EHHD010A0B41Z - ABB - Datasheet.Directory

Datasheet

September 11, 2020

Page 1

EHHD010A0B HAMMERHEAD* Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 10A, 120W Output

Features

▪ Compliant to RoHS Directive 2011/65/EU and amended

Directive (EU) 2015/863 (-Z versions)

▪ Compliant to REACH Directive (EC) No 1907/2006

▪ Flat and high efficiency curve

▪ Industry standard, DOSA compliant footprint

58.4mm x 22.8mm x 8.9mm

(2.30 in x 0.9 in x 0.35 in)

▪ Ultra wide input voltage range: 18-75 Vdc

▪ Tightly regulated output

▪ Remote sense

▪ Output Voltage adjust: 90% to 110% of VO,nom

▪ Constant switching frequency

▪ Positive remote On/Off logic

▪ Output overcurrent and overvoltage protection

▪ Over temperature protection

▪ Wide operating temperature range (-40°C to 85°C)

▪ Suitable for cold wall cooling using suitable Gap Pad applied

directly to top side of module

▪ ANSI/UL# 62368-1 and CAN/CSA† C22.2 No. 62368-1

Recognized, DIN VDE‡ 0868-1/A11:2017 (EN62368-

1:2014/A11:2017)

▪ CE mark meets 2006/95/EC directive§

▪ Meets the voltage and current requirements for ETSI 300-132-

2 and complies with and licensed for Basic insulation rating per

EN60950-1

▪ 2250 Vdc Isolation tested in compliance with IEEE 802.3¤ PoE

standards

▪ ISO**9001 and ISO 14001 certified manufacturing facilities

Applications

▪ Distributed Power Architectures

▪ Wireless Networks

▪ Enterprise Networks including Power over Ethernet (PoE)

▪ Industrial Equipment

Options

▪ Negative Remote On/Off logic (preferred)

▪ Over current/Over temperature/Over voltage protections

(Auto-restart) (preferred)

▪ 1/8th Brick Heat plate for 1/8th heatsinks

▪ 1/4th Brick heat plate with unthreaded inserts

Description

The EHHD010A0B [HAMMERHEAD*] Series, eighth-brick, low-height power modules are isolated dc-dc converters which provide a

single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75Vdc. The EHHD010A0B provides 12Vdc nominal

output voltage rated for 10Adc output current. The module incorporates GE’s vast heritage for reliability and quality, while also using the

latest in technology, and component and process standardization to achieve highly competitive cost. The open frame module

construction, available in through-hole packaging, enable designers to develop cost and space efficient solutions. The module achieves

typical full load efficiency greater than 90% at VIN=24Vdc and VIN=48Vdc. Standard features include remote On/Off, remote sense, output

voltage adjustment, overvoltage, overcurrent and over temperature protection. An optional heat plate allows for external standard,

eighth-brick or quarter-brick heat sink attachment to achieve higher output current in high temperature applications.

* Trademark of General Electric Company.

# UL is a registered trademark of Underwriters Laboratories, Inc.

† CSA is a registered trademark of Canadian Standards Association.

‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.

¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.

** ISO is a registered trademark of the International Organization of Standards

RoHS Compliant

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 2

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only,

functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of

the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter

Device

Symbol

Min

Max

Unit

Input Voltage

Continuous

All

VIN

-0.3

Vdc

Transient, operational (≤100 ms)

All

VIN,trans

-0.3

100

Vdc

Operating Ambient Temperature

All

-40

°C

Maximum Heat Plate Operating Temperature

-18H, H

-40

105

°C

(see Thermal Considerations section)

Storage Temperature

All

Tstg

-55

125

°C

Altitude*

All

4000

I/O Isolation voltage (100% factory Hi-Pot tested)

All

⎯

2250

Vdc

* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter

Device

Symbol

Min

Typ

Max

Unit

Operating Input Voltage

All

VIN

24/48

Vdc

Maximum Input Current

All

IIN

7.3

7.8

Adc

(VIN= VIN, min to VIN, max, VO= VO, set, IO=IO, max)

Input No Load Current

All

IIN,No load

120

VIN = 24Vdc, (IO = 0, module enabled)

VIN = 48V, (IO = 0, module enabled)

Input Stand-by Current

All

IIN,stand-by

(VIN = 24 to 48V, module disabled)

Inrush Transient

All

I2t

0.5

A2s

Input Reflected Ripple Current, peak-to-peak

(5Hz to 20MHz, 12μH source impedance; VIN, min to VIN, max, IO= IOmax ; See

Test configuration section)

All

mAp-p

Input Ripple Rejection (120Hz)

All

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of

sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum

safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 15

A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input

current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 3

Electrical Specifications (continued)

Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.

