LD 271
LD 271 H
LD 271 L
LD 271 HL
GaAs-IR-Lumineszenzdiode
GaAs Infrare d Emitter
2001-02-22 1
Wesentliche Merkmale
• GaAs-LED mit sehr hohem Wirkungsgrad
• Hohe Zuverlässigkeit
• Gute spektrale Anpassung an
Si-Fotoempfänger
• Gehäusegleich mit SFH 300, SFH 203
Anwendungen
• IR-Fernsteuerung von Fernseh- und
Rundfunkgeräten, Videorecordern,
Lichtdimmern
• Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
• Sensorik
• Diskrete Lichtschranken
Typ
Type Bestellnummer
Ordering Code Gehäuse
Package
LD 271 Q62703-Q148 5-mm-LED-Gehäuse (T 1 3/4), graugetöntes Epoxy-
Gießharz, Lötspieße im 2.54-mm-Raster (1/10’’)
5 mm LED package (T 1 3/4), grey colored epoxy resin
lens, solder tabs lead spacing 2.54 mm (1/10’’)
LD 271 L Q62703-Q833
LD 271 H Q62703-Q256
LD 271 HL Q62703-Q838
Features
•Very highly efficient GaAs-LED
•High reliability
•Spectral match with silicon photodetectors
•Same package as SFH 300, SFH 203
Applications
•IR remote control of hi-fi and TV-sets, video
tape recorders, dimmers
•Remote control for steady and v arying intensi ty
•Sensor technology
•Discrete interrupters
2001-02-22 2
LD 271, LD 271 H, LD 271 L, LD 271 HL
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg – 40 …+ 100 °C
Sperrspannung
Reverse voltage VR5V
Durchlaßstrom
Forward current IF130 mA
Stoßstrom, tp = 10 µs, D = 0
Surge current IFSM 3.5 A
Verlustleistung
Power dissipation Ptot 220 mW
Wärmewiderstand
Thermal resistance RthJA 330 K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
∆λ 55 nm
Abstrahlwinkel
Half angle ϕ± 25 Grad
deg.
Aktive Chipfläche
Active chip area A0.25 mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area L×B
L×W0.5 ×0.5 mm
Abstand Chipoberfläche bis Linsenscheitel
Distance chip front to lens top H4.0 …4.6 mm
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching tim es, Ie from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf1µs
LD 271, LD 271 H, LD 271 L, LD 271 HL
2001-02-22 3
Kapazität, VR = 0 V, f = 1 MHz
Capacitance Co40 pF
Durchlaßspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µsVF
VF
1.30 (≤ 1.5)
1.90 (≤ 2.5) V
V
Sperrstrom, VR = 5 V
Reverse current IR0.01 (≤ 1) µA
Gesamtstrahlungsfluß
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe18 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe,
IF = 100 mA
TCI– 0.55 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA TCV– 1.5 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA TCλ0.3 nm/K
Gruppierung der Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Grouping of Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
LD 271
LD 271 L LD 271 H
LD 271 HL
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µsIe
Ie typ.
15 (≥ 10)
120 > 16 mW/sr
mW/sr
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
LD 271, LD 271 H, LD 271 L, LD 271 HL
2001-02-22 4
Relati ve Sp ectral emission
Irel = f (λ)
Forward Cu rrent
IF = f (VF), single pulse, tp = 20 µs
Radiation Characteristics Irel = f (ϕ)
OHRD1938
λ
rel
Ι
0880 920 960 1000
nm
1060
20
40
60
80
%
100
V
OHR01041
F
F
I
1
1
10
0
10
-1
10
10
-2
A
1.5 2 2.5 3 3.5 4 V 4.5
max.
typ.
OHR01879
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiant Intensity
Single pulse , tp = 20 µs
Permissible Pulse Handling
Capability IF = f (τ), TC = 25 °C,
duty cycle D = parameter
Ιe
Ιe 100 mA = f (IF)
Ι
OHR01038
F
-1
10
10
0
1
10
2
10
10
-2 -1
10
0
10 A 10
1
Ι
e
Ι
e
(100 mA)
t
OHR00257
P
10
-5
s
T
t
p
D=t
p
T
Ι
F
10
4
Ι
F
DC
0.5
0.2
0.1
0.005
0.01
0.02
0.05
mA
10
3
10
2-4
10
-3
10
-2
10
-1
10
0
10
2
10
=D
5
5
Max. Permissible Forward Current
IF = f (TA)
T
OHO00364
A
0
F
Ι
0 20 40 60 80 100C
mA
20
40
60
80
100
120
140
160
200
LD 271, LD 271 H, LD 271 L, LD 271 HL
2001-02-22 5
Maßzeichnung
Package Outlines
Maße werden wi e fo lgt angegeben: mm (inch) / Dimensio ns are s pecified as follow s: m m (inc h).
7.8 (0.307)
7.5 (0.295)
9.0 (0.354)
8.2 (0.323)
29 (1.142)
27 (1.063)
1.8 (0.071)
1.2 (0.047)
4.8 (0.189)
4.2 (0.165)
ø5.1 (0.201)
ø4.8 (0.189)
0.8 (0.031)
0.4 (0.016)
0.6 (0.024)
0.4 (0.016)
2.54 (0.100)
spacing
5.9 (0.232)
5.5 (0.217)
0.6 (0.024)
0.4 (0.016)
Area not flat
Chip position
Cathode
GEOY6645
4.8 (0.189)
4.2 (0.165)
11.4 (0.449)
11.0 (0.433)
14.0 (0.051)
13.0 (0.512)
1.3 (0.051)
1.0 (0.039)
Cathode
Chip position
GEXY6239
1.0 (0.039)
0.7 (0.028)
spacing
2.54 (0.100)
1.2 (0.047)
1.8 (0.071)
0.4 (0.016)
0.6 (0.024) Area not flat
8.2 (0.323)
9.0 (0.354)
7.8 (0.307)
7.5 (0.295)
ø5.1 (0.201)
ø4.8 (0.189)
5.5 (0.217)
5.9 (0.232)
0.4 (0.016)
0.6 (0.024)
2001-02-22 6
LD 271, LD 271 H, LD 271 L, LD 271 HL
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The inform at ion describe s the type of compon ent and shall not be considered as assur ed c haracteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recyc ling operat ors known t o you. We can also help y ou – get in touch wit h your near est sales offic e.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critica l component is a co mponent usedin a l ife-support devi ce or system whose failure can re asonably be expec ted
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain
and sust ain human life. If th ey fail , it is rea so nable to assume th at the health of the user may be endangered.
