LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 LMX5453 Micro-Module Integrated Bluetooth(R)2.0 Baseband Controller and Radio Check for Samples: LMX5453 FEATURES 1 The LMX5453 is a drop in replacement for the LMX5452. The LMX5453 has new features added: 2 * * * * * * * * * * * * * * * * * * * * * * eSCO eSCO over USB HCI transport Enhanced scatternet Interlaced scan Flushing Audio PCM slave mode support Generic PCM configuration Compliant with the Bluetooth 2.0 Core Specification Better than -80 dBm input sensitivity Class 2 operation Low power consumption: Accepts external clock or crystal input: - Clocking option 12/13 MHz with PLL bypass mode for power reduction - 10-20 MHz external clock or crystal network - Secondary 32.768 kHz oscillator for lowpower modes - Advanced power management features High integration: - Implemented in 0.18 m CMOS technology - RF includes on-chip antenna filter and switch On-chip firmware with complete HCI Embedded ROM (200K) and Patch RAM (16.6K) memory Up to 7 Asynchronous Connection Less (ACL) links Support for two simultaneous voice or Extended Synchronous Connection Oriented (eSCO) and Synchronous Connection Oriented (SCO) and links. Enhanced scatternet Interlaced scan Flushing Audio PCM slave mode support Generic PCM configuration * * * * Fractional-N Sigma/Delta modulator Operating voltage range 2.5-3.6V I/O voltage range 1.6-3.6V 60-pad micro-module BGA package (6.1 mm x 9.1 mm x 1.2 mm) APPLICATIONS * * * * * * Mobile Handsets USB Dongles Stereo Headsets Personal Digital Assistants Personal Computers Automotive Telematics DESCRIPTION The LMX5453 is a highly integrated Bluetooth 2.0 compliant solution. The integrated baseband controller and 2.4 GHz radio combine to form a complete, small form-factor (6.1 mm x 9.1 mm x 1.2 mm) Bluetooth node. The on-chip memory, ROM, and Patch RAM provide lowest cost and minimize design risk with the flexibility of firmware upgrades. The firmware supplied in the on-chip ROM supports a complete Bluetooth Link Manager and HCI with communication through a UART or USB interface. This firmware features point-to-point and point-tomultipoint link management, supporting data rates up to 723 kbps. The radio employs an integrated antenna filter and switch to minimize the number of external components. The radio has a heterodyne receiver architecture with a low intermediate frequency (IF), which enables the IF filters to be integrated on-chip. The transmitter uses direct IQ-modulation with Gaussian-filtered bitstream data, a voltage-controlled oscillator (VCO) buffer, and a power amplifier. The LMX5453 module is lead free and RoHS (Restriction of Hazardous Substances) compliant. For more information on those quality standards, please visit our green compliance website at ** http://www.national.com/quality/green/ 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Bluetooth is a registered trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2014, Texas Instruments Incorporated LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Functional Block Diagram Oscillator/ Crystal Clock Generator including PLL USB Link Manager HCI Transport UART USB_DUSB_D+ VCC_USB GND_USB TXD RXD RTS# CTS# JTAG Antenna Radio Baseboard Controller &RPSDFW5,6& Processor Access bus SPI Voltage Regulator ROM Combined System and Patch RAM CVSD Codecs Audio Port SCL SDA MDODI MWCS# MSK MDIDO SCLK SFS SFS1 STD SRD This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. INTERFACES * * * * * * * 2 Full-duplex UART supporting transfer rates up to 921.6 kbps including baud rate detection for HCI Full speed (12 Mbps) USB 2.0 for HCI ACCESS.bus and SPI/Microwire for interfacing with external non-volatile memory Advanced Audio Interface (AAI) for interfacing with external 8-kHz PCM codec Up to 3 GPIO port pins (OP4/PG4, PG6, PG7) controllable by HCI commands JTAG based serial on-chip debug interface Single Rx/Tx-pad radio interface Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 CONNECTION DIAGRAM 1 2 3 4 5 6 7 8 9 10 VCC_USB USB_D+ USB_D- RDY# TMS XOSCEN PG6 VDD_IF TE VDD_RF RTS# GND_USB RXD TCK TDI GND_RF TST1/DIV2# OP6/SCL/MSK CTS# TXD VCC_IO VCC_CORE MDODI PG7 VCC GND STD SCLK SFS SRD A B B_RESET_RA# RESET_BB# RESET_RA# C ENV1# TST2 TST3 TST4 GND_RF TDO OP4/PG4 GND_IF TST5 TST6 ANT VCC_IOP X2_CKO VDD_IOR X1_CKI VDD_X1 GND_VCO GND_RF OP5/SFS1 X2_CKI VCC_PLL X1_CKO VCO_OUT VCO_IN VDD_VCO D OP3/MWCS# OP7/SDA/MDIDO E F Figure 1. X-ray - Top View Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 3 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com SIGNAL DESCRIPTIONS Table 1. Signal Descriptions Pad Name Pad Location Type X1_CKO F7 O X1_CKI E7 I X2_CKI F5 I GND (if not used) X2_CKO E5 O NC (if not used) RESET_RA# B8 I Radio Reset Input (active low) B_RESET_RA# B6 O Buffered Radio Reset Output (active low) RESET_BB# B7 I ENV1 C6 TE A9 TST1/DIV2# B10 Default Layout Crystal or External Clock 10-20 MHz I I 32.768 kHz Crystal Oscillator ENV1: Environment Select used for manufacturing test only GND Test Enable - Used for manufacturing test only NC TST1: Test Mode. Leave not connected to permit use with VTune automatic tuning algorithm. DIV2#: No longer supported TST2 C7 I GND Test Mode, Connect to GND TST3 C8 I GND Test Mode, Connect to GND TST4 C9 I GND Test Mode, Connect to GND TST5 D8 I GND Test Mode, Connect to GND TST6 D9 VCO_OUT I Test Input, Connect to VCO_OUT through a zeroohm resistor to permit use with VTune automatic tuning algorithm USB_D- A3 I USB Data (negative) USB_D+ A2 I USB Data (positive) MDODI D1 I/O (1) OP6/SCL/MSK C1 OP7/SDA/MDIDO D4 OP3/MWCS# D3 SPI Master Data Out/Slave Data In OP6: I SCL/MSK: I/O OP7: I SDA/MDID O: I/O See Table 20 OP6: Pin checked during the start-up sequence for configuration option SCL: ACCESS.Bus Clock MSK: SPI Shift See Table 20 OP7: Pin checked during the start-up sequence for configuration option SDA: ACCESS.Bus Serial Data MDIDO: SPI Master Data In/Slave Data Out See Table 20 and Table 21 OP3: Pin checked during the start-up sequence for configuration option MWCS#: SPI Slave Select Input (active low) See Table 20 and Table 21 OP4: Pin checked during the start-up sequence for configuration option PG4: GPIO See Table 20 and Table 21 OP5: Pin checked during the start-up sequence for configuration option SFS1: Audio PCM Interface - Frame Synchronization for second codec I OP4/PG4 D6 OP5/SFS1 F4 OP4: I PG4: I/O I/O 4 32.768 kHz Crystal Oscillator Baseband Controller Reset (active low) NC I (1) Description Crystal 10-20 MHz SCLK F1 I/O Audio PCM Interface Clock SFS F2 I/O Audio PCM Interface Frame Synchronization SRD F3 I Audio PCM Interface Receive Data Input O Audio PCM Interface Transmit Data Output O Clock Request. Toggles with X2 (LP0) crystal enable/disable STD E3 XOSCEN A6 PG6 A7 PG7 D2 O O See NVS Table 21 GPIO - Default setup USB status indication See NVS Table 21 GPIO - Default setup TL (Transport Layer) traffic LED indication Must use 1k ohm pull up Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Table 1. Signal Descriptions (continued) (2) (3) Pad Name Pad Location Type Default Layout Description CTS# (2) C2 I GND (if not used) Host Serial Port Clear To Send (active low) NC (if not used) Host Serial Port Request To Send (active low) RXD B3 I RTS# (3) B1 O Host Serial Port Receive Data TXD C3 O RDY# A4 I NC JTAG Ready Output (active low) TCK B4 I NC JTAG Test Clock Input TDI B5 I NC JTAG Test Data Input TDO D5 O NC JTAG Test Data Output TMS A5 I NC JTAG Test Mode Select Input VCO_OUT F8 O Charge Pump Output, connect to loop filter VCO_IN F9 I VCO Tuning Input, feedback from loop filter Host Serial Port Transmit Data ANT D10 O RF Antenna, 50-ohm nominal impedance VCC_PLL F6 O 1.8V Core Logic Power Supply Output VCC_CORE C5 O 1.8V Voltage Regulator Output VDD_X1 E8 I Power Supply Crystal Oscillator VDD_VCO F10 I Power Supply VCO VDD_RF A10 I Power Supply RF VDD_IOR E6 I Power Supply I/O Radio/BB VDD_IF A8 I Power Supply IF VCC_USB A1 I Power Supply USB Transceiver VCC_IOP E4 I Power Supply Audio Interface VCC_IO C4 I Power Supply I/O VCC E1 I Voltage Regulator Input GND_VCO E9 Ground GND_USB B2 Ground GND_RF B9, C10, E10 Ground GND_IF D7 Ground GND E2 Ground