© Semiconductor Components Industries, LLC, 2006
March, 2006 Rev. 6
1Publication Order Number:
MC74AC138/D
MC74AC138, MC74ACT138
1−of−8
Decoder/Demultiplexer
The MC74AC138/74ACT138 is a highspeed 1of8
decoder/demultiplexer. This device is ideally suited for highspeed
bipolar memory chip select address decoding.
The multiple input enables allow parallel expansion to a 1of24
decoder using just three MC74AC138/74ACT138 devices or a
1of32 decoder using four MC74AC138/74ACT138 devices and one
inverter.
Demultiplexing Capability
Multiple Input Enable for Easy Expansion
Active LOW Mutually Exclusive Outputs
Outputs Source/Sink 24 mA
ACT138 Has TTL Compatible Inputs
wThese devices are available in Pbfree package(s). Specifications herein
apply to both standard and Pbfree devices. Please see our website at
www.onsemi.com for specific Pbfree orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
VCC
GNDA0A1A2E1E2E3
1516 14 13 12 11 10
21 34567
9
8
O7
O0O1O2O3O4O5O6
Figure 1. Pinout: 16Lead Packages Conductors
(Top View)
Figure 2. Logic Symbol
A0A1A2E1E2E3
O1O2O3O4O5O6O7
O0
PIN ASSIGNMENT
PIN FUNCTION
A0A2Address Inputs
E1E2Enable Inputs
E3Enable Input
O0O7Outputs
http://onsemi.com
DIP16
N SUFFIX
CASE 648
1
16
SO16
D SUFFIX
CASE 751B
1
16
Device Package Shipping
ORDERING INFORMATION
MC74AC138N PDIP16 25 Units/Rail
MC74AC138D SOIC16 48 Units/Rail
MC74AC138DR2 2500 Tape & Reel
TSSOP16
DT SUFFIX
CASE 948F
MC74AC138DT TSSOP16 96 Units/Rail
MC74AC138DTR2 TSSOP16
SOIC16
2500 Tape & Reel
MC74ACT138N PDIP16 25 Units/Rail
MC74ACT138D SOIC16 48 Units/Rail
MC74ACT138DR2 2500 Tape & Reel
MC74ACT138DT TSSOP16 96 Units/Rail
MC74ACT138DTR2 TSSOP16
SOIC16
2500 Tape & Reel
1
16
See general marking information in the device marking
section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
1
16
EIAJ16
M SUFFIX
CASE 966
MC74AC138M EIAJ16
MC74AC138MEL EIAJ16 2000 Tape & Reel
MC74ACT138M EIAJ16
MC74ACT138MEL EIAJ16 2000 Tape & Reel
50 Units/Rail
50 Units/Rail
MC74AC138, MC74ACT138
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2
FUNCTIONAL DESCRIPTION
The MC74AC138/74ACT138 highspeed 1of8
decoder/demultiplexer accepts three binary weighted inputs
(A0, A1, A2) and, when enabled, provides eight mutually
exclusive activeLOW outputs (O0O7). The
MC74AC138/74ACT138 features three Enable inputs, two
activeLOW (E1, E2) and one activeHIGH (E3). All
outputs will be HIGH unless E1 and E2 are LOW and E3 is
HIGH. This multiple enabled function allows easy parallel
expansion of the device to a 1of32 (5 lines to 32 lines)
decoder with just four MC74AC138/74ACT138 devices
and one inverter (See Figure 4). The
MC74AC138/74ACT138 can be used as an 8output
demultiplexer by using one of the active LOW Enable inputs
as the data input and the other Enable inputs as strobes. The
Enable inputs which are not used must be permanently tied
to their appropriate activeHIGH or activeLOW state.
TRUTH TABLE
Inputs Outputs
E1E2E3A0A1A2O0O1O2O3O4O5O6O7
H X X X X X H H H H H H H H
X H X X X X H H H H H H H H
X X L X X X H H H H H H H H
L L H L L L L H H H H H H H
L L H H L L H L H H H H H H
L L H L H L H H L H H H H H
L L H H H L H H H L H H H H
L L H L L H H H H H L H H H
L L H H L H H H H H H L H H
L L H L H H H H H H H H L H
L L H H H H H H H H H H H L
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
A2A1A0E3
E1E2
0706050403020100
NOTE: This diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation
delays.