Parameter

Device

Symbol

Min

Typ

Max

Unit

Nominal Output Voltage Set-point

All

VO, set

11.82

12.18

Vdc

VIN= 24V to 48V IO=IO, max, TA=25°C)

Output Voltage

All

-3.0

⎯

+3.0

% VO, set

(Over all operating input voltage, resistive load, and temperature

conditions until end of life)

Adjustment Range (*Vin > 20V)

All

VO, adj

-10

+10*

% VO, set

Selected by external resistor

Output Regulation

Line (VIN=VIN, min to VIN, max)

All

⎯

±0.2

% VO, set

Load (IO=IO, min to IO, max)

All

⎯

±0.2

% VO, set

Temperature (Tref=TA, min to TA, max)

All

⎯

±1.5

% VO, set

Output Ripple and NoiseOutput Ripple and Noise on nominal output

Measured with 10uF Tantalum||1uF ceramic

(VIN=24 to 48, IO=80% IO, max , TA=25)

RMS (5Hz to 20MHz bandwidth)

All

mVrms

Peak-to-Peak (5Hz to 20MHz bandwidth)

All

200

mVpk-pk

External Capacitance

All

CO, max

⎯

5000

μF

Output Current

All

Adc

Output Current Limit Inception (Hiccup Mode )

(VO= 90% of VO, set)

IO, lim

Adc

Output Short-Circuit Current

All

IO, s/c

1.2

Arms

(VO≤250mV) ( Hiccup Mode )

Efficiency

VIN=24V, TA=25°C, IO=10A, VO = 12V

All

VIN=48V, TA=25°C, IO=10A, VO = 12V

All

92.5

Switching Frequency

All

fsw

300

kHz

Dynamic Load Response

(dIo/dt=0.1A/s; VIN = 24V or 48V; TA=25°C; CO>100μF)

Load Change from Io= 50% to 75% or 25% to 50% of Io,max

Peak Deviation

All

Vpk

⎯

% VO, set

Settling Time (Vo<10% peak deviation)

All

⎯

800

⎯

s

Isolation Specifications

Parameter

Device

Symbol

Min

Typ

Max

Unit

Isolation Capacitance

All

Ciso

⎯

1000

⎯

Isolation Resistance

All

Riso

⎯

MΩ

I/O Isolation Voltage (100% factory Hi-pot tested)

All

⎯

2250

Vdc

General Specifications

Parameter

Device

Symbol

Min

Typ

Max

Unit

Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I

Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm, 90% confidence)

All

FIT

125.3

109/Hour

All

MTBF

7,981,756

Hours

Weight (Open Frame)

All

23 (0.8)

g (oz.)

Weight (with Heatplate)

All

37 (1.3)

g (oz.)

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 4

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See

Feature Descriptions for additional information.

Parameter

Device

Symbol

Min

Typ

Max

Unit

Remote On/Off Signal Interface

(VIN=VIN, min to VIN, max ; open collector or equivalent,

Signal referenced to VIN- terminal)

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current

All

Ion/off

⎯

0.15

Logic Low - On/Off Voltage

All

Von/off

-0.7

⎯

0.6

Vdc

Logic High Voltage – (Typ = Open Collector)

All

Von/off

2.5

6.7

Vdc

Logic High maximum allowable leakage current

All

Ion/off

⎯

μA

Turn-On Delay and Rise Times

(IO=IO, max , VIN=VIN, nom, TA = 25oC)

Case 1: Input power is applied for at least 1 second,

and then the On/Off input is set from OFF to ON

(Tdelay = on/off pin transition until VO = 10% of VO, set)

