Ver. 201207 Multilayer Power Inductor CIG22H Series (2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN High Current Type Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 22 Dimension [mm] L W T D 2.50.2 2.00.2 1.10.1 0.550.25 DESCRIPTION Size Inductance DC Rated Current (A)1 (inch/mm) (uH)@1MHz Resistance() Typ. CIG22H1R0MNE 1008/2520 1.0 20 % 0.08025 % CIG22H1R2MNE 1008/2520 1.2 20 % CIG22H1R5MNE 1008/2520 CIG22H2R2MNE Part no. Rated Current (A)2 Max. Typ. 3.3 1.5 2.0 0.09420 % 2.8 1.5 1.9 1.5 20 % 0.10420 % 2.4 1.5 1.6 1008/2520 2.2 20 % 0.11620 % 1.8 1.2 1.6 CIG22H3R3MNE 1008/2520 3.3 20 % 0.13320 % 1.0 1.0 1.5 CIG22H4R7MNE 1008/2520 4.7 20 % 0.23320 % 0.95 0.8 1.0 Rated Current (A)1: DC current value when Inductance drops to 30% of nominal Inductance value (ONLY REFERENCE) Rated Current (A)2: DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25) Operating temperature range: -40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201207 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 22 (3) H (4) 1R0 (5) M (6) N (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (H:High Current Type) Inductance (1R0:1.0uH) (6) Tolerance (M:20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 2,500 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.