CMOS, 1.8 V to 5.5 V/2.5 V, 3 Low Voltage 4-/8-Channel Multiplexers ADG708/ADG709 FEATURES FUNCTIONAL BLOCK DIAGRAMS 1.8 V to 5.5 V single supply 2.5 V dual supply 3 on resistance 0.75 on resistance flatness 100 pA leakage currents 14 ns switching times Single 8-to-1 multiplexer ADG708 Differential 4-to-1 multiplexer ADG709 16-lead TSSOP package Low power consumption TTL-/CMOS-compatible inputs ADG708 S1 D S8 APPLICATIONS A0 A1 00041-001 1 OF 8 DECODER A2 EN Figure 1. Data acquisition systems Communication systems Relay replacement Audio and video switching Battery-powered systems ADG709 S1A DA GENERAL DESCRIPTION S4A The ADG708/ADG709 are low voltage, CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG708 switches one of eight inputs (S1 to S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG709 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched off. Low power consumption and an operating supply range of 1.8 V to 5.5 V make the ADG708/ADG709 ideal for batterypowered, portable instruments. All channels exhibit breakbefore-make switching action preventing momentary shorting when switching channels. These switches are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low on resistance, and leakage currents. On resistance is in the region of a few ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either multiplexers or demultiplexers and have an input signal range that extends to the supplies. S1B DB S4B A0 A1 EN 00041-002 1 OF 4 DECODER Figure 2. PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. Single-/dual-supply operation. The ADG708/ADG709 are fully specified and guaranteed with 3 V and 5 V single-supply and 2.5 V dual-supply rails. Low RON (3 typical). Low power consumption (<0.01 W). Guaranteed break-before-make switching action. Small 16-lead TSSOP package. The ADG708/ADG709 are available in a 16-lead TSSOP. Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2000-2009 Analog Devices, Inc. All rights reserved. ADG708/ADG709 TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configurations and Function Descriptions ......................... 10 Applications ....................................................................................... 1 Truth Tables................................................................................. 11 General Description ......................................................................... 1 Typical Performance Characteristics ........................................... 12 Functional Block Diagrams ............................................................. 1 Test Circuits ..................................................................................... 15 Product Highlights ........................................................................... 1 Terminology .................................................................................... 18 Revision History ............................................................................... 2 Applications Information .............................................................. 19 Specifications..................................................................................... 3 Power Supply Sequencing ......................................................... 19 Dual Supply ................................................................................... 7 Outline Dimensions ....................................................................... 20 Absolute Maximum Ratings............................................................ 