SAA-CIC61508-OSRF5V - Infineon Technologies AG

Data Sheet

V1.2 2011-06

CIC61508

Functional Safety Companion Chip

Edition 2011-06

Published by

Infineon Technologies AG

81726 Munich, Germany

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Data Sheet

V1.2 2011-06

CIC61508

Functional Safety Companion Chip

CIC61508

Data Sheet V1.2, 2011-06

CIC61508 Data Sheet

Revision History: V1.2 2011-06

Previous Versions: V1.0, V1.1

Page Subjects (major changes since last revision)

20 Typical SPI timing parameters are replaced by limit values.

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CIC61508

Table of Contents

Data Sheet I-1 V1.2, 2011-06

1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Functional Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.5 Power Supply and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1.1 Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1.2 Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1.3 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.2 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.2.1 Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.2.2 Supply Threshold Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.2.3 Voltage Monitor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2.2.4 Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2.3 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.3.1 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.3.2 Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.3.3 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2.3.4 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3 Package and Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.2 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.3 Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table of Contents

Data Sheet 1 V1.2, 2011-06

CIC61508Functional Safety Companion Chip

1Overview

1.1 Features

The CIC61508 has the following features:

• Power supply monitor for over- and under-voltage

• Sequencer

• Task monitor

• Data comparison and verification functions

• SPI communication monitor

• Safety path control (enable/disable)

• Configurable Wake-Up Timer

• Wide range of voltage supply supported (3.3V or 5.0V +/-10%)

• TSSOP-38 package available

1.2 Ordering Information

For the available ordering codes for the CIC61508, please refer to your responsible sales

representative or your local distributor.

This document decribes th e device types shown in Table 1-1.

1.3 Functional Summary

The CIC61508 is a Companion Safety Monitor Chip to build up functional safety

applications; examples include airbag, Electrical Powered Steering (EPS) and damping

systems. The chip is responsible fo r monitoring the host microcontroller’s behavi our. It

can monitor the host microcontroller’s power supply and verify the host microcontroller’s

requests. It therefore serves as an independent diagnostic monitoring device to allow the

host microcontroller system to be SIL3 approved.

Table 1-1 CIC61508 Device Types

Device Type Power Supply Ambient Temperature Range

SAA-CIC61508-OSRF 5V 5.0 V -40 to 140 °C

SAA-CIC61508-OSRF 3V 3.3 V -40 to 140 °C

CIC61508

Overview

Data Sheet 2 V1.2, 2011-06

1.4 Pin Configuration

Figure 1-1 CIC61508 Pinout (PG-TSSOP-38)

Table 1-2 Pi n Defin iti on s an d Functions (PG-TSSOP-38 )

Number Type Reset

State1) Symbol Function

1 --V

DDP Voltage Supply

2 I Hi-Z SCLK SPI Clock

3 I Hi-Z MTSR SPI Input

4 O Hi-Z MRST SPI Output

5 - - NC Not connected

CIC61508

SCLK

MTSR

MRST

SSC

DDC

SSP

SYSDISC

SENA

SENB

SENC

DDP

SSP

DDP

RESET

SYSDISA

SYSDISB

SEND

SENREF

SENGND

SSP

CIC61508

Overview

Data Sheet 3 V1.2, 2011-06

6 - - NC Not connected

7 --V

SSC Supply Ground (Digital)

8 --V

DDC Core Supply Monitor

9 - - NC Not connected

10 - - NC Not connected

11--V

SSP Supply Ground

12 - - NC Not connected

13 O PU SYSDISC System Disable C

14 - - NC Not connected

15 I Hi-Z SENA Analog Input A

16 I Hi-Z SENB Analog Input B

17 I Hi-Z SENC Analog Input C

18--V

DDP Voltage Supply

19--V

SSP Supply Ground

20--V

SSP Supply Ground

21--V

SSP Supply Ground

22--V

SSP Supply Ground

23--V

SSP Supply Ground

24 - - SENGND Analog Ground

25 - - SENREF Analog Reference

26 I Hi-Z SEND Analog Input D

27 - - NC Not connected

28 - - NC Not connected

29 - - NC Not connected

30 I/O PD CS Chip Select / Wake-Up Output

31 - - NC Not connected

32 O Hi-Z SYSDISB System Disable B

33 O Hi-Z SYSDISA System Disable A

34 - - NC Not connected

35 - - NC Not connected

Table 1-2 Pi n Defin iti on s an d Functions (PG-TSSOP-38 )