Connect to GND if CTS is not used Treat as No Connect if RTS is not used. Pad required for mechanical stability Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 5 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Electrical Specifications Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. This device is ESD sensitive. Handling and assembly of this device should be performed at ESD-free workstations. All pads are rated 2 kV. This device operates between -40 and +85C. Absolute Maximum Ratings Parameter Min Max Units VCC Power Supply Voltage -0.2 4.0 V VI Voltage on any pad with GND = 0V -0.2 VCC + 0.2 V 0.2 3.3 V VDD_RF VDD_IF VDD_X1 Supply Voltage Radio VDD_VCO PINRF RF Input Power VANT Applied Voltage to ANT pad TS Storage Temperature Range TL Lead Temperature TLNOPB Lead Temperature NOPB ESDHBM ESD - Human Body Model ESDMM ESD - Machine Model ESDCDM ESD - Charged Device Model (1) (2) 0 (1) -65 dBm 1.95 V +150 C (solder 4 sec) 225 C (1) (2) 260 C 2000 V 200 V 1000 V (solder 40 sec) Reference IPC/JEDEC J-STD-020C spec. NOPB = No Pb (No Lead) Recommended Operating Conditions Parameter Min VCC Module Power Supply Voltage TR Module Power Supply Rise Time TA Ambient Opoerating Temperature Range Fully Functional Bluetooth Node VCC_IO Supply Voltage Digital I/O VCC_USB Supply Voltage USB VCC_PLL Internally connected to VCC_Core Typ 2.5 Max 2.75 -40 +25 Units 3.6 V 10 S +85 C 1.6 3.3 3.6 V 2.97 3.3 3.63 V Supply Voltage Radio 2.5 2.75 3.0 V VDD_IOR Supply Voltage Radio I/O 1.6 2.75 VDD_RF V VCC_IOP Supply Voltage PCM Interface 1.6 3.3 3.6 V VCC_CORE Supply Voltage Output VCC_CORE Supply Voltage Output Max Load VDD_RF VDD_IF VDD_X1 VDD_VCO 1.8 V 5 mA MAX VCC_CORES When used as supply input (VCC grounded) 1.6 1.8 2.0 V HORT 6 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Power Supply Requirements (1) (2) Parameter Min Typ Max Units IRXDM5 During Receive DM5 26 mA ITXDM5 During Transmit DM5 27 mA IRXDH5 During Receive DH5 26 mA ITXDH5 During Transmit DH5 27 mA IRXHV1 During Receive HV1 12 mA ITXHV1 During Transmit HV1 12 mA ICC-RX Receive Power Supply Current (Receive in Continuous Mode) 65 mA ICC-TX Transmit Power Supply Current (Transmit in Continuous Mode) 65 mA ICC-PWDN Power-down Current (Standby, XO off) IACTIVE ISNIFF (1) (2) 34 A Active Mode - Page/Inquiry Scan Enabled 6 mA Sniff Mode - Sniff Interval 1.28 sec. 5 mA Power supply requirements are based on Class 2 output power. VCC = 2.75V, TA = +25C DC Characteristics Parameter Condition VIH Logical 1 Input Voltage High (except oscillator I/O) 1.6V VCC_IO 3.0 3.0V VCC_IO 3.6 VIL Logical 1 Input Voltage Low (except oscillator I/O) IOH (1) IOL (1) (1) Min Max Units 0.7 x VCC_IO 2.0 VCC_IO + 0.2 VCC_IO + 0.2 V 1.6V VCC_IO 3.0 3.0V VCC_IO 3.6 -0.2 -0.2 0.25 x VCC_IO 0.8 V Logical 1 Output Current VOH = 2.4V, VCC_IO = 3.0V -10 mA Logical 0 Output Current VOL = 0.4V, VCC_IO = 3.0V 10 mA Maximum current is 50mA per VCC_IO/GND pair. USB Transceiver Parameter VCC_USB USB Power Supply Voltage VDI Differential Input Sensitivity VCM Differential Common Mode Range VSE Siungle Ended Received Threshold VOL Output Low Voltage VOH Output High Voltage IOZ TRI-STATE Data Line Leakage CTRN Transceiver Capacitance Condition Min 2.97 (D+) - (D-) Typ Max 3.63 V -0.2 +0.2 V 0.8 2.5 V 0.8 2.0 V 0.3 V RL = 1.5k, to 3.6V 3.3 Units 2.8 0V < VIN < 3.3V -10 V +10 A 20 pF Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 7 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com RF Characteristics Parameter RXsense Receive Sensitivity PinRF Intermodulation Performance , OOB (2), (3) (3) -76 BER < 0.001 dBm 2.441 GHz -80 -76 dBm 2.480 GHz -80 -76 dBm F1 = + 3 MHz, F2 = + 6 MHz, PinRF = -64 dBm -10 0 dBm -38 -36 dBm -72 -52 Input Impedance of RF Port Single input impedance Fin = 2.5 GHz (RF_inout) (3) Return Loss (1) (2) Units -80 RSSI Dynamic Range at LNA Input RSSI ZRFIN Max 2.402 GHz Min Maximum Input Level (2) (3) IMP Typ (1) Condition (3) 32 Return Loss Out of Band Blocking Performance dBm -8 dB PinRF = -10 dBm, 30 MHz < FCWI < 2 GHz, BER < 0.001 -10 dBm PinRF = -27 dBm, 2000 MHz < FCWI < 2399 MHz, BER < 0.001 -27 dBm PinRF = -27 dBm, 2498 MHz < FCWI < 3000 MHz, BER < 0.001 -27 dBm PinRF = -10 dBm, 3000 MHz < FCWI < 12.75 GHz, BER < 0.001 -10 dBm Typical operating conditions are at 2.75V operating voltage and 25C ambient temperature. The f0 = -64 dBm Bluetooth modulated signal, f1 = -39 dbm sine wave, f2 = -39 dBm Bluetooth modulated signal, f0 = 2f1 - f2, and |f2 - f1| = n x 1 MHz, where n is 3, 4, or 5. For the typical case, n = 3. Not tested in production. Transmitter Characteristics Parameter Condition POUT2 x fod (2) PA 2nd Harmonic Suppression Maximum gain setting: f0 = 2402 MHz, Pout = 4804 MHz ZRFOUT RF Output Impedance/Input Impedance of RF Port (RF_inout) Pout @ 2.5 GHz (1) (2) Min Typ (1) Max Units -30 dBm 47 Typical operating conditions are at 2.75V operating voltage and 25C ambient temperature. Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel. Synthesizer Characteristics Parameter fVCO Condition VCO Frequency Range tLOCK Lock Time f0offset (1) f0drift (1) Initial Carrier Frequency Tolerance Initial Carrier Frequency Drift (1) 8 Transmitter Delay Time Typ Max 2402 f0 20 kHz Units 2480 MHz 120 s -75 0 75 kHz DH1 data packet -25 0 25 kHz DH3 data packet -40 0 40 kHz DH5 data packet -40 0 40 kHz -20 0 20 kHz/50 s During preamble Drift Rate tD-Tx Min From Tx data to antenna 4 s Frequency accuracy is dependent on crystal oscillator chosen. The crystal must have a cumulative accuracy of <20 ppm to meet Bluetooth specifications. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Crystal Requirements The LMX5453 provides an on-chip driver that may be used with an external crystal and capacitors to form an oscillator. Figure 2 shows the recommended crystal circuit. Table 5 specifies the system clock requirements. The RF local oscillator and internal digital clocks for the LMX5453 are derived from the reference clock at the CLK+ input. This reference may come from either an external clock signal or the oscillator using the on-chip driver. When the on-chip driver is used, the board- and design dependent capacitance must be considered in tuning the crystal circuit. Equations that provide a close approximation of the crystal tuning capacitance are used as a starting point, but the optimal values will vary with the capacitive properties of the circuit board. As a result, fine tuning of the crystal circuit must be performed experimentally, by testing different values of load capacitance. Many different crystals can be used with the LMX5453. A key requirement from the Bluetooth specification is a cumulative accuracy of <20 ppm. Additionally, ESR (Equivalent Series Resistance) must be carefully considered. The LMX5453 can support a maximum ESR of 230, but it is recommended to stay <100 for best performance over voltage and temperature. See Figure 3 for ESR as part of the crystal circuit for more information. The ESR of the crystal also has an impact on the start-up time of the crystal oscillator circuit. See ** Section 15.0 and Table 18 for system start-up timing. Crystal The crystal appears inductive near its resonant frequency. It forms a resonant circuit with its load capacitors. The resonant frequency may be trimmed with the crystal load capacitance. Load Capacitance For resonance at the correct frequency, the crystal should be loaded with its specified load capacitance. Load capacitance is a parameter specified by the crystal vendor, typically expressed in pF. The crystal circuit shown in Figure 3 is composed of: * C1 (motional capacitance) * R1 (motional resistance) * L1 (motional inductance) * C0 (static or shunt capacitance) The LMX5453 provides some of the load with internal capacitors Cint and XOCTUNE. The remainder must come from the external capacitors labeled Ct1 and Ct2 shown in Figure 2. For best noise performance, Ct1 and Ct2 should have the same the value. The value of XOCTUNE can be programmed in register 2. There are 7 bits of tuning for XOCTUNE. The default value is 0028h, which results in an additional 2.6 pF internal capacitance. This register can be used in production testing for additional tuning, if