Figure 3. Logic Diagram
MC74AC138, MC74ACT138
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3
H
123 123 123 123
A0
A2
A3
A4
A0A1A2E
0001020304050607
A0A1A2E
0001020304050607
A0A1A2E
0001020304050607
A0A1A2E
0001020304050607
00031
04
Figure 4. Expansion to 1of32 Decoding
A1
MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V
VIN DC Input Voltage (Referenced to GND) 0.5 to VCC +0.5 V
VOUT DC Output Voltage (Referenced to GND) 0.5 to VCC +0.5 V
IIN DC Input Current, per Pin ±20 mA
IOUT DC Output Sink/Source Current, per Pin ±50 mA
ICC DC VCC or GND Current per Output Pin ±50 mA
Tstg Storage Temperature 65 to +150 °C
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recom-
mended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage
AC 2.0 5.0 6.0
V
ACT 4.5 5.0 5.5
VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) 0VCC V
tr, tfInput Rise and Fall Time (Note 1)
AC Devices except Schmitt Inputs
VCC @ 3.0 V 150
VCC @ 4.5 V 40 ns/V
VCC @ 5.5 V 25
tr, tfInput Rise and Fall Time (Note 2)
ACT Devices except Schmitt Inputs
VCC @ 4.5 V 10
ns/V
VCC @ 5.5 V 8.0
TJJunction Temperature (PDIP) 140 °C
TAOperating Ambient Temperature Range 40 25 85 °C
IOH Output Current High 24 mA
IOL Output Current Low 24 mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
MC74AC138, MC74ACT138
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4
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74AC 74AC
Unit Conditions
TA = +25°C
TA =
40°C to
+85°C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage
3.0 1.5 2.1 2.1 VOUT = 0.1 V
4.5 2.25 3.15 3.15 V or VCC 0.1 V
5.5 2.75 3.85 3.85
VIL Maximum Low Level
Input Voltage
3.0 1.5 0.9 0.9 VOUT = 0.1 V
4.5 2.25 1.35 1.35 V or VCC 0.1 V
5.5 2.75 1.65 1.65
VOH Minimum High Level
Output Voltage
3.0 2.99 2.9 2.9 IOUT = 50 μA
4.5 4.49 4.4 4.4 V
5.5 5.49 5.4 5.4
V
*VIN = VIL or VIH
3.0 2.56 2.46 12 mA
4.5 3.86 3.76 IOH 24 mA
5.5 4.86 4.76 24 mA
VOL Maximum Low Level
Output Voltage
3.0 0.002 0.1 0.1 IOUT = 50 μA
4.5 0.001 0.1 0.1 V
5.5 0.001 0.1 0.1
V
*VIN = VIL or VIH
3.0 0.36 0.44 12 mA
4.5 0.36 0.44 IOL 24 mA
5.5 0.36 0.44 24 mA
IIN Maximum Input
Leakage Current 5.5 ±0.1 ±1.0 μA VI = VCC, GND
IOLD †Minimum Dynamic
Output Current
5.5 75 mA VOLD = 1.65 V Max
IOHD 5.5 75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current 5.5 8.0 80 μA VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
MC74AC138, MC74ACT138
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5
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol Parameter VCC*
(V)
74AC 74AC
Unit Fig.
No.
