©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 09/11/18
Low Capacitance ESD Protection - SP3014 Series
SP3014-02UTG
Description
Applications
The SP3400 integrates 2 channels of low capacitance
steering diodes and an additional zener diode to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). The SP3400 can
safely absorb repetitive ESD strikes above the maximum
contact level specified in IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation.
The low off-state capacitance makes it ideal for protecting
high-speed signal lines such as USB2.0 or USB 3.0 and
1Gb Ethernet with an extremely low dynamic resistance to
protect the most sensitive, state of the art chipsets against
ESD transients.
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC 61000-4-4, 80A
(tP=5/50ns)
• Lightning, 8A (8/20 as
defined in IEC 61000-4-5
2nd edition)
• Low capacitance of 1pF
(TYP) per I/O
• Low leakage current of
0.01μA (TYP) at 5V
• Small form factor μDFN
(JEDEC MO-229) package
provides flow through
routing to simplify PCB
layout
• AEC-Q101 qualified
• Moisture Sensitivity
Level(MSL -1)
• Halogen free, lead free
and RoHS compliant
• LCD/PDP TVs
• External Storages
• DVD/Blu-ray Players
• Set Top Boxes
• Smartphones
• Ultrabooks/Notebooks
• Digital Cameras
• Portable Medical
• Automotive Electronics
• Wearable Technology
Pinout
Functional Block Diagram
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
SP3400, 1pF, ±30kV Diode Array RoHS
Pb
GREEN
USB 2.0 Protection Application Example
GND
USB Port
V
BUS
D+
D-
IC
USB Controller
*Package is shown as transparent
SP3014
SP1003
SP3400
SP3400
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 09/11/18
Low Capacitance ESD Protection - SP3014 Series
SP3014-02UTG
SP3012
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation
of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 8 A
TOP Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR = 1μA 5.0 V
Breakdown Voltage VBR IR = 1mA 6.5 7. 8 V
Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 0.01 0.5 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 9.2 12 V
IPP=8A, tp=8/20µs, Fwd 13 16 V
Dynamic Resistance2RDYN TLP, tp=100ns, I/O to GND 0.24 Ω
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact) ±30 kV
IEC 61000-4-2 (Air) ±30 kV
Diode Capacitance3CI/O-GND Reverse Bias=0V, f= 3 GHz 1pF
CI/O-I/O 0.5
Note: 1 Parameter is guaranteed by design and/or component characterization.
2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns.
3. Package sizes larger than 0201 can add parasitic capacitance, inductance and resistance.
SP3400
8/20μs Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.015.020.025.030.0
Time (μs)
Percent of I
PP
Clamping voltage vs. IPP for 8/20μs waveshape
0
2
4
6
8
10
12
14
02468
Clamp Voltage (V
C
)
Peak Pulse Current-I
PP
(A)
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 09/11/18
Low Capacitance ESD Protection - SP3014 Series
SP3014-02UTG
Positive Transmission Line Pulsing (TLP) Plot Negative Transmission Line Pulsing (TLP) Plot
IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage
0
5
10
15
20
25
30
35
40
0510 15
TLP Voltage (V)
TLP Current (A)
-40
-35
-30
-25
-20
-15
-10
-5
0
-10-6-4-20
TLP Voltage (V)
TLP Current (A)
-8
SP3400
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 09/11/18
Low Capacitance ESD Protection - SP3014 Series
SP3014-02UTG
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Part Numbering System Part Marking System
SP 3400 xx T G
Series
Package
T= Tape & Reel
G= Green
Number of
Channels
–
TVS Diode Arrays
(SPA
®
Diodes)
02 = 2 channel
x
µDFN-6LU=
AKKD
AK : Part code
K : Assembly code
D : Date code
12
3
4
5
6
Part Number Package Min. Order Qty.
SP3400-02UTG µDFN-6L 3000
Ordering Information
SP3400
Product Characteristics
Lead Plating Pre-Plated Frame (µDFN)
Lead Material Copper Alloy
Substrate Material Silicon
Body Material Molded Compound
Flammability UL Recognized compound meeting
flammability rating V-0
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 09/11/18
Low Capacitance ESD Protection - SP3014 Series
SP3014-02UTG
Package Dimensions —µDFN-6L
Package µDFN-6L
JEDEC MO-229
Pins 6
Millimeters Inches
Min Max Min Max
A0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.125 REF 0.005 REF
b0.35 0.45 0.014 0.018
b1 0.15 0.25 0.006 0.010
c0.05 REF 0.002 REF
D1.55 1.65 0.062 0.065
E0.95 1.05 0.038 0.042
F0.80 REF 0.031 REF
e0.50 REF 0.020 REF
R0.125 REF 0.005 REF
L0.33 0.43 0.013 0.017
D
E
A
A1
A3
e e
R
Pin1
1321
Top View Bottom View
Side View
645
Fc
6
3
4
b x 2 b1 x 4
Drawing# : U03-A
1
Package outline
Recommended soldering pad layout (Unit : mm)
Package center line
0.400.300.30
0.42
0.55
1.10
0.48
0.48
0.50 0.50
0.05
0.20 0.15
1.35
L
Embossed Carrier Tape & Reel Specification — µDFN-6L
Symbol Millimeters Inches
Min Max Min Max
E1.65 1.85 0.064 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.076 0.081
D1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P3.90 4.10 0.154 0.161
10P0 40.0+/-0.20 1.574+/-0.008
W7.90 8.30 0.311 0.319
P0 3.90 4.10 0.154 0.161
A0 1.15 1.25 0.045 0.049
B0 1.75 1.85 0.069 0.073
K0 0.65 0.75 0.026 0.03
t0.22 max 0.009 max
User Feeding Direction
Pin 1 Location
SP3400
,Ref.
,Ref.
,Ref.
8mm TAPE AND REEL
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test each product selected for their own applicaons. Lielfuse products are not designed for, and may not be used in, all applicaons.
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