9 Ordering Guide .......................................................................... 20 ESD Caution .................................................................................. 9 REVISION HISTORY 4/09-Rev. B to Rev. C Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 5 Changes to Table 3 ............................................................................ 7 Moved Truth Tables Section.......................................................... 11 Changes to Figure 7, Figure 8, and Figure 9................................ 12 Changes to Figure 13 and Figure 14 ............................................. 13 Moved Terminology Section ......................................................... 18 Changes to Ordering Guide .......................................................... 20 8/06-Rev. A to Rev. B Updated Format .................................................................. Universal Changes to Absolute Maximum Ratings Section ......................... 9 Added Table 7 and Table 8 ............................................................ 10 Updated Outline Dimensions ....................................................... 18 Changes to Ordering Guide .......................................................... 18 4/02--Rev. 0 to Rev. A Edits to Features and Product Highlights ..................................... 1 Change to Specifications .............................................................. 2-4 Edits to Absolute Maximum Ratings Notes .................................. 5 Edits to TPCs 2, 5, 6-9, 11, and 15 ............................................. 7-9 Edits to Test Circuits 9 and 10 ...................................................... 11 Addition of Test Circuit 11 ............................................................ 11 10/00--Revision 0: Initial Version Rev. C | Page 2 of 20 ADG708/ADG709 SPECIFICATIONS VDD = 5 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 1. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match Between Channels (RON) On Resistance Flatness (RFLAT (ON)) +25C B Version -40C to -40C to +85C +125C 0 V to VDD 5 7 0.8 1.5 Drain Off Leakage, ID (Off ) 0.01 Channel On Leakage, ID, IS (On) 0.01 4.5 0.4 1.65 20 20 20 7 max typ 0.8 1.5 max typ 1.2 1.65 max 20 20 nA typ 0.1 0.01 0.3 0.1 0.01 0.75 0.1 0.75 2.4 0.8 0.005 1 6 nA max nA typ nA max nA typ VIN = VINL or VINH RL = 300 , CL = 35 pF; see Figure 24 VS1 = 3 V/0 V, VS8 = 0 V/3 V RL = 300 , CL = 35 pF 14 14 ns typ Break-Before-Make Time Delay, tOPEN 8 tON (EN) 14 tOFF (EN) 7 Charge Injection 3 Off Isolation -60 -80 25 25 ns max ns typ 1 1 25 25 12 12 3 ns min ns typ ns max ns typ ns max pC typ -60 -80 dB typ dB typ 8 14 25 25 7 12 12 Rev. C | Page 3 of 20 VD = VS = 1 V or 4.5 V; see Figure 23 0.1 2 1 VD = 4.5 V/1 V, VS = 1 V/4.5 V; see Figure 22 V min V max 2 1 VDD = 5.5 V VD = 4.5 V/1 V, VS = 1 V/4.5 V; see Figure 21 2.4 0.8 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 tTRANSITION 25 VS = 0 V to VDD, IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA nA max A typ A max pF typ 25 VS = 0 V to VDD, IDS = 10 mA; see Figure 20 6 0.005 0.1 Test Conditions/ Comments V 5 0.01 20 Unit typ 0.75 1.2 0.01 0 V to VDD 3 0.75 LEAKAGE CURRENTS Source Off Leakage, IS (Off) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH 0 V to VDD 3 4.5 0.4 +25C C Version -40C to -40C to +85C +125C VS = 3 V; see Figure 25 RL = 300 , CL = 35 pF VS = 3 V; see Figure 26 RL = 300 , CL = 35 pF VS = 3 V; see Figure 