DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC2710TB DESCRIPTION UE D 5 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER The PC2710TB is a silicon monolithic integrated circuit designed as PA driver for 900 MHz band cellular telephone tuners. This IC is packaged in super minimold package which is smaller than conventional minimold. This IC is manufactured using NEC's 20 GHz fT NESAT TM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and IN prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES Supply voltage Circuit current Power gain Medium output power Upper limit operating frequency Port impedance High-density surface mounting : VCC = 4.5 to 5.5 V : ICC = 22 mA TYP. @VCC = 5.0 V : GP = 33 dB TYP. @ f = 500 MHz : PO(sat) = +13.5 dBm TYP. @ f = 500 MHz : fu = 1.0 GHz TYP. @ 3 dB bandwidth : input/output 50 : 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) NT * * * * * * * APPLICATION * PA driver for 900 MHz band cellular telephone SC O ORDERING INFORMATION Part Number PC2710TB-E3 Remark Package 6-pin super minimold Marking C1F Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. To order evaluation samples, please contact your nearby sales office. DI (Part number for sample order: PC2710TB-A) Document No. P13443EJ3V0DS00 (3rd edition) Date Published January 2001 N CP(K) Caution Electro-static sensitive devices The mark shows major revised points PC2710TB PIN CONNECTIONS 2 1 4 4 3 5 5 2 6 6 1 Pin No. Pin Name 1 INPUT 2 GND D C1F 3 (Bottom View) 3 GND 4 OUTPUT 5 GND UE (Top View) 6 VCC PRODUCT LINE-UP (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) PC2708TB PC2709T PC2709TB PC2710T PC2710TB PC2776T PC2776TB GP (dB) 2.9 +10.0 15 NF (dB) ICC (mA) 2 Marking 26 C1D 6-pin super minimold 6-pin minimold 2.3 +11.5 23 5.0 25 C1E 6-pin super minimold 6-pin minimold 1.0 2.7 +13.5 33 3.5 +8.5 23 6.0 22 6-pin minimold 25 C2L 6-pin super minimold The package size distinguishes between minimold and super minimold. Data Sheet P13443EJ3V0DS C1F 6-pin super minimold Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. DI Notice Package 6-pin minimold 6.5 SC O Remark PO(sat) (dBm) IN PC2708T fu (GHz) NT Part No. PC2710TB SYSTEM APPLICATION EXAMPLE EXAMPLE OF 900 MHz BAND DIGITAL CELLULER TELEPHONE RX PLL UE PLL SW 0 Driver TX I Q D DEMOD. I PA PC2710TB Q DI SC O NT IN 90 Data Sheet P13443EJ3V0DS 3 PC2710TB PIN EXPLANATION Pin Name Applied Voltage (V) Pin Voltage Function and Applications INPUT - 0.90 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 2 3 5 GND 0 - Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. UE 1 6 - Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. VCC 4.5 to 5.5 - Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. DI Note Pin voltage is measured at VCC = 5.0 V 4 6 4 IN Voltage as same as VCC through external inductor NT OUTPUT SC O 4 Internal Equivalent Circuit Note (V) D Pin No. Data Sheet P13443EJ3V0DS 1 3 2 5 PC2710TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit VCC TA = +25C, pin 4 and pin 6 5.8 V Total Circuit Current ICC TA = +25C 60 mA Power Dissipation PD Mounted on double-sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB TA = +85C Operating Ambient Temperature TA Storage Temperature Tstg Input Power Pin RECOMMENDED OPERATING RANGE Supply Voltage Symbol MIN. VCC 4.5 TYP. mW -40 to +85 C -55 to +150 C +10 dBm MAX. Unit Remark IN Parameter 270 UE TA = +25C D Supply Voltage 5.0 5.5 V The same voltage should be applied to pin 4 and pin 6. Parameter Circuit Current Power Gain Saturated Output Power Symbol Test Conditions Upper Limit Operating Frequency MIN. TYP. MAX. Unit