necessary. See Table 19 for the range of XOCTUNE values. The crystal load capacitance (CL) is calculated as: CL Cint XOCTUNE Ct1/ /Ct2 (1) The CL above does not include the crystal internal self capacitance C0 as shown in Figure 3, so the total capacitance is: Ctotal CL C0 (2) Based on the crystal specification and equation: CL Cint XOCTUNE Ct1/ /Ct2 CL 8 pF 2.6 pF 6 pF (3) 16.6 pF (4) 16.6 pF is very close to the TEW crystal requirement of 16 pF load capacitance. With the internal shunt capacitance Ctotal: Ctotal 16.6 pF 5 pF 21.6 pF (5) Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 9 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com LMX5453 CLK+ C int CLK- XOC TUNE Ct2 Ct1 Crystal Figure 2. Recommended Crystal Circuit R1 C1 L1 C0 Figure 3. Crystal Equivalent Circuit Crystal Pullability Pullability is another important crystal parameter, which is the change in frequency of a crystal with units of ppm/pF, either from the natural resonant frequency to a load resonant frequency, or from one load resonant frequency to another. The frequency can be pulled in a parallel resonant circuit by changing the value of load capacitance. A decrease in load capacitance causes an increase in frequency, and an increase in load capacitance causes a decrease in frequency. Frequency Tuning Frequency tuning is performed by adjusting the crystal load capacitance with external capacitors. It is a Bluetooth requirement that the frequency is always within 20 ppm. The crystal/oscillator must have cumulative accuracy specifications of 15 ppm to provide margin for frequency drift with aging and temperature. TEW Crystal The LMX5453 has been tested with the TEW TAS-4025A crystal (see Table 3). Because the internal capacitance of the crystal circuit is 8 pF and the load capacitance is 16 pF, 12 pF is a good starting point for both Ct1 and Ct2. The 2480 MHz RF frequency offset is then tested. Figure 5 shows the RF frequency offset test results. Figure 5 shows the results are -20 kHz off the center frequency, which is -1 ppm. The pullability of the crystal is 2 ppm/pF, so the load capacitance must be decreased by about 1.0 pF. By changing Ct1 or Ct2 to 10 pF, the total load capacitance is decreased by 1.0 pF. Figure 6 shows the frequency offset test results. The frequency offset is now zero with Ct1 = 10 pF and Ct2 = 10 pF. See Table 3 for crystal tuning values used on the Phoenix Development Board with the TEW crystal. Table 2. TEW TAS-4025A 10 Specification Value Package 4.0 x 2.5 x 0.65 mm - 4 pads Frequency 13.000 MHz Mode Fundamental Stability <15ppm @ -40 to +85C CL Load Capacitance 16 pF ESR 80 max CO Shunt Capacitance 5 pF Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Table 2. TEW TAS-4025A (continued) Specification Value Drive Level 50 10uV Pullability 2 ppm/pF (minimum) Storage Temperature -40 to +85C Table 3. TEW on Phoenix Board Specification Value Ct1 10 pF Ct2 10 pF TCXO (Temperature Compensated Crystal Oscillator) The LMX5453 also can operate with an external TCXO (Temperature Compensated Crystal Oscillator). The TCXO signal is directly connected to the CLK+. 1. Input Impedance The LMX5453 CLK+ pin has in input impedance of 2pF capacitance in parallel with >400k resistance Optional 32 KHZ Oscillator A second oscillator is provided (see Figure 4) that is tuned to provide optimum performance and low-power consumption while operating with a 32.768 kHz crystal. An external crystal clock network is required between the 32kHz_CLKI clock input (pad B13) and the 32kHz_CLKO clock output (pad C13) signals. The oscillator is built in a Pierce configuration and uses two external capacitors. Figure 4 provides the oscillator's specifications. In case the 32Khz is placed optionally, it is recommended to remove C2 and replace C1 with a zero ohm resistor. 32kHz_CLKI 32.768 kHz 32kHz_CLKO C2 C1 GND Figure 4. 32.768 kHz Oscillator Table 4. 32.768 kHz Oscillator Specifications Symbol Parameter VDD Supply Voltage Condition IDDACT Supply Current (Active) f Nominal Output Frequency VPPOSC Oscillating Amplitude Min Typ 1.62 Max 1.8 Unit 1.98 V 2 A 32.768 kHz 1.8 Duty Cycle V 40 60 % Table 5. System Clock Requirements (1) Symbol Parameter CREF External Reference Clock Frequency (1) 10 13 20 MHz -20 15 20 ppm 20 MHz CTOL Frequency Tolerance (over full operating temperature and aging) XOCTUNE Digital Crystal Tuning Load Range COSC Crystal Oscillator Min Typ Max Unit 8 10 13 pF Frequencies supported: 10.00, 10.368, 12.00, 12.60, 12.80, 13.00, 13.824, 14.40, 15.36, 16.00, 16.20, 16.80, 19.20, 19.44, 19.68, and 19.80 MHz Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 11 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Table 5. System Clock Requirements (continued) Symbol Parameter CESR Crystal Serial Resistance CREF-PS External Reference Clock Power Swing (peak to peak) Cint Internal Load Capacitance CAGE Aging Min Typ 100 Max 200 Unit 230 400 mV 8 pF 1 ppm/year Figure 5. Frequency Offset with 12 pF//12 pF Capacitors Figure 6. Frequency Offset with 10 pF//10 pF Capacitors 12 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Table 6. Register 2: XOCTUNE Tuning Load Range Binary Value Hex Value Value Units 000 0000 00 0 pF 2.6 pF 8 pF 010 1000 111 1111 (1) 28 (1) 7F Default value for RF initialization register 2. Figure 7. ESR vs. Load Capacitance for the Crystal Antenna Matching and Front-End Filtering Figure 8 shows the recommended component layout to be used between RF output and antenna input. Allows for versatility in the design such that the match to the antenna maybe improved and/or the blocking margin increased by addition of a LC filter. Refer to antenna application note for further details. LC filter To Antenna PI Match Figure 8. Front End Layout Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 13 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Loop Filter Design Since the LMX5453 has an external loop filter that determines the performance of the device to a great extent, it is important that it is designed correctly. Texas Instruments will provide the starting component values but the end customer may have to make adjustments to optimize the performance. Please refer to Loop Filter application note and also Texas Instrument's Webench design tool for detailed information. Component Calculations The following parameters are required for component value calculation of a third order passive loop filter. symbol? Phase Margin: Phase of the open loop transfer function Fc Loop Bandwidth Fcomp Comparison Frequency: Phase detector frequency KVOC VCO gain: Sensitivity of the VCO to control volts K symbol? Charge Pump gain: Magnitude of the alternating current during lock FOUT Mean RF output frequency T31 Ratio of the poles T3 to T1 in a 3rd order filter symbol? Gamma optimization parameter The third order loop filter being defined has the topology shown in Figure 10. R3 CP VCO C1 R2 C3 C2 GND Figure 9. Third Order Loop Filter * J 1 1 tan1 tan (ZC T1) tan (ZC T1 T31) T1 T1 T31 Z (c) C I (6) Calculate the poles and zeros. Use exact method to solve for T1 using numerical methods. J T3 T31u T1 T2 ZC (T1 T3) KI K vco A0 ZC2 N (7) 1 ZC2 T22 (1 ZC2 T12 )(1 ZC2 T32 ) (8) Calculate the loop filter coefficients, A1 A0 (T1 T3) A2 A0 T1 T3 (9) A2 T2 A0 T2 A1 * * 1 1 2 A2 (c) T2 (c) (10) C1 Summary: Symbol T1 14 Description Units N counter value None Loop Bandwidth rad/s Loop filter pole S Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Symbol Description Units T2 Loop filter zero S T3 Loop filter zero S A0 Total capacitance nF A1 First order loop filter coefficient nFs A2 Second order loop filter coefficients nFs2 Components can then be calculated from loop filter coefficients C3 R2 LT 1 T22 C12 T2 A1 C1 A2 A0 C2 T22 C1 A2 A2 R3 C1 C3 T2 T2 C2 400 (1 log10 'F) FC A0 C1 C3 (11) (12) Frequency tolerance Frequency jump where 'F (13) Some typical values for the LMX5453 are: Symbol Description Units Comparison Frequency 13 MHz Phase Margin 48 PI rad Loop bandwidth 100 kHz T3 or T1 ratio 40 % Gamma 1.0 VCO gain 120 Charge pump gain 0.6 mA 2441 MHz Fout MHz per V Which give the following component values: Symbol Description Units C1 0.17 nF C2 2.38 nF C3 0.04 nF R2 1737 ohms R3 7025 ohms Phase Noise and Lock-Time Calculations Phase noise has three sources, the VCO, crystal oscillator and the rest of the PLL consisting of the phase detector, dividers, charge pump and loop filter. Assuming the VCO and crystal are very low noise, it is possible to put down approximate equations that govern the phase noise of the PLL. Phase noise (in-band) = PN1Hz + 20Log[N] + 10Log [Fcomp] Where PH1Hz is the PLL normalized noise floor in 1 Hz resolution bandwidth. Further out from the carrier, the phase noise will be affected by the loop filter roll-off and hence its bandwidth. As a rule-of-thumb; Phase noise = 40Log [ Fc] Where Fc is the relative change in loop BW expressed as a fraction. For example if the loop bandwidth is reduced from 100kHz to 50kHz or by one half, then the change in phase noise will be -12dB. Loop BW in reality should be selected to meet the lower limit of the modulation deviation, this will yield the best possible phase noise. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 15 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Even further out from the carrier, the phase noise will be mainly dominated by the VCO noise assuming the crystal is relatively clean. Lock-time is dependent on three factors, the loop bandwidth, the maximum frequency jump that the PLL must make and the final tolerance to which the frequency must settle. As a rule-of-thumb it is given by: 400 Frequency tolerance LT (1 log10 'F) where 'F FC Frequency jump (14) These equations are approximations of the ones used by Webench to calculate phase noise and lock-time. Practical Optimisation In an example where frequency drift and drift rate can be improved though loop filter tweaks, consider the results taken below. The drift rate is 26.1 kHz per 50us and the maximum drift is 25 kHz for DH1 packets, both of which are exceeding or touching the Bluetooth pass limits. These measurements are taken with component values shown above. Table 7. TRM/CA/09/C (Carrier Drift) Hopping On - Low Channel DH1 DH3 DH5 Drift Rate / 50us 26, 1 kHz N/A -30,5 kHz Max Drift 25 kHz N/A 36 kHz Average Drift -1 kHz N/A 12 kHz Packets Tested 10 N/A 10 Packets Failed 2 N/A 10 Overall Result Failed N/A Failed Results below were taken on the same board with three loop filter values changed. C2 and R2 have been increased in value and C1 has been reduced. The drift rate has improved by 13 kHz per 50 s and the maximum drift has improved by 10 kHz. Table 8. TRM/CA/09/C (Carrier Drift) Hopping On - Low Channel DH1 DH3 DH5 Drift Rate / 50us -13,6 kHz N/A 15,6 kHz Max Drift 15 kHz N/A 21 kHz Average Drift 3 kHz N/A 1 kHz Packets Tested 10 N/A 10 Packets Failed 0 N/A 0 Overall Result Passed N/A Passed The effect of changing these three components is to reduce the loop bandwidth which reduces the phase noise. The reduction in this noise level corresponds directly to the reduction of noise in the payload area where drift is measured. This noise reduction comes at the expense of locktime which can be increased to 120 s without suffering any ill effects, however if we continue to reduce the loop BW further the lock-time will increase such that the PLL does not have time to lock before data transmission and the drift will again increase. Before the locktime goes out of spec, the modulation index will start to fall since it is being cut by the reducing loop BW. Therefore a compromise has to be found between lock-time, phase noise and modulation, which yields best performance. Note// The values shown on the LMX5453 datasheet are the best case optimized values that have been shown to produce the best overall results and are recommended as a starting point for all designs. Another example of how the loop filter values can affect frequency drift rate, these results below show the DUT with maximum drift on mid and high channels failing. Adjusting the loop bandwidth as shown provides the improvement required to pass qualification. 16 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Table 9. Original results: Hopping OFF - Low Channel DH1 DH3 DH5 Drift Rate / 50us -15.00 kHz -28.10 kHz -19.10 kHz Maximum Drift -19 kHz -37 kHz -20 kHz DH1: +/- 25 kHz Average Drift -11 kHz -32 kHz -10 kHz DH3: +/- 40 kHz Packets Tested 10 10 10 DH5: +/- 40 kHz Packets Failed 0 1 0 Result Pass Fail Pass Limits +/- 20 kHz Hopping OFF - Med Channel DH1 DH3 DH5 Drift Rate / 50us -18.60 kHz 16.30 kHz -18.00 kHz Limits Maximum Drift -29 kHz -44 kHz -28 kHz DH1: +/- 25 kHz +/- 20 kHz Average Drift -19 kHz -37 kHz -19 kHz DH3: +/- 40 kHz Packets Tested 10 10 10 DH5: +/- 40 kHz Packets Failed 2 2 0 Result Fail Fail Pass Hopping OFF - High Channel DH1 DH3 DH5 Drift Rate / 50us -16.30 kHz 16.80 kHz -17.70 kHz Maximum Drift -36 kHz -61 kHz -38 kHz DH1: +/- 25 kHz Average Drift -31 kHz -48 kHz -29 kHz DH3: +/- 40 kHz Packets Tested 10 10 10 DH5: +/- 40 kHz Packets Failed 10 8 0 Result Fail Fail Pass Limits +/- 20 kHz Table 10. New Results: Hopping OFF - Low Channel DH1 DH3 DH5 Limits Drift Rate / 50us -12.00 kHz -15.10 kHz 18.80 kHz Maximum Drift -15 kHz -35 kHz -19 kHz DH1: +/- 25 kHz Average Drift -6 kHz -25 kHz -9 kHz DH3: +/- 40 kHz Packets Tested 10 10 10 DH5: +/- 40 kHz Packets Failed 0 0 0 Result Pass Pass Pass +/- 20 kHz Hopping OFF - Med Channel DH1 DH3 DH5 Drift Rate / 50us -14.20 kHz -16.10 kHz 17.20 kHz Limits Maximum Drift -16 kHz -34 kHz -22 kHz DH1: +/- 25 kHz +/- 20 kHz Average Drift -11 kHz -27 kHz -9 kHz DH3: +/- 40 kHz Packets Tested 10 10 10 DH5: +/- 40 kHz Packets Failed 0 0 0 Result Pass Pass Pass Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 17 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Hopping OFF - High Channel DH1 DH3 DH5 Drift Rate / 50us -12.70 kHz -17.40 kHz -16.50 kHz Maximum Drift -23 kHz -29 kHz -25 kHz DH1: +/- 25 kHz Average Drift -12 kHz -25 kHz -16 kHz DH3: +/- 40 kHz Packets Tested 10 10 10 DH5: +/- 40 kHz Packets Failed 0 0 0 Result Pass Pass Pass Limits +/- 20 kHz Reference Starting Values Recommended starting values for the LMX5453 as also stated in the reference design towards the end of this datasheet are a as shown in Table 11. These values have been optimized through testing to yield the best results from the design. However minor changes to the layout could mean the values need re-optimization. Table 11. Loop Filter Values Device C1 C2 C3 LMX5453 220 pF 2200 pF 39 pF R2 4.7k R3 10k Functional Blocks Baseband Processor And Link Management Processor Baseband and lower link control functions are implemented using a combination of a CompactRISC 16-bit processor and the Bluetooth Lower Link Controller (LLC). These processors operate from integrated ROM memory and RAM. They execute on-board firmware implementing all Bluetooth functions. Bluetooth Lower Link Controller The integrated Bluetooth Lower Link Controller complies with the Bluetooth Specification version 2.0 and implements the following functions: * Faster connection * Interlaced Scanning * Adaptive frequency hopping (AFH) * Enhanced Error detection * Support for 1-, 3-, and 5-slot packet types * 79 channel hop-frequency generation circuitry * Fast frequency hopping at 1600 hops per second * Power management control * Access code correlation and slot timing recovery Memory The LMX5453 provides 16K of combined system and Patch RAM memory that can be used for data and/or code upgrades of the ROM-based firmware. Due to the flexible startup used for the LMX5453, operating parameters like the Bluetooth Device Address (BD_ADDR) are defined during boot time. This allows reading the parameters from an external EEPROM or programming them directly over HCI. External Memory Interfaces Because the LMX5453 is a ROM-based device with no onchip non-volatile storage, the operation parameters will be lost after a power cycle or hardware reset. To avoid reinitializing operation parameters, patches, or user data, the LMX5453 offers two options for connecting with an external EEPROM: * Microwire/SPI * ACCESS.bus (I2C compatible) 18 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 The interface is selected during start-up, based on states sampled from the option pins. See Table 20 for the option pin descriptions. Microwire/SPI Interface If