TA = +25°C
CL = 50 pF
TA = 40°C
to +85°C
CL = 50 pF
Min Typ Max Min Max
tPLH
Propagation Delay
An to On
3.3 1.5 8.5 13.0 1.5 15.0 ns 36
5.0 1.5 6.5 9.5 1.5 10.5
tPHL
Propagation Delay
An to On
3.3 1.5 8.0 12.5 1.5 14.0 ns 36
5.0 1.5 6.0 9.0 1.5 10.5
tPLH
Propagation Delay
E1 or E2 to On
3.3 1.5 11.0 15.0 1.5 16.0 ns 36
5.0 1.5 8.0 11.0 1.5 12.0
tPHL
Propagation Delay
E1 or E2 to On
3.3 1.5 9.5 13.5 1.5 15.0 ns 36
5.0 1.5 7.0 9.5 1.5 10.5
tPLH
Propagation Delay
E3 to On
3.3 1.5 11.0 15.5 1.5 16.5 ns 36
5.0 1.5 8.0 11.0 1.5 12.5
tPHL
Propagation Delay
E3 to On
3.3 1.5 8.5 13.0 1.5 14.0 ns 36
5.0 1.5 6.0 8.0 1.0 9.5
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74ACT 74ACT
Unit Conditions
TA = +25°C
TA =
40°C to
+85°C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage
4.5 1.5 2.0 2.0 VVOUT = 0.1 V
5.5 1.5 2.0 2.0 or VCC 0.1 V
VIL Maximum Low Level
Input Voltage
4.5 1.5 0.8 0.8 VVOUT = 0.1 V
5.5 1.5 0.8 0.8 or VCC 0.1 V
VOH Minimum High Level
Output Voltage
4.5 4.49 4.4 4.4 VIOUT = 50 μA
5.5 5.49 5.4 5.4
*VIN = VIL or VIH
4.5 3.86 3.76 V IOH
24 mA
5.5 4.86 4.76 24 mA
VOL Maximum Low Level
Output Voltage
4.5 0.001 0.1 0.1 VIOUT = 50 μA
5.5 0.001 0.1 0.1
*VIN = VIL or VIH
4.5 0.36 0.44 V IOL
24 mA
5.5 0.36 0.44 24 mA
IIN Maximum Input
Leakage Current 5.5 ±0.1 ±1.0 μA VI = VCC, GND
ΔICCT Additional Max. ICC/Input 5.5 0.6 1.5 mA VI = VCC 2.1 V
IOLD †Minimum Dynamic
Output Current
5.5 75 mA VOLD = 1.65 V Max
IOHD 5.5 75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current 5.5 8.0 80 μA VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
Maximum test duration 2.0 ms, one output loaded at a time.
MC74AC138, MC74ACT138
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6
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol Parameter VCC*
(V)
74ACT 74ACT
Unit Fig.
No.
TA = +25°C
CL = 50 pF
TA = 40°C
to +85°C
CL = 50 pF
Min Typ Max Min Max
tPLH Propagation Delay
An to On
5.0 1.5 7.0 10.5 1.5 11.5 ns 36
tPHL Propagation Delay
An to On
5.0 1.5 6.5 10.5 1.5 11.5 ns 36
tPLH Propagation Delay
E1 or E2 to On
5.0 2.5 8.0 11.5 2.0 12.5 ns 36
tPHL Propagation Delay
E1 or E2 to On
5.0 2.0 7.5 11.5 2.0 12.5 ns 36
tPLH Propagation Delay
E3 to On
5.0 2.5 8.0 12.0 2.0 13.0 ns 36
tPHL Propagation Delay
E3 to On
5.0 2.0 6.5 10.5 1.5 11.5 ns 36
*Voltage Range 5.0 V is 5.0 V ± 0.5 V
CAPACITANCE
Symbol Parameter Value
Typ Unit Test Conditions
CIN Input Capacitance 4.5 pF VCC = 5.0 V
CPD Power Dissipation Capacitance 60 pF VCC = 5.0 V
MARKING DIAGRAMS
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
AC138
AWLYWW
MC74AC138N
AWLYYWW AC
138
ALYW
ACT138
AWLYWW ACT
138
ALYW
MC74ACT138N
AWLYYWW
DIP16 SO16 TSSOP16 EIAJ16
74AC138
ALYW
74ACT138
ALYW
MC74AC138, MC74ACT138
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7
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
FC
S
H
GD
J
L
M
16 PL
SEATING
18
916
K
PLANE
T
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
PDIP16
N SUFFIX
16 PIN PLASTIC DIP PACKAGE
CASE 64808
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45_
G
8 PLP
B
A
M
0.25 (0.010) B S
T
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
SO16
D SUFFIX
16 PIN PLASTIC SOIC PACKAGE
CASE 751B05
ISSUE J
MC74AC138, MC74ACT138
http://onsemi.com
8
PACKAGE DIMENSIONS
TSSOP16
DT SUFFIX
16 PIN PLASTIC TSSOP PACKAGE
CASE948F01
ISSUE O
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
___ _
SECTION NN
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
L
2X L/2
U
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
T
V
W
0.25 (0.010)
16X REFK
N
N
EIAJ16
M SUFFIX
16 PIN PLASTIC EIAJ PACKAGE
CASE96601
ISSUE O
HE
A1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 0.78 −−− 0.031
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
MC74AC138, MC74ACT138
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9
Notes
MC74AC138, MC74ACT138
http://onsemi.com
10
Notes
MC74AC138, MC74ACT138
http://onsemi.com
11
Notes
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MC74AC138/D
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