26 VS = 2.5 V, RS = 0 , CL = 1 nF; See Figure 27 RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz; see Figure 28 ADG708/ADG709 B Version -40C to -40C to +85C +125C C Version -40C to -40C to +85C +125C -80 -80 dB typ -3 dB Bandwidth 55 55 MHz typ CS (Off ) CD (Off ) ADG708 ADG709 CD, CS (On) ADG708 ADG709 POWER REQUIREMENTS IDD 13 13 pF typ Test Conditions/ Comments RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz; see Figure 29 RL = 50 , CL = 5 pF; see Figure 30 f = 1 MHz 85 42 85 42 pF typ pF typ f = 1 MHz f = 1 MHz 96 48 96 48 pF typ pF typ f = 1 MHz f = 1 MHz VDD = 5.5 V Digital inputs = 0 V or 5.5 V Parameter Channel-to-Channel Crosstalk +25C -60 0.001 0.001 1.0 1 +25C -60 1.0 1.0 Guaranteed by design, not subject to production test. Rev. C | Page 4 of 20 1.0 Unit dB typ A typ A max ADG708/ADG709 VDD = 3 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match Between Channels (RON) +25C B Version -40C to -40C to +85C +125C 0 V to VDD 0 V to VDD 8 11 0.4 8 12 1.2 LEAKAGE CURRENTS Source Off Leakage, IS (Off ) 0.01 Drain Off Leakage, ID (Off ) 0.01 Channel On Leakage, ID, IS (On) 0.01 14 11 0.4 2 20 20 20 20 20 12 1.2 0.1 0.01 0.3 0.1 0.01 0.75 0.1 0.75 2 1 6 max typ nA max nA typ nA max nA typ VIN = VINL or VINH 0.1 RL = 300 , CL = 35 pF; see Figure 24 VS1 = 2 V/0 V, VS2 = 0 V/2 V RL = 300 , CL = 35 pF 18 ns typ tON (EN) 18 tOFF (EN) 8 30 30 ns max ns typ 1 1 30 30 15 15 8 1 Charge Injection 3 3 ns min ns typ ns max ns typ ns max pC typ Off Isolation -60 -60 dB typ -80 -80 dB typ -60 -60 dB typ -80 -80 dB typ 55 55 MHz typ 18 30 -3 dB Bandwidth 30 8 15 Channel-to-Channel Crosstalk 1 15 Rev. C | Page 5 of 20 VS = VD = 1 V or 3 V; see Figure 23 V min V max 18 30 VS = 3 V/1 V, VD = 1 V/3 V; see Figure 22 2.0 0.8 2 30 VDD = 3.3 V VS = 3 V/1 V, VD = 1 V/3 V; see Figure 21 nA max 2 8 VS = 0 V to VDD, IDS = 10 mA max A typ A max pF typ Break-Before-Make Time Delay, tOPEN VS = 0 V to VDD, IDS = 10 mA; see Figure 20 6 0.005 0.1 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 tTRANSITION 14 Test Conditions/ Comments V nA typ 2.0 0.8 0.005 Unit typ 0.01 20 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH +25C C Version -40C to -40C to +85C +125C VS = 2 V; see Figure 25 RL = 300 , CL = 35 pF VS = 2 V; see Figure 26 RL = 300 , CL = 35 pF VS = 2 V; see Figure 26 VS = 1.5 V, RS = 0 , CL = 1 nF; see Figure 27 RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz; see Figure 28 RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz; see Figure 29 RL = 50 , CL = 5 pF; see Figure 30 ADG708/ADG709 Parameter CS (Off ) CD (Off ) ADG708 ADG709 CD, CS (On) ADG708 ADG709 POWER REQUIREMENTS IDD +25C 13 B Version -40C to -40C to +85C +125C Unit pF typ Test Conditions/ Comments f = 1 MHz 85 42 85 42 pF typ pF typ f = 1 MHz f = 1 MHz 96 48 96 48 pF typ pF typ f = 1 MHz f = 1 MHz VDD = 3.3 V Digital inputs = 0 V or 3.3 V 0.001 0.001 1.0 1 +25C 13 C Version -40C to -40C to +85C +125C 1.0 1.0 Guaranteed by design, not subject to production test. Rev. C | Page 6 of 20 1.0 A typ A max ADG708/ADG709 DUAL SUPPLY VDD = 2.5 V 10%, VSS = -2.5 V 10%, GND = 0 V, unless otherwise noted. Table 3. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match Between Channels (RON) On Resistance Flatness (RFLAT (ON)) +25C B Version -40C to -40C to +85C +125C VSS to VDD 2.5 4.5 0.4 5 7 0.8 1.5 Drain Off Leakage, ID (Off ) 0.01 Channel On Leakage, ID, IS (On) 0.01 4.5 0.4 1.65 20 20 20 20 20 max typ 0.8 1.5 1.0 1.65 max typ max nA typ 0.1 0.01 0.3 0.1 0.01 0.75 0.1 0.75 1.7 0.7 0.005 V typ 7 0.01 20 Unit 5 0.6 1.0 0.01 VSS to VDD 2.5 0.6 LEAKAGE CURRENTS Source Off Leakage, IS (Off ) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH +25C C Version -40C to -40C to +85C +125C 1 6 nA max nA typ nA max nA typ VIN = VINL or VINH RL = 300 , CL = 35 pF; see Figure 24 VS = 1.5 V/0 V; see Figure 24 RL = 300 , CL = 35 pF 14 14 ns typ Break-Before-Make Time Delay, tOPEN 8 tON (EN) 14 tOFF (EN) 8 Charge Injection 3 Off Isolation 25 25 ns max ns typ 1 1 25 25 15 15 3 ns min ns typ ns max ns typ ns max pC typ -60 -60 dB typ -80 -80 dB typ 8 14 25 25 8 15 15 Rev. C | Page 7 of 20 VS = VD = +2.25 V/-1.25 V; see Figure 23 0.1 2 1 VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; see Figure 22 V min V max 2 1 VDD = +2.75 V, VSS = -2.75 V VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; see Figure 21 1.7 0.7 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 tTRANSITION 25 VS = VSS to VDD, IDS = 10 mA VS = VSS to VDD, IDS = 10 mA nA max A typ A max pF typ 25 VS = VSS to VDD, IDS = 10 mA; see Figure 20 6 0.005 0.1 Test Conditions/ Comments VS = 1.5 V; see Figure 25 RL = 300 , CL = 35 pF VS = 1.5 V; see Figure 26 RL = 300 , CL = 35 pF VS = 1.5 V; see Figure 26 VS = 0 V, RS = 0 , CL = 1 nF; see Figure 27 RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz; see Figure 28 ADG708/ADG709 B Version -40C to -40C to +85C +125C C Version -40C to -40C to +85C +125C -80 -80 dB typ -3 dB Bandwidth 55 55 MHz typ CS (Off ) CD (Off ) ADG708 ADG709 CD, CS (On) ADG708 ADG709 POWER REQUIREMENTS IDD 13 13 pF typ Test Conditions/ Comments RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz; see Figure 29 RL = 50 , CL = 5 pF; see Figure 30 f = 1 MHz 85 42 85 42 pF typ pF typ f = 1 MHz f = 1 MHz 96 48 96 48 pF typ pF typ f = 1 MHz f = 1 MHz VDD = 2.75 V Digital inputs = 0 V or 2.75 V Parameter Channel-to-Channel Crosstalk ISS 1 +25C -60 0.001 +25C -60 0.001 1.0 1.0 1.0 1.0 0.001 1.0 1.0 1.0 1.0 0.001 Guaranteed by design not subject to production test. Rev. C | Page 8 of 20 Unit dB typ A typ A max A typ A max VSS = -2.75 V Digital inputs = 0 V or 2.75 V ADG708/ADG709 ABSOLUTE MAXIMUM RATINGS TA = 25C, unless otherwise noted. Table 4. Parameter VDD to VSS VDD to GND VSS to GND Analog Inputs 1 1 Digital Inputs Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Maximum) Continuous Current, S or D Operating Temperature Industrial Temperature Range Storage Temperature Range Junction Temperature TSSOP Package, Power Dissipation JA Thermal Impedance JC Thermal Impedance Lead Temperature, Soldering Vapor Phase (60 sec) Infrared (15 sec) Rating 7V -0.3 V to +7 V +0.3 V to -3.5 V VSS - 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first -0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first 100 mA Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating can be applied at any one time. ESD CAUTION 30 mA -40C to +125C -65C to +150C 150C 432 mW 150.4C/W 27.6C/W 215C 220C 1 Overvoltages at A, EN, S, or D are clamped by internal codes. Current should be limited to the maximum ratings given. Rev. C | Page 9 of 20 ADG708/ADG709 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 1 16 A1 A0 1 16 A1 EN 2 15 A2 EN 2 15 GND 14 GND VSS 3 3 S1 4 ADG708 13 S1A 4 S2 5 TOP VIEW (Not to Scale) VDD 12 S5 S2A 5 S3 6 11 S6 S3A 6 S4 7 10 S7 S4A 7 10 D 8 9 S8 DA 8 9 00041-003 VSS Figure 3. ADG708 Pin Configuration 14 VDD ADG709 13 TOP VIEW (Not to Scale) S1B 12 S2B 11 S3B S4B DB 00041-004 A0 Figure 4. ADG709 Pin Configuration Table 5. ADG708 Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Mnemonic A0 EN VSS S1 S2 S3 S4 D S8 S7 S6 S5 VDD GND A2 A1 Description Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Most Negative Power Supply Pin in Dual-Supply Applications. For single-supply applications, it should be tied to GND. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Most Positive Power Supply Pin. Ground (0 V) Reference. Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Table 6. ADG709 Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Mnemonic A0 EN VSS S1A S2A S3A S4A DA DB S4B S3B S2B S1B VDD GND A1 Description Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8). Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8). Most Negative Power Supply Pin in Dual-Supply Applications. For single-supply applications, it should be tied to GND. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Most Positive Power Supply Pin. Ground (0 V) Reference. Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8). Rev. C | Page 10 of 20 ADG708/ADG709 TRUTH TABLES Table 7. ADG708 Truth Table A2 X1 0 0 0 0 1 1 1 1 1 A1 X1 0 0 1 1 0 0 1 1 A0 X1 0 1 0 1 0 1 0 1 EN 0 1 1 1 1 1 1 1 1 X Switch Condition None 1 2 3 4 5 6 7 8 X = Don't care. Table 8. ADG709 Truth Table A1 X1 0 0 1 1 1 A0 X1 0 1 0 1 EN 0 1 1 1 1 On Switch Pair None 1 2 3 4 X = Don't care. Rev. C | Page 11 of 20 ADG708/ADG709 TYPICAL PERFORMANCE CHARACTERISTICS 8 8 TA = 25C VSS = 0V 7 VDD = 3V VSS = 0V 7 +125C 6 5 VDD = 3.3V 4 VDD = 4.5V VDD = 5.5V 3 4 -40C 3 2 2 1 1 0 1 2 3 4 VD OR VS - DRAIN OR SOURCE VOLTAGE (V) 5 +25C 0 00041-005 0 +85C 5 0 Figure 5. On Resistance as a Function of VD (VS) for Single Supply 0.5 1.0 1.5 2.0 2.5 VD OR VS - DRAIN OR SOURCE VOLTAGE (V) 3.0 00041-008 VDD = 2.7V ON RESISTANCE () ON RESISTANCE () 6 Figure 8. On Resistance as a Function of VD (VS) for Different Temperatures, Single Supply 6 8 VDD = +2.5V VSS = -2.5V TA = 25C 7 5 ON RESISTANCE () 5 4 VDD = +2.25V VSS = -2.25V 3 +125C 4 2 2 -40C 1 VDD = +2.75V VSS = -2.75V 0 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 VD OR VS - DRAIN OR SOURCE VOLTAGE (V) 0 -2.5 00041-006 1 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 Figure 9. On Resistance as a Function of VD (VS) for Different Temperatures, Dual Supply 0.12 8 VDD = 5V VSS = 0V TA = 25C VDD = 5V VSS = 0V 7 0.08 CURRENT (nA) 6 5 +125C 4 +25C -2.5 VD OR VS - DRAIN OR SOURCE VOLTAGE (V) Figure 6. On Resistance as a Function of VD (VS) for Dual Supply ON RESISTANCE () +25C +85C 3 00041-009 ON RESISTANCE () 6 +85C 3 ID (ON) 0.04 0 IS (OFF) -0.04 2 ID (OFF) -0.08 -40C -0.12 0 1 2 3 4 VD OR VS - DRAIN OR SOURCE VOLTAGE (V) 5 0 00041-007 0 Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures, Single Supply Rev. C | Page 12 of 20 1 2 3 VS, (VD = VDD - VS) (V) 4 Figure 10. Leakage Currents as a Function of VD (VS) 5 00041-010 1 ADG708/ADG709 0.08 VDD = 3V VSS = 0V TA = 25C 0.04 ID (ON) 0.35 0.25 IS (OFF) ID (OFF) 0.15 0.5 1.0 1.5 2.0 VD, (VS = VDD - VD) (V) 3.0 2.5 0 00041-011 0 0 20 40 60 80 100 120 TEMPERATURE (C) Figure 14. Leakage Currents as a Function of Temperature Figure 11. Leakage Currents as a Function of VD (VS) 10m 0.12 VDD = +2.5V VSS = -2.5V TA = 25C 0.08 TA = 25C 1m CURRENT (A) 0 IS (OFF) -0.04 VDD = +2.5V VSS = -2.5V 100 ID (ON), VS = VD 0.04 ID (OFF) 10 VDD = +5V 1 VDD = +3V 100n -0.08 2.0 2.5 3.0 1n 10 00041-012 1.5 100 1k 10k 100k FREQUENCY (Hz) 0 VDD = +5V VSS = 0V AND VDD = +2.5V VSS = -2.5V 0.20 0.15 ID (OFF) 0.10 IS (OFF) ID (ON) 0 20 40 60 80 