.2 = 12mm3
MDT2520-CR
2.2 0.08 700 2.5 x 2.0 x 1.0 = 5mm3
1.5 0.11 900TOKO D2812C 1.3 0.17 730 2.8 x 2.8 x 1.2 = 9.4mm3
L1 = FDK MIPF2520 SERIES
1.5µH FOR MAX8581
3.3µH FOR MAX8582
C1, C2 = TAIYO YUDEN JMK105BJ225MV-B
OUT
GND
REFIN
GND
IN
HP
SHDN
L1
C1 C2
Figure 2. Example PCB Layout and Routing Scheme
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
_______________________________________________________________________________________ 9
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
6, 8, &10L, DFN THIN.EPS
H1
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
MAX8581/MAX8582
2.5MHz/1.5MHz Step-Down Converters
with 60mΩBypass in TDFN for CDMA PA Power
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 10
©2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
COMMON DIMENSIONS
SYMBOL MIN. MAX.
A0.700.80
D2.903.10
E2.903.10
A1 0.00 0.05
L0.200.40
PKG. CODE N D2 E2 eJEDEC SPEC b[(N/2)-1] x e
PACKAGE VARIATIONS
0.25 MIN.k
A2 0.20 REF.
2.30±0.101.50±0.106T633-1 0.95 BSC MO229 / WEEA 1.90 REF0.40±0.05
1.95 REF0.30±0.050.65 BSC2.30±0.108T833-1
2.00 REF0.25±0.050.50 BSC2.30±0.1010T1033-1
2.40 REF0.20±0.05- - - - 0.40 BSC1.70±0.10 2.30±0.1014T1433-1
1.50±0.10
1.50±0.10
MO229 / WEEC
MO229 / WEED-3
0.40 BSC - - - - 0.20±0.05 2.40 REFT1433-2 14 2.30±0.101.70±0.10
T633-2 6 1.50±0.10 2.30±0.10 0.95 BSC MO229 / WEEA 0.40±0.05 1.90 REF
T833-2 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
T833-3 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
-DRAWING NOT TO SCALE-
H2
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
2.30±0.10 MO229 / WEED-3 2.00 REF0.25±0.05
0.50 BSC
1.50±0.1010T1033-2
Revision History
Pages changed at Rev 1: 1, 3, 8, 9, 10