All

Tdelay

―

msec

Case 2: On/Off input is set to Logic Low (Module

ON) and then input power is applied (Tdelay from

instant at which VIN = VIN, min until Vo=10% of VO,set)

All

Tdelay

―

msec

Output voltage Rise time (time for Vo to rise from 10%

of Vo,set to 90% of Vo, set)

All

Trise

―

msec

Output voltage overshoot – Startup

All

―

% VO, set

IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC

Remote Sense Range

All

VSENSE

% VO, set

Output Overvoltage Protection1

All

VO, limit

13.6

⎯

16.6

Vdc

Overtemperature Protection – Hiccup Auto Restart

Open

frame

Tref

135

Heat

Plate

Tref

120

Input Undervoltage Lockout

All

VUVLO

Turn-on Threshold

⎯

17.5

Vdc

Turn-off Threshold

15.5

Vdc

Hysteresis

Vdc

Input Overvoltage Lockout

All

VOVLO

Turn-on Threshold

⎯

Vdc

Turn-off Threshold

⎯

Vdc

Hysteresis

⎯

Vdc

1 –OVP voltage is lower than 13.6 for Vin between 18-20V. The module requires a minimum of 100μF external output capacitor to avoid exceeding the OVP maximum limits

during startup into openloop fault conditions

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 5

Characteristic Curves

The following figures provide typical characteristics for the EHHD010A0B (12V, 10A) at 25 OC. The figures are identical for either

positive or negative remote On/Off logic.

EFFICIENCY,  (%)

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (200mV/div) Io(A) (2A/div)

OUTPUT CURRENT, IO (A)

TIME, t (200µs/div)

Figure 1. Converter Efficiency versus Output Current.

Figure 4. Transient Response to 0.1A/µS Dynamic Load Change

from 50% to 75% to 50% of full load, Vin=48V.

OUTPUT VOLTAGE

VO (V) (100mV/div)

OUTPUT VOLTAGE On/Off VOLTAGE

VO (V) (5V/div) VOn/Off (V) (2V/div)

TIME, t (2s/div)

TIME, t (20ms/div)

Figure 2. Typical output ripple and noise (Io = Io,max).

Figure 5. Typical Start-up Using Remote On/Off, negative logic

version shown (VIN = 24V, Io = Io,max).

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (200mV/div) Io(A) (2A/div)

OUTPUT VOLTAGE INPUT VOLTAGE

VO (V) (5V/div) VIN (V) (10V/div)

TIME, t (200µs/div)

TIME, t (20ms/div)

Figure 3. Transient Response to 0.1A/µS Dynamic Load

Change from 50% to 75% to 50% of full load, Vin=24V.

Figure 6. Typical Start-up Using Input Voltage (VIN = 24V, Io =

Io,max).

0246810

Vin=75V

Vin=24V

Vin=36V

Vin=48V

Vin=18V

Vin=24V

Vin=48V

Vin=75V

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 6

Test Configurations

TO OSCILLOSCOPE

CURRENT PROBE

LTEST

12μH

BATTERY

CS 220μF

E.S.R.<0.1

@ 20°C 100kHz

33-100μF

Vin+

Vin-

NOTE: Measure input reflected ripple current with a simulated

source inductance (LTEST) of 12μH. Capacitor CS offsets

possible battery impedance. Measure current as shown

above.

Figure 7. Input Reflected Ripple Current Test Setup.

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

(+)

(

–

)

RESISTIVE

LOAD

SCOPE

COPPER STRIP

GROUND PLANE

10uF

1uF

Figure 8. Output Ripple and Noise Test Setup.

Vout+

Vout-

Vin+

Vin-

RLOAD

Rcontact

Rdistribution

Rcontact

Rdistribution

Rcontact

Rdistribution

VIN

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

Figure 9. Output Voltage and Efficiency Test Setup.



VO.

VIN.

IIN

100

Efficiency

Design Considerations

Input Filtering

The power module should be connected to a low

ac-impedance source. Highly inductive source impedance can

affect the stability of the power module. For the test

configuration in Figure 7 a 100μF electrolytic capacitor

(ESR<0.7 at 100kHz), mounted close to the power module

helps ensure the stability of the unit. Consult the factory for

further application guidelines.