Number Type Reset

State1) Symbol Function

CIC61508

Overview

Data Sheet 4 V1.2, 2011-06

36 - - NC Not connected

37 - - NC Not connected

38 I PU RESET Reset Input

1) Abbreviations: PU - Pull up; PD - Pull down; Hi-Z - High impedance.

Table 1-2 Pi n Defin iti on s an d Functions (PG-TSSOP-38 )

Number Type Reset

State1) Symbol Function

CIC61508

Overview

Data Sheet 5 V1.2, 2011-06

1.5 Power Supply and Reset

The power supply to the CIC61508 is regulated by the internal voltage regulator that

comes with detection circuitries to ensure that the supplied voltages are within the

specified operating range.

The CIC61508 microcontroller requ ires a power supply voltage level (VDDP) of 3.3 V or

5.0 V, which must be provided from the external power supply pin.

VDDP is used to power up the CIC61508. In order to power up the chip properly, the

external reset pin RESET must be asserted until the internal working voltage (VDDC)

reaches 90% of its intended voltage of 2.5 V. The delay of external reset can be realized

by an external capacitor at RESET pin. This capacitor value must be selected so that

VRESET reaches 0.4 V, but not before VDDC reaches 0.9* VDDC.

A typical application example is shown in Figure 1-2. VDDP capacitor value is 300 nF.

VDDC capacitor value is 220 nF. The capacitor connected to RESET pin is 100 nF.

Typically, the time taken for VDDC to reach 0.9*VDDC is less than 50 μs once VDDP reaches

2.3V. Hence, based on the condition that 10% to 90% VDDP (slew rate) is less than

500 μs, the RESET pin should be he l d l ow f or 500 μs typically. See Figure 1-3.

Figure 1-2 Reset Circuitry

VSSP VDDP VDDC VSSC

3.3 / 5V

RESET

Vin

e.g. 300nF 220nF

ty p.

100nF

CIC61508

30k

CIC61508

Overview

Data Sheet 6 V1.2, 2011-06

Figure 1-3 VDDP, VDDC and VRESET during Power-on Reset

An external hardware reset is triggered when the reset input pin RESET is asserted and

held low for at least 100 ns.

VDDC detector in the internal voltage regulator detects brownout when the core supply

voltage VDDC dips below the thresh old voltage VDDC_TH (2.1 V). The brownout will cause

the device to be reset.

Both the hardware reset and the brownout reset have the same effect as a power-on

reset, therefore the SYSDISx pins will be reset to their default states shown in Table 1-2.

VDDP

RESET with

capacitor

2.3V VDDC

< 0.4V

0.9*VDDC

2.5V

Voltage

Voltage Time

Time

t y p. < 50 us

CIC61508

Electrical Parameters

Data Sheet 7 V1.2, 2011-06

2 Electrical Parameters

Chapter 2 provides the characteristics of the electrical parameters which are

implementation-specific for the CIC61508.

2.1 General Parameters

The general parameters are described here to aid the users in interpreting the

parameters mainly in Section 2.2 and Section 2.3.

2.1.1 Parameter Interpretation

The parameters listed in this section represent partly the characteristics of the CIC61508

and partly its requirements on the system. To aid interpreting the parameters easily

when evaluating them for a design, they are indicated by the abbreviations in the

“Symbol” column:

•CC

These parameters indicate Chip Characteri stics, which ar e distinctive fe atures of the

CIC61508 and must be regarded for a system design.

•SR

These parameters indicate System Requirements, which must be provided by the

system in which the CIC61508 is designed in.

CIC61508

Electrical Parameters

Data Sheet 8 V1.2, 2011-06

2.1.2 Absolute Maximum Rating

Maximum ratings are the extreme limits to which the CIC61508 can be subjected to

without permanent damage.

