© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2 1Publication Order Number:
NUF2030XV6/D
NUF2030XV6, NUF2042XV6
USB Upstream Terminator
with ESD Protection
These devices are designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. They are intended
for use in upstream USB ports, cellular phones, wireless equipment
and computer applications. These devices offer an integrated solution
in a small package (SOT−563) reducing PCB space and cost.
Features:
Provides USB Line Termination, Filtering and ESD Protection
Single IC Offers Cost Savings
Bidirectional EMI Filtering Prevents Noise from Entering/Leaving
the System
Compliance with IEC61000−4−2 (Level 4)
8 kV (Contact)
15 kV (Air)
ESD Ratings: Machine Model = C
:Human Body Model = 3B
These are Pb−Free Devices
Benefits:
SOT−563 Package Minimizes PCB Space
Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
USB Hubs
Computer Peripherals Using USB
MAXIMUM RATINGS (TA = 25°C)
Rating Symbol Value Unit
Steady State Power PD225 mW
Maximum Junction Temperature TJ(max) 125 °C
Operating Temperature Range TJ−55 to +125 °C
Storage Temperature Range Tstg −55 to +125 °C
Lead Solder Temperature
(10 second duration) TL260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
SOT−563
CASE 463A
CIRCUIT DESCRIPTION
MARKING DIAGRAM
654
123
RS
D1(0) VBUS D2(0)
D1(i) GND D2(i)
RSC1C1
1
6
xx = Specific Device Code
(see table on page 5)
M = Month Code
G= Pb−Free Package
(Note: Microdot may be in either location)
xx M G
G
1
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
NUF2030XV6, NUF2042XV6
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Device VRWM
(V)
VBR @ 1 mA
(V) IR @ 3.3 V
(nA)
Line Capacitance
Vdc = 2.5 V
f = 1 MHz
(pF) (Note 1) Series Resistor
RS (W)
Min Typ Max Min Typ Max Min Typ Max Min Typ Max
NUF2030XV6T1 5.25 5.6 6.8 8.0 10 100 30 36 17.6 22 26.4
NUF2042XV6T1 5.25 5.6 6.8 8.0 10 100 37.6 42 56.4 17.6 22 26.4
1. Measured between pins 1, 3, 4, 6 and ground with pin 5 also grounded.
2. For other resistance value (e.g. 33 W), please contact your local ON Semiconductor sales representative.
NUF2030XV6, NUF2042XV6
http://onsemi.com
3
TYPICAL CHARACTERISTICS
FREQUENCY (Hz)
S21 (dB)
0
10
20
30
40
50
60
01 2345
REVERSE VOLTAGE (V)
CAPACITANCE (pF)
Figure 1. Insertion Loss Characteristics
(NUF2030) Figure 2. Analog Cross−Talk (NUF2030)
−30
−25
−20
−15
−10
−5
0
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
Figure 3. Insertion Loss Characteristics
(NUF2042) Figure 4. Analog Cross−Talk (NUF2042)
Figure 5. Typical Capacitance (NUF2030) Figure 6. Typical Capacitance (NUF2042)
FREQUENCY (Hz)
S41 (dB)
−80
−70
−60
−50
−40
−30
1.E+06 1.E+07 1.E+08 1.E+09 1.E+1
0
−20
−10
0
FREQUENCY (Hz)
S21 (dB)
−30
−25
−20
−15
−10
−5
0
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz)
S41 (dB)
−80
−70
−60
−50
−40
−30
1.E+06 1.E+07 1.E+08 1.E+09 1.E+1
0
−20
−10
0
0
10
20
30
40
50
60
01 2345
REVERSE VOLTAGE (V)
CAPACITANCE (pF)
70
80
NUF2030XV6, NUF2042XV6
http://onsemi.com
4
21.5
22.0
22.5
23.0
23.5
24.0
24.5
−20 −10 0 10 20 30 40 50 60 70
RS = Typical
TEMPERATURE (°C)
RS (W)
Figure 7. RS versus Temperature
(NUF2030 and NUF2042)
NUF2030XV6, NUF2042XV6
http://onsemi.com
5
ORDERING INFORMATION
Device Device
Marking Package Shipping
NUF2030XV6T1 30 SOT−563* 4000 / Tape & Reel
NUF2030XV6T1G 30 SOT−563* 4000 / Tape & Reel
NUF2042XV6T1 22 SOT−563* 4000 / Tape & Reel
NUF2042XV6T1G 22 SOT−563* 4000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
NUF2030XV6, NUF2042XV6
http://onsemi.com
6
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE E
1.35
0.0531
0.5
0.0197
ǒmm
inchesǓ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM MIN NOM MAX
MILLIMETERS
A0.50 0.55 0.60
b0.17 0.22 0.27
C
D1.50 1.60 1.70
E1.10 1.20 1.30
e0.5 BSC
L0.10 0.20 0.30
1.50 1.60 1.70
0.020 0.021 0.023
0.007 0.009 0.011
0.059 0.062 0.066
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN NOM MAX
INCHES
eM
0.08 (0.003) X
b6 5 PL
A
C
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
D
E
Y
12 3
45
L
6
HE
0.08 0.12 0.18 0.003 0.005 0.007
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its of ficers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
NUF2030XV6/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.