Safety Considerations

For safety agency approval the power module must be

installed in compliance with the spacing and separation

requirements of the end-use safety agency standards, i.e., UL

ANSI/UL* 62368-1 and CAN/CSA+ C22.2 No. 62368-1

Recognized, DIN VDE 0868-1/A11:2017 (EN62368-

1:2014/A11:2017)

If the input source is non-SELV (ELV or a hazardous voltage

greater than 60 Vdc and less than or equal to 75Vdc), for the

module’s output to be considered as meeting the

requirements for safety extra-low voltage (SELV) or ES1, all of

the following must be true:

▪ The input source is to be provided with reinforced

insulation from any other hazardous voltages, including

the ac mains.

▪ One VIN pin and one VOUT pin are to be grounded, or both

the input and output pins are to be kept floating.

▪ The input pins of the module are not operator accessible.

▪ Another SELV or ES1 reliability test is conducted on the

whole system (combination of supply source and subject

module), as required by the safety agencies, to verify

that under a single fault, hazardous voltages do not

appear at the module’s output.

Note: Do not ground either of the input pins of the module

without grounding one of the output pins. This may

allow a non-SELV voltage to appear between the

output pins and ground.

The power module has extra-low voltage (ELV) outputs when

all inputs are ELV.

All flammable materials used in the manufacturing of these

modules are rated 94V-0, or tested to the UL60950 A.2 for

reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal to

–75 Vdc, these converters have been evaluated to the

applicable requirements of BASIC INSULATION between

secondary DC MAINS DISTRIBUTION input (classified as TNV-2

in Europe) and unearthed SELV or ES1 outputs.

The input to these units is to be provided with a maximum 15

A fast-acting fuse in the ungrounded lead.

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 7

Feature Descriptions

Remote On/Off

Two remote on/off options are available. Positive logic turns

the module on during a logic high voltage on the ON/OFF pin,

and off during a logic low. Negative logic remote On/Off,

device code suffix “1”, turns the module off during a logic high

and on during a logic low.

ON/OFF

Vin+

Vin-

Ion/off

Von/off

Vout+

TRIM

Vout-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a

switch (open collector or equivalent) to control the voltage

(Von/off) between the ON/OFF terminal and the VIN(-) terminal

(see Figure 10). Logic low is 0V ≤ Von/off ≤ 0.6V. The maximum

Ion/off during a logic low is 0.15mA; the switch should maintain

a logic low level whilst sinking this current.

During a logic high, the typical maximum Von/off generated by

the module is 5V, and the maximum allowable leakage current

at Von/off = 5V is 1μA.

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to VIN(-).

Remote Sense

Remote sense minimizes the effects of distribution losses by

regulating the voltage at the remote-sense connections (See

Figure 11). The voltage between the remote-sense pins and

the output terminals must not exceed the output voltage

sense range given in the Feature Specifications table:

[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

Although the output voltage can be increased by both the

remote sense and by the trim, the maximum increase for the

output voltage is not the sum of both. The maximum increase

is the larger of either the remote sense or the trim.

The amount of power delivered by the module is defined as

the voltage at the output terminals multiplied by the output

current. When using remote sense and trim, the output

voltage of the module can be increased, which at the same

output current would increase the power output of the

module. Care should be taken to ensure that the maximum

output power of the module remains at or below the

maximum rated power (Maximum rated power = Vo,set x

Io,max).

Figure 11. Circuit Configuration for remote sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit,

the module operation is disabled. The module will only begin

to operate once the input voltage is raised above the

undervoltage lockout turn-on threshold, VUV/ON.

Once operating, the module will continue to operate until the

input voltage is taken below the undervoltage turn-off

threshold, VUV/OFF.