Note: Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of th e device at these or any other co nditions above those indicated i n

the operati onal sections o f this specification is n ot implied . Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

During absolute maximum rating overload conditions (VIN >VDDP or VIN <VSS) the

voltage on VDDP pin with respect to ground (VSS) must not exceed the values

defined by the absolute maximu m ratings.

Table 1 Absolute Maximum Rating Parameters

Parameter Symbol Limit Values Unit Notes

min. max.

Ambient temperature TA-40 140 °C under bias

Storage temperature TST -65 150 °C

Junction temperature TJ-40 150 °C under bias

Voltage on power supply pin with

respect to VSS

VDDP -0.5 6 V

Voltage on any pin with respect

to VSS

VIN -0.5 VDDP +

0.5 or

max. 6

V whichever is

lower

CIC61508

Electrical Parameters

Data Sheet 9 V1.2, 2011-06

2.1.3 Operating Conditions

The following operating conditions must not be exceeded in order to ensure correct

operation of the CIC61508. All parameters mentioned in the following table refer to these

operating conditions, unless otherwise noted.

Table 2 Operating Condition Parameters

Parameter Symbol Limit Values Unit Notes/

Conditions

min. typ. max.

Digital power supply voltage VDDP 3.0 - 3.6 V 3.3V

Variant

Digital power supply voltage VDDP 4.5 - 5.5 5.0V

Variant

Digital ground voltage VSS 0V

Operating Clock Frequency1)

1) Some parts of the CIC6150 8 run at 80 MHz frequency. These frequencies are internal working fr equencies of

the CIC61508.

fCLK - 26.7 - MHz

Ambient temperature TA-40 - 140 °C

CIC61508

Electrical Parameters

Data Sheet 10 V1.2, 2011-06

2.2 DC Parameters

The electrical characteristi c s of the DC Parameters are detailed in this section.

2.2.1 Input/Output Characteristics

Table 3 provides the characteristics of the input/ou tput pins of the CIC61508.

Table 3 Input/Output Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions

min. max.

VDDP = 5 V Range

Output low voltage VOL CC – 1.0 V IOL =15mA

–0.4V

IOL =5mA

Output high voltage VOH CC VDDP -

1.0 –VIOH =-15mA

VDDP -

0.4 –VIOH =-5mA

Input low voltage on

port pins VILP SR – 0.3 ×

VDDP

V CMOS Mode

Input low voltage on

RESET pin VILR SR – 0.3 ×

VDDP

V CMOS Mode

Input high voltage on

port pins VIHP SR 0.7 ×

VDDP

– V CMOS Mode

Input high voltage on

RESET pin VIHR SR 0.7 ×

VDDP

– V CMOS Mode

Input Hysteresis on port

pins1) HYSP CC 0.08 ×

VDDP

– V CMOS Mode

Pull-up current IPU SR – -10 μAVIH,min

-150 – μAVIL,max

Pull-down current IPD SR – 10 μAVIL,max

150 – μAVIH,min

Input leakage current2)3) IOZ1 CC -0.5 0.5 μA0 < VIN < VDDP,

TA≤140°C

Overload current on any

pin IOV SR -5 5 mA

CIC61508

Electrical Parameters

Data Sheet 11 V1.2, 2011-06

Absolute sum of

overload currents Σ|IOV|SR– 25 mA3)

Voltage on any pin

during VDDP power off VPO SR – 0.3 V 4)

Maximum current per

pin (excluding VDDP and

VSS)

IM SR SR – 15 mA

Maximum current for all

pins (excluding VDDP

and VSS)

Σ|IM|SR– 60 mA

Maximum current into

VDDP

IMVDDP

SR – 80 mA

Maximum current out of

VSS

IMVSS

SR – 80 mA

VDDP = 3.3 V Range

Output low voltage VOL CC – 1.0 V IOL =8mA

–0.4V

IOL =2.5mA

Output high voltage VOH CC VDDP -

1.0 –VIOH =-8mA

VDDP -

0.4 –VIOH =-2.5mA

Input low voltage on

port pins VILP SR – 0.3 ×

VDDP

V CMOS Mode

Input low voltage on

RESET pin VILR SR – 0.3 ×

VDDP

V CMOS Mode

Input high voltage on

port pins VIHP SR 0.7 ×

VDDP

– V CMOS Mode

Input high voltage on

RESET pin VIHR SR 0.7 ×

VDDP

– V CMOS Mode

Input Hysteresis1) HYS CC 0.03 ×

VDDP

– V CMOS Mode

Pull-up current IPU SR – -5 μAVIH,min

-50 – μAVIL,max

Table 3 Input/Output Characteristics (Operating Conditions apply) (cont’d)

Parameter Symbol Limit Values Unit Test Conditions

min. max.

