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SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
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SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
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SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
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SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
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SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9679201Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9679201Q2A
SNJ54S
30FK
5962-9679201QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QC
A
SNJ54S30J
5962-9679201QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QC
A
SNJ54S30J
5962-9679201QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QD
A
SNJ54S30W
5962-9679201QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QD
A
SNJ54S30W
JM38510/30009B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30009B2A
JM38510/30009B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30009B2A
JM38510/30009BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BCA
JM38510/30009BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BCA
JM38510/30009BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BDA
JM38510/30009BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BDA
JM38510/30009SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SCA
JM38510/30009SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SCA
JM38510/30009SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SDA
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
JM38510/30009SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SDA
M38510/30009B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30009B2A
M38510/30009B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30009B2A
M38510/30009BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BCA
M38510/30009BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BCA
M38510/30009BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BDA
M38510/30009BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009BDA
M38510/30009SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SCA
M38510/30009SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SCA
M38510/30009SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SDA
M38510/30009SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30009SDA
SN5430J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN5430J
SN5430J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN5430J
SN54LS30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS30J
SN54LS30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS30J
SN54S30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S30J
SN54S30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S30J
SN7430N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN7430N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74LS30D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LS30D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS30
SN74LS30J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70
SN74LS30J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70
SN74LS30N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS30N
SN74LS30N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS30N
SN74LS30N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74LS30N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74LS30NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS30N
SN74LS30NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS30N
SN74LS30NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS30
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LS30NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS30
SN74LS30NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS30
SN74LS30NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS30
SN74LS30NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS30
SN74LS30NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS30
SN74S30D OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70
SN74S30D OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70
SN74S30DR OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70
SN74S30DR OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70
SN74S30J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70
SN74S30J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70
SN74S30N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74S30N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SNJ5430J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ5430J
SNJ5430J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ5430J
SNJ5430W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ5430W
SNJ5430W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ5430W
SNJ54LS30FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
30FK
SNJ54LS30FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
30FK
SNJ54LS30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS30J
SNJ54LS30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS30J
SNJ54LS30W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS30W
SNJ54LS30W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS30W
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54S30FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9679201Q2A
SNJ54S
30FK
SNJ54S30FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9679201Q2A
SNJ54S
30FK
SNJ54S30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QC
A
SNJ54S30J
SNJ54S30J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QC
A
SNJ54S30J
SNJ54S30W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QD
A
SNJ54S30W
SNJ54S30W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9679201QD
A
SNJ54S30W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 6
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5430, SN54LS30, SN54LS30-SP, SN54S30, SN7430, SN74LS30, SN74S30 :
Catalog: SN7430, SN74LS30, SN54LS30, SN74S30
Military: SN5430, SN54LS30, SN54S30
Space: SN54LS30-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS30DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LS30NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS30DR SOIC D 14 2500 367.0 367.0 38.0
SN74LS30NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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