100 -60 -80 -100 120 TEMPERATURE (C) -120 30k 00041-013 0.05 -40 100k 1M FREQUENCY (Hz) 10M Figure 16. Off Isolation vs. Frequency Figure 13. Leakage Currents as a Function of Temperature Rev. C | Page 13 of 20 100M 00041-016 0.25 VDD = 5V TA = 25C -20 ATTENUATION (dB) 0.30 10M Figure 15. Supply Current vs. Input Switching Frequency Figure 12. Leakage Currents as a Function of VD (VS) 0.35 1M 00041-015 10n -0.12 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 VS, (VD = VDD - VS) (V) CURRENT (nA) ID (OFF) IS (OFF) 0.05 -0.12 0 ID (ON) 0.10 -0.08 CURRENT (nA) 0.20 00041-014 0 -0.04 VDD = +3V 0.30 CURRENT (nA) CURRENT (nA) 0.12 ADG708/ADG709 20 VDD = 5V TA = 25C TA = 25C -40 0 -60 -20 -100 -30 100k 1M FREQUENCY (Hz) 10M 100M Figure 17. Crosstalk vs. Frequency VDD = 5V TA = 25C -10 -15 1M FREQUENCY (Hz) 10M 100M 00041-018 ATTENUATION (dB) -5 100k -40 -3 VDD = +2.5V VSS = -2.5V -2 -1 0 1 2 VOLTAGE (V) 3 4 Figure 19. Charge Injection vs. Source Voltage 0 -20 30k VDD = +3V VSS = 0V -10 -80 -120 30k VDD = +5V VSS = 0V Figure 18. On Response vs. Frequency Rev. C | Page 14 of 20 5 00041-019 10 QINJ (pC) -20 00041-017 ATTENUATION (dB) 0 ADG708/ADG709 TEST CIRCUITS IDS VDD VSS VDD VSS V1 S1 D ID (OFF) S2 D GND Figure 22. ID (OFF) A VDD VSS VDD VSS VDD VSS VDD VSS S1 GND 0.8V GND Figure 21. IS (OFF) VSS VDD VSS ADDRESS DRIVE (VIN) VS1 ADG708* VS8 S8 VS1 90% VOUT CL 35pF RL 300 GND 50% VOUT D EN 50% 0V S2 TO S7 A0 2.4V 3V S1 A1 50 2.4V EN Figure 23. ID (ON) VDD A2 A VD VS 00041-021 VD D S8 S8 EN ID (ON) S1 D S2 VS 00041-023 IS(OFF) 0.8V EN 00041-022 00041-020 RON = V1/IDS VD VS Figure 20. On Resistance VIN A S8 VS 90% VS8 tTRANSITION *SIMILAR CONNECTION FOR ADG709. tTRANSITION 00041-024 S Figure 24. Switching Time of Multiplexer, tTRANSITION VDD VSS VDD VIN 50 3V A2 VSS S1 A1 S2 TO S7 ADDRESS DRIVE (VIN) VS 0V A0 2.4V S8 VOUT D EN GND RL 300 CL 35pF VOUT 80% 80% tOPEN *SIMILAR CONNECTION FOR ADG709. Figure 25. Break-Before-Make Delay, tOPEN Rev. C | Page 15 of 20 00041-025 ADG708* ADG708/ADG709 VDD VDD VSS 3V VSS ENABLE DRIVE (VIN) A2 VS S1 A1 0V tOFF (EN) S2 TO S8 A0 VO ADG708* EN VIN 50% 50% VOUT D CL 35pF RL 300 GND 50 0.9VO 0.9VO OUTPUT 0V 00041-026 tON (EN) *SIMILAR CONNECTION FOR ADG709. Figure 26. Enable Delay, tON (EN), tOFF (EN) VDD A2 VDD A0 RS VS 3V VSS LOGIC INPUT (VIN) D S CL VOUT 1nF EN VIN 0V ADG708* VOUT VOUT QINJ = CL x VOUT GND 00041-027 A1 VSS *SIMILAR CONNECTION FOR ADG709. Figure 27. Charge Injection VDD VSS 0.1F A2 A1 A0 0.1F VDD NETWORK ANALYZER VSS S 50 50 VS D 2.4V EN RL 50 OFF ISOLATION = 20 log 00041-028 GND VOUT VOUT VS Figure 28. Off Isolation VDD VSS 0.1F 0.1F V A2 DD A0 NETWORK ANALYZER 50 VS 50 EN 2.4V ADG708* D S1 RL 50 S2 S8 NETWORK ANALYZER VOUT GND *SIMILAR CONNECTION FOR ADG709. CHANNEL-TO-CHANNEL CROSSTALK = 20 log VOUT VS Figure 29. Channel-to-Channel Crosstalk Rev. C | Page 16 of 20 00041-029 A1 VSS ADG708/ADG709 VDD VSS 0.1F A2 A1 A0 0.1F VDD NETWORK ANALYZER VSS S 50 VS D EN RL 50 GND INSERTION LOSS = 20 log VOUT WITH SWITCH VOUT WITHOUT SWITCH Figure 30. Bandwidth Rev. C | Page 17 of 20 VOUT 00041-030 2.4V ADG708/ADG709 TERMINOLOGY tTRANSITION Delay time measured between the 50% and 90% points of the digital inputs and the switch on condition when switching from one address state to another. VDD Most positive power supply potential. VSS Most negative power supply in a dual-supply application. In single-supply applications, tie VSS to ground at the device. tON (EN) Delay time between the 50% and 90% points of the EN digital input and the switch on condition. GND Ground (0 V) reference. tOFF (EN) Delay time between the 50% and 90% points of the EN digital input and the switch off condition. S Source terminal. Can be an input or output. D Drain terminal. Can be an input or output. tOPEN Off time measured between the 80% points of both switches when switching from one address state to another. Ax Logic control input. Off Isolation A measure of unwanted signal coupling through an off switch. EN Active high enable. Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. RON Ohmic resistance between D and S. RFLAT (ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range. IS (Off) Source leakage current with the switch off. On Loss The loss due to the on resistance of the switch. ID, IS (On) Channel leakage current with the switch on. VINL Maximum input voltage for Logic 0. VD (VS) Analog voltage on Terminal D and Terminal S. CS (Off) Off switch source capacitance. Measured with reference to ground. CD (Off) Off switch drain capacitance. Measured with reference to ground. CIN Digital input capacitance. Bandwidth The frequency at which the output is attenuated by 3 dB. On Response The frequency response of the on switch. ID (Off) Drain leakage current with the switch off. CD, CS (On) On switch capacitance. Measured with reference to ground. Charge A measure of the glitch impulse transferred from injection of the digital input to the analog output during switching. VINH Minimum input voltage for Logic 1. IINL (IINH) Input current of the digital input. IDD Positive supply current. ISS Negative supply current. Rev. C | Page 18 of 20 ADG708/ADG709 APPLICATIONS INFORMATION POWER SUPPLY SEQUENCING When using CMOS devices, take care to ensure correct power supply sequencing. Incorrect power supply sequencing can result in the device being subjected to stresses beyond the maximum ratings listed in Figure 4. Always apply digital and analog inputs after power supplies and ground. For single-supply operation, tie VSS to GND as close to the device as possible. Rev. C | Page 19 of 20 ADG708/ADG709 OUTLINE DIMENSIONS 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.30 0.19 0.65 BSC COPLANARITY 0.10 0.20 0.09 SEATING PLANE 8 0 0.75 0.60 0.45 COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters ORDERING GUIDE Model ADG708BRU ADG708BRU-REEL ADG708BRU-REEL7 Temperature Range -40C to +125C -40C to +125C -40C to +125C Package Description 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] Package Option RU-16 RU-16 RU-16 ADG708BRUZ 1 ADG708BRUZ-REEL1 ADG708BRUZ-REEL71 ADG708CRU ADG708CRU-REEL -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 RU-16 RU-16 RU-16 RU-16 ADG708CRU-REEL7 ADG708CRUZ1 ADG708CRUZ-REEL1 ADG708CRUZ-REEL71 -40C to +125C -40C to +125C -40C to +125C -40C to +125C 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 RU-16 RU-16 RU-16 ADG709BRU ADG709BRU-REEL ADG709BRU-REEL7 ADG709BRUZ1 ADG709BRUZ-REEL1 -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 RU-16 RU-16 RU-16 RU-16 ADG709BRUZ-REEL71 ADG709CRU ADG709CRU-REEL ADG709CRU-REEL7 -40C to +125C -40C to +125C -40C to +125C -40C to +125C 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 RU-16 RU-16 RU-16 ADG709CRUZ1 ADG709CRUZ-REEL1 ADG709CRUZ-REEL71 -40C to +125C -40C to +125C -40C to +125C 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 RU-16 RU-16 1 Z = RoHS Compliant Part. (c)2000-2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D00041-0-4/09(C) Rev. C | Page 20 of 20