CIC61508

Electrical Parameters

Data Sheet 12 V1.2, 2011-06

Pull-down current IPD SR – 5 μAVIL,max

50 – μAVIH,min

Input leakage current2)3) IOZ1 CC -0.5 0.5 μA0 < VIN < VDDP,

TA≤140°C

Overload current on any

pin IOV SR -5 5 mA

Absolute sum of

overload currents Σ|IOV|SR– 25 mA3)

Voltage on any pin

during VDDP power off VPO SR – 0.3 V 4)

Maximum current per

pin (excluding VDDP and

VSS)

IM SR SR – 15 mA

Maximum current for all

pins (excluding VDDP

and VSS)

Σ|IM|SR– 60 mA

Maximum current into

VDDP

IMVDDP

SR – 80 mA

Maximum current out of

VSS

IMVSS

SR – 80 mA

1) Not subjected to production test , verified by design/cha racterization. Hystere sis is implemented to a void meta

stable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses

switching due to external system noise.

2) An additional error current (IINJ) will f l ow if an overload current fl ows through an adjacent pin. RES ET pin has

internal pull devices and is not included in the input leakage current characteristic.

3) Not subjected to production test, verified by design/characterization.

4) Not subjected to production test, verified by design/characterization. However , for applications with strict low

power-down current requirements, it is mandatory that no active voltage source is supplied at any pin when

VDDP is powered off.

Table 3 Input/Output Characteristics (Operating Conditions apply) (cont’d)

Parameter Symbol Limit Values Unit Test Conditions

min. max.

CIC61508

Electrical Parameters

Data Sheet 13 V1.2, 2011-06

2.2.2 Supply Threshold Characteristics

Table 4 provides the characteristics of the supply threshold in the CIC61508.

Note: VDDC is an internal working voltage used by some parts of the CIC61508 .

Figure 1 Supply Threshold Param eters

Table 4 Supply Threshold Parameters (Operating Conditions apply)

Parameters Symbol Limit Values Unit

min. typ. max.

VDDC prewarning voltage1)

1) Detection is disabled in powe r-down mode.

VDDCPW CC 2.2 2.3 2.4 V

VDDC brownout voltage in

active mode1) VDDCBO CC 2.0 2.1 2.2 V

VDDC brownout voltage in

power-down mode2)

2) Detection is enabled in both acti ve and power-down mode.

VDDCBOPD CC 1.3 1.5 1.7 V

VDDP prewarning voltage3)

3) Detection is enabled for external power supply of 5.0V.

Detection is disabled for external power supply of 3.3V.

VDDPPW CC 3.4 4.0 4.65 V

Power-on reset voltage2) VDDCPOR CC 1.3 1.5 1.7 V

VDDP

VDDC

DDPPW

DDCPOR

DDCPW

DDCBO

DDCBOPD

5.0V

2.5V

CIC61508

Electrical Parameters

Data Sheet 14 V1.2, 2011-06

2.2.3 Voltage Monitor Characteristics

All ground pins (VSS) must be externally connected to one single star point in the system.

The voltage difference between the ground pins must not exceed 200mV.

Table 1 Voltage Monitor Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions/

Remarks

min. typ . max.

Analog reference

voltage VAREF SR VAGND

+ 1 VDDP VDDP

+ 0.05 V

Analog reference

ground VAGND SR VSS -

0.05 VSS VAREF

- 1 V

Analog input

voltage range VAIN SR VAGND –VAREF V

Total unadjusted

error (for 10-bit

conversion

TUE CC – – 2 LSB 5V variant

– – 3 LSB 3.3V variant

Switched

capacitance at the

reference vol t ag e

input

CAREFSW CC – 10 20 pF 1)2)

1) Not subject to production test , ve rified by design/characterization.