Overtemperature Protection

To provide protection under certain fault conditions, the unit

is equipped with a thermal shutdown circuit. The unit will

shutdown if the thermal reference points, Tref, exceed135 OC

(Figure 13, typical) or 120 OC(Figure 14, typical) respectively,

but the thermal shutdown is not intended as a guarantee that

the unit will survive temperatures beyond its rating. The

module will automatically restart upon cool-down to a safe

temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the modules

has an independent over voltage loop to prevent single point

of failure. This protection feature latches in the event of over

voltage across the output. Cycling the on/off pin or input

voltage resets the latching protection feature. If the auto-

restart option (4) is ordered, the module will automatically

restart upon an internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition, the

unit is equipped with internal current-limiting circuitry and can

endure current limiting continuously. At the point of

current-limit inception, the unit enters hiccup mode. If the unit

is not configured with auto–restart, then it will latch off

following the over current condition. The module can be

restarted by cycling the dc input power for at least one second

or by toggling the remote on/off signal for at least one second.

Feature Descriptions (continued)

If the unit is configured with the auto-restart option (4), it will

remain in the hiccup mode as long as the overcurrent

condition exists; it operates normally, once the output current

VO(+)

SENSE(+)

SENSE(–)

VO(–)

VI(+)

VI(-)

IOLOAD

CONTACTAND

DISTRIBUTION LOSSES

SUPPLY II

CONTACT

RESISTANCE

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 8

is brought back into its specified range. The average output

current during hiccup is 10% IO, max.

Output Voltage Programming

Trimming allows the output voltage set point to be increased

or decreased from the default value; this is accomplished by

connecting an external resistor between the TRIM pin and

either the VO(+) pin or the VO(-) pin.

VO(+)

VOTRIM

VO(-)

Rtrim-down

LOAD

VIN(+)

ON/OFF

VIN(-)

Rtrim-up

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (Rtrim-down) between the TRIM

pin and the VO(-) (or Sense(-)) pin decreases the output

voltage set point. To maintain set point accuracy, the trim

resistor tolerance should be ±1.0%.

The following equation determines the required external

resistor value to obtain a percentage output voltage change of

Δ%













−



−22.10

511

downtrim

Where

100%

,, 











−

=

seto

desiredoseto V

For example, to trim-down the output voltage of the module

by 6% to 11.28V, Rtrim-down is calculated as follows:

6% =













−=

−22.10

511

downtrim

=

−9.74

downtrim

Connecting an external resistor (Rtrim-up) between the TRIM pin

and the VO(+) (or Sense (+)) pin increases the output voltage

set point. The following equation determines the required

external resistor value to obtain a percentage output voltage

change of Δ%:













−



−



+

−k

Rseto

upadj 22.10

511

%225.1

%)100(11.5 ,

Where

100%

,, 











−

=

seto

setodesiredo V

For example, to trim-up the output voltage of the module by

4% to 12.48V, Rtrim-up is calculated is as follows:

4% =













−−



+

−22.10

511

4225.1 )4100(0.1211.5

uptrim

=

−52.1163

uptrim

The voltage between the VO(+) and VO(–) terminals must not

exceed the minimum output overvoltage protection value

shown in the Feature Specifications table. This limit includes

any increase in voltage due to remote-sense compensation

and output voltage set-point adjustment trim.

Although the output voltage can be increased by both the

remote sense and by the trim, the maximum increase for the

output voltage is not the sum of both. The maximum increase

is the larger of either the remote sense or the trim. The

amount of power delivered by the module is defined as the

voltage at the output terminals multiplied by the output

current. When using remote sense and trim, the output

voltage of the module can be increased, which at the same

output current would increase the power output of the

module. Care should be taken to ensure that the maximum

output power of the module remains at or below the

maximum rated power (Maximum rated power = VO,set x

IO,max).

Thermal Considerations

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be provided

to help ensure reliable operation.

Considerations include ambient temperature, airflow, module

power dissipation, and the need for increased reliability. A

reduction in the operating temperature of the module will

result in an increase in reliability.

The thermal data presented here is based on physical

measurements taken in a wind tunnel, using automated

thermo-couple instrumentation to monitor key component

temperatures: FETs, diodes, control ICs, magnetic cores,

ceramic capacitors, opto-isolators, and module pwb

conductors, while controlling the ambient airflow rate and

temperature. For a given airflow and ambient temperature,

the module output power is increased, until one (or more) of

the components reaches its maximum derated operating

temperature, as defined in IPC-9592. This procedure is then

repeated for a different airflow or ambient temperature until

a family of module output derating curves is obtained.