ICC No signal 16 22 29 mA GP f = 500 MHz 30 33 36.5 dB +11.0 +13.5 - dBm - 3.5 5.0 dB 3 dB down below flat gain at f = 0.1 GHz 0.7 1.0 - GHz PO(sat) NF f = 500 MHz, Pin = -8 dBm f = 500 MHz SC O Noise Figure NT ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) fu ISL f = 500 MHz 34 39 - dB Input Return Loss RLin f = 500 MHz 3 6 - dB Output Return Loss RLout f = 500 MHz 9 12 - dB Gain Flatness GP f = 0.1 to 0.6 GHz - 0.8 - dB DI Isolation Data Sheet P13443EJ3V0DS 5 PC2710TB TEST CIRCUIT VCC C3 L 6 C1 C2 4 1 1 000 pF 1 000 pF 2, 3, 5 CHARACTERISTICS Value C1, C2 Bias Tee 1 000 pF C3 Capacitor 1 000 pF L Bias Tee 1 000 nH EXAMPLE OF ACTURAL APPLICATION COMPONENTS Type Value C1 to C3 Chip Capacitor 1 000 pF 100 MHz or higher L Chip Inductor 300 nH 10 MHz or higher 100 nH 100 MHz or higher 10 nH 1.0 GHz or higher NT Type IN COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL 50 OUT UE 50 IN D 1 000 pF Operating Frequency INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output SC O transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. DI The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). 6 Data Sheet P13443EJ3V0DS PC2710TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD D AMP-2 OUT C 1F 1 2 IN UE 3 Top View C 6 L 5 4 C Mounting Direction VCC Value C 1 000 pF L 300 nH Notes NT COMPONENT LIST IN C 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern : Through holes 4. For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF DI SC O 6-PIN SUPER MINIMOLD SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P13252E). Data Sheet P13443EJ3V0DS 7 PC2710TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 40 40 No signal 35 30 25 20 15 10 30 25 20 15 10 5 5 0 No signal VCC = 5.0 V UE Circuit Current ICC (mA) Circuit Current ICC (mA) 35 D CIRCUIT CURRENT vs. SUPPLY VOLTAGE 1 2 3 4 5 0 -60 -40 6 -20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (C) IN Supply Voltage VCC (V) NOISE FIGURE, POWER GAIN vs. FREQUENCY POWER GAIN vs. FREQUENCY 35 35 VCC = 5.5 V VCC = 5.0 V NF VCC = 4.5 V 3.5 3 VCC = 5.5 V GP VCC = 4.5 V 0.3 1.0 1.0 0.3 Frequency f (GHz) ISOLATION vs. FREQUENCY INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 Input Return Loss RLin (dB) Output Return Loss RLout (dB) -10 -20 DI -30 -40 0.3 1.0 2.0 2.0 VCC = 5.0 V -10 -20 RLin RLout -30 -40 -50 0.1 Frequency f (GHz) 8 TA = +85C Frequency f (GHz) VCC = 5.0 V Isolation ISL (dB) 30 25 0.1 2.0 0 -50 0.1 TA = -40C TA = +25C VCC = 5.0 V SC O 25 0.1 Power Gain GP (dB) 4 30 NT 4.5 Power Gain GP (dB) Noise Figure NF (dB) VCC = 5.0 V Data Sheet P13443EJ3V0DS 0.3 1.0 Frequency f (GHz) 2.0 PC2710TB OUTPUT POWER vs. INPUT POWER VCC = 5.5 V f = 0.5 GHz +15 +10 VCC = 5.0 V +5 VCC = 4.5 V 0 -5 -10 -15 -40 -35 -30 -25 -20 -15 -10 -5 0 TA = -40C 0 -5 -10 IN +5 VCC = 4.5 V -10 +15 f = 0.5 GHz +10 +5 -5 0 -15 -40 -35 -30 -25 -20 -15 -10 -5 +5 +10 SATURATED OUTPUT POWER vs. FREQUENCY +18 Pin = -8 dBm VCC = 5.5 V +16 VCC = 5.0 V +14 +12 +10 VCC = 4.5 V DI +8 +6 0.1 0.2 0.5 Frequency f (GHz) 1.0 2.0 3rd Order Intermodulation Distortion IM3 (dBc) SC O Input Power Pin (dBm) Saturated Output Power PO (sat) (dBm) f = 1.0 GHz 0 -10 -15 -40 -35 -30 -25 -20 -15 -10 -5 +20 +5 +10 VCC = 5.0 V Output Power Pout (dBm) VCC = 5.5 V -5 0 OUTPUT POWER vs. INPUT POWER NT Output Power Pout (dBm) TA = +25C +5 +20 VCC = 5.0 V f = 1.0 GHz +15 0 +10 Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER +10 TA = +85C -15 -40 -35 -30 -25 -20 -15 -10 -5 +5 +10 Input Power Pin (dBm) +20 VCC = 5.0 V f = 0.5 GHz UE +15 Output Power Pout (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER +20 