2) This represents an equivalent switched capacitance. This capacitance is not switched to the reference volta ge

at once. Instead of this, smaller capacitances are successively switched to the reference voltage.

Switched

capacitance at the

analog voltage

inputs

CAINSW CC – 5 7 pF 1)3)

3) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before connecting the input to

the C-Network. Because of the parasitic elements, the voltage measured at ANx is lower than VAREF/2.

Input resistance of

the reference input RAREF CC – 1 2 kΩ1)

Input resistance of

the selected analog

channel

RAIN CC – 1 1.5 kΩ1)

CIC61508

Electrical Parameters

Data Sheet 15 V1.2, 2011-06

Figure 2 Voltage Monitor Inpu t Circuits

SENGND

EXT

A n alog Input Circuitry

AIN

EXT

SENx

AINSW

AIN, On

SENGND

Reference Voltage Input Circuitry

AREFSW

AREF, On

SENREF

AREF

CIC61508

Electrical Parameters

Data Sheet 16 V1.2, 2011-06

2.2.4 Power Supply Current

Table 2 provides the characteristics of the power supply current in the CIC61508.

Table 2 Power Supply Current Parameters (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Condition

typ.1)

1) The typical current values are based on preliminary measurements and are to be used as reference only.

These values are periodically measured at TA=+25°C and VDDP =5.0V.

max.2)

2) The maximum current values are measured under worst case condition s (TA= + 140 °C and VDDP =5.5V).

Active Mode IDDP 22.6 24.5 mA

Periodic Wake-up (low current)

Mode3)

3) The periodic wake-up or low current mode is entered once the wake-up timer functionality is enabled.

IPWU 4.1 - mA 4)

4) Not subjected to production test, verified by design/characterization.

CIC61508

Electrical Parameters

Data Sheet 17 V1.2, 2011-06

2.3 AC Parameters

The electrical characteristics of the AC Parameters are detailed in this section.

2.3.1 Testing Waveforms

The testing waveforms for rise/fall time, output delay and output high impedance are

shown in Figure 3, Figure 4 and Figure 5.

Figure 3 Rise/Fall Time Parameters

Figure 4 Testing Waveform, Output Delay

Figure 5 Testing Waveform, Output High Impedance

10%

90%

10%

90%

DDP

DDE

/ 2 Test Points V

DDE

/ 2

DDP

Load

+ 0.1 V V

- 0.1 V

Timing

Reference

Points

Load

- 0.1 V V

- 0.1 V

CIC61508

Electrical Parameters

Data Sheet 18 V1.2, 2011-06

2.3.2 Output Rise/Fall Times

Table 1 provides the characteristics of the output rise/fall times in the CIC61508.

Figure 6 Rise/Fall Times Parameters

Table 1 Output Rise/Fall Times Parameters (Operating Conditions apply)

Parameter Symbol Limit

Values Unit Test Conditions

min. max.

VDDP = 5V Range

Rise/fall times1) 2)

1) Rise/Fall time measurements are taken with 10% - 90% of pad supply.

2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.

tR, tF– 10 ns 20 pF.3)

3) Additional rise/fall time valid for CL= 20pF - 100pF @ 0.125 ns/pF.

VDDP = 3.3V Range

Rise/fall times 1) 2) tR, tF– 10 ns 20 pF.4)

4) Additional rise/fall time valid for CL= 20pF - 100pF @ 0.225 ns/pF.

10%

90%

10%

90%

DDP

CIC61508

Electrical Parameters

Data Sheet 19 V1.2, 2011-06

2.3.3 Reset Timing

Table 3 provides the characteristics of the reset timing in the CIC61508.

Table 2 Reset Timing (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions

min. typ. max.

Start-up time from an

immediate wake-up

timer reset1)

1) The start-up time is measured from the time the immediate wake-up timer reset is triggered to the time the

start-up BIST is completed. The immediate wake-up timer reset is triggered by a SFR write command to the

WAKERELOAD SFR while WAKEPRESCALAR SFR is configured with the value 8XH.

tSWU CC – 55.8 – ms 2)

2) Not subjected to production test, verified by design/characterization.