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 9

Thermal Considerations (continued)

The thermal reference points, Tref1, and Tref2 used in the

specifications for open frame modules are shown in Figure 13.

For reliable operation these temperatures should not exceed

124 OC & 121 OC respectively

Figure 13. Tref Temperature Measurement Locations for

Open Frame Module.

The thermal reference point, Tref, used in the specifications for

modules with heatplate is shown in Figure 14. For reliable

operation this temperature should not exceed 98OC.

Figure 14. Tref Temperature Measurement Location for

Module with Heatplate.

Heat Transfer via Convection

Increased airflow over the module enhances the heat

transfer via convection. Derating curves showing the

maximum output current that can be delivered by

each module versus local ambient temperature (TA)

for natural convection and up to 3m/s (600 ft./min) forced

airflow are shown in Figures 15 - 20.

Please refer to the Application Note “Thermal

Characterization Process For Open-Frame Board-Mounted

Power Modules” for a detailed discussion of thermal aspects

including maximum device temperatures.

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 15. Output Current Derating for the Open Frame

Module; Airflow in the Transverse Direction from Vout(-) to

Vout(+); VIN =48V, VO=12V.

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 16. Output Current Derating for the Module with

Heatplate; Airflow in the Transverse Direction from Vout(-) to

Vout(+);VIN =48V, VO=12V.

Tref1

Tref2

AIRFLOW

Figure 13. T Temperature Measurement Location for

Open Frame Module

ref

25 35 45 55 65 75 85

NC 100LFM

(0.5m/s) 200LFM

(1.0m/s)

400LFM

(2.0m/s)

600LFM

(3.0m/s)

25 35 45 55 65 75 85

NC 100LFM

(0.5m/s)

200LFM

(1.0m/s)

400LFM

(2.0m/s)

600LFM

(3.0m/s)

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 10

Thermal Considerations (continued)

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 17. Output Current Derating for the Module with -

18H Heatplate; Airflow in the Transverse Direction from

Vout(-) to Vout(+);VIN =48V, VO=12V

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 18. Output Current Derating for the Open Frame

Module; Airflow in the Transverse Direction from Vout(-) to

Vout(+); VIN =24V, VO=12V.

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 19. Output Current Derating for the Module with

Heatplate; Airflow in the Transverse Direction from Vout(-) to

Vout(+);VIN =24V, VO=12V.

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 20. Output Current Derating for the Module with -

18 Heatplate; Airflow in the Transverse Direction from Vout(-)

to Vout(+);VIN =24V, VO=12V.

Heat Transfer via Conduction

The module can also be used in a sealed environment with

cooling via conduction from the

module’s top surface through a gap pad material to a

cold wall, as shown in Figure 21. This capability is achieved by

insuring the top side component skyline profile achieves no

more than 1mm height difference between the tallest and the

shortest power train part that benefits from contact with the

gap pad material. The output current derating versus cold

wall temperature, when using a gap pad such as Bergquist

GP2500S20, is shown in Figure 22.

Figure 21. Cold Wall Mounting

OUTPUT CURRENT, IO (A)

COLDPLATE TEMEPERATURE, TC (oC)

Figure 22. Derated Output Current versus Cold Wall

Temperature with local ambient temperature around

module at 85C; VIN =24V or 48V.

20 30 40 50 60 70 80 90

100LFM

(0.5m/s)

200LFM

(1.0m/s)

400LFM

(2.0m/s)

600LFM

(3.0m/s)

25 35 45 55 65 75 85

100LFM

(0.5m/s) 200LFM

(1.0m/s) 400LFM

(2.0m/s)

600LFM

(3.0m/s)

25 35 45 55 65 75 85

NC 100LFM

(0.5m/s) 200LFM

(1.0m/s) 400LFM

(2.0m/s)

600LFM

(3.0m/s)

20 30 40 50 60 70 80 90

100LFM

(0.5m/s)

200LFM

(1.0m/s)

400LFM

(2.0m/s) 600LFM

(3.0m/s)

20 30 40 50 60 70 80 90

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 11

Through-Hole Soldering Information

Lead-Free Soldering

The EHHD010A0B xx RoHS-compliant through-hole products

use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant

components. They are designed to be processed through

single or dual wave soldering machines. The pins have a

RoHS-compliant finish that is compatible with both Pb and Pb-

free wave soldering processes. A maximum preheat rate of

3C/s is suggested. The wave preheat process should be such

that the temperature of the power module board is kept

below 210C. For Pb solder, the recommended pot

temperature is 260C, while the Pb-free solder pot is 270C

max.

Paste-in-Hole Soldering

The EHHD010A0B xx module is compatible with reflow paste-

in-hole soldering processes shown in Figures 24-26. Since the

EHHD010A0B xxZ module is not packaged per J-STD-033

Rev.A, the module must be baked prior to the paste-in-hole

reflow process. Please contact your ABB Sales Representative

for further information.

Pick and Place

The EHHD010A0B modules use an open frame construction

and are designed for a fully automated assembly process. The

modules are fitted with a label designed to provide a large

surface area for pick and place operations. The label meets all

the requirements for surface mount processing, as well as

safety standards, and is able to withstand reflow

temperatures of up to 300oC. The label also carries product

information such as product code, serial number and the

location of manufacture.

Figure 23. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using

open frame construction. Even so, these modules have a

relatively large mass when compared to conventional SMT

components. Variables such as nozzle size, tip style, vacuum

pressure and placement speed should be considered to

optimize this process. The minimum recommended nozzle

diameter for reliable operation is 6mm. The maximum nozzle

outer diameter, which will safely fit within the allowable

component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used

within the space available.

Tin Lead Soldering

The EHHD010A0B power modules are lead free modules and

can be soldered either in a lead-free solder process or in a

conventional Tin/Lead (Sn/Pb) process. It is recommended

that the customer review data sheets in order to customize

the solder reflow profile for each application board assembly.

The following instructions must be observed when soldering

these units. Failure to observe these instructions may result

in the failure of or cause damage to the modules and can

adversely affect long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process, peak reflow

temperatures are limited to less than 235°C. Typically, the

eutectic solder melts at 183°C, wets the land, and

subsequently wicks the device connection. Sufficient time

must be allowed to fuse the plating on the connection to

ensure a reliable

solder joint. There are several types of reflow technologies

currently used in the industry. These power modules can be

reliably soldered using natural forced convection, IR (radiant

infrared), or a combination of convection/IR. For reliable

soldering, the solder reflow profile should be established by

accurately measuring the modules connector temperatures.

Lead Free Soldering

The –Z version of the EHHD010A0B modules are lead-free (Pb-

free) and RoHS compliant and are both forward and backward

compatible in a Pb-free and a SnPb soldering process. Failure

to observe the instructions below may result in the failure of

or cause damage to the modules and can adversely affect

long-term reliability.

REFLOW TEMP (C)

REFLOW TIME (S)

Figure 24. Reflow Profile for Tin/Lead (Sn/Pb) process.

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 12

MAX TEMP SOLDER (C)

Figure 25. Time Limit Curve Above 205oC for Tin/Lead

(Sn/Pb) process

Pb-free Reflow Profile

Power systems will comply with J-STD-015 Rev. C

(Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices) for both Pb-free solder

profiles and applicable MSL classification procedures. This

standard provides a recommended forced-air-convection

reflow profile based on the volume and thickness of the

package (table 4-2). The suggested Pb-free solder paste is

Sn/Ag/Cu (SAC). The recommended linear reflow profile using

Sn/Ag/Cu solder is shown in Figure 26.

Figure 26. Recommended linear reflow profile using

Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit board assembly

process prior to electrical board testing. The result of

inadequate cleaning and drying can affect both the reliability

of a power module and the testability of the finished circuit

board assembly. For guidance on appropriate soldering,

cleaning and drying procedures, refer to GE Board

Mounted Power Modules: Soldering and Cleaning Application

Note (AN04-001).

Per J-STD-020 Rev. C

100

150

200

250

300

Reflow Time (Seconds)

Reflow Temp (°C)

Heating Zone

1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C

15 Seconds

*Time Above 217°C

60 Seconds

Cooling

Zone

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 13

EMC Considerations

The circuit and plots in Figure 27 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.

Figure 27. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT012A0 data sheet (DS05-028).

VIN = 48V, Io = Io,max, L Line

VIN = 48V, Io = Io,max, N Line

EHHD010

FLT012A0

FILTER

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 14

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

*Top side label includes GE name, product designation and date code.

Top

View

Side

View

Bottom

View* VI-

ON/OFF

VI+

VO-

TRIM

VO+

SENSE-

SENSE+

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

Mechanical Outline for EHHD_120W Through-hole Module

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 15

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

VI-

ON/OFF

VI+

VO-

TRIM

VO+

SENSE-

SENSE+

Top

View

Side

View

Bottom

View*

*Bottom side label includes product designation and date code.

**Side

View

Mechanical Outline for EHHD_120W Through-Hole Module with 1/8th Brick Heat Plate

**Side label contains product designation and date code.

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 16

Mechanical Outline for Through-Hole Module with ¼ Brick Heat Plate (-18H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Mechanical Outline for EHHD_120W Through-Hole Module with 1/4th Brick Heat Plate

Top

View

Side

View

Bottom

View*

**Side

View

**Side label contains product designation and date code.

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

VI-

ON/OFF

VI+

VO-

TRIM

VO+

SENSE-

SENSE+

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

September 11, 2020

Page 17

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

NOTES:

FOR 0.030” X 0.025”

RECTANGULAR PIN, USE

0.063” PLATED THROUGH

HOLE DIAMETER

FOR 0.062” DIA PIN, USE

0.087” PLATED THROUGH

HOLE DIAMETER

Function

Vi(+)

ON/OFF

Vi(-)

Vo(-)

SENSE(-)

TRIM

SENSE(+)

Vo(+)

TH Recommended Pad Layout (Component Side View)

3.8[.15]

50.80[2.000]

3.8

[.15]

7.62

[.300]

22.8

[.90]

3.81

[.150]

11.7

[.46]

KEEP

OUT

AREAS

TH Recommend Pad Layout (Component Side View)

5.4[.22]

17.9[.70]

26.1[1.03]

39.0[1.54]

58.4[2.30]

47.2[1.86]

Datasheet

EHHD010A0B Series: DC-DC Converter Power Module

18 to 75Vdc Input; 12Vdc, 10A, 120W Output

For more information, call us at

USA/Canada:

+1 877 546 3243, or +1 972 244 9288

Asia-Pacific:

+86-21-53899666

Europe, Middle-East and Africa:

+49.89.878067-280

Go.ABB/Industrial

GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a

result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.

September 11, 2020

Version 2_6

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes

Input Voltage

Output

Voltage

Output

Current

On/Off Logic

Connector

Type

Comcodes

EHHD010A0B 41Z

24/48V (18-75Vdc)

12V

10A

Negative

Through hole

150029653

EHHD010A0B 41-HZ

24/48V (18-75Vdc)

12V

10A

Negative

Through hole

150029831

EHHD010A0B 41-18HZ

24/48V (18-75Vdc)

12V

10A

Negative

Through hole

150029833

Table 2. Device Coding Scheme and Options

Characteristic

Definition

Form Factor E

E = 1 /8th Brick

Family Designator HH

HH = Hammerhead™ Series

Input Voltage D

D = UltraWide Range, 18V-75V

Output Current

010A0 010A0 = 010.0 Amps Maximum Output Current

Output Voltage

BB=12V Nominal

Omit = Default Pin Length shown in Mechanical Outline Figures

6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)

8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)

Omit = Positive Logic

1 = Negative Logic

Customer Specific XY

XY = Customer Specific Modified Code, Omit for Standard Code

Omit = Standard open Frame Module

H = 1/8th Brick size heat plate, for use with heat sinks (not available

with -S option)

18H = 1/4th Brick size heat plate with unthreaded inserts for use in

coldwall applications (not available with -S option)

S = Surface Mount connections

Omit = RoHS 5/6, Lead Based Solder Used

Z = RoHS 6/6 Compliant, Lead free

Ratings

Options

Pin Length

Action following

Protective Shutdown

4 = Auto-restart following shutdown (Overcurrent/Overvoltage)

Must be ordered

On/Off Logic

Mechanical Features

RoHS

Character and Position

18H