the configuration selected by the option pins uses a Microwire/SPI interface, the LMX5453 activates that interface and attempts to read the EEPROM. The external memory must be compatible with the features listed in Table 12. The largest size EEPROM supported is limited by the addressing format of the selected EEPROM. The device must have a page size equal to N x 32 bytes. The LMX5453 firmware requires that the EEPROM supports page write. The clock must be high when idle. Table 12. M95640-S EEPROM 8K x 8 (1) Parameter Value Supplier ST Microelectronics Supply Voltage (1) 1.8 - 3.6 V Interface SPI compatible (positive clock SPI modes) Memory Size 8K x 8 (64 Kbits) Clock Rate (1) 2 MHz Access Byte and page write (up to 32 bytes) Parameter range reduced to requirements of Texas Instruments' reference design. ACCESS.bus Interface If the configuration selected by the option pins uses an ACCESS.bus or I2C-compatible interface, the LMX5453 activates that interface and attempts to read the EEPROM. The external memory must be compatible with the features listed in Table 13. The largest size EEPROM supported is limited by the addressing format of the selected EEPROM. The device must have a page size equal to N x 32 bytes. The device uses a 16-bit address format. The device address must be 000. Table 13. 24C64 EEPROM 8K x 8 Parameter Supplier Atmel Supply Voltage (1) 2.7 - 5.5 V Interface 2-wire serial interface Memory Size Clock Rate 8K x 8 (64 Kbits) (1) Access (1) Value 100 kHz 32-byte page-write mode Parameter range reduced to requirements of Texas Instruments' reference design. Host Controller Interface Port UART Interface The LMX5453 provides one Universal Asynchronous Receiver Transmitter (UART). It supports 8-bit data with or without parity, and with one or two stop bits. The UART can operate at standard baud rates from 300 baud up to a maximum of 921.6 kbaud. DMA transfers are supported to allow for fast processor-independent receive and transmit operation. The UART implements flow-control signals (RTS# and CTS#) for hardware handshaking. The reference clock and UART baud rate are configured during start-up by sampling option pins OP3, OP4, and OP5. If the auto baud rate detect option is selected, the firmware checks an area in non-volatile storage (NVS) for a valid UART baud rate stored during a previous session. If no value was saved, the LMX5453 will switch to auto baud rate detection and wait for an incoming reference signal. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 19 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com The UART can detect a BREAK signal, which forces the LMX5453 to reset. This is useful when the only connection between the LMX5453 and the host system is the HCI port. The UART offers wake-up from low-power modes through its Multi-Input Wake-Up module (MIWU). When the LMX5453 is in a low-power mode, RTS# and CTS# can function as Host_WakeUp and Bluetooth_WakeUp, respectively. Table 14 represents the operational modes supported by the LMX5453 firmware for implementing the HCI transport port with the UART. Table 14. UART Operation Modes Modes Range Default at Power-Up With Auto Baud Detect Baud Rate 0.3 to 921.6 kbaud Configured by option pins, NVS parameter, or auto baud rate detection Flow Control RTS#/CTS# or None RTS#/CTS# RTS#/CTS# Parity Odd, Even, or None None None Stop Bits 1 or 2 1 1 Data Bits 8 8 8 0.3 to 921.6 kbaud USB Interface The LMX5453 USB node controller features enhanced DMA support with many automatic data handling features. It is certifiable to USB specification version 2.0. The USB interface is the standard 12 Mbit/s. An internal PLL provides the necessary 48 MHz clock. The USB node controller integrates the required USB transceiver, a Serial Interface Engine (SIE) and USB endpoint FIFOs. Seven endpoint pipelines are supported: one for the mandatory control endpoint and six to support interrupt, bulk, and isochronous endpoints. Each endpoint pipeline has a dedicated FIFO (8 bytes for the control endpoint, and 64 bytes for the other endpoints). Audio Port Advanced Audio Interface The Advanced Audio Interface (AAI) is an advanced version of the Synchronous Serial Interface (SSI) that provides a full-duplex communications port to a variety of industry-standard 13/14/15/16-bit linear or 8-bit log PCM codecs, DSPs, and other serial audio devices. The interface supports up to two codecs or interfaces. The firmware selects the desired audio path and interface configuration using a parameter in RAM (imported from nonvolatile storage or programmed during boot-up). The audio path options include 16-bit two's complement linear audio through the HCI transport, the Motorola MC145483 codec, and the OKI MSM7717 codec through the AAI, or No Audio. See NVS Table 21. If an external codec or DSP is used, the LMX5453 audio interface generates the necessary bit and frame clock for driving the interface. Table 15 summarizes the audio path selection and the configuration of the audio interface at the specific modes. The LMX5453 supports two simultaneous SCO links. Table 15. Audio Path configuration Audio setting Interface OKI MSM7717 Advanced audio interface Motorola MC145483 (2) (1) (2) 20 Advanced audio interface Freq ANY (1) Format AAI Bit Clock AAI Frame Clock AAI Frame Sync Pulse Length 8-bit log PCM (a-law only) 480 KHz 8 KHz 14 Bits 13-bit linear 480 KHz 8 KHz 13 Bits For supported frequencies see Table 5 Due to internal clock divider limitations the optimum of 512KHz, 8KHz can not be reached. The values are set to the best possible values. The clock mismatch does not result in any discernible loss in audio quality. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Table 15. Audio Path configuration (continued) Audio setting Interface OKI MSM7717 Advanced audio interface Freq 13MHz Format AAI Bit Clock AAI Frame Clock AAI Frame Sync Pulse Length 8-bit log PCM (a-law only) 520 KHz 8 KHz 14 Bits 13-bit linear 520 KHz 8 KHz 13 Bits Motorola MC145483 (3) Advanced audio interface Winbond W681310 Advanced audio interface 13MHz 8 bit log PCM A-law and u-law 520 KHz 8 KHz 14 Bits Winbond W681360 Advanced audio interface 13MHz 13-bit linear 520 KHz 8 KHz 13 Bits PCM slave (4) Advanced audio interface ANY (1) 8/16 bits 128 - 1024 KHz 8 KHz 8/16 Bits 16-Bit Two's Complement Linear -- -- -- Audio over HCI (3) (4) HCI Transport Due to internal clock divider limitations the optimum of 512KHz, 8KHz can not be reached. The values are set to the best possible values. The clock mismatch does not result in any discernible loss in audio quality. In PCM slave mode, parameters are stored in NVS. Bit clock and frame clock must be generated by the host interface. PCM slave configuration example: PCM slave uses the slot 0, 1 slot per frame, 16 bit linear mode, long frame sync, normal frame sync. In this case, 0x03E0 should be stored in NVS. See ** "LMX5453 Software User's Guide" for more details. Auxiliary Ports RESET# There are two reset inputs: RESET_RA# for the radio and RESET_BB# for the baseband. Both are active low. There is also a reset output, B_RESET_RA# (Buffered Radio Reset), which is also active low. This output follows input RESET_RA#. When RESET_RA# is released, going high, B_RESET_RA# stays low until the clock has started. See ** Section 15.0 for details and Section 16.0 for schematics. General Purpose I/O Ports The LMX5453 provides 3 GPIO ports which either can be used as indication and configuration pins or can be used for general-purpose functionality. The states which select these options are sampled during the start-up sequence. In a general-purpose configuration, the pins are controlled by hardware-specific HCI commands. These commands provide the ability to set the direction of the pin, drive the pin high or low, and enable a weak pull-up on the pin. In the alternate-function configuration, the pins have predefined indication functions. See Table 16 for a description of the alternate-function configuration. Table 16. Alternate GPIO Pin Configuration Pin Description OP4/PG4 Operation mode pin to configure transport layer settings during boot-up PG6 USB status indication PG7 TL (Transport Layer) traffic indication System Power-Up To power-up the LMX5453 the following sequence must be performed: 1. Apply VCC_IO and VCC to the LMX5453. 