CIC61508

Electrical Parameters

Data Sheet 20 V1.2, 2011-06

2.3.4 SPI Timing

Table 3 provides the characteristics of the SPI timing in the CIC61508.

Note: These parameters are not subject to production test but verified by design and/or

characterization.

Figure 4 SPI Timing

Table 3 SPI Timing (Operating Conditions apply; CL = 50 pF)

Parameter Symbol Limit Values Unit

min. max.

SCLK clock period t0SR 500 2000 ns

Data valid t1CC0–ns

Data setup time t2SR 22 – ns

Data hold time t3SR0–ns

Clock active after CS becomes valid t4SR 2.0 3.5 μs

Clock inactive before CS becomes invalid t5SR 0 2.8 μs

Time betwee n active CS1)

1) The typical value is based on 8 consecutive 16-bit dat a transfers per heartbeat, at a baud rate of 2 Mbaud.

t6SR 60.7 65 μs

SCK

MRST

MTSR LSB

LSB MSB

MSB

CIC61508

Package and Quality Declaration

Data Sheet 21 V1.2, 2011-06

3 Package and Quality Declaration

Chapter 3 provides the information of the CIC61508 package and reliability section.

3.1 Package Parameters

Table 3 provides the thermal characteristics of the package used in CIC61508 .

Table 3 Thermal Characteristics of the Package

Parameter Symbol Limit Val ues Unit Notes

Min. Max.

PG-TSSOP-38

Thermal resistance junction

case1)

1) The thermal resist ances be tween t he case a nd the a mbient (RTCA) , the lead and the ambi ent (RTLA) are to be

combined with the thermal resistances between the junction and the case (RTJC), the ju nction and the lead

(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient

(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)

depend on the external system (PCB, case) characteristics, and are under user responsibility.

The junction temperature can be calculated using the following equation: TJ=TA+RTJA ×PD, where the RTJA is

the total thermal re sistance between th e junction and the ambient, while PD is given by the multiplication of the

max. VDDP and max. IDDP. The total junction ambient resistance RTJA can be obtained from the upper four

partial thermal resistances, by

a) simply adding only the two thermal resistances (junction lead and lead ambient), or

b) by taking all four resistances into account, depending on the precision needed.

RTJC CC - 15.7 K/W -

Thermal resistance junction

lead1) RTJL CC - 39.2 K/W -

CIC61508

Package and Quality Declaration

Data Sheet 22 V1.2, 2011-06

3.2 Package Outline

Figure 7 show the package outline of the CIC61508.

Figure 7 PG-TSSOP-38 Package Outline

CIC61508

Package and Quality Declaration

Data Sheet 23 V1.2, 2011-06

3.3 Quality Declaration

Table 4 shows the characteristics of the quality parameters in the CIC61508.

Table 4 Quality Parameters1)

1) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.

Parameter Symbol Limit Values Unit Notes

Min. Typ. Max.

Operation Lifetime

when the device is used

at the four stated TA 2)

2) This lifetime refers only to the time when the device is powered-on.

tOP - - 1500 hours TA = 140°C

- - 2000 hours TA = 125°C

- - 10000 hours TA = 85 °C

- - 1500 hours TA = -40°C

Operation Lifetime

when the device is used

at the two stated TA2)

tOP2 - - 18000 hours TA = 108°C

- - 130000 hours TA = 27°C

Weighted Average

Temperature3)

3) This parameter is derived based on the Arr henius model.

TWA - 106 - °C For 15000 hours

ESD susceptibility

according to Human

Body Model (HBM) for

all pins (except VDDC)

VHBM - - 2000 V Conforming to

EIA/JESD22-

A114-B

ESD susceptibility

according to Human

Body Model (HBM) for

VDDC

VHBMC 600 Conforming to

EIA/JESD22-

A114-B

ESD susceptibility

according to Charged

Device Model (CDM)

pins

VCDM - - 750 V Conforming to

JESD22-C101-C

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