D +20 0 +5 +10 Input Power Pin (dBm) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE -60 f1 = 0.500 GHz f2 = 0.502 GHz -50 VCC = 5.0 V -40 VCC = 5.5 V -30 -20 VCC = 4.5 V -10 -10 -8 -6 -4 -2 0 +2 +4 +6 +8 +10 Output Power of Each Tone PO (each) (dBm) Data Sheet P13443EJ3V0DS 9 PC2710TB S-PARAMETERS (TA = +25C, VCC = Vout = 5.0 V) UE D S11-FREQUENCY 0.1 GHz 3.0 GHz 2.0 GHz IN 1.0 GHz NT S22- FREQUENCY SC O 3.0 GHz 0.1 GHz 2.0 GHz DI 1.0 GHz 10 Data Sheet P13443EJ3V0DS PC2710TB TYPICAL S-PARAMETER VALUES (TA = +25C) VCC = Vout = 5.0 V, ICC = 22 mA ANG. MAG. S21 ANG. MAG. S12 ANG. 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 0.306 0.324 0.356 0.400 0.439 0.469 0.481 0.488 0.479 0.465 0.448 0.417 0.387 0.350 0.316 0.292 0.256 0.245 0.215 0.201 0.177 0.161 0.145 0.124 0.113 0.107 0.091 0.081 0.067 0.055 0.039 2.5 5.2 5.3 2.5 -3.3 -10.2 -17.9 -26.7 -34.5 -41.2 -49.3 -54.9 -61.2 -65.2 -70.8 -74.0 -76.9 -80.5 -82.9 -85.6 -84.4 -88.8 -88.7 -90.3 -89.8 -91.9 -92.2 -94.9 -97.4 -103.8 -95.6 43.072 43.517 44.432 45.513 45.679 45.670 44.793 43.016 40.519 37.946 35.122 32.108 29.221 26.656 23.895 21.576 19.567 17.743 16.040 14.717 13.475 12.327 11.154 10.262 9.490 8.793 8.149 7.652 7.134 6.726 6.295 -8.4 -17.1 -26.5 -36.9 -48.1 -59.7 -71.8 -84.3 -96.0 -107.3 -117.9 -128.0 -137.0 -145.8 -153.9 -161.6 -168.1 -174.4 179.6 173.5 168.8 163.1 158.7 154.4 150.4 146.4 142.4 138.9 135.1 131.5 128.4 0.012 0.010 0.010 0.012 0.012 0.013 0.014 0.014 0.013 0.016 0.016 0.015 0.015 0.015 0.013 0.016 0.015 0.018 0.017 0.021 0.020 0.021 0.022 0.023 0.025 0.028 0.030 0.031 0.031 0.039 0.039 15.2 10.7 20.2 26.9 27.0 31.3 34.9 27.9 26.6 30.8 26.6 39.5 39.7 50.2 50.8 56.6 69.0 61.7 70.0 71.2 83.0 76.7 87.9 81.4 91.9 88.7 93.4 92.1 93.0 88.3 89.6 S22 MAG. K ANG. 0.156 0.164 0.185 0.225 0.255 0.283 0.301 0.312 0.316 0.311 0.307 0.282 0.270 0.248 0.236 0.215 0.200 0.196 0.180 0.175 0.166 0.171 0.159 0.164 0.158 0.166 0.175 0.183 0.191 0.200 0.203 2.7 2.1 0.3 -5.5 -15.4 -27.6 -40.2 -54.9 -67.7 -79.5 -92.2 -104.6 -115.5 -127.0 -136.2 -145.3 -155.2 -162.5 -173.4 -178.1 172.0 167.7 159.1 154.0 147.0 141.8 135.7 131.6 123.4 118.9 111.5 IN 1.08 1.17 1.10 0.92 0.85 0.77 0.74 0.74 0.78 0.79 0.85 0.99 1.12 1.27 1.56 1.49 1.71 1.59 1.88 1.71 1.94 1.99 2.08 2.15 2.19 2.06 2.13 2.13 2.26 1.97 2.08 DI SC O NT S11 D MAG. UE FREQUENCY MHz Data Sheet P13443EJ3V0DS 11 PC2710TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 UE D 0.2+0.1 -0.05 0.65 0.65 1.3 2.00.2 1.250.1 12 Data Sheet P13443EJ3V0DS 0.15+0.1 -0.05 IN DI SC O NT 0 to 0.1 0.7 0.90.1 0.1 MIN. PC2710TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. accordance with desired frequency. RECOMMENDED SOLDERING CONDITIONS UE (5) The DC cut capacitor must be attached to input pin and output pin. D (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in This product should be soldered under the following recommended conditions. Soldering Method Soldering Conditions Recommended Condition Symbol Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Count: 3, Exposure limit: NoneNote VPS Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Count: 3, Exposure limit: NoneNote VP15-00-3 Wave Soldering Soldering bath temperature: 260C or below Time: 10 seconds or less Count: 1, Exposure limit: NoneNote WS60-00-1 Partial Heating Pin temperature: 300C or below Time: 3 seconds or less (per side of device) Exposure limit: NoneNote - NT IN Infrared Reflow IR35-00-3 SC O Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document DI SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 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