Siemens Matsushita Components 43
Applications
●Temperature compensation
●Hybrid circuits
●Data systems
●Telecom systems
●Automotive electronics
●LC displays
Features
●Small dimensions, EIA size 1206
●Silver palladium terminations
●Cost-effective
●Suitable for automatic placement
●Suitable for wave and reflow soldering
●Available on tape (PU: 4000 pcs)
Options
Alternative resistance ratings and resistance tolerance < 5% available on request
+: J for ∆
R
/
R
N = ±5 %
K for ∆
R
/
R
N = ± 10 %
M for ∆
R
/
R
N = ± 20 %
1) Depends on mounting situation
Climatic category (IEC 68-1)
Max. power at 25 °C (on PCB)
P
25
Resistance tolerance ∆
R
/
R
N
Rated temperature
T
N
B value tolerance ∆
B
/
B
Dissipation factor (on PCB) δth1)
Thermal cooling time constant (on PCB) τc1)
Heat capacity
C
th1)
55/125/21
300
±5%,±10 %, ±20 %
25
± 3 %
approx. 5
approx. 10
approx. 50
mW
°C
mW/K
s
mJ/K
Type
R
25
Ω
No. of
R
/
T
characteristic
B
25/100
K
Ordering code
C 621/2,2 k/+ 2,2 k 1308 3060 B57621-C222-+62
C 621/3,3 k/+ 3,3 k 1309 3520 B57621-C332-+62
C 621/4,7 k/+ 4,7 k 1309 3520 B57621-C472-+62
C 621/10 k/+ 10 k 1010 3530 B57621-C103-+62
C 621/15 k/+ 15 k 1008 3560 B57621-C153-+62
C 621/22 k/+ 22 k 1008 3560 B57621-C223-+62
C 621/33 k/+ 33 k 2003 3980 B57621-C333-+62
C 621/47 k/+ 47 k 2001 3920 B57621-C473-+62
C 621/68 k/+ 68 k 2001 3920 B57621-C683-+62
Dimensions in mm
Approx. weight 18 mg
Termination
Temperature Measurement
SMDs B57621
C 621
44 Siemens Matsushita Components
+: J for ∆
R
/
R
N = ±5 %
K for ∆
R
/
R
N = ± 10 %
M for ∆
R
/
R
N = ± 20 %
Type
R
25
Ω
No. of
R
/
T
characteristic
B
25/100
K
Ordering code
C 621/100 k/+ 100 k 4901 3950 B57621-C104-+62
C 621/150 k/+ 150 k 2903 4200 B57621-C154-+162
C 621/220 k/+ 220 k 2903 4200 B57621-C224-+62
C 621/330 k/+ 330 k 1014 4250 B57621-C334-+62
C 621/470 k/+ 470 k 1014 4250 B57621-C474-+62
Reliability data
Tested on standardized PCB in accordance with IEC 60068-2-21
Test Standard Test conditions ∆
R
25/
R
25
(typical) Remarks
Storage in
dry heat IEC
60068-2-2
Storage at upper
category temperature
T
: 125 °C
t
: 1000 h
< 3 %
Storage in damp
heat, steady state IEC
60068-2-3
Temperature of air: 40 °C
Relative humidity of air: 93 %
Duration: 21 days < 3 % No visible
damage
Rapid temperature
cycling IEC
60068-2-14
Lower test temperature: – 55 °C
Upper test temperature: 125 °C
Number of cycles: 10 < 3 %
Endurance
P
max: 300 mW
Duration: 1000 h < 5 %
Solderability IEC
60068-2-58
Solderability: 215 °C/4 s
235 °C/2 s
Resistance to soldering heat:
260 °C/10 s
< 3 % 95 % of
terminations
wetted
Robustness of
terminations Bending of carrier
(2 mm bending)
Refer also to page 120
< 3 % No visible
damage
B57621
C 621
