All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
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Wire and Film Technologies Division
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Physical Data
Dimensions (Inches and (mm))
IRC
Type
L (Resistance
Dependant)
H (Resistance
Dependant)
OARS-XP 0.425 - 0.470
(10.7 - 12.0)
0.090 - 0.180
(2.28 - 4.57)
0.093 ± 0.010
(2.36 ± 0.25)
0.190 ± 0.030
(4.83 ± 0.76)
0.250 ± 0.015
(6.35 ± 0.38)
*
* 0.250+0.045/-0.015(6.35+1.14/-0.38) for R001
L
H
W
D
T
OARS XP
Open Air Sense Resistors
Metal Alloy Strip
25 60 95 130 165 195 225
6.0
5.0
4.0
3.0
2.0
0.0
Ambient Temperature (°C)
Power Rating (watts)
Power Derating Curve
Note:
The power derating curve is a guidance based on a conser-
vative design model. The OARS XP is a solid metal alloy
construction that can withstand signifi cantly greater operating
temperatures than conservative design models permit. The
resistive alloys can withstand temperatures in exess of 350°C.
Therefore, the system thermal design is a more signifi cant
design parameter due to the heat limitations of solder joints
and/or circuit board substrate materials. Refer to additional
information below.
The thermal image (not a simulation) to the left is of an OARS
XP 2.5 m running at 5 Watts. Notice the hotpsot is nearly
205°C, but the solder joint is approximately 115°C (FR4 is
rated for 130°C). The unique construction of the OARS XP
isolates the hotspot from the circuit board material preventing
damage. Additionally, the thermal energy is dissipated to the
air instead of being conducted into the circuit board potentially
causing a nearby power component to exceed its rating.
The standard test circuit board consists of a four layer FR4
material with 2 ounce outer layers and 1 ounce inner layers,
which is typical of many industry designs. Contact IRC for
more details or for other thermal image test data for specifi c
resistance values and power levels.
OARS XP R0025 Thermal Image @ 5 Watts
Ambient conditions, No forced air.
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