INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1301-R06 1
CPC1301
Optocoupler with
High-Voltage Darlington Output
Part Number Description
CPC1301G 4-Pin DIP (100/Tube)
CPC1301GR 4-Pin Surface Mount (100/Tube)
CPC1301GRTR 4-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Breakdown Voltage - BVCEO 350 VP
Current Transfer Ratio - CTR 1000-8000 %
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecom Switching
• Tip/Ring Circuits
• Hook Switch
• Modem Switching (Laptop, Notebook, Pocket Size)
• Loop Detect
• Ringing Detect
• Current Sensing
• 5000Vrms Input/Output Isolation
• 350VP Breakdown Voltage
• Small 4-Pin Package
• Surface Mount Tape & Reel Version Available
The CPC1301 is a unidirectional input optocoupler
with a high-voltage Darlington output. Light output
from the highly efficient infrared LED activates the
optically coupled silicon NPN photo-Darlington output
transistor. The input LED and the output transistor are
separated by a 5000Vrms isolation barrier.
With a LED current of only 1mA, a current transfer
ratio of 1000% to 8000% is guaranteed at the
collector of the 350V Darlington output transistor.
The CPC1301's low input current, high current
transfer ratio, high output voltage capability, and
large isolation barrier rating make it ideal for many
applications such as telecom, industrial, and power
control.
Approvals
• UL 1577 Approved Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN 60950 Certified Component:
TUV Certificate B 13 12 82667 003
1
A
K
C
E
2
4
3
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2R06
CPC1301
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manfacturing testing requirements.
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Breakdown Voltage ICEO=100µA BVCEO 350 - - VP
Emitter-Collector Breakdown Voltage IE=0.1mA BVECO 0.3 - - V
Phototransistor Output (Dark) Current VCEO=200V, IF=0mA ICEO - - 100 nA
Saturation Voltage IC=10mA, IF=1mA VCE(Sat)
--1
V
IC=100mA, IF=10mA - - 1.2
Current Transfer Ratio IF=1mA, VCE=1V CTR 1000 5500 8000 %
Output Capacitance VCEO=50V, f=1MHz COUT -13-pF
Input Characteristics
Input Control Current IC=10mA, VCE=1V IF- 0.07 1 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Input Reverse Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance - CI/O -3-pF
Parameter Ratings Units
Breakdown Voltage, BVCEO 350 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Phototransistor Power Dissipation 2150 mW
Isolation Voltage, Input to Output 5000 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / oC
2 Derate linearly 1.5 mW / oC
Characteristic Symbol Test Condition Typ Units
Rise Time tR
VCC=10V
IF=10mA
RL=100
40
s
Fall Time tF2.6
Turn-On Time ton 2.75
Storage Time tS20
Turn-Off Time toff 60
Turn-On Time ton VCC=10V
IF=16mA
RL=180
1
Storage Time tS40
Turn-Off Time toff 80
Switching Characteristics @ 25ºC
Switching Time Test Circuit VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=50%
IF
10%
90%
ton toff
t S
VCE t Ft R
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CPC1301
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R06
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Current (mA)
0
10
20
30
40
50
LED Current (IF)
vs. LED Forward Voltage (VF)
LED Forward Voltage (V)
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Current (mA)
0.1
1
10
100
LED Current (IF)
vs. LED Forward Voltage (VF)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
100,000
0.1 110 100
10,000
1000
100
10
LED Current (mA)
CTR (%)
VCE=1.5V
VCE=1.0V
CTR vs. LED Current (IF)
LED Forward Current (mA)
Collector Current IC (mA)
0.01
1000
100
10
1
0.1 1 10 100
Collector Current
vs. LED Current (IF)
VCE=1.5V
VCE=1.0V
Temperature (ºC)
Collector Current IC (mA)
Collector Current vs. Temperature
(VCE = 1.2V)
375
300
225
150
75
0
-40 -20 0 20 40 60 80 100
I
F
=10mA
I
F
=5mA
I
F
=1mA
I
F
=0.5mA
Load Resistance (:)
10 100 1K 10K 100K
Switching Time (Ps)
0.1
1
10
100
1000
Switching Time vs. Load Resistance
tOFF, IF=16mA
tOFF, IF=1.6mA
tON, IF=1.6mA
tON, IF=16mA
Collector-Emitter Voltage VCE (V)
Collector Current IC (mA)
0
180
160
140
120
100
80
60
40
20
00.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Collector Current vs.
Collector-Emitter Voltage
IF = 1mA
IF = 0.5mA
IF = 2mA
IF = 5mA
IF = 10mA
Temperature (ºC)
Leakage Current (µA)
Leakage vs. Temperature
(VCEO
= 350V)
3.0
2.5
2.0
1.5
1.0
0.5
0-40 -20 0 20 40 60 80 120100
Breakdown Voltage vs. Temperature
Temperature (ºC)
Breakdown Voltage BVCEO (VP)
-40
450
440
430
420
410
400
390
380
370
-15 10 35 60 85
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
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CPC1301
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1301G MSL 1
CPC1301GR MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1301GR, the solder
reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed.
For the through-hole device, CPC1301G, and any other processes, the guidelines of J-STD-020 must be observed.
Device Maximum Body Temperature (Tc) Time
CPC1301GR 250ºC 15 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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CPC1301
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MECHANICAL DIMENSIONS
PC Board Pattern (Top View)
Dimensions
mm
(inches)
PIN 1
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
0.991
(0.039)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010)
9.144 ± 0.508
(0.360 ± 0.020)
7.620 ± 0.250
(0.300 ± 0.010)
7.620 ± 0.127
(0.300 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005) 3.175
(0.125)
0.508
(0.020)
2.159
(0.085)
Dimensions
mm
(inches)
PCB Land Pattern
PIN #1
6.350 ± 0.127
(0.250 ± 0.005)
0.991
(0.039)
9.525
(0.375)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.254
(0.025 ± 0.010)
0.254
(0.010)
3.300 ± 0.050
(0.130 ± 0.002)
3.480 ± 0.076
(0.137 ± 0.003)
2.287
(0.09)
8.80
(0.346)
1.60
(0.063)
0.95
(0.037)
9º ± 1º
(ALL)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
CPC1301G
CPC1301GR
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1301-R06
©Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/7/2016
For additional information please visit our website at: www.ixysic.com
6
CPC1301
Dimensions
mm
(inches)
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max) K0=4.20
(0.165)
K1=3.70
(0.146)
W=16.00±0.30
(0.630±0.012)
A0=10.01
(0.394)
P=12.00
(0.472)
B0=5.00
(0.197)
CPC1301GRTR Tape & Reel