2. The RESET_RA# should be driven high. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 21 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com 3. Then RESET_BB# should be driven high at a recommended time of 1ms after the LMX5453 voltage rails are high. The LMX5453 is properly reset. (See Figure 10). all VCC and VDD lines tPTORRA RESET_RA# tPTORBB RESET_BB# X1_CKO LMX5453 Initialization LMX5453 Oscillator Start-Up LMX5453 in Normal Mode LMX5453 in Power-Up Mode Figure 10. LMX5453 Power-On Reset Timing Table 17. LMX5453 Power to Reset Timing Symbol Parameter Condition Min tPTORRA Power to Reset VCC and VCC_IO at operating voltage level to valid reset <500 (1) s tPTORBB Reset to Reset VCC and VCC_IO at operating voltage level to valid reset 1 (2) ms (1) (2) Typ Max Units Rise time on power must switch on fast, rise time <500 s Recommended value. Table 18. ESR vs. Start-Up Time (1) (2) ESR () Typical (1) (2) Units 10 12 ms 25 13 ms 40 16 ms 50 24 ms 80 30 ms Frequency, loading caps, and ESR all must be considered for determining the start-up time. For reference only, must be tested on each system to accurately determine the start-up time. Start-Up Sequence During start-up, the LMX5453 samples the option inputs OP3 to OP7 for configuration, external clock source, HCI transport layer, and available non-volatile storage EEPROM interface. The start-up options are described in Table 20. Options Register The states sampled from the OP inputs listed in Table 20 are latched in this register at the end of reset. The Options register can be read by the LMX5453 firmware at any time. All pads are inputs with weak on-chip pull-up/down resistors during reset. The resistors are disconnected at the end of RESET_BB#. 1 = Pull-up resistor connected in application 0 = Pull-down resistor connected in application 22 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 x = Don't care Start-Up With External EEPROM To read information from an external EEPROM, the OP inputs have to be strapped according to Table 20. The start-up sequence performs these operations: 1. From the Options register bits OP6 and OP7, the firmware checks whether a serial EEPROM is available to use (ACCESS.bus or Microwire/SPI). 2. If a serial EEPROM is available, the permanent parameter block, patch block, and non-volatile storage (NVS) are initialized from it. 3. From the Options register bits OP3, OP4, and OP5, the firmware checks for clocking information and transport layer settings. If the NVS information are not sufficient, the firmware will send the Await Initialization event on the TL and wait for additional information (see ** Section 15.1.3) 4. The firmware compensates the UART for new BBCLK information from the NVS. 5. The firmware starts up the Bluetooth core. Start-Up Without External EEPROM The following sequence will take place if OP6 and OP7 have selected No external memory, as described in Table 20. The start-up sequence performs these operations: 1. From the Options registers OP6 and OP7, the firmware checks if an EEPROM is available to use. 2. From the Options register OP3, OP4 and OP5, the firmware checks the clocking mode and transport layer settings. 3. The firmware sends the Await Initialization event on the transport layer and waits for NVS configuration commands. The configuration is finalized by sending the Enter Bluetooth Mode command. 4. The firmware compensates the UART for new BBCLK information from the NVS. 5. The firmware starts up the Bluetooth core. Table 19. Start-Up Sequence Options (1) Package Pad Description OP3 OP4 OP5 OP6 OP7 ENV1# PD PD PD PD PD PU PD = Internal pulldown during reset PU = Internal pull-up during reset x x x Open (0) Open (0) Open (1) BBCLK No serial memory x x x 1 Open (0) Open (1) BBCLK TBD x x x Open (0) 1 Open (1) BBCLK Microwire serial memory x x x 1 1 Open (1) BBCLK ACCESS.bus serial memory T_SCLK x x T_RFDATA T_RFCE 0 BBCLK/US BCLK Test mode (1) I/O pull-up/down resistor connected in application. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 23 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Table 20. Fixed Frequencies Osc Freq (MHz) BBLCK (MHz) PLL (48 MHz) OP3 OP4 OP5 12 12 Off 0 0 0 13 13 Off 1 0 0 10-20 10-20 (1) On 0 1 0 13 13 Off 1 1 0 12 12 On 0 0 1 13 13 On 1 0 1 10-20 10-20 (1) On 0 1 1 13 13 Off 1 1 1 (1) Description HCI UART transport layer with baud rate detection HCI UART transport layer 115.2 kbaud HCI USB transport layer HCI UART transport layer 921.6 kbaud See Table 5 for supported frequencies. Configuring the LMX5453 Through the Transport Layer As described in Section 15.0, the LMX5453 checks the Options register during start-up to determine whether an external EEPROM is available. If the EEPROM information is incomplete or no EEPROM is installed, the LMX5453 will boot into the initialization mode. The mode is confirmed by the Await Initialization event. The following information is needed to enter Bluetooth mode: * Bluetooth Device Address (BD_ADDR) * External clock source (only if 10-20 MHz has been selected) * UART baud rate (only needed if auto baud rate detection has been selected) 24 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Reset yes OP6/7 EEPROM available? no Read BD_Addr CLK, UART speed. Apply Patches OP3/4/5 Transport Layer and Clock? USB UART no Clock and baudrate properly defined by the NVS? no yes Clock and baudrate properly defined by the OP pins? Clock properly defined by OP pins or NVS? yes yes AutoBaudrate Detection no ERROR undefined clock Send HCI command to set temporary values for Clock and Baudrate no Send HCI command to set BD_Addr BD_Addr available in NVS? yes Send HCI command to Enter BT Mode Bluetooth Mode Figure 11. Flow Chart for the Start-Up Sequence In general, the following procedure will initialize the LMX5453: 1. Wait for the Await initialization event. The event will only appear if the transport layer speed is set or after successful baud rate detection. 2. Send Set Clock and Baudrate command for temporary clock frequency and UART configuration. 3. Send Write BD_Addr to configure local Bluetooth device address. 4. Send Enter Bluetooth Mode. The LMX5453 will use the configured clock frequency and UART baud rate to start the HCI transport layer interface. Note: These clock and baud rate settings are only valid until the next power-on or hardware reset. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 25 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Auto Baud Rate Detection The LMX5453 supports an auto baud rate detection in case the external clock is different from 12, 13 MHz or the range 10-20 MHz or the baud rate is different from 115.2 or 921.6 kbaud. The baud rate detection is based on the measurement of a single character. The following issues need to be considered: * The flow control pin CTS# must be low, otherwise the host is held in flow stop mode. * The auto baud rate detector measures the length of the 0x01 character from the positive edge of bit 0 to the positive edge of the stop bit. * Therefore, the very first received character must always be 0x01. * The host can restrict itself to send only a 0x01 character or it can send an HCI command. * If an HCI command is used for baud rate detection, the second received character must be 0x00. * The host must flush the TX buffer within 50-100 milliseconds, depending on the clock frequency of the host controller. * After 50-100 milliseconds, the UART is about to be initialized. Then, the host should receive an Await Initialization event or a Command Status event. CTS# RX 0x01 0x00 PVGHOD\ Figure 12. Auto Baud Rate Detection Using an External EEPROM for Nonvolatile Storage The LMX5453 offers two interfaces for connecting to external EEPROM used for non-volatile storage (NVS). The interface is selected by the states sampled from the option inputs during the start-up sequence. See Table 20 for the available options. The external memory is used to store mandatory parameters such as the Bluetooth device address (BD_ADDR) as well as many optional parameters such as link keys or user data. The firmware uses fixed addresses to reference the parameters, which allows the EEPROM to be preprogrammed with default parameters in manufacturing. See Table 21 for the organization of the NVS parameter map. If the EEPROM is empty, during the first start-up the LMX5453 will behave as though no memory is connected. (see ** Section 15.1.3). During the start-up sequence, parameters can be written directly to the EEPROM so that they can be used during subsequent sessions. Patches supplied over the transport layer will be stored automatically into the EEPROM. Table 21. Non Volatile Storage Map Address 00-05 (1) (1) 26 Name BD_ADDR 06 Audio Path Selection 07-0A Baudrate Description Bluetooth Device Address LAP(lsb), LAP, UAP, NAP, NAP (msb) 0x00: One motorola MC145483 codec 0x01: Two motorola MC145483 codecs 0x02: One OKI MSM7717 codec 0x03: Two OKI MSM7717 codecs 0x04: Generic PCM Slave. For this setting the generic slave configuration and the generic slave frame clock prescaler must also be set to correct values in the NVS. 0x05 0xFE: No audio path 0xFF: HCI used for SCO transfer Parameters located at these addresses are requested by the Bluetooth Core for proper operation. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Table 21. Non Volatile Storage Map (continued) Address Name 0B Frame settings (2) 0C-0D USB Vid 0E-0F USB PID 10 USB Self powered 11 USB max power 12-15 Frequency (3) Description Core parameters 16-BD (1) Link Keys Internal use, 24 bytes per key BE (1) Local Name Length Length of Local Device Name BF-1B6 (1) Local Device Name Friendly bluetooth name of the bluetooth device 1B7 (1) Link Key Type 1B8 (1) Unit Key Present 1B9-1C8 (1) Unit Key Debugging info 1C9-1D7 Assert Information Internal use only. 1D8-1E9 Runtime Information Internal use only. Reserved (2) (3) 1EA Options Bit 0: Reserved Bit 1: Low power operation 0: Disable low power operation 1: Enable low power operation Bit 2: Traffic LED Indication 0: Enable traffic LED indication on PG7 1: Disable traffic LED indication on PG7 Bit 3: USB status 0: Enable USB status on PG6 1: Disable USB status on PG6 Bit 4: TLKAS (Transport Layer Keep Alive during Scans) 0: Normal TL power off 1: Only power off TL if page/inquiry scans disabled Bit4 has no effect on USB TL. The USB TL will always use halt in order to comply with USB power constraints. This option does not affect the protocol for TL power management, only the internal operation of the firmware. TLKAS == 0 requires a stable clock when exiting from HALT mode.ormal TL power off Bit 5-7: Unused 1EB Vtune_Desired_Threshold Internal use only. 1EC Vtune_on Internal use only. 1ED Vtune_enable Internal use only. 1EE AclAndScoBufferMode 0: 8 339 byte ACL buffers, 2 SCO buffers 1: 8 ACL 339 bytes, 1 eSCO/SCO 2: 4 339 byte ACL, 2 eSCO/SCO 0xFF: specifies same set-up as 1. This parameter can only be used with a pre-programming external EEPROM. The frequency parameter is only needed when the firmware starts up in a mode with unknown crystal frequency (10- 20MHz). FSEL pins are used to determine if the crystal frequency is unknown. Reference Table 5 for supported frequencies. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 27 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Table 21. Non Volatile Storage Map (continued) Address Name Description 1F1-1F2 Generic PCM slave config This 16-bit value (LSB first) is used to store the PCM format configuration for the PCM generic slave. The Fcprs value must also be set in order to use the generic PCM slave. Attention: Some values are not mapped directly to the parameter values, because we want 0xFF to select the default behavior. Bit 0-1: Slot selection: 11: use slot 0 00: use slot 1 01: use slot 2 10: use slot 3 Bit 2-3: Number of slots per frame: 11: 1 slot 00: 2 slots 01: 3 slots 10: 4 slots Bit 4-6: PCM data format: 000: 8 bit A-law 001: 8 bit u-law 010: 13 bit linear 011: 14 bit linear 100: 15 bit linear 101: 16 bit linear 110: 16 bit linear 111: 16 bit linear Bit 7: Frame sync length: 0: short frame sync 1: long frame sync Bit 8: Data word length: 0: 8-bit data word length 1: 16-bit data word length Bit 9: Frame sync polarity: 0: use normal frame sync 1: use inverted frame sync Bit 10-15: Unused, set to 1 1F3 Generic PCM slave Fcprs Frame clock prescaler for generic PCM slave. The ratio between the bit clock and the frame clock must be written into this register for the generic PCM slave to operate correctly. BIT0-6: Fcprs This value is an unsigned integer indicating the prescaler. The following equation must be true: bit_clock/(Fcprs + 1) = frame_clock. Example: bit clock = 480000, frame sync rate = 8000, Fcprs must be set to 59 since 480000/(59 + 1) = 8000 BIT7: Unused, set to 1 Production Parameters 1F0 (4) XOCTUNE 1F4-1F7 RfReg4 1F8-1FB RfReg15 1FC-1FF Unused 200-2FF RF Development Reserved for RF development Internal use only. Patch Code Area 300-1CFF Patch code Space for Patch code, activated during startup 1D00-2000 User Data Available space if 8K EEPROM is used 1D00-4000 User Data Available space if 16K EEPROM is used 1D00-8000 User Data Available space if 32K EEPROM is used Application Data (4) 28 Reference Section 11.0 "Crystal Requirements" on page 12 for details on crystal tuning. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Low-Power Operation The LMX5453 provides low-power modes which cover the main usage scenarios in a Bluetooth environment. Each of the low-power modes is optimized for minimal power consumption in that particular scenario. The modular structure of the LMX5453 allows the firmware to power down unused modules or to switch to a lowspeed clock. Because the LMX5453 firmware supports these modes transparently, no power-control mechanisms need to be implemented by application code to use these modes. To reduce power consumption, the LMX5453 can disable the UART transport layer, which switches off the UART module and enables a wake-up mechanism triggered by the UART interface. Power Modes The LMX5453 has six operating power modes, which are selected by the activity level of the HCI transport layer and the Bluetooth baseband processor. Mode switching is triggered by a change in the baseband processor activity or by enabling/disabling the UART transport layer. The baseband processor activity depends on application requirements and is defined by standard Bluetooth operations such as inquiry/page scanning and link establishment. A remote device establishing or disconnecting a link may also indirectly change the baseband processor activity and therefore the power mode. The HCI transport layer is enabled on device power-up by default. To disable the transport layer, the vendorspecific HCI command HCI_DISABLE_TL is used. Therefore, only the host side of the HCI can disable the transport layer. Reenabling the transport layer is controlled by the hardware wake-up signalling. This can be performed from either the host or the LMX5453 side of the interface. See Section 15.5 for detailed information. Note: The HCI_Disable_TL command is only supported with the UART transport layer. The Main clock can disabled for PM0. The Main clock itself may be 12, 13, or 10-20 MHz. The PLL will always be enabled if the transport layer is USB or if the transport layer is UART but the Main clock is not 12 or 13 MHz. Also, in PM2, the Main and System clocks will be disabled by Host Controller when not needed by the Lower Link Controller. Table 22. LMX5453 Power Modes Power Mode UART Mode Baseband Activity Description PM0 Disabled Wake-Up Trigger Enabled None Standby mode. PM1 Enabled None Transport layer ready to receive commands, no baseband processor activity. PM2 Disabled Wake-Up Trigger Enabled Scanning LMX5453 discoverable/connectable for other devices. UART disabled. Wake-up trigger enabled to wake-up host on incoming connection. PM3 Enabled Scanning LMX5453 discoverable/connectable for other devices. UART enabled. PM4 Disabled Wake-Up Trigger Enabled Active Link LMX5453 handling at least one link. UART disabled. Wake-up trigger enabled to wakeup host on incoming data or connections. PM5 Enabled Active Link Standard active mode. LMX5453 handling at least one link. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 29 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com The LMX5453 switches between power modes in response to certain changes in activity. Because any of the parameters can be changed dynamically, there is no limitation on which mode can be reached from another. Figure 13 shows an overview of the power modes and the transitions between modes. Bluetooth Baseband Page/Inquiry Scanning Disabled Active Link(s) Disconnect Disconnect HCI Disabled PM0 PM2 PM4 Incoming Connection HCI Disable HCI Enable HCI Enable HCI Disable PM1 HCI Disable Disconnect Scan Disable HCI Enabled HCI Enable PM3 PM5 Scan Enable Connection Connection Figure 13. LMX5453 Power Modes Controlling the UART Hardware Wake-Up Function In certain usage scenarios, the host may switch off the transport layer of the LMX5453 to reduce power consumption. Then, both devices are able to shut down their UART interfaces. In this mode, the firmware will configure the UART interface to enable a hardware wake-up trigger. The hardware interface between the host and the UART interface on the LMX5453 is shown in Figure 14. Host LMX5453 RTS CTS TX RX RTS CTS TX RX Figure 14. UART Null Modem Connections Disabling the UART The host can disable the UART transport layer by sending the Disable Transport Layer command. In response, the LMX5453 will empty its buffers, send the confirmation event, and disable its UART interface. Then, the UART interface will be reconfigured to wake-up the LMX5453 when a rising edge occurs on the CTS# input. When the HCI transport layer is disabled, both the host and the LMX5453 will drive RTS=0, because they will be in a Not Ready to Receive mode. The hardware wake-up signal is then defined as a falling edge on the CTS input i.e. a device wakes up the other device by asserting its own Ready to Receive output (i.e. Setting RTS active). If the LMX5453 redefines the CTS input from flow-control input to wake-up input when the UART has shifted out the last byte of the HCI_COMMAND_COMPLETE (for HCI_DISABLE_TL) event and the host redefines its RTS output when it has received the last byte of the HCI_COMMAND_COMPLETE event there will be a short period of time during which the signalling is ambiguous. To avoid this, delays are introduced as illustrated in Figure 15. LMX5453 To Host Wake-Up and UART Enable Because the transport layer can be disabled in any situation, the LMX5453 must first verify that the transport layer is enabled before sending data to the host. Possible scenarios in which the LMX5453 must wake up the host include incoming data or incoming link indicators. If the UART is not enabled, the LMX5453 assumes that it must wake up the host by asserting RTS#. To respond to this assertion, the host must monitor its CTS# input. 30 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 When CTS# is asserted, the host must wake up its UART interface and confirm the UART status by sending the HCI_RTX_WAKEUP_COMPLETE event. This event should not be sent until the HCI transport layer is ready for transferring data. When the host receives the HCI_RTX_WAKEUP_COMPLETE debug event, both sides know that the HCI transport layer is enabled. Host Controller Host RTS+CTS used for flow-control RTS+CTS used for flow-control HCI_DISABLE_TL After last Tx byte: Set RTS Inactive RTS is now used for power-control E PLET COM AND_ _TL) M M CO BL E HCI_ DHC DISA (HCI_ After last Rx byte: L Set RTS Inactive RTS is now used for power-control CTS is now used for power-control CTS is now used for power-control From now setting RTS will wake-up the Host DH From now setting RTS will wake-up the Host Controler L is the time period in which the RTS/CTS signalling is ambiguous. To make the mechanism work, the following relations must be true: DHC is the time period the LMX5453 must delay redefining CTS to Wake-Up input. Lmax L Lmin DH is the time period the Host must wait before attempting to send a Wake-Up signal to the LMX5453 by setting RTS active. DHC Lmax DH DHC - Lmin Figure 15. Disabling the UART Transport Layer The LMX5453 should now send the pending HCI events that triggered the wake-up. See Figure 16 for the complete process. Host LMX5453 HCI_Disable TL HCI_Command_Complete HW Wakeup Set RTS Active HCI TL Disabled Air Activity Set RTS Active HW Wakeup Ack. HCI Wakeup Complete HCI TL Enabled Figure 16. LMX5453 Wake-Up to Host Host to LMX5453 Wake-Up and UART Enable If the host needs to send data or commands to the LMX5453 while the UART transport layer is disabled, it must first assume that the LMX5453 is sleeping and wake it up by asserting its RTS signal. When the LMX5453 detects the wake-up signal, it enables the UART and acknowledges the wake-up signal by asserting its RTS signal. Additionally, the wake up will be confirmed by a confirmation event. When the host has received this HCI_WAKEUP_COMPLETE event, the LMX5453 is ready to receive commands. The host may now send the pending HCI events that triggered the wakeup. See Figure 17 for the complete process. Note: Even though the LMX5453 sets RTS active (indicating Ready to Receive mode), the host must not send any HCI commands to the LMX5453 before receiving the HCI_WAKEUP_COMPLETE event. Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 31 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com Host LMX5453 HCI_Disable TL HCI_Command_Complete Host Activity Set RTS Active HCI TL Disabled HW Wakeup HCI Wakeup Complete Set RTS Active HCI TL Enabled Figure 17. Host Wake-Up to LMX5453 Applications Information USB Dongle Reference Schematic 32 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 LMX5453 www.ti.com SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 Soldering The LMX5453 bumps are composed of a solder alloy and reflow (melt and reform) during the Surface Mount Assembly (SMA) process. In order to ensure reflow of all solder bumps and maximum solder joint reliability while minimizing damage to the package, recommended reflow profiles should be used. Table 23, Table 24, and Figure 18 provide the soldering details required to properly solder the LMX5453 to standard PCBs. The illustration serves only as a guide and Texas Instruments is not liable if a selected profile does not work. Table 23. Soldering Details Parameter Value PCB Land Pad Diameter 13 mil PCB Solder Mask Opening 19 mil PCB Finish Defined by customer or manufacturing facility Stencil Aperture 17 mil Stencil Thickness 5 mil Solder Paste Used Defined by customer or manufacturing facility Flux Cleaning Process Defined by customer or manufacturing facility Table 24. Classification Reflow Profiles Profile Feature (1) (2) NOPB Assembly Average Ramp-Up Rate (TsMAX to Tp) (1) (2) Preheat: Temperature Min (TsMIN) Temperature Max (TsMAX) Time (tsMIN to tsMAX) 150C 200C 60-180 seconds Time maintained above: Temperature (TL) Time (tL) 217C 60-150 seconds Peak/Classification Temperature (Tp) 260 + 0C Time within 5C of actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 6C/second maximum Time 25C to Peak Temperature 8 minutes maximum Reflow Profiles See Figure 18 See ** IPC/JEDEC J-STD-020C, July 2004. All temperatures refer to the top side of the package, measured on the package body surface. Figure 18. Typical Reflow Profiles Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 33 LMX5453 SNOSAU2D - FEBRUARY 2006 - REVISED JANUARY 2014 www.ti.com REVISION HISTORY Changes from Revision C (June 2013) to Revision D * 34 Page Added data to Recommended Operating Conditions because data was missing from old National version ...................... 6 Submit Documentation Feedback Copyright (c) 2006-2014, Texas Instruments Incorporated Product Folder Links: LMX5453 PACKAGE OPTION ADDENDUM www.ti.com 6-Nov-2017 PACKAGING INFORMATION Orderable Device Status (1) LMX5453SM/NOPB NRND Package Type Package Pins Package Drawing Qty NFBGA NZB 60 320 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR Op Temp (C) Device Marking (4/5) -40 to 85 5453SM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples MECHANICAL DATA NZB0060A SLF60A (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2017, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LMX5453SM/NOPB LMX5453SMX/